Magnet assembly and deposition apparatus including same

Abstract

A magnet assembly includes a yoke plate disposed on a plane and a magnetic field generator disposed on the yoke plate and including a magnet portion including a magnet unit, a magnetic body, and a non-magnetic body. The magnetic body overlaps the magnet portion in a plan view. The non-magnetic body overlaps a region between the magnet units in a plan view. The magnet assembly operates in one of a first mode and a second mode. The magnetic field generator generates a magnetic field under the magnetic and non-magnetic bodies in a first mode, and generates substantially no magnetic field under the magnetic and non-magnetic bodies in a second mode.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0103715 filed on August 8, 2023, in the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a magnet assembly, a deposition device including the magnet assembly, and a deposition method using the deposition device. Background Art

[0004] In recent years, as interest in information display has increased, research and development of display devices has continued.

[0005] The display device may include layers including various materials. For example, the display devices may each include an anode, a cathode, and an organic emission layer disposed between the anode and the cathode.

[0006] The organic emission layer may be formed by various methods. For example, the organic emission layer may be formed by a deposition process using a fine metal mask (FMM).

[0007] In order to realize a high-resolution display device, the structure forming the display device becomes finer, and accordingly, a deposition process needs to be more finely controlled. Summary of the invention

[0008] The present disclosure provides a magnet assembly in which a deposition process is more finely controlled to manufacture a high-resolution display device, a deposition apparatus including the magnet assembly, and a deposition method using the deposition apparatus.

[0009] The present disclosure provides a magnet assembly in which the risk of mechanical deformation of a substrate or the like during a deposition process can be reduced, a deposition apparatus including the magnet assembly, and a deposition method using the deposition apparatus.

[0010] The magnet assembly according to the embodiment may include a yoke plate disposed on a plane and a magnetic field generator disposed on the yoke plate and including a magnet portion including a magnet unit, a magnetic body, and a non-magnetic body. The magnetic body may overlap with the magnet portion in a plan view, the non-magnetic body may overlap with a region between the magnet units in a plan view, the magnet assembly may operate in one of a first mode and a second mode, and the magnetic field generator may generate a magnetic field under the magnetic body and the non-magnetic body in the first mode, and substantially does not generate a magnetic field under the magnetic body and the non-magnetic body in the second mode.

[0011] According to an embodiment, the magnetic body may include iron (Fe). The non-magnetic body may include brass (Cu—Zn).

[0012] According to an embodiment, the magnet part may include magnet units spaced apart from each other.

[0013] According to an embodiment, the magnet units may be arranged in a matrix structure in a first direction and in a second direction different from the first direction.

[0014] According to an embodiment, the magnetic body and the non-magnetic body may extend in the second direction and may be adjacent to each other in the first direction.

[0015] According to an embodiment, in the first mode, the magnet units may have the same polarity in the second direction, and the magnet units adjacent to each other in the first direction may have different polarities.

[0016] According to an embodiment, the magnetic field generated in the first mode may have a first magnetic field strength at a position corresponding to the central area of ​​the magnetic body, and a second magnetic field strength at a position corresponding to the central area of ​​the non-magnetic body. The first magnetic field strength may be the highest strength of the magnetic field. The second magnetic field strength may be the lowest strength of the magnetic field.

[0017] According to an embodiment, the magnetic body may include adjacent magnetic bodies, and the adjacent magnetic bodies may be spaced apart from each other by a distance in a range of about 1 mm to about 7 mm.

[0018] According to an embodiment, in the second mode, the magnet unit may alternately form different polarities in the first direction, and may alternately form different polarities in the second direction.

[0019] According to an embodiment, the magnet portion may include magnet units each having a magnetic width. The magnetic body may have a first width. The non-magnetic body may have a second width. The magnetic width may be equal to the first width. The first width may be greater than the second width.

[0020] According to an embodiment, the magnet portion may include magnet units each having a magnetic width. The magnetic body may have a first width. The non-magnetic body may have a second width. The magnetic width may be greater than the first width. The second width may be greater than the first width.

[0021] According to an embodiment, the magnet portion may include magnet units each having a magnetic width. The magnetic body may have a first width. The non-magnetic body may have a second width. The magnetic width may be smaller than the first width. The first width may be larger than the second width.

[0022] According to an embodiment, a deposition device may include: a deposition source, which is arranged in a chamber and is used to supply a deposition material; a magnet assembly, including a yoke plate arranged on a plane and a magnetic field generator arranged on the yoke plate and including a magnet part including a magnet unit, a magnetic body and a non-magnetic magnet; and a cooling plate, which is arranged between the magnet assembly and the deposition source, the magnetic body may overlap with the magnet part in a plan view, and the non-magnetic body may overlap with the area between the magnet units in a plan view, the magnet assembly may operate in one of a first mode and a second mode, and in the first mode, when the magnet assembly and the cooling plate are adjacent to each other, the magnetic field generator may generate a magnetic field below the magnet assembly and the cooling plate, and in the second mode, when the magnet assembly and the cooling plate are spaced apart from each other, the magnetic field generator may substantially not generate a magnetic field below the magnet assembly and the cooling plate.

[0023] The deposition method according to the embodiment may include: bringing a magnet assembly operated in one of a first mode and a second mode close to a substrate; bringing the substrate and a mask assembly into close contact with each other; depositing a deposition material on the substrate using the mask assembly; and separating the magnet assembly from the substrate. The magnet assembly may include a yoke plate disposed on a plane and a magnetic field generator disposed on the yoke plate and including a magnet portion including a magnet unit, a magnetic body, and a non-magnetic body, and the magnetic field generator may generate a magnetic field under the magnetic body and the non-magnetic body in the first mode, and substantially not generate a magnetic field under the magnetic body and the non-magnetic body in the second mode.

[0024] According to an embodiment, bringing the magnet assembly into proximity with the substrate may include operating the magnet assembly in the second mode.

[0025] According to an embodiment, bringing the substrate and the mask assembly into close contact with each other may include operating a magnet assembly in a first mode.

[0026] According to an embodiment, bringing the magnet assembly close to the substrate may include allowing the substrate and the magnet assembly to be adjacent to each other, wherein the cooling plate is interposed between the substrate and the magnet assembly. Bringing the substrate and the mask assembly into close contact with each other may include causing the magnet assembly to enter a first mode when the magnet assembly and the cooling plate are in contact with each other.

[0027] According to an embodiment, separating the magnet assembly and the substrate may include operating the magnet assembly in the second mode.

[0028] According to an embodiment, in separating the magnet assembly and the substrate, after the magnet assembly enters the second mode, a contact state between the magnet assembly and the cooling plate may be released.

[0029] According to an embodiment, the mask assembly may include a fine metal mask. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1is a schematic cross-sectional view illustrating a deposition apparatus according to an embodiment.

[0031] Figure 2 is a schematic cross-sectional view illustrating a magnet assembly including a magnetic field generator according to an embodiment.

[0032] Figure 3 is a schematic cross-sectional view illustrating a magnet assembly including a magnetic field generator according to an embodiment.

[0033] Figure 4 is a schematic cross-sectional view illustrating a magnet assembly including a magnetic field generator according to an embodiment.

[0034] Figure 5 is a schematic plan view illustrating a magnet assembly including a magnetic field generator according to an embodiment.

[0035] Figures 6 to 10 is a schematic diagram illustrating an operation mode of a magnetic field generator according to an embodiment.

[0036] Fig.11 is a flow chart illustrating a deposition method according to an embodiment.

[0037] Figure 12 to Figure 14 2 is a schematic cross-sectional view illustrating each process operation of a deposition method according to an embodiment. DETAILED DESCRIPTION

[0038] It will be apparent to those skilled in the art that various modifications and changes may be made in the present disclosure without departing from the spirit or scope of the present disclosure, and specific embodiments are illustrated in the drawings and explained in the detailed description. However, it should be understood that this is not intended to limit the present disclosure to the specific disclosed form, and includes all modifications, equivalents and substitutions included in the technical scope of the present disclosure.

[0039] Although the terms "first", "second", etc. can be used in this article to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, the first element discussed below can be referred to as the second element without departing from the teachings of the present disclosure.

[0040] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms of "one" and "the (said)" are intended to also include plural forms, unless the context clearly indicates otherwise. In addition, when used in this specification, the terms "include", "comprise" and / or "have" indicate the existence of stated features, wholes, steps, operations, elements, parts and / or their groups, but do not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, parts and / or their groups.

[0041] When an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, directly connected to, or coupled to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without intervening elements. In addition, when an element is referred to as being "in contact with" or "contacting" another element, etc., the element may be in "electrical contact" or in "physical contact" with the other element; or in "indirect contact" or in "direct contact" with the other element.

[0042] For descriptive purposes, spatially relative terms such as "below," "below," "under," "down," "above," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein and thereby describe the relationship of one element relative to another element(s) as illustrated in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "below" other elements or features will then be oriented to be "above" the other elements or features. Thus, the example term "below" can encompass both above and below orientations. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or oriented in other orientations), and therefore, the spatially relative descriptors used herein should be interpreted accordingly.

[0043] In the specification and claims, for the purpose of its meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group of...". For example, "at least one of A and B" may be understood to mean "A, B, or A and B". In the specification and claims, for the purpose of its meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" may be understood to mean "A, B, or A and B". The terms "and" and "or" may be used in a conjunctive or disjunctive sense and may be understood to be equivalent to "and / or".

[0044] It should also be noted that as used herein, the terms "substantially," "about," and other similar terms are used as terms of approximation rather than terms of degree, and thus are used to take into account the inherent deviations of measured, calculated, and / or provided values ​​recognized by those of ordinary skill in the art.

[0045] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or overly formal sense unless specifically so defined herein.

[0046] The present disclosure relates to a magnet assembly, a deposition device including the magnet assembly, and a deposition method using the same. Hereinafter, a magnet assembly according to an embodiment, a deposition device including the magnet assembly, and a deposition method using the same will be described with reference to the accompanying drawings.

[0047] Figure 1 is a schematic cross-sectional view illustrating a deposition apparatus according to an embodiment.

[0048] refer to Figure 1 , the deposition device DED may include a chamber CHM, a deposition source DES, a support SUP, a mask assembly FMM, a cooling plate COP and a magnet assembly MAS.

[0049] The deposition device DED may deposit the deposition material OLM provided from the deposition source DES on the substrate MS.

[0050] The deposition material OLM may be formed on the substrate MS in the chamber CHM. The deposition material OLM may include an organic material, but the present disclosure is not limited thereto. The deposition material OLM may include a material for forming an emission layer of an organic light emitting element to be manufactured.

[0051] The substrate MS may include a mother substrate. During the deposition process, the substrate MS may be disposed between the cooling plate COP and the mask assembly FMM.

[0052] The chamber CHM may house a deposition source DES, a support SUP, a mask assembly FMM, a cooling plate COP, and a magnet assembly MAS.

[0053] The deposition source DES may store the deposition material OLM, and may spray the deposition material OLM toward the mask assembly FMM and the substrate MS.

[0054] The support SUP may support a lower portion of the mask assembly FMM. The support SUP may provide a base on which the mask assembly FMM may be disposed.

[0055] The mask assembly FMM may be disposed to be fixed on the support SUP. During the performance of the deposition process, the mask assembly FMM may be adjacent to (eg, directly adjacent to) the substrate MS.

[0056] The mask assembly FMM may be disposed between the deposition source DES and the substrate MS so that the deposition material OLM may be patterned on the substrate MS.

[0057] According to an embodiment, the mask assembly FMM may include a fine metal mask.

[0058] The cooling plate COP may be disposed between the substrate MS and the magnet assembly MAS. During the deposition process, the cooling plate COP may push the substrate MS so that the substrate MS and the mask assembly FMM are in close contact with each other.

[0059] According to an embodiment, the cooling plate COP may include a non-magnetic material. For example, the cooling plate COP may have a structure in which a material (eg, glass) is coated with a non-magnetic material. However, the present disclosure is not limited thereto.

[0060] The magnet assembly MAS may be disposed above one side of the substrate MS. The magnet assembly MAS may be disposed above one side of the substrate MS with the cooling plate COP interposed between the magnet assembly MAS and the substrate MS. During the deposition process, the magnet assembly MAS may be moved to be adjacent to the cooling plate COP. For example, the magnet assembly MAS may be raised or lowered in the third direction DR3.

[0061] The magnet assembly MAS may be a sample holder for fixing the movement of the substrate MS. For example, the magnet assembly MAS may generate a magnetic field to pull the mask assembly FMM. Accordingly, during the deposition process, the risk of lifting between the mask assembly FMM and the substrate MS may be reduced, and the shielding effect generated during the deposition process may be improved.

[0062] The magnet assembly MAS may include a yoke plate YOP and a magnetic field generator MP.

[0063] The yoke plate YOP may include a plate that may form a base on which the magnetic field generator MP may be formed. According to an embodiment, the yoke plate YOP may include a magnetic material such as stainless steel, etc. However, the present disclosure is not limited thereto.

[0064] The yoke plate YOP may be disposed on a plane. In this specification, the plane may be defined by a first direction DR1 and a second direction DR2. For example, at least a portion of the plane may extend in the first direction DR1, and at least another portion of the plane may extend in the second direction DR2.

[0065] The magnetic field generator MP may be disposed on a surface of the yoke plate YOP (eg, a surface facing the cooling plate COP). The magnetic field generator MP may be disposed between the yoke plate YOP and the cooling plate COP.

[0066] The magnetic field generator MP may generate a magnetic field. In a state where the magnet assembly MAS is adjacent to the cooling plate COP, the magnetic field generated by the magnetic field generator MP may pull the mask assembly FMM, and accordingly, the mask assembly FMM and the substrate MS may be in close contact with each other.

[0067] Will refer to Figures 2 to 10 A magnet assembly MAS comprising a magnetic field generator MP is described.

[0068] Figures 2 to 4 is a schematic cross-sectional view illustrating a magnet assembly including a magnetic field generator according to an embodiment. Figure 5 is a schematic plan view illustrating a magnet assembly including a magnetic field generator according to an embodiment. Figure 5 is a plan view for describing the positional relationship between the mask assembly FMM and the magnet part MGN in a plan view during the deposition process. Figure 5 The substrate MS is omitted in the figure so that the arrangement relationship between the components can be understood more clearly.

[0069] Figures 6 to 10 is a schematic diagram illustrating an operation mode of a magnetic field generator according to an embodiment. Figure 6 is a block diagram illustrating the mode of operation of the magnetic field generator MP.

[0070] Figure 7 and Figure 8 is a schematic diagram illustrating the operation of the magnetic field generator MP in the first mode MODE1. Fig. 9 and Fig.10 is a schematic diagram illustrating the operation of the magnetic field generator MP in the second mode MODE2.

[0071] Figures 7 to 10 The magnetic field lines of the magnetic field generated by the magnetic field generator MP are indicated by dashed lines.

[0072] For ease of description, Figure 8 and Fig.10 Based on the above Figure 2 The cross-sectional structure of illustrates the operation mode of the magnetic field generator MP. Figure 8 and Fig.10 Along Figure 7 and Fig. 9 Schematic cross-sectional view taken along line AA'.

[0073] refer to Figures 2 to 5 , the magnetic field generator MP may include a magnet part MGN, a magnetic body MB and a non-magnetic body NMB.

[0074] The magnet part MGN may be disposed on one side of the yoke plate YOP. The magnet part MGN may be disposed between the yoke plate YOP and the magnetic body MB. In another embodiment, the magnet part MGN may be further disposed between the yoke plate YOP and the non-magnetic body NMB.

[0075] The magnet portion MGN may have a first surface S1 facing the magnetic body MB or the non-magnetic body NMB and a second surface S2 facing the yoke plate YOP.

[0076] According to an embodiment, the second surface S2 of the magnet part MGN may be adjacent to (e.g., directly adjacent to) the yoke plate YOP. According to an embodiment, the first surface S1 of the magnet part MGN may be adjacent to (e.g., directly adjacent to) the magnetic body MB. According to an embodiment, the first surface S1 of the magnet part MGN may be adjacent to (e.g., directly adjacent to) the non-magnetic body NMB.

[0077] The magnet part MGN may include a permanent magnet. For example, the magnet part MGN may include a ferromagnet including a ferrite-based magnet, a neodymium-based magnet, or a samarium-cobalt-based magnet. However, the present disclosure is not limited thereto.

[0078] The magnet portion MGN may include magnet units MGN_U spaced apart from each other. For example, the magnet units MGN_U may be spaced apart from each other in a first direction DR1, and may be spaced apart from each other in a second direction DR2. According to an embodiment, the magnet units MGN_U may be arranged in a matrix structure in a first direction DR1 and a second direction DR2 different from the first direction DR1. The first direction DR1 may be a row direction, and the second direction DR2 may be a column direction.

[0079] For example, the magnet units MGN_U may be sequentially arranged in each of the rows R. The rows R may include a first row R1, a second row R2, a third row R3, and a fourth row R4. The magnet units MGN_U may be sequentially arranged in each of the rows R.

[0080] According to an embodiment, the magnetic bodies MB may extend in the second direction DR2. The magnetic bodies MB may be adjacent to each other in the first direction DR1. The non-magnetic bodies NMB may extend in the second direction DR2. The non-magnetic bodies NMB may be adjacent to each other in the first direction DR1.

[0081] According to an embodiment, the magnetic bodies MB and the non-magnetic bodies NMB may be alternately disposed in the first direction DR1. According to an embodiment, the non-magnetic bodies NMB may be disposed between the magnet units MGN_U in each of the adjacent rows R.

[0082] According to an embodiment, during the performance of a deposition process, the mask assembly FMM including the pattern region and the non-pattern region and the magnet assembly MAS may be adjacent to each other (or overlap each other) in a thickness direction (eg, the third direction DR3 ).

[0083] The pattern area may be a transmission area of ​​the mask assembly FMM, and the non-pattern area may be a non-transmission area of ​​the mask assembly FMM.

[0084] According to an embodiment, the position of the non-pattern area may generally correspond to the position of the magnetic body MB and the magnetic body portion MGN. The position of the pattern area may generally correspond to the position of the non-magnetic body NMB.

[0085] According to an embodiment, the polarity of each of the magnet units MGN_U may be maintained or changed according to the operation mode of the magnet assembly MAS. Accordingly, in the case where the deposition device DED including the magnet assembly MAS according to the embodiment performs a deposition process, the pattern structure formed using the mask assembly FMM may become finer. Figures 6 to 10 to describe its details.

[0086] The magnetic body MB may be disposed on the first surface S1 of the magnet portion MGN. The magnetic body MB may be adjacent to (eg, directly adjacent to) the magnet unit MGN_U.

[0087] The magnetic body MB may include a material having magnetic force. For example, the magnetic body MB may include iron (Fe). However, the present disclosure is not limited thereto.

[0088] The magnetic body MB may be adjacent to the non-magnetic body NMB in the planar direction. For example, the magnetic body MB and the non-magnetic body NMB may not overlap each other in a planar view.

[0089] The non-magnetic body NMB may include a non-magnetic material. The non-magnetic body NMB may have a smaller magnetic force than the magnetic body MB. For example, the non-magnetic body NMB may include brass (Cu-Zn). However, the present disclosure is not limited thereto.

[0090] The magnet unit MGN_U may have a magnetic width W_B. The magnetic body MB may have a first width W1. The non-magnetic body NMB may have a second width W2.

[0091] According to an embodiment, the magnetic width W_B, the first width W1, and the second width W2 may be defined in a plane direction in which the yoke plate YOP is disposed. For example, the magnetic width W_B, the first width W1, and the second width W2 may be defined in the first direction DR1 or the second direction DR2.

[0092] According to the embodiment (see Figure 2), the magnetic width W_B may be equal to the first width W1. The magnetic width W_B and the first width W1 may be greater than the second width W2.

[0093] According to the embodiment (see Figure 3 ), the magnetic width W_B may be greater than the first width W1. The second width W2 may be greater than the first width W1.

[0094] According to the embodiment (see Figure 4 ), the magnetic width W_B may be smaller than the first width W1. The first width W1 may be larger than the second width W2.

[0095] According to an embodiment, a plurality of magnetic bodies MB and a plurality of non-magnetic bodies NMB may be provided and may be adjacent to each other in one direction. According to an embodiment, the magnetic bodies MB and the non-magnetic bodies NMB may extend in the second direction DR2. The magnetic bodies MB and the non-magnetic bodies NMB may be alternately arranged in the first direction DR1.

[0096] According to the embodiment, the magnet assembly MAS may have a structure in which the magnetic body MB and the non-magnetic body NMB are disposed adjacent to each other on a plane on the magnet portion MGN, and the pattern structure of the mask assembly FMM may become finer and mechanical noise during a deposition process may be reduced.

[0097] refer to Figures 6 to 10 , an operation mode of the magnetic field generator MP (or the magnet assembly MAS) will be described, and a technical effect achieved by the magnetic field generator MP (or the magnet assembly MAS) according to the embodiment will be described.

[0098] refer to Figures 6 to 10 , the magnetic field generator MP (or the magnet assembly MAS) may be provided to operate in a first mode MODE1 or a second mode MODE2.

[0099] According to an embodiment, the deposition device DED may include a controller configured to control overall operations of components included in the deposition device DED.

[0100] The controller can change the operation mode of the magnetic field generator MP. The controller can be implemented as a central processing unit (CPU) or a device similar thereto according to hardware, software, or a combination thereof. The controller can be provided in the form of an electronic circuit that processes electrical signals and performs control functions in terms of hardware. The controller can be provided in the form of a program, application, or firmware processed by a hardware controller in terms of software.

[0101] refer to Figures 6 to 8 , the magnetic field generator MP can operate in the first mode MODE1. The magnetic field generator MP can enter the first mode MODE1 from the second mode MODE2.

[0102] In the first mode MODE1, the magnetic field generator MP may generate a magnetic field in a region outside the magnetic field generator MP. For example, the first mode MODE1 may be an operation mode performed when the magnet assembly MAS including the magnetic field generator MP brings the substrate MS and the mask assembly FMM into close contact with each other.

[0103] For example, in the first mode MODE1, the magnetic field generator MP can generate a magnetic field below the magnetic body MB and the non-magnetic body NMB. Accordingly, a magnetic field can be generated below the magnetic field generator MP (eg, below the magnetic body MB and the non-magnetic body NMB).

[0104] According to an embodiment, in the first mode MODE1, the magnet units MGN_U arranged in the second direction DR2 may have the same polarity. In the first mode MODE1, the magnet units MGN_U adjacent to each other in the first direction DR1 may have different polarities. For example, the magnet units MGN_U arranged in the first row R1 and the third row R3 may have an N pole. The magnet units MGN_U arranged in the second row R2 and the fourth row R4 may have an S pole. Accordingly, the magnet units MGN_U may generate a magnetic field between adjacent rows R. The generated magnetic field may have a relatively low intensity between adjacent rows R, and may have a relatively high intensity at a position where the magnet unit MGN_U is arranged in each row arranged in the rows R.

[0105] According to an embodiment, the generated magnetic field may have a first magnetic field strength ST1 in a region. For example, the first magnetic field strength ST1 may be the highest magnetic field strength of the generated magnetic field. In a plan view, the position where the first magnetic field strength ST1 is generated may overlap with the region where the magnet part MGN is provided. For example, in a plan view, the position where the first magnetic field strength ST1 is generated may correspond to the central region of the magnet part MGN. In a plan view, the position where the first magnetic field strength ST1 is generated may correspond to the central region of the magnetic body MB.

[0106] According to an embodiment, the generated magnetic field may have a second magnetic field strength ST2 in another region. For example, the second magnetic field strength ST2 may be the lowest magnetic field strength of the generated magnetic field. In a plan view, the position where the second magnetic field strength ST2 is generated may overlap with the region between the magnet parts MGN. For example, in a plan view, the position where the second magnetic field strength ST2 is generated may correspond to the central region between the magnet units MGN_U. In a plan view, the position where the second magnetic field strength ST2 is generated may correspond to the central region of the non-magnetic body NMB.

[0107] According to an embodiment, the distance L between the magnetic field positions defining the first magnetic field strength ST1 may be less than or equal to about 10 mm. The distance L may be the distance between the central areas of adjacent magnetic bodies MB. According to an embodiment, the distance L may be in the range of about 1 mm to about 7 mm. According to an embodiment, the distance L may be in the range of about 2 mm to about 6 mm. According to an embodiment, the distance L may be about 5 mm. However, the present disclosure is not limited thereto.

[0108] refer to Figure 6 , Fig. 9 and Fig.10 , the magnetic field generator MP can operate in the second mode MODE2. The magnetic field generator MP can enter the second mode MODE2 from the first mode MODE1.

[0109] In the second mode MODE2, the magnetic field generator MP may not generate a magnetic field in a region outside the magnetic field generator MP. For example, the second mode MODE2 may be an operation mode performed when the magnet assembly MAS including the magnetic field generator MP does not bring the substrate MS and the mask assembly FMM into close contact with each other.

[0110] For example, in the second mode MODE2, the magnetic field generated by the magnetic field generator MP can be generated to have a relatively very weak intensity under the magnetic body MB and the non-magnetic body NMB, or the magnetic field generator MP can generate substantially no magnetic field under the magnetic body MB and the non-magnetic body NMB. The magnetic field generator MP can generate a magnetic field in a region in which the magnetic body MB and the non-magnetic body NMB are disposed. Accordingly, a magnetic field having a relatively very weak intensity can be generated under the magnetic field generator MP (for example, under the magnetic body MB and the non-magnetic body NMB), or substantially no magnetic field can be generated.

[0111] According to an embodiment, in the second mode MODE2, the magnet units MGN_U arranged in the first direction DR1 may alternately form different polarities. For example, in the first direction DR1, the magnet units MGN_U forming the N pole and the magnet units MGN_U forming the S pole may be arranged alternately. According to an embodiment, in the second mode MODE2, the magnet units MGN_U arranged in the second direction DR2 may alternately form different polarities. For example, in the second direction DR2, the magnet units MGN_U forming the N pole and the magnet units MGN_U forming the S pole may be arranged alternately. For example, the magnet units MGN_U arranged in the first row R1 and the third row R3 may alternately form the N pole and the S pole in sequence. The magnet units MGN_U arranged in the second row R2 and the fourth row R4 may alternately form the S pole and the N pole in sequence. Accordingly, the magnetic fields generated by the adjacent magnet units MGN_U may offset each other to have a relatively low intensity. As a result, due to the magnetic body MB and the non-magnetic body NMB formed under the magnet portion MGN, the magnetic field generated in the second mode MODE2 may not be substantially generated under the magnetic body MB and the non-magnetic body NMB, or may be generated to have a very low intensity.

[0112] refer to Figure 5 In order to realize fine patterns in display panels, etc., it may be necessary to manufacture pattern areas and non-pattern areas to have fine widths. According to an embodiment, during the deposition process, the mask assembly FMM may be disposed under the magnet assembly MAS, and the substrate MS may be disposed between the magnet assembly MAS and the mask assembly FMM.

[0113] In order to properly combine the mask assembly FMM in which the pattern region and the non-pattern region are more finely formed and the magnet assembly MAS, it is necessary that the magnet units MGN_U of the magnet assembly MAS be spaced apart from each other at narrow intervals.

[0114] According to the embodiment, since the magnetic body MB and the non-magnetic body NMB are disposed under the magnet portion MGN, the magnet portion MGN may be more finely disposed, and thus, the mask assembly FMM may be provided to realize a fine pattern.

[0115] For example, the magnetic field generated in the case where the magnet assembly MAS operates in the first mode MODE1 may be defined by a structure in which the magnetic body MB and the non-magnetic body NMB are arranged. Therefore, the generated magnetic field may be fine.

[0116] Depending on the panel to be manufactured, the thickness of each component disposed under the cooling plate COP may be different. For example, in the case where a double-layer mask is disposed under at least a portion of the substrate MS (e.g., the mask assembly FMM includes a double-layer mask), or the substrate MS is provided to manufacture a display panel including an under-screen camera (UPC) structure, the thickness of each component disposed under the cooling plate COP may be different.

[0117] Experimentally, in the case where a deposition process is performed to arrange the magnet assembly MAS on the surface of the cooling plate COP and the substrate MS having a thickness deviation is disposed on the other surface of the cooling plate COP, it may be desirable to set the entire region causing the thickness deviation so as not to overlap with the magnet part MGN in a plan view. For example, in the case where a portion of the region causing the thickness deviation overlaps with the magnet part MGN and another portion of the region causing the thickness deviation does not overlap with the magnet part MGN, a portion of the generated magnetic field may generate a repulsive force on the mask assembly FMM, which may result in a risk of the mask assembly FMM being lifted from the cooling plate COP.

[0118] However, according to an embodiment, the magnet parts MGN may be arranged more finely, thereby reducing the risk that the region of the substrate MS causing thickness deviation is unevenly disposed. Accordingly, the risk of the mask assembly FMM being lifted from the cooling plate COP may be reduced.

[0119] According to an embodiment, the magnet assembly MAS may operate in one of the first mode MODE1 and the second mode MODE2 according to a process operation of a deposition process, and thus, a mechanical risk that may occur during the deposition process may be reduced. Details thereof will be described below with reference to the accompanying drawings.

[0120] refer to Figures 11 to 14 With reference to the above drawings, a deposition method using a deposition device DED according to an embodiment will be described. For the convenience of description, the contents that may be repeated with the above contents will be briefly described or not repeated.

[0121] Fig.11 is a flow chart illustrating a deposition method according to an embodiment. Figure 12 to Figure 14 2 is a schematic cross-sectional view illustrating each process operation of a deposition method according to an embodiment.

[0122] Fig.12 and Fig.14 The embodiment in which the magnet assembly MAS operates in the second mode MODE2 is illustrated, and reference is made to Fig.10 The process operation based on the cross-sectional structure described above is shown.

[0123] Fig.13An embodiment in which the magnet assembly MAS operates in the first mode MODE1 is illustrated, and reference is made to Figure 8 The process operation based on the cross-sectional structure described above is shown.

[0124] refer to Fig.11 According to an embodiment, a deposition method using a deposition device DED may include: an operation S100 of approaching a magnet assembly toward a substrate, an operation S200 of bringing the substrate and a mask assembly into close contact with each other, an operation S300 of depositing a deposition material, and an operation S400 of separating the magnet assembly and the substrate.

[0125] refer to Fig.11 and Fig.12 In operation S100 of approaching the magnet assembly toward the substrate, the magnet assembly MAS may be moved to be adjacent to the substrate MS and the cooling plate COP.

[0126] In operation S100, the magnet assembly MAS may operate in the second mode MODE2. Fig. 9 and Fig.10 , the magnetic field generated by the magnetic field generator MP may be offset and generated to be relatively weak under the magnetic body MB and the non-magnetic body NMB, or substantially no magnetic field may be generated under the magnetic body MB and the non-magnetic body NMB.

[0127] Experimentally, when the magnet assembly MAS is adjacent to the substrate MS and the cooling plate COP in a state in which a strong magnetic field is generated below the magnet assembly MAS, mechanical noise (e.g., mechanical vibration) may be generated in the substrate MS in a state in which the magnet assembly MAS is not in close contact with the cooling plate COP.

[0128] However, according to an embodiment, when the magnet assembly MAS operates in the second mode MODE2 in which a relatively weak magnetic field or substantially no magnetic field can be generated under the magnet assembly MAS, the magnet assembly MAS can be adjacent to the substrate MS and the cooling plate COP, so that the risks described above can be prevented.

[0129] refer to Fig.11 and Fig.13 In operation S200 of bringing the substrate and the mask assembly into close contact with each other, the magnet assembly MAS may be adjacent to (eg, directly adjacent to) the cooling plate COP, and accordingly, the substrate MS and the cooling plate COP may be in close contact with each other.

[0130] In operation S200, the magnet assembly MAS may operate in the first mode MODE1. Figure 7 and Figure 8 , the magnetic field generated by the magnetic field generator MP can be generated below the magnetic field generator MP.

[0131] According to an embodiment, in operation S200 , the magnet assembly MAS may simultaneously enter the first mode MODE1 while the magnet assembly MAS is adjacent to (eg, directly adjacent to) the cooling plate COP and the substrate MS and the cooling plate COP are in close contact with each other.

[0132] Accordingly, according to an embodiment, at a timing in a process of bringing the substrate MS and the cooling plate COP into close contact with each other, an operation of generating a magnetic field under the magnetic field generator MP may be selectively performed.

[0133] refer to Fig.11 and Fig.13 In operation S300 of depositing a deposition material, a deposition material OLM may be deposited on the substrate MS.

[0134] In operation S300, the magnet assembly MAS may operate (or remain in) the first mode MODE1. Accordingly, the magnetic field generated by the magnetic field generator MP may be continuously generated (e.g., maintained) below the magnetic field generator MP, and in a state where the substrate MS is disposed in close contact with the cooling plate COP, a deposition process may be performed.

[0135] refer to Fig.11 and Fig.14 , in operation S400 of separating the magnet assembly and the substrate, the magnet assembly MAS may be physically separated from the cooling plate COP, and accordingly, a close contact state between the substrate MS and the cooling plate COP may be released.

[0136] In operation S400, the magnet assembly MAS may operate in the second mode MODE2. Fig. 9 and Fig.10 , a relatively weak magnetic field may be generated below the magnetic body MB and the non-magnetic body NMB, or substantially no magnetic field may be generated.

[0137] According to an embodiment, in operation S400, after the magnet assembly MAS enters the second mode MODE2, the magnet assembly MAS may be separated from the cooling plate COP. For example, the contact state between the magnet assembly MAS and the cooling plate COP may be released only after the magnet assembly MAS enters the second mode MODE2. Since the magnet assembly MAS may be separated from the cooling plate COP after the magnetic field applied to the mask assembly FMM is blocked, unnecessary vibration or movement of the substrate MS may be prevented according to the movement of the magnet assembly MAS. Accordingly, the mechanical noise of the substrate MS may be reduced, and process reliability may be improved.

[0138] According to an embodiment of the present disclosure, a magnet assembly in which a deposition process is more finely controlled to manufacture a high-resolution display device, a deposition apparatus including the magnet assembly, and a deposition method using the deposition apparatus may be provided.

[0139] An object of the present disclosure is to provide a magnet assembly in which the risk of mechanical deformation of a substrate or the like during a deposition process can be reduced, a deposition apparatus including the magnet assembly, and a deposition method using the deposition apparatus.

[0140] The above description is an example of the technical features of the present disclosure, and those skilled in the art to which the present disclosure belongs will be able to make various modifications and changes.Therefore, the various embodiments of the present disclosure described above may be implemented individually or in combination with each other.

[0141] Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure, but are used to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The protection scope of the present disclosure should be interpreted by the claims, and it should be understood that all technical spirits within the equivalent scope are included in the scope of the present disclosure.

Claims

1. A magnet assembly, comprising: a yoke plate, disposed on a flat surface; as well as A magnetic field generator is provided on the yoke plate and includes a magnet portion including a magnet unit, a magnetic body and a non-magnetic body, wherein The magnetic body partially overlaps with the magnet in a plan view, The non-magnetic body overlaps with the region between the magnetic units in the plan view, The magnet assembly operates in one of a first mode and a second mode, and The magnetic field generator generates a magnetic field under the magnetic body and the non-magnetic body in the first mode, and does not generate a magnetic field under the magnetic body and the non-magnetic body in the second mode.

2. The magnet assembly according to claim 1, wherein: The magnetic body includes iron, and The non-magnetic body includes brass.

3. The magnet assembly according to claim 1, wherein: The magnet portion includes the magnet units spaced apart from each other.

4. The magnet assembly according to claim 3, wherein: The magnet units are arranged in a matrix structure in a first direction and in a second direction different from the first direction.

5. The magnet assembly according to claim 4, wherein: The magnetic body and the non-magnetic body extend in the second direction and are adjacent to each other in the first direction.

6. The magnet assembly according to claim 5, wherein: In the first mode, The magnet units have the same polarity in the second direction, and The magnet units adjacent to each other in the first direction have different polarities.

7. The magnet assembly according to claim 6, wherein: The magnetic field generated in the first mode has a first magnetic field strength at a position corresponding to the central region of the magnetic body, and has a second magnetic field strength at a position corresponding to the central region of the non-magnetic body, The first magnetic field strength is the highest strength of the magnetic field, and The second magnetic field strength is the lowest strength of the magnetic field.

8. The magnet assembly according to claim 7, wherein: The magnetic body includes adjacent magnetic bodies, and The adjacent magnetic bodies are spaced apart from each other by a distance in a range of 1 mm to 7 mm.

9. The magnet assembly according to claim 5, wherein: In the second mode, The magnet units alternately form different polarities in the first direction, and alternately form different polarities in the second direction.

10. The magnet assembly according to any one of claims 1 to 9, wherein: The magnet portion includes the magnet units each having a magnet width, The magnetic body has a first width, The non-magnetic body has a second width, The magnetic width is equal to the first width, and The first width is greater than the second width.

11. The magnet assembly according to any one of claims 1 to 9, wherein: The magnet portion includes the magnet units each having a magnet width, The magnetic body has a first width, The non-magnetic body has a second width, The magnetic width is greater than the first width, and The second width is greater than the first width.

12. The magnet assembly according to any one of claims 1 to 9, wherein: The magnet portion includes the magnet units each having a magnet width, The magnetic body has a first width, The non-magnetic body has a second width, The magnetic width is smaller than the first width, and The first width is greater than the second width.

13. A deposition device comprising: a deposition source disposed in the chamber and used to supply a deposition material; A magnet assembly including a yoke plate disposed on a plane and a magnetic field generator disposed on the yoke plate and including a magnet portion including a magnet unit, a magnetic body and a non-magnetic body; as well as A cooling plate is disposed between the magnet assembly and the deposition source, wherein The magnetic body partially overlaps with the magnet in a plan view, The non-magnetic body overlaps with the region between the magnetic units in the plan view, The magnet assembly operates in one of a first mode and a second mode, and The magnetic field generator generates a magnetic field under the magnet assembly and the cooling plate when the magnet assembly and the cooling plate are adjacent to each other in the first mode, and does not generate a magnetic field under the magnet assembly and the cooling plate when the magnet assembly and the cooling plate are spaced apart from each other in the second mode.

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