Efficient glass substrate through hole preparation device and structure for generating multiple Bessel beams

Abstract

The invention provides an efficient glass substrate through hole preparation device and a structure for generating multiple Bessel beams, which are applied to the technical field of laser processing, and the method comprises the following steps: splitting Gaussian beams generated by a laser through a beam splitting element to obtain multiple Gaussian beams; according to the method, the multiple Gaussian beams are obtained, then the multiple Gaussian beams are subjected to shaping treatment through the optical shaping element, the multiple Bessel beams are obtained, and compared with a mode that a single Bessel beam is used for preparing the glass substrate through hole, the multiple Bessel beams can be generated, so that the preparation efficiency can be improved; besides, any sub-beam of the multiple Bessel beams used for preparing the glass substrate through hole is directly converted from a Gaussian beam, and due to the fact that the Gaussian beam has the characteristic of symmetry, the formed Bessel beam used for preparing the glass substrate through hole is rounder in light spot formed by focusing, and therefore the high-roundness glass substrate through hole can be prepared.

Description

Technical Field

[0001] The present disclosure relates to the field of laser processing technology, and in particular to the field of glass substrate through-hole preparation technology. Background Art

[0002] Glass substrate is a common material with good optical transparency and mechanical strength. Through Glass Via (TGV) is a vertical channel made in a glass substrate by precision machining. It is widely used in integrated circuits and microelectronic packaging to play the role of electrical connection and heat dissipation. Bessel beams are used in the preparation of through holes in glass substrates due to their long focal depth and non-diffraction characteristics.

[0003] However, the prior art uses a single Bessel light beam to prepare through holes in a glass substrate, which results in low preparation efficiency of the through holes in the glass substrate and cannot meet the needs of large-scale mass production. Summary of the invention

[0004] In view of this, the embodiments of the present disclosure provide an efficient glass substrate through-hole preparation device and a structure for generating multiple Bessel light beams, which at least partially solve the problems existing in the prior art.

[0005] In a first aspect, an embodiment of the present disclosure provides a structure for generating multiple Bessel light beams, including:

[0006] Lasers, beam splitters, optical shaping elements;

[0007] The laser is used to generate a Gaussian beam;

[0008] The beam splitting element is arranged after the laser and is used to perform beam splitting processing on the Gaussian beam generated by the laser to obtain multiple Gaussian beams;

[0009] The optical shaping element is arranged after the beam splitting element, and is used to perform shaping processing on the multiple Gaussian light beams to obtain multiple Bessel light beams.

[0010] Optionally, a beam expander is provided between the laser and the beam splitting element;

[0011] The beam expander is used to expand and collimate the Gaussian beam emitted by the laser to obtain an expanded Gaussian beam;

[0012] Correspondingly, the beam splitting element is used to split the expanded Gaussian beam to obtain multiple Gaussian beams.

[0013] Optionally, a focusing objective lens is arranged after the optical shaping element, and the focusing objective lens is used to focus the multiple Bessel light beams to obtain multiple Bessel focused light spots.

[0014] Optionally, the beam splitting element is any one or a combination of a lens array, a spatial light modulator, and a beam splitter.

[0015] Optionally, the optical shaping element is any one of a conical lens, a toroidal lens, and a spatial light modulator.

[0016] Optionally, the generated multiple Bessel light beams are used for preparing through holes in a glass substrate.

[0017] Optionally, the through hole of the glass substrate is a circular hole.

[0018] Optionally, the central wavelength of the Gaussian light beam generated by the laser is 1035 nm.

[0019] In a second aspect, the present disclosure discloses an efficient device for preparing through-holes in a glass substrate, the device comprising: a structure for generating multiple Bessel light beams as described in the first aspect.

[0020] Optionally, the device further comprises:

[0021] The loading platform is used to load the glass substrate to be processed.

[0022] The present disclosure provides a structure for generating multiple Bessel light beams, comprising: a laser, a beam splitting element, and an optical shaping element; the laser is used to generate a Gaussian light beam; the beam splitting element is arranged after the laser, and is used to perform beam splitting processing on the Gaussian light beam generated by the laser to obtain multiple Gaussian light beams; the optical shaping element is arranged after the beam splitting element, and is used to perform shaping processing on the multiple Gaussian light beams to obtain multiple Bessel light beams. That is to say, the Gaussian beam generated by the laser is first split by a beam splitting element to obtain multiple Gaussian beams, and then the multiple Gaussian beams are shaped by an optical shaping element to obtain multiple Bessel beams. Compared with using a single Bessel beam to prepare a through hole on a glass substrate, the present invention can generate multiple Bessel beams, thereby improving the preparation efficiency; in addition, any sub-beam of the multiple Bessel beams used to prepare a through hole on a glass substrate in the present invention is directly converted from a Gaussian beam, compared with first converting a single Gaussian beam into a single Bessel beam, and then converting the single Bessel beam into multiple Bessel beams for preparing a through hole on a glass substrate (that is, any sub-Bessel beam in the multiple Bessel beams is converted from a Bessel beam), due to the symmetry of the Gaussian beam, the Bessel beam used to prepare a through hole on a glass substrate formed by the former has a more rounded light spot after focusing, thereby being able to prepare a through hole on a glass substrate with high roundness.

[0023] In order to make the above-mentioned objectives, features and advantages of the present disclosure more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present disclosure and are used together with the specification to illustrate the technical solutions of the present disclosure. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can also be obtained based on these drawings without creative work.

[0025] Figure 1 is a schematic structural diagram of a glass substrate through-hole preparation device provided by an embodiment of the present disclosure;

[0026] Figure 2 is a schematic diagram of a stage and a glass substrate provided in an embodiment of the present disclosure;

[0027] Figure 3 This is an example diagram of a top view of a glass substrate provided in an embodiment of the present disclosure.

[0028] The description of the figures is as follows:

[0029] 1-Laser; 2-Beam expander; 3-Gaussian beam; 4-Mirror 1; 5-Mirror 2; 6-Mirror

[0030] 3; 7-beam splitting element; 8-optical shaping element; 9-focusing objective lens; 10-Bessel beam; 11-glass substrate; 12-stage; 13-pressing sheet; 14-glass substrate 1; 15-glass substrate 2; 16-glass substrate through hole. DETAILED DESCRIPTION

[0031] The following describes the implementation methods of the embodiments of the present disclosure through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the embodiments of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The embodiments of the present disclosure can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the embodiments of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the embodiments of the present disclosure.

[0032] like Figure 1 The glass substrate through-hole preparation device shown includes a structure for generating multiple Bessel light beams according to an embodiment of the present disclosure, the structure including:

[0033] Laser 1, beam splitting element 7, optical shaping element 8;

[0034] The laser 1 is used to generate a Gaussian beam 3;

[0035] The beam splitting element 7 is arranged after the laser 1 and is used to split the Gaussian beam 3 generated by the laser 1 to obtain multiple Gaussian beams;

[0036] The optical shaping element 8 is disposed after the beam splitting element 7 and is used to shape the multiple Gaussian beams to obtain multiple Bessel beams.

[0037] Among them, the beam splitting element is any one or a combination of a lens array, a spatial light modulator, and a beam splitter. According to the different requirements for the number of beam splitting, one or more of the lens array, spatial light modulator, and beam splitter can be selected for configuration, that is, one of the three can be selected for beam splitting processing, or two or three of them can be selected for beam splitting processing. Among them, the lens array is an array composed of lenses with a light aperture and a relief depth of micrometers. Like traditional lenses, the smallest functional unit can also be a spherical mirror, an aspherical mirror, a cylindrical mirror, a prism, etc., which can also realize functions such as beam transformation at a micro-optical angle. Among them, the spatial light modulator is a device that modulates the spatial distribution of light waves. Under the control of an electrical drive signal, the amplitude or intensity, phase, polarization state, etc. of the light distribution in space are changed. The spatial light modulator is usually a two-dimensional array, which controls the optical properties of each pixel through an electrical signal, thereby dynamically modulating the entire light beam in space. The beam splitter is a coated glass with one or more layers of thin film coated on the surface of the optical glass. When a beam of light is projected onto the coated glass, the light beam is divided into two or more beams through reflection and refraction. The beam splitting element may also be other elements that can realize the function of the present disclosure and transform the Gaussian beam from one beam to multiple beams.

[0038] Wherein, the optical shaping element is any one of a conical lens, an annular lens, and a spatial light modulator. Wherein, the conical lens is a lens with a special geometric shape, and its surface is usually conical rather than a traditional spherical or flat surface. The unique structure of the conical lens enables it to focus the incident light beam into a special beam form, such as a "Bessel beam" or a "ring beam", not a single focal point. This beam has the characteristics of long focal depth and diffraction insensitivity, and is therefore very useful in certain applications. Wherein, the annular lens is a special lens, which is composed of a central lens with a number of small lenses distributed on the circumference. Its principle is to provide a more uniform light intensity distribution in a larger field of view, avoiding the problem of reduced imaging quality caused by changes in the image field curvature of a single lens. Bessel beams can also be formed by an annular lens or a spatial light modulator. Wherein, the optical shaping element can also be other elements that can realize the function of the present disclosure and convert a Gaussian beam into a Bessel beam.

[0039] Among them, the structure for generating multiple Bessel light beams provided in the embodiment of the present disclosure can be used for the preparation of through holes in a glass substrate, wherein the through holes in the glass substrate are circular through holes; the structure for generating multiple Bessel light beams provided in the embodiment of the present disclosure can also be applied to other scenarios in which Bessel light beams are used to prepare products, to solve the problem of low efficiency in preparing products using a single Bessel light beam, as well as other related scenarios, which are not limited by the present disclosure.

[0040] An embodiment of the present disclosure provides a structure for generating multiple Bessel light beams, comprising: a laser, a beam splitting element, and an optical shaping element; the laser is used to generate a Gaussian light beam; the beam splitting element is arranged after the laser, and is used to perform beam splitting processing on the Gaussian light beam generated by the laser to obtain multiple Gaussian light beams; the optical shaping element is arranged after the beam splitting element, and is used to perform shaping processing on the multiple Gaussian light beams to obtain multiple Bessel light beams. That is to say, the Gaussian beam generated by the laser is first split by a beam splitting element to obtain multiple Gaussian beams, and then the multiple Gaussian beams are shaped by an optical shaping element to obtain multiple Bessel beams. Compared with using a single Bessel beam to prepare a through hole on a glass substrate, the present invention can generate multiple Bessel beams, thereby improving the preparation efficiency; in addition, any sub-beam of the multiple Bessel beams used to prepare a through hole on a glass substrate in the present invention is directly converted from a Gaussian beam, compared with first converting a single Gaussian beam into a single Bessel beam, and then converting the single Bessel beam into multiple Bessel beams for preparing a through hole on a glass substrate (that is, any sub-Bessel beam in the multiple Bessel beams is converted from a Bessel beam), due to the symmetry of the Gaussian beam, the Bessel beam used to prepare a through hole on a glass substrate formed by the former has a more rounded light spot after focusing, thereby being able to prepare a through hole on a glass substrate with high roundness.

[0041] In addition, in the process of splitting and shaping the Gaussian beam generated by the laser, due to the good symmetry of the Gaussian beam, its spatial distribution law is simple and stable, and the splitting process is easier to achieve controllability. The beam splitting system can effectively optimize the distribution of the sub-beams through optical design, so that the power and phase errors are controlled within a reasonable range; especially when the system is adjusted in a small range, the symmetry of the Gaussian beam is not easily destroyed, thereby ensuring the stability of the system performance. When the multiple Gaussian beams obtained by splitting the Gaussian laser are shaped, due to the phase and intensity distribution rules of each sub-beam, it is easier to meet the conditions for generating Bessel beams. Through reasonable optical design and interference shaping, multiple Gaussian beams can be efficiently converted into Bessel beam spots with good symmetry and uniformity. Therefore, splitting the Gaussian beam first and then shaping it is not only simple to operate and has high optimization feasibility, but also can effectively improve the final beam quality and generate a highly symmetrical spot that meets the application requirements. Finally, a TGV structure with high circularity and high aspect ratio can be produced.

[0042] The present disclosure provides a possible implementation method, such as Figure 1 As shown, a beam expander 2 is arranged between the laser and the beam splitting element;

[0043] The beam expander 2 is used to expand and collimate the Gaussian beam emitted by the laser to obtain an expanded Gaussian beam;

[0044] Correspondingly, the beam splitting element is used to split the expanded Gaussian beam to obtain multiple Gaussian beams.

[0045] Specifically, different numbers of reflectors can be configured according to different requirements for device size (length, width, height), such as Figure 1 As shown, three reflectors are arranged after the beam expander 2 ( Figure 1 By changing the optical path structure (reflector 1, reflector 2, reflector 3), the size of the device can be controlled.

[0046] Among them, a beam expander is an optical device used to expand the diameter of a light beam. It is usually used in laser systems. Its main function is to increase the diameter of the light beam, which helps to reduce the divergence angle of the light beam, especially when propagating over long distances, to keep the beam expansion smaller.

[0047] In the disclosed embodiment, a Gaussian beam emitted by a laser is expanded and collimated by a beam expander to obtain an expanded and collimated Gaussian beam, which can improve the quality of subsequent Bessel beam generation.

[0048] The embodiment of the present disclosure provides a possible implementation method, wherein a focusing lens 9 is arranged after the optical shaping element, and the focusing lens 9 is used to focus the multiple Bessel light beams so that the Bessel light beams 10 after passing through the focusing lens 9 can be focused to obtain multiple Bessel focused light spots.

[0049] Among them, the focusing objective is a precision optical component, which is mainly used to focus the light beam to a very small point or a specific position. It is usually used in equipment that requires high-precision focusing, such as microscopes, laser processing, and precision measurement. Its design features enable it to concentrate the energy of the light beam in a smaller area, thereby achieving high-resolution and high-power-density optical processing.

[0050] In the disclosed embodiment, the multiple Gaussian light beams are focused by a focusing objective lens, so as to obtain a focused light spot for preparing a through hole in a glass substrate.

[0051] The embodiment of the present disclosure provides a possible implementation method, wherein the generated multiple Bessel light beams are used for preparing through holes in a glass substrate.

[0052] Specifically, the through hole of the glass substrate is a circular hole. Specifically, the central wavelength of the Gaussian beam generated by the laser is 100 to 1400 nm, and the pulse width is 200 to 30000×10 -15 s, repetition frequency is 1 to 10 3 kHz tuning; the aperture range of the circular through holes etched on the glass substrate is 1μm-50μm, the aspect ratio is between 5:1 and 100:1, and the density is ≥20,000 / cm 2.

[0053] Specifically, through experiments conducted by the inventors of the present disclosure, when the central wavelength of the Gaussian beam generated by the laser is 1035 nm, the generated Bessel beam can prepare a high-roundness through-hole in a glass substrate.

[0054] The present disclosure discloses a device for preparing a through-hole in a glass substrate, the device comprising:

[0055] Laser 1, beam splitting element 7, optical shaping element 8;

[0056] The laser 1 is used to generate a Gaussian beam 3;

[0057] The beam splitting element 7 is arranged after the laser 1 and is used to split the Gaussian beam 3 generated by the laser 1 to obtain multiple Gaussian beams;

[0058] The optical shaping element 8 is arranged after the beam splitting element 7, and is used to shape the multiple Gaussian beams to obtain multiple Bessel beams;

[0059] A focusing lens 9 is arranged behind the optical shaping element 8, and the focusing lens 9 is used to focus the obtained multiple Bessel light beams to obtain multiple Bessel focused light spots;

[0060] The device also includes a stage 12, which is used to carry the glass substrate to be processed. Figure 2 14 glass substrate 1, 15 glass substrate 2, wherein the glass substrate can be fixed on the stage 12 by a pressing plate 13). The positional relationship between the glass substrate on the stage and the aforementioned generated Bessel focusing spot can be adjusted accordingly, so that the through hole of the glass substrate can be prepared. Among them, the through hole of the glass substrate is a circular hole. Since any of the multiple Bessel light beams used in the embodiment of the present disclosure is transformed from a Gaussian light beam, and since the Gaussian light beam has a symmetric characteristic, the focused spot obtained after it is focused by the focusing objective lens is more round, so that a high-roundness through hole 16 of the glass substrate can be prepared (such as Figure 3 shown).

[0061] Exemplarily, a method for using a glass substrate through-hole preparation device disclosed herein may be:

[0062] 1. Place the glass substrate 1 and the glass substrate 2 to be processed (there may be more glass substrates) on the stage and ensure that they are firmly fixed on a horizontal surface.

[0063] 2. Start the laser to generate a laser beam. The generated laser beam is a Gaussian beam. After being expanded and collimated by a beam expander, the laser beam enters the optical beam splitter. Under the action of the optical beam splitter, the laser beam is modulated into multiple parallel Gaussian beams. Then, these beams are converted into multiple Bessel beams through optical shaping elements such as a conical lens, annular lens or spatial light modulator. Finally, multiple Bessel beams are focused by a focusing objective to form multiple Bessel focused spots. Among them, the central wavelength of the beam generated by the laser can be 100-1400nm, and the pulse width is 200-30000×10 -15 s, repetition frequency is 1-10 3 kHz tuning.

[0064] 3. The position of the stage is controlled by the control program to move it under the focusing objective lens, thereby ensuring that the laser beam can evenly scan multiple glass substrates to complete the drilling process of the glass substrates.

[0065] 4. The punched glass substrate is placed in an etching solution for etching, thereby forming a precise high aspect ratio TGV structure (glass substrate through hole) array on the glass substrate.

[0066] The embodiment of the present disclosure provides a device for preparing a through hole in a glass substrate. The device can firstly split a Gaussian beam generated by a laser through a beam splitting element to obtain multiple Gaussian beams, and then shape the obtained multiple Gaussian beams through an optical shaping element to obtain multiple Bessel beams. Compared with using a single Bessel beam to prepare a through hole in a glass substrate, the present disclosure can generate multiple Bessel beams, thereby improving the preparation efficiency. In addition, any sub-beam of the multiple Bessel beams used for preparing a through hole in a glass substrate in the present disclosure is directly transformed from a Gaussian beam. Compared with first transforming a single Gaussian beam into a single Bessel beam, and then transforming the single Bessel beam into multiple Bessel beams for preparing a through hole in a glass substrate (i.e., any sub-Bessel beam in the multiple Bessel beams is transformed from a Bessel beam), since the Gaussian beam has a symmetric characteristic, the Bessel beam used for preparing a through hole in a glass substrate formed by the former has a more rounded light spot after focusing, thereby being able to prepare a through hole in a glass substrate with a high roundness.

[0067] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the embodiments of the present disclosure. The drawings only show components related to the embodiments of the present disclosure rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0068] The following embodiments of the present disclosure are provided by specific specific examples to illustrate the embodiments of the present disclosure. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0069] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein may be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein may be implemented independently of any other aspect, and two or more of these aspects may be combined in various ways. For example, any number of aspects described herein may be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein may be used to implement this device and / or practice this method.

[0070] The embodiments described above are part of the embodiments of the present disclosure, but not all of them. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the embodiments of the present disclosure.

[0071] In the description of the embodiments of the present disclosure, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present disclosure. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0072] In the description of the embodiments of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0073] The above are only specific implementations of the embodiments of the present disclosure, but the protection scope of the embodiments of the present disclosure is not limited thereto. Any changes or replacements that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the embodiments of the present disclosure should be included in the protection scope of the embodiments of the present disclosure. Therefore, the protection scope of the embodiments of the present disclosure should be based on the protection scope of the claims.

Claims

1. A structure for generating multiple Bessel beams, characterized in that: include: Lasers, beam splitters, optical shaping elements; The laser is used to generate a Gaussian beam; The beam splitting element is arranged after the laser and is used to perform beam splitting processing on the Gaussian beam generated by the laser to obtain multiple Gaussian beams; The optical shaping element is arranged after the beam splitting element, and is used to perform shaping processing on the multiple Gaussian light beams to obtain multiple Bessel light beams.

2. The structure according to claim 1, characterized in that: A beam expander is arranged between the laser and the beam splitting element; The beam expander is used to expand and collimate the Gaussian beam emitted by the laser to obtain an expanded Gaussian beam; Correspondingly, the beam splitting element is used to perform beam splitting processing on the expanded Gaussian beam to obtain multiple Gaussian beams.

3. The structure according to claim 1, characterized in that: A focusing lens is arranged behind the optical shaping element, and the focusing lens is used to focus the multiple Bessel light beams to obtain multiple Bessel focusing spots.

4. The structure according to claim 1, characterized in that The beam splitting element is any one or a combination of a lens array, a spatial light modulator, and a beam splitter.

5. The structure according to claim 1, characterized in that: The optical shaping element is any one of a conical lens, a toroidal lens, and a spatial light modulator.

6. The structure according to any one of claims 1 to 5, characterized in that: The generated multiple Bessel light beams are used for preparing through holes in a glass substrate.

7. The structure according to claim 6, characterized in that The through hole of the glass substrate is a circular hole.

8. The structure according to claim 7, characterized in that The central wavelength of the Gaussian beam generated by the laser is 1035 nm.

9. An efficient glass substrate through-hole preparation device, characterized in that: The device comprises: a structure for generating multiple Bessel light beams as described in any one of claims 1 to 8.

10. The device according to claim 9, characterized in that The device also includes: The loading platform is used to load the glass substrate to be processed.

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