Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer, first and second internal electrode layers, the first and second internal electrode layers being alternately disposed in a first direction; and a first external electrode and a second external electrode disposed on both surfaces of the body in the second direction, respectively. The first internal electrode layer and the second internal electrode layer each include a first internal electrode connected to the first external electrode and a second internal electrode connected to the second external electrode. The first and second internal electrodes are alternately disposed in the third direction, the first internal electrodes of the first internal electrode layer are alternately disposed in the first direction with the second internal electrodes of the second internal electrode layer, and the second internal electrodes of the first internal electrode layer are alternately disposed in the first direction with the first internal electrodes of the second internal electrode layer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0105577 filed on August 11, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC, a type of multilayer electronic component) may be a chip capacitor mounted on a printed circuit board of various types of electronic products such as an image display device such as a liquid crystal display (LCD) or a plasma display panel (PDP), a computer, a smart phone, a mobile phone, etc., and used to charge or discharge the same.

[0004] As electronic products are designed to be miniaturized, thin, and multifunctional, chip components are also required to be miniaturized, and the mounting of electronic components has also become highly integrated. In response to this trend, the space between mounted electronic components has also been reduced.

[0005] In order to make MLCC have high capacitance, it may be necessary to use a material with a high dielectric constant as the material of the dielectric layer, or to design it to reduce the thickness of the dielectric layer. However, in addition to capacitance, MLCC also has many characteristics that should be satisfied at the same time (such as temperature characteristics, voltage characteristics, and moisture resistance reliability), so there is a limitation in reducing the thickness of the dielectric layer.

[0006] Therefore, there is a need for structural improvements in MLCCs that can increase capacitance per unit volume without deteriorating reliability. Summary of the invention

[0007] One aspect of the present disclosure is to increase the capacitance per unit volume of a multilayer electronic component.

[0008] An aspect of the present disclosure is to improve capacitance per unit volume of a multilayer electronic component without deteriorating the reliability of the multilayer electronic component.

[0009] According to one aspect of the present disclosure, a multilayer electronic component may include: a body including a dielectric layer, a first inner electrode layer and a second inner electrode layer, the first inner electrode layer and the second inner electrode layer being alternately arranged in a first direction, and the dielectric layer being interposed between the first inner electrode layer and the second inner electrode layer; a first outer electrode arranged on one of two surfaces of the body opposite to each other in a second direction perpendicular to the first direction; and a second outer electrode arranged on the other of the two surfaces of the body opposite to each other in the second direction. The first inner electrode layer and the second inner electrode layer may each include a first inner electrode connected to the first outer electrode and a second inner electrode connected to the second outer electrode. The first inner electrode and the second inner electrode may be alternately arranged to be spaced apart from each other in a third direction perpendicular to the first direction and the second direction, the first inner electrode of the first inner electrode layer may be alternately arranged with the second inner electrode of the second inner electrode layer in the first direction, and the second inner electrode of the first inner electrode layer may be alternately arranged with the first inner electrode of the second inner electrode layer in the first direction. s≥td may be satisfied, wherein s is the distance in the third direction between one of the first internal electrodes and the second internal electrode most adjacent to the one first internal electrode in the third direction, and td is the distance in the first direction between the one first internal electrode and the second internal electrode most adjacent to the one first internal electrode in the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present disclosure; Figure 2 is a perspective view schematically showing a main body according to an embodiment; Figure 3 is a cross-sectional view showing a cross section in a first direction and a third direction of a multilayer electronic component according to a comparative example, the cross section being obtained by polishing the multilayer electronic component to a central portion in a second direction; Figure 4 is along Figure 1 A cross-sectional view taken along line II'; Figure 5 is a plan view showing an inner electrode layer according to an embodiment; Figure 6 is a cross-sectional view showing a cross section of a capacitance forming portion in a first direction and a third direction according to an embodiment; Fig. 7Ais a schematic diagram showing an electric field flux between internal electrodes of a multilayer electronic component according to a comparative example using a (3×n) matrix as an example, and Figure 7B is a schematic diagram showing an electric field flux between internal electrodes of a multilayer electronic component according to an example using a (3×n) matrix as an example; Fig. 8A is a schematic diagram showing an electric field flux between internal electrodes of a multilayer electronic component according to a comparative example using a (n×3) matrix as an example, and Figure 8B is a schematic diagram showing an electric field flux between internal electrodes of a multilayer electronic component according to an example using a (n×3) matrix as an example; Fig. 9 yes Figure 4 an enlarged view of a region P; and Fig.10 is a perspective view showing a portion of a process of stacking inner electrodes and dielectric layers according to an embodiment. DETAILED DESCRIPTION

[0011] Hereinafter, the specific embodiments of the present disclosure will be described as follows with reference to the accompanying drawings. However, the present disclosure can be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Therefore, for the sake of clarity of description, the shapes and sizes of the elements in the drawings may be exaggerated, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0012] In the accompanying drawings, irrelevant descriptions will be omitted to clearly describe the present disclosure, and the thickness may be exaggerated to clearly represent multiple layers and regions. The same elements with the same functions within the scope of the same concept will be described using the same reference numerals. Throughout the specification, unless otherwise explicitly stated, when a component is referred to as "including" or "comprising", it means that it may also include other components, rather than excluding other components.

[0013] In the drawings, the first direction may be defined as a direction or a thickness direction in which the first inner electrode layers and the second inner electrode layers are alternately arranged with the dielectric layer interposed between the first inner electrode layers and the second inner electrode layers, and in the second direction and the third direction perpendicular to the first direction, the second direction may be defined as a length direction, and the third direction may be defined as a width direction.

[0014] Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present disclosure.

[0015] Figure 2 is a perspective view schematically showing a main body according to an embodiment.

[0016] Figure 3 : is a cross-sectional view showing a cross section in the first direction and the third direction of a multilayer electronic component according to a comparative example, the cross section being obtained by polishing the multilayer electronic component to a center portion in the second direction.

[0017] Figure 4 is along Figure 1 A cross-sectional view taken along line II'.

[0018] Figure 5 is a plan view showing an internal electrode layer according to an embodiment.

[0019] Figure 6 2 is a cross-sectional view illustrating a cross section of a capacitance forming portion in a first direction and a third direction according to an embodiment.

[0020] Fig. 7A is a schematic diagram showing an electric field flux between internal electrodes of a multilayer electronic component according to a comparative example using a (3×n) matrix as an example, and Figure 7B is a schematic diagram illustrating electric field flux between internal electrodes of a multilayer electronic component according to an example using a (3×n) matrix as an example.

[0021] Fig. 8A is a schematic diagram showing an electric field flux between internal electrodes of a multilayer electronic component according to a comparative example using a (n×3) matrix as an example, and Figure 8B is a schematic diagram illustrating electric field flux between internal electrodes of a multilayer electronic component according to an example using a (n×3) matrix as an example.

[0022] Fig. 9 yes Figure 4 Magnified view of area P.

[0023] Fig.10 is a perspective view showing a portion of a process of stacking inner electrodes and dielectric layers according to an embodiment.

[0024] In the following, reference will be made to Figures 1 to 10 The multilayer electronic component 100 according to the embodiment is described in more detail.

[0025] According to an embodiment of the present disclosure, a multilayer electronic component 100 may include a body 110 including a dielectric layer 111, a first internal electrode layer 120a, and a second internal electrode layer 120b, the first internal electrode layers 120a and the second internal electrode layers 120b being alternately arranged in a first direction with the dielectric layer 111 interposed therebetween; a first external electrode 130 disposed on one of two surfaces of the body 110 that are opposite to each other in a second direction perpendicular to the first direction; and a second external electrode 140 disposed on the other of the two surfaces of the body 110 that are opposite to each other in the second direction. The first internal electrode layer 120a may include a first internal electrode 121 connected to the first external electrode 130 and a second internal electrode 122 connected to the second external electrode 140, and the second internal electrode layer 120b may include a first internal electrode 121 connected to the first external electrode 130 and a second internal electrode 122 connected to the second external electrode 140. The first internal electrodes 121 and the second internal electrodes 122 may be alternately disposed in a third direction perpendicular to the first direction and the second direction to be spaced apart from each other, the first internal electrodes 121 of the first internal electrode layer 120a may be alternately disposed with the second internal electrodes 122 of the second internal electrode layer 120b in the first direction, and the second internal electrodes 122 of the first internal electrode layer 120a may be alternately disposed with the first internal electrodes 121 of the second internal electrode layer 120b in the first direction. When a distance in the third direction between the first internal electrode 121 and the second internal electrode 122 most adjacent to the first internal electrode 121 in the third direction is defined as s, and a distance in the first direction between the first internal electrode 121 and the second internal electrode 122 most adjacent to the first internal electrode 121 in the first direction is defined as td, s≥td is satisfied.

[0026] Reference Figure 4 The body 110 includes a dielectric layer 111, a first internal electrode layer 120a and a second internal electrode layer 120b, the first internal electrode layers 120a and the second internal electrode layers 120b are alternately arranged in a first direction, and the dielectric layer 111 is between the first internal electrode layers 120a and the second internal electrode layers 120b.

[0027] The shape of the body 110 may not be limited to any specific shape, but as shown in the figure, the body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder included in the body 110 during the firing process, the body 110 may not have a precise hexahedral shape formed by straight lines, but may generally have a hexahedral shape.

[0028] The main body 110 may have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and face each other in a third direction.

[0029] The plurality of dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that the boundary between adjacent dielectric layers 111 may not be easily distinguishable without using a scanning electron microscope (SEM).

[0030] The raw material for forming the dielectric layer 111 is not limited to any specific example as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material may be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and examples of the BaTiO3-based ceramic powder may include (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1). In this case, the dielectric layer 111 may include barium (Ba) and titanium (Ti), and may additionally include calcium (Ca) and zirconium (Zr) depending on the solid-solved elements.

[0031] In addition, as the raw material for forming the dielectric layer 111, a CaZrO3-based paraelectric (Ca 1-x Sr x )(Zr 1- y Ti y )O3 (0 < x < 1, 0 < y < 1) (CSZT) material may be used. In this case, the dielectric layer 111 may include calcium (Ca), strontium (Sr), zirconium (Zr), and titanium (Ti).

[0032] Furthermore, for the purpose of the present disclosure, the raw material of the dielectric layer 111 may include various ceramic additives, organic solvents, binders, dispersants, etc. added to powders (such as barium titanate (BaTiO3) powder, etc.).

[0033] The first inner electrode layer 120a and the second inner electrode layer 120b may be alternately disposed, and the dielectric layer 111 is interposed between the first inner electrode layer 120a and the second inner electrode layer 120b, so that the first inner electrode layer 120a and the second inner electrode layer 120b may be used to form a capacitor together with the dielectric layer 111. However, the capacitor may not be formed over the entire region of the first inner electrode layer 120a and the second inner electrode layer 120b, and the first inner electrode 121 and the second inner electrode 122 to be described later may be overlapped in the first direction and / or the third direction, so that the capacitor may be formed only in the region where the electric field is formed and in the peripheral region thereof. In this specification, for ease of description, the region where the first inner electrode 121 and the second inner electrode 122 overlap in the first direction and / or the third direction is defined as a capacitor forming portion Ac, but the region where the capacitor is actually formed may be different from the capacitor forming portion Ac.

[0034] In an embodiment, the covering parts 112 and 113 may be disposed on one surface and the other surface of the capacitance forming part Ac in the first direction, respectively.

[0035] The covering parts 112 and 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on upper and lower surfaces of the capacitance forming part Ac, respectively, in a thickness direction, and may prevent damage to the internal electrodes due to physical stress and / or chemical stress.

[0036] The cover parts 112 and 113 do not include an internal electrode, and may include the same material as that of the dielectric layer 111. That is, the cover parts 112 and 113 may include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0037] In addition, the average thickness of the cover parts 112 and 113 may not be limited to any specific example. However, in order to easily obtain miniaturization and high capacitance of the multilayer electronic component, the average thickness of the cover parts 112 and 113 may be 15 μm or less.

[0038] Here, the average thickness of the covering portions 112 and 113 may refer to an average size of the covering portions 112 and 113 in the first direction, and may be a value obtained by averaging the sizes of the covering portions 112 and 113 in the first direction measured at five equally spaced points above or below the capacitance forming portion Ac.

[0039] Reference Figure 2 In an embodiment, the edge portions 114 and 115 may be respectively disposed on one surface and the other surface of the capacitance forming portion Ac in the third direction.

[0040] like Figure 2As shown in , the edge portions 114 and 115 may mean regions between both ends of the first and second internal electrodes 121 and 122 and the outer surface of the body 110 .

[0041] The edge portions 114 and 115 may mainly serve to prevent damage to the inner electrodes due to physical stress and / or chemical stress.

[0042] The edge portions 114 and 115 may be formed by applying a conductive paste to portions of the ceramic green sheet except for where the edge portions are to be formed to form internal electrodes.

[0043] In addition, in order to suppress the step difference caused by the internal electrodes 121 and 122, cutting may be performed after stacking so that the internal electrodes are exposed to the two side surfaces of the capacitor forming portion Ac in the third direction (width direction), and then edge portions 114 and 115 are formed by stacking a single dielectric layer or two or more dielectric layers on the two side surfaces of the capacitor forming portion Ac in the third direction (width direction).

[0044] In addition, there is no particular limitation on the width of the edge portions 114 and 115. However, in order to more easily achieve miniaturization and high capacitance of a multilayer electronic component, the average width of the edge portions 114 and 115 may be 15 μm or less.

[0045] The average width of edge portions 114 and 115 may refer to an average size of edge portions 114 and 115 in the third direction, and may be a value obtained by averaging the sizes of edge portions 114 and 115 in the third direction measured at five points equally spaced on both sides of the capacitor forming portion Ac.

[0046] The inner electrodes 121 and 122 may be alternately disposed in the first direction with the dielectric layer 111 between the inner electrodes 121 and 122, and the inner electrodes 121 and 122 may also be alternately disposed in the third direction. The inner electrodes 121 and 122 may include a first inner electrode 121 connected to the first outer electrode 130 and a second inner electrode 122 connected to the second outer electrode 140. In this case, the first inner electrode 121 may be disposed to be spaced apart from the second outer electrode 140, and the second inner electrode 122 may be disposed to be spaced apart from the first outer electrode 130. Therefore, different voltages may be applied to the first inner electrode 121 and the second inner electrode 122.

[0047] In addition, the dielectric layer 111 can be disposed in a space where a first inner electrode 121 described later is spaced from a second outer electrode 140 , and can be disposed in a space where a second inner electrode 122 described later is spaced from a first outer electrode 130 , thereby improving the mechanical strength and moisture resistance reliability of the multilayer electronic component 100 .

[0048] Reference Figure 4, the first internal electrodes 121 and the second internal electrodes 122 may be alternately disposed in the third direction in the same internal electrode layers 120a and 120b to be spaced apart from each other, and the first internal electrode 121 included in one of the internal electrode layers 120a and 120b may be alternately disposed in the first direction with the second internal electrode 122 included in the other internal electrode layer. In addition, as described above, since the internal electrode layers 120a and 120b are disposed with the dielectric layer 111 interposed between the internal electrode layers 120a and 120b, the first internal electrode 121 included in one of the internal electrode layers 120a and 120b may be disposed to be spaced apart from the second internal electrode 122 included in the other internal electrode layer in the first direction. Similarly, the second internal electrode 122 included in one of the internal electrode layers 120a and 120b may be alternately disposed in the first direction with the first internal electrode 121 included in the other internal electrode layer, and may be disposed to be spaced apart from the first internal electrode 121 included in the other internal electrode layer in the first direction.

[0049] The material for forming the internal electrodes 121 and 122 is not limited to any specific example, and a material having excellent conductivity may be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0050] In addition, the internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes including one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on the ceramic green sheet. As a method of printing the conductive paste for the internal electrodes, a screen printing method or a gravure printing method may be used, but the embodiment is not limited thereto.

[0051] The external electrodes 130 and 140 may be disposed on the body 110 .

[0052] The external electrodes 130 and 140 may include a first external electrode 130 contacting the third surface 3 of the body 110 and a second external electrode 140 contacting the fourth surface 4 of the body 110. The first external electrode 130 may be connected to the first internal electrode 121, and the second external electrode 140 may be connected to the second internal electrode 122.

[0053] In an embodiment, the multilayer electronic component 100 may have two external electrodes 130 and 140 , but the number of the external electrodes 130 and 140 and the shapes of the external electrodes 130 and 140 may vary according to the internal electrodes 121 and 122 or for other purposes.

[0054] In addition, the external electrodes 130 and 140 may be formed using any material having conductivity, such as metal, and a specific material may be determined in consideration of electrical characteristics and structural stability, and may have a multi-layered structure.

[0055] For example, the external electrodes 130 and 140 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer.

[0056] For a more specific example of the electrode layer, the electrode layer may be a sintered electrode including a conductive metal and glass or a resin-based electrode including a conductive metal and resin.

[0057] In addition, the electrode layer may have a form in which a sintered electrode and a resin-based electrode are sequentially formed on the body. In addition, the electrode layer may be formed by transferring a sheet including a conductive metal onto the body or by transferring a sheet including a conductive metal onto the sintered electrode.

[0058] A material having excellent conductivity may be used as the conductive metal included in the electrode layer, and the type of the electrode layer is not limited to any specific example. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and may preferably be copper (Cu) to improve adhesion to the body.

[0059] The plating layer is used to improve mounting characteristics. The type of the plating layer is not limited to any specific example, and may be a plating layer including one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, and may be formed of a plurality of layers.

[0060] For a more specific example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, or the plating layer may have a form in which a Ni plating layer and a Sn plating layer are formed in sequence, or the plating layer may have a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are formed in sequence. In addition, the plating layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0061] Figure 3 is a cross-sectional view showing a cross section of a multilayer electronic component according to a comparative example in the first direction and the third direction, the cross section being obtained by polishing the multilayer electronic component to the center portion in the second direction. This structure represents a multilayer electronic component having an internal electrode of a conventional general structure.

[0062] Specifically, in the case of the multilayer electronic component according to the comparative example, the capacitance forming part Ac' may include first and second internal electrodes 121' and 122' alternately disposed, and the dielectric layer 111' is interposed between the first and second internal electrodes 121' and 122'. In this case, the first and second internal electrodes 121' and 122' are continuously formed in the second direction or the third direction to ensure an area where the internal electrodes overlap.

[0063] In addition, Figure 3 In the conventional case shown, in order to increase the capacitance per unit volume, the stacking degree should be increased by reducing the thickness of the dielectric layer 111' or the internal electrodes 121' and 122', and in order to solve the reliability degradation occurring in the process, a method such as increasing the number of dielectric grains per layer of the dielectric layer 111' is used. However, in ultra-small and high-capacitance multilayer electronic components, there is a limit to reducing the thickness of the dielectric layer 111' or the internal electrodes 121' and 122', and there is also a limit to increasing the number of dielectric grains per layer in the thinned dielectric layer.

[0064] Reference Figure 4 and Figure 5 , the structures of the first and second internal electrode layers 120 a and 120 b of the multilayer electronic component 100 according to the embodiment of the present disclosure can be confirmed.

[0065] Specifically, the first internal electrode layer 120a and the second internal electrode layer 120b each include a first internal electrode 121 connected to the first external electrode 130 and a second internal electrode 122 connected to the second external electrode 140. That is, unlike conventional cases, each internal electrode layer of the multilayer electronic component 100 according to an embodiment of the present disclosure may include internal electrodes connected to different external electrodes.

[0066] Reference Figure 4 and Figure 5 , the first internal electrodes 121 and the second internal electrodes 122 are alternately disposed in a third direction perpendicular to the first direction and the second direction and are spaced apart from each other. In addition, the first internal electrodes 121 of the first internal electrode layer 120a may be alternately disposed with the second internal electrodes 122 of the second internal electrode layer 120b in the first direction, and the second internal electrodes 122 of the first internal electrode layer 120a may be alternately disposed with the first internal electrodes 121 of the second internal electrode layer 120b in the first direction. Figure 3 Compared with the conventional case shown, the density of internal electrodes contributing to the formation of capacitance can be increased, and the capacitance per unit volume of the multilayer electronic component can be increased by increasing the electric field flux (also referred to as "electric flux" or "electric field strength flux") between the internal electrodes of the multilayer electronic component.

[0067] Hereinafter, it will be disclosed based on a schematic diagram of an internal electrode that the capacitance per unit volume of a multilayer electronic component according to an embodiment of the present disclosure is significantly improved compared with a conventional case due to a difference in an internal electrode structure.

[0068] Fig. 7A is a schematic diagram showing an electric field flux between internal electrodes of a multilayer electronic component according to a comparative example (using a (3×n) matrix as an example), and Figure 7Bis a schematic diagram illustrating electric field flux between internal electrodes of a multilayer electronic component according to an example (using a (3×n) matrix as an example).

[0069] It can be seen that the comparative example is a case where the first internal electrode and the second internal electrode are continuously formed in the second direction and the third direction (as in the above-mentioned conventional case), and the example is a case where the first internal electrode and the second internal electrode are formed spaced apart from each other in both the first direction and the third direction (as in the embodiment of the present disclosure). Fig. 7A and Figure 7B The shown E refers to the electric field, and the direction of the arrow indicates the direction of the electric field.

[0070] Specifically, assuming a (3×n) matrix, and when Fig. 7A When the stacking degree of the inner electrodes 121' and 122' corresponds to N (for example, the relationship between N and n is: n=2N+1), the total number of electric field fluxes according to the comparative example (which is proportional to the total number of electric field lines of the corresponding electric field) corresponds to 3N. In addition, when Figure 7B When the stacking degree of the inner electrodes 121 and 122 in corresponds to N, the total number of electric field fluxes according to the example corresponds to 3N+1. That is, in the comparative example and the example, it can be seen that at the same stacking degree, the difference in the number of electric field fluxes according to the inner electrode structure is 1. In the present disclosure, n may be an odd number greater than or equal to 3, and N may be an integer greater than or equal to 1.

[0071] Fig. 8A is a schematic diagram showing an electric field flux between internal electrodes of a multilayer electronic component according to a comparative example (using a (n×3) matrix as an example), and Figure 8B is a schematic diagram illustrating electric field flux between internal electrodes of a multilayer electronic component according to an example (using a (n×3) matrix as an example).

[0072] It can be seen that the comparative example is a case where the first internal electrode and the second internal electrode are continuously formed in the second direction and the third direction (as in the above-mentioned conventional case), and the example is a case where the first internal electrode and the second internal electrode are spaced apart from each other in both the first direction and the third direction (as in the embodiment of the present disclosure). Fig. 8A and Figure 8B The shown E refers to the electric field, and the direction of the arrow indicates the direction of the electric field.

[0073] Specifically, assuming a (n×3) matrix, if Fig. 8A The number of divisions of the inner electrodes 121' and 122' in the embodiment is N, and the total number of electric field fluxes according to the comparative example corresponds to 2N+1. Figure 8BThe number of divisions of the inner electrodes 121 and 122 in the embodiment is n, and the total number of electric field fluxes according to the example corresponds to 3N + 1. That is, in the comparative example and the example, it can be seen that under the same number of divisions, the difference in the number of electric field fluxes according to the inner electrode structure reaches about 50%.

[0074] Summarize Fig. 7A and Figure 7B as well as Fig. 8A and Figure 8B As a result, as in an embodiment of the present disclosure, when the first internal electrodes 121 and the second internal electrodes 122 are alternately arranged to be spaced apart from each other in a third direction perpendicular to the first direction and the second direction, the first internal electrodes 121 of the first internal electrode layer 120a are alternately arranged with the second internal electrodes 122 of the second internal electrode layer 120b in the first direction, and the second internal electrodes 122 of the first internal electrode layer 120a are alternately arranged with the first internal electrodes 121 of the second internal electrode layer 120b in the first direction. It can be seen that the electric field flux can be significantly improved compared with the conventional case, and thus the capacitance per unit volume of the multilayer electronic component 100 can be significantly improved.

[0075] In addition, summary Fig. 7A and Figure 7B as well as Fig. 8A and Figure 8B From the results, it can be seen that, for improving the capacitance per unit volume of the multilayer electronic component 100, the number of divisions of the internal electrodes in the third direction (the width direction of the internal electrodes) (the number of internal electrodes stacked in the third direction) is more important than the stacking degree of the internal electrodes in the first direction (the stacking direction of the internal electrodes). That is, when the stacking degree of the first internal electrode 121 and the second internal electrode 122 in the third direction is greater than the stacking degree of the first internal electrode 121 and the second internal electrode 122 in the first direction, the capacitance per unit volume of the multilayer electronic component can be more advantageously improved.

[0076] Here, the stacking degree of the internal electrodes in the first direction may mean the number of the first internal electrodes 121 and the second internal electrodes 122 stacked in the first direction (for example, if the number is represented by N described above, the number is N+1), and the stacking degree of the internal electrodes in the third direction may mean the number of the first internal electrodes 121 and the second internal electrodes 122 stacked in the third direction. That is, in embodiments, the number of the first internal electrodes 121 and the second internal electrodes 122 stacked in the third direction may be greater than the number of the first internal electrodes 121 and the second internal electrodes 122 stacked in the first direction.

[0077] In addition, refer to Figure 4According to the embodiment, the first and second internal electrodes 121 and 122 may be arranged in a mesh shape in the cross-section of the multilayer electronic component 100 in the first and third directions. Therefore, the capacitance per unit volume of the multilayer electronic component may be increased by increasing the electric field flux between the internal electrodes of the multilayer electronic component.

[0078] The shape of the grid structure and the position where the internal electrodes 121 and 122 are arranged are not particularly limited as long as they meet the embodiments of the present disclosure. As an example, the first internal electrode layer 120a and the second internal electrode layer 120b may include a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122, and the internal electrode most adjacent to one of the plurality of first internal electrodes may have the same form as the second internal electrode 122. Therefore, by increasing the amount of electric field flux formed between the internal electrodes 121 and 122, the capacitance per unit volume of the multilayer electronic component 100 may be significantly increased.

[0079] In addition, as in the embodiments of the present disclosure, there is no particular limitation on the method for forming the following structure: the first internal electrodes 121 and the second internal electrodes 122 are alternately arranged to be spaced apart from each other in a third direction perpendicular to the first direction and the second direction, the first internal electrodes 121 of the first internal electrode layer 120a are alternately arranged with the second internal electrodes 122 of the second internal electrode layer 120b in the first direction, and the second internal electrodes 122 of the first internal electrode layer 120a are alternately arranged with the first internal electrodes 121 of the second internal electrode layer 120b in the first direction. Fig.10 As shown, the conductive pattern 221 for forming the first internal electrode and the conductive pattern 222 for forming the second internal electrode may be formed on the dielectric ceramic green sheet 211, and may be stacked, pressed, and sintered to form the conductive pattern. The conductive pattern 221 for forming the first internal electrode and the conductive pattern 222 for forming the second internal electrode may be formed by printing, but the present disclosure is not limited thereto, for example, the conductive pattern 221 for forming the first internal electrode may be formed by attaching a one-dimensional conductive material continuous in the second direction to the dielectric ceramic green sheet 211, and the conductive pattern 222 for forming the second internal electrode may be formed by attaching a one-dimensional conductive material continuous in the second direction to the dielectric ceramic green sheet 211.

[0080] In addition, the first internal electrode 121 and the second internal electrode 122 may be alternately arranged in a third direction perpendicular to the first direction and the second direction to be spaced apart from each other, the first internal electrode 121 of the first internal electrode layer 120a may be alternately arranged with the second internal electrode 122 of the second internal electrode layer 120b in the first direction, and the second internal electrode 122 of the first internal electrode layer 120a may be alternately arranged with the first internal electrode 121 of the second internal electrode layer 120b in the first direction, which may increase the capacitance per unit volume of the multilayer electronic component 100, but may be difficult to ensure reliability. In order to improve the reliability (such as withstand voltage characteristics) of the internal electrode structure according to an embodiment of the present disclosure, it is necessary to adjust various parameters (such as the relative positions and thicknesses of the dielectric layer 111, the first internal electrode 121, and the second internal electrode 122).

[0081] Fig. 9 yes Figure 4 Magnified view of area P.

[0082] Reference Fig. 9 , a distance in the third direction between the first internal electrode 121 and a second internal electrode most adjacent to the first internal electrode in the third direction is represented as "s". The distance "s" in the third direction between the first internal electrode 121 and the second internal electrode most adjacent to the first internal electrode in the third direction may refer to a size of a line segment in the third direction obtained by connecting one end of the first internal electrode 121 in the third direction and one end of the second internal electrode 122 in the third direction facing the one end of the first internal electrode 121 in the third direction in a cross section in the first direction and the third direction obtained by polishing the multilayer electronic component 100 to a central portion in the second direction, and may be measured using a scanning electron microscope (SEM) or an optical microscope (OM), but the present disclosure is not limited thereto.

[0083] In the cross-sections in the first and third directions obtained by polishing the multilayer electronic component 100 to the central portion in the second direction, the distance "s" may have an average value of values ​​measured at 10 or more layers of inner electrodes in the central portion of the capacitance forming portion, which is adjusted so that 10 or more layers of the first inner electrode and the second inner electrode are respectively provided in the first direction, so that the distance "s" may be further generalized. That is, the distance "s" may be an average distance in the third direction between the first inner electrode 121 and the second inner electrode 122 that is most adjacent to the first inner electrode 121 in the third direction.

[0084] Reference Fig. 9, a distance in the first direction between the first internal electrode 121 and the second internal electrode 122 most adjacent to the first internal electrode 121 in the first direction is represented as “td”. The distance “td” in the first direction between the first internal electrode 121 and the second internal electrode 122 most adjacent to the first internal electrode 121 in the first direction may refer to a size of a line segment in the first direction obtained by connecting one end of the first internal electrode 121 in the first direction and one end of the second internal electrode 122 in the first direction facing the one end of the first internal electrode 121 in the first direction, in a cross section in the first and third directions obtained by polishing the multilayer electronic component 100 to a central portion in the second direction, and may be measured using a scanning electron microscope (SEM) or an optical microscope (OM), but the present disclosure is not limited thereto.

[0085] In the cross-sections in the first and third directions obtained by polishing the multilayer electronic component 100 to the central portion in the second direction, the distance "td" may have an average value of values ​​measured at 10 or more layers of inner electrodes in the central portion of the capacitance forming portion, which is adjusted so that 10 or more layers of the first inner electrode and the second inner electrode are respectively provided in the first direction, so that the distance "td" may be further generalized. That is, the distance "td" may be an average distance in the first direction between the first inner electrode 121 and the second inner electrode 122 most adjacent to the first inner electrode 121 in the first direction.

[0086] Reference Fig. 9, the maximum dimensions of the first inner electrode 121 and the second inner electrode 122 in the first direction are denoted as “te”, and the maximum dimensions of the first inner electrode 121 and the second inner electrode 122 in the third direction are denoted as “we”. According to the specific shapes of the first inner electrode 121 and the second inner electrode 122, the thickness and width of the first inner electrode 121 and the second inner electrode 122 may be different at each position, and therefore, in the present disclosure, the values ​​corresponding to the thickness and width of the first inner electrode 121 and the second inner electrode 122 are respectively set as the maximum dimension “te” of the first inner electrode 121 and the second inner electrode 122 in the first direction and the maximum dimension “we” of the first inner electrode 121 and the second inner electrode 122 in the third direction. Specifically, when describing based on the first internal electrode 121, in the cross-sections in the first and third directions obtained by polishing the multilayer electronic component 100 to the central portion in the second direction, the size of a line segment obtained by connecting the highest point and the lowest point in the first direction for any one of the first internal electrodes included in the capacitance forming portion may be set as the maximum size "te" of the first internal electrode 121 in the first direction, and the size of a line segment obtained by connecting the outermost points in the third direction (the outermost point in the + direction, the outermost point in the - direction) for any one of the first internal electrodes may be set as the maximum size "we" of the first internal electrode 121 in the third direction. This measurement may be similarly applied to the second internal electrode 122, and may be measured using a scanning electron microscope (SEM) or an optical microscope (OM), but the present disclosure is not limited thereto.

[0087] In the cross-sections in the first and third directions obtained by polishing the multilayer electronic component 100 to the central portion in the second direction, the maximum dimensions "te" and "we" may have an average value of values ​​measured at 10 or more layers of inner electrodes in the central portion of the capacitance forming portion, and the central portion of the capacitance forming portion is adjusted so that 10 or more layers of the first inner electrode and the second inner electrode are respectively provided in the first direction, so that the maximum dimensions "te" and "we" may be further generalized. That is, "te" may refer to the average value of the maximum dimensions of the first inner electrode and the second inner electrode in the first direction, and "we" may refer to the average value of the maximum dimensions of the first inner electrode and the second inner electrode in the third direction.

[0088] In an embodiment, s≥td may be satisfied. When the distance "s" between the first inner electrode and the second inner electrode that is most adjacent to the first inner electrode in the third direction is less than the distance "td" between the first inner electrode and the second inner electrode that is most adjacent to the first inner electrode in the first direction, when a high voltage is applied to the multilayer electronic component, there may be a risk that a failure may occur between the first inner electrode and the second inner electrode that is most adjacent to the first inner electrode in the third direction. Therefore, in an embodiment, by adjusting the distance between the inner electrodes adjacent in the third direction to be equal to or greater than the distance between the inner electrodes adjacent in the first direction, the capacitance per unit volume of the multilayer electronic component 100 may be increased, and the withstand voltage characteristics may be improved. On the other hand, when the dielectric layer is formed of a thin film, for example, when "s" or "td" is 0.41 μm or less, when a high voltage is applied to the multilayer electronic component, the reliability problem may become more serious due to the failure of the distance "s" between the first inner electrode and the second inner electrode that is most adjacent to the first inner electrode in the third direction. However, in the embodiment, by satisfying s≥td, since the withstand voltage characteristic in the third direction is improved, which plays a more important role in forming capacitance, even if "s" or "td" is adjusted to 0.41 μm or less, the withstand voltage characteristic of the multilayer electronic component 100 can be ensured. That is, when "s" or "td" is 0.41 μm or less, the reliability improvement effect according to the embodiment can be more significant.

[0089] In an embodiment, te≤td may be satisfied. When the maximum dimension "te" of the first internal electrode 121 and the second internal electrode 122 is greater than the distance "td" between the first internal electrode and the second internal electrode that is most adjacent to the first internal electrode in the first direction, a fringing effect may easily occur in the internal electrode. The fringing effect may cause interference with the electric field generated between the first internal electrode 121 and the second internal electrode 122 in the capacitor forming portion, thereby reducing the capacitance per unit volume of the multilayer electronic component 100. Therefore, in an embodiment, by adjusting the maximum dimension "te" of the first internal electrode 121 and the second internal electrode 122 to be equal to or less than the distance "td" in the first direction between the first internal electrode and the second internal electrode that is most adjacent to the first internal electrode in the first direction, the capacitance per unit volume of the multilayer electronic component 100 may be further increased.

[0090] In the cross-sections in the first and third directions, the shapes of the internal electrodes 121 and 122 are not particularly limited, and the internal electrodes 121 and 122 may have shapes such as a polygon (eg, a regular polygon), a circle, or an ellipse.

[0091] In an embodiment, 0.5≤te / we≤1.5 may be satisfied, and more preferably, 0.9≤te / we≤1.1 may be satisfied. Therefore, by controlling the shapes of the first and second internal electrodes 121 and 122 to effectively dispose the first and second internal electrodes 121 and 122 in the capacitance forming portion, the capacitance per unit volume of the multilayer electronic component 100 may be further improved. In this case, when 0.9≤te / we≤1.1 is satisfied, it can be seen that in the cross-section of the multilayer electronic component 100 in the first and third directions, the first and second internal electrodes 121 and 122 may substantially have a square shape.

[0092] in addition, Figure 5 , a total of 12 inner electrode layers are shown, but the embodiments of the present disclosure are not limited thereto. Figure 6 As shown, the inner electrodes may be arranged in 50 layers or more in the first direction, and the inner electrodes may be arranged in 50 layers or more in the third direction. Therefore, the electric field flux formed between the first inner electrode 121 and the second inner electrode 122 may be significantly improved. Therefore, in an embodiment, when the maximum dimension of the body 110 in the first direction is T, 50(te+td)≤T may be satisfied, and therefore, the first inner electrode layer 120a and the second inner electrode layer 120b may each be set to 25 layers or more in the first direction. From a similar perspective, when the maximum dimension of the body 110 in the third direction is W, 50(s+we)≤W may be satisfied, and therefore, in the same inner electrode layer of the first inner electrode layer 120a and the second inner electrode layer 120b, the first inner electrode 121 and the second inner electrode 122 may each be set to 25 layers or more in the third direction.

[0093] According to an embodiment of the present disclosure, s≥td may be satisfied, where s is the distance in the third direction between one of the first inner electrodes and the second inner electrode that is most adjacent to the one first inner electrode in the third direction, and td is the distance in the first direction between the one first inner electrode and the second inner electrode that is most adjacent to the one first inner electrode in the first direction. 0.5≤te / we≤1.5 may be satisfied, where te is the maximum size in the first direction of one of the first inner electrodes and the second inner electrodes that is most adjacent to the one first inner electrode (or the one second inner electrode) in the first direction, and we is the maximum size in the third direction of one of the first inner electrodes and the second inner electrodes that is most adjacent to the one first inner electrode (or the one second inner electrode) in the third direction. te≤td may be satisfied, where te is the maximum size in the first direction of one of the first inner electrodes and the second inner electrodes that is most adjacent to the one first inner electrode (or the one second inner electrode) in the first direction. 50(te+td)≤T may be satisfied, where te is the maximum dimension of one of the first and second internal electrodes that is most adjacent to the one first internal electrode (or one second internal electrode) in the first direction, and T is the maximum dimension of the body in the first direction. 50(s+we)≤W may be satisfied, where we is the maximum dimension of one of the first and second internal electrodes that is most adjacent to the one first internal electrode (or one second internal electrode) in the third direction, and W is the maximum dimension of the body in the third direction.

[0094] The size of the multilayer electronic component 100 may not need to be particularly limited.

[0095] However, in order to simultaneously achieve miniaturization and high capacitance, increasing the number of stacked layers by reducing the thickness of dielectric layers and internal electrodes may make it difficult to ensure reliability in a multilayer electronic component 100 having a size of 0201 (length×width of 0.2 mm×0.1 mm) or less.

[0096] Therefore, considering manufacturing errors and the size of the external electrodes, when the multilayer electronic component 100 has a length of 0.22 mm or less and a width of 0.11 mm or less, the effect of improving reliability according to the embodiment may be more significant.

[0097] Here, the length of the multilayer electronic component 100 may refer to a maximum dimension of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to a maximum dimension of the multilayer electronic component 100 in the third direction.

[0098] As described above, according to the aforementioned embodiments, by increasing the electric field flux, the capacitance per unit volume can be increased.

[0099] According to the above-described embodiments, in the inner electrode structure for improving electric field flux, capacitance per unit volume can be improved without deteriorating reliability.

[0100] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: A main body, comprising a dielectric layer, a first internal electrode layer and a second internal electrode layer, wherein the first internal electrode layer and the second internal electrode layer are alternately arranged in a first direction, and the dielectric layer is interposed between the first internal electrode layer and the second internal electrode layer; a first external electrode disposed on one of two surfaces of the body that are opposite to each other in a second direction perpendicular to the first direction; as well as a second external electrode disposed on the other of the two surfaces of the body that are opposite to each other in the second direction, wherein the first inner electrode layer and the second inner electrode layer each include a first inner electrode connected to the first outer electrode and a second inner electrode connected to the second outer electrode, wherein the first internal electrodes and the second internal electrodes are alternately arranged to be spaced apart from each other in a third direction perpendicular to the first direction and the second direction, the first internal electrodes of the first internal electrode layer are alternately arranged with the second internal electrodes of the second internal electrode layer in the first direction, and the second internal electrodes of the first internal electrode layer are alternately arranged with the first internal electrodes of the second internal electrode layer in the first direction, Wherein, s≥td is satisfied, wherein s is the distance between one of the first inner electrodes and the second inner electrode most adjacent to the one first inner electrode in the third direction, and td is the distance between the one first inner electrode and the second inner electrode most adjacent to the one first inner electrode in the first direction in the first direction.

2. The multilayer electronic component according to claim 1, wherein 0.5≤te / we≤1.5 is satisfied, wherein te is the maximum dimension in the first direction of one of the first internal electrodes and the second internal electrodes that is most adjacent to the one first internal electrode in the first direction, and we is the maximum dimension in the third direction of one of the first internal electrodes and the second internal electrodes that is most adjacent to the one first internal electrode in the third direction.

3. The multilayer electronic component according to claim 1, wherein: te≤td is satisfied, where te is a maximum dimension in the first direction of one of the first internal electrodes and the second internal electrodes that is most adjacent to the one first internal electrode in the first direction.

4. The multilayer electronic component according to claim 1, wherein: 50(te+td)≤T is satisfied, where te is a maximum dimension in the first direction of an inner electrode of the first inner electrode and the second inner electrode that is most adjacent to the one first inner electrode in the first direction, and T is a maximum dimension of the body in the first direction.

5. The multilayer electronic component according to claim 1, wherein 50(s+we)≤W is satisfied, wherein we is the maximum dimension of one of the first internal electrodes and the second internal electrodes that is most adjacent to the one first internal electrode in the third direction, and W is the maximum dimension of the body in the third direction.

6. The multilayer electronic component according to claim 1, wherein: Each of the first internal electrode layers and the second internal electrode layers is provided in 25 layers or more in the first direction.

7. The multilayer electronic component according to claim 1, wherein: In the same inner electrode layer of the first inner electrode layer and the second inner electrode layer, each of the first inner electrode and the second inner electrode is provided in 25 layers or more in the third direction.

8. The multilayer electronic component according to claim 1, wherein The number of the first and second internal electrodes stacked in the third direction is greater than the number of the first and second internal electrodes stacked in the first direction.

9. The multilayer electronic component according to claim 1, wherein: In cross sections of the multilayer electronic component in the first direction and the third direction, the first internal electrodes and the second internal electrodes are arranged in a mesh shape.

10. The multilayer electronic component according to claim 1, wherein In cross sections of the multilayer electronic component in the first and third directions, the first and second internal electrodes have a square shape.

11. The multilayer electronic component according to claim 1, wherein The first inner electrode is spaced apart from the second outer electrode, and the second inner electrode is spaced apart from the first outer electrode.

12. The multilayer electronic component according to claim 11, wherein The dielectric layer is disposed in a space where the first internal electrode is spaced apart from the second external electrode and in a space where the second internal electrode is spaced apart from the first external electrode.

13. The multilayer electronic component according to claim 1, wherein The first internal electrode layer and the second internal electrode layer each include a plurality of first internal electrodes and a plurality of second internal electrodes, and The inner electrode most adjacent to the one first inner electrode is the second inner electrode.

14. The multilayer electronic component according to claim 1, wherein The dielectric layer includes Ba and Ti.

15. The multilayer electronic component according to claim 1, wherein The dielectric layer includes Ca, Sr, Zr and Ti.

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