Cooling heat sink device for high-power semiconductor laser chip

Abstract

The invention discloses a cooling heat sink device for a high-power semiconductor laser chip, and relates to the technical field of photoelectron heat dissipation and packaging. The heat sink comprises a lower heat sink which is provided with a first end and a second end which are oppositely arranged, and a water cooling channel is formed in the lower heat sink; the laser chip is fixed at the top of the lower heat sink corresponding to the water cooling channel, and the light emitting direction of the laser chip is arranged along the directions of the first end and the second end of the lower heat sink; the supporting seat is fixed at the top of the lower heat sink and corresponds to one side of the laser chip; the upper heat sink is fixed to the top of the supporting base, an air cooling channel is formed in the upper heat sink, and the air outlet end of the air cooling channel corresponds to the top face of the laser chip. Air is blown to the top surface of the laser chip through the air cooling channel to take away heat at the top of the laser chip, and the water cooling channel is close to the bottom surface of the laser chip to take away heat at the bottom of the laser chip, so that uniform heat dissipation of all parts of the chip is ensured, and the output power and the service life of the laser chip are prevented from being influenced by uneven temperature.

Description

Technical Field

[0001] The invention relates to the technical field of optoelectronic heat dissipation and packaging, and more particularly to a cooling heat sink device for a high-power semiconductor laser chip. Background Art

[0002] In the existing semiconductor laser heat sink technology, the use of inert gas heat dissipation is not considered, and most of the heat dissipation structures use the unbonded electrode surface of the laser core and the traditional water-cooled microchannel heat sink for soldering and packaging. The heat dissipation function is achieved through the contact between this surface and the heat sink, while the bonded electrode surface opposite to it is only exposed to the air and can only dissipate heat through heat conduction, and cannot dissipate heat through direct contact with the heat sink. Therefore, the heat dissipation efficiency of the area closer to the bonded electrode surface is obviously inferior to that of the area closer to the heat sink, which can easily cause uneven heat dissipation and temperature distribution in the upper and lower areas and surfaces of the laser core, thereby affecting the output power and life of the chip. Summary of the invention

[0003] In view of this, the present invention aims to provide a cooling heat sink device for a high-power semiconductor laser chip to at least to some extent solve the problem of uneven heat dissipation and temperature distribution in the upper and lower areas and on the surface of the laser core in the prior art, thereby affecting the output power and life of the chip.

[0004] In order to achieve the above object, the present invention adopts the following technical solution:

[0005] A cooling heat sink device for a high-power semiconductor laser chip, comprising:

[0006] A lower heat sink, wherein the lower heat sink has a first end and a second end that are arranged opposite to each other and a water cooling channel is provided inside the lower heat sink;

[0007] A laser chip, wherein the laser chip is fixed on the top of the lower heat sink corresponding to the water cooling channel, and the light emitting direction of the laser chip is arranged along the first end and the second end of the lower heat sink;

[0008] A support seat, the support seat is fixed on the top of the lower heat sink and corresponds to one side of the laser chip;

[0009] An upper heat sink is fixed on the top of the support seat and has an air cooling channel inside, wherein the air outlet end of the air cooling channel corresponds to the top surface of the laser chip.

[0010] The beneficial effects that can be achieved by the present invention are as follows: the air cooling channel blows air toward the top surface of the laser chip to take away the heat from the top of the laser chip, and the water cooling channel is close to the bottom surface of the laser chip to take away the heat from the bottom of the laser chip, thereby ensuring uniform heat dissipation between the upper and lower areas of the chip and preventing uneven temperature from affecting the output power and life of the laser chip.

[0011] Preferably, the water cooling channel is a spiral channel.

[0012] Preferably, the air cooling channel includes a first air cooling channel and a second air cooling channel, the first air cooling channel is arranged along the first end and the second end of the lower heat sink and is opened inside the upper heat sink, and its air inlet end passes through the side wall of the upper heat sink close to the first end of the lower heat sink; the second air cooling channel is arranged perpendicular to the first air cooling channel and the air inlet end is connected to the air outlet end of the first air cooling channel, and the air outlet end is inclined downward and passes through the bottom wall of the upper heat sink to blow air toward the top surface of the laser chip.

[0013] Preferably, the second air-cooling channel includes a plurality of first air-cooling channels and a plurality of second air-cooling channels alternately arranged along the first end and the second end of the lower heat sink, and the air inlet ends of the first air-cooling channels and the second air-cooling channels are connected to the air outlet end of the first air-cooling channel, and the air outlet ends respectively correspond to the two sides of the top surface of the laser chip arranged along the direction perpendicular to the first end and the second end of the lower heat sink.

[0014] Preferably, the upper heat sink and the lower heat sink are both made of oxygen-free copper.

[0015] Preferably, the support seat is made of insulating material.

[0016] Preferably, outer surfaces of the upper heat sink and the lower heat sink are coated with a gold layer.

[0017] Preferably, a gold-tin solder layer is further provided, and the gold-tin solder layer is arranged on the top of the gold layer above the water-cooling channel, and the laser chip is soldered on the top of the gold-tin solder layer.

[0018] Preferably, a dust removal air duct is also provided, which is opened in the lower heat sink below the water cooling channel, with its air inlet end connected to the air supply equipment, and the air outlet end is inclined upward and passes through the end face of the second end of the lower heat sink to correspond to the light emitting surface of the laser chip.

[0019] Preferably, the dust removal air duct includes a first dust removal air duct and a plurality of second dust removal air ducts, the first dust removal air duct is arranged along the direction of the first end and the second end of the lower heat sink and is opened inside the lower heat sink corresponding to below the water cooling channel, and its air inlet end passes through the end face of the first end of the lower heat sink and is connected to the air supply equipment; the plurality of second dust removal air ducts are arranged at intervals along the direction perpendicular to the first end and the second end of the lower heat sink, and the air inlet end of each of the second dust removal air ducts is connected to the air outlet end of the first dust removal air duct, and the air outlet end is inclined upward and passes through the end face of the second end of the lower heat sink to correspond to the light emitting surface of the laser chip.

[0020] It can be seen from the above technical solutions that, compared with the prior art, the present invention discloses a cooling heat sink device for a high-power semiconductor laser chip, which has the following beneficial effects:

[0021] 1. The air cooling channel blows inert gas to the top surface of the laser chip to take away the heat from the top of the laser chip and prevent dust from adhering. The water cooling channel is close to the bottom surface of the laser chip to take away the heat from the bottom of the laser chip, ensuring uniform heat dissipation between the upper and lower areas of the chip to prevent uneven temperature from affecting the output power and life of the laser chip.

[0022] 2. The water cooling channel is a spiral channel, and the water cooling channel is arranged close to the laser chip, which is conducive to quickly taking away the heat generated by the laser chip, avoiding heat accumulation, and enhancing the heat dissipation effect.

[0023] 3. The inert gas blown out from the dust removal air duct in the lower heat sink is blown in front of the light-emitting surface of the laser chip and on the light-emitting path, which is used to protect the light-emitting surface of the laser chip and eliminate the interference and adhesion of tiny particles in the air in the light-emitting direction of the laser chip.

[0024] 4. The support seat and bolts are made of insulating materials, which have the properties of fixing, heat dissipation and insulation, making it easy to disassemble and assemble the upper and lower heat sinks. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0026] Figure 1 The present invention is a schematic structural diagram at one angle of a cooling heat sink device for a high-power semiconductor laser chip provided by the present invention.

[0027] Figure 2 This is a schematic structural diagram from another angle of a cooling heat sink device for a high-power semiconductor laser chip provided by the present invention.

[0028] Figure 3 This is a schematic diagram of a top perspective structure of a lower heat sink provided by the present invention.

[0029] Figure 4 This is a schematic diagram of the front perspective structure of the lower heat sink provided by the present invention.

[0030] Figure 5 This is a schematic diagram of the front perspective structure of the upper heat sink provided by the present invention.

[0031] Figure 6This is a schematic diagram of a top perspective structure of an upper heat sink provided by the present invention.

[0032] Figure 7 This is a schematic diagram of the cross-sectional structure of the lower heat sink provided by the present invention.

[0033] In the figure: 1. lower heat sink, 11. first end, 12. second end, 13. water-cooling channel, 14. dust removal air duct, 141. first dust removal air duct, 142. second dust removal air duct, 15. threaded hole, 2. laser chip, 3. support seat, 4. upper heat sink, 41. air-cooling channel, 411. first air-cooling channel, 412. second air-cooling channel, 4121. first air-cooling channel, 4122. second air-cooling channel, 5. bolt, 6. gold layer, 7. gold-tin solder layer. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In the description of the present invention, it is necessary to understand that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] Embodiment 1:

[0038] See also Figure 1-Figure 7 The embodiment of the present invention discloses a cooling heat sink device for a high-power semiconductor laser chip, comprising:

[0039] A lower heat sink 1, wherein the lower heat sink 1 has a first end 11 and a second end 12 arranged opposite to each other, and a water cooling channel 13 is provided inside the lower heat sink 1;

[0040] The laser chip 2 is fixed on the top of the lower heat sink 1 at the corresponding water cooling channel 13, and its light emitting direction is arranged along the first end 11 and the second end 12 of the lower heat sink 1;

[0041] A support seat 3, the support seat 3 is fixed on the top of the lower heat sink 1 and corresponds to one side of the laser chip 2;

[0042] The upper heat sink 4 is fixed on the top of the support base 3 and has an air cooling channel 41 inside. The air outlet end of the air cooling channel 41 corresponds to the top surface of the laser chip 2 .

[0043] Among them, the inert gas output by the gas supply equipment is blown toward the top surface of the laser chip 2 through the air cooling channel 41 to take away the heat from the top surface of the laser chip 2. The water cooling channel 13 contacts the bottom of the laser chip 2 to take away the heat from the bottom of the laser chip 2, ensuring uniform heat dissipation in the upper and lower areas of the chip to prevent uneven temperature from affecting the output power and life of the laser chip 2.

[0044] For details, see Figure 3 , Figure 4 The water cooling channel 13 is a spiral channel, which includes a plurality of U-shaped channels connected end to end, and the water inlet and outlet of the channel both penetrate the end surface of the first end 11 of the lower heat sink 1. The water cooling channel 13 is close to the welding surface of the laser chip 2, so that the heat generated by the laser chip 2 can be quickly transferred to avoid heat accumulation.

[0045] For details, see Figure 5-Figure 6 The air-cooling channel 41 includes a first air-cooling channel 411 and a second air-cooling channel 412. The first air-cooling channel 411 is arranged along the first end 11 and the second end 12 of the lower heat sink 1 and is opened inside the upper heat sink 4. Its air inlet end passes through the side wall of the upper heat sink 4 close to the first end 11 of the lower heat sink 1; the second air-cooling channel 412 is arranged perpendicular to the first air-cooling channel 411 and the air inlet end is connected to the air outlet end of the first air-cooling channel 411. The air outlet end is tilted downward and passes through the bottom wall of the upper heat sink 4 to blow air toward the top surface of the laser chip 2.

[0046] More specifically, the second air-cooling channel 412 includes a plurality of first air-cooling channels 4121 and a plurality of second air-cooling channels 4122 that are alternately arranged along the first end 11 and the second end 12 of the lower heat sink 1, and the air inlet ends of the first air-cooling channels 4121 and the second air-cooling channels 4122 are both connected to the air outlet end of the first air-cooling channel 411, and the air outlet ends are inclined downward and correspond to the two sides of the top surface of the laser chip 2 arranged along the first end 11 and the second end 12 of the lower heat sink 1 vertically, so that the top of the laser chip 2 is evenly cooled.

[0047] Specifically, the upper heat sink 4 and the lower heat sink 1 are both made of oxygen-free copper material.

[0048] Specifically, the top surface and the bottom surface of the upper heat sink 4 and the lower heat sink 1 are coated with a gold layer 6 by using a gold spraying process to improve the heat dissipation efficiency of the heat sink.

[0049] Specifically, Figure 7 A gold-tin solder layer 7 is provided on the top of the gold layer 6 above the water-cooling channel 13 , and the laser chip 2 is soldered on the top of the gold-tin solder layer 7 , and the length of the gold-tin solder layer 7 is consistent with the length of the laser chip 2 .

[0050] Specifically, the lower heat sink 1 and the support seat 3, and the support seat 3 and the upper heat sink 4 are connected by bolts 5. In a specific embodiment, a threaded hole 15 is provided on the lower heat sink, and the tail end of the bolt 5 passes through the upper heat sink 4 and the support seat 3 in turn and is threadedly connected to the threaded hole 15.

[0051] Specifically, the support base 3 and the bolt 5 are both made of insulating materials. Preferably, the support base 3 is made of AlN ceramic material, and the bolt 5 is a cross pan head screw made of PEEK material.

[0052] Embodiment 2:

[0053] See also Figure 1-Figure 4 When the chip is working, the light-emitting surface is easily disturbed by tiny particles in the air in front and heat easily causes particle adhesion, which in turn affects the beam quality of the chip and the cleanliness and life of the anti-reflection film on the light-emitting surface. Therefore, a dust removal air duct 14 is also provided in this embodiment. The dust removal air duct 14 is opened in the lower heat sink 1 below the corresponding water cooling channel 13, and its air inlet end is connected to the air supply equipment, and the air outlet end is tilted upward and passes through the end face of the second end 12 of the lower heat sink 1 to correspond to the light-emitting surface of the laser chip 2. The inert gas blown out by the dust removal air duct 14 is used to dissipate the heat from the light-emitting surface of the laser chip 2 and take away the tiny particles in the air in front of the light-emitting surface.

[0054] Specifically, the dust removal air duct 14 includes a first dust removal air duct 141 and a plurality of second dust removal air ducts 142. The first dust removal air duct 141 is arranged along the direction between the first end 11 and the second end 12 of the lower heat sink 1 and is opened inside the lower heat sink 1 below the corresponding water cooling channel 13, and its air inlet end passes through the end face of the first end 11 of the lower heat sink 1; the plurality of second dust removal air ducts 142 are arranged at intervals along the direction vertical to the first end 11 and the second end 12 of the lower heat sink 1, and the air inlet end of each second dust removal air duct 142 is connected to the air outlet end of the first dust removal air duct 141, and the air outlet end is tilted upward to pass through the end face of the second end 12 of the lower heat sink 1, so that the air outlet direction of the dust removal air duct 14 passes through the front area and the light emitting path of the light emitting surface of the laser chip 2, thereby blowing away the tiny particles in the air on the path in front of the light emitting surface of the laser chip 2, preventing the light emitting effect from being affected and avoiding the particles from adhering to the laser chip.

[0055] The present invention provides a cooling heat sink device for a high-power semiconductor laser chip. The water cooling channel 13 can be used to cool the welding surface at the bottom of the laser chip 2. The air cooling channel 41 in the upper heat sink 4 can also be used to blow inert gas to the bonding electrode surface at the top of the laser chip 2 to cool it. The dust removal air channel 14 can be used to dissipate the heat from the light-emitting surface of the laser chip 2 and purify the air in front of it, thereby achieving better protection of the electrode and heat dissipation effects, preventing the device surface from oxidizing, indoor dust from adhering to the cavity surface, and eliminating interference from tiny particles in the air in the light-emitting direction of the device and pollution of the light-emitting surface. The heat sink device of the present invention is suitable for bare testing and tube-shell packaging of any current semiconductor laser, especially single-die and bar strips of quantum cascade lasers.

[0056] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0057] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling heat sink device for a high-power semiconductor laser chip, characterized in that: include: A lower heat sink (1), the lower heat sink (1) having a first end (11) and a second end (12) arranged opposite to each other, and a water cooling channel (13) provided inside the lower heat sink; A laser chip (2), the laser chip (2) being fixed on the top of the lower heat sink (1) corresponding to the water cooling channel (13), and the light emitting direction of the laser chip (2) being arranged along the first end (11) and the second end (12) of the lower heat sink (1); A support seat (3), the support seat (3) being fixed on the top of the lower heat sink (1) and corresponding to one side of the laser chip (2); An upper heat sink (4), wherein the upper heat sink (4) is fixed on the top of the support seat (3) and an air cooling channel (41) is provided inside the upper heat sink, wherein the air inlet end of the air cooling channel (41) is connected to an air supply device, and the air outlet end corresponds to the top surface of the laser chip (2).

2. A cooling heat sink device for a high-power semiconductor laser chip according to claim 1, characterized in that: The water cooling channel (13) is a spiral channel.

3. A cooling heat sink device for a high-power semiconductor laser chip according to claim 1, characterized in that: The air cooling channel (41) comprises a first air cooling channel (411) and a second air cooling channel (412); the first air cooling channel (411) is arranged along the first end (11) and the second end (12) of the lower heat sink (1) and is opened inside the upper heat sink (4); its air inlet end passes through the side wall of the upper heat sink (4) close to the first end (11) of the lower heat sink (1); the second air cooling channel (412) is arranged perpendicular to the first air cooling channel (411) and its air inlet end is connected to the air outlet end of the first air cooling channel (411); the air outlet end is arranged to be tilted downward and pass through the bottom wall of the upper heat sink (4) to blow air toward the top surface of the laser chip (2).

4. A cooling heat sink device for a high-power semiconductor laser chip according to claim 3, characterized in that: The second air-cooling channel (412) comprises a plurality of first air-cooling channels (4121) and a plurality of second air-cooling channels (4122) which are alternately arranged in the direction of the first end (11) and the second end (12) of the lower heat sink (1), and the air inlet ends of the first air-cooling channels (4121) and the second air-cooling channels (4122) are both connected to the air outlet end of the first air-cooling channel (411), and the air outlet ends are inclined downward and correspond to the two sides of the top surface of the laser chip (2) which are arranged in the direction perpendicular to the first end (11) and the second end (12) of the lower heat sink (1).

5. A cooling heat sink device for a high-power semiconductor laser chip according to claim 1, characterized in that: The upper heat sink (4) and the lower heat sink (1) are both made of oxygen-free copper.

6. A cooling heat sink device for a high-power semiconductor laser chip according to claim 1, characterized in that: The support seat (3) is made of insulating material.

7. A cooling heat sink device for a high-power semiconductor laser chip according to claim 1, characterized in that: The outer surfaces of the upper heat sink (4) and the lower heat sink (1) are both coated with a gold layer (6).

8. A cooling heat sink device for a high-power semiconductor laser chip according to claim 7, characterized in that: A gold-tin solder layer (7) is also provided, the gold-tin solder layer (7) being arranged on the top of the gold layer (6) above the water cooling channel (13), and the laser chip (2) being soldered on the top of the gold-tin solder layer (7).

9. A cooling heat sink device for a high-power semiconductor laser chip according to any one of claims 1 to 8, characterized in that: A dust removal air duct (14) is also provided. The dust removal air duct (14) is opened in the lower heat sink (1) below the corresponding water cooling channel (13), and its air inlet end is connected to the air supply device, and the air outlet end is inclined upward and passes through the end surface of the second end (12) of the lower heat sink (1) to correspond to the light emitting surface of the laser chip (2).

10. A cooling heat sink device for a high-power semiconductor laser chip according to claim 9, characterized in that: The dust removal air duct (14) comprises a first dust removal air duct (141) and a plurality of second dust removal air ducts (142); the first dust removal air duct (141) is arranged along the direction between the first end (11) and the second end (12) of the lower heat sink (1) and is opened inside the lower heat sink (1) below the corresponding water cooling channel (13); its air inlet end passes through the end face of the first end (11) of the lower heat sink (1) and is connected to an air supply device; the plurality of second dust removal air ducts (142) are arranged at intervals along the direction perpendicular to the first end (11) and the second end (12) of the lower heat sink (1), and the air inlet end of each second dust removal air duct (142) is connected to the air outlet end of the first dust removal air duct (141), and the air outlet end is inclined upward to pass through the end face of the second end (12) of the lower heat sink (1) to correspond to the light emitting surface of the laser chip (2).

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