Photosensitive assembly and camera module thereof

Abstract

The invention discloses a photosensitive component, which comprises a fixed component and a photosensitive component, the at least one retaining assembly is arranged on the fixing assembly; the moving assembly is movably connected with the fixing assembly in the horizontal direction through the maintaining assembly, when the maintaining assembly is in the initial state, the moving assembly is kept in the middle state, and the moving assembly is suitable for bearing the photosensitive chip; the circuit assembly is electrically connected to the moving assembly and the fixed assembly; and the at least two driving assemblies are used for driving the moving assembly to move relative to the fixed assembly, and the at least two driving assemblies are arranged in two opposite side areas of the top side surface of the moving assembly. The driving assemblies are arranged on the two sides of the photosensitive chip in the length direction, so that the width of the photosensitive assembly is reduced, the photosensitive assembly is applied to the camera module, especially a periscopic camera module, and the overall height of the camera module is reduced.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a photosensitive component and a camera module thereof. Background Art

[0002] Electronic devices have gradually become an indispensable social and entertainment tool in people's daily lives, and people's requirements for electronic devices are getting higher and higher. In terms of video, people are increasingly interested in the performance of video anti-shake in order to obtain photos with higher image quality. The increase in the chip image surface can effectively increase the light flux per unit time and further improve the image quality. However, the increase in the chip image surface will be accompanied by the increase in the lens, resulting in an increase in the lens' own weight. Therefore, the driving force and stroke of the common lens anti-shake motor are difficult to meet the demand.

[0003] The principle of photosensitive chip anti-shake technology is similar to that of lens anti-shake. Usually, the photosensitive chip is set on a movable substrate and electrically connected to the movable substrate. The movable substrate is electrically connected to the external circuit through a flexible retainer to achieve electrical connection between the photosensitive chip and the external circuit. During the chip anti-shake process, the movable substrate carries the photosensitive chip to move and pulls and squeezes the flexible retainer. The flexible retainer can deformably electrically connect the movable substrate and the external circuit. With the development of the industry, flexible retainers are no longer limited to flexible movable substrates or lead frames.

[0004] At present, the flexible holder is easily set to have a large rebound force. If the rebound force is large, a larger driving force is required to resist the rebound force. If the rebound force is small, the effect of the flexible holder will be weakened. At the same time, the flexible holder will expand the size of the photosensitive chip, resulting in a larger overall size of the camera module. Designing a flexible holder so that the chip anti-shake has a good anti-shake effect and is as compact as possible is an urgent problem to be solved. Summary of the invention

[0005] An object of the present invention is to provide a photosensitive component, wherein the driving components are arranged on both sides of the length direction of the photosensitive chip to reduce the width of the photosensitive component.

[0006] Another object of the present invention is to provide a photosensitive component that can move and rotate a moving component within a required stroke with a smaller rated driving force.

[0007] Another object of the present invention is to provide a camera module, which can reduce the overall height, reduce the weight, and improve the imaging quality by applying the above-mentioned photosensitive component.

[0008] In order to achieve one of the purposes of the present application, the technical solution adopted by the present invention is: a photosensitive component, which includes: a fixed component; at least one holding component, which is arranged on the fixed component; a moving component, which is movably connected to the fixed component in a horizontal direction through the holding component, and when the holding component is in an initial state, the moving component is maintained in a neutral state, and the moving component is suitable for carrying a photosensitive chip; a circuit component, which is electrically connected to the moving component and the fixed component; at least two driving components to drive the moving component to move relative to the fixed component, and at least two of the driving components are arranged on opposite side areas of the top side surface of the moving component.

[0009] In one embodiment of the present application, the photosensitive chip is arranged on the movable component. In a plane orthogonal to the optical axis of the photosensitive chip, the movable component and the fixed component are arranged opposite to each other, and a gap is maintained between the movable component and the fixed component so that the movable component can move relative to the fixed component. The circuit component is arranged on the peripheral side of the photosensitive chip and is placed horizontally on the gap so as to electrically connect the movable component and the adjacent fixed component.

[0010] In one embodiment of the present application, the driving component further includes at least two driving coils, which are fixed to the top side surface of the moving component and are respectively located on both sides of the photosensitive chip, the fixed component is located between the photosensitive chip and the driving component, one end of the circuit component is connected to the fixed component, and the other end of the circuit component is connected to the side of the moving component opposite to the fixed component.

[0011] In one embodiment of the present application, the retaining component is elastically deformably connected to the moving component from the end of the fixed component, and keeps the moving component in a suspended state.

[0012] In one embodiment of the present application, the movable assembly includes a first movable plate and a second movable plate, and the first movable plate and the second movable plate are relatively arranged in an orthogonal plane to the optical axis of the photosensitive chip to fix the photosensitive chip, and the fixing assembly includes a first fixing plate and a second fixing plate, the first fixing plate is arranged on a side of the first movable plate relatively away from the photosensitive chip, and the second fixing plate is arranged on a side of the second movable plate relatively away from the photosensitive chip, so that the first movable plate, the photosensitive chip and the second movable plate are sequentially arranged between the first fixing plate and the second fixing plate.

[0013] In one embodiment of the present application, the circuit component includes a first flexible portion and a second flexible portion arranged on both sides of the photosensitive chip, the first flexible portion is horizontally placed in the gap between the first movable plate and the first fixed plate, so as to electrically connect the first movable plate and the adjacent first fixed plate, and the second flexible portion is horizontally placed in the gap between the second movable plate and the second fixed plate, so as to electrically connect the second movable plate and the adjacent second fixed plate.

[0014] In one embodiment of the present application, the driving component includes a first driving coil and a second driving coil, and the first driving coil and the second driving coil are arranged on the top side surface of the movable component and are respectively located on both sides of the photosensitive chip, so as to drive the movable component to move in an orthogonal plane to the optical axis of the photosensitive chip.

[0015] In one embodiment of the present application, the driving component also includes a third driving coil, which is eccentrically arranged on at least one side of the photosensitive chip to drive the moving component to rotate in an orthogonal plane to the optical axis of the photosensitive chip.

[0016] In one embodiment of the present application, the driving component also includes a fourth driving coil, the first driving coil and the second driving coil are arranged on opposite sides of the photosensitive chip and are eccentrically arranged respectively, the third driving coil is eccentrically and adjacently arranged on one side of the first driving coil, and the fourth driving coil is eccentrically and adjacently arranged on one side of the second driving coil, so as to drive the moving component to move and rotate in an orthogonal plane to the optical axis of the photosensitive chip.

[0017] In one embodiment of the present application, the retaining assembly further includes a plurality of stop assemblies, wherein the stop assemblies are located in the gap between the moving assembly and the fixed assembly, wherein the stop assemblies include a fixed portion and a movable portion, wherein the movable portion is detachably engaged with the fixed portion, wherein the fixed portion is disposed at one of the moving assembly or the fixed assembly, and wherein the movable portion is disposed at the other of the fixed assembly or the moving assembly, so that the moving assembly can be detachably engaged with the fixed assembly.

[0018] In one embodiment of the present application, the number of the stop assemblies is at least four, wherein the fixed portions of two of the stop assemblies are arranged at intervals on the side of the first fixed plate, and the two movable portions are arranged at intervals on the side of the first movable plate, and are respectively arranged opposite to the fixed portions, and the fixed portions of another two of the stop assemblies are arranged at intervals on the side of the second fixed plate, and the other two movable portions are arranged at intervals on the side of the second movable plate, and are respectively arranged opposite to the fixed portions, so that the movable assembly can move and rotate relative to the fixed assembly within a preset range.

[0019] In one embodiment of the present application, the movable component also includes a third movable plate, which is arranged in the adjacent side direction of the first movable plate and the second movable plate for placing the photosensitive chip, and the fixed component also includes a third fixed plate, which is arranged on a side of the third movable plate relatively away from the photosensitive chip.

[0020] In one embodiment of the present application, the circuit component also includes a third flexure portion, which is located in the adjacent side direction of the first flexure portion and the second flexure portion, and the third flexure portion is horizontally placed in the gap between the third movable plate and the third fixed plate to electrically connect the third movable plate and the adjacent third fixed plate.

[0021] In one embodiment of the present application, the fixed parts of the two stop assemblies are arranged at intervals on the sides of the third fixed plate, and the two movable parts are arranged at intervals on the sides of the third movable plate, and are respectively arranged opposite to the fixed parts, so that the movable assembly can move and rotate relative to the fixed assembly within a preset range.

[0022] In one embodiment of the present application, the photosensitive component also includes at least one reinforcement plate, which is arranged at the bottom of the movable component. The reinforcement plate fixed to the first movable plate extends to the bottom of the first drive coil so that the first drive coil can be placed. The reinforcement plate fixed to the second movable plate extends to the bottom of the second drive coil so that the second drive coil can be placed.

[0023] To achieve another purpose of the present application, the technical solution adopted by the present invention is: a camera module, comprising: at least one reflection component for reflecting incident light, at least one lens component, which is equipped with at least one lens and corresponds to the reflection component; the photosensitive component as described above, the photosensitive component is located in the exit direction of the light path of the lens component, so that the image sensor senses light and forms an image.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] (1) By arranging the driving components on both sides of the photosensitive chip in the length direction, the width of the photosensitive component can be reduced. The photosensitive component is applied to the camera module, especially the periscope camera module, which is conducive to reducing the overall height of the camera module;

[0026] (2) By evenly maintaining the reaction force, the moving component carrying the photosensitive chip is suspended on the fixed component. The flexure has a lighter mass and a smaller reaction force, so that a smaller rated driving force can be used to move and rotate the moving component within the required stroke. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic structural diagram of a photosensitive component according to some embodiments of the present application;

[0028] Figure 2 is an exploded view of a photosensitive component according to some embodiments of the present application;

[0029] Figure 3 is a schematic diagram of the internal structure of a photosensitive component according to some embodiments of the present application;

[0030] Figure 4 This application Figure 3 An enlarged schematic diagram of the local A in the middle;

[0031] Figure 5 is a schematic diagram of a stopper assembly according to some embodiments of the present application;

[0032] Figure 6 is a schematic diagram of a stopper assembly according to some other embodiments of the present application;

[0033] Figure 7 is an exploded view of an upper cover portion according to some embodiments of the present application;

[0034] Figure 8 is a schematic diagram of the distribution of driving coils according to some embodiments of the present application;

[0035] Fig. 9 is a schematic diagram of the distribution of driving coils according to other embodiments of the present application;

[0036] Fig.10 is a schematic diagram of a partial structure of a photosensitive component according to some embodiments of the present application;

[0037] Fig.11 is an exploded view of the internal structure of a photosensitive component according to some embodiments of the present application;

[0038] Fig.12 is a schematic diagram of a partial structure of a photosensitive component according to other embodiments of the present application;

[0039] Fig.13 is an exploded view of the internal structure of a photosensitive component according to other embodiments of the present application;

[0040] Fig.14 is a schematic diagram of a partial structure of a photosensitive component according to other embodiments of the present application;

[0041] Fig.15 is an exploded view of the internal structure of a photosensitive component according to other embodiments of the present application;

[0042] Fig.16 It is a schematic diagram of the structure of a periscope camera module according to some embodiments of the present application.

[0043] In the figure: 1, photosensitive component; 10, photosensitive chip; 11, heat dissipation plate; 20, moving component; 21, first moving plate; 22, second moving plate; 23, third moving plate; 24, reinforcing plate; 241, heat dissipation hole; 242, groove; 243 ball; 30, fixed component; 31, first fixed plate; 32, second fixed plate; 33, third fixed plate; 34, extension frame; 341, avoidance hole; 40, driving component; 41, driving coil; 411, first driving coil; 412, second driving coil; 413, third driving coil; 414, fourth driving coil; 42, driving Moving magnet; 421, first driving magnet; 422, second driving magnet; 423, third driving magnet; 424, fourth driving magnet; 43, epitaxial plate; 431, first epitaxial plate; 432, second epitaxial plate; 50, circuit assembly; 51, first flexure; 52, second flexure; 53, third flexure; 60, retaining assembly; 70, stop assembly; 71, fixed portion; 72, movable portion; 73, stop end face; 80, bearing assembly; 81, base plate; 811, supporting structure; 82, upper cover; 821, limiting groove; 822, magnetic conductive plate; 9, periscope camera module. DETAILED DESCRIPTION

[0044] The present invention is further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0045] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present invention.

[0046] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0047] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection, or an indirect connection through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] like Figure 1-Figure 4 As shown, a photosensitive component 1 includes a moving component 20, a fixed component 30, a circuit component 50, at least one holding component 60 and at least two driving components 40. The moving component 20 is suitable for carrying a photosensitive chip 10, and the photosensitive chip 10 is arranged on the moving component 20. In the orthogonal plane of the optical axis of the photosensitive chip 10, that is, the XY plane, the moving component 20 and the fixed component 30 are arranged opposite to each other, and a gap is maintained between the moving component 20 and the fixed component 30. The holding component 60 is arranged in the gap between the fixed component 30 and the moving component 20 in a horizontal direction, and the moving component 20 is movably connected to the fixed component 30 in a horizontal direction through the holding component 60. The circuit component 50 is arranged on the peripheral side of the photosensitive chip 10 and is placed horizontally on the gap between the fixed component 30 and the moving component 20, so as to be deformably electrically connected to the moving component 20 and the adjacent fixed component 30, which is conducive to shortening the wiring length of the circuit component 50. Under the driving force of the plurality of driving components 40 , the moving component 20 is able to move relative to the fixed component 30 along a plane orthogonal to the optical axis of the photosensitive chip 10 .

[0049] In an optional embodiment, the driving assembly 40 is composed of a driving coil 41 and a driving magnet 42, and at least some of the components of the driving assembly 40 are arranged on the opposite sides of the top surface of the moving assembly 20. Specifically, at least some of the components of the driving assembly 40 are arranged on the opposite sides of the length direction of the photosensitive assembly 1 in the horizontal direction, and are located on the top surface of the moving assembly 20, so as to reduce the dimensions of the photosensitive assembly 1 in the width direction and the height direction. It can be understood that the width direction of the photosensitive assembly 1 is arranged in the height direction of the periscope camera module, and reducing the width direction of the photosensitive assembly 1 is conducive to reducing the overall height of the periscope camera module.

[0050] In an optional embodiment, at least two of the driving coils 41 are disposed on the top side surface of the moving component 20 and are respectively located on both sides of the photosensitive chip 10. The driving coils 41, the fixed component 30 and the photosensitive chip 10 are arranged in the horizontal direction, so as to reduce the height of the photosensitive component 1. In an optional embodiment, the photosensitive chip 10, the fixed component 30 and at least part of the components of at least two of the driving components 40, such as the driving coils 41, are arranged one by one outward along the central area of ​​the moving component 20, that is, the photosensitive chip 10 is arranged in the central area of ​​the moving component 20, the fixed component 30 is arranged on at least two opposite sides of the central area, and at least part of the components of the driving component 40, such as the two driving coils 41, are respectively and relatively arranged in the more peripheral areas of the fixed component 30, so as to reduce the height of the photosensitive component 1, and at the same time, the size of the photosensitive component 1 is expanded to both sides of the photosensitive chip 10, which is conducive to reducing the width of the photosensitive component 1.

[0051] In some embodiments, at least some components of the driving component 40, such as the driving coil 41, are horizontally arranged on at least two sides of the fixed component 30 relatively far from the photosensitive chip 10, and the driving component 40 is electrically connected to the moving component 20 and is connected to the moving component 20 on the side of the photosensitive chip 10 and is connected to the circuit component 50. In other words, the line connecting the driving component 40 is connected from the side of the fixed component 30 relatively far from the photosensitive chip 10 to the side close to the photosensitive chip 10, so as to be connected to the circuit component 50 arranged on the side of the photosensitive chip 10, and further electrically connected to the fixed component 30. This electrical connection method is conducive to reducing the wiring distance of the photosensitive chip 10. In addition, the circuit component 50 is relatively soft, and its elastic coefficient at the maximum deformation end in the original state and within the rated stroke is kept within 10 times. The circuit component 50 is arranged relatively close to the inner side of the photosensitive component 1 to reduce the risk of damage to the circuit component 50.

[0052] In some embodiments, Figure 4As shown, the photosensitive component 1 further includes a plurality of stopper components 70, which are located in the gap between the moving component 20 and the fixed component 30, so as to prevent the moving component 20 from moving too much, and to prevent the gap between the moving component 20 and the fixed component 30 from being too narrow, thereby causing the circuit component 50 to bend excessively and break and fail. In some optional embodiments, the stopper component 70 is configured as a convex block structure, and a plurality of the stopper components 70 are protrudingly disposed on the fixed component 30 and extend toward the moving component 20, and a gap is maintained between the stopper component 70 and the moving component 20, and a stopper end face 73 is provided at the end of the stopper component 70, and the stopper end face 73 is adapted to the side of the moving component 20 opposite to the stopper component 70. For example, the stop end face 73 is parallel to the side face of the moving component 20. When the movement amplitude of the moving component 20 exceeds a preset range, the side face of the moving component 20 contacts and abuts against the stop end face 73 to prevent the gap between the moving component 20 and the fixed component 30 from being too narrow and damaging the circuit component 50, thereby improving the operating reliability of the photosensitive component 1. It is understandable that the stop component 70 may also be a protruding structure arranged on the moving component 20.

[0053] In some other optional embodiments, Figure 5 and Figure 6 As shown, the stopper assembly 70 includes a fixed portion 71 and a movable portion 72, wherein the movable portion 72 is detachably engaged with the fixed portion 71, wherein the fixed portion 71 is protrudingly disposed on one of the moving assembly 20 or the fixed assembly 30, and the movable portion 72 is protrudingly disposed on the other of the fixed assembly 30 or the moving assembly 20, and is disposed opposite to the fixed portion 71, so that the moving assembly 20 is detachably engaged with the fixed assembly 30. It can be understood that when the fixed portion 71 of the stopper assembly 70 is engaged with the movable portion 72, the gap between the moving assembly 20 and the fixed assembly 30 is the narrowest.

[0054] In some embodiments, Figure 2 and Figure 7 As shown, the photosensitive component 1 further includes a bearing component 80, and the bearing component 80 includes a base plate 81 and an upper cover 82. The base plate 81 is disposed below the moving component 20 and the fixed component 30 to support the moving component 20 and the fixed component 30. The upper cover 82 is disposed above the moving component 20 and the fixed component 30 and is engaged with the base plate 81 to accommodate the moving component 20 and the fixed component 30. In some optional embodiments, as Figure 2As shown, a support structure 811 is protrudingly provided on the upper surface of the base plate 81, and the support structure 811 is adapted to the fixing assembly 30 and is located below the fixing assembly 30, so that the fixing assembly 30 is fixed to the base plate 81 and is located in the same plane as the moving assembly 20. In some optional embodiments, as Figure 7 As shown, the lower side of the upper cover 82 is provided with a limiting groove 821, and the driving magnet 42 of the driving assembly 40 is accommodated in the limiting groove 821, and is arranged relative to the driving coil 41 fixed to the moving assembly 20 along the optical axis direction of the photosensitive chip 10, that is, the Z axis direction. In some optional embodiments, the upper surface of the base plate 81 is provided with a circuit board to achieve electrical connection with the fixed assembly 30, and the base plate 81 is also provided with a magnetic sheet to attract the driving magnet 42 fixed to the upper cover 82, so that the connection between the upper cover 82 and the base plate 81 is more reliable. It can be understood that the fixed assembly 30 is fixed relative to the bearing assembly 80, the moving assembly 20 is connected to the fixed assembly 30 through the retaining assembly 60, and moves inside the bearing assembly 80 through the driving force of multiple driving assemblies 40, and the circuit assembly 50 is flexibly supported and electrically connected between the moving assembly 20 and the fixed assembly 30.

[0055] In some embodiments, Figure 2-Figure 4 As shown, the moving assembly 20 includes a first moving plate 21 and a second moving plate 22, and the first moving plate 21 and the second moving plate 22 are located on the orthogonal plane of the optical axis of the photosensitive chip 10, that is, on opposite sides in the XY plane and are arranged on the reinforcing plate 24. The material of the moving assembly 20 can be a semiconductor substrate. It can be understood that a large semiconductor substrate is prone to bending during molding, and as long as there is a defect on a semiconductor substrate, the entire semiconductor substrate is considered defective. The moving assembly 20 is divided into a first moving plate 21 and a second moving plate 22, so as to reduce the area of ​​a single moving plate and further reduce the risk of bending during molding. The first moving plate 21 and the second moving plate 22 are arranged relative to each other at intervals, a part of the lower surface of the photosensitive chip 10 is attached to the first moving plate 21, a part of the lower surface of the photosensitive chip 10 is attached to the second moving plate 22, and the middle area of ​​the photosensitive chip 10 is suspended. The first movable plate 21 and the second movable plate 22 are arranged on a reinforcing plate 24 , so as to improve the installation flatness of the first movable plate 21 and the second movable plate 22 , and further improve the flatness of the photosensitive chip 10 .

[0056] In an optional embodiment, the reinforcing plate 24 is made of titanium copper material, and its surface flatness is less than 10μm, so as to improve the flatness of the moving component 20 fixed to the reinforcing plate 24. The moving component 20 can be bonded to the reinforcing plate 24 by glue, so as to improve the reliability of the installation of the photosensitive component 1. It is worth mentioning that a heat dissipation hole 241 is provided in the center of the reinforcing plate 24. The heat dissipation hole 241 passes through the reinforcing plate 24 and is located below the central area of ​​the photosensitive chip 10, so as to avoid the heat dissipation plate 11 attached to the lower surface of the photosensitive chip 10. The material of the heat dissipation plate 11 can be titanium copper, steel sheet or other materials with good thermal conductivity, so as to improve the heat dissipation efficiency of the photosensitive chip 10 and extend the working life of the photosensitive chip 10. In an optional embodiment, the surface flatness of the heat dissipation plate 11 is less than 10μm, so as to further improve the flatness of the photosensitive chip 10. In another optional embodiment, the heat sink 11 has magnetic properties and is able to generate an adsorption force with the driving magnet 42 fixed on the upper cover 82 to maintain the distance between the photosensitive chip 10 and the upper cover 82, thereby making the installation of the photosensitive component 1 more reliable.

[0057] In some embodiments, the fixing assembly 30 includes a first fixing plate 31 and a second fixing plate 32 fixed to the extension frame 34, the first fixing plate 31 is arranged on a side of the first moving plate 21 relatively far away from the photosensitive chip 10, and a gap is provided between the first fixing plate 31 and the first moving plate 21, so that the moving assembly 20 can move relative to the first fixing plate 31, and the second fixing plate 32 is arranged on a side of the second moving plate 22 relatively far away from the photosensitive chip 10, and a gap is provided between the second fixing plate 32 and the second moving plate 22, so that the moving assembly 20 can move relative to the second fixing plate 32. That is, the first fixing plate 31, the first moving plate 21, the photosensitive chip 10, the second moving plate 22 and the second fixing plate 32 are arranged in sequence in the length direction of the photosensitive assembly 1, the first moving plate 21 and the first fixing plate 31 are adjacently located on one side of the photosensitive chip 10, and the second moving plate 22 and the second fixing plate 32 are adjacently located on the other side of the photosensitive chip 10, so that the structure of the photosensitive assembly 1 is more compact, and it is also helpful to reduce the wiring length of the circuit assembly 50.

[0058] In some optional embodiments, the first fixing plate 31 and the second fixing plate 32 are arranged on an extension frame 34, so as to improve the installation flatness of the first fixing plate 31 and the second fixing plate 32. The extension frame 34 and the reinforcing plate 24 under the moving assembly 20 are located in the same plane, so that the first fixing plate 31 and the second fixing plate 32 are arranged on at least two sides of the moving assembly 20, and the first fixing plate 31, the second fixing plate 32 and the moving assembly 20 are basically flush. The extension frame 34 surrounds the circumference of the moving assembly 20 and the reinforcing plate 24, and extends to both sides of the length direction of the photosensitive assembly 1, so as to increase the assembly space to place the resistor and the container or other components. As mentioned above, the width direction of the photosensitive assembly 1 is arranged in the height direction of the periscope camera module. Such an arrangement of the extension frame 34 is conducive to reducing the expansion of the photosensitive assembly 1 in the width direction and reducing the overall height of the periscope camera module.

[0059] In some embodiments, one end of the circuit component 50 is connected to the fixed component 30, and the other end of the circuit component 50 is connected to the side of the mobile component 20 opposite to the fixed component 30, so as to electrically connect the mobile component 20 with the fixed component 30. It is worth mentioning that in the traditional lead frame structure scheme, the elastic coefficient of the circuit component in the high stiffness state and the low stiffness state is quite different. When a certain deformation displacement is reached, the elastic coefficient decreases sharply, and a small increase in force may also produce excessive displacement, causing the circuit component to deform sharply and be damaged and broken. In the scheme of the present application, as described above, the elastic coefficient of the circuit component 50 at the maximum deformation end in the original state and the rated stroke is maintained within 10 times, that is, the change of its elastic coefficient is small, so that the reaction force is more uniform, and the circuit component 50 is prevented from being deformed sharply and damaged and broken after being subjected to force, so that it can deformably adapt to the movement of the mobile component 20 relative to the fixed component 30.

[0060] In some embodiments, the circuit assembly 50 includes a first flexure 51 and a second flexure 52 disposed on both sides of the photosensitive chip 10, and the first flexure 51 and the second flexure 52 are respectively located on at least two sides of the photosensitive chip 10. In an optional embodiment, a plurality of the first flexures 51 are mutually parallel and horizontally arranged in the gap between the first movable plate 21 and the first fixed plate 31, one end of the first flexure 51 is connected to the first fixed plate 31, and the other end of the first flexure 51 is connected to the adjacent side of the first movable assembly 20 close to the photosensitive chip 10, so as to electrically connect the first movable plate 21 and the adjacent first fixed plate 31. A plurality of second flexures 52 are disposed parallel to each other in the gap between the second movable plate 22 and the second fixed plate 32, one end of the second flexure 52 is connected to the second fixed plate 32, and the other end of the second flexure 52 is connected to the adjacent side of the second movable assembly 20 close to the photosensitive chip 10, so as to electrically connect the second movable plate 22 and the adjacent second fixed plate 32, and the fixing portions 71 of the two stopper assemblies 70 are disposed at intervals on the side of the second fixed plate 32. The photosensitive chip 10 is electrically connected to the first movable assembly 20 and the second movable assembly 20, and is conducted to the first fixed plate 31 and the second fixed plate 32 through the first flexure 51 and the second flexure 52, so as to be further conducted to the external circuit.

[0061] In some optional embodiments, the fixed portions 71 of the two stop assemblies 70 are arranged at intervals on the sides of the first fixed plate 31, the two movable portions 72 are arranged at intervals on the sides of the first movable plate 21, and are respectively arranged opposite to the two fixed portions 71 on the first fixed plate 31, the fixed portions 71 of the two stop assemblies 70 are arranged at intervals on the sides of the second fixed plate 32, the two movable portions 72 are arranged at intervals on the sides of the second movable plate 22, and are respectively arranged opposite to the fixed portions 71 of the second fixed plate 32, so as to avoid the gap between the movable assembly 20 and the fixed assembly 30 being too narrow, causing the first flexible portion 51 and the second flexible portion 52 to be excessively bent and break and fail. In some other optional embodiments, the stop assembly 70 is configured as a protrusion structure, two of the stop assemblies 70 are protruded and disposed at both ends of the first fixed plate 31 at intervals, and the other two of the stop assemblies 70 are protruded and disposed at both ends of the second fixed plate 32 at intervals, so as to avoid the gap between the moving assembly 20 and the fixed assembly 30 being too narrow, causing the first flexure portion 51 and the second flexure portion 52 to bend excessively and break and fail.

[0062] In some embodiments, the moving assembly 20 further includes a third moving plate 23, which is disposed in the adjacent direction of the first moving plate 21 and the second moving plate 22 to carry the photosensitive chip 10, and the fixing assembly 30 further includes a third fixing plate 33, which is disposed on a side of the third moving plate 23 relatively away from the photosensitive chip 10. The circuit assembly 50 further includes a third flexure 53, which is located in the adjacent direction of the first flexure 51 and the second flexure 52, and is disposed transversely in the gap between the third moving plate 23 and the third fixing plate 33, one end of the third flexure 53 is connected to the third fixing plate 33, and the other end of the third flexure 53 is connected to the adjacent side of the third moving assembly 20 close to the photosensitive chip 10, so as to electrically connect the third moving plate 23 and the adjacent third fixing plate 33. It is worth mentioning that the third movable plate 23, the first movable plate 21 and the second movable plate 22 are fixed on the same reinforcement plate 24, and the third fixed plate 33, the first fixed plate 31 and the second fixed plate 32 are arranged on the same extension frame 34, so as to improve the installation flatness of the movable component 20 and the fixed component 30.

[0063] In some optional embodiments, the fixed portions 71 of the two stop assemblies 70 are arranged at intervals on the sides of the third fixed plate 33, and the two movable portions 72 are arranged at intervals on the sides of the third movable plate 23, and are respectively arranged opposite to the two fixed portions 71 on the third fixed plate 33. In other optional embodiments, the stop assembly 70 is configured as a protrusion structure, and the two stop assemblies 70 are protruded and arranged at intervals at both ends of the third fixed plate 33, so as to avoid the gap between the movable assembly 20 and the fixed assembly 30 being too narrow, causing the third flexure 53 to be excessively bent and break and fail.

[0064] In some embodiments, each flexure is a V-shaped silicon wire. When the moving component 20 is not driven by an external force and is placed between the fixed components 30, the V-shaped silicon wire is located in the plane where the moving component 20 and the fixed component 30 are located. When the moving component 20 is subjected to force and moves relative to the fixed component 30, the V-shaped silicon wire stretches or squeezes the oblique bending protrusion out of the plane, so as to deformably electrically connect the moving component 20 and the fixed component 30. In other embodiments, each flexure is an oblique silicon wire, and the height of the oblique silicon wire in the optical axis direction is less than 200μm, so as to reduce the height of the photosensitive component 1, which is conducive to reducing the overall size of the camera module. It is worth mentioning that the oblique silicon wire is suitable for semiconductor process molding and is easy to process.

[0065] In some embodiments, the number of the holding components 60 is four, wherein each of the two ends of the first fixed plate 31 is provided with a holding component 60 connected to the first movable plate 21, and each of the two ends of the second fixed plate 32 is provided with a holding component 60 connected to the second movable plate 22. It can be understood that the reinforcing plate 24 rigidly connects the first movable plate 21 and the second movable plate 22, so that the movable component 20 is suspended between the first fixed plate 31 and the second fixed plate 32 through the four holding components 60. In some optional embodiments, one end of the holding component 60 is fixed to one end of the fixed plate, and the other end of the holding component 60 is fixed to one end of the movable plate corresponding to the fixed plate. The holding component 60 extends in the horizontal direction and is accommodated between the opposite fixed plate and the movable plate, and is elastically deformable to connect the fixed plate and the movable plate, so that the photosensitive chip 10 moves in the orthogonal plane of its optical axis, and at the same time, the restoring force of the movable component relative to the fixed component 30 in at least two directions in the orthogonal plane of the optical axis of the photosensitive chip 10, that is, in the XY plane, is balanced. It is worth mentioning that the circuit component 50 and the retaining component 60 arranged between the same pair of fixed plates and movable plates are located on the same side of the fixed plate, and the two retaining components 60 are located on the outermost sides of the multiple flexible parts, which facilitates the installation of multiple flexible parts and makes the structure of the photosensitive component 1 more compact, which is conducive to reducing the overall size.

[0066] It is understandable that when the external force driving the moving component 20 to move is removed, the holding component 60 can provide a restoring force to the moving component 20, so that the moving component 20 returns to the initial position, or when the moving component 20 is subjected to an external force, the holding component 60 keeps the moving component 20 in the initial position. Secondly, the moving component 20 moves relative to the fixed component 30 in the orthogonal plane of the optical axis of the photosensitive chip 10, that is, the XY plane, wherein when the driving component 40 drives the moving component 20 to move in the X direction, it needs to resist the reaction force in the X direction, and when driving the moving component 20 to move in the Y direction, it needs to resist the reaction force in the Y direction. In the scheme of the present application, the difference in the elastic coefficients of each of the holding components 60 in the two directions is less than or equal to 20%, which is relatively consistent, so as to provide a relatively uniform reaction force, and at the same time, it is possible to more accurately predict the resultant force of the reaction force of each of the holding components 60 in the XY plane, so as to more conveniently control the driving component 40 to provide the required driving force. It is worth mentioning that the elastic coefficients of each retaining component 60 in the two directions are slightly different, so that the driving force required to drive the moving component 20 to move in the X and Y directions is similar, so as to avoid the driving force required in one direction being larger, resulting in the driving coil 41 and the driving magnet 42 in this direction being larger, which is beneficial to reducing the overall size of the photosensitive component 1.

[0067] In some embodiments, Figure 8 and Fig. 9 As shown, the driving coil 41 further includes a first driving coil 411 and a second driving coil 412, and the first driving coil 411 and the second driving coil 412 are located on the top surface of the moving component 20 and are horizontally arranged on the extension plate 43. The first driving coil 411 is located on a side of the first fixed plate 31 relatively far away from the first moving plate 21, and the second driving coil 412 is located on a side of the second fixed plate 32 relatively far away from the second moving plate 22. The extension plate 43 includes a first extension plate 431 and a second extension plate 432. The first extension plate 431 is fixedly connected to one side of the reinforcement plate 24 and extends to the bottom of the first drive coil 411 to support the first drive coil 411, so that the first drive coil 411 is connected to the moving component 20 through the first extension plate 431 and the reinforcement plate 24. The second extension plate 432 is fixedly connected to the other side of the reinforcement plate 24 and extends to the bottom of the second drive coil 412 to support the second drive coil 412, so that the second drive coil 412 is connected to the moving component 20 through the second extension plate 432 and the reinforcement plate 24.

[0068] That is to say, the first drive coil 411, the first fixed plate 31, the first movable plate 21, the photosensitive chip 10, the second movable plate 22, the second fixed plate 32, and the second drive coil 412 are arranged in sequence in the length direction of the photosensitive component 1, so that the size of the photosensitive component 1 is expanded to both sides of the photosensitive chip 10, which is conducive to reducing the width of the photosensitive component 1. It can be understood that when the photosensitive component 1 is set in the periscope camera module, reducing the width of the photosensitive component 1 helps to reduce the shoulder height of the periscope camera module, so as to reduce the overall size of the periscope camera module. The drive magnet 42 includes a first drive magnet 421 and a second drive magnet 422 accommodated in the limit groove 821 of the upper cover 82, and the first drive magnet 421 and the second drive magnet 422 are respectively arranged relative to the optical axis direction of the photosensitive chip 10, that is, the Z axis direction, with the first drive coil 411 and the second drive coil 412. The extension direction of the first driving magnet 421 is consistent with the long side direction of the first driving coil 411, the N / S poles of the first driving magnet 421 are arranged along the short side direction of the first driving coil 411, the extension direction of the second driving magnet 422 is consistent with the long side direction of the second driving coil 412, and the N / S poles of the second driving magnet 422 are arranged along the short side direction of the second driving coil 412. When the driving coils 41 fixed on the moving component 20 are energized, the driving coils 41 interact with the relative driving magnets 42 to generate Lorentz force, so as to drive the moving component 20 to move. It can be understood that in addition to the electromagnetic driving method in which the driving coils 41 and the driving magnets 42 cooperate, the driving component 40 can also be driven by a piezoelectric motor, etc., and this application does not make specific restrictions.

[0069] In some embodiments, the driving coil 41 further includes a third driving coil 413, and the third driving coil 413 is eccentrically disposed on at least one side of the photosensitive chip 10, so as to drive the moving component 20 to rotate in a plane orthogonal to the optical axis of the photosensitive chip 10. Specifically, the third driving coil 413 is disposed on the top surface of the moving component 20 and is horizontally located on one side of the photosensitive chip 10, and the midline of the long side direction of the third driving coil 413 deviates from the geometric center of the photosensitive chip 10, so that the driving force generated by the third driving coil 413 deviates from the geometric center of the photosensitive chip 10, so as to form a torque to drive the moving component 20 to rotate in a plane orthogonal to the optical axis of the photosensitive chip 10. It can be understood that the photosensitive chip 10 carried by the moving assembly 20 is suspended and vertically arranged in the periscope module, that is, the direction of the optical axis of the photosensitive chip 10 is substantially perpendicular to the height direction of the periscope module. When the periscope module is tilted, the photosensitive chip 10 rotates under the action of gravity, and the third driving coil 413 can adjust the photosensitive chip 10. The driving magnet 42 also includes a third driving magnet 423 accommodated in the limiting groove 821 of the upper cover 82. The third driving magnet 423 and the third driving coil 413 are arranged relative to the optical axis direction of the photosensitive chip 10, wherein the extension direction of the third driving magnet 423 is consistent with the long side direction of the third driving coil 413, and the N / S poles of the third driving magnet 423 are arranged along the short side direction of the third driving coil 413.

[0070] In some embodiments, the driving coil 41 also includes a fourth driving coil 414. The first driving coil 411 and the second driving coil 412 are arranged on opposite sides of the photosensitive chip 10, the third driving coil 413 is adjacently arranged on one side of the first driving coil 411, and the fourth driving coil 414 is adjacently arranged on one side of the second driving coil 412, so as to drive the moving component 20 to move and rotate in an orthogonal plane to the optical axis of the photosensitive chip 10. Specifically, the first driving coil 411 and the third driving coil 413 are adjacently arranged on one side of the first fixing plate 31 relatively far away from the photosensitive chip 10 and fixedly connected to the first epitaxial plate 431, and the second driving coil 412 and the fourth driving coil 414 are adjacently arranged on one side of the second fixing plate 32 relatively far away from the photosensitive chip 10 and fixedly connected to the second epitaxial plate 432. Among them, the long side directions of the first drive coil 411 and the second drive coil 412 are consistent, and the long side directions of the third drive coil 413 and the fourth drive coil 414 are perpendicular to the long side directions of the first drive coil 411 and the second coil, so that the moving component 20 can move in at least two directions in the orthogonal plane of the optical axis of the photosensitive chip 10.

[0071] In an optional embodiment, the midline of the long side direction of the third drive coil 413 is on the same straight line as the midline of the short side direction of the first drive coil 411, and the midline of the long side direction of the fourth drive coil 414 is on the same straight line as the midline of the short side direction of the second drive coil 412. It can be understood that the drive magnet 42 also includes a fourth drive magnet 424 accommodated in the limiting groove 821 of the upper cover 82, and the fourth drive magnet 424 and the fourth drive coil 414 are arranged relative to the optical axis direction of the photosensitive chip 10, wherein the extension direction of the fourth drive magnet 424 is consistent with the long side direction of the fourth drive coil 414, and the N / S poles of the fourth drive magnet 424 are arranged along the short side direction of the fourth drive coil 414.

[0072] It is worth mentioning that in some embodiments, Figure 8As shown, the midline of the long side direction of the first drive coil 411 and the midline of the long side direction of the second drive coil 412 are located on the same straight line, deviated from the geometric center of the photosensitive chip 10, and close to one side of the photosensitive chip 10; the midline of the short side direction of the third drive coil 413 and the midline of the short side direction of the fourth drive coil 414 are located on the same straight line, deviated from the geometric center of the photosensitive chip 10, and close to the other side of the photosensitive chip 10. When reverse current is applied to the first drive coil 411 and the third drive coil 413, the resultant torque is increased, and when the same-direction current is applied to the first drive coil 411 and the third coil, the torque in one direction is offset; similarly, when reverse current is applied to the second drive coil 412 and the fourth drive coil 414, the resultant torque is increased, and when the same-direction current is applied to the second drive coil 412 and the fourth coil, the torque in one direction is offset, so that the moving component 20 carries the photosensitive chip 10 to rotate around the optical axis and / or translate in one direction. When the first drive coil 411, the second drive coil 412, the third drive coil 413 and the fourth drive coil 414 are energized at the same time, the moving component 20 carries the photosensitive chip 10 to rotate around the optical axis and / or translate in at least two directions.

[0073] In other embodiments, Fig. 9 As shown, the midline of the long side direction of the first drive coil 411 and the midline of the short side direction of the fourth drive coil 414 are located on the same straight line, deviated from the geometric center of the photosensitive chip 10, and close to one side of the photosensitive chip 10; the midline of the short side direction of the third drive coil 413 and the midline of the long side direction of the second drive coil 412 are located on the same straight line, deviated from the geometric center of the photosensitive chip 10, and close to the other side of the photosensitive chip 10. When reverse current is applied to the first drive coil 411 and the second drive coil 412, the resultant torque is increased, and when the same-direction current is applied to the first drive coil 411 and the second drive coil 412, the torque in one direction is offset; similarly, when reverse current is applied to the third drive coil 413 and the fourth drive coil 414, the resultant torque is increased, and when the same-direction current is applied to the third drive coil 413 and the fourth drive coil 414, the torque in one direction is offset, so that the moving component 20 carries the photosensitive chip 10 to rotate around the optical axis and / or translate in one direction. When the first drive coil 411, the second drive coil 412, the third drive coil 413 and the fourth drive coil 414 are energized at the same time, the moving component 20 carries the photosensitive chip 10 to rotate around the optical axis and / or translate in at least two directions.

[0074] In some optional embodiments, such as Fig.10 and Fig.11 As shown, the first extension plate 431 and the second extension plate 432 are fixed to the lower surface of the reinforcement plate 23 and extend to the bottom of each of the drive coils 41, that is, extend to the long side direction of the photosensitive component 1. It can be understood that, as described above, the extension frame 34 and the reinforcement plate 24 are located in the same plane, so each of the extension plates 43 is horizontally arranged below the extension frame 34, and the support structure 811 on the base plate 81 is able to receive the extension frame 34, so that the extension frame 34 and the reinforcement plate 24 are located in the same plane, and further the fixed component 30 fixed on the extension frame 34 and the movable component 20 fixed on the reinforcement plate 24 are located at the same height. It is worth mentioning that the extension frame 34 is provided with an avoidance structure, such as an avoidance hole 341, which is able to avoid each of the drive coils 41 arranged on the outside of the fixed component 30. The avoidance structure can also be set as an avoidance gap, etc., and the present application does not impose specific restrictions. In other optional embodiments, such as Fig.12 and Fig.13 As shown, the first extension plate 431 and the second extension plate 432 are fixed to the upper surfaces of both sides of the reinforcing plate 23 and extend below each of the driving coils 41. It can be understood that, as described above, the extension frame 34 and the reinforcing plate 24 are located in the same plane, so each of the extension plates 43 is horizontally arranged above the extension frame 34. In other embodiments, Fig.14 and Fig.15 As shown, the first epitaxial plate 431 , the second epitaxial plate 432 and the reinforcing plate 24 are integrally formed.

[0075] The present application also provides a camera module, including a lens assembly, a focus motor and the photosensitive assembly 1 as described above, wherein the lens assembly is equipped with at least one lens, and the focus motor is placed on the outside of the lens assembly to drive the lens assembly to move along its optical axis direction, i.e., the Z-axis direction, to achieve the focusing function of the camera module, and the photosensitive assembly 1 is located below the lens assembly to achieve the anti-shake function of the camera module, and the photosensitive assembly 1 has a compact structure, which is conducive to reducing the overall size of the camera module and reducing the mass of the camera module.

[0076] In an alternative embodiment, if Fig.16As shown, the camera module is a periscope camera module 9, and the optical axis of its lens assembly is perpendicular to the optical axis of the photosensitive chip 10 in the photosensitive assembly 1, that is, the width direction of the photosensitive assembly 1 is located in the height direction of the periscope camera module 9, and the driving assembly 40 of the photosensitive assembly 1 is located in the length direction of the photosensitive assembly 1, so as to reduce the size of the photosensitive assembly 1 in the width direction, which is beneficial to reduce the shoulder height of the periscope camera module 9, so as to reduce the overall size of the periscope camera module 9, and help to achieve the thinness of the periscope camera module 9.

[0077] In some embodiments, Figure 7 As shown, the photosensitive component 1 further includes a magnetic conductive plate 822, which is located between the upper cover 82 and the driving magnet 42, so as to avoid the magnetic field of the driving magnet 4242 located below the lens mount 721 from interfering with the magnetic field of the focus motor located above the lens mount 721, and at the same time guide the direction of the magnetic flux lines of the driving magnet 42, so as to improve the operating reliability of the movable photosensitive component 11. In an optional embodiment, the magnetic conductive plate 882 is accommodated in the limiting groove 821 of the upper cover 82.

[0078] In some optional embodiments, such as Figure 8-Figure 11 As shown, a ball bearing 243 is provided between the reinforcing plate 24 and the upper cover 82, so that the moving assembly 20 and the reinforcing plate 24 can be slidably clamped between the upper cover 82 and the base plate 81, so as to prevent the photosensitive chip 10 from shaking significantly in the direction of its optical axis, and improve the stability of the photosensitive chip 10 in the bearing assembly 80. Specifically, a plurality of grooves 242 are convexly provided in the thickness direction of the reinforcing plate 24, and the grooves 242 are suitable for accommodating the ball bearings 243, so that the ball bearings 243 are in contact with the lower side of the upper cover 82, and the reinforcing plate 24, the moving assembly 20 fixed to the reinforcing plate 24, and the photosensitive chip 10 fixed to the moving assembly 20 can be clamped in the bearing assembly 80 by the ball bearings 243. When the driving assembly 40 drives the moving assembly 20 to move relative to the fixed assembly 30, the reinforcing plate 24 and the upper cover 82 slide relative to each other.

[0079] The above describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention to be protected. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A photosensitive component, characterized in that: include: Fixing components; At least one retaining component, disposed on the fixing component; A movable component is movably connected to the fixed component in a horizontal direction through the holding component. When the holding component is in an initial state, the movable component is kept in a neutral state. The movable component is suitable for carrying a photosensitive chip. a circuit assembly, the circuit assembly being electrically connected to the moving assembly and the fixed assembly; At least two driving components are used to drive the moving component to move relative to the fixed component. The at least two driving components are arranged at two opposite side areas of the top side surface of the moving component.

2. The photosensitive component according to claim 1, characterized in that: The photosensitive chip is arranged on the movable component. In an orthogonal plane to the optical axis of the photosensitive chip, the movable component and the fixed component are arranged opposite to each other, and a gap is maintained between the movable component and the fixed component so that the movable component can move relative to the fixed component. The circuit component is arranged on the peripheral side of the photosensitive chip and is placed horizontally on the gap so as to electrically connect the movable component and the adjacent fixed component.

3. The photosensitive component according to claim 1, characterized in that: The driving component further includes at least two driving coils, which are fixed to the top side surface of the moving component and are respectively located on both sides of the photosensitive chip. The fixed component is located between the photosensitive chip and the driving component. One end of the circuit component is connected to the fixed component, and the other end of the circuit component is connected to the side of the moving component opposite to the fixed component.

4. The photosensitive component according to claim 3, characterized in that: The holding component is elastically deformably connected to the moving component from the end of the fixing component, and keeps the moving component in a suspended state.

5. The photosensitive component according to claim 4, characterized in that: The movable assembly includes a first movable plate and a second movable plate, and the first movable plate and the second movable plate are relatively arranged in an orthogonal plane to the optical axis of the photosensitive chip to fix the photosensitive chip. The fixed assembly includes a first fixed plate and a second fixed plate, and the first fixed plate is arranged on a side of the first movable plate relatively far away from the photosensitive chip, and the second fixed plate is arranged on a side of the second movable plate relatively far away from the photosensitive chip, so that the first movable plate, the photosensitive chip and the second movable plate are sequentially arranged between the first fixed plate and the second fixed plate.

6. The photosensitive component according to claim 5, characterized in that: The circuit component includes a first flexible portion and a second flexible portion arranged on both sides of the photosensitive chip, the first flexible portion is horizontally placed in the gap between the first movable plate and the first fixed plate, so as to electrically connect the first movable plate and the adjacent first fixed plate, and the second flexible portion is horizontally placed in the gap between the second movable plate and the second fixed plate, so as to electrically connect the second movable plate and the adjacent second fixed plate.

7. The photosensitive component according to claim 5, characterized in that: The driving component includes a first driving coil and a second driving coil. The first driving coil and the second driving coil are arranged on the top side surface of the moving component and are respectively located on both sides of the photosensitive chip, so as to drive the moving component to move in an orthogonal plane to the optical axis of the photosensitive chip.

8. The photosensitive component according to claim 7, characterized in that: The driving component also includes a third driving coil, which is eccentrically arranged on at least one side of the photosensitive chip, so as to drive the moving component to rotate in an orthogonal plane to the optical axis of the photosensitive chip.

9. The photosensitive component according to claim 8, characterized in that: The driving component also includes a fourth driving coil. The first driving coil and the second driving coil are arranged on opposite sides of the photosensitive chip and are eccentrically arranged respectively. The third driving coil is eccentrically and adjacently arranged on one side of the first driving coil, and the fourth driving coil is eccentrically and adjacently arranged on one side of the second driving coil, so as to drive the moving component to move and rotate in an orthogonal plane to the optical axis of the photosensitive chip.

10. The photosensitive component according to any one of claims 9, characterized in that: The retaining assembly also includes a plurality of stop assemblies, wherein the stop assemblies are located in the gap between the moving assembly and the fixed assembly, and the stop assemblies include a fixed portion and a movable portion, wherein the movable portion is detachably engaged with the fixed portion, the fixed portion is disposed at one of the moving assembly or the fixed assembly, and the movable portion is disposed at the other of the fixed assembly or the moving assembly, so that the moving assembly can be detachably engaged with the fixed assembly.

11. The photosensitive component according to claim 10, characterized in that: The number of the stop assemblies is at least four, wherein the fixed portions of two of the stop assemblies are arranged at intervals on the side of the first fixed plate, and the two movable portions are arranged at intervals on the side of the first movable plate, and are respectively arranged opposite to the fixed portions, and the fixed portions of the other two of the stop assemblies are arranged at intervals on the side of the second fixed plate, and the other two movable portions are arranged at intervals on the side of the second movable plate, and are respectively arranged opposite to the fixed portions, so that the movable assembly can move and rotate relative to the fixed assembly within a preset range.

12. The photosensitive component according to claim 10, characterized in that: The movable component also includes a third movable plate, which is arranged in the adjacent side direction of the first movable plate and the second movable plate for placing the photosensitive chip. The fixed component also includes a third fixed plate, which is arranged on a side of the third movable plate relatively away from the photosensitive chip.

13. The photosensitive component according to claim 12, characterized in that: The circuit assembly also includes a third flexure, which is located in the adjacent side direction of the first flexure and the second flexure. The third flexure is placed horizontally in the gap between the third movable plate and the third fixed plate to electrically connect the third movable plate and the adjacent third fixed plate.

14. The photosensitive component according to claim 12, characterized in that: The fixed parts of the two stopper assemblies are arranged at intervals on the sides of the third fixed plate, and the two movable parts are arranged at intervals on the sides of the third movable plate, and are respectively arranged opposite to the fixed parts, so that the movable assembly can move and rotate relative to the fixed assembly within a preset range.

15. The photosensitive component according to any one of claims 7 to 14, characterized in that: The photosensitive component also includes at least one reinforcement plate, which is arranged at the bottom of the movable component. The reinforcement plate fixed to the first movable plate extends to the bottom of the first drive coil so as to accommodate the first drive coil. The reinforcement plate fixed to the second movable plate extends to the bottom of the second drive coil so as to accommodate the second drive coil.

16. A camera module, characterized in that: include: At least one reflective component, used to reflect incident light, At least one lens assembly, equipped with at least one lens and corresponding to the reflection assembly; The photosensitive component as described in any one of claims 1-15, wherein the photosensitive component is located in the exit direction of the light path of the lens assembly, so that the image sensor senses light and forms an image.

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