High-reflection flexible thin film, transparent assembly, window assembly and assembly

Abstract

The invention discloses a high-reflection flexible thin film, a transparent assembly, a window assembly and a combination. The thin film comprises a base material; the upper bottom coating and the lower bottom coating are arranged on the two sides of the base material layer; an upper IM layer and a lower IM layer are respectively arranged on the upper bottom coating and the lower bottom coating; a base coat, a first niobium oxide layer, a silicon dioxide layer, a second niobium oxide layer, a tin oxide layer, a mixed target layer, a titanium oxide layer, an ITO layer or an SIO layer are sequentially formed on the upper IM layer through magnetron coating sputtering, the atmosphere of magnetron coating sputtering is the mixed atmosphere of argon, nitrogen and oxygen, and the atmosphere in the coating process meets the conditions that the partial pressure of rare gas is always kept consistent with that of nitrogen, and the partial pressure of titanium oxide is kept consistent with that of the other rare gas; the ratio of P (rare gas) to P (nitrogen) is (1.7-4): 1; and the oxygen partial pressure is reduced along with the increase of the number of the plating layers, and P (oxygen): P (nitrogen) = (0.14-0.5): 1.

Description

Technical Field

[0001] The invention belongs to the technical field of optical films, and in particular relates to a highly reflective flexible film, a transparent component, a window component and a combination thereof. Background Art

[0002] High reflective film is an important optical film with a wide range of applications. In most cases, the requirement for reflective film is that the reflectivity in the working spectrum is as high as possible. In some special occasions, not only high reflectivity is required, but also the absorption of the film is required to be very small, because the projected light is still useful. It has the effects of sun protection, heat insulation, UV protection, energy saving and cooling, and is mostly used in architectural glass. In order to meet the application requirements, high reflective film needs to be optimized and improved in many aspects such as hardness, bonding, and wear resistance.

[0003] Therefore, in view of the above technical problems, it is necessary to provide a highly reflective flexible film, a transparent component, a window component and a combination.

[0004] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0005] The object of the present invention is to provide a highly reflective flexible film, a transparent component, a window component and a combination thereof.

[0006] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows:

[0007] A highly reflective flexible film comprises a substrate; an upper primer layer and a lower primer layer on both sides of the substrate layer; an upper IM layer and a lower IM layer respectively arranged on the upper primer layer and the lower primer layer; a primer layer, a first niobium oxide layer, a silicon dioxide layer, a second niobium oxide layer, a tin oxide layer, a mixed target layer, a titanium oxide layer, an ITO layer or a SIO layer are sequentially formed on the upper IM layer by magnetron sputtering, wherein the atmosphere of the magnetron sputtering is a mixed atmosphere of argon, nitrogen and oxygen, and during the plating process, the atmosphere satisfies the following conditions:

[0008] The partial pressure of the noble gas and nitrogen is always consistent and satisfies P (稀有气体) :P (氮气) =(1.7-4):1; and

[0009] The oxygen partial pressure decreases with the increase of the number of coatings, satisfying P (氧气) :P (氮气) =(0.14-0.5):1.

[0010] In one or more embodiments of the present invention, the noble gas is selected from argon and helium.

[0011] In one or more embodiments of the present invention, the noble gas is argon.

[0012] In one or more embodiments of the present invention, the atmosphere during the plating process satisfies:

[0013] The partial pressure of the noble gas and nitrogen is always consistent and satisfies P (稀有气体) :P (氮气) =(2.3-3.7):1.

[0014] In one or more embodiments of the present invention, the atmosphere during the plating process satisfies:

[0015] The partial pressure of the noble gas and nitrogen is always consistent and satisfies P (稀有气体) :P (氮气) =(2.7-3.1):1.

[0016] In one or more embodiments of the present invention, the atmosphere during the plating process satisfies: the oxygen partial pressure decreases as the number of plating layers increases, satisfying P (氧气) :P (氮气) =(0.16-0.35):1.

[0017] In one or more embodiments of the present invention, the atmosphere during the plating process satisfies: the oxygen partial pressure decreases as the number of plating layers increases, satisfying P (氧气) :P (氮气) =(0.16-0.22):1.

[0018] In one or more embodiments of the present invention, the translucent component includes a translucent carrier (such as glass) and a highly reflective flexible film carried on the carrier.

[0019] In one or more embodiments of the present invention, a window assembly includes a frame structure having a limiting structure (the frame structure is such as a frame of a window, etc.) and a component constrained to the limiting structure.

[0020] In one or more embodiments of the present invention, a combination (the combination may be a building, a vehicle, etc.) includes a main body and a component or a window component disposed on the main body.

[0021] Compared with the prior art, the highly reflective flexible film, the transparent component, the window component and the assembly of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a comparison chart of the boiling test results of the samples in one embodiment of the present invention and the samples in the prior art: boiling at 100°C for 3-4 hours, wherein a is the comparison chart of comparative example 1, and b is the comparison chart of embodiment 1. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0025] In the embodiment of the present invention, the highly reflective flexible film includes a substrate layer, which can be a PET layer, a transparent PI layer, a TAC layer, a COP layer or a PC layer, and the thickness of the substrate layer is 5.7-250 μm. The upper and lower primer layers are respectively provided on both sides of the substrate layer through a coating process, and an upper IM layer and a lower IM layer are respectively provided on the upper and lower primer layers through a coating process. The upper IM layer and the lower IM layer are both low-refractive acrylic resin coating liquids, the coating thickness of the upper IM layer is 40-320 nm, and the coating thickness of the lower IM layer is 0.3-3.9 μm. After coating, a 30-188 μm high-temperature protective film is attached to the lower IM layer to ensure the appearance protection of the film surface and the stability of the coating during the magnetron sputtering coating process. A primer layer for increasing the adhesion of the bottom layer is plated on the upper IM layer through a magnetron sputtering process, and the thickness of the bottom layer is (2-30 nm). The bottom layer can be plated with SiO2 / T i / TiO2 / Si / Al2O3 / MgF2 / SiO is used as the base, a niobium oxide layer (15-136nm) for increasing reflection is plated on the base layer, a silicon dioxide layer (32-190nm) for stable reflection is plated on the niobium oxide layer, a niobium oxide layer (31-220nm) for increasing reflection is plated on the silicon dioxide layer, a tin oxide layer (0.1-20nm) for increasing physical properties is plated on the niobium oxide layer, a silicon + aluminum (ratio 87-98:13-2) mixed target silicon dioxide layer (10-100nm) for stable reflection is plated on the tin oxide layer, a titanium oxide layer (9-125nm) for increasing reflection is plated on the mixed target silicon dioxide layer, an ITO layer (5-39nm) for increasing short-wave 430-480nm reflection is plated on the titanium oxide layer, and the top ITO layer can also be a SIO layer (1-25nm). On the basis of the aforementioned structural scheme, the embodiment of the present invention further optimizes the atmosphere gas in the magnetron sputtering coating process, that is, optimizes the target material reaction gas to be a mixed gas of argon, nitrogen, and oxygen, thereby effectively solving the uniformity of target surface sputtering and the firmness of film layer bonding, and overall improving the optical stability after superposition. After the overall coating is superimposed, the uniformity of reflection of 400-700nm reaches within 5%, and the color difference in the TD direction is basically small, which is very helpful for the yield rate and product stability. The film surface reflects about 35%, and the above coating thickness and color can be changed according to customer needs, and the reflection can be between 20-80% according to requirements. Other control options for the environment here are: During the plating process, the atmosphere satisfies: the partial pressure of the rare gas and nitrogen is always consistent, and satisfies P (稀有气体) :P (氮气) =(1.7-4): 1; and the oxygen partial pressure decreases with the increase of the number of coatings, satisfying P (氧气) :P (氮气) =(0.14-0.5):1.

[0026] Including but not limited to the upper primer layer, lower primer layer, upper IM layer and lower IM layer in the following embodiments, all of them can be solutions of conventional technology in the art, and are not limited here.

[0027] Example 1

[0028] The highly reflective flexible film of this embodiment includes a PET substrate layer with a thickness of 5.7 μm. An upper primer layer and a lower primer layer are respectively provided on both sides of the substrate layer through a coating process. An upper IM layer and a lower IM layer are respectively provided on the upper primer layer and the lower primer layer through a coating process. The upper IM layer and the lower IM layer are both obtained by applying a conventional low-refractive acrylic resin coating liquid. The coating thickness of the upper IM layer is 40 nm, and the coating thickness of the lower IM layer is 0.3 μm. After coating, a 30 μm high-temperature protective film is attached to the lower IM layer to ensure the appearance protection of the film surface and the coating stability during the magnetron sputtering coating process. Then, a primer layer for increasing the adhesion of the bottom layer is plated on the upper IM layer by a magnetron sputtering process. The thickness of the bottom layer is 2nm, which can be a SiO2-plated primer layer. A first niobium oxide layer (15nm) for increasing reflection is plated on the primer layer, a silicon dioxide layer (32nm) for stable reflection is plated on the first niobium oxide layer, a second niobium oxide layer (31nm) for increasing reflection is plated on the silicon dioxide layer, a tin oxide layer (0.1nm) for increasing physical properties is plated on the second niobium oxide layer, a silicon / aluminum (the mass ratio of silicon to aluminum is 87:13) mixed target silicon dioxide layer (10-100nm) for stable reflection is plated on the tin oxide layer, a titanium oxide layer (9nm) for increasing reflection is plated on the mixed target silicon dioxide layer, and an ITO layer (5nm) for increasing short-wave 430-480nm reflection is plated on the titanium oxide layer.

[0029] In the above process, the magnetron sputtering conditions are: acceleration voltage: 300V, magnetic field: about 80G, gas pressure: 1mTorr, current density: 4mA / cm2, power density: 10W / cm2. The plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (稀有气体) :P (氮气) =2.5:1, when SiO2 is plated as the base layer, P (氧气) :P (氮气) =0.5:1, when plating the first niobium oxide layer, P (氧气) :P (氮气) =0.45:1, when silicon dioxide layer is plated, P (氧气) :P (氮气) =0.38:1, when plating the second niobium oxide layer, P (氧气) :P (氮气) =0.33:1, when tin oxide layer is plated, P (氧气) :P (氮气) =0.26:1, when plating mixed target silicon dioxide layer, P (氧气) :P (氮气) =0.22:1, when titanium oxide layer is plated, P (氧气) :P (氮气) =0.18:1, when ITO layer is plated, P (氧气):P (氮气) =0.14:1. During the plating process, the ambient gas is appropriately adjusted after each layer of structure is plated.

[0030] Comparative Example 1

[0031] The only difference between this comparative example and Example 1 is that the plating environment gas is argon.

[0032] Comparative Example 2

[0033] The difference between this comparative example and Example 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (氧气) :P (稀有气体) :P (氮气) =0.5:2.5:1.

[0034] Comparative Example 3

[0035] The difference between this comparative example and Example 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (氧气) :P (稀有气体) :P (氮气) =0.14:2.5:1.

[0036] from Figure 1 It can be seen that the unified test method is to adhere OCA glue to the back side before the ring test and stick it to the black acrylic board. After bonding, it is degassed with a degassing machine. After degassed, the surface is wiped clean and tested with an Olympus reflectometer. The reflection contrast is tested at 100°C water temperature for 3-4 hours. The optical curve of the comparative scheme has no obvious change in 3 hours, and changes greatly in 4 hours. There is no obvious change in the scheme of Example 1 for 3-4 hours, which shows that the boiling performance of the scheme of Example 1 is better than that of the scheme of Comparative Example 1.

[0037] Table 1 Comparison of pencil hardness

[0038]

[0039]

[0040] As can be seen from Table 1, the unified test method is to adhere OCA glue on the back and stick it on the transparent glass. After bonding, the degassing machine is used to degas. After degassing, the surface is wiped clean and the surface pencil hardness is tested with a pencil hardness tester. The test requirements are to use pencils of different hardness with different loads, and draw 5 lines respectively. ≥3 lines are judged as qualified, and ≤2 lines are judged as NG. It can be seen from the above table that the overall test results of the comparative scheme are lower than those of the embodiment 1 scheme, indicating that the surface hardness of the embodiment 1 scheme is higher.

[0041] Table 2 Comparison of steel wool wear resistance

[0042]

[0043] As can be seen from Table 2, the unified test method, the back side is bonded with OCA glue, and it is attached to the transparent glass. After bonding, it is degassed with a degassing machine. After degassing, the surface is wiped clean, the coated surface faces up, the wear-resistant machine is loaded with a 1000g weight, the wear-resistant head is fixed with Japanese Bonstar 0000# steel wool and placed on the film surface, the stroke is 60mm long, and one back and forth grinding is one stroke. After 100-200 wear times, there is no scratch on the film surface of the comparative scheme and the embodiment 1 scheme, and it is judged to be OK; after 300 wear times, there is 1 scratch on the left and middle sides of the comparative scheme (left, middle, and right refer to the film sheet path, the film width is 1200mm, and the left, middle, and right are tested at three points), which is judged to be NG, and there is no scratch on the embodiment 1 scheme, indicating that the embodiment 1 scheme is better than the comparative scheme; after 500 wear times, there are 3-5 scratches on the comparative scheme, which is judged to be NG, and there is no scratch on the embodiment 1 scheme, indicating that the embodiment 1 scheme is better than the comparative scheme.

[0044] Table 3 Comparison of various environmental tests

[0045]

[0046] Note: As can be seen from Table 3, the unified test method is to stick OCA glue on the back before the ring test and stick it on the transparent glass. After sticking, use a degassing machine to degas. After degassing, wipe the surface clean. Test double 85 ring test (high temperature 85℃, high humidity 85%). Compared with 28 days, all 100 grids are 5B, and the comparative scheme is 2-4B in 35 days, which shows that the scheme of embodiment 1 is better. Test sunlight resistance (light 0.55w / (m 2 ), wavelength 340nm, filter Extended UV-Q / B, 3.8h of light + 1h of darkness as one cycle. The temperature of the illuminated blackboard was set at 89°C, the temperature of the box was 63°C, and the humidity was 50%; the temperature of the box and blackboard was set at 38°C and the humidity was 95% in the dark stage. Compared with 28 days, the average of 100 grids was 5B, and the comparative scheme was 3-4B in 35 days, indicating that the scheme of Example 1 is better; the test was QUV resistance (UV-A (340nm) 0.63W / m 2 (4h, plus condensation 50℃ (4h) as 1 cycle) compared with 28 days, the average of 100 grids was 5B, and the comparative scheme was 1-2B in 35 days, which shows that the scheme of Example 1 is better; the high temperature ring test (95℃) was tested, and the average of 100 grids was 5B in 28 days, and the comparative scheme was 3-5B in 35 days, which shows that the scheme of Example 1 is better.

[0047] Example 2

[0048] The difference between this embodiment and embodiment 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (稀有气体) :P (氮气) =1.7:1.

[0049] Example 3

[0050] The difference between this embodiment and embodiment 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (稀有气体) :P (氮气) =4:1.

[0051] Example 4

[0052] The difference between this embodiment and embodiment 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (稀有气体) :P (氮气) =2.3:1.

[0053] Example 5

[0054] The difference between this embodiment and embodiment 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (稀有气体) :P (氮气) =3.7:1.

[0055] Example 6

[0056] The difference between this embodiment and embodiment 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (稀有气体) :P (氮气) =2.7:1.

[0057] Example 7

[0058] The difference between this embodiment and embodiment 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and P (稀有气体) :P (氮气) =3.1:1.

[0059] Example 8

[0060] The difference between this embodiment and embodiment 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and when plating SiO2 as the base layer, P (氧气) :P (氮气) =0.35:1, when plating the first niobium oxide layer, P (氧气) :P (氮气) =0.32:1, when silicon dioxide layer is plated, P (氧气) :P (氮气) =0.28:1, when plating the second niobium oxide layer, P (氧气) :P (氮气) =0.26:1, when tin oxide layer is plated, P (氧气) :P (氮气) =0.24:1, when plating mixed target silicon dioxide layer, P (氧气) :P (氮气) =0.22:1, when titanium oxide layer is plated, P (氧气) :P (氮气) =0.19:1, when ITO layer is plated, P(氧气) :P (氮气) =0.16:1. During the plating process, the ambient gas is appropriately adjusted after each layer of structure is plated.

[0061] Example 9

[0062] The difference between this embodiment and embodiment 1 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and when plating SiO2 as the base layer, P (氧气) :P (氮气) =0.22:1, when plating the first niobium oxide layer, P (氧气) :P (氮气) =0.21:1, when silicon dioxide layer is plated, P (氧气) :P (氮气) =0.21:1, when plating the second niobium oxide layer, P (氧气) :P (氮气) =0.20:1, when tin oxide layer is plated, P (氧气) :P (氮气) =0.20:1, when plating mixed target silicon dioxide layer, P (氧气) :P (氮气) =0.19:1, when titanium oxide layer is plated, P (氧气) :P (氮气) =0.18:1, when ITO layer is plated, P (氧气) :P (氮气) =0.16:1. During the plating process, the ambient gas is appropriately adjusted after each layer of structure is plated.

[0063] Example 10

[0064] The difference between this embodiment and embodiment 6 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and when the SiO2 base layer is plated, P (氧气) :P (氮气) =0.35:1, when plating the first niobium oxide layer, P (氧气) :P (氮气) =0.32:1, when silicon dioxide layer is plated, P (氧气) :P (氮气) =0.28:1, when plating the second niobium oxide layer, P (氧气) :P (氮气) =0.26:1, when tin oxide layer is plated, P (氧气) :P (氮气) =0.24:1, when plating mixed target silicon dioxide layer, P (氧气) :P (氮气) =0.22:1, when titanium oxide layer is plated, P (氧气) :P (氮气) =0.19:1, when ITO layer is plated, P (氧气) :P (氮气)=0.16:1. During the plating process, the ambient gas is appropriately adjusted after each layer of structure is plated.

[0065] Embodiment 11

[0066] The difference between this embodiment and embodiment 6 is that the plating environment gas is a mixed atmosphere of argon, nitrogen and oxygen, and when the SiO2 base layer is plated, P (氧气) :P (氮气) =0.22:1, when plating the first niobium oxide layer, P (氧气) :P (氮气) =0.21:1, when silicon dioxide layer is plated, P (氧气) :P (氮气) =0.21:1, when plating the second niobium oxide layer, P (氧气) :P (氮气) =0.20:1, when tin oxide layer is plated, P (氧气) :P (氮气) =0.20:1, when plating mixed target silicon dioxide layer, P (氧气) :P (氮气) =0.19:1, when titanium oxide layer is plated, P (氧气) :P (氮气) =0.18:1, when ITO layer is plated, P (氧气) :P (氮气) =0.16:1. During the plating process, the ambient gas is appropriately adjusted after each layer of structure is plated.

[0067] Table 4 Comparison of pencil hardness of Examples 2-11

[0068]

[0069]

[0070] Table 5 Comparison of steel wool wear resistance of Examples 2-11

[0071]

[0072]

[0073] Table 6 Comparison of various environmental measurements of Examples 2-11

[0074]

[0075]

[0076] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0077] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A highly reflective flexible film, comprising a substrate; an upper primer layer and a lower primer layer on both sides of the substrate layer; an upper IM layer and a lower IM layer respectively disposed on the upper primer layer and the lower primer layer; a primer layer, a first niobium oxide layer, a silicon dioxide layer, a second niobium oxide layer, a tin oxide layer, a mixed target layer, a titanium oxide layer, an ITO layer or a SIO layer are sequentially formed on the upper IM layer by magnetron sputtering, characterized in that: The magnetron sputtering atmosphere is a mixed atmosphere of argon, nitrogen and oxygen. During the plating process, the atmosphere satisfies: The partial pressure of the noble gas and nitrogen is always consistent and satisfies P (稀有气体) :P (氮气) =(1.7-4):1; and The oxygen partial pressure decreases with the increase of the number of coatings, satisfying P (氧气) :P (氮气) =(0.14-0.5):

1.

2. The highly reflective flexible film according to claim 1, characterized in that: The rare gas is selected from argon and helium.

3. The highly reflective flexible film according to claim 2, characterized in that: The rare gas is argon.

4. The highly reflective flexible film according to claim 1, characterized in that: The atmosphere during the plating process satisfies: The partial pressure of the noble gas and nitrogen is always consistent and satisfies P (稀有气体) :P (氮气) =(2.3-3.7):

1.

5. The highly reflective flexible film according to claim 4, characterized in that: The atmosphere during the plating process satisfies: The partial pressure of the noble gas and nitrogen is always consistent and satisfies P (稀有气体) :P (氮气) =(2.7-3.1):

1.

6. The highly reflective flexible film according to claim 1, characterized in that: The atmosphere during the plating process satisfies: the oxygen partial pressure decreases as the number of plating layers increases, satisfying P (氧气) :P (氮气) =(0.16-0.35):

1.

7. The highly reflective flexible film according to claim 6, characterized in that: The atmosphere during the plating process satisfies: the oxygen partial pressure decreases as the number of plating layers increases, satisfying P (氧气) :P (氮气) =(0.16-0.22):

1.

8. A transparent component, comprising a light-transmitting carrier and the highly reflective flexible film according to any one of claims 1 to 7 carried on the carrier.

9. A window assembly comprising a frame structure having a limiting structure and an assembly according to claim 8 constrained to the limiting structure.

10. A combination comprising a main body and the component according to claim 8 or the window assembly according to claim 9 arranged on the main body.

Images