Soldering flux cleaning system with zero wastewater discharge

Abstract

The invention relates to the technical field of scaling powder cleaning, in particular to a scaling powder cleaning system with zero wastewater discharge. The device comprises a jet-flow cleaning assembly, and a placing swing assembly and a waste liquid filtering assembly which are positioned in the jet-flow cleaning assembly. According to the chip cleaning device, the water wheel is driven through liquid flushing, then the driving rod meshed with the water wheel is driven to rotate, then the hanging shaft is driven to swing periodically, and the relative angle between the chip and the jet flow cavity can be changed during flushing, so that the problem of flushing dead angles and blind areas is solved, and the cleaning effect on chip scaling powder residues is ensured; the filter screen slidably connected with the bottom of the swing plate reciprocates up and down, so that residues on the surface of the filter screen can be thrown up, the filter screen is obliquely arranged, the residues can be gradually gathered towards the second box door in the throwing process through the up-down reciprocating motion of the filter screen, and therefore the residues can be conveniently taken out after the chip is cleaned.

Description

Technical Field

[0001] The invention relates to the technical field of flux cleaning, and in particular to a flux cleaning system with zero wastewater discharge. Background Art

[0002] The chip assembly process is a vital part of the production of electronic products. Chip assembly is the process of installing the chip on the circuit board, which includes steps such as mounting, welding and testing. Among them, the chip needs to use flux when welding to reduce the oxidation reaction during the welding process.

[0003] For example, CN104209289A involves a solder flux cleaning device and a cleaning method, which includes a cleaning device, a liquid collecting tank, a separation device and a circulating liquid supply device, wherein the cleaning device generates a high-pressure and high-temperature water jet flow, which is directly sprayed onto both sides of the electronic component, so that the high-pressure hot water jet flow directly acts on the surface of the electronic component to effectively remove the adhesive solder flux from both sides of the electronic component without damaging the surface of the electronic component, thereby improving the quality and yield of the electronic product; the liquid collecting tank collects the cleaned and removed objects to be cleaned, the separation device separates the cleaning liquid from the objects to be cleaned, and the circulating liquid supply device supplies the separated cleaning liquid to the cleaning device for use, so the cleaning liquid can be recycled and reused, which greatly saves the amount of clean water or solvent, greatly reduces the manufacturing cost, and avoids affecting the natural environment.

[0004] After completing the chip welding, in order to ensure the cleanliness of the semiconductor device, it is necessary to remove the residues and other contaminants generated during the welding process. For example, the flux cleaning device and cleaning method of the above-mentioned patent use high-pressure water to act on the surface of electronic components to remove the flux and separate the cleaning liquid from the object to be cleaned. However, the flux cleaning device of the above-mentioned patent cannot adjust the spraying angle of the high-pressure water. There is a blind spot in the single-angle spraying. The part of the flux residue blocked by the chip is difficult to clean, and the cleaning effect is poor.

[0005] In order to efficiently remove flux residues, a flux cleaning system with zero wastewater discharge is proposed. Summary of the invention

[0006] The object of the present invention is to provide a flux cleaning system with zero wastewater discharge to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention aims to provide a flux cleaning system with zero wastewater discharge, comprising a jet cleaning component, a placement swing component and a waste liquid filtering component located in the jet cleaning component, wherein the waste liquid filtering component is used to filter the residue in the liquid; The jet cleaning assembly comprises a jet box for spraying liquid and a circulation pump connected to the jet box for liquid circulation; The placement swing assembly includes a material fixing device and a driving body that is transmission-connected to the material fixing device. The top end of the material fixing device is rotationally connected to the inner wall of the spray box, and the bottom end of the material fixing device is slidingly connected to the waste liquid filter assembly. The driving body uses the kinetic energy of the detergent to drive the material fixing device to perform periodic swinging motion to change the spraying angle of the material, and the material fixing device drives the waste liquid filter assembly to perform up and down reciprocating motion to collect and process the residue.

[0008] As a further improvement of the present technical solution, the material fixing device includes a loading carrier and a placing body on the loading carrier, the loading carrier includes a pair of hanging shafts and a cross-frame connected to the bottom ends of the two hanging shafts, the top end of the hanging shaft is rotatably connected to the inner wall of the spray box, the placing body includes a placing rack located on the cross-frame and multiple pairs of limit groups, the limit group includes two limit grids slidably connected to the placing rack, and a first spring is arranged between the two limit grids.

[0009] As a further improvement of the present technical solution, a plurality of jet chambers for spraying liquid are opened at the top of the spray box, and circulation pipes are connected to the upper and lower ends of the circulation pump. The circulation pump is connected to the jet chambers through the circulation pipe arranged at the top, and the circulation pump is connected to the bottom of the spray box through the circulation pipe arranged at the bottom.

[0010] As a further improvement of the present technical solution, the material fixing device also includes a swing plate located at the bottom of the loading body, a vertical arm connected to the hanging shaft is provided on the top of the swing plate, a first wall groove is provided on the inner wall of the spray box, the driving body includes a water wheel and a driving rod meshing with the water wheel, both ends of the water wheel are rotatably connected to the inner wall of the spray box, the driving rod is located in the first wall groove, and the upper screw of the driving rod is connected to a hinged sleeve, and the hinged sleeve is plugged into and matched with the bottom of both ends of the swing plate.

[0011] As a further improvement of the technical solution, the vertical arm is slidably connected to the hanging shaft, the top of the vertical arm is connected to the inner wall of the hanging shaft through a second spring, a horizontal arm is provided on the side wall of the top of the vertical arm, a plurality of wedges are provided at the bottom of the horizontal arm, and a triangle is provided on the top of the two limiting grids of the limiting group.

[0012] As a further improvement of the technical solution, a second wall groove is provided on the inner wall of the spray box, a card slot is provided on the inner wall of the spray box at the upper middle part of the second wall groove, and a card block is provided on the outer wall of the swing plate correspondingly, and the card block is located in the card slot.

[0013] As a further improvement of the technical solution, the horizontal partition frame is provided with an inner groove for positioning, and the bottom end of the placement frame is snap-fitted with the inner groove.

[0014] As a further improvement of the present technical solution, the waste liquid filtering assembly includes a filter screen arranged at the bottom of the spray box, and a second box door for removing residues is arranged at a position corresponding to the filter screen on the side wall of the spray box.

[0015] As a further improvement of the technical solution, an extension frame is arranged on the top of the filter screen, and a connecting arm is correspondingly arranged on the bottom of the swing plate, and both ends of the connecting arm are slidably connected to the extension frame.

[0016] As a further improvement of the technical solution, the filter is placed obliquely at the bottom of the spray box, and the lower end of the filter faces the second box door.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. In the flux cleaning system with zero wastewater discharge, the water wheel will be driven to rotate during flushing, and then the driving rod meshing with the water wheel will be driven to rotate, and the swing plate will be driven by the hinge sleeve connected to the driving rod lead screw, and then the hanging shaft will be driven to make periodic swinging motions, thereby changing the relative angle between the chip and the jet chamber, so that the cleaning agent sprayed downward from the jet chamber can flush the chip at multiple angles, thereby avoiding the problem of flushing blind spots and ensuring the cleaning effect of the chip flux residue. In addition, when the hanging shaft makes periodic swinging motions, it will drive the filter screen slidingly connected to the bottom of the swing plate to make up and down reciprocating motions, so that the residue on the surface of the filter screen is thrown up, and the up and down reciprocating motion of the filter screen can make the residue gradually gather to the second box door during the throwing process, so as to facilitate the removal of the residue after the chip is cleaned.

[0018] 2. In the flux cleaning system with zero wastewater discharge, under the action of the kinetic energy of the cleaning agent sprayed downward from the jet chamber, the swing plate impacted by the cleaning agent is driven to overcome the elastic force of the second spring and move downward, thereby driving the horizontal arm to move downward, so that the inclined surface of the wedge block contacts the inclined surface of the triangle. Under the continuous squeezing of the wedge block, the two limiting grids move toward each other to clamp and fix the chip, thereby preventing the chip from falling off, which is beneficial to the cleaning of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the overall cross-sectional structure of the present invention; Figure 3 It is a cross-sectional view of the structure of the jet cleaning assembly of the present invention; Figure 4 It is a schematic diagram of the structure of the placement and swinging assembly of the present invention; Figure 5 It is a schematic diagram of the structure of the carrier of the present invention; Figure 6 It is a schematic diagram of the structure of the placement body of the present invention; Figure 7 for Figure 6 A schematic diagram of the structure enlargement in the middle; Figure 8 It is a schematic diagram of the structure of the driving body of the present invention; Fig. 9 It is a structural diagram of the waste liquid filtering assembly of the present invention; Fig.10 It is a schematic diagram of displacement of the limiting grid of the present invention; Fig.11 It is a schematic diagram of the activity of the material fixing device of the present invention.

[0020] The meaning of each number in the figure is: 1. jet cleaning assembly; 11. jet box; 111. jet chamber; 112. first box door; 113. second box door; 114. first wall groove; 115. second wall groove; 1151. card slot; 12. circulation pump; 121. circulation pipe; 2. Place the swing assembly; 21. Loading carrier; 211. Hanging shaft; 212. Transverse partition frame; 22. Placement body; 221. Placement frame; 222. Limiting group; 223. Triangle body; 23. Swing plate; 231. Vertical arm; 232. Horizontal arm; 2321. Wedge block; 233. Connecting arm; 24. Driving body; 241. Water wheel; 242. Driving rod; 243. Articulated sleeve; 3. Waste liquid filter assembly; 31. Filter screen; 32. Extension frame. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Chip coating, or thin film deposition, is a surface treatment process used in the chip manufacturing process. Thin film materials are attached to the surface of chip materials through physical or chemical methods. The thickness, composition and structure of the film can be precisely controlled to achieve the desired performance and functions.

[0023] The purpose of this embodiment is to provide a chip coating process, including the following process: S1. First, remove the oxide and dirt on the circuit board, then position the chip on the circuit board and fix the two together; S2. After applying flux on the chip and circuit board, heat the soldering iron and take solder, place the solder on the chip pad, and then press the preheated soldering iron on the solder to melt it and cover the chip pad. After cooling, remove the residual flux through the flux cleaning system with zero wastewater discharge; S3, clean the chip surface again to ensure that there is no dust, oil or other impurities on the surface, and spray the chip surface with oxygen, nitrogen or other gases to remove surface oxides; S4. Then put the circuit board and chip into the vacuum chamber, perform vacuum coating by physical coating or chemical vapor deposition, and then complete the coating process by post-processing.

[0024] Among them, the cleaning effect of the flux cleaning system on the chip flux determines the cleanliness of the chip. If the chip surface is not clean enough, the coating layer will be difficult to adhere firmly to the chip, which may easily lead to peeling, cracking and other problems.

[0025] Therefore, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, the above-mentioned flux cleaning system with zero wastewater discharge is disclosed below, including a jet cleaning component 1 and a swing component 2 and a waste liquid filter component 3 placed in the jet cleaning component 1. The waste liquid filter component 3 is used to filter residues in the liquid.

[0026] The jet cleaning assembly 1 comprises a spray box 11 for spraying liquid and a circulation pump 12 connected to the spray box 11 for liquid circulation; The placement swing assembly 2 includes a material fixing device and a driving body 24 that is transmission-connected to the material fixing device. The top end of the material fixing device is rotationally connected to the inner wall of the spray box 11, and the bottom end of the material fixing device is slidingly connected to the waste liquid filtering assembly 3. The cleaning agent is pumped into the spray box 11 by the circulating pump 12, and the cleaning agent is sprayed downward from the top of the spray box 11. The driving body 24 uses the kinetic energy of the cleaning agent to drive the material fixing device to perform periodic swinging motion, thereby changing the spraying angle of the material to improve the cleaning effect, and the material fixing device drives the waste liquid filtering assembly 3 to perform up and down reciprocating motion to collect and process the residue.

[0027] The above structure is disclosed as follows: First, in order to facilitate the placement of the chip, such as Figure 4 , Figure 5 , Figure 6As shown, the material fixing device includes a loading carrier 21 and a placing body 22 on the loading carrier 21. The loading carrier 21 includes a pair of hanging shafts 211 and a horizontal partition frame 212 connected to the bottom ends of the two hanging shafts 211. The top of the hanging shaft 211 is rotatably connected to the inner wall of the spray box 11. The placing body 22 includes a placing frame 221 located on the horizontal partition frame 212 and a plurality of pairs of limiting groups 222. The limiting group 222 includes two limiting grids slidably connected to the placing frame 221. A first elastic The first spring can push the two limiting grids outward, thereby increasing the distance between the two limiting grids to facilitate the placement of the chip, and a first box door 112 is provided at a corresponding position on the spray box 11. The chip to be cleaned is placed in the two limiting grids of the limiting group 222, and then the placement rack 221 with the chip is placed in the spray box 11, and the bottom end of the placement rack 221 is placed on the cross-partition rack 212, and then the first box door 112 is closed to maintain the closed state in the spray box 11, and the chip is placed.

[0028] After the chip is placed, the residual flux on the chip needs to be cleaned. Figure 3 As shown, a plurality of spray chambers 111 for spraying liquid are provided at the top of the spray box 11, and circulation pipes 121 are connected to the upper and lower ends of the circulation pump 12. The circulation pump 12 is connected to the spray chamber 111 through the circulation pipe 121 arranged at the top, and the circulation pump 12 is connected to the bottom of the spray box 11 through the circulation pipe 121 arranged at the bottom. The circulation pump 12 pumps the cleaning agent into the spray chamber 111 through the circulation pipe 121, and the cleaning agent is sprayed downward through the spray chamber 111 through the material fixing device to rinse the chip to remove the residual flux attached to the chip.

[0029] Due to the blind spots of single-angle spraying, the flux residue blocked by the chip during flushing is difficult to clean, affecting the cleaning effect of the chip. In order to avoid the problem of flux residue being difficult to completely clean due to the blind spots, such as Figure 4 , Figure 5 , Figure 8As shown, the material fixing device also includes a swing plate 23 located at the bottom of the carrier 21, a vertical arm 231 connected to the hanging shaft 211 is provided on the top of the swing plate 23, a first wall groove 114 is provided on the inner wall of the spray box 11, and the driving body 24 includes a water wheel 241 and a driving rod 242 meshed with the water wheel 241. Both ends of the water wheel 241 are rotatably connected to the inner wall of the spray box 11, and the driving rod 242 is located in the first wall groove 114. The upper lead screw of the driving rod 242 is connected to an articulated sleeve 243, and the articulated sleeve 243 is plugged into the bottom of both ends of the swing plate 23. When the detergent passes from top to bottom in the spray box 11, it will contact and drive the water wheel 241 to rotate, thereby driving the driving rod 242 meshed with the water wheel 241 to rotate, and the swing plate 23 is driven by the articulated sleeve 243 connected to the lead screw of the driving rod 242, thereby driving the hanging shaft 211 to perform periodic swinging motion, and its motion is as shown in FIG. Fig.11 As shown by the double-headed arrow c, the relative angle between the chip and the jet chamber 111 can be changed during flushing, so that the cleaning agent sprayed downward from the jet chamber 111 can flush the chip at multiple angles, thereby avoiding the problem of flushing blind spots and ensuring the cleaning effect of the chip flux residue.

[0030] Considering that the hanging shaft 211 will cause the chip to shake unsteadily when performing periodic swinging motion, and the impact force on the chip during washing will cause the chip to fall off from the limit group 222, in order to prevent the chip from falling off, Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, the vertical arm 231 is slidably connected with the hanging shaft 211, the top of the vertical arm 231 is connected to the inner wall of the hanging shaft 211 through a second spring, the top side wall of the vertical arm 231 is provided with a horizontal arm 232, the bottom of the horizontal arm 232 is provided with a plurality of wedges 2321, the tops of the two limiting grids of the limiting group 222 are both provided with a triangular body 223, and the inner wall of the spray box 11 is provided with a second wall groove 115, the inner wall of the spray box 11 is provided with a card groove 1151 at the upper middle part of the second wall groove 115, and the outer wall of the swing plate 23 is correspondingly provided with a card block, and the card block is located in the card groove 1151, as shown in FIG. Fig.10 As shown, when the chip is placed in or taken out, the spray box 11 is in a stopped flushing state. At this time, the card block is stuck in the card slot 1151, so that when the chip is placed in or taken out, the hanging shaft 211 will not swing, thereby reducing the difficulty of chip placement and removal. When the chip is placed and the spray box 11 is in a flushing state, under the kinetic energy of the detergent sprayed downward from the spray chamber 111, the swing plate 23 impacted by the detergent is driven to overcome the elastic force of the second spring and move downward, as shown in FIG. Fig.10As shown by the middle arrow a, the card block enters the second wall groove 115 from the card groove 1151. At this time, under the transmission action of the driving body 24, the swing plate 23 can drive the hanging shaft 211 to perform a periodic swinging motion, and when the swing plate 23 moves downward, it will drive the horizontal arm 232 to move downward, so that the inclined surface of the wedge block 2321 contacts the inclined surface of the triangle 223. Under the continuous extrusion of the wedge block 2321, the two limit grids move toward each other, as shown in FIG. Fig.10 As shown by the middle arrow b, the chip is clamped and fixed to prevent it from falling off. In addition, the cross frame 212 is provided with an inner groove for positioning, and the bottom end of the placement frame 221 is snap-fitted with the inner groove. The placement frame 221 is positioned by setting the inner groove, which not only facilitates the placement of the placement frame 221 on the cross frame 212, but also ensures the contact between the wedge block 2321 and the triangle 223 when the horizontal arm 232 moves downward.

[0031] When the cleaning agent passes through the chip surface, the residual flux will be stripped from the chip surface, and the stripped residue will fall into the bottom of the spray box 11. In order to achieve the recycling of the cleaning agent and take into account the purpose of zero wastewater discharge, Fig. 9 As shown, the waste liquid filtering assembly 3 includes a filter screen 31 arranged at the bottom of the spray box 11, and a second box door 113 for removing residues is arranged at a position corresponding to the side wall of the spray box 11 and the filter screen 31. When the detergent passes through the filter screen 31, the residue is intercepted by the filter screen 31 and remains on the filter screen 31, and the filtered detergent enters the circulation pump 12 through the circulation pipe 121 at the bottom of the spray box 11 to achieve recycling. After the chip is cleaned, the second box door 113 is opened to remove the residue on the surface of the filter screen 31. Considering that the residue accumulated on the surface of the filter screen 31 will block the filter holes of the filter screen 31 and reduce the filtering efficiency of the detergent, an extension frame 32 is arranged on the top of the filter screen 31, and a connecting arm 233 is correspondingly arranged at the bottom of the swing plate 23. The two ends of the connecting arm 233 are located in the extension frame 32 and are slidably connected to the extension frame 32. When the hanging shaft 211 performs periodic swinging motion, the filter screen 31 slidably connected to the bottom of the swing plate 23 will be driven to reciprocate up and down, such as Fig.11 As shown by the arrow d in the middle, the residue on the surface of the filter screen 31 will be thrown up, thereby avoiding the problem of low cleaning agent filtering efficiency caused by clogging of the filter screen 31. The filter screen 31 is placed at an angle at the bottom of the spray box 11, and the lower end of the filter screen 31 faces the second box door 113. By tilting the filter screen 31, the up and down reciprocating motion of the filter screen 31 can make the residue gradually gather at the second box door 113 during the throwing process. Fig.11 As shown by the arrow e in the middle, it is convenient to remove the residue after the chip is cleaned.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A flux cleaning system with zero wastewater discharge, characterized in that: It comprises a jet cleaning component (1), a placement and swinging component (2) and a waste liquid filtering component (3) located in the jet cleaning component (1), wherein the waste liquid filtering component (3) is used to filter residues in liquid; The jet cleaning assembly (1) comprises a spray box (11) for spraying liquid and a circulation pump (12) connected to the spray box (11) for circulating the liquid; The placement swing assembly (2) comprises a material fixing device and a driving body (24) which is transmission-connected to the material fixing device. The top end of the material fixing device is rotationally connected to the inner wall of the spray box (11), and the bottom end of the material fixing device is slidingly connected to the waste liquid filter assembly (3). The driving body (24) uses the kinetic energy of the cleaning agent to drive the material fixing device to perform periodic swinging motion to change the spraying angle of the material, and the material fixing device drives the waste liquid filter assembly (3) to perform up and down reciprocating motion to collect and process the residue.

2. A flux cleaning system with zero wastewater discharge according to claim 1, characterized in that: The material fixing device comprises a loading carrier (21) and a placement body (22) on the loading carrier (21); the loading carrier (21) comprises a pair of hanging shafts (211) and a transverse partition frame (212) connected to the bottom ends of the two hanging shafts (211); the top ends of the hanging shafts (211) are rotatably connected to the inner wall of the spray box (11); the placement body (22) comprises a placement frame (221) located on the transverse partition frame (212) and a plurality of pairs of limit groups (222); the limit groups (222) comprise two limit grids slidably connected to the placement frame (221); a first spring is provided between the two limit grids.

3. A flux cleaning system with zero wastewater discharge according to claim 2, characterized in that: A plurality of spray chambers (111) for spraying liquid are provided at the top of the spray box (11), and circulation pipes (121) are connected to both the upper and lower ends of the circulation pump (12). The circulation pump (12) is connected to the spray chambers (111) via the circulation pipe (121) provided at the top, and the circulation pump (12) is connected to the bottom of the spray box (11) via the circulation pipe (121) provided at the bottom.

4. A flux cleaning system with zero wastewater discharge according to claim 3, characterized in that: The material fixing device further comprises a swing plate (23) located at the bottom of the loading body (21); a vertical arm (231) connected to the hanging shaft (211) is provided at the top of the swing plate (23); a first wall groove (114) is provided on the inner wall of the spray box (11); the driving body (24) comprises a water wheel (241) and a driving rod (242) meshed with the water wheel (241); both ends of the water wheel (241) are rotatably connected to the inner wall of the spray box (11); the driving rod (242) is located in the first wall groove (114); a lead screw on the driving rod (242) is connected to a hinge sleeve (243); and the hinge sleeve (243) is plug-fitted with the bottom of both ends of the swing plate (23).

5. A flux cleaning system with zero wastewater discharge according to claim 4, characterized in that: The vertical arm (231) is slidably connected to the hanging shaft (211); the top end of the vertical arm (231) is connected to the inner wall of the hanging shaft (211) via a second spring; a horizontal arm (232) is provided on the side wall of the top end of the vertical arm (231); a plurality of wedge blocks (2321) are provided at the bottom of the horizontal arm (232); and a triangular body (223) is provided at the top of two limiting grids of the limiting group (222).

6. A flux cleaning system with zero wastewater discharge according to claim 4, characterized in that: The inner wall of the jet box (11) is provided with a second wall groove (115), the inner wall of the jet box (11) is provided with a clamping groove (1151) at a position above the middle of the second wall groove (115), and the outer wall of the swing plate (23) is correspondingly provided with a clamping block, and the clamping block is located in the clamping groove (1151).

7. A flux cleaning system with zero wastewater discharge according to claim 2, characterized in that: The transverse partition frame (212) is provided with an inner groove for positioning, and the bottom end of the placement frame (221) is snap-fitted with the inner groove.

8. A flux cleaning system with zero wastewater discharge according to claim 4, characterized in that: The waste liquid filtering assembly (3) comprises a filter screen (31) arranged at the bottom of the spray box (11), and a second box door (113) for removing residues is arranged at a position corresponding to the filter screen (31) on the side wall of the spray box (11).

9. A flux cleaning system with zero wastewater discharge according to claim 8, characterized in that: An extension frame (32) is provided on the top of the filter screen (31), and a connecting arm (233) is correspondingly provided on the bottom of the swing plate (23), and both ends of the connecting arm (233) are slidably connected to the extension frame (32).

10. A flux cleaning system with zero wastewater discharge according to claim 8, characterized in that: The filter screen (31) is placed obliquely at the bottom of the spray box (11), and the lower end of the filter screen (31) faces the second box door (113).

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