LED packaging structure and packaging method
By optimizing the functional area distribution of the package bracket and the fifth functional area of the cross-shaped structure in the LED packaging structure, the problem of poor display effect of traditional RGB LED lamp beads is solved, and the low power consumption and high color purity LED lamp beads are realized Display effect.
Patent Information
- Application Number
- CN202411790550.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-02-18
AI Technical Summary
The display effect of traditional RGB LED lamp beads is not delicate enough, especially when displaying black and yellow, the color purity is not high, and the power consumption is large when displaying white, and the color gamut and saturation are poor.
Adopt an optimized LED packaging structure, including LED light emitting unit, packaging glue and packaging bracket. Multiple functional areas and fifth functional areas with cross-shaped structures are set on the packaging bracket to increase the crystal solid area and spacing of the chip to improve the heat dissipation effect. .
It realizes the low-power consumption and high color purity display of LED lamp beads, improving the heat dissipation performance and display effect.
Smart Images
Figure CN119480867A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of LED packaging, and in particular to an LED packaging structure and a packaging method. Background Art
[0002] LED display screen controls the display mode of semiconductor light emitting diodes to display various information such as text, graphics, images, animations, videos, and video signals. It integrates microelectronics technology, computer technology, and information processing, and has the advantages of bright colors, wide dynamic range, high brightness, high clarity, low operating voltage, low power consumption, long life, impact resistance, and stable and reliable operation.
[0003] The LED display is made of PCB modules, and the front of the PCB module is made of LED lamp beads. The clarity, picture detail, and minimum power consumption of the LED display are all determined by the LED lamp beads. The display effect of traditional RGB LED lamp beads is not delicate enough, especially when displaying black and yellow, the color purity is not high. In addition, when displaying white, RGB needs to be lit at the same time, which consumes more power and has poor color gamut and saturation. Summary of the invention
[0004] The technical problem to be solved by the present invention is to provide an LED packaging structure and a packaging method, which optimizes the LED packaging structure and obtains an LED lamp bead with low power consumption and high display color purity.
[0005] In order to solve the above problems, the present invention discloses an LED packaging structure, including an LED light-emitting unit, a packaging glue and a packaging bracket;
[0006] The LED light-emitting unit comprises a plurality of light-emitting chips, and the plurality of light-emitting chips are arranged on the packaging bracket;
[0007] The packaging glue at least covers the LED light-emitting unit;
[0008] The packaging bracket includes a bracket body and a plurality of functional areas arranged on the front side of the bracket body, the plurality of functional areas include a first functional area, a second functional area, a third functional area, a fourth functional area and a fifth functional area arranged at intervals, the fifth functional area includes a central area and an extension area extending outward from the central area in at least four directions, the first functional area, the second functional area, the third functional area and the fourth functional area are arranged around the fifth functional area in a counterclockwise direction.
[0009] As an improvement of the above technical solution, the fifth functional zone is a cross-shaped structure, and the extension zone includes a first extension zone, a second extension zone, a third extension zone and a fourth extension zone. The first extension zone is located between the fourth functional zone and the first functional zone, the second extension zone is located between the first functional zone and the second functional zone, the third extension zone is located between the second functional zone and the third functional zone, and the fourth extension zone is located between the third functional zone and the fourth functional zone.
[0010] As an improvement of the above technical solution, the first extension area is used to place the first chip, the second extension area is used to place the second chip, the third extension area is used to place the third chip, and the fourth extension area is used to place the fourth chip;
[0011] The two electrodes of the first chip are electrically connected to the first functional area and the fifth functional area respectively;
[0012] The two electrodes of the second chip are electrically connected to the second functional area and the fifth functional area respectively;
[0013] The two electrodes of the third chip are electrically connected to the third functional area and the fifth functional area respectively;
[0014] The two electrodes of the fourth chip are electrically connected to the fourth functional area and the fifth functional area respectively;
[0015] The first chip is a red light chip, the second chip is a green light chip, the third chip is a blue light chip, and the fourth chip is a yellow light chip.
[0016] As an improvement of the above technical solution, the first functional area, the second functional area, the third functional area and the fourth functional area have the same shape and are centrally symmetrically distributed.
[0017] As an improvement of the above technical solution, the ratio of the area of the fifth functional area to the sum of the areas of the first functional area, the second functional area, the third functional area, and the fourth functional area is 1:(0.6-1); and / or
[0018] The ratio of the area of the fifth functional area to the area of the first functional area is 1:(0.15-0.25); and / or
[0019] The ratio of the area of the fifth functional area to the area of the second functional area is 1:(0.15-0.25); and / or
[0020] The ratio of the area of the fifth functional area to the area of the third functional area is 1:(0.15-0.25); and / or
[0021] The ratio of the area of the fifth functional zone to the area of the fourth functional zone is 1:(0.15-0.25).
[0022] As an improvement of the above technical solution, the ratio of the distance between the fifth functional area and the first functional area to the width of the first extension area is 1:(3-4); and / or
[0023] The ratio of the distance between the fifth functional area and the second functional area to the width of the second extension area is 1:(3-4); and / or
[0024] The ratio of the distance between the fifth functional area and the third functional area to the width of the third extension area is 1:(3-4); and / or
[0025] The ratio of the distance between the fifth functional area and the fourth functional area to the width of the fourth extension area is 1:(3-4).
[0026] As an improvement of the above technical solution, each of the first functional area, the second functional area, the third functional area, the fourth functional area and the fifth functional area is provided with a functional pin extending to the back side of the bracket body.
[0027] As an improvement of the above technical solution, centers of the first chip and the third chip are located on the same horizontal line; and / or
[0028] Centers of the second chip and the fourth chip are located on the same vertical line.
[0029] As an improvement of the above technical solution, the first chip is a vertical red light chip, the second chip is a vertical green light chip, the third chip is a vertical blue light chip, and the fourth chip is a vertical yellow light chip;
[0030] One electrode of the first chip is fixed to the fifth functional area and electrically connected to the fifth functional area, and the other electrode is electrically connected to the first functional area via a bonding wire;
[0031] The two electrodes of the second chip are electrically connected to the second functional area and the fifth functional area through bonding wires respectively;
[0032] The two electrodes of the third chip are electrically connected to the third functional area and the fifth functional area through bonding wires respectively;
[0033] The two electrodes of the fourth chip are electrically connected to the fourth functional area and the fifth functional area through bonding wires respectively.
[0034] Correspondingly, the present invention also discloses a LED packaging method for forming the above-mentioned LED packaging structure, comprising the following steps:
[0035] Fixing the plurality of light-emitting chips respectively on the fifth functional area of the packaging bracket;
[0036] Electrically connecting two electrodes of the plurality of light-emitting chips to corresponding functional areas respectively;
[0037] The packaging glue is injected to cover the light-emitting chip to obtain an LED lamp bead.
[0038] The implementation of the present invention has the following beneficial effects:
[0039] The LED packaging structure provided by the present invention optimizes the distribution and structure of the functional areas. The functional areas include a first functional area, a second functional area, a third functional area, a fourth functional area and a fifth functional area that are arranged at intervals. The fifth functional area includes a central area and an extension area. The setting of the extension area increases the die-bonding area of the chip, the distance between the chips is increased, the heat dissipation effect of the lamp beads is better, and the low power consumption and high color purity display of the LED lamp beads are achieved in combination with the setting of the chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] Figure 1 It is a schematic diagram of a top view of an RGB LED packaging structure in the prior art;
[0041] Figure 2 is a schematic diagram of a top view of a packaging bracket provided by an embodiment of the present invention;
[0042] Figure 3 is a schematic diagram of a top view of an LED packaging structure provided by an embodiment of the present invention;
[0043] Figure 4 is a bottom-up structural schematic diagram of an LED packaging structure provided by an embodiment of the present invention;
[0044] Figure 5 It is a schematic cross-sectional structure diagram of an LED packaging structure provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0045] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in further detail below.
[0046] See also Figure 1 , Figure 1The top view of the structure of the conventional RGB LED packaging structure includes a first functional area 11', a second functional area 12', a third functional area 13' and a fourth functional area 14'. The first functional area 11' and the second functional area 12' are arranged on the left side of the fourth functional area 14', and the third functional area 13' is arranged at the upper right corner of the fourth functional area 14'. The red light chip 21', the second chip 22' and the third chip 23' are arranged in a straight line on the fourth functional area 14'. With this packaging structure, the area of the fourth functional area 14' for solid crystal is small, and the distance between the red light chip 21', the second chip 22' and the third chip 23' is close, which is not conducive to the heat dissipation of the lamp beads, and the red light chip 21', the second chip 22' and the third chip 23' are difficult to achieve high-purity yellow and gold display; in addition, when displaying white, the red light chip 21', the second chip 22' and the third chip 23' need to be lit at the same time in a certain ratio, and the power required for lighting is relatively high.
[0047] See also Figure 2 to Figure 5 , the present invention provides an LED packaging structure, including a packaging bracket 1, an LED light-emitting unit 2 and a packaging glue 3;
[0048] The LED light emitting unit 2 includes a plurality of chips, and the plurality of chips are arranged on the packaging bracket 1;
[0049] The packaging glue 3 at least covers the LED light-emitting unit 2;
[0050] See also Figure 2 The packaging bracket 1 includes a bracket body 1 and a plurality of functional areas arranged on the front side of the bracket body 1, the plurality of functional areas include a first functional area 11, a second functional area 12, a third functional area 13, a fourth functional area 14 and a fifth functional area 15 arranged at intervals, the fifth functional area 15 includes a central area 150 and an extension area extending outward from the central area 150 in at least four directions, the first functional area 11, the second functional area 12, the third functional area 13 and the fourth functional area 14 are arranged around the fifth functional area 15 in a counterclockwise direction.
[0051] In a preferred embodiment, the fifth functional area 15 is a cross-shaped structure, and the extension area includes a first extension area 151, a second extension area 152, a third extension area 153, and a fourth extension area 154. The first extension area 151 is located between the fourth functional area 14 and the first functional area 11, the second extension area 152 is located between the first functional area 11 and the second functional area 12, the third extension area 153 is located between the second functional area 12 and the third functional area 13, and the fourth extension area 154 is located between the third functional area 13 and the fourth functional area 14. It can be understood that the fifth functional area 15 is divided into the first extension area 151, the second extension area 152, the third extension area 153, and the fourth extension area 154, which respectively provide die-bonding areas for the light-emitting chips, increase the area of the die-bonding area, and the light-emitting chips do not need to be concentrated in a smaller die-bonding area, thereby improving the heat dissipation performance.
[0052] Specifically, the first extension area 151 is used to place the first chip 21, the second extension area 152 is used to place the second chip 22, the third extension area 153 is used to place the third chip 23, and the fourth extension area 154 is used to place the fourth chip 24;
[0053] The two electrodes of the first chip 21 are electrically connected to the first functional area 11 and the fifth functional area 15 respectively;
[0054] The two electrodes of the second chip 22 are electrically connected to the second functional area 12 and the fifth functional area 15 respectively;
[0055] The two electrodes of the third chip 23 are electrically connected to the third functional area 13 and the fifth functional area 15 respectively;
[0056] The two electrodes of the fourth chip 24 are electrically connected to the fourth functional area 14 and the fifth functional area 15 respectively;
[0057] In one embodiment, the first chip 21 is a red chip, the second chip 22 is a green chip, the third chip 23 is a blue chip, and the fourth chip 24 is a yellow chip. That is to say, the red chip 21, the second chip 22, the third chip 23 and the fourth chip 24 are respectively arranged on the four corners of the fifth functional area 15. On the one hand, the distance between the fifth functional area 15 and the other four functional areas can be shortened, thereby shortening the length of the bonding wire connecting the light-emitting chip to the functional area. On the other hand, the distance between the red chip 21, the second chip 22, the third chip 23 and the fourth chip 24 is increased, which can improve the heat dissipation capacity and ensure the reliability of the packaging structure.
[0058] In a preferred embodiment, the centers of the first chip 21 and the third chip 23 are located on the same horizontal line. In a preferred embodiment, the centers of the second chip 22 and the fourth chip 24 are located on the same vertical line. Such an arrangement can improve the symmetry of the arrangement of the light-emitting chip, thereby improving the light-emitting effect.
[0059] Specifically, the first functional area 11, the second functional area 12, the third functional area 13, the fourth functional area 14 and the fifth functional area 15 are each provided with a functional pin extending to the back of the bracket body 1. The setting of the functional pins can realize the lighting of different functional areas respectively, and is also conducive to sufficient welding in subsequent production. Specifically, the first functional area 11, the second functional area 12, the third functional area 13, the fourth functional area 14 and the fifth functional area 15 are respectively provided with a first functional pin 111, a second functional pin 121, a third functional pin 131, a fourth functional pin 141 and a fifth functional pin 155.
[0060] In a preferred embodiment, the first chip 21 is a vertical red light chip, the second chip 22 is a vertical green light chip, the third chip 23 is a vertical blue light chip, and the fourth chip 24 is a vertical yellow light chip. Specifically, one electrode of the first chip 21 is fixed to the fifth functional area 15 and electrically connected to the fifth functional area 15, and the other electrode is electrically connected to the first functional area 11 through a bonding wire. Specifically, the first chip 21 is fixed to the fifth functional area 15 through silver glue, and the first chip 21 is connected to the fifth functional area 15 through the silver glue, and then connected to the first functional area 11 through a bonding wire and electrically connected to the outside world through the functional pin of the first functional area 11, thereby reducing the bonding wires required to conduct the first functional area 11 and the fifth functional area 15. The two electrodes of the second chip 22 are electrically connected to the second functional area 12 and the fifth functional area 15 respectively through bonding wires. The two electrodes of the third chip 23 are electrically connected to the third functional area 13 and the fifth functional area 15 respectively through bonding wires. The two electrodes of the fourth chip 24 are electrically connected to the fourth functional area 14 and the fifth functional area 15 through bonding wires. That is to say, the function pin of the fifth functional area 15 is the common pole of the red light chip 21, the second chip 22, the third chip 23 and the fourth chip 24, which can be a common anode or a cathode. Preferably, the function pin of the fifth functional area 15 is a common cathode, and correspondingly, the function pins of the first functional area 11, the second functional area 12, the third functional area 13 and the fourth functional area 14 are respectively a red light anode, a green light anode, a blue light anode and a yellow light anode. Therefore, it is only necessary to control the conduction of the function pins of the first functional area 11, the second functional area 12, the third functional area 13 and the fourth functional area 14 to individually control the lighting of the red light chip 21, the second chip 22, the third chip 23 and the fourth chip 24.
[0061] In a preferred embodiment, the first functional area 11, the second functional area 12, the third functional area 13 and the fourth functional area 14 have the same shape and are centrally symmetrically distributed, thereby improving the preparation efficiency of the functional areas.
[0062] In a preferred embodiment, the ratio of the area of the fifth functional area 15 to the total area of the first functional area 11, the second functional area 12, the third functional area 13, and the fourth functional area 14 is 1:(0.6-1), ensuring sufficient die-bonding area while achieving electrical connection between different chips.
[0063] More preferably, the ratio of the area of the fifth functional area 15 to the area of the first functional area 11 is 1:(0.15-0.25). Preferably, the ratio of the area of the fifth functional area 15 to the area of the second functional area 12 is 1:(0.15-0.25). Preferably, the ratio of the area of the fifth functional area 15 to the area of the third functional area 13 is 1:(0.15-0.25). Preferably, the ratio of the area of the fifth functional area 15 to the area of the fourth functional area 14 is 1:(0.15-0.25). By limiting the ratio of the area of the fifth functional area 15 to the first functional area 11, the second functional area 12, the third functional area 13 and the fourth functional area 14, the electrical connection effect of each functional area is guaranteed.
[0064] More preferably, the ratio of the spacing l1 between the fifth functional area 15 and the first functional area 11 to the width L1 of the first extension area 151 is 1:(3~4). Preferably, the ratio of the spacing l2 between the fifth functional area 15 and the second functional area 12 to the width L2 of the second extension area 152 is 1:(3~4). Preferably, the ratio of the spacing l3 between the fifth functional area 15 and the third functional area 13 to the width L3 of the third extension area 153 is 1:(3~4). Preferably, the ratio of the spacing l4 between the fifth functional area 15 and the fourth functional area 14 to the width L4 of the fourth extension area 154 is 1:(3~4). By controlling the spacing between different functional areas, it is possible to avoid the conductive glue from being thrown onto the corners during the solid crystal operation, thereby causing a hidden short circuit between two adjacent functional areas during the process.
[0065] In addition, the LED packaging bracket 1 further includes a glue cup 4 arranged on the front side of the bracket body, and a packaging cavity is formed between the glue cup and the bracket body for better packaging the LED light-emitting unit.
[0066] Correspondingly, the present invention also provides an LED packaging method for forming the above-mentioned LED packaging structure, comprising the following steps:
[0067] (1) fixing a plurality of light-emitting chips on the fifth functional area respectively;
[0068] Specifically, in one embodiment, the first chip, the second chip, the third chip and the fourth chip are fixed on the first extension area, the second extension area, the third extension area and the fourth extension area respectively, the first chip is a vertical red light chip, the second chip is a positive green light chip, the third chip is a positive blue light chip, and the fourth chip is a positive yellow light chip. Silver glue is used to fix the cathode of the vertical red light chip to the first extension area, and insulating glue is used to fix the positive green light chip, the positive blue light chip and the positive yellow light chip on the second extension area, the third extension area and the fourth extension area respectively.
[0069] (2) electrically connecting two electrodes of the plurality of light-emitting chips to corresponding functional areas respectively;
[0070] Specifically, in one embodiment, the positive electrode of the vertical red light chip is electrically connected to the first functional area through a bonding wire, the negative electrode of the upright green light chip is electrically connected to the fifth functional area through a bonding wire, the positive electrode is electrically connected to the second functional area, the negative electrode of the upright blue light chip is electrically connected to the fifth functional area through a bonding wire, the positive electrode is electrically connected to the third functional area, the negative electrode of the upright yellow light chip is electrically connected to the fifth functional area through a bonding wire, and the positive electrode is electrically connected to the fourth functional area.
[0071] (3) Inject packaging glue and cover the light-emitting chip to obtain an LED lamp bead.
[0072] Specifically, a packaging glue is injected into the packaging cavity to cover the first chip, the second chip, the third chip and the fourth chip. The material of the packaging glue can be epoxy packaging glue, silicone packaging glue, polyurethane packaging glue or ultraviolet light curing packaging glue, etc., without specific limitation.
[0073] The above is a preferred embodiment of the invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the invention. These improvements and modifications are also considered to be within the scope of protection of the invention.
Claims
1. An LED packaging structure, characterized in that: It includes LED light-emitting unit, packaging glue and packaging bracket; The LED light-emitting unit comprises a plurality of light-emitting chips, and the plurality of light-emitting chips are arranged on the packaging bracket; The packaging glue at least covers the LED light-emitting unit; The packaging bracket includes a bracket body and a plurality of functional areas arranged on the front side of the bracket body, the plurality of functional areas include a first functional area, a second functional area, a third functional area, a fourth functional area and a fifth functional area arranged at intervals, the fifth functional area includes a central area and an extension area extending outward from the central area in at least four directions, the first functional area, the second functional area, the third functional area and the fourth functional area are arranged around the fifth functional area in a counterclockwise direction.
2. The LED packaging structure according to claim 1, characterized in that: The fifth functional zone is a cross-shaped structure, and the extension zone includes a first extension zone, a second extension zone, a third extension zone and a fourth extension zone. The first extension zone is located between the fourth functional zone and the first functional zone, the second extension zone is located between the first functional zone and the second functional zone, the third extension zone is located between the second functional zone and the third functional zone, and the fourth extension zone is located between the third functional zone and the fourth functional zone.
3. The LED packaging structure according to claim 1, characterized in that: The first extension area is used to place the first chip, the second extension area is used to place the second chip, the third extension area is used to place the third chip, and the fourth extension area is used to place the fourth chip; The two electrodes of the first chip are electrically connected to the first functional area and the fifth functional area respectively; The two electrodes of the second chip are electrically connected to the second functional area and the fifth functional area respectively; The two electrodes of the third chip are electrically connected to the third functional area and the fifth functional area respectively; The two electrodes of the fourth chip are electrically connected to the fourth functional area and the fifth functional area respectively; The first chip is a red light chip, the second chip is a green light chip, the third chip is a blue light chip, and the fourth chip is a yellow light chip.
4. The LED packaging structure according to claim 1, characterized in that: The first functional area, the second functional area, the third functional area and the fourth functional area have the same shape and are centrally symmetrically distributed.
5. The LED packaging structure according to claim 1, characterized in that: The ratio of the area of the fifth functional area to the sum of the areas of the first functional area, the second functional area, the third functional area and the fourth functional area is 1:(0.6-1); and / or The ratio of the area of the fifth functional area to the area of the first functional area is 1:(0.15-0.25); and / or The ratio of the area of the fifth functional area to the area of the second functional area is 1:(0.15-0.25); and / or The ratio of the area of the fifth functional area to the area of the third functional area is 1:(0.15-0.25); and / or The ratio of the area of the fifth functional zone to the area of the fourth functional zone is 1:(0.15-0.25).
6. The LED packaging structure according to claim 2, characterized in that: The ratio of the distance between the fifth functional area and the first functional area to the width of the first extension area is 1:(3-4); and / or The ratio of the distance between the fifth functional area and the second functional area to the width of the second extension area is 1:(3-4); and / or The ratio of the distance between the fifth functional area and the third functional area to the width of the third extension area is 1:(3-4); and / or The ratio of the distance between the fifth functional area and the fourth functional area to the width of the fourth extension area is 1:(3-4).
7. The LED packaging structure according to claim 1, characterized in that: The first functional area, the second functional area, the third functional area, the fourth functional area and the fifth functional area are each provided with a functional pin extending to the back side of the bracket body.
8. The LED packaging structure according to claim 3, characterized in that: Centers of the first chip and the third chip are located on the same horizontal line; and / or Centers of the second chip and the fourth chip are located on the same vertical line.
9. The LED packaging structure according to claim 3, characterized in that: The first chip is a vertical red light chip, the second chip is a vertical green light chip, the third chip is a vertical blue light chip, and the fourth chip is a vertical yellow light chip; One electrode of the first chip is fixed to the fifth functional area and electrically connected to the fifth functional area, and the other electrode is electrically connected to the first functional area via a bonding wire; The two electrodes of the second chip are electrically connected to the second functional area and the fifth functional area through bonding wires respectively; The two electrodes of the third chip are electrically connected to the third functional area and the fifth functional area through bonding wires respectively; The two electrodes of the fourth chip are electrically connected to the fourth functional area and the fifth functional area through bonding wires respectively.
10. A method for packaging an LED, for forming the LED packaging structure according to any one of claims 1 to 9, characterized in that: The following steps are involved: Fixing the plurality of light-emitting chips respectively on the fifth functional area of the packaging bracket; Electrically connecting two electrodes of the plurality of light-emitting chips to corresponding functional areas respectively; The packaging glue is injected to cover the light-emitting chip to obtain an LED lamp bead.