Silicon wafer grinding device and method and readable storage medium

Abstract

The invention provides a silicon wafer grinding device and method and a readable storage medium, and relates to the technical field of semiconductor processing. The silicon wafer grinding device comprises a grinding assembly; the grinding assembly comprises a grinding wheel flange plate, a shaft body, a supporting structure and an adjusting unit. The grinding wheel flange plate is arranged at the first end of the shaft body and is used for grinding a silicon wafer; the supporting structure is arranged below the shaft body, and the difference value between the first distance and the second distance is smaller than a preset value; the first distance is the distance between the supporting structure and the first end of the shaft body, and the second distance is the distance between the supporting structure and the second end of the shaft body; the adjusting unit is arranged at the second end of the shaft body and used for controlling the second end of the shaft body to move in the target direction, and the target direction is the direction perpendicular to the axis of the shaft body. The problems that in the prior art, a vertical grinding device cannot adjust the grinding precision of the edge of the silicon wafer, and the quality of the silicon wafer is affected are solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a silicon wafer grinding device, method and readable storage medium. Background Art

[0002] During the silicon wafer processing, the edge surface of the silicon wafer after cutting has edges, burrs, broken edges, and even cracks or other defects. In order to increase the mechanical strength of the silicon wafer edge surface and reduce particle contamination, the silicon wafer edge surface needs to be ground. Among them, the grinding methods for silicon wafers include horizontal grinding and vertical grinding.

[0003] During the vertical grinding of silicon wafers, the silicon wafers are ground by a grinding wheel, but the grinding wheel has a problem of poor grinding accuracy on the edge of the silicon wafer. The existing vertical grinding device cannot adjust the angle of the grinding wheel, resulting in the vertical grinding device being unable to adjust the grinding accuracy of the silicon wafer edge, thereby affecting the quality of the silicon wafer. Summary of the invention

[0004] The embodiments of the present invention provide a silicon wafer grinding device, method and readable storage medium, which are used to solve the problem that the vertical grinding device in the prior art cannot adjust the grinding accuracy of the silicon wafer edge, thus affecting the quality of the silicon wafer.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] In a first aspect, an embodiment of the present invention provides a silicon wafer polishing device, comprising: a polishing assembly;

[0007] The grinding assembly comprises: a grinding wheel flange, a shaft, a supporting structure and an adjustment unit;

[0008] The grinding wheel flange is arranged at the first end of the shaft body and is used for grinding the silicon wafer;

[0009] The support structure is arranged below the shaft, and the difference between the first distance and the second distance is less than a preset value; the first distance is the distance between the support structure and the first end of the shaft, and the second distance is the distance between the support structure and the second end of the shaft;

[0010] The adjustment unit is disposed at the second end of the shaft body, and is used to control the second end of the shaft body to move along a target direction, where the target direction is a direction perpendicular to the axis of the shaft body.

[0011] Optionally, the silicon wafer grinding device comprises: two sets of the grinding components;

[0012] The two groups of grinding components are arranged opposite to each other and are used to grind two opposite surfaces of the silicon wafer respectively.

[0013] Optionally, the adjustment unit comprises: a servo motor;

[0014] The output shaft of the servo motor is arranged perpendicular to the axis of the shaft body;

[0015] When the servo motor is in a first state, the output shaft extends out of the servo motor and lifts up the second end of the shaft body; when the servo motor is in a second state, the output shaft retracts into the servo motor and presses down the second end of the shaft body.

[0016] Optionally, the adjustment unit comprises: a servo motor and a counterweight;

[0017] The counterweight block is movably connected to the second end of the shaft body;

[0018] The output shaft of the servo motor is connected to the counterweight;

[0019] When the servo motor is in a first state, the output shaft extends out of the servo motor and drives the counterweight block to approach the supporting structure so that the first end of the shaft body tilts downward; when the servo motor is in a second state, the output shaft retracts into the servo motor and drives the counterweight block away from the supporting structure so that the first end of the shaft body tilts upward.

[0020] Optionally, the silicon wafer grinding device further includes:

[0021] A disc carrier for carrying silicon wafers;

[0022] The disc carrier is arranged on a side of the grinding component close to the grinding wheel flange and can rotate around the axis of the disc carrier.

[0023] Optionally, the silicon wafer grinding device further includes:

[0024] A distance measuring unit, used to measure the moving distance of the counterweight;

[0025] The angle measuring unit is used to measure the offset angle of the grinding wheel flange.

[0026] In a second aspect, an embodiment of the present invention provides a silicon wafer grinding method, which is applied to the silicon wafer grinding device as described above, comprising:

[0027] The adjustment unit is operated to control the second end of the shaft to move along the target direction, so as to adjust the angle of the grinding wheel flange relative to the silicon wafer.

[0028] Optionally, controlling the second end of the shaft to move along the target direction by running the adjustment unit includes:

[0029] The servo motor is operated to drive the counterweight to move along the shaft body, so that the second end of the shaft body moves along the target direction.

[0030] Optionally, controlling the second end of the shaft to move along the target direction by running the adjustment unit includes:

[0031] The adjusting unit is operated, and the second end of the shaft body is driven to move along the target direction by extending or retracting the output shaft of the adjusting unit.

[0032] In a third aspect, an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the silicon wafer grinding method as described above when executed by a processor.

[0033] The beneficial effects of the present invention are:

[0034] The silicon wafer grinding device of the embodiment of the present application can control the second end of the shaft body to move upward or downward in a direction perpendicular to the axis of the shaft body by setting the adjustment unit at the second end of the shaft body, thereby adjusting the angle of the grinding wheel flange set at the second end of the shaft body relative to the silicon wafer to be ground, and further adjusting the grinding flatness of the edge of the silicon wafer in the continuous grinding process state. This solves the problem that the vertical grinding device in the prior art cannot adjust the grinding accuracy of the silicon wafer edge, affecting the quality of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram showing the structure of a silicon wafer polishing device according to an embodiment of the present invention;

[0036] Figure 2 A schematic diagram showing the structure of a grinding assembly according to an embodiment of the present invention;

[0037] Figure 3 A schematic diagram showing adjustment of a grinding wheel flange according to an embodiment of the present invention;

[0038] Figure 4 A schematic diagram showing the steps of a silicon wafer grinding method according to an embodiment of the present invention;

[0039] Figure 5 A schematic diagram showing a module of a silicon wafer polishing method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0040] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help fully understand the embodiments of the present invention. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. In addition, for clarity and brevity, the description of known functions and structures is omitted.

[0041] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0042] Aiming at the problem that the prior art neutral grinding device cannot adjust the grinding accuracy of the silicon wafer edge, thus affecting the quality of the silicon wafer, the present invention provides a silicon wafer grinding device, method and readable storage medium.

[0043] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a silicon wafer grinding device, comprising: a grinding component 1;

[0044] The grinding assembly 1 comprises: a grinding wheel flange 11, a shaft 12, a supporting structure 13 and an adjustment unit;

[0045] The grinding wheel flange 11 is disposed at the first end of the shaft 12 and is used for grinding the silicon wafer;

[0046] The support structure 13 is disposed below the shaft body 12, and the difference between the first distance and the second distance is less than a preset value; the first distance is the distance between the support structure 13 and the first end of the shaft body 12, and the second distance is the distance between the support structure 13 and the second end of the shaft body 12;

[0047] The adjustment unit is disposed at the second end of the shaft body 12 and is used to control the second end of the shaft body 12 to move along a target direction, where the target direction is a direction perpendicular to the axis of the shaft body 12 .

[0048] Optionally, a grinding wheel 15 is disposed on the grinding wheel flange 11 for grinding the silicon wafer.

[0049] In the embodiment of the present application, the shaft, the support structure and the adjustment unit form a lever; the adjustment unit controls the second end of the shaft to move upward, and the first end of the shaft to move downward, so that the angle between the grinding wheel flange and the silicon wafer becomes larger, such as Figure 3 shown.

[0050] In an embodiment of the present application, a lever is formed by the shaft, the support structure and the adjustment unit; the adjustment unit controls the second end of the shaft to move downward, and causes the first end of the shaft to move upward, so that the angle between the grinding wheel flange and the silicon wafer becomes smaller.

[0051] The silicon wafer grinding device of the embodiment of the present application can control the second end of the shaft body to move upward or downward in a direction perpendicular to the axis of the shaft body by setting the adjustment unit at the second end of the shaft body, thereby adjusting the angle of the grinding wheel flange set at the second end of the shaft body relative to the silicon wafer to be ground, and further adjusting the grinding flatness of the edge of the silicon wafer in the continuous grinding process state. This solves the problem that the vertical grinding device in the prior art cannot adjust the grinding accuracy of the silicon wafer edge, affecting the quality of the silicon wafer.

[0052] Optionally, the silicon wafer grinding device comprises: two groups of the grinding components 1;

[0053] The two groups of grinding components 1 are arranged opposite to each other and are used to grind two opposite surfaces of the silicon wafer respectively.

[0054] The silicon wafer grinding device of the embodiment of the present application can grind two opposite surfaces of the silicon wafer at the same time by respectively arranging the grinding components on two opposite surfaces of the silicon wafer; the angle between the grinding wheel flange and the silicon wafer is adjusted by two groups of the grinding components, so that the grinding flatness of the edge of the silicon wafer can be adjusted without stopping the machine.

[0055] Optionally, the adjustment unit comprises: a servo motor 16;

[0056] The output shaft 161 of the servo motor 16 is arranged perpendicular to the axis of the shaft body 12;

[0057] When the servo motor 16 is in the first state, the output shaft 161 extends out of the servo motor 16 and lifts up the second end of the shaft body 12; when the servo motor 16 is in the second state, the output shaft 161 retracts into the servo motor 16 and presses down the second end of the shaft body 12.

[0058] Optionally, the output shaft of the servo motor is connected to the shaft body.

[0059] The silicon wafer grinding device of the embodiment of the present application can control the second end of the shaft to move in a target direction through the servo motor, thereby controlling the grinding wheel flange located at the first end of the shaft to move in the opposite direction of the target direction, thereby automatically adjusting the grinding flatness of the edge of the silicon wafer without stopping the machine.

[0060] Optionally, the adjustment unit comprises: a servo motor and a counterweight;

[0061] The counterweight block is movably connected to the second end of the shaft body;

[0062] The output shaft of the servo motor is connected to the counterweight;

[0063] When the servo motor is in a first state, the output shaft extends out of the servo motor and drives the counterweight block to approach the supporting structure so that the first end of the shaft body tilts downward; when the servo motor is in a second state, the output shaft retracts into the servo motor and drives the counterweight block away from the supporting structure so that the first end of the shaft body tilts upward.

[0064] Optionally, the counterweight is suspended on the shaft through a ring;

[0065] Wherein, the circular ring passes through the counterweight block and is nested on the shaft body.

[0066] In the embodiment of the present application, when the servo motor pushes the counterweight block, it drives the ring to move relative to the shaft.

[0067] Optionally, the counterweight block is an internal hollow structure, and the counterweight block is nested on the shaft body.

[0068] The silicon wafer grinding device of the embodiment of the present application can control the second end of the shaft to move along the target direction through the cooperation of the counterweight block and the servo motor, thereby adjusting the angle between the flange disk on the second end of the shaft and the silicon wafer, thereby achieving the purpose of adjusting the grinding flatness of the edge of the silicon wafer.

[0069] Optionally, the silicon wafer grinding device further includes:

[0070] The disc carrier 2 is used to carry the silicon wafer;

[0071] The disc carrier 2 is disposed on a side of the grinding assembly 1 close to the grinding wheel flange 11 and is capable of rotating around the axis of the disc carrier 2 .

[0072] In the embodiment of the present application, a silicon wafer is respectively bonded to the two opposite surfaces of the disc carrier, and the two groups of grinding components grind the silicon wafers located on the same side of the disc carrier respectively, thereby adjusting the edge flatness of the two silicon wafers respectively, thereby improving the grinding efficiency.

[0073] Optionally, the silicon wafer grinding device further includes:

[0074] A distance measuring unit, used to measure the moving distance of the counterweight;

[0075] The angle measuring unit is used to measure the offset angle of the grinding wheel flange.

[0076] Before the silicon wafer grinding device leaves the factory, the distance measuring unit and the angle measuring unit are used in combination to measure the correspondence between the moving distance of the counterweight block and the offset angle of the grinding wheel flange. Therefore, during the use of the device outside the factory, the adjustment distance of the counterweight block can be determined according to the angle of the grinding wheel flange that needs to be adjusted.

[0077] After the silicon wafer grinding device has been used for a period of time, the distance measuring unit and the angle measuring unit can be used to detect whether there is an error between the correspondence between the moving distance of the counterweight block and the offset angle of the grinding wheel flange and the original data, thereby adjusting the correspondence between the moving distance of the counterweight block and the offset angle of the grinding wheel flange according to the error, so that the grinding device is in a high-precision working state and the grinding accuracy of the silicon wafer is guaranteed.

[0078] like Figure 4 As shown, the embodiment of the present application also provides a silicon wafer grinding method, which is applied to the silicon wafer grinding device as described above, and includes the following steps:

[0079] Step 401: Control the second end of the shaft to move along the target direction by running the adjustment unit to adjust the angle of the grinding wheel flange relative to the silicon wafer.

[0080] In one embodiment of the present application, a lever is formed by the shaft, the supporting structure and the adjustment unit; by operating the adjustment unit, the second end of the shaft is controlled to move upward, and the first end of the shaft is moved downward, so that the angle between the grinding wheel flange and the silicon wafer becomes larger.

[0081] In one embodiment of the present application, a lever is formed by the shaft, the supporting structure and the adjustment unit; by operating the adjustment unit, the second end of the shaft is controlled to move downward, and the first end of the shaft is moved upward, so that the angle between the grinding wheel flange and the silicon wafer becomes smaller.

[0082] Optionally, controlling the second end of the shaft body to move along the target direction by running the adjustment unit includes:

[0083] The servo motor is operated to drive the counterweight to move along the shaft body, so that the second end of the shaft body moves along the target direction.

[0084] In the embodiment of the present application, when the adjustment unit includes the servo motor and the counterweight, the servo motor is operated in the forward direction, and the output shaft of the servo motor extends out of the servo motor, so that the counterweight moves along the shaft body, thereby controlling the first end of the shaft body to tilt downward, and the angle between the grinding wheel flange and the silicon wafer becomes larger.

[0085] In the embodiment of the present application, when the adjustment unit includes the servo motor and the counterweight, the servo motor runs in reverse, and the output shaft of the servo motor retracts the servo motor, causing the counterweight to move along the shaft, thereby controlling the first end of the shaft to tilt upward, and the angle between the grinding wheel flange and the silicon wafer becomes smaller.

[0086] Optionally, controlling the second end of the shaft body to move along the target direction by running the adjustment unit includes:

[0087] The adjusting unit is operated, and the second end of the shaft body is driven to move along the target direction by extending or retracting the output shaft of the adjusting unit.

[0088] In the embodiment of the present application, when the adjustment unit includes the servo motor, the output shaft of the servo motor is arranged perpendicular to the axis of the shaft body; when the servo motor runs in the forward direction, the output shaft of the servo motor extends out of the servo motor, lifts the second end of the shaft body, thereby controlling the first end of the shaft body to tilt downward, and the angle between the grinding wheel flange and the silicon wafer becomes larger.

[0089] In the embodiment of the present application, when the adjustment unit includes the servo motor, the output shaft of the servo motor is arranged perpendicular to the axis of the shaft body; when the servo motor runs in the forward direction, the output shaft of the servo motor extends out of the servo motor, lifts the second end of the shaft body, thereby controlling the first end of the shaft body to tilt downward, and the angle between the grinding wheel flange and the silicon wafer becomes larger.

[0090] like Figure 5 As shown, the embodiment of the present application further provides a silicon wafer polishing device 500, comprising:

[0091] The adjustment module 501 is used to control the second end of the shaft to move along the target direction by running the adjustment unit, so as to adjust the angle of the grinding wheel flange relative to the silicon wafer.

[0092] Optionally, the adjustment module is further used to:

[0093] The servo motor is operated to drive the counterweight to move along the shaft body, so that the second end of the shaft body moves along the target direction.

[0094] Optionally, the adjustment module is further used to:

[0095] The adjusting unit is operated, and the second end of the shaft body is driven to move along the target direction by extending or retracting the output shaft of the adjusting unit.

[0096] In addition, a specific embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the steps of the above-mentioned silicon wafer grinding method are implemented. And the same technical effect can be achieved, so it will not be repeated here to avoid repetition.

[0097] The embodiment of the present application also provides a computer program product, including computer instructions. When the computer instructions are executed by a processor, the various processes of the above-mentioned silicon wafer grinding method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, they are not repeated here.

[0098] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the scope of protection of the present invention.

Claims

1. A silicon wafer polishing device, characterized in that: include: grinding components; The grinding assembly comprises: a grinding wheel flange, a shaft, a supporting structure and an adjustment unit; The grinding wheel flange is arranged at the first end of the shaft body and is used for grinding the silicon wafer; The support structure is arranged below the shaft, and the difference between the first distance and the second distance is less than a preset value; the first distance is the distance between the support structure and the first end of the shaft, and the second distance is the distance between the support structure and the second end of the shaft; The adjustment unit is disposed at the second end of the shaft body, and is used to control the second end of the shaft body to move along a target direction, where the target direction is a direction perpendicular to the axis of the shaft body.

2. The silicon wafer polishing device according to claim 1, characterized in that: include: two sets of said grinding assemblies; The two groups of grinding components are arranged opposite to each other and are used to grind two opposite surfaces of the silicon wafer respectively.

3. The silicon wafer polishing device according to claim 1, characterized in that: The adjustment unit comprises: a servo motor; The output shaft of the servo motor is arranged perpendicular to the axis of the shaft body; When the servo motor is in a first state, the output shaft extends out of the servo motor and lifts up the second end of the shaft body; when the servo motor is in a second state, the output shaft retracts into the servo motor and presses down the second end of the shaft body.

4. The silicon wafer polishing device according to claim 1, characterized in that: The adjustment unit comprises: a servo motor and a counterweight; The counterweight block is movably connected to the second end of the shaft body; The output shaft of the servo motor is connected to the counterweight; When the servo motor is in a first state, the output shaft extends out of the servo motor and drives the counterweight block to approach the supporting structure so that the first end of the shaft body tilts downward; when the servo motor is in a second state, the output shaft retracts into the servo motor and drives the counterweight block away from the supporting structure so that the first end of the shaft body tilts upward.

5. The silicon wafer polishing device according to claim 1, characterized in that: Also includes: A disc carrier for carrying silicon wafers; The disc carrier is arranged on a side of the grinding component close to the grinding wheel flange and can rotate around the axis of the disc carrier.

6. The silicon wafer polishing device according to claim 4, characterized in that: Also includes: A distance measuring unit, used to measure the moving distance of the counterweight; The angle measuring unit is used to measure the offset angle of the grinding wheel flange.

7. A silicon wafer grinding method, applied to the silicon wafer grinding device according to any one of claims 1 to 6, characterized in that: include: The adjustment unit is operated to control the second end of the shaft to move along the target direction, so as to adjust the angle of the grinding wheel flange relative to the silicon wafer.

8. The silicon wafer grinding method according to claim 7, characterized in that: Controlling the second end of the shaft body to move along the target direction by running the adjustment unit includes: The servo motor is operated to drive the counterweight block to move along the shaft body, so that the second end of the shaft body moves along the target direction.

9. The silicon wafer grinding method according to claim 7, characterized in that: Controlling the second end of the shaft body to move along the target direction by running the adjustment unit includes: The adjusting unit is operated, and the second end of the shaft body is driven to move along the target direction by extending or retracting the output shaft of the adjusting unit.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method for adjusting the flatness of a silicon wafer polishing as claimed in any one of claims 7 to 9 are implemented.

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