A semiconductor chip packaging device for convenient loading

Abstract

The present invention discloses a semiconductor chip packaging device that is convenient for loading, and relates to the field of semiconductor chip packaging technology. The semiconductor chip packaging device that is convenient for loading includes a support seat and a conveying device. The conveying device is provided inside the support seat, and the conveying device includes a servo motor and a conveyor belt. The semiconductor chip packaging device that is convenient for loading, in order to accurately position the center of the semiconductor chip at the bottom of the dispensing nozzle of the dispensing device, starts the cylinder so that the positioning plate drives the rollers to approach each other, and can clamp and position the semiconductor chip. After the semiconductor chip is clamped, the positioning plate is subjected to an extrusion force and approaches the connecting plate, so that the extrusion rod squeezes the rotating block, causing the positioning block to rotate, and the rotation of the positioning block squeezes the semiconductor chip that is not centered, so that the center position of the semiconductor chip is exactly aligned with the dispensing nozzle of the dispensing device, facilitating accurate dispensing and improving the quality of packaging.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, in particular to a semiconductor chip packaging device with convenient material loading. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between that of conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. The core chips in most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Semiconductor chips that can achieve certain functions are made by etching and wiring on semiconductor sheets. After manufacturing, the chips need to be packaged.

[0003] The patent with patent announcement number CN220420538U relates to a dispensing device for semiconductor chip packaging, including a device main body, an operating terminal fixedly connected to the side of the device main body, a mounting bracket fixedly connected to the outer wall of the upper end of the device main body, a movable slide rail provided on the mounting bracket, a dispensing pen slidably connected to the movable slide rail, and a mounting tube installed on the upper end of the dispensing pen. This patent can achieve the following when using: the colloid can be injected into the stirring tank first, and the stirring blade is used for stirring pre-treatment, so that the colloid is defoamed by the uniform stirring of the stirring blade to avoid the phenomenon of voids in the colloid during injection. At the same time, when the stirring blade stirs the colloid in the stirring tank, the blending part located on the stirring blade will automatically blend the diluent released by the colloid to avoid the colloid being too viscous, which will cause wire drawing and other phenomena during subsequent dispensing.

[0004] In the above patent, when the semiconductor chip is transported to the glue dispensing equipment for glue dispensing, the semiconductor chip cannot be accurately positioned, so that the center position of the semiconductor chip is not aligned with the glue dispensing point of the glue dispensing equipment. As a result, when the semiconductor chip is glued, glue may drip on the edge of the semiconductor, thereby affecting the packaging effect and reducing the quality of the product. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a semiconductor chip packaging device that is convenient for loading materials, which solves the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor chip packaging device that is convenient for loading, comprising a support seat and a conveying device, a conveying device is provided inside the support seat, the conveying device comprises a servo motor and a conveyor belt, the conveyor belt is rotatably mounted on the inner wall of the support seat, the servo motor is fixedly penetrated on the side of the support seat away from the conveyor belt, the output end of the servo motor is fixedly connected to the drive shaft of the conveyor belt, when the semiconductor chip needs to be dispensed and packaged, the servo motor is started to rotate the conveyor belt, and the semiconductor chip is placed on the conveyor belt. , the semiconductor chip is transported to the dispensing equipment by a conveyor belt for dispensing and packaging operations, a fixed frame is fixed on the top of the support seat, a dispensing device is provided on the fixed frame, a positioning component for positioning the semiconductor chip is provided on the support seat, and also includes an intermittent feeding component and a collecting component; wherein the positioning component includes a cylinder, a connecting plate, a connecting column, a positioning plate, a stopper, a compression spring, a roller, a rotating rod, a rotating block, a positioning block, an inclined block, an extrusion rod and a torsion spring; the cylinder is fixed on the fixed frame, a connecting plate is fixed on the output end of the cylinder, a connecting column is passed through the connecting plate, and the connecting column A positioning plate is fixed at one end of the connecting column, and a stopper is fixed at the other end of the connecting column. A compression spring is fixed on the side of the stopper close to the connecting plate, and the side of the compression spring away from the stopper is fixed to the side wall of the connecting plate. A plurality of rollers in a linear array are rotatably installed on the inner side of the positioning plate. When the semiconductor chip is transported to the dispensing equipment, the cylinder is activated to drive the connecting plate and the positioning plate to move, so that the positioning plate contacts the semiconductor chip for clamping and positioning. An extrusion rod is fixed to the side wall of the connecting plate, and a rotating rod is passed through the positioning plate, and the rotating rod is rotatably connected to the penetration point of the positioning plate. A rotating block is fixed on the top of the rotating rod, and a positioning block is fixed on the bottom of the rotating rod. There are four positioning blocks, and two positioning blocks form a group. The two groups of positioning blocks are symmetrically arranged with the center line of the conveyor belt in the vertical direction as the symmetry axis. When the positioning plate clamps the semiconductor chip, the positioning plate will be subjected to extrusion force, causing the positioning plate to move toward the connecting plate, thereby stretching the compression spring, and when the positioning plate moves to the rotating block and contacts the extrusion rod, the extrusion rod will squeeze the rotating block, causing the rotating block to rotate, thereby causing the four positioning blocks to rotate simultaneously, and the semiconductor chip to be centered.

[0007] According to the above technical solution, a torsion spring is fixed on the top of the positioning block, and the top of the torsion spring is fixed to the inner side of the bottom of the positioning plate. An inclined block is fixed on the side wall of the positioning block. When the positioning block rotates, the bottom of the inclined block will insert the semiconductor chip.

[0008] According to the above technical solution, the intermittent feeding assembly includes a slide rod, a sleeve, a sleeve rod, a long plate, a slide groove, a baffle, a dust collector, a dust hood, a fixed plate, a dust collection box, a spring switch, a transmission rod, a return spring, a transmission block, a hinged rod and an L-shaped extrusion block; the slide rod is fixed to the side wall of the connecting plate, the top of the support seat is fixed with a sleeve, the inner wall of the sleeve is slidably mounted with a sleeve rod, the top of the sleeve rod is fixed with a long plate, a slide groove is provided on the long plate, the slide rod passes through the slide groove, and the penetration part is fitted, and a baffle is fixed to the bottom of the long plate. When the connecting plate moves, the slide rod can move in the slide groove, so that the slide rod can squeeze the long plate to move downward, thereby driving the baffle to move downward.

[0009] According to the above technical solution, a fixed plate is fixed to the side wall of the long board, a vacuum cleaner is fixed to the top of the fixed plate, a spring switch is installed on the vacuum cleaner, a dust hood is fixedly connected to the left side of the vacuum cleaner through a dust suction pipe, and a dust box is fixedly connected to the right side of the vacuum cleaner through a discharge pipe, and the dust box is fixed to the side wall of the long board.

[0010] According to the above technical solution, a transmission rod passes through the baffle, a transmission block is fixed on the top of the transmission rod, an L-shaped extrusion block passes through the fixed plate, a hinged rod is hinged on the L-shaped extrusion block, and one end of the hinged rod away from the L-shaped extrusion block is hinged to the top of the transmission block. When the baffle moves downward, the transmission rod will come into contact with the conveyor belt, and the transmission rod will be moved upward in the baffle by the extrusion force, so that the transmission block squeezes the hinged rod, and the hinged rod squeezes the L-shaped extrusion block to squeeze the spring switch, thereby starting the vacuum cleaner.

[0011] According to the above technical solution, a return spring is fixed to the bottom of the transmission block, and the bottom of the return spring is fixed to the top of the baffle.

[0012] According to the above technical solution, the collection assembly includes a fixed rod, a movable rod, a connecting block, a collection box, a guide rod, a connecting spring, a push rod, a push block, a diagonal rod and a sealing plate; the fixed rod is fixed to the top of the dust collection box, and a connecting block is slidably installed on the inner bottom of the fixed frame, and a movable rod is hinged on the connecting block, and the end of the movable rod away from the connecting block is hinged to the top of the fixed rod, and a collection box is fixed on the side of the connecting block away from the movable rod, and a sealing plate is slidably installed on the top of the collection box. When the baffle drives the dust collection box to move downward, the fixed rod will move downward, so that the fixed rod will pull the movable rod, so that the movable rod rotates at the hinge, and the movable rod pulls the connecting block to move, so that the collection box is removed from the bottom of the dispensing equipment.

[0013] According to the above technical solution, a guide rod passes through the connecting block, a push block is fixed to the end point of the guide rod, a connecting spring is fixed to the side wall of the push block, the side of the connecting spring away from the push block is fixed to the side wall of the connecting block, a push rod is fixed to the side wall of the push block, and the end of the push rod away from the push block is hinged to an oblique rod, and the end of the oblique rod away from the push rod is hinged to the sealing plate. When the connecting block moves, the push block will contact the fixed rod, so that the push block is subjected to extrusion force, thereby causing the push rod to squeeze the oblique rod, so that the two sets of sealing plates can approach each other.

[0014] The present invention provides a semiconductor chip packaging device that is convenient for loading materials. It has the following beneficial effects:

[0015] 1. The semiconductor chip packaging equipment with convenient loading, in order to make the center position of the semiconductor chip accurately at the bottom of the dispensing nozzle of the dispensing equipment, starts the cylinder, so that the positioning plate drives the rollers close to each other, and can clamp and position the semiconductor chip. After the semiconductor chip is clamped, the positioning plate is squeezed and approaches the connecting plate, so that the squeezing rod squeezes the rotating block, and the positioning block rotates. The rotation of the positioning block squeezes the semiconductor chip that is not centered, so that the center position of the semiconductor chip is just aligned with the dispensing nozzle of the dispensing equipment, which facilitates accurate dispensing and improves the quality of packaging.

[0016] 2. The semiconductor chip packaging equipment is convenient for loading materials. When the connecting plate drives the positioning plate to clamp and position the semiconductor chip, the slide bar moves in the slide groove, so that the long plate drives the baffle to move downward to block the next semiconductor chip to be glued, so that intermittent feeding can be carried out to prevent collision. When the baffle moves downward, the transmission rod can contact the conveyor belt, so that the transmission rod moves upward under the extrusion force. Through the cooperation of the transmission block, the hinged rod and the L-shaped extrusion block, the L-shaped extrusion block squeezes the spring switch, so that the vacuum cleaner is started to remove dust from the semiconductor chip that needs to be glued.

[0017] 3. The semiconductor chip packaging equipment is convenient for loading materials, and when the dispensing equipment is not performing the dispensing operation, the collection box will be placed at the bottom of the dispensing nozzle of the dispensing equipment, so that the glue connection operation can be carried out to prevent glue residue on the dispensing nozzle, causing the glue to drip onto the conveyor belt, making the cleaning operation inconvenient. When the dispensing operation is carried out, the baffle will drop, so that the fixed rod will drop to pull the movable rod, so that the connecting block drives the collection box to move away from the bottom of the dispensing equipment to perform the dispensing operation. When the connecting block moves, the push block will contact the fixed rod, so that the push block will be squeezed close to the collection box. Through the cooperation of the push rod and the inclined rod, the sealing plate will cover the top of the collection box to prevent dust from entering. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1It is a structural schematic diagram of the overall device of the present invention;

[0019] Figure 2 It is a schematic structural diagram of the present invention as a whole;

[0020] Figure 3 It is a schematic structural diagram of the present invention;

[0021] Figure 4 This is a schematic structural diagram of the positioning assembly, intermittent feeding assembly and collecting assembly of the present invention;

[0022] Figure 5 This is a partial structural diagram of the positioning component of the present invention;

[0023] Figure 6 It is a schematic diagram of the structure of the intermittent feeding component and the collecting component of the present invention;

[0024] Figure 7 For the present invention Figure 6 A magnified schematic diagram of the A structure;

[0025] Figure 8 This is a schematic diagram of the structure of the collection component of the present invention.

[0026] In the figure: 1, support base; 2, conveying equipment; 3, fixed frame; 4, dispensing equipment; 5, cylinder; 6, connecting plate; 7, connecting column; 8, positioning plate; 9, stopper; 10, compression spring; 11, roller; 12, rotating rod; 13, rotating block; 14, squeezing rod; 15, positioning block; 16, torsion spring; 17, inclined block; 1801, sliding rod; 1802, sleeve; 1803, sleeve rod; 1804, long board; 1805, baffle; 1806, slide; 1807, vacuum cleaner; 18 08, dust hood; 1809, dust box; 1810, fixed plate; 1811, transmission rod; 1812, transmission block; 1813, return spring; 1814, hinged rod; 1815, L-shaped extrusion block; 1816, spring switch; 1901, fixed rod; 1902, movable rod; 1903, connecting block; 1904, collecting box; 1905, guide rod; 1906, connecting spring; 1907, push block; 1908, push rod; 1909, inclined rod; 1910, sealing plate. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] See also Figure 1-Figure 5 , one embodiment of the present invention is: a semiconductor chip packaging device for convenient loading, comprising a support base 1 and a conveying device 2, a conveying device 2 is provided on the inner side of the support base 1, the conveying device 2 comprises a servo motor and a conveyor belt, the conveyor belt is rotatably mounted on the inner wall of the support base 1, the servo motor is fixedly passed through the side of the support base 1 away from the conveyor belt, the output end of the servo motor is fixedly connected to the driving shaft of the conveyor belt, a fixed frame 3 is fixed on the top of the support base 1, a dispensing device 4 is provided on the fixed frame 3, and a positioning component for positioning the semiconductor chip is provided on the support base 1; wherein the positioning component comprises a cylinder 5, a connecting plate 6, a connecting column 7, a positioning plate 8, a stopper 9, a compression spring 10, a roller 11, a rotating rod 12, a rotating block 13, a positioning block 15, an inclined block 17, an extrusion rod 14 and a torsion spring 16; the cylinder 5 is fixed on the fixed frame 3, a connecting plate 6 is fixed on the output end of the cylinder 5, a connecting plate 6 is passed through the connecting plate 6, and the connecting column 7 and the connecting plate 6 are penetrated The cam 14 is fixed to the side of the cam 12 and the cam 13 is fixed to the top of the cam 12. The cam 14 is fixed to the side of the cam 12 and the cam 13 is fixed to the top of the cam 12. The cam 14 is fixed to the side of the cam 12 and the cam 13 is fixed to the top of the cam 12. The cam 14 is fixed to the side of the cam 12.

[0029] After the semiconductor chip is clamped by the roller 11, the positioning block 15 is rotated to squeeze the semiconductor chip and move it, so that the semiconductor chip is centered and the center position of the semiconductor chip is aligned with the dispensing nozzle of the dispensing device 4, so that precise dispensing is performed to prevent glue from dripping on the edge of the semiconductor chip, affecting the packaging effect and reducing product quality.

[0030] And through the setting of the roller 11, when the positioning block 15 squeezes the semiconductor chip to center it, the semiconductor chip will move on the roller 11, thereby facilitating the movement of the semiconductor on the positioning plate 8 and preventing direct contact with the semiconductor chip through the positioning plate 8, thereby causing excessive friction and possibly damaging the semiconductor chip.

[0031] When this embodiment is working: when it is necessary to perform glue dispensing and packaging operations on semiconductor chips, the servo motor is started to rotate the conveyor belt, and the semiconductor chips to be packaged are placed on the conveyor belt. The semiconductor chips are transported toward the glue dispensing device 4 through the conveyor belt, which facilitates the loading operation of the semiconductor chips. When the semiconductor chips are transported to the glue dispensing device 4, the cylinder 5 is started to drive the connecting plate 6 to move, and the connecting plate 6 drives the connecting column 7 and the positioning plate 8 to move, so that the two sets of positioning plates 8 are close to each other. The rollers 11 on the positioning plate 8 can clamp and position the semiconductor chips on the conveyor belt, and the semiconductor chips are placed in the middle of the conveyor belt. When the roller 11 presses and positions the semiconductor body, the positioning plate 8 is squeezed and moved toward the connecting plate 6, causing the compression spring 10 to stretch and deform. When the positioning plate 8 is moved toward the connecting plate 6, the squeezing rod 14 is in contact with the rotating block 13. When the squeezing rod 14 squeezes the rotating block 13, the rotating block 13 is rotated, so that the rotating rod 12 drives the four positioning blocks 15 to rotate relative to each other, thereby compressing and deforming the torsion spring 16, so that the positioning block 15 can squeeze the semiconductor chip that is not centered, so that the semiconductor chip can adjust its position on the positioning plate 8. When the rotating block 13 is squeezed and rotated 90 degrees by the squeezing rod 14, By rotating the positioning block 15 by 90 degrees, the side wall of the positioning block 15 is just fitted with the outer wall of the semiconductor chip, which can accurately locate the position of the semiconductor chip and align the center position of the semiconductor chip with the dispensing nozzle of the dispensing device 4, thereby performing precise dispensing and improving the quality of product packaging. When the positioning block 15 is rotated, the oblique block 17 is moved away from the side of the positioning block 15 and fitted with the conveyor belt. The oblique block 17 can scoop up the semiconductor chip from the bottom of the semiconductor chip so that the bottom of the semiconductor chip does not contact the conveyor belt, thereby reducing the friction between the semiconductor chip and the conveyor belt and reducing the risk of damage to the semiconductor chip. And when the semiconductor chip is positioned, the glue dispensing equipment 4 is started to perform the glue dispensing operation. When the glue dispensing is completed, the two sets of positioning plates 8 are moved away from each other by starting the cylinder 5, so that the clamping positioning of the semiconductor chip can be released. When the positioning plate 8 is not squeezed, the compression spring 10 is in a tensile deformation state, which will cause the compression spring 10 to drive the stop block 9 and the connecting column 7 to reset, thereby resetting the positioning plate 8 away from the connecting plate 6, so that the extrusion rod 14 does not squeeze the rotating block 13. Because the torsion spring 16 is in a contraction deformation state, the torsion spring 16 drives the positioning block 15 to rotate, so that the positioning block 15 rotates to the bottom of the positioning plate 8, and the next positioning operation is performed.

[0032] See also Figures 1-8On the basis of the above embodiment, another embodiment of the present invention further includes an intermittent feeding assembly and a collecting assembly, and the intermittent feeding assembly includes a slide bar 1801, a sleeve 1802, a sleeve bar 1803, a long plate 1804, a slide groove 1806, a baffle 1805, a dust collector 1807, a dust cover 1808, a fixing plate 1810, a dust collection box 1809, a spring switch 1816, a transmission rod 1811, a return spring 1813, a transmission block 1812, a hinged rod 1814 and an L-shaped extrusion block 1815; Rod 1801 is fixed to the side wall of connecting plate 6, sleeve 1802 is fixed to the top of support seat 1, sleeve 1803 is slidably mounted on the inner wall of sleeve 1802, long plate 1804 is fixed to the top of sleeve 1803, long plate 1804 is provided with a slide groove 1806, slide rod 1801 passes through the slide groove 1806, and the penetration is fitted, baffle 1805 is fixed to the bottom of long plate 1804, baffle 1805 is made of rubber material, fixed plate 1810 is fixed to the side wall of long plate 1804, fixed plate 1810 A dust collector 1807 is fixed on the top of the baffle 1805, a spring switch 1816 is installed on the dust collector 1807, a dust cover 1808 is fixedly connected to the left side of the dust collector 1807 through a dust collection pipe, a dust collection box 1809 is fixedly connected to the side wall of the long board 1804, a transmission rod 1811 is passed through the baffle 1805, and the transmission rod 1811 is slidably connected to the penetration point of the baffle 1805, and a transmission block 1812 is fixed to the top of the transmission rod 1811. An L-shaped extrusion block 1815 passes through the fixed plate 1810, and the L-shaped extrusion block 1815 is slidably connected to the penetration point of the fixed plate 1810, and the L-shaped extrusion block 1815 can move in the fixed plate 1810. A hinged rod 1814 is hinged on the L-shaped extrusion block 1815, and the end of the hinged rod 1814 away from the L-shaped extrusion block 1815 is hinged to the top of the transmission block 1812. A return spring 1813 is fixed to the bottom of the transmission block 1812, and the bottom of the return spring 1813 is fixed to the top of the baffle 1805.

[0033] And by moving the baffle 1805 downward to fit with the conveyor belt, it can shield the next semiconductor chip that needs to be glued and packaged, and perform intermittent feeding to prevent collisions and prevent the two groups of semiconductor chips from colliding and causing damage.

[0034] By starting the vacuum cleaner 1807, the dust hood 1808 can be used to vacuum the next semiconductor chip that needs to be glued, preventing dust from adhering to the semiconductor chip. The dust may contaminate the glue material and affect the quality and performance of the package.

[0035] The collecting assembly includes a fixed rod 1901, a movable rod 1902, a connecting block 1903, a collecting box 1904, a guide rod 1905, a connecting spring 1906, a push rod 1908, a push block 1907, an inclined rod 1909 and a sealing plate 1910; the fixed rod 1901 is fixed to the top of the dust collecting box 1809, and a connecting block 1903 is slidably installed on the inner bottom of the fixed frame 3, and the connecting block 1903 is hinged with the movable rod 1902, and the end of the movable rod 1902 away from the connecting block 1903 is hinged to the top of the fixed rod 1901, and the side of the connecting block 1903 away from the movable rod 1902 is fixed with the collecting box 1904, and the top of the collecting box 1904 is slidably installed with a sealing plate 1910, and the guide rod 1905 passes through the connecting block 1903, and the passing part is slidably connected. A push block 1907 is fixed to the end point of 905, and a connecting spring 1906 is fixed to the side wall of the push block 1907. The side of the connecting spring 1906 away from the push block 1907 is fixed to the side wall of the connecting block 1903, and a push rod 1908 is fixed to the side wall of the push block 1907. The end of the push rod 1908 away from the push block 1907 is hinged to an inclined rod 1909, and the end of the inclined rod 1909 away from the push rod 1908 is hinged to a sealing plate 1910. There are two groups of sealing plates 1910, and the two groups of sealing plates 1910 are symmetrically arranged with the center line of the collecting box 1904 in the vertical direction as the axis of symmetry. The collecting box 1904 can collect excess glue dripping from the dispensing nozzle of the dispensing equipment 4 to prevent the glue from dripping onto the conveyor belt, causing pollution to the conveyor belt and inconvenience for subsequent staff to clean up.

[0036] Furthermore, by providing two sets of sealing plates 1910 , when the collection box 1904 is not performing gluing operations, the sealing plates 1910 will cover the top of the collection box 1904 , thereby achieving a dust-proof effect.

[0037] When this embodiment works: when the two groups of connecting plates 6 approach each other, the slide bar 1801 will move at the oblique groove of the slide groove 1806, thereby causing the slide bar 1801 to squeeze the oblique groove of the slide groove 1806. Due to the squeezing force, the long plate 1804 will move downward, so that the long plate 1804 can drive the baffle 1805 to move downward, blocking the next semiconductor chip that needs to be glued, and when the slide bar 1801 moves to the straight groove section of the slide groove 1806, the position of the long plate 1804 will no longer change. After the glue is finished, the two groups of connecting plates 6 move away from each other to release the clamping position of the glued semiconductor chip, thereby The conveyor belt can be transported to the next process, and when the two sets of connecting plates 6 are reset, the slide bar 1801 will be reset in the slide groove 1806, so when it moves to the inclined groove section of the slide groove 1806, it will squeeze the long plate 1804 to move upward, so that the baffle 1805 moves upward and does not block the semiconductor chip, so that the feeding operation can be carried out. The setting of the baffle 1805 can achieve the effect of intermittent feeding, thereby preventing the accident of collision, and when the baffle 1805 moves downward, the transmission rod 1811 will first contact the outer wall of the conveyor belt, and the transmission rod 1811 will be squeezed in the baffle 1805 due to the squeezing force. The transmission rod 1811 drives the transmission block 1812 to move upward, stretching the return spring 1813 and causing the transmission block 1812 to squeeze the hinge rod 1814, causing the hinge rod 1814 to rotate at the hinge, so that the hinge rod 1814 squeezes the L-shaped extrusion block 1815 to move closer to the vacuum cleaner 1807, so that the L-shaped extrusion block 1815 squeezes the spring switch 1816, causing the spring switch 1816 to move to turn on the vacuum cleaner 1807, thereby performing a vacuuming operation through the dust cover 1808, and vacuuming the dust attached to the top of the semiconductor chip at the baffle 1805, and discharging the absorbed dust into the dust collection box. 1809, and when the baffle 1805 moves upward, the transmission rod 1811 will not be squeezed, and the reset spring 1813 will be in a stretched state, which will cause the transmission block 1812 to move downward, causing the transmission block 1812 to pull the hinged rod 1814, causing the hinged rod 1814 to rotate at the hinge, so that the hinged rod 1814 pulls the L-shaped extrusion block 1815 away from the spring switch 1816, so that the L-shaped extrusion block 1815 does not contact the spring switch 1816, and the spring switch 1816 is reset, so that the vacuum cleaner 1807 is turned off and the vacuuming operation is stopped, preventing it from being in the on state all the time, which may cause power loss.

[0038] When the long plate 1804 moves downward, the dust collecting box 1809 can be driven to move downward, so that the fixed rod 1901 pulls the movable rod 1902, so that the movable rod 1902 rotates at the hinge, so that the movable rod 1902 pulls the connecting block 1903 to move toward the long plate 1804, so that the connecting block 1903 drives the collecting box 1904 to move toward the long plate 1804, so that the collecting box 1904 does not block the dispensing nozzle of the dispensing device 4, so that the dispensing operation can be carried out, and when the connecting block 1 When 903 approaches the long plate 1804, the push block 1907 contacts the fixed rod 1901, which causes the push block 1907 to be squeezed, causing the guide rod 1905 to move in the connecting block 1903, compressing the connecting spring 1906. When the push block 1907 moves, the push rod 1908 squeezes the oblique rod 1909, causing the oblique rod 1909 to rotate at the hinge, causing the oblique rod 1909 to squeeze the two sets of sealing plates 1910 closer to each other, and the sealing plates 1910 can be used to close the sealing plates. The top of the collecting box 1904 is sealed to prevent dust. When the dispensing operation is not in progress, the long plate 1804 will move upward, thereby causing the dust collecting box 1809 to move upward, causing the fixed rod 1901 to move upward, causing the fixed rod 1901 to squeeze the movable rod 1902, causing the movable rod 1902 to squeeze the connecting block 1903 away from the long plate 1804, and when the connecting block 1903 is away from the long plate 1804, the pushing block 1907 is not in contact with the fixed rod 1901, thereby causing the pushing block 1907 to Block 1907 is not subjected to extrusion force, and because the connecting spring 1906 is in a compressed state, the push block 1907 is reset, and the push block 1907 drives the push rod 1908 to reset, so that the push rod 1908 pulls the inclined rod 1909, and the inclined rod 1909 rotates at the hinge, so that the inclined rod 1909 pulls the two sets of sealing plates 1910 to open, and the connecting block 1903 drives the collection box 1904 to move to the bottom of the dispensing nozzle of the dispensing device 4, so that the glue dripping in the dispensing nozzle can be collected.

[0039] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging device that is convenient for loading, comprising a support base (1) and a conveying device (2), wherein the conveying device (2) is provided inside the support base (1), and is characterized in that: The conveying device (2) includes a servo motor and a conveyor belt, the conveyor belt is rotatably mounted on the inner wall of the support base (1), the servo motor is fixedly inserted through the side of the support base (1) away from the conveyor belt, the output end of the servo motor is fixedly connected to the drive shaft of the conveyor belt, a fixed frame (3) is fixed on the top of the support base (1), a dispensing device (4) is provided on the fixed frame (3), a positioning component for positioning the semiconductor chip is provided on the support base (1), and an intermittent feeding component and a collecting component are also included; The positioning assembly comprises a cylinder (5), a connecting plate (6), a connecting column (7), a positioning plate (8), a stopper (9), a compression spring (10), a roller (11), a rotating rod (12), a rotating block (13), a positioning block (15), an inclined block (17), an extrusion rod (14) and a torsion spring (16); the cylinder (5) is fixed on the fixed frame (3); the output end of the cylinder (5) is fixed with a connecting plate (6); a connecting column (7) passes through the connecting plate (6); one end of the connecting column (7) is fixed with a positioning plate (8); the other end of the connecting column (7) is fixed with a stopper (9); the side of the stopper (9) close to the connecting plate (6) is fixed with a compression spring (10); The side of the compression spring (10) away from the stopper (9) is fixed to the side wall of the connecting plate (6), and a plurality of rollers (11) in a linear array are rotatably installed on the inner side of the positioning plate (8). The side wall of the connecting plate (6) is fixed with an extrusion rod (14), and a rotating rod (12) passes through the positioning plate (8), and the rotating rod (12) is rotatably connected to the through-hole of the positioning plate (8). A rotating block (13) is fixed to the top of the rotating rod (12), and a positioning block (15) is fixed to the bottom of the rotating rod (12). Four positioning blocks (15) are provided, and two positioning blocks (15) form a group, and the two groups of positioning blocks (15) are symmetrically arranged with the center line of the conveyor belt in the vertical direction as the symmetry axis.

2. The semiconductor chip packaging equipment with convenient loading according to claim 1, characterized in that: A torsion spring (16) is fixed on the top of the positioning block (15), and the top of the torsion spring (16) is fixed on the inner side of the bottom of the positioning plate (8). An inclined block (17) is fixed on the side wall of the positioning block (15).

3. The semiconductor chip packaging equipment with convenient loading according to claim 2, characterized in that: The intermittent feeding assembly comprises a slide bar (1801), a sleeve (1802), a sleeve bar (1803), a long plate (1804), a slide groove (1806), a baffle (1805), a dust collector (1807), a dust hood (1808), a fixed plate (1810), a dust collection box (1809), a spring switch (1816), a transmission rod (1811), a return spring (1813), a transmission block (1812), a hinged rod (1814) and an L-shaped extrusion block (1815); the slide bar (1801), a sleeve bar (1803), a long plate (1804), a slide groove (1806), a baffle (1805), a dust collector (1807), a dust hood (1808), a fixed plate (1810), a dust collection box (1809), a spring switch (1816), a transmission rod (1811), a return spring (1813), a transmission block (1812), a hinged rod (1814) and an L-shaped extrusion block (1815); The rod (1801) is fixed to the side wall of the connecting plate (6), a sleeve (1802) is fixed to the top of the support seat (1), a sleeve rod (1803) is slidably installed on the inner wall of the sleeve (1802), a long plate (1804) is fixed to the top of the sleeve rod (1803), a sliding groove (1806) is provided on the long plate (1804), the sliding rod (1801) passes through the sliding groove (1806), and the penetration part is in contact with each other, and a baffle (1805) is fixed to the bottom of the long plate (1804).

4. The semiconductor chip packaging equipment with convenient loading according to claim 3, characterized in that: A fixed plate (1810) is fixed to the side wall of the long board (1804), a vacuum cleaner (1807) is fixed to the top of the fixed plate (1810), a spring switch (1816) is installed on the vacuum cleaner (1807), a dust hood (1808) is fixedly connected to the left side of the vacuum cleaner (1807) via a vacuum tube, and a dust box (1809) is fixedly connected to the right side of the vacuum cleaner (1807) via a discharge tube, and the dust box (1809) is fixed to the side wall of the long board (1804).

5. The semiconductor chip packaging equipment with convenient loading according to claim 4, characterized in that: A transmission rod (1811) passes through the baffle (1805), a transmission block (1812) is fixed to the top of the transmission rod (1811), an L-shaped extrusion block (1815) passes through the fixed plate (1810), a hinged rod (1814) is hinged on the L-shaped extrusion block (1815), and the end of the hinged rod (1814) away from the L-shaped extrusion block (1815) is hinged to the top of the transmission block (1812).

6. The semiconductor chip packaging equipment with convenient loading according to claim 5, characterized in that: A return spring (1813) is fixed to the bottom of the transmission block (1812), and the bottom of the return spring (1813) is fixed to the top of the baffle (1805).

7. The semiconductor chip packaging equipment with convenient loading according to claim 6, characterized in that: The collecting assembly comprises a fixed rod (1901), a movable rod (1902), a connecting block (1903), a collecting box (1904), a guide rod (1905), a connecting spring (1906), a push rod (1908), a push block (1907), an inclined rod (1909) and a sealing plate (1910); the fixed rod (1901) is fixed to the top of the dust collecting box (1809), the connecting block (1903) is slidably mounted on the inner bottom of the fixed frame (3), the movable rod (1902) is hinged on the connecting block (1903), one end of the movable rod (1902) away from the connecting block (1903) is hinged to the top of the fixed rod (1901), the collecting box (1904) is fixed to the side of the connecting block (1903) away from the movable rod (1902), and the sealing plate (1910) is slidably mounted on the top of the collecting box (1904).

8. The semiconductor chip packaging equipment with convenient loading according to claim 7, characterized in that: A guide rod (1905) passes through the connecting block (1903), a push block (1907) is fixed to the end point of the guide rod (1905), a connecting spring (1906) is fixed to the side wall of the pushing block (1907), a side of the connecting spring (1906) away from the pushing block (1907) is fixed to the side wall of the connecting block (1903), a push rod (1908) is fixed to the side wall of the pushing block (1907), an end of the push rod (1908) away from the pushing block (1907) is hinged to an inclined rod (1909), and an end of the inclined rod (1909) away from the push rod (1908) is hinged to a sealing plate (1910).

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