Gluing and developing device and method

Abstract

The invention relates to the field of gluing and developing in semiconductor manufacturing, and provides a gluing and developing device and method, and the device comprises a wafer box module, a gluing module, a developing module and a corresponding robot. The wafer box module comprises an in-out station, a wafer conveying mechanical arm, a wafer feeding / returning station and a loading station. The in-out station robot is responsible for conveying the wafer between the loading station and the wafer feeding / returning station; and the wafer conveying manipulator conveys wafers between the wafer feeding main station and the wafer box wafer feeding branch. The gluing module comprises a coating robot and a gluing unit, the developing module comprises a developing robot and a developing unit which are located on the same side of the film box module, and the developing module is arranged below the gluing module. And the coating robot sends the wafer to the gluing unit, and the developing robot sends back the developed wafer. And the film box film feeding / returning branch is respectively corresponding to the gluing / developing frame. According to the design, the production efficiency is improved by reducing redundant stations and manipulators.

Description

Technical Field

[0001] The invention relates to the field of glue coating and development in semiconductor manufacturing, and in particular to a glue coating and development device and method. Background Art

[0002] The film conveying route of the prior art coating and developing equipment is: the film is fed from the coating module arranged at the bottom layer, and then the film is returned by the developing module arranged at the top layer. Since the top film return station in the developing module is too high, a transition station and a manipulator need to be set. The film conveying route is lengthened, and the longer the route is, the greater the loss of production capacity. Therefore, a coating and developing device and method are urgently needed to improve the above problems. Summary of the invention

[0003] The object of the present invention is to provide a coating and developing device and method, which is used to save redundant workstations and robots to improve production capacity.

[0004] In a first aspect, the present invention provides a glue coating and developing device, comprising: a film box module provided with an entry and exit robot, a film transfer manipulator, a main film feeding station, a film box feeding branch station, a film box return branch station, a first loading station and a second loading station; the entry and exit robot is used to transfer the wafer on the first loading station to the main film feeding station, and to transfer the wafer on the film box return branch station to the second loading station; the film transfer manipulator is used to transfer the wafer on the main film feeding station to the film box feeding branch station; a glue coating module provided with a coating robot and the glue coating unit; a film developing robot and a developing unit provided with a coating robot and a developing unit provided with a coating robot and a developing unit provided with a coating robot and a developing unit provided with a developing robot and a developing unit provided with a developing robot and a developing unit provided with a developing unit ... The developing module of the imaging unit; the developing module and the gluing module are both arranged on the same side of the film box module; the developing module is located on the bottom side of the gluing module; the coating robot is used to transfer the wafer on the film box feeding branch station to the gluing unit for gluing process; the developing robot is used to transfer the wafer after the developing process to the film box returning branch station located on the bottom side of the film box feeding branch station; the film box feeding branch station is arranged in a one-to-one correspondence with the gluing frame in the gluing module; the film box returning branch station is arranged in a one-to-one correspondence with the developing frame in the developing module.

[0005] Optionally, a plurality of stacked cassette return branch stations are arranged adjacent to the second loading station; the entry and exit robot is used to sequentially transfer wafers on the plurality of cassette return branch stations to the second loading station.

[0006] Optionally, the developing module and the gluing module are both located in the film conveying direction of the film box module; a plurality of developing units are symmetrically distributed on the first side and the second side of the developing module with respect to the film conveying direction; a plurality of coating units are symmetrically distributed on the first side and the second side of the gluing module with respect to the film conveying direction.

[0007] Optionally, the film transfer robot is located on the first side or the second side of the film box module; an auxiliary process unit is arranged on the opposite side of the film transfer robot, and the auxiliary process unit is used to supply liquid to the glue coating unit.

[0008] Optionally, the auxiliary process unit includes a liquid bottle and a liquid pump; the liquid pump is used to apply the liquid in the liquid bottle to the surface of the wafer; and the liquid is set to be photoresist or anti-reflective glue.

[0009] In a second aspect, the present invention provides a method for coating and developing, which is used to control the coating and developing device described in any one of the first aspects, including: S1, controlling the entry and exit robots to transfer the wafers on the first loading station to the main film feeding station; S2, controlling the film transfer robot to transfer the wafers on the main film feeding station to the film box film feeding branch station; S3, controlling the coating robot to transfer the wafers on the film box film feeding branch station to the coating unit for a coating process; S4, controlling the developing robot to transfer the wafers that have undergone the developing process to the film box film return branch station located at the bottom side of the film box film feeding branch station; S5, controlling the entry and exit robots to transfer the wafers on the film box film return branch station to the second loading station.

[0010] Optionally, S2 includes: controlling the wafer transfer robot to transfer the wafer on the main wafer feeding station to the adjacent M-layer wafer box feeding branch stations, where M is a positive integer.

[0011] Optionally, S3 includes: controlling the coating robot to transfer the wafers located on the M-layer film box feed branch station to the adjacent M-layer glue coating frames one by one, so that each wafer is transferred to the corresponding glue coating unit in each glue coating frame for glue coating process.

[0012] Optionally, S4 includes: controlling the developing robot to transfer the wafers in the N-layer developing frames arranged adjacently to the N-layer film box feeding branch stations one by one, where N is a positive integer.

[0013] Optionally, S3 also includes: S31, controlling the coating robot to transfer the wafers that have undergone the glue coating process to the interface wafer feed branch station; controlling the back wash robot to transfer the wafers on the interface wafer feed branch station to the back wash unit; controlling the back wash robot to transfer the wafers that have undergone the back wash process from the back wash unit to the cache unit.

[0014] Optionally, S3 also includes: S32, controlling the forward washing robot to transfer the wafer on the cache unit to the interface cooling unit, transferring the wafer after the photolithography process to the forward washing unit, and transferring the wafer on the forward washing unit to the N-layer wafer box feed branch station.

[0015] Optionally, S2 also includes: first controlling the film transfer robot to transfer the wafer on the main film feeding station to the adhesion unit, controlling the adhesion unit to perform an adhesion process on the wafer surface, and then controlling the film transfer robot to transfer the wafer that has undergone the adhesion process to the adjacent M-layer film box film feeding branch station.

[0016] Optionally, S2 further includes: controlling a cooling unit on the wafer feeding branch station of the wafer box of the M layer to cool the wafer thereon, so that the temperature of the wafer after the adhesion enhancement process satisfies the requirements of the glue coating process.

[0017] The beneficial effects of the present invention are as follows: by controlling the developing robot to transfer the wafers that have undergone the developing process to the film box return branch station located on the bottom side of the film box feed branch station, the film return path is simplified and no longer relies on the high station, thereby reducing unnecessary transition film transfer links and shortening the transmission distance of the wafer inside the machine, which may further improve the efficiency of the entire coating and development process and help reduce production capacity losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic cross-sectional view perpendicular to the Y direction of a glue coating and developing device provided by the present invention; Figure 2 A schematic top view of a glue coating and developing device provided by the present invention along the Z reverse direction; Figure 3 The present invention provides Figure 2 AA section diagram in; Figure 4 The present invention provides Figure 2 BB cross-section diagram in FIG. Figure 5 The present invention provides Figure 2 DD cross-section diagram in ; Figure 6 The present invention provides Figure 2 Schematic diagram of CC cross section in ; Figure 7 The present invention provides Figure 2 EE cross-sectional diagram in ; Figure 8 The present invention provides Figure 2 FF cross-sectional diagram in; Fig. 9 The present invention provides Figure 2 Schematic diagram of the GG cross section; Fig.10 A schematic structural diagram of a gluing and developing device provided by the present invention in which a front washing unit is replaced by an edge exposure unit.

[0019] Fig.11A schematic flow chart of a method for coating and developing a glue provided by the present invention; Description of reference numerals in the figures: 100, film box module; 200, liquid processing module; 300, interlayer module; 400, heat treatment module; 500, interface module. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0021] In view of the problems existing in the existing technology, like Figure 1 and Figure 2 As shown, the second embodiment provides a glue coating and developing device for executing any of the methods described in the above embodiments, including: a film box module 100 provided with an in-and-out station robot, a film transfer robot 2, a main film feed station, a film box film feed branch station, a film box film return branch station, a first loading station and a second loading station; the in-and-out station robot is used to transfer the wafer on the first loading station to the main film feed station, and to transfer the wafer on the film box film return branch station to the second loading station; the film transfer robot is used to transfer the wafer on the main film feed station to the film box film feed branch station; a glue coating module provided with the coating robot and the coating unit block; a developing module provided with the developing robot and the developing unit; the developing module and the gluing module are both arranged on the same side of the film box module; the developing module is located on the bottom side of the gluing module; the coating robot is used to transfer the wafers on the film box feeding branch station to the gluing unit for gluing process; the developing robot is used to transfer the wafers after the developing process to the film box returning branch station located on the bottom side of the film box feeding branch station; the film box feeding branch station is arranged in a one-to-one correspondence with the gluing frame in the gluing module; the film box returning branch station is arranged in a one-to-one correspondence with the developing frame in the developing module.

[0022] Reference Figure 1As shown, in some specific embodiments, the film box feeding branch station includes adjacent stacked stations SCPC1, SCPC2 and SCPC3 equipped with cooling units. The film box returning branch station includes adjacent stacked stations PSI21, PSI22 and PSI23.

[0023] In some embodiments, a plurality of stacked cassette return branch stations are arranged adjacent to the second loading station; the inbound and outbound robots are used to sequentially transfer wafers on the plurality of cassette return branch stations to the second loading station.

[0024] like Figure 3 In the example shown, the entry and exit robot is used to transfer the wafer on the first loading station LP1 to the main wafer feeding station. The wafer transfer robot 2 is used to transfer the wafer on the main wafer feeding station to the adhesion unit ADB, and to transfer the wafer on the adhesion unit ADB to the stations SCPC1, SCPC2 and SCPC3 in sequence. The entry and exit robot is also used to transfer the wafers on the stations PSI21, PSI22 and PSI23 to the second loading station in sequence. This example directly transfers the wafers on the stations PSI21, PSI22 and PSI23 to the second loading station, eliminating the need for a main station and robot for transferring wafers in the film return direction, which helps to accelerate the transfer of wafers to the second loading station and avoid wafer accumulation in the film transfer route.

[0025] In some embodiments, the developing module and the gluing module are both located in the film conveying direction of the film box module 100; a plurality of developing units are symmetrically distributed on the first side and the second side of the developing module with respect to the film conveying direction; a plurality of coating units are symmetrically distributed on the first side and the second side of the gluing module with respect to the film conveying direction.

[0026] In one example, the film conveying direction is set to be along the horizontally set X direction. The stacking direction of the film box feeding branch station and the film box returning branch station is along the vertically set Z direction. The X direction and the Z direction form a vertical plane XZ, and a plurality of developing units are symmetrically distributed about the vertical plane XZ. The horizontally set Y direction is set to point from the first side to the second side. The X, Y, and Z directions are perpendicular to each other.

[0027] like Figure 4 As shown, in another example, coating components COT are symmetrically arranged on both sides of the coating robot CR1-3. Specifically. The coating component COT is arranged as a gluing unit PR and an anti-reflection unit Barc symmetrically about the vertical plane XZ. The developing robot DR1-3 is symmetrically arranged on both sides of the developing component. The developing component is arranged as a developing unit SDC symmetrically about the vertical plane XZ.

[0028] In some embodiments, the wafer transfer robot 2 is located on the first side or the second side of the wafer box module 100; an auxiliary process unit is arranged on the opposite side of the wafer transfer robot 2, and the auxiliary process unit is used to perform auxiliary processing on the wafer at at least one workstation among the wafer box module 100, the coating unit and the developing unit.

[0029] In some specific embodiments, the auxiliary process unit includes a liquid bottle and a liquid pump; the liquid pump is used to apply the liquid in the liquid bottle to the surface of the wafer; and the liquid is set to be photoresist or anti-reflective glue.

[0030] In some embodiments, the three layers of glue coating frames located on the top side and the three layers of developing frames located on the bottom side constitute a liquid processing module. Each layer of the glue coating frame is provided with a glue coating unit PR.

[0031] In some examples, in the gluing frame, the gluing unit PR and the anti-reflection unit Barc are stacked. In some examples, the gluing unit PR and the anti-reflection unit Barc are symmetrically arranged at the same height with respect to the vertical plane, for example, the gluing unit PR is located on the Y direction side of the anti-reflection unit Barc. In other examples, in the same layer of the film feeding liquid processing frame, the gluing unit PR is located on the top side of the anti-reflection unit Barc. In still other examples, in the same layer of the film feeding liquid processing frame, the gluing unit PR is located on the bottom side of the anti-reflection unit Barc. In yet another example, the gluing unit PR and the anti-reflection unit Barc are symmetrically arranged with respect to the vertical plane XZ.

[0032] In some embodiments, a heat treatment module 400 and an interlayer module 300 are further included. The developing module and the glue coating module located thereon constitute a liquid processing module 200. In the liquid processing module 200, the bottom glue coating frame is adjacent to the top developing frame. The interlayer module 300 is located between the liquid processing module 200 and the heat treatment module 400.

[0033] like Figure 5 In the example shown, the cassette module 100, the liquid treatment module 200, the interlayer module 300, the heat treatment module 400 and the interface module 500 are arranged in sequence in the X direction. In another example, corresponding to the liquid treatment module 200, the heat treatment module 400 has 6 layers, namely HR1-HR6.

[0034] like Figure 6 As shown, in some specific embodiments, the interlayer module 300 is provided with workstations PSI2-7, PSI15-20 and workstations SCPC4-9 with cooling units.

[0035] In one example, the robot 14 located in the bottom layer of the glue coating frame is used to move the wafer on the workstation SCPC1 to the anti-reflection unit Barc, and move the wafer in the anti-reflection unit Barc to the interface PSI2. The robot 24 located in the bottom layer of the film feeding heat treatment frame is used to move the wafer from the interface PSI2 to the anti-reflection baking unit BARC Bake, and move the wafer from the anti-reflection baking unit BARC Bake to the interface SCPC4. The robot 14 located in the bottom layer of the glue coating frame is used to move the wafer on the workstation SCPC4 to the glue coating unit PR, and move the wafer in the glue coating unit PR to the workstation PSI3. The robot 24 located in the bottom layer of the film feeding heat treatment frame is also used to move the wafer from the interface PSI3 to the soft baking unit Soft Bake, move the wafer in the soft baking unit Soft Bake to the edge exposure unit WES, and move the wafer from the edge exposure unit WES to the interface PSI8.

[0036] like Figure 7 and Figure 2 As shown, in some specific embodiments, the backwash robot 31 is used to move the wafers on the branch interfaces PSI8, PSI9 and PSI10 to the backwash unit BS. Figure 8 and Figure 2 As shown, the forward cleaning robot 32 is used to move the wafers on the forward cleaning unit PIS to the branch interfaces PSI12, PSI13 and PSI14 respectively.

[0037] like Fig. 9 and Figure 2 As shown, in some specific embodiments, the backwash robot 31 is also used to move the wafers that have been backwashed from the backwash unit BS to the buffer unit BF. In some examples, the buffer unit BF is set as a 25-layer wafer storage rack.

[0038] In some other specific embodiments, the forward cleaning robot 32 is further used to move the wafers on the buffer unit BF to the interface cooling unit CPC, and to move the wafers on the interface PSI11 to the forward cleaning unit PIS.

[0039] In some further specific embodiments, the interface module 500 further includes an interface robot 33 for delivering the wafer on the interface cooling unit CPC into the lithography machine SCAN, and moving the wafer output by the lithography machine SCAN to the interface PSI11.

[0040] In some specific embodiments, the baking robot 23 in the film return heat treatment frame on the top layer is used to move the wafer from the interface PSI14 to the post-exposure baking unit PEB, and move the wafer from the post-exposure baking unit PEB to the interface SCPC9. The developing robot 13 moves the wafer from the interface SCPC9 provided with a cooling unit in the interlayer module to the developing unit SDC, and moves the wafer from the developing unit SDC to the interface PSI19. The baking robot 23 in the film return heat treatment frame on the top layer is also used to move the wafer from the interface PSI19 to the hard bake unit Hard Bake, transfer the wafer in the hard bake unit Hard Bake to the optical inspection unit AOI, and move the wafer from the optical inspection unit AOI to the interface PSI20. The developing robot 13 is also used to move the wafer from the interface PSI20 to the interface PSI23. The wafers on the branch interfaces PSI21, PSI22 and PSI23 are moved to the second loading station LP2 by the robot 1.

[0041] In some other optional embodiments, the edge exposure unit WES is not provided in the heat treatment module 400, and the front washing unit PIS in the interface module 500 is replaced by the edge exposure unit WES. Fig.10 After the positive cleaning unit PIS is replaced by the edge exposure unit WES, the wafer transfer routes in the thermal processing module 400 and the interface module 500 are changed. The wafers in the soft bake unit Soft Bake are directly sent to the interfaces PSI8, PSI9 and PSI10 by the robot 24 in the wafer feeding thermal processing frame.

[0042] The front washing robot 32 is used to move the wafers on the branch interfaces PSI8, PSI9 and PSI10 to the edge exposure unit WES, and to transfer the wafers on the edge exposure unit WES to the buffer unit BF. The back washing robot 31 is used to send the wafers in the buffer unit BF to the back washing unit BS for back washing. The back washing robot 31 is used to send the back washed wafers to the interface cooling unit CPC.

[0043] The interface robot 33 is used to send the wafer on the interface cooling unit CPC to the photolithography machine SCAN, and to move the wafer output by the photolithography machine SCAN to the interface PSI11. The positive washing robot 32 is used to move the wafer on the interface PSI11 to the branch interfaces PSI12, PSI13 and PSI14 respectively. This can save the workstations in the heat treatment module 400 to place more heat treatment units, which can solve the problem of insufficient number of heat treatment units in mass production.

[0044] like Fig.11As shown, the first embodiment provides a method for coating and developing, including: S1, controlling the in-and-out robot to transfer the wafer on the first loading station to the main film feeding station; S2, controlling the film transfer robot to transfer the wafer on the main film feeding station to the film box film feeding branch station; S3, controlling the coating robot to transfer the wafer on the film box film feeding branch station to the coating unit for coating process; S4, controlling the developing robot to transfer the wafer after the developing process to the film box film returning branch station located at the bottom side of the film box film feeding branch station; S5, controlling the in-and-out robot to transfer the wafer on the film box film returning branch station to the second loading station.

[0045] In some embodiments, the first loading station is configured as an inbound wafer loading port for storing wafers to be coated and developed, and the second loading station is configured as an outbound wafer loading port for storing wafers that have been coated and developed.

[0046] When executing S1, it specifically includes: the main control unit sends a start signal to the in-and-out robot. The in-and-out robot performs a self-check to confirm that all components are functioning normally. The wafer position is captured by an industrial camera, and the wafer position is adjusted to the center according to the feedback from the visual system. A vacuum suction cup is used as the end effector. The end effector is lowered and adsorbs the wafer. Confirm that the wafer is firmly adsorbed and moves to the wafer feed station according to the preset path. When approaching the target position, confirm again that the placement position is correct. The vacuum suction cup releases adsorption, places the wafer in place, and verifies through the visual system that the wafer has been correctly placed in the wafer feed station. Feedback to the control system that the wafer transfer task is completed. The in-and-out robot returns to its original position and prepares for the next task. Through the above steps, the automatic and accurate transfer of wafers from the first loading station to the wafer feed station can be achieved. This process not only improves efficiency, but also reduces errors that may be caused by human operation.

[0047] In some embodiments, S2 includes: controlling the wafer transfer robot to transfer the wafer on the main wafer feeding station to the adjacent M layers of the wafer box wafer feeding branch stations, where M is a positive integer.

[0048] In some specific embodiments, the adjacent M layers of the film box film feed branch stations are stacked in the vertical direction, and the film box film feed branch station located on the top layer is located higher than the main film feed station.

[0049] In some embodiments, S2 also includes: first controlling the film transfer robot to transfer the wafer on the main film feeding station to the adhesion unit, controlling the adhesion unit to perform an adhesion process on the wafer surface, and then controlling the film transfer robot to transfer the wafer that has undergone the adhesion process to the adjacent M layer of the film box film feeding branch station.

[0050] In some specific embodiments, the nozzle in the adhesion unit evenly sprays the adhesion promoter onto the surface of the wafer to increase the adhesion of the wafer surface. The adhesion promoter is evenly distributed on the surface of the wafer by rotating or oscillating the platform to ensure the consistency of the coating. The adhesion promoter is quickly dried by heating with hot air or infrared lamp to form a stable adhesive layer on the surface of the wafer, thereby enhancing the adhesion performance of the wafer in subsequent processes.

[0051] In some embodiments, S2 further includes: controlling the cooling unit on the wafer feeding branch station of the wafer box of the M layer to cool the wafer thereon, so that the temperature of the wafer after the adhesion enhancement process meets the requirements of the glue coating process.

[0052] In a specific embodiment, the cooling unit on the M-layer cassette feed branch station is controlled to start. The cooling unit cools the wafer so that the surface temperature of the wafer drops to a temperature range required for the glue coating process. A temperature sensor is used to monitor the wafer temperature to ensure that the temperature meets the requirements of the glue coating process. The temperature sensor is used to verify that the wafer temperature meets the requirements of the glue coating process.

[0053] In some embodiments, S3 includes: controlling the coating robot to transfer the wafers located on the M-layer film box feed branch station to the adjacent M-layer coating frames one by one, so that each wafer is transferred to the corresponding coating unit in each coating frame for the coating process.

[0054] In some examples, M is set to 3, and S3 includes: controlling the coating robot to transfer the wafers located on the 3-layer film box feed branch station to the adjacent 3-layer glue coating frame one by one. In other examples, M is set to 2, and S3 includes: controlling the coating robot to transfer the wafers located on the 2-layer film box feed branch station to the adjacent 2-layer glue coating frame one by one. In some other examples, M is set to 4, and S3 includes: controlling the coating robot to transfer the wafers located on the 4-layer film box feed branch station to the adjacent 4-layer glue coating frame one by one.

[0055] In some specific embodiments, the glue coating process includes: applying photoresist to the wafer surface. In other specific embodiments, applying anti-reflective coating to the wafer surface before applying photoresist to the wafer surface is also included. Through these two specific embodiments, it can be ensured that the wafer surface can be effectively processed before or after the glue coating process, thereby improving the quality of subsequent processes.

[0056] In some embodiments, S3 also includes: S31, controlling the coating robot to transfer the wafers that have undergone the glue coating process to the interface wafer feed branch station; controlling the back wash robot to transfer the wafers on the interface wafer feed branch station to the back wash unit; controlling the back wash robot to transfer the wafers that have undergone the back wash process from the back wash unit to the cache unit.

[0057] In some specific embodiments, the back wash robot places the wafer on the workbench of the back wash unit. The back wash unit is started to clean the back side of the wafer to remove impurities or residues. In other specific embodiments, a visual system is used to verify whether the back side of the wafer has been cleaned. When the back side of the wafer has been cleaned, the back wash robot is controlled to transfer the back washed wafer from the back wash unit to the cache unit. When the back side of the wafer is not cleaned, the back wash unit is restarted to clean the back side of the wafer again. This embodiment can remove impurities or residues on the back side of the wafer through effective back wash treatment, thereby improving the overall quality of the wafer. Clean wafers can ensure the smooth progress of subsequent processing and reduce the defect rate.

[0058] In some embodiments, S3 also includes: S32, controlling the forward washing robot to transfer the wafer on the cache unit to the interface cooling unit, transferring the wafer after the photolithography process to the forward washing unit, and transferring the wafer on the forward washing unit to the N-layer wafer box feed branch station.

[0059] In some specific embodiments, the cache unit is configured as a cache rack, which is provided with H cache stations for storing H wafers, where H is a positive integer greater than or equal to N.

[0060] In other specific embodiments, the forward washing robot places the wafer on the workbench of the forward washing unit. The forward washing unit is started to clean the front side of the wafer to remove impurities or residues. In other specific embodiments, a visual system is used to verify whether the front side of the wafer has been cleaned. When the front side of the wafer has been cleaned, the forward washing robot is controlled to transfer the wafer that has undergone the forward washing process from the forward washing unit to the N-layer wafer box feed branch station. When the front side of the wafer is not cleaned, the forward washing unit is restarted to clean the front side of the wafer again. This embodiment can remove impurities or residues on the front side of the wafer through effective forward washing, thereby improving the overall quality of the wafer.

[0061] In some embodiments, S4 includes: controlling the developing robot to transfer the wafers in the N-layer developing frames arranged adjacently to the N-layer film box feeding branch stations one by one, where N is a positive integer.

[0062] In some examples, N is 3, and S4 includes: controlling the developing robot to transfer the wafers in the three adjacent developing frames to the three-layer film box feed branch station one by one. In other examples, N is 4, and S4 includes: controlling the developing robot to transfer the wafers in the four adjacent developing frames to the four-layer film box feed branch station one by one. In some examples, N is 2, and S4 includes: controlling the developing robot to transfer the wafers in the two adjacent developing frames to the two-layer film box feed branch station one by one.

[0063] It is worth noting that if the method is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling an electronic device to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory, a random access memory, a magnetic disk or an optical disk.

[0064] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A coating and developing device, characterized in that: include: A film box module is provided with an in-and-out robot, a film transfer manipulator, a main film feeding station, a film box feeding branch station, a film box returning branch station, a first loading station and a second loading station; The in-and-out robot is used to transfer the wafers on the first loading station to the main wafer feeding station, and to transfer the wafers on the film box return branch station to the second loading station; the wafer transfer manipulator is used to transfer the wafers on the main wafer feeding station to the film box feed branch station; A coating robot and a gluing module of the gluing unit are provided; a developing robot and a developing module of the developing unit are provided; the developing module and the gluing module are both provided on the same side of the film box module; the developing module is located at the bottom side of the gluing module; the coating robot is used to transfer the wafers on the film box feed branch station to the gluing unit for the gluing process; the developing robot is used to transfer the wafers that have undergone the developing process to the film box return branch station located at the bottom side of the film box feed branch station; The film box film feeding branch station is arranged in a one-to-one correspondence with the gluing frame in the gluing module; the film box film returning branch station is arranged in a one-to-one correspondence with the developing frame in the developing module.

2. The device according to claim 1, characterized in that A plurality of stacked wafer box return branch stations are arranged adjacent to the second loading station; the inbound and outbound robots are used to sequentially transfer wafers on the plurality of wafer box return branch stations to the second loading station.

3. The device according to claim 1, characterized in that The developing module and the gluing module are both located in the film conveying direction of the film box module; A plurality of developing units are symmetrically distributed on a first side and a second side of the developing module with respect to the film transmission direction; A plurality of coating units are symmetrically distributed on a first side and a second side of the glue coating module with respect to the sheet conveying direction.

4. The device according to claim 1 or 3, characterized in that: The film transfer robot is located at the first side or the second side of the film box module; an auxiliary process unit is arranged on the opposite side of the film transfer robot, and the auxiliary process unit is used to supply liquid to the glue coating unit.

5. The device according to claim 4, characterized in that The auxiliary process unit comprises a liquid bottle and a liquid pump; the liquid pump is used to apply the liquid in the liquid bottle to the surface of the wafer; the liquid is set to be photoresist or anti-reflective glue.

6. A method for developing a coating, used for controlling the coating developing device according to any one of claims 1 to 5, characterized in that: include: S1, control the in-and-out robot to transfer the wafer on the first loading station to the wafer loading station; S2, control the wafer transfer robot to transfer the wafer on the main wafer feeding station to the cassette wafer feeding branch station; S3, controlling the coating robot to transfer the wafer on the cassette feeding branch station to the gluing unit for gluing process; S4, controlling the developing robot to transfer the wafer that has undergone the developing process to the cassette film return branch station located at the bottom side of the cassette film feed branch station; S5, controlling the inbound and outbound robots to transfer the wafers on the cassette return branch station to the second loading station.

7. The method according to claim 6, characterized in that S2 include: The wafer transfer robot is controlled to transfer the wafer on the main wafer feeding station to the adjacent M-layer wafer box feeding branch stations, where M is a positive integer.

8. The method according to claim 7, characterized in that S3 includes: controlling the coating robot to transfer the wafers located on the M-layer film box feed branch station to the adjacent M-layer glue coating frames one by one, so that each wafer is transferred to the corresponding glue coating unit in each glue coating frame for glue coating process.

9. The method according to claim 6 or 7, characterized in that: S4 includes: controlling the developing robot to transfer the wafers in the N-layer developing frames arranged adjacently to the N-layer film box feeding branch stations one by one, where N is a positive integer.

10. The method according to claim 9, characterized in that S3 also includes: S31, controlling the coating robot to transfer the wafers that have undergone the glue coating process to the interface wafer feed branch station; controlling the back wash robot to transfer the wafers on the interface wafer feed branch station to the back wash unit; controlling the back wash robot to transfer the wafers that have undergone the back wash process from the back wash unit to the cache unit.

11. The method according to claim 10, characterized in that S3 also includes: S32, controlling the forward cleaning robot to transfer the wafer on the cache unit to the interface cooling unit, transferring the wafer after the photolithography process to the forward cleaning unit, and transferring the wafer on the forward cleaning unit to the N-layer wafer box feed branch station.

12. The method according to claim 7, characterized in that The S2 also includes: first controlling the wafer transfer robot to transfer the wafer on the main wafer feeding station to the adhesion unit, controlling the adhesion unit to perform an adhesion process on the wafer surface, and then controlling the wafer transfer robot to transfer the wafer that has undergone the adhesion process to the adjacent M-layer wafer box feeding branch station.

13. The method according to claim 12, characterized in that The S2 also includes: controlling the cooling unit on the M-layer wafer box feed branch station to cool the wafer thereon, so that the temperature of the wafer after the adhesion enhancement process meets the requirements of the glue coating process.

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