Chip plastic packaging device and method for integrated circuit production

Abstract

The present invention belongs to the field of chip processing technology, specifically a chip plastic sealing device and method for integrated circuit production; it includes a processing table, on which a force-applying and continuous pressure mechanism for plastic sealing of the chip is provided; the force-applying and continuous pressure mechanism includes a fixed mold, the bottom of which is connected to the top of the processing table by bolts; the processing table is also equipped with a U-shaped base, and the opening of the U-shaped base faces the top of the processing table; a telescopic cylinder is installed on the U-shaped base by bolts, and the output end of the telescopic cylinder faces the top of the processing table and is also equipped with an H-shaped square plate; impurities or dust adhering to the fixed mold and the movable mold are cleaned by a gas-generating and cavity-clearing unit, and the cleaning process does not require manual operation by the staff, while avoiding the problem that the impurities inside the fixed mold and the movable mold are not completely cleaned due to negligence in the process, resulting in incomplete chip sealing, bubble generation, etc., thereby improving the plastic sealing effect of the device and further reducing the work intensity of the staff.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and in particular relates to a chip plastic packaging device and method for integrated circuit production. Background Art

[0002] As the core carrier of integrated circuits, chips play a vital role. In order to protect chips from external impact, scratches and wear, prevent erosion by dust, moisture and chemicals, ensure electrical insulation, and facilitate installation and use, chips usually need to be plastic-encapsulated. Plastic encapsulation provides multi-faceted protection for chips and ensures their stable and reliable operation in different environments.

[0003] After the chip is plastic-sealed, the inside of the mold cavity of the mold used for plastic sealing needs to be cleaned to prevent residual plastic sealing material residues and other impurities generated by high temperature in the mold cavity from affecting the subsequent chip plastic sealing quality. Existing chip plastic sealing devices mostly rely on staff to manually operate an air blower to clean the residual residues in the mold cavity. This not only increases the workload of the staff, but also any negligence in the cleaning process will cause incomplete chip plastic sealing, bubbles, and other problems, further reducing the plastic sealing effect and efficiency of the device, making the device more limited in use. Summary of the Invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a chip plastic packaging device and method for integrated circuit production, which effectively solves the problems in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a chip encapsulation device for integrated circuit production, comprising a processing table, wherein the processing table is provided with a force-applying and continuous-pressing mechanism for plastic-encapsulating the chip; the force-applying and continuous-pressing mechanism comprises a fixed mold, the bottom of which is connected to the top of the processing table by bolts; the processing table is also provided with a U-shaped base, and the opening of the U-shaped base faces the top of the processing table; a telescopic cylinder is mounted on the U-shaped base by bolts, the output end of the telescopic cylinder faces the top of the processing table and an H-shaped square plate is also installed, and the opposite sides of the U-shaped base are located in the hollow area of ​​the H-shaped square plate; a guide T-plate is symmetrically installed on both sides of the H-shaped square plate near the opposite sides of the U-shaped base, and an air-generating and cavity-clearing unit is provided on the guide T-plate, which is used to clean impurities adhered to the mold cavity in the fixed mold; L-shaped racks are also installed on the opposite sides of the two guide T-plates, and the end points of the L-shaped racks face the processing table.

[0006] Preferably, a guide cylinder is symmetrically installed on the side of the guide T-plate away from the processing table, and the end of the guide cylinder away from the fixed mold passes through the top of the U-shaped base, and the guide cylinder and the top of the U-shaped base are slidably fitted; the end of the guide cylinder away from the processing table is connected to a guide limit plate; two groups of limit sliding columns are symmetrically installed on the side of the H-shaped square plate away from the top of the U-shaped base, and the number of limit sliding columns in a group is two, and the two groups of limit sliding columns are relatively arranged on both sides of the U-shaped base.

[0007] Preferably, both groups of the limit slides are connected through a pressure square plate, and the pressure square plate slides in cooperation with the limit slide; the end of the limit slide away from the H-shaped square plate is connected to the limit circular plate; the top of the processing table is also penetrated by a limit circular groove, which is located on the moving path of the limit circular plate and the two have the same size; a limit spring is sleeved on the limit slide, one end of the limit spring is fixedly connected to the H-shaped square plate, and the other end is fixedly connected to the top of the pressure square plate; the bottom of the pressure square plate is also connected to a movable mold by bolts, and the working surfaces of the movable mold and the fixed mold are arranged relative to each other.

[0008] Preferably, the gas-making and cavity-clearing unit includes an auxiliary slot, which is arranged through one of the two opposite sides of the U-shaped base; a fixed pulley is provided for rotation in the auxiliary slot; a winding roller is provided at the outer wall of the U-shaped base close to the auxiliary slot, and an auxiliary rotating shaft is installed on both sides of the winding roller, and an auxiliary substrate is installed on the auxiliary rotating shaft, and the auxiliary substrate is arranged on the U-shaped base; a clockwork spring is installed on the auxiliary rotating shaft, and the end point of the clockwork spring is arranged on the auxiliary substrate.

[0009] Preferably, a locking square seat is fixedly installed on one of the guide T-plates near the auxiliary slot, and a cable is connected to the locking square seat, and the end of the cable away from the locking square seat passes around the fixed pulley and is wound around the winding roller; the end of the auxiliary shaft away from the winding roller is connected to a rotating turntable, and displacement columns are installed on the opposite back surfaces of the two rotating turntables, and a displacement cross block is slidably connected to the displacement column, and two displacement square columns are symmetrically connected to the side of the displacement cross block, and the two displacement square columns are slidably connected to a displacement base plate, and the displacement base plate is arranged on the U-shaped base.

[0010] Preferably, a blocking and encryption component is also provided on the processing table; the blocking and encryption component includes two driving gears, and the two driving gears are symmetrical on both sides of the top of the processing table; the driving gears are located on the moving path of the L-shaped rack, and the two are meshed with each other; the opposite back surfaces of the two driving gears are meshed and connected with driving racks, and the opposite back surfaces of the two driving racks are symmetrically connected with two driving square plates, and the two driving square plates are commonly connected to a driving square column, and a driving substrate is slidably connected to the driving square column, and the driving substrate is arranged on a U-shaped base; a driving spring is sleeved on the driving square column, one end of the driving spring is connected to the driving square plate, and the other end is connected to the driving substrate.

[0011] Preferably, the bottom ends of the two driving racks are commonly connected to a U-shaped square rod, and displacement L plates are installed on both sides of the U-shaped square rod. The end points of the displacement L plates pass through the processing table and are connected to a linkage base plate, and the displacement L plates and the processing table slide together; the two linkage base plates are commonly connected to a rectangular frame, and a sealing rubber gasket is provided on the inner wall of the rectangular frame, and the sealing rubber gasket has the same size as the fixed mold and the movable mold; the connection between the fixed mold and the movable mold is located on the moving path of the sealing rubber gasket; the driving gear is arranged on the U-shaped base; and the rectangular frame is sleeved on the fixed mold.

[0012] Preferably, an extended square rod is installed at the bottom of the displacement cross block, and a displacement slider is installed on the end point of the extended square rod; the top of the processing table is symmetrically provided with displacement slides with the U-shaped base as the symmetry axis, and the displacement slides are slidably matched with the displacement slider; the opposite back surfaces of the two displacement sliders are installed with rotating shafts, and rotating gears are installed on the rotating shafts, and the rotating gears are meshed and connected with a retaining rack, and the retaining rack is arranged on the top of the processing table; a large pulley is installed at the end of the rotating shaft away from the displacement slider, and a transmission belt is connected to the large pulley, and a small pulley is connected to the transmission belt, and the transmission belt is slidably matched with the small pulley and the large pulley; a transmission shaft is installed on the small pulley, and the transmission shaft passes through the displacement slider and is connected to a number of fan blades.

[0013] Preferably, one of the retaining racks is arranged on the top wall of the rotating gear, and the other retaining rack is arranged on the bottom wall of the rotating gear; the notches of the two retaining racks are both facing the rotating gear; two groups of L-shaped connecting blocks are symmetrically installed on both sides of the top of the processing table, and the number of L-shaped connecting blocks in a group is two; the opposite surfaces of the two displacement sliders are provided with storage boxes, and the opening of the storage box faces the fixed mold; the end of the transmission shaft away from the small pulley and a number of fan blades are all located in the storage box; a filter is provided in the storage box, and the filter is located in front of the fan blades; the two L-shaped connecting blocks are both facing the storage box; a pressure round wheel is installed on the L-shaped connecting block, and the pressure round wheel is located on the moving path of the sensor provided on the side wall of the storage box.

[0014] The present invention also provides a chip plastic packaging method for integrated circuit production, comprising the following steps:

[0015] S1. Place the object to be plastic-sealed in the movable mold and the fixed mold and start the telescopic cylinder so that its output end drives the H-shaped square plate to move;

[0016] S2, the H-shaped square plate drives the pressure square plate to move under the action of the limit slide and the limit spring, so that the movable mold on it moves toward the fixed mold;

[0017] S3, when the movable mold contacts the fixed mold after continuous movement, the fit between the two forms a closed cavity;

[0018] S4. The material required for plastic sealing is squeezed into the closed cavity, and a hard packaging shell is formed after solidification, thereby completing the plastic sealing operation of the chip.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] (1) The large pulley drives the small pulley to rotate through the transmission belt. Since the size of the large pulley as the power source is larger than that of the small pulley, the speed of the small pulley is higher than that of the large pulley, so that the small pulley rotates quickly, and drives several fan blades to rotate quickly through the transmission shaft, so that it rotates quickly in the storage box, so that wind force is generated at the opening of the storage box, and the wind force acts on the fixed mold. It is worth mentioning that at this time, the fixed mold and the movable mold are still on the way to closing the mold, so that the above-mentioned wind force can clean the impurities or dust adhering to the fixed mold and the movable mold, so that the cleaning process does not require manual work by the staff, and avoids negligence in the process that causes the impurities inside the fixed mold and the movable mold to be not completely cleaned, resulting in incomplete chips and bubbles during plastic sealing. This improves the plastic sealing effect of the device, further reduces the work intensity of the staff, and improves the plastic sealing efficiency of the device, further reducing the limitations of the device during use;

[0021] (2) The two driving racks move upward synchronously, thereby jointly driving the U-shaped square rod to move upward, so that the two displacement L plates on both sides of the rod move upward, thereby driving the rectangular frame to move upward, so that the fixed mold moves to the upper limit. At this time, the fixed mold has been fitted with the movable mold, so that the sealing gasket on the inner wall of the rectangular frame moves to the connection between the fixed mold and the movable mold and fits, thereby further limiting the connection between the fixed mold and the movable mold, avoiding the gap between the fixed mold and the movable mold when the device is plastic-sealing the chip, resulting in burrs on the plastic-sealed shell, and at the same time avoiding the leakage of plastic-sealing material causing defects in the package appearance, improving the quality of chip plastic-sealing, and further reducing the limitations of the device during use; at the same time, when the device completes the chip plastic-sealing, the plastic-sealing material and burrs leaked from the edges of the fixed mold and the movable mold can be cleaned by resetting the rectangular frame, thereby improving the use effect of the device;

[0022] (3) The opening of the storage box at one displacement slider generates a blowing force, which can blow away the impurities adhered to the fixed mold and the movable mold from the fixed mold and the movable mold, and the opening of the storage box at the other displacement slider generates a suction force, which can suck the impurities blown away by the storage box on the opposite side into the storage box, so as to collect these impurities, thereby avoiding the impurities being blown everywhere and making it difficult to clean, affecting the work intensity of the staff, avoiding the staff from cleaning while ensuring the cleanliness of the working environment of the device; on the contrary, when the two displacement sliders are reset and moved synchronously, the wind forces presented by the openings of the two storage boxes are also set in opposite directions, so as to continuously clean the impurities adhered to the fixed mold and the movable mold, thereby improving the use effect of the device;

[0023] (4) Start the telescopic cylinder so that its output end drives the H-shaped square plate to move, so that the H-shaped square plate drives the pressure square plate to move under the action of the limit slide and the limit spring, so that the movable mold on it moves toward the fixed mold, so that the two fit together to complete the mold closing operation, and a closed cavity is formed between the two. This cavity provides a spatial basis for chip plastic sealing, and the preheated liquid plastic sealing material is injected into this closed cavity under a certain pressure through the gate. The plastic sealing material will flow in the cavity and fill the space around the chip and the lead frame. After solidification, a hard packaging shell is formed, so that the chip plastic sealing operation can be completed; It is worth mentioning that when the H-shaped square plate moves with the movable mold, the guide T-plate on the H-shaped square plate moves relative to the top limit of the U-shaped base through the guide cylinder, limiting the movement of the movable mold, avoiding the movable mold from shaking and other phenomena during movement, which leads to dislocation, improving the stability of the movable mold during movement, and improving the accuracy of the docking of the movable mold with the fixed mold when closing the mold, thereby improving the plastic sealing effect of the device on the chip;

[0024] (5) After the fixed mold and the movable mold are fitted, the H-shaped square plate continues to move, so that the two storage boxes continue to operate, and the harmful gases generated by the device during the chip plastic sealing process are collected and filtered through the filter for discharge, so as to avoid the device generating a large amount of harmful gases when plastic sealing the chip and accumulating around to endanger the physical and mental health of the operator, and at the same time improve the environmental performance of the device during use; at the same time, when the device is completed after plastic sealing, the H-shaped square plate is reset and moved, so that the two storage boxes continue to operate on both sides of the fixed mold and the movable mold, which can not only purify the harmful gases and heat generated during demoulding after plastic sealing, but also reduce the temperature of the chip after plastic sealing, speed up the cooling speed of the package shell, and improve its solidification molding speed, thereby improving the plastic sealing efficiency and effect of the device and further reducing the limitations of the device during use;

[0025] (6) Continue to operate the telescopic cylinder to make the H-shaped square plate continue to move. Since the movable mold on the pressure square plate can no longer move, the H-shaped square plate is moved to the upper limit of several limit slides, so that the limit spring is in a buffering state, thereby strengthening the connection strength between the movable mold and the fixed mold, avoiding insufficient contact strength between the two resulting in a gap in the connection. The existence of a gap when the two are connected will cause the plastic sealing material to flow out, causing the device to fail in the plastic sealing operation of the chip. The continuous movement of the H-shaped square plate is used to continuously increase the connection strength between the movable mold and the fixed mold to avoid the occurrence of the above phenomenon, reducing the limitations of the device during use, and making the device more effective in the chip sealing. The sealing performance of the sheet during plastic sealing is guaranteed, which improves the use effect of the device. At the same time, when the H-shaped square plate is continuously moving, the limit sliding column on the H-shaped square plate is continuously moved within the upper limit of the pressure square plate, so that the limit spring is continuously in a buffer state. While the movable mold continuously applies pressure to the fixed mold, the limit sliding column gradually moves into the limit circular groove, thereby further limiting the movement of the H-shaped square plate, avoiding the phenomenon of misalignment of the H-shaped square plate during movement, which causes uneven pressure on the movable mold and gaps elsewhere. This further improves the plastic sealing effect of the device and the stability of the H-shaped square plate and the movable mold during movement.

[0026] (7) When the displacement slider moves to the end quickly, the rotating gear and the retaining rack are no longer engaged, and are in a buffer period, and the sensor on the side wall of the storage box contacts the pressure wheel, indicating that the storage box is moving to the end quickly, so that the valve (not shown in the figure) at the opening on the bottom surface of the storage box that generates suction is opened. Since there is no suction in the storage box at this time, the impurities absorbed by the storage box fall into the opening on the bottom surface of the storage box, so that these impurities can be collected. At the same time, the valve setting is closed to avoid impurities flying around during the conversion between suction and blowing. When the storage box at this location is reset and moved, the rotating gear resumes engagement with the retaining rack, so that the storage box that generates suction is converted into blowing. This reciprocating process can continuously clean the fixed mold and the movable mold, reducing the limitations of the device during use, thereby improving the plastic sealing effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0028] In the attached figure:

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 Schematic diagram of the movable mold structure of the present invention;

[0031] Figure 3This is a schematic diagram of the rectangular frame structure of the present invention;

[0032] Figure 4 This is a schematic diagram of the retaining rack structure of the present invention;

[0033] Figure 5 This is a schematic diagram of the H-shaped square plate structure of the present invention;

[0034] Figure 6 Schematic diagram of the displacement column structure of the present invention;

[0035] Figure 7 It is a cross-sectional view of the material storage box of the present invention;

[0036] Figure 8 This is a schematic diagram of the U-shaped base structure of the present invention;

[0037] Figure 9 This is a schematic diagram of the displacement cross block structure of the present invention;

[0038] In the figure: 1. Processing table; 2. Fixed die; 3. U-shaped base; 4. Telescopic cylinder; 5. H-shaped square plate; 6. Guide T-plate; 7. L-shaped rack; 8. Guide cylinder; 9. Guide limit plate; 10. Limiting slide; 11. Pressure square plate; 12. Limiting circular plate; 13. Limiting circular groove; 14. Limiting spring; 15. Moving die; 16. Auxiliary notch; 17. Fixed pulley; 18. Winding roller; 19. Auxiliary rotating shaft; 20. Auxiliary base plate; 21. Spring; 22. Locking square seat; 23. Cable; 24. Rotating turntable; 25. Displacement column; 26. Displacement cross block; 27. Displacement square column; 28. Displacement base plate; 29. ​​Driving gear; 30. Driving rack; 31. Driving square plate; 32. Driving square column; 33. Driving base plate; 34. Driving spring; 35. U-shaped square rod; 36. Displacement L-plate; 37. Linkage base plate; 38. Rectangular frame; 39. Sealing gasket; 40. Extended square rod; 41. Displacement slider; 42. Displacement chute; 43. Rotating shaft; 44. Rotating gear; 45. Retaining rack; 46. Large pulley; 47. Transmission belt; 48. Small pulley; 49. Transmission shaft; 50. Fan blade; 51. L-shaped connecting block; 52. Storage box; 53. Pressure wheel. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0040] Example, by Figures 1 to 9The present invention includes a processing table 1, on which a force-applying and continuous-pressing mechanism for plastic-sealing the chip is provided; the force-applying and continuous-pressing mechanism includes a fixed mold 2, the bottom of which is connected to the top of the processing table 1 by bolts; the processing table 1 is also equipped with a U-shaped base 3, the opening of the U-shaped base 3 is facing the top of the processing table 1; a telescopic cylinder 4 is installed on the U-shaped base 3 by bolts, the output end of the telescopic cylinder 4 is facing the top of the processing table 1 and is also equipped with an H-shaped square plate 5, and the opposite side of the U-shaped base 3 is connected to the U-shaped base 3. In the hollow area of ​​the H-shaped square plate 5; a guide T-plate 6 is symmetrically installed on both sides of the H-shaped square plate 5 on the opposite side of the U-shaped base 3, and an air-making and cavity-clearing unit is provided on the guide T-plate 6, which is used to clean the impurities adhering to the mold cavity in the fixed mold 2; L-shaped racks 7 are also installed on the opposite sides of the two guide T-plates 6, and the end points of the L-shaped racks 7 face the processing table 1; a guide cylinder 8 is symmetrically installed on the side of the guide T-plate 6 away from the processing table 1, and the end of the guide cylinder 8 away from the fixed mold 2 passes through the U-shaped base At the top of the seat 3, the guide cylinder 8 and the top of the U-shaped base 3 are slidably matched; the guide cylinder 8 is connected to a guide limit plate 9 at one end away from the processing table 1; two groups of limit slides 10 are symmetrically installed on one side of the H-shaped square plate 5 away from the top of the U-shaped base 3, and the number of a group of limit slides 10 is two, and the two groups of limit slides 10 are relatively arranged on both sides of the U-shaped base 3; the two groups of limit slides 10 are connected through a pressure square plate 11, and the pressure square plate 11 slides with the limit slide 10; the limit slide 1 0 is connected to a limit circular plate 12 at one end away from the H-shaped square plate 5; a limit circular groove 13 is also provided on the top of the processing table 1, and the limit circular groove 13 is located on the moving path of the limit circular plate 12 and the two are of the same size; a limit spring 14 is sleeved on the limit sliding column 10, one end of the limit spring 14 is fixedly connected to the H-shaped square plate 5, and the other end is fixedly connected to the top of the pressure square plate 11; the bottom of the pressure square plate 11 is also connected to a movable mold 15 by bolts, and the movable mold 15 and the working surface of the fixed mold 2 are arranged opposite each other;

[0041] The required plastic encapsulation materials and chips are placed in the movable mold 15 and the fixed mold 2. By starting the telescopic cylinder 4, its output end drives the H-shaped square plate 5 to move, so that the H-shaped square plate 5 drives the pressure square plate 11 to move under the action of the limit slide 10 and the limit spring 14, so that the movable mold 15 on it moves toward the direction of the fixed mold 2, so that the two are fitted to complete the mold closing operation. A closed mold cavity is formed between the two. This cavity provides a spatial basis for chip plastic encapsulation, and the preheated liquid plastic encapsulation material is injected into this closed mold cavity under a certain pressure through the gate. The plastic encapsulation material will flow in the cavity and fill the space around the chip and lead frame. After solidification, The H-shaped square plate 5 is used to form a hard packaging shell, so as to complete the plastic sealing operation of the chip. It is worth mentioning that when the H-shaped square plate 5 moves with the movable mold 15, the guide T-plate 6 on the H-shaped square plate 5 is limited relative to the top of the U-shaped base 3 through the guide cylinder 8, which limits the movement of the movable mold 15, avoids the movable mold 15 from shaking during movement and causing dislocation, improves the stability of the movable mold 15 during movement, and improves the accuracy of the docking of the movable mold 15 with the fixed mold 2 when closing the mold, thereby improving the plastic sealing effect of the device on the chip. It is worth mentioning that after the movable mold 15 has docked with the fixed mold 2, the telescopic cylinder 4 is continued to operate to make the H-shaped square plate 5 continue to move. Since the movable mold 15 on the pressure square plate 11 can no longer move, the H-shaped square plate 5 is moved within the upper limit of the plurality of limit slides 10, so that the limit spring 14 is in a buffering state, thereby strengthening the connection strength of the movable mold 15 to the fixed mold 2, avoiding insufficient contact strength between the two resulting in a gap in the connection. The presence of a gap when the two are connected will cause the plastic sealing material to flow out, causing the device to fail in the plastic sealing operation of the chip. The continuous movement of the H-shaped square plate 5 is used to continuously increase the connection strength between the movable mold 15 and the fixed mold 2 to avoid the occurrence of the above phenomenon, reduce the limitations of the device during use, and ensure the sealing of the device when plastic sealing the chip. , which improves the use effect of the device; at the same time, when the H-shaped square plate 5 continues to move, the limiting slide post 10 on the H-shaped square plate 5 continues to move within the limit position of the pressure square plate 11, so that the limiting spring 14 is continuously in a buffering state, and while the movable mold 15 continues to apply pressure to the fixed mold 2, the limiting slide post 10 gradually moves into the limiting circular groove 13, thereby further limiting the movement of the H-shaped square plate 5, avoiding the phenomenon of misalignment of the H-shaped square plate 5 during movement, resulting in uneven pressure exerted on the movable mold 15 and gaps elsewhere, further improving the plastic sealing effect of the device and the stability of the H-shaped square plate 5 and the movable mold 15 during movement.

[0042] The gas-making and cavity-clearing unit of this embodiment includes an auxiliary slot 16, which is arranged on one of the two opposite sides of the U-shaped base 3; a fixed pulley 17 is rotatably provided in the auxiliary slot 16; a winding roller 18 is provided on the outer wall of the U-shaped base 3 near the auxiliary slot 16, and an auxiliary rotating shaft 19 is installed on both sides of the winding roller 18, and an auxiliary substrate 20 is installed on the auxiliary rotating shaft 19, and the auxiliary substrate 20 is arranged on the U-shaped base 3; a clockwork spring 21 is installed on the auxiliary rotating shaft 19, and the end point of the clockwork spring 21 is arranged on the auxiliary substrate 20; a locking square seat 22 is also fixedly installed on one of the guide T-plates 6 near the auxiliary slot 16, and a cable 23 is connected to the locking square seat 22, and the cable 23 is away from One end of the locking square seat 22 is wound around the fixed pulley 17 and connected to the winding roller 18; the end of the auxiliary rotating shaft 19 away from the winding roller 18 is connected to the rotating turntable 24, and the two rotating turntables 24 are respectively installed with displacement columns 25 on the opposite back surfaces, and the displacement columns 25 are slidably connected with the displacement cross block 26, and two displacement square columns 27 are symmetrically connected to the side of the displacement cross block 26, and the two displacement square columns 27 are slidably connected to the displacement base plate 28, which is set on the U-shaped base 3; the bottom of the displacement cross block 26 is installed with an extended square rod 40, and the end point of the extended square rod 40 is installed with a displacement slider 41; the top of the processing table 1 is symmetrically provided with a displacement slide 42 with the U-shaped base 3 as the symmetry axis, and the displacement slide 42 is symmetrically connected to the displacement slider 4 1 sliding fit; the opposite back surfaces of the two displacement sliders 41 are both equipped with a rotating shaft 43, and a rotating gear 44 is installed on the rotating shaft 43, and the rotating gear 44 is meshed with a retaining rack 45, and the retaining rack 45 is arranged on the top of the processing table 1; the end of the rotating shaft 43 away from the displacement slider 41 is equipped with a large pulley 46, and the large pulley 46 is connected to a transmission belt 47, and the transmission belt 47 is connected to a small pulley 48, and the transmission belt 47 slides with the small pulley 48 and the large pulley 46; the small pulley 48 is equipped with a transmission shaft 49, and the transmission shaft 49 passes through the displacement slider 41 and is connected to a number of fan blades 50; one of the retaining racks 45 is arranged on the top wall of the rotating gear 44, and the other retaining rack 45 is arranged on the top wall of the rotating gear 44. Placed on the bottom wall of the rotating gear 44; the notches of the two retaining racks 45 are both facing the rotating gear 44; two groups of L-shaped coupling blocks 51 are symmetrically installed on both sides of the top of the processing table 1, and the number of each group of L-shaped coupling blocks 51 is two; the opposite surfaces of the two displacement sliders 41 are provided with storage boxes 52, and the opening of the storage box 52 faces the fixed mold 2; the end of the transmission shaft 49 away from the small pulley 48 and a plurality of fan blades 50 are all located in the storage box 52; a filter is provided in the storage box 52, and the filter is located in front of the fan blades 50; the two L-shaped coupling blocks 51 are both facing the storage box 52; a pressure round wheel 53 is installed on the L-shaped coupling block 51, and the pressure round wheel 53 is located on the moving path of the sensor provided on the side wall of the storage box 52;

[0043] When the device is plastic-sealing the chip, the H-shaped square plate 5 moves, so that the locking square seat 22 on it moves synchronously, and the winding roller 18 is driven to rotate under the action of the cable 23 and the fixed pulley 17, so that the auxiliary rotating shaft 19 on it drives the rotating turntable 24 to rotate, and at the same time, the spring spring 21 on the auxiliary rotating shaft 19 is in a buffer state, so that when it is reset, it can drive the winding roller 18 to rotate and reset the winding; at the same time, the displacement column 25 moves with the rotation of the rotating turntable 24, so that the displacement column 25 is in the displacement cross block 26 reciprocates, thereby making the displacement square column 27 on the displacement cross block 26 reciprocate on the displacement base plate 28, so that the reciprocating displacement cross block 26 drives the displacement slider 41 to reciprocate through the extended square rod 40, so that it reciprocates in the displacement chute 42; when both displacement sliders 41 move away from the rotating turntable 24, the rotating gear 44 on the displacement slider 41 moves along the retaining rack 45, so that the rotating gear 44 rotates as the displacement slider 41 moves, thereby driving the large pulley 4 6 rotates, so that it drives the small pulley 48 to rotate through the transmission belt 47. Since the size of the large pulley 46 of the power source is larger than the small pulley 48, the speed of the small pulley 48 is higher than that of the large pulley 46, so that the small pulley 48 rotates quickly, and drives the plurality of fan blades 50 to rotate quickly through the transmission shaft 49, so that it rotates quickly in the storage box 52, so that wind force is generated at the opening of the storage box 52, and the wind force acts on the fixed mold 2. It is worth mentioning that at this time the fixed mold 2 and the movable mold 15 are still on the way to mold closing, so that the above-mentioned wind force can clean the impurities or dust adhering to the fixed mold 2 and the movable mold 15, so that the cleaning process does not need to be manually performed by the staff, and at the same time avoids the negligence in the process that causes the impurities inside the fixed mold 2 and the movable mold 15 to be not fully cleaned, resulting in incomplete chips and bubbles during plastic sealing, thereby improving the plastic sealing effect of the device, further reducing the work intensity of the staff, and improving the plastic sealing efficiency of the device, further reducing the limitations of the device during use;

[0044] The cam 45 is engaged with the cam 46 and the cam 47 is engaged with the cam 48. The cam 48 is engaged with the cam 46 and the cam 47 is engaged with the cam 48. The cam 48 is engaged with the cam 46 and the cam 47 is engaged with the cam 48. The device is used to continuously clean the impurities adhering to the fixed mold 2 and the movable mold 15, thereby improving the use effect of the device; it is worth mentioning that when the displacement slider 41 is moving to the end quickly, the rotating gear 44 and the retaining rack 45 are no longer engaged, and are in a buffer period, and the sensor on the side wall of the storage box 52 is in contact with the pressure wheel 53, indicating that the storage box 52 is moving to the end quickly, so that the valve (not shown in the figure) at the opening on the bottom surface of the storage box 52 that generates suction is opened, and since suction is no longer generated in the storage box 52 at this time , so that the impurities absorbed by the storage box 52 fall into the opening on the bottom surface of the storage box 52, so that these impurities can be collected, and the valve setting is closed at the same time to prevent impurities from flying around during the conversion between suction and blowing forces. When the storage box 52 at this location is reset and moved, the rotating gear 44 resumes the engagement with the retaining rack 45, so that the suction force generated by the storage box 52 is converted into blowing force, and the reciprocating movement is carried out to continuously clean the fixed mold 2 and the movable mold 15, thereby reducing the limitations of the device during use and improving the plastic sealing effect of the device;

[0045] It is worth mentioning that after the fixed mold 2 and the movable mold 15 are fitted, the continued movement of the H-shaped square plate 5 allows the two storage boxes 52 to continue operating, and collects the harmful gases generated by the device during the chip plastic sealing process, and filters them through the filter and discharges them, so as to avoid the device from generating a large amount of harmful gases when plastic sealing the chip and accumulating them around, causing harm to the physical and mental health of the operator, and at the same time improving the environmental protection performance of the device during use; at the same time, when the device is completed after plastic sealing, the reset movement of the H-shaped square plate 5 still allows the two storage boxes 52 to continue operating on both sides of the fixed mold 2 and the movable mold 15, which can not only purify the harmful gases and heat generated during demolding after plastic sealing, but also reduce the temperature of the chip after plastic sealing, accelerate the cooling speed of the packaging shell, and improve its curing molding speed, thereby improving the plastic sealing efficiency and effect of the device, and further reducing the limitations of the device during use.

[0046] The processing table 1 of this embodiment is also provided with a blocking encryption component; the blocking encryption component includes two driving gears 29, and the two driving gears 29 are symmetrical on both sides of the top of the processing table 1; the driving gears 29 are located on the moving path of the L-shaped rack 7, and the two are meshed with each other; the opposite back surfaces of the two driving gears 29 are meshed and connected with a driving rack 30, and the opposite back surfaces of the two driving racks 30 are symmetrically connected with two driving square plates 31, and the two driving square plates 31 are commonly connected to a driving square column 32, and a driving substrate 33 is slidably connected to the driving square column 32, and the driving substrate 33 is arranged on the U-shaped base 3; a driving spring 34 is sleeved on the driving square column 32, and one end of the driving spring 34 is connected to the driving The movable square plate 31 is connected, and the other end is connected to the driving base plate 33; the bottom ends of the two driving racks 30 are commonly connected to a U-shaped square rod 35, and displacement L plates 36 are installed on both sides of the U-shaped square rod 35. The end points of the displacement L plates 36 pass through the processing table 1 and are connected to the linkage base plate 37. The displacement L plates 36 and the processing table 1 slide together; the two linkage base plates 37 are commonly connected to a rectangular frame 38, and a sealing gasket 39 is provided on the inner wall of the rectangular frame 38. The sealing gasket 39 has the same size as the fixed mold 2 and the movable mold 15; the connection between the fixed mold 2 and the movable mold 15 is located on the moving path of the sealing gasket 39; the driving gear 29 is arranged on the U-shaped base 3; the rectangular frame 38 is sleeved on the fixed mold 2;

[0047] When the H-shaped square plate 5 moves downward, it synchronously drives the L-shaped rack 7 to move, so that after the movable mold 15 on the H-shaped square plate 5 moves to fit with the fixed mold 2, the H-shaped square plate 5 continues to move downward, and the L-shaped rack 7 on it continues to move downward to mesh with the driving gear 29, thereby driving the driving gear 29 to rotate, so that it meshes with the driving rack 30 to move, so that it moves on the upper limit of the driving base plate 33 through the driving square column 32, so that the driving spring 34 is in a buffering state, so that it is easy to drive the driving rack 30 to reset and move when it resets; it is worth mentioning that the two driving racks 30 are synchronously moved upward, thereby jointly driving the U-shaped square rod 35 to move upward, so that the two displacement L plates 36 on both sides of it are moved upward, thereby driving the rectangular frame 38 to move upward, so that The fixed mold 2 moves to the upper limit, and at this time the fixed mold 2 has been fitted with the movable mold 15, so that the sealing gasket 39 on the inner wall of the rectangular frame 38 moves to the connection between the fixed mold 2 and the movable mold 15 and fits, thereby further limiting the connection between the fixed mold 2 and the movable mold 15, avoiding the gap between the fixed mold 2 and the movable mold 15 when the device is plastic-sealing the chip, resulting in burrs on the plastic-sealed shell, and at the same time avoiding the leakage of the plastic sealing material causing defects in the package appearance, thereby improving the quality of the chip plastic sealing and further reducing the limitations of the device during use; at the same time, when the device completes the plastic sealing of the chip, the plastic sealing material and burrs leaked from the edges of the fixed mold 2 and the movable mold 15 can be cleaned through the reset movement of the rectangular frame 38, thereby improving the use effect of the device.

[0048] The present invention also provides a chip plastic packaging method for integrated circuit production, comprising the following steps:

[0049] S1. Place the object to be plastic-sealed in the movable mold 15 and the fixed mold 2 and start the telescopic cylinder 4 so that its output end drives the H-shaped square plate 5 to move;

[0050] S2, the H-shaped square plate 5 drives the pressure square plate 11 to move under the action of the limit slide 10 and the limit spring 14, so that the movable mold 15 on it moves toward the fixed mold 2;

[0051] S3, when the movable mold 15 contacts the fixed mold 2 after continuous movement, the two are fitted together to form a closed cavity;

[0052] S4. The material required for plastic sealing is squeezed into the closed cavity, and a hard packaging shell is formed after solidification, thereby completing the plastic sealing operation of the chip.

[0053] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0054] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A chip plastic packaging device for integrated circuit production, comprising a processing table (1), characterized in that: The processing table (1) is provided with a force-applying and continuous-pressing mechanism for plastic-sealing the chip; the force-applying and continuous-pressing mechanism comprises a fixed die (2), the bottom of which is connected to the top of the processing table (1) by bolts; a U-shaped base (3) is also installed on the processing table (1), the opening of the U-shaped base (3) faces the top of the processing table (1); a telescopic cylinder (4) is installed on the U-shaped base (3) by bolts, the output end of the telescopic cylinder (4) faces the top of the processing table (1) and is also installed An H-shaped square plate (5) is provided, and the opposite side of the U-shaped base (3) is located in the hollow area of ​​the H-shaped square plate (5); a guide T-plate (6) is symmetrically installed on both sides of the H-shaped square plate (5) close to the opposite side of the U-shaped base (3), and an air-generating and cavity-clearing unit is provided on the guide T-plate (6), and the air-generating and cavity-clearing unit is used to clean impurities adhered to the mold cavity of the fixed mold (2); L-shaped racks (7) are also installed on the opposite sides of the two guide T-plates (6), and the end points of the L-shaped racks (7) face the processing table (1); The gas-generating and cavity-clearing unit comprises an auxiliary notch (16), which is arranged through one of two opposite sides of the U-shaped base (3); a fixed pulley (17) is rotatably arranged in the auxiliary notch (16); a winding roller (18) is provided at the outer wall of the U-shaped base (3) near the auxiliary notch (16), and auxiliary rotating shafts (19) are installed on both sides of the winding roller (18), and an auxiliary substrate (20) is installed on the auxiliary rotating shaft (19), and the auxiliary substrate (20) is arranged on the U-shaped base (3); a spring (21) is installed on the auxiliary rotating shaft (19), and the end point of the spring (21) is arranged on the auxiliary substrate (20); A locking square seat (22) is fixedly mounted on one of the guide T-plates (6) near the auxiliary notch (16), and a cable (23) is connected to the locking square seat (22). The end of the cable (23) away from the locking square seat (22) passes around the fixed pulley (17) and is wound and connected to the winding roller (18); the end of the auxiliary rotating shaft (19) away from the winding roller (18) is connected to a rotating turntable (24), and displacement columns (25) are mounted on opposite sides of the two rotating turntables (24). A displacement horizontal block (26) is slidably connected to the displacement column (25), and two displacement square columns (27) are symmetrically connected to the side of the displacement horizontal block (26). The two displacement square columns (27) are slidably connected to a displacement base plate (28), and the displacement base plate (28) is arranged on the U-shaped base (3); An extended square rod (40) is installed at the bottom of the displacement cross block (26), and a displacement slider (41) is installed on the end point of the extended square rod (40); a displacement slide groove (42) is symmetrically provided on the top of the processing table (1) with the U-shaped base (3) as the symmetry axis, and the displacement slide groove (42) and the displacement slider (41) are slidably matched; a rotating shaft (43) is installed on the opposite back surface of the two displacement sliders (41), and a rotating gear (44) is installed on the rotating shaft (43), and the rotating gear (44) is meshed with a retaining rack (45) , a retaining rack (45) is arranged on the top of the processing table (1); a large pulley (46) is installed at one end of the rotating shaft (43) away from the displacement slider (41), a transmission belt (47) is connected to the large pulley (46), a small pulley (48) is connected to the transmission belt (47), and the transmission belt (47) is slidably matched with the small pulley (48) and the large pulley (46); a transmission shaft (49) is installed on the small pulley (48), and the transmission shaft (49) passes through the displacement slider (41) and is connected to a plurality of fan blades (50); One of the retaining racks (45) is arranged on the top wall of the rotating gear (44), and the other retaining rack (45) is arranged on the bottom wall of the rotating gear (44); the notches of the two retaining racks (45) are both oriented toward the rotating gear (44); two groups of L-shaped coupling blocks (51) are symmetrically installed on both sides of the top of the processing table (1), and the number of each group of L-shaped coupling blocks (51) is two; the opposite surfaces of the two displacement sliders (41) are both provided with a storage box (52), and the opening of the storage box (52) is oriented toward the fixed mold (2 ); one end of the transmission shaft (49) away from the small pulley (48) and a plurality of fan blades (50) are all located in the storage box (52); a filter is provided in the storage box (52), and the filter is located in front of the fan blades (50); the two L-shaped coupling blocks (51) are both facing the storage box (52); a pressure wheel (53) is installed on the L-shaped coupling block (51), and the pressure wheel (53) is located on the moving path of the sensor provided on the side wall of the storage box (52), and the end of the retaining rack (45) is not provided with a tooth portion; When the displacement slider (41) is about to move to the end, the rotating gear (44) and the retaining rack (45) are no longer engaged and are in a buffer period, and the sensor on the side wall of the storage box (52) is in contact with the pressure wheel (53), indicating that the storage box (52) is about to move to the end, so that the valve at the opening on the bottom surface of the storage box (52) that generates suction is opened.

2. The chip plastic packaging device for integrated circuit production according to claim 1, characterized in that: A guide cylinder (8) is symmetrically installed on one side of the guide T-plate (6) away from the processing table (1), and one end of the guide cylinder (8) away from the fixed mold (2) passes through the top of the U-shaped base (3), and the guide cylinder (8) and the top of the U-shaped base (3) are slidably matched; one end of the guide cylinder (8) away from the processing table (1) is connected to a guide limit plate (9); and two groups of limit slides (10) are symmetrically installed on one side of the H-shaped square plate (5) away from the top of the U-shaped base (3), and the number of each group of limit slides (10) is two, and the two groups of limit slides (10) are relatively arranged on both sides of the U-shaped base (3).

3. The chip plastic packaging device for integrated circuit production according to claim 2, characterized in that: The two groups of limit slides (10) are both connected with a pressure square plate (11), and the pressure square plate (11) and the limit slide (10) are slidably matched; the end of the limit slide (10) away from the H-shaped square plate (5) is connected to the limit circular plate (12); the top of the processing table (1) is also provided with a limit circular groove (13), the limit circular groove (13) is located on the moving path of the limit circular plate (12) and the two are of the same size; the limit slide (10) is sleeved with a limit spring (14), one end of the limit spring (14) is fixedly connected to the H-shaped square plate (5), and the other end is fixedly connected to the top of the pressure square plate (11); the bottom of the pressure square plate (11) is also connected to a movable mold (15) by bolts, and the working surfaces of the movable mold (15) and the fixed mold (2) are arranged relative to each other.

4. The chip plastic packaging device for integrated circuit production according to claim 1, characterized in that: The processing table (1) is also provided with a blocking encryption component; the blocking encryption component comprises two driving gears (29), and the two driving gears (29) are symmetrical to the two sides of the top of the processing table (1); the driving gears (29) are located on the moving path of the L-shaped rack (7), and the two are meshed and matched; the opposite back surfaces of the two driving gears (29) are meshed and connected with driving racks (30), and the opposite back surfaces of the two driving racks (30) are symmetrically connected with two driving square plates (31), and the two driving square plates (31) are commonly connected with a driving square column (32), and a driving base plate (33) is slidably connected to the driving square column (32), and the driving base plate (33) is arranged on the U-shaped base (3); a driving spring (34) is sleeved on the driving square column (32), and one end of the driving spring (34) is connected to the driving square plate (31), and the other end is connected to the driving base plate (33).

5. The chip plastic packaging device for integrated circuit production according to claim 4, characterized in that: The bottom ends of the two driving racks (30) are commonly connected to a U-shaped square rod (35), and displacement L plates (36) are installed on both sides of the U-shaped square rod (35). The end points of the displacement L plates (36) pass through the processing table (1) and are connected to a linkage base plate (37). The displacement L plates (36) and the processing table (1) are slidably matched; the two linkage base plates (37) are commonly connected to a rectangular frame (38), and a sealing rubber gasket (39) is provided on the inner wall of the rectangular frame (38). The sealing rubber gasket (39) has the same size as that of the fixed mold (2) and the movable mold (15); the connection between the fixed mold (2) and the movable mold (15) is located on the moving path of the sealing rubber gasket (39); the driving gear (29) is arranged on the U-shaped base (3); and the rectangular frame (38) is sleeved on the fixed mold (2).

6. A method for plastic packaging of integrated circuit chips, using the integrated circuit chip plastic packaging device according to claim 1, characterized in that: Including steps: S1. Place the object to be plastic-sealed in the movable mold (15) and the fixed mold (2) and start the telescopic cylinder (4) so ​​that its output end drives the H-shaped square plate (5) to move; S2, the H-shaped square plate (5) drives the pressure square plate (11) to move under the action of the limit slide (10) and the limit spring (14), so that the movable mold (15) on it moves toward the fixed mold (2); S3, when the movable mold (15) contacts the fixed mold (2) after continuous movement, the two molds fit together to form a closed cavity; S4. The material required for plastic sealing is squeezed into the closed cavity, and a hard packaging shell is formed after solidification, thereby completing the plastic sealing operation of the chip.

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