Real-time temperature control method and system based on intelligent rectifier cabinet, terminal and medium

Abstract

The invention is suitable for the technical field of rectifier cabinet control, and provides a real-time temperature control method and system based on an intelligent rectifier cabinet, a terminal and a medium, and the method comprises the steps: obtaining the first real-time thermodynamic diagram information of a target rectifier cabinet, and obtaining the second real-time thermodynamic diagram information of the target rectifier cabinet after a specified time interval, according to the first real-time thermodynamic diagram information and the second real-time thermodynamic diagram information, key optimization area information is effectively generated, and finally, according to the key optimization area information, a cooling device power increasing instruction is rapidly generated. When the temperature of local electronic components of the rectifier cabinet is abnormal, the output power of the cooling device can be automatically adjusted and increased, the cooling effect is rapidly improved, faults caused by overheating of the rectifier cabinet are prevented, unnecessary energy consumption is reduced, the dual-carbon target is met, and carbon emission is effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of rectifier cabinet control, and in particular to a real-time temperature control method, system, terminal and medium based on an intelligent rectifier cabinet. Background Art

[0002] In the hydrogen production industry, the rectifier cabinet is an important equipment used in the process of electrolyzing water to produce hydrogen. Its main function is to convert alternating current into direct current to supply the electrolyzer for water electrolysis to produce hydrogen and oxygen.

[0003] At present, under long-term high current load, local components of the rectifier cabinet (such as rectifier diodes and transformers) will heat up, and excessively high temperatures will cause electronic components to fail or be damaged, affecting the normal operation of the rectifier cabinet; due to the lack of a real-time temperature control mechanism, there is a problem of low reliability, which needs further improvement. Summary of the invention

[0004] Based on this, the embodiments of the present application provide a real-time temperature control method, system, terminal and medium based on an intelligent rectifier cabinet to solve the problem of low reliability in the prior art.

[0005] In a first aspect, an embodiment of the present application provides a real-time temperature control method based on an intelligent rectifier cabinet, the method comprising:

[0006] Acquire first real-time thermal map information of a target rectifier cabinet, and acquire second real-time thermal map information of the target rectifier cabinet after a specified time interval;

[0007] Generate key optimization area information according to the first real-time heat map information and the second real-time heat map information;

[0008] A cooling device power increase instruction is generated according to the key optimization area information, wherein the target rectifier cabinet is equipped with a cooling device, and the cooling device power increase instruction is used to instruct to increase the output power of the cooling device.

[0009] Compared with the prior art, the beneficial effects are as follows: in the real-time temperature control method based on the intelligent rectifier cabinet provided in the embodiment of the present application, the terminal device can first obtain the first real-time thermal map information of the target rectifier cabinet, and after a specified time interval, obtain the second real-time thermal map information of the target rectifier cabinet, and then effectively generate key optimization area information based on the first real-time thermal map information and the second real-time thermal map information, and finally quickly generate a cooling device power increase instruction based on the key optimization area information, so that when the local electronic components of the rectifier cabinet are abnormally high in temperature, the output power of the cooling device is increased in time to improve the cooling effect of the cooling device, effectively improve the reliability, and to a certain extent solve the current problem of low reliability.

[0010] In a second aspect, an embodiment of the present application provides a real-time temperature control system based on an intelligent rectifier cabinet, the system comprising:

[0011] A real-time thermal map information acquisition module is used to acquire first real-time thermal map information of a target rectifier cabinet, and acquire second real-time thermal map information of the target rectifier cabinet after a specified time interval;

[0012] A key optimization area information generation module: used to generate key optimization area information according to the first real-time heat map information and the second real-time heat map information;

[0013] A cooling device power increase instruction generation module is used to generate a cooling device power increase instruction based on the key optimization area information, wherein the target rectifier cabinet is equipped with a cooling device, and the cooling device power increase instruction is used to indicate increasing the output power of the cooling device.

[0014] In a third aspect, an embodiment of the present application provides a terminal device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method of the first aspect described above when executing the computer program.

[0015] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method of the first aspect described above are implemented.

[0016] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0018] Figure 1 It is a flow chart of a real-time temperature control method provided in one embodiment of the present application;

[0019] Figure 2 It is a flow chart of step S200 in the real-time temperature control method provided in one embodiment of the present application;

[0020] Figure 3 It is a flowchart of step S300 in the real-time temperature control method provided in one embodiment of the present application;

[0021] Figure 4 It is a flow chart after step S301 in the real-time temperature control method provided in one embodiment of the present application;

[0022] Figure 5 It is a schematic diagram of the process after step S420 in the real-time temperature control method provided in one embodiment of the present application;

[0023] Figure 6 It is a module block diagram of a real-time temperature control system provided by an embodiment of the present application;

[0024] Figure 7 It is a schematic diagram of a terminal device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0025] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0026] In the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0027] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0028] In order to illustrate the technical solution described in this application, a specific embodiment is provided below for illustration.

[0029] See also Figure 1 , Figure 1: is a flow chart of the real-time temperature control method based on the intelligent rectifier cabinet provided in the embodiment of the present application. In the present embodiment, the execution subject of the real-time temperature control method is a terminal device. It is understandable that the types of terminal devices include but are not limited to mobile phones, tablet computers, laptop computers, ultra-mobile personal computers (Ultra-Mobile Personal Computer, UMPC), netbooks, personal digital assistants (Personal Digital Assistant, PDA), etc., and the embodiment of the present application does not impose any restrictions on the specific types of terminal devices.

[0030] See also Figure 1 The real-time temperature control method provided in the embodiment of the present application includes but is not limited to the following steps:

[0031] In S100, first real-time thermal map information of a target rectifier cabinet is obtained, and after a specified time interval, second real-time thermal map information of the target rectifier cabinet is obtained.

[0032] Specifically, the terminal device can use a preset thermal imaging camera to take a first shot of the rectifier cabinet to obtain the first real-time thermal map information of the target rectifier cabinet, and at the same time, after a specified time interval, take a second shot of the rectifier cabinet to obtain the second real-time thermal map information of the target rectifier cabinet, wherein the first real-time thermal map information is used to describe the thermal map obtained in real time by the first shooting; the specific value of the time interval can be a custom preset value; the second real-time thermal map information is used to describe the thermal map obtained in real time by the second shooting.

[0033] In S200, key optimization area information is generated according to the first real-time heat map information and the second real-time heat map information.

[0034] Specifically, after the terminal device obtains the first real-time thermogram information and the second real-time thermogram information, the terminal device can effectively generate key optimization area information based on the first real-time thermogram information and the second real-time thermogram information, wherein the key optimization area information is used to describe the key areas to be optimized. The operation and maintenance personnel can know the electronic components in the rectifier cabinet whose positions need to be optimized through the key optimization area information.

[0035] In some possible implementations, in order to generate key optimization area information, please refer to Figure 2 Step S200 includes but is not limited to the following steps:

[0036] In S210, information of the area to be detected is generated according to the second real-time thermal map information.

[0037] Without loss of generality, the first real-time thermal map information includes multiple first thermal areas and first real-time temperature information corresponding to each first thermal area. Each first thermal area is located at a different position. The higher the first real-time temperature information corresponding to the first thermal area, the darker the corresponding color of the first thermal area in the first real-time thermal map information; the second real-time thermal map information includes multiple second thermal areas and second real-time temperature information corresponding to each second thermal area. The meaning of the second thermal area in the second real-time thermal map information is similar to the meaning of the first thermal area in the first real-time thermal map information, so it is not repeated.

[0038] Specifically, the terminal device can effectively generate information on the area to be detected based on the second real-time thermal map information and according to the area where any two second thermal areas overlap, wherein the information on the area to be detected is used to describe the area where at least two second thermal areas overlap.

[0039] In S220, the number information of overlapping areas is obtained according to the information of the area to be detected.

[0040] Specifically, after the terminal device generates the information of the area to be detected, the terminal device can obtain the information on the number of overlapping areas based on the information of multiple areas to be detected, wherein the information on the number of overlapping areas is used to describe the total number of second thermal areas corresponding to the information of the area to be detected; exemplarily, when the information of the area to be detected is determined by the overlap of two second thermal areas, the information on the number of overlapping areas is 2; when the information of the area to be detected is determined by the overlap of four second thermal areas, the information on the number of overlapping areas is 4.

[0041] In S230 , the overlapping area quantity information is compared with the preset overlapping quantity threshold information.

[0042] Specifically, after the terminal device obtains the overlapping area quantity information, the terminal device may compare the overlapping area quantity information with preset overlapping quantity threshold information, wherein the overlapping quantity threshold information is a user-defined preset value.

[0043] In S240, if the overlapping area quantity information is greater than the overlapping quantity threshold information, the to-be-detected area information is determined to be candidate area information.

[0044] Specifically, if the overlapping area quantity information is greater than the overlapping area threshold information, the terminal device may determine that the to-be-detected area information is candidate area information.

[0045] In S250, it is determined whether there is no candidate area information in the first real-time heat map information.

[0046] Specifically, after the terminal device determines that the area information to be detected is the candidate area information, the terminal device can determine whether the candidate area information does not exist in the first real-time heat map information.

[0047] In S260, if the candidate region information does not exist in the first real-time heat map information, the candidate region information is determined to be the key optimization region information.

[0048] Specifically, if there is no candidate area information in the first real-time heat map information, it indicates that the high temperature of the candidate area information is caused by the superposition of multiple diffused high temperature areas, so the terminal device can determine that the candidate area information is the key optimization area information.

[0049] In S300, a power increase instruction for the cooling device is generated according to the key optimization area information.

[0050] Specifically, after the terminal device generates the key optimization area information, the terminal device can quickly generate a cooling device power increase instruction based on the key optimization area information, thereby improving the overall cooling efficiency, reducing the situation where local electronic components have excessive temperatures, and improving reliability. Among them, the target rectifier cabinet can be pre-installed with a cooling device, and the cooling device power increase instruction is used to indicate an increase in the output power of the cooling device.

[0051] In some possible implementations, in order to generate a cooling device power increase instruction, see Figure 3 Step S300 includes but is not limited to the following steps:

[0052] In S310, third real-time temperature information of the key optimization area information is obtained.

[0053] Specifically, the terminal device may obtain the third real-time temperature information of the key optimization area information, wherein the third real-time temperature information is used to describe the real-time temperature of the key optimization area information.

[0054] In S320, the third real-time temperature information is compared with the preset safety temperature threshold information.

[0055] Specifically, after the terminal device obtains the third real-time temperature information, the terminal device can compare the third real-time temperature information with preset safety temperature threshold information, wherein the safety temperature threshold information is a custom preset value.

[0056] In S330, if the third real-time temperature information is greater than or equal to the safety temperature threshold information, a power increase instruction for the cooling device is generated.

[0057] Specifically, if the third real-time temperature information is greater than or equal to the safety temperature threshold information, the terminal device can accurately generate a power increase instruction for the cooling device.

[0058] Accordingly, after step S300, the method further includes but is not limited to the following steps:

[0059] In S301, a cooling device power increase instruction is sent to the cooling device to control the cooling device to increase the output power.

[0060] Specifically, after the terminal device generates a cooling device power increase instruction, the terminal device can send the cooling device power increase instruction to the cooling device to control the cooling device to increase the output power, thereby reducing the high temperature of local electronic components and improving reliability.

[0061] In some possible implementations, in order to facilitate the operation and maintenance personnel to intuitively understand the working conditions of the rectifier cabinet, please refer to Figure 4 After step S301, the method further includes but is not limited to the following steps:

[0062] In S400, after a specified time interval, fourth real-time temperature information of the key optimization area information is obtained.

[0063] Specifically, the terminal device can obtain the fourth real-time temperature information of the key optimization area information after a specified time interval.

[0064] In S410, the fourth real-time temperature information is compared with the safety temperature threshold information.

[0065] Specifically, after the terminal device obtains the fourth real-time temperature information of the key optimization area information, the terminal device may compare the fourth real-time temperature information with the safety temperature threshold information.

[0066] In S420, if the fourth real-time temperature information is greater than or equal to the safety temperature threshold information, abnormally high temperature reminder information is generated.

[0067] Specifically, if the fourth real-time temperature information is greater than or equal to the safety temperature threshold information, the terminal device can generate abnormally high temperature reminder information, which is used to prompt that even if the output power of the cooling device is increased, the temperature of the key optimization area information is still abnormally high.

[0068] In some possible implementations, in order to facilitate the operation and maintenance personnel to optimize the structure of the rectifier cabinet, please refer to Figure 5 After step S420, the method further includes but is not limited to the following steps:

[0069] In S421, the real-time location information of the key optimization area information and the inner wall area information of the target rectifier cabinet and the key coverage area of ​​the cooling device are obtained.

[0070] Specifically, the terminal device can obtain real-time location information of key optimization area information, obtain inner wall area information of the target rectifier cabinet, and obtain the key coverage area of ​​the cooling device, wherein the inner wall area information is used to describe the area in the inner wall of the target rectifier cabinet where the cooling device can be installed; the key coverage area is used to describe the cooling coverage range of the cooling device. The key coverage area can be a custom preset value. For example, the key coverage area can be a virtual area whose cross-section is a cooling device and extends infinitely toward the inner wall on the other side.

[0071] In S422, the recommended position information of the cooling device is generated according to the real-time position information, the inner wall area information and the key coverage area.

[0072] Specifically, after the terminal device obtains the real-time location information, inner wall area information and key coverage area, the terminal device can first use the real-time location information as the starting point, and then extend it with the key coverage area until the extended part coincides with the inner wall area information, and then use the overlapping part as the recommended installation position of the cooling device to generate the recommended location information of the cooling device, wherein the recommended location information of the cooling device coincides with the real-time location information, the inner wall area information and the key coverage area at the same time.

[0073] The implementation principle of the real-time temperature control method based on the intelligent rectifier cabinet in the embodiment of the present application is: the terminal device can first obtain the first real-time thermal map information of the target rectifier cabinet, and after a specified time interval, obtain the second real-time thermal map information of the target rectifier cabinet, and then effectively generate key optimization area information based on the first real-time thermal map information and the second real-time thermal map information, and finally quickly generate a power increase instruction for the cooling device based on the key optimization area information, so that when the local electronic components of the rectifier cabinet are abnormally high in temperature, the output power of the cooling device is increased in time to improve the cooling effect of the cooling device and effectively improve the reliability.

[0074] It should be noted that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0075] The embodiment of the present application also provides a real-time temperature control system based on an intelligent rectifier cabinet. For ease of description, only the parts related to the present application are shown, such as Figure 6 As shown, the system 60 includes:

[0076] The real-time thermal map information acquisition module 61 is used to acquire the first real-time thermal map information of the target rectifier cabinet, and acquire the second real-time thermal map information of the target rectifier cabinet after a specified time interval;

[0077] Key optimization area information generating module 62: used to generate key optimization area information according to the first real-time heat map information and the second real-time heat map information;

[0078] The cooling device power increase instruction generating module 63 is used to generate a cooling device power increase instruction according to the key optimization area information, wherein the target rectifier cabinet is equipped with a cooling device, and the cooling device power increase instruction is used to instruct to increase the output power of the cooling device.

[0079] Optionally, the first real-time thermal map information includes a plurality of first thermal regions and first real-time temperature information corresponding to each first thermal region, and the second real-time thermal map information includes a plurality of second thermal regions and second real-time temperature information corresponding to each second thermal region; the key optimization region information generation module 62 includes:

[0080] The submodule for generating information of the area to be detected is used to generate information of the area to be detected according to the second real-time thermal map information, wherein the information of the area to be detected is used to describe an area where at least two second thermal areas overlap;

[0081] The overlapping area quantity information acquisition submodule is used to acquire the overlapping area quantity information according to the area information to be detected, wherein the overlapping area quantity information is used to describe the total number of second thermal areas corresponding to the area information to be detected;

[0082] Overlapping area quantity information comparison submodule: used to compare the overlapping area quantity information with the preset overlapping quantity threshold information;

[0083] A candidate region information determination submodule: used to determine the region information to be detected as candidate region information if the overlapping region quantity information is greater than the overlapping quantity threshold information;

[0084] The first real-time heat map information judgment submodule is used to judge whether there is no candidate area information in the first real-time heat map information;

[0085] Key optimization region information determination submodule: used to determine the candidate region information as the key optimization region information if the candidate region information does not exist in the first real-time heat map information.

[0086] Optionally, the above-mentioned cooling device power increase instruction generating module 63 includes:

[0087] The third real-time temperature information acquisition submodule is used to acquire the third real-time temperature information of the key optimization area information;

[0088] The third real-time temperature information comparison submodule is used to compare the third real-time temperature information with the preset safety temperature threshold information;

[0089] A cooling device power increase instruction generation submodule: used for generating a cooling device power increase instruction if the third real-time temperature information is greater than or equal to the safety temperature threshold information;

[0090] Accordingly, the system 60 further includes:

[0091] A cooling device power increase instruction sending module is used to send a cooling device power increase instruction to the cooling device to control the cooling device to increase the output power.

[0092] Optionally, the system 60 further includes:

[0093] A fourth real-time temperature information acquisition module: used to acquire fourth real-time temperature information of key optimization area information after a specified time interval;

[0094] Fourth real-time temperature information comparison module: used to compare the fourth real-time temperature information with the safety temperature threshold information;

[0095] Abnormally high temperature reminder information generation module: used to generate abnormally high temperature reminder information if the fourth real-time temperature information is greater than or equal to the safety temperature threshold information.

[0096] Optionally, the system 60 further includes:

[0097] Inner wall area information acquisition module: used to obtain the real-time location information of key optimization area information and the inner wall area information of the target rectifier cabinet, as well as the key coverage area of ​​the cooling device;

[0098] Cooling device recommended position information generation module: used to generate cooling device recommended position information based on real-time position information, inner wall area information and key coverage area, wherein the cooling device recommended position information coincides with the real-time position information, inner wall area information and key coverage area.

[0099] It should be noted that the information interaction, execution process and other contents between the above-mentioned modules are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0100] The present application also provides a terminal device, such as Figure 7 As shown, the terminal device 70 of this embodiment includes: a processor 71, a memory 72, and a computer program 73 stored in the memory 72 and executable on the processor 71. When the processor 71 executes the computer program 73, the steps in the above-mentioned real-time temperature control method embodiment are implemented, for example Figure 1 Steps S100 to S300 shown; or, when the processor 71 executes the computer program 73, the functions of each module in the above device are realized, for example Figure 6 The functions of modules 61 to 63 are shown.

[0101] The terminal device 70 may be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server, and the terminal device 70 includes but is not limited to a processor 71 and a memory 72. Those skilled in the art will appreciate that Figure 7 It is only an example of the terminal device 70 and does not constitute a limitation of the terminal device 70. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the terminal device 70 may also include input and output devices, network access devices, buses, etc.

[0102] Among them, the processor 71 can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.; the general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc.

[0103] The memory 72 may be an internal storage unit of the terminal device 70, such as a hard disk or memory of the terminal device 70, or the memory 72 may be an external storage device of the terminal device 70, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the terminal device 70; further, the memory 72 may also include both an internal storage unit and an external storage device of the terminal device 70, and the memory 72 may also store a computer program 73 and other programs and data required by the terminal device 70, and the memory 72 may also be used to temporarily store data that has been output or is to be output.

[0104] One embodiment of the present application also provides a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the steps of each of the above method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form, etc.; the computer-readable medium may include: any entity or device that can carry computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc.

[0105] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, all equivalent changes made according to the methods, principles, and structures of the present application should be included in the protection scope of the present application.

Claims

1. A real-time temperature control method based on an intelligent rectifier cabinet, characterized in that: The method comprises: Acquire first real-time thermal map information of a target rectifier cabinet, and acquire second real-time thermal map information of the target rectifier cabinet after a specified time interval; Generate key optimization area information according to the first real-time heat map information and the second real-time heat map information; A cooling device power increase instruction is generated according to the key optimization area information, wherein the target rectifier cabinet is equipped with a cooling device, and the cooling device power increase instruction is used to instruct to increase the output power of the cooling device.

2. The method according to claim 1, characterized in that: The first real-time thermal map information includes a plurality of first thermal regions and first real-time temperature information corresponding to each of the first thermal regions, and the second real-time thermal map information includes a plurality of second thermal regions and second real-time temperature information corresponding to each of the second thermal regions; The generating key optimization area information according to the first real-time heat map information and the second real-time heat map information includes: Generate information of a region to be detected according to the second real-time thermal map information, wherein the information of the region to be detected is used to describe an area where at least two of the second thermal regions overlap; According to the information of the area to be detected, the number of overlapping areas is acquired, wherein the number of overlapping areas is used to describe the total number of the second thermal areas corresponding to the information of the area to be detected; Comparing the overlapping area quantity information with preset overlapping quantity threshold information; If the overlapping area quantity information is greater than the overlapping quantity threshold information, determining the to-be-detected area information as candidate area information; Determining whether the candidate area information does not exist in the first real-time heat map information; If the candidate area information does not exist in the first real-time heat map information, the candidate area information is determined to be the key optimization area information.

3. The method according to claim 2, characterized in that The step of generating a cooling device power increase instruction according to the key optimization area information includes: Acquire third real-time temperature information of the key optimization area information; Comparing the third real-time temperature information with preset safety temperature threshold information; If the third real-time temperature information is greater than or equal to the safety temperature threshold information, a power increase instruction for the cooling device is generated; Accordingly, after generating a cooling device power increase instruction according to the key optimization area information, the method further includes: Sending a power increase instruction of the cooling device to the cooling device to control the cooling device to increase the output power.

4. The method according to claim 3, characterized in that After sending the cooling device power increase instruction to the cooling device to control the cooling device to increase the output power, the method further includes: After a specified time interval, obtaining fourth real-time temperature information of the key optimization area information; Comparing the fourth real-time temperature information with the safety temperature threshold information; If the fourth real-time temperature information is greater than or equal to the safety temperature threshold information, abnormally high temperature reminder information is generated.

5. The method according to claim 4, characterized in that After generating abnormally high temperature reminder information if the fourth real-time temperature information is greater than or equal to the safety temperature threshold information, the method further includes: Acquire the real-time location information of the key optimization area information and the inner wall area information of the target rectifier cabinet, as well as the key coverage area of ​​the cooling device; The recommended position information of the cooling device is generated according to the real-time position information, the inner wall area information and the key coverage area, wherein the recommended position information of the cooling device coincides with the real-time position information, the inner wall area information and the key coverage area.

6. A real-time temperature control system based on an intelligent rectifier cabinet, characterized in that: The system comprises: A real-time thermal map information acquisition module is used to acquire first real-time thermal map information of a target rectifier cabinet, and acquire second real-time thermal map information of the target rectifier cabinet after a specified time interval; A key optimization area information generation module: used to generate key optimization area information according to the first real-time heat map information and the second real-time heat map information; A cooling device power increase instruction generation module is used to generate a cooling device power increase instruction based on the key optimization area information, wherein the target rectifier cabinet is equipped with a cooling device, and the cooling device power increase instruction is used to indicate increasing the output power of the cooling device.

7. The system according to claim 6, characterized in that The first real-time thermal map information includes a plurality of first thermal regions and first real-time temperature information corresponding to each of the first thermal regions, and the second real-time thermal map information includes a plurality of second thermal regions and second real-time temperature information corresponding to each of the second thermal regions; The key optimization area information generation module includes: A submodule for generating information of the area to be detected: used for generating information of the area to be detected according to the second real-time thermal map information, wherein the information of the area to be detected is used for describing an area where at least two of the second thermal areas overlap; The overlapping area quantity information acquisition submodule is used to acquire the overlapping area quantity information according to the area information to be detected, wherein the overlapping area quantity information is used to describe the total number of the second thermal areas corresponding to the area information to be detected; Overlapping area quantity information comparison submodule: used to compare the overlapping area quantity information with preset overlapping quantity threshold information; A candidate region information determination submodule: configured to determine the to-be-detected region information as candidate region information if the overlapping region quantity information is greater than the overlapping quantity threshold information; The first real-time heat map information judgment submodule is used to judge whether the candidate area information does not exist in the first real-time heat map information; Key optimization area information determination submodule: used to determine the candidate area information as the key optimization area information if the candidate area information does not exist in the first real-time heat map information.

8. A terminal device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 5 are implemented.

9. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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