Exposure equipment and exposure method

Abstract

The invention relates to exposure equipment, which comprises a target light projection module, a to-be-exposed workpiece, a focusing light processing module and a focusing module, and is characterized in that the target light projection module is used for forming a target focusing light beam and a target exposure light beam on the to-be-exposed workpiece; the focusing module comprises a one-dimensional second linear image sensor for receiving the first target projection beam to form a first focusing pattern and for receiving the second target projection beam to form a second focusing pattern; the target projection light beam is obtained by processing a target focusing light beam reflected by the to-be-exposed workpiece based on the focusing module, and the focus position of the target focusing light beam on the to-be-exposed workpiece is determined based on the light and shade contrast of the first focusing pattern and the second focusing pattern. The to-be-exposed workpiece is subjected to exposure processing at the focus position based on the target exposure light beam. The one-dimensional linear image sensor only needs to process one-dimensional data, and the algorithm and the processing process are relatively simple, so that the overall focusing speed of the exposure equipment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of exposure equipment, and in particular to an exposure equipment and an exposure method. Background Art

[0002] Photolithography is widely used in the manufacture of semiconductor devices and displays such as liquid crystal displays (LCD) and organic light emitting diode displays (OLED). A photolithography machine is a device that uses a projection lens to image a mask pattern onto a substrate surface, a glass substrate, or an LED. The exposure technology that exposes an object with a photosensitive layer formed on the surface and makes the photosensitive layer sensitive is the main technology of photolithography and is actively used in the formation of various fine circuits or fine structures. A representative exposure technology is the following technology: light is irradiated to a shield that forms a pattern identical to the exposure pattern, and the image of the shield is projected onto the surface of the object, whereby the light of the exposure pattern is irradiated to the object.

[0003] In order to ensure that the exposure pattern can be accurately exposed, the focusing and leveling device needs to accurately control the substrate surface to be located at the specified position, so that the substrate surface on the workpiece table is located at the best focal plane of the projection objective.

[0004] Japanese Patent No. 5007070 adopts a coaxial focus position detection method. An exposure device is provided, which includes: a focusing light source, which outputs light that is not exposed to the photoresist during autofocus; and a digital microprocessor, which modulates the output light of the photoresist. During, the light projection optical system includes a micromirror device and an objective lens, and the focus position determination device is configured to set the front focus position at a position optically conjugate with the surface of the substrate; the focus position of the light projection optical system is focused according to the contrast between the light and dark pattern of the rear focus position on the rear side of the surface, and the focus of the light projection optical system is determined between the rear side of the surface. The distance between the projection optical system and the substrate is matched, and in the focusing optical system and the light projection optical system. The micromirror device is used for autofocusing, so that the light of the focused light and dark pattern is projected onto the substrate. The focusing light source and the exposure light source of the focusing optical system are mixed and incident on the substrate, and switch between autofocus and exposure. The exposure device of this patent is as follows Figure 1As shown, it includes a projection optical system 3 that projects an exposure pattern onto the substrate 2 during exposure, and a light and dark pattern for focusing that projects the exposure pattern onto the substrate 2 during exposure. CCD20 and CCD21 are photoelectric conversion components that receive light from the focusing optical system 4 and convert it into an electrical signal. Since the detection speed (frequency) of the CCD camera will be limited by the CCD and is only tens to hundreds of times per second, there will be a risk of not being able to detect in time for the high-speed direct-drawing exposure method, or the exposure film movement speed of the direct-drawing lithography machine will be limited by the detection speed (frequency). In addition, since the CCD camera needs to send the image to the back-end industrial computer or server for image processing and algorithm analysis after capturing the image, the calculation speed of this part will also affect the overall exposure speed. Summary of the invention

[0005] The technical problem to be solved by the present invention is the low pattern conversion efficiency and slow focusing speed of the exposure equipment provided in the prior art.

[0006] According to one aspect of the present application, an exposure device is disclosed, the exposure device comprising a target light projection module, a workpiece to be exposed, a focus light processing module and a focus module, the target light projection module is used to form a target light beam on the workpiece to be exposed, the target light beam comprising a target focus beam and a target exposure beam;

[0007] The focus light processing module is used to process the target focus beam reflected by the workpiece to be exposed to obtain a first target projection beam and a second target projection beam. The focus module includes a one-dimensional first linear image sensor and a one-dimensional second linear image sensor. The one-dimensional first linear image sensor is used to receive the first target projection beam to form a first focus pattern, and the one-dimensional second linear image sensor is used to receive the second target projection beam to form a second focus pattern. The focal position of the target focus beam on the workpiece to be exposed is determined based on the light and dark contrast of the first focus pattern and the second focus pattern, so that after the focal position is determined, the workpiece to be exposed is exposed at the focal position based on the target exposure beam.

[0008] In some examples, the exposure device also includes a light source processing module, which includes an exposure light source device, a focusing light source device, a first collimating lens, a second collimating lens, a first semi-reflecting mirror, an inner total reflection mirror and a spatial light modulator. The first collimating lens is arranged between the exposure light source device and the first semi-reflecting mirror, and the second collimating lens is arranged between the focusing light source device and the first semi-reflecting mirror. The exposure light source device is used to provide an exposure light source, and the focusing light source device is used to provide a focusing light source. The parallel exposure light beam formed by the exposure light source passing through the first collimating lens and the first semi-reflecting mirror in sequence is coaxial with the parallel focusing light beam formed by the focusing light source passing through the second collimating lens and the first semi-reflecting mirror in sequence. The inner total reflection mirror is arranged on one side of the first semi-reflecting mirror, and the inner total reflection mirror is used to reflect the parallel exposure light beam and the parallel focusing light beam. The spatial light modulator is arranged on one side of the inner total reflection mirror, and the spatial light modulator is used to reflect the target light beam and provide target projection light for the target light projection module after passing through the inner total reflection mirror.

[0009] In some examples, the target light projection module is disposed on one side of the workpiece to be exposed, and the target light projection module includes a plane mirror, a third collimating lens, a second semi-reflecting mirror and a projection objective lens which are sequentially arranged close to the workpiece to be exposed. The target projection light is sequentially reflected by the plane mirror, collimated by the third collimating lens and projected through the projection objective lens to form the target light beam which is projected onto the workpiece to be exposed.

[0010] In some examples, the focusing light processing module includes a filter, an imaging lens and a third semi-reflective mirror, the filter is arranged between the second semi-reflective mirror and the imaging lens, the imaging lens is arranged between the filter and the third semi-reflective mirror, the target focusing beam passes through the filter and the imaging lens in sequence and is then split by the third semi-reflective mirror, so that the third semi-reflective mirror provides the first target projection beam for the one-dimensional first linear image sensor, and provides the second target projection beam for the one-dimensional second linear image sensor.

[0011] In some examples, the exposure device also includes a first magnifying objective lens and a second magnifying objective lens, the first magnifying objective lens is arranged between the third semi-reflective mirror and the one-dimensional first linear image sensor, and the second magnifying objective lens is arranged between the third semi-reflective mirror and the one-dimensional second linear image sensor.

[0012] In some examples, the focus light source device is used to provide a focus light source that does not expose the photoresist during autofocus.

[0013] In some examples, after receiving the first target projection beam, the one-dimensional first linear image sensor performs recognition processing on the first target projection beam, and its recognition rate is at the KHz level; and after receiving the second target projection beam, the one-dimensional second linear image sensor performs recognition processing on the second target projection beam, and its recognition rate is at the KHz level.

[0014] In some examples, the spatial light modulator is configured as any one of a DMD spatial light modulator, a liquid crystal panel, or a light emitting diode array.

[0015] According to another aspect of the present application, an exposure method is also disclosed. The method is implemented based on any of the exposure devices described above, and the method comprises the following steps:

[0016] Turning on the focus light source device, adjusting the focus positions corresponding to the one-dimensional first linear image sensor and the one-dimensional second linear image sensor, respectively, to determine the focal position of the focus light source output by the focus light source device on the workpiece to be exposed;

[0017] Turn off the focus light source device;

[0018] The exposure light source device is turned on to complete the exposure process at the focal position for the workpiece to be exposed after the focal position is determined.

[0019] The present invention includes but is not limited to the following beneficial effects: (1) This solution processes the received target projection light beam based on a one-dimensional linear image sensor. Since the one-dimensional linear image sensor only captures light information on one line, it only needs to process one-dimensional data. The algorithm and processing process are relatively simple, and image analysis and focus detection can be performed more quickly. Compared with the CCD camera in the prior art that needs to process every pixel of the entire image, the data volume is smaller and the processing speed is faster, thereby improving the overall focusing speed of the exposure equipment; (2) This solution can monitor the state of the workpiece to be exposed in real time based on the one-dimensional linear image sensor, and quickly feedback the change of the focus position to ensure that the focus can be adjusted in time during the production process, reducing errors caused by inaccurate focusing; (3) This solution uses an internal total reflection mirror to reflect parallel exposure beams and parallel focusing beams, which can effectively guide the beams in a specific direction. By using the principle of total reflection, the loss of light can be reduced, so that more light energy can be effectively utilized. Compared with traditional reflectors, internal total reflectors can provide higher reflectivity in certain wavelength ranges, and can reduce light scattering and distortion, improve imaging quality and light beam quality, thereby improving the image recognition quality of the focusing module and improving focusing accuracy; (4) In this solution, multiple optical elements (such as collimating lenses, half-reflecting mirrors and internal total reflectors) work together to form parallel exposure beams and focusing beams, reduce scattering and loss during beam propagation, improve beam quality, and thereby improve focusing accuracy; (5) In this solution, the focusing light source device will not expose the photoresist during autofocus, effectively avoiding unnecessary light damage , improving the utilization rate of materials and the quality of finished products; (6) In this scheme, the recognition rate of the one-dimensional linear image sensor can reach the KHz level, ensuring the fast and accurate processing of the target light beam and improving the response speed and stability of the system; (7) In this scheme, by placing a magnifying objective lens in front of the one-dimensional linear image sensor, the resolution of the imaging system can be improved, so that the one-dimensional linear image sensor can capture more delicate image details and improve the imaging quality. The magnifying objective lens can effectively focus the light beam and increase the light intensity received by the one-dimensional linear image sensor, thereby improving the signal quality, reducing the impact of noise, and further improving the imaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0021] Figure 1 It is a structural schematic diagram of an exposure device in the prior art;

[0022] Figure 2 is a schematic structural diagram of an exposure device according to an embodiment of the present invention;

[0023] Figure 3 is a schematic diagram of the distribution of light intensity received by a focus module of an exposure device according to an embodiment of the present invention;

[0024] Figure 4 is a diagram showing the architecture of a focus detection system of a one-dimensional linear image sensor according to an embodiment of the present invention;

[0025] Figure 5 is a schematic diagram of a focus position determination principle according to an embodiment of the present invention;

[0026] Figure 6 is a flow chart of an exposure method according to an embodiment of the present invention;

[0027] In the figure, 1-workpiece to be exposed, 2-target light projection module, 21-plane mirror, 22-third collimating lens, 23-second semi-reflecting mirror, 24-projection objective lens, 3-focusing light processing module, 31-filter, 32-imaging lens, 33-third semi-reflecting mirror, 4-focusing module, 41-one-dimensional first linear image sensor, 42-one-dimensional second linear image sensor, 5-light source processing module, 51-exposure light source device, 52-focusing light source device, 53-first collimating lens, 54-second collimating lens, 55-first semi-reflecting mirror, 56-internal total reflection mirror, 57-spatial light modulator, 6-first magnifying objective lens, 7-second magnifying objective lens. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0029] The term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "inner", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may include one or more of the features explicitly or implicitly. Moreover, the terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0030] In order to solve the problems existing in the prior art, the present application provides an exposure device, specifically, Figure 2 As shown, the exposure device includes a target light projection module 2, a workpiece to be exposed 1, a focus light processing module 3 and a focus module 4. The target light projection module 2 is used to form a target light beam on the workpiece to be exposed 1. The target light beam includes a target focus beam and a target exposure beam.

[0031] Among them, the focus light processing module 3 is used to process the target focus beam reflected by the workpiece 1 to be exposed to obtain a first target projection beam and a second target projection beam. The focus module 4 includes a one-dimensional first linear image sensor 41 and a one-dimensional second linear image sensor 42. The one-dimensional first linear image sensor 41 is used to receive the first target projection beam to form a first focus pattern, and the one-dimensional second linear image sensor 42 is used to receive the second target projection beam to form a second focus pattern; the focal position of the target focus beam on the workpiece 1 to be exposed is determined based on the light and dark contrast of the first focus pattern and the second focus pattern, so that after the focal position is determined, the workpiece 1 to be exposed is exposed at the focal position based on the target exposure beam. It can be understood that this technical solution processes the received target projection light beam based on a one-dimensional linear image sensor. Since the one-dimensional linear image sensor only captures light information on one line, it only needs to process one-dimensional data. The algorithm and processing process are relatively simple, and image analysis and focus detection can be performed more quickly. Compared with the CCD camera in the prior art that needs to process every pixel of the entire image, the data volume is smaller and the processing speed is faster, thereby improving the overall focusing speed of the exposure equipment; further, this technical solution can monitor the status of the workpiece 1 to be exposed in real time based on the one-dimensional linear image sensor, and quickly feedback the change of the focus position to ensure that the focus can be adjusted in time during the production process, thereby reducing errors caused by inaccurate focusing.

[0032] In some examples, the exposure device further includes a light source processing module 5, which includes an exposure light source device 51, a focusing light source device 52, a first collimating lens 53, a second collimating lens 54, a first semi-reflecting mirror 55, an internal total reflection mirror 56, and a spatial light modulator 57. The first collimating lens 53 is arranged between the exposure light source device 51 and the first semi-reflecting mirror 55, the second collimating lens 54 is arranged between the focusing light source device 52 and the first semi-reflecting mirror 55, the exposure light source device 51 is used to provide an exposure light source, and the focusing light source device 52 is used to provide a focusing light source. The parallel exposure beam formed by the exposure light source after passing through the first collimating lens 53 and the first semi-reflecting mirror 55 in sequence is coaxial with the parallel focus beam formed by the focus light source after passing through the second collimating lens 54 and the first semi-reflecting mirror 55 in sequence. The inner total reflection mirror 56 is arranged on one side of the first semi-reflecting mirror 55. The inner total reflection mirror 56 is used to reflect the parallel exposure beam and the parallel focus beam. The spatial light modulator 57 is arranged on one side of the inner total reflection mirror 56. The spatial light modulator 57 is used to reflect the target beam and provide the target projection light to the target light projection module 2 after passing through the inner total reflection mirror 56. Among them, in some preferred embodiments, the focus light source device 52 is used to provide a focus light source that does not expose the photoresist during the autofocus period, that is, the focus light source device 52 outputs a light source that is insensitive to the photoresist. Exemplarily, the focus light source device 52 can be composed of a red light emitting diode. It can be understood that the focus light source device 52 will not expose the photoresist during the autofocus period, which effectively avoids unnecessary light damage and improves the utilization rate of the material and the quality of the finished product. Furthermore, in the structure of the application, based on the use of the internal total reflection mirror 56 to reflect the parallel exposure light beam and the parallel focus light beam, the light beam can be effectively directed to a specific direction, and the total reflection principle can be used to reduce the loss of light, so that more light energy can be effectively used. Compared with the traditional reflector, the internal total reflection mirror 56 can provide a higher reflectivity in certain wavelength ranges, and can reduce the scattering and distortion of light, improve the imaging quality and the quality of the light beam, thereby improving the recognition quality of the image by the focus module 4 and improving the focusing accuracy; and through the coordinated work of multiple optical elements (such as collimating lenses, half-reflecting mirrors and internal total reflection mirrors), parallel exposure light beams and focus light beams are formed, reducing the scattering and loss during the propagation of the light beams, improving the quality of the light beams, and thereby improving the focusing accuracy.

[0033] In some examples, the target light projection module 2 is disposed on one side of the workpiece 1 to be exposed, and the target light projection module 2 includes a plane mirror 21, a third collimating lens 22, a second semi-reflective mirror 23 and a projection objective lens 24 which are sequentially arranged close to the workpiece 1 to be exposed. The target projection light is sequentially reflected by the plane mirror 21, collimated by the third collimating lens and projected by the projection objective lens 24 to form a target light beam which is projected onto the workpiece 1 to be exposed.

[0034] In some examples, the focus light processing module 3 includes a filter 31, an imaging lens 32 and a third semi-reflective mirror 33. The filter 31 is arranged between the second semi-reflective mirror 23 and the imaging lens 32, and the imaging lens 32 is arranged between the filter 31 and the third semi-reflective mirror 33. The target focus light beam passes through the filter 31 and the imaging lens 32 in sequence and is then split by the third semi-reflective mirror 33, so that the third semi-reflective mirror 33 provides a first target projection light beam for the one-dimensional first linear image sensor 41, and provides a second target projection light beam for the one-dimensional second linear image sensor 42.

[0035] In some examples, the exposure device further includes a first magnifying objective lens 6 and a second magnifying objective lens 7, wherein the first magnifying objective lens 6 is disposed between the third semi-reflective mirror 33 and the one-dimensional first linear image sensor 41, and the second magnifying objective lens 7 is disposed between the third semi-reflective mirror 33 and the one-dimensional second linear image sensor 42. It can be understood that by placing the magnifying objective lens before the one-dimensional linear image sensor, the resolution of the imaging system can be improved, so that the one-dimensional linear image sensor can capture more detailed image details and improve the imaging quality, and the magnifying objective lens can effectively focus the light beam and increase the light intensity received by the sensor, thereby improving the quality of the signal, reducing the influence of noise, and further improving the imaging quality.

[0036] In some examples, after receiving the first target projection beam, the one-dimensional first linear image sensor 41 recognizes and processes the first target projection beam, and its recognition rate is at the KHz level, and after receiving the second target projection beam, the one-dimensional second linear image sensor 42 recognizes and processes the second target projection beam, and its recognition rate is at the KHz level. It can be understood that the recognition rate of the one-dimensional linear image sensor can reach the KHz level, ensuring fast and accurate processing of the target beam, and improving the response speed and stability of the system.

[0037] In some examples, the spatial light modulator 57 is configured as any one of a DMD spatial light modulator, a liquid crystal panel, or a light emitting diode array.

[0038] For ease of understanding, the working principle of the exposure equipment is further introduced below:

[0039] Specifically, before exposing the workpiece 1 to be exposed, it is necessary to determine the exposure focus position of the workpiece 1 to be exposed. First, the focus light source device 52 is started. After the focus light source device 52 is started, the focus light source device 52 outputs the focus light source, which enters the first semi-reflective mirror 55 for reflection after passing through the second collimating lens 54, and then enters the inner total reflection mirror 56 to continue to reflect to the spatial light modulator 57, and then after being processed by the spatial light modulator 57, it is reflected again by the inner total reflection mirror 56 to provide the target projection light for the target light projection module 2, and then the target projection light is reflected once by the plane mirror 21 of the target light projection module 2, collimated by the third collimating mirror, and projected by the projection objective lens 24 to form a target focus beam that is projected onto the workpiece 1 to be exposed. Further, the target focus beam passes through the filter 31 and the imaging lens 32 in sequence, and is then split by the third semi-reflective mirror 33, so that the third semi-reflective mirror 33 provides the first target projection beam for the one-dimensional first linear image sensor 41, and provides the second target projection beam for the one-dimensional second linear image sensor 42. Further, the focus positions of the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 are adjusted to determine the focus position of the workpiece 1 to be exposed. Figure 2 , Figure 3 and Figure 4 The instructions are as follows:

[0040] The one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 are photoelectric conversion components that convert the received target projection light beam into electrical signals.

[0041] The one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 are placed at positions offset by equal distances in the optical axis direction from a position (line B) conjugated with the focal position of the projection objective lens 24. Figure 2 As shown, the one-dimensional first linear image sensor 41 is installed so that the photocathode is focused at the front focus position (line A) in front of the focal plane where the photocathode is optically conjugate with the surface of the workpiece 1 to be exposed. The cathode of the one-dimensional second linear image sensor 42 is focused at a position behind the focus (line C), which is located behind the focal plane. Figure 4 As shown, the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 convert the received target projection beam into an electrical signal, and then convert the analog signal into a digital signal based on an analog / digital converter, and then process it through a filter. Finally, the signals from the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 are compared by a comparator and then transmitted to the focus calculation unit module to calculate the focus position. Figure 3 As shown, Figure 3The schematic diagram of the intensity distribution of light received by the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 is shown. The line a where the photocathode of the one-dimensional first linear image sensor 41 is located is conjugate with the position C on the rear focus side of the projection objective 24. When the workpiece 1 to be exposed is located at the position of line C, the line a obtains the maximum contrast at the one-dimensional first linear image sensor 41, and as the position of the workpiece 1 to be exposed moves from C to A, the contrast gradually decreases. On the other hand, the line c where the photocathode of the one-dimensional second linear image sensor 42 is located is conjugate with the front focus position A of the projection objective 24, and when the workpiece 1 to be exposed is located at the position of line A, the maximum contrast is obtained, and as the position of the workpiece 1 to be exposed moves from A to C, the contrast gradually decreases.

[0042] Next, the focus position of the workpiece 1 to be exposed is determined based on the comparison of the focus patterns obtained by the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor. Figure 5 As shown, Figure 5 The horizontal axis of the graph shown is the position of the workpiece 1 to be exposed, and the curves C1 and C2 respectively represent the changes in the contrast values ​​obtained through the one-dimensional first linear image sensor 41 and the one-dimensional second image sensor. In addition, the curve C3 is obtained by finding the difference between the curve C2 and the curve C1, and is a signal (error signal) that changes in an S shape according to the position deviation of the workpiece 1 to be exposed. Therefore, by driving the platform to find the position on the workpiece 1 to be exposed where the error signal becomes zero, the focus position can be detected. In addition, by paying attention to the positive and negative signs of the curve C3, it is possible to immediately determine whether the workpiece 1 to be exposed is located before or after the focus position, thereby achieving high-speed automatic focus control.

[0043] Furthermore, after the focal position is determined, the focusing light source device 52 is turned off and the exposure light source device 51 is turned on, so that the exposure light provided by the exposure light source device 51 passes through the first collimating lens 53 of the optical element, the first semi-reflecting mirror 55, the internal total reflection mirror 56, the spatial modulator and the internal total reflection mirror 56 again to enter the target light projection module 2, so that the target light projection module 2 provides a target exposure beam to the workpiece 1 to be exposed, and exposes the workpiece 1 to be exposed at the focal position.

[0044] According to another aspect of the present application, an exposure method is also disclosed, such as Figure 6 The method is implemented based on any of the above exposure devices, and the method comprises the following steps:

[0045] S100, turning on the focus light source device, adjusting the focus positions corresponding to the one-dimensional first linear image sensor and the one-dimensional second linear image sensor, to determine the focal position of the focus light source output by the focus light source device on the workpiece to be exposed.

[0046] S102, turning off the focus light source device.

[0047] S104, turning on the exposure light source device to complete the exposure processing at the focal position of the workpiece to be exposed after the focal position is determined.

[0048] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0049] The above shows and describes the basic principle, connection mode, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements fall within the scope of the present invention to be protected.

Claims

1. An exposure device, characterized in that: The exposure device comprises a target light projection module (2), a workpiece to be exposed (1), a focus light processing module (3) and a focus module (4), wherein the target light projection module (2) is used to form a target light beam on the workpiece to be exposed (1), and the target light beam comprises a target focus light beam and a target exposure light beam; The focus light processing module (3) is used to process the target focus light beam reflected by the workpiece (1) to be exposed to obtain a first target projection light beam and a second target projection light beam. The focus module (4) comprises a one-dimensional first linear image sensor (41) and a one-dimensional second linear image sensor (42). The one-dimensional first linear image sensor (41) is used to receive the first target projection light beam to form a first focus pattern. The one-dimensional second linear image sensor (42) is used to receive the second target projection light beam to form a second focus pattern. The focal position of the target focusing beam on the workpiece (1) to be exposed is determined based on the light-dark contrast between the first focusing pattern and the second focusing pattern, so that after the focal position is determined, the workpiece (1) to be exposed is exposed at the focal position based on the target exposure beam.

2. The exposure device according to claim 1, characterized in that The exposure device further comprises a light source processing module (5), wherein the light source processing module (5) comprises an exposure light source device (51), a focusing light source device (52), a first collimating lens (53), a second collimating lens (54), a first semi-reflecting mirror (55), an internal total reflection mirror (56) and a spatial light modulator (57), wherein the first collimating lens (53) is arranged between the exposure light source device (51) and the first semi-reflecting mirror (55), the second collimating lens (54) is arranged between the focusing light source device (52) and the first semi-reflecting mirror (55), the exposure light source device (51) is used to provide an exposure light source, the focusing light source device (52) is used to provide a focusing light source, and the exposure A parallel exposure beam formed by the light source passing through the first collimating lens (53) and the first semi-reflecting mirror (55) in sequence is coaxial with a parallel focus beam formed by the focus light source passing through the second collimating lens (54) and the first semi-reflecting mirror (55) in sequence. The inner total reflection mirror (56) is arranged on one side of the first semi-reflecting mirror (55). The inner total reflection mirror (56) is used to reflect the parallel exposure beam and the parallel focus beam. The spatial light modulator (57) is arranged on one side of the inner total reflection mirror (56). The spatial light modulator (57) is used to reflect the target beam through the inner total reflection mirror (56) to provide target projection light for the target light projection module (2).

3. The exposure device according to claim 1, characterized in that The target light projection module (2) is arranged on one side of the workpiece (1) to be exposed, and comprises a plane mirror (21), a third collimating lens (22), a second semi-reflecting mirror (23) and a projection lens (24) which are arranged in sequence close to the workpiece (1) to be exposed. The target projection light is reflected by the plane mirror (21), collimated by the third collimating lens and projected by the projection lens (24) to form the target light beam which is projected onto the workpiece (1) to be exposed.

4. The exposure device according to claim 3, characterized in that The focusing light processing module (3) comprises a filter (31), an imaging lens (32) and a third semi-reflective mirror (33); the filter (31) is arranged between the second semi-reflective mirror (23) and the imaging lens (32); the imaging lens (32) is arranged between the filter (31) and the third semi-reflective mirror (33); the target focusing light beam passes through the filter (31) and the imaging lens (32) in sequence and is then split by the third semi-reflective mirror (33), so that the third semi-reflective mirror (33) provides the first target projection light beam for the one-dimensional first linear image sensor (41) and provides the second target projection light beam for the one-dimensional second linear image sensor (42).

5. The exposure device according to claim 4, characterized in that The exposure device also includes a first magnifying objective lens (6) and a second magnifying objective lens (7), wherein the first magnifying objective lens (6) is arranged between the third semi-reflective mirror (33) and the one-dimensional first linear image sensor (41), and the second magnifying objective lens (7) is arranged between the third semi-reflective mirror (33) and the one-dimensional second linear image sensor (42).

6. The exposure device according to claim 2, characterized in that The focusing light source device (52) is used to provide a focusing light source that does not expose the photoresist during automatic focusing.

7. The exposure device according to claim 1, characterized in that After receiving the first target projection light beam, the one-dimensional first linear image sensor (41) performs recognition processing on the first target projection light beam, and its recognition rate is at the KHz level; and after receiving the second target projection light beam, the one-dimensional second linear image sensor (42) performs recognition processing on the second target projection light beam, and its recognition rate is at the KHz level.

8. The exposure device according to claim 2, characterized in that The spatial light modulator (57) is constructed as any one of a DMD spatial light modulator (57), a liquid crystal panel, and a light emitting diode array.

9. An exposure method, characterized in that: The method is implemented based on the exposure device according to any one of claims 1 to 8, and the method comprises the following steps: Turning on the focus light source device, adjusting the focus positions corresponding to the one-dimensional first linear image sensor and the one-dimensional second linear image sensor, respectively, to determine the focal position of the focus light source output by the focus light source device on the workpiece to be exposed; Turn off the focus light source device; The exposure light source device is turned on to complete the exposure process at the focal position for the workpiece to be exposed after the focal position is determined.

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