Equipment for improving magnetron sputtering thickness and uniformity of target material

Abstract

The invention relates to the technical field of magnetron sputtering coating, in particular to equipment for a method for improving the magnetron sputtering thickness and uniformity of a target material. Comprising a vacuum cavity and a connection protection cavity, and the connection protection cavity is fixedly connected to the upper portion of the vacuum cavity; a rotating disc is rotationally connected into the vacuum cavity, and a first rotating mechanism matched with the rotating disc is arranged in the vacuum cavity. A plurality of fixed control blocks are fixedly connected to the rotating disc, base plates are arranged on the fixed control blocks, and angle adjusting mechanisms matched with the corresponding base plates are arranged on the fixed control blocks; a target material fixing disc is arranged in the vacuum cavity, and the target material fixing disc is located above one of the substrates and concentrically corresponds to the substrate; and a first lifting mechanism matched with the target material fixing disc is arranged in the connecting protection cavity.

Description

Technical Field

[0001] The invention relates to the technical field of magnetron sputtering coating, in particular to a device for improving the thickness and uniformity of target material magnetron sputtering. Background Art

[0002] Magnetron sputtering coating technology is increasingly widely used in the vacuum coating industry due to its two advantages of high speed and low temperature, and has become one of the most important technologies in industrial coating production; the main working principle of magnetron sputtering coating equipment is to use the glow discharge process of gas to generate positive ions (usually argon ions when the reaction gas is argon). These positive ions bombard the surface of the cathode target with very high energy under the acceleration of the electric field, causing the target to sputter. The generated sputtered particles (atoms or molecules) detach from the cathode and deposit on the anode substrate to form a thin film, thereby completing the coating process.

[0003] The magnetron coating technology in the prior art has problems with coating thickness and uniformity during the coating process because the molecular routes after bombardment are divergent, resulting in unqualified products; on the other hand, the coating thickness and uniformity are unqualified due to the flatness of the target material and the substrate; in order to solve this technical problem in the prior art, a support plate is often used to support the substrate. This process is not only time-consuming and labor-intensive, but also requires different support plates to support different substrates. Therefore, it is time-consuming and labor-intensive, and there is also the problem of troublesome target installation; in addition, the magnetron sputtering coating technology in the prior art can only coat a single substrate, and the coating efficiency is low. Therefore, there is an urgent need for a device to improve the target magnetron sputtering thickness and uniformity method to solve the current problem. Summary of the invention

[0004] To solve the above problems, the present invention proposes a device for improving the thickness and uniformity of target material magnetron sputtering, which effectively solves the problem of insufficient coating thickness and uniformity in the magnetron sputtering coating process in the prior art; it also solves the problem of insufficient coating thickness and uniformity caused by the flatness of the target material or substrate; it also realizes that multiple substrates can be magnetron sputtered at the same time, greatly improving the coating efficiency.

[0005] To solve the above problems, the present invention proposes the following technical solutions: a device for improving the thickness and uniformity of target material magnetron sputtering; comprising a vacuum chamber and a connecting protective chamber, the connecting protective chamber is fixedly connected to the top of the vacuum chamber; a rotating disk is rotatably connected in the vacuum chamber, and a first rotating mechanism cooperating with the rotating disk is arranged in the vacuum chamber; a plurality of fixed control blocks are fixedly connected to the rotating disk, each of the fixed control blocks is provided with a substrate, and each of the fixed control blocks is provided with an angle adjustment mechanism cooperating with the corresponding substrate; a target material fixing disk is arranged in the vacuum chamber, the target material fixing disk is located above one of the substrates and concentrically corresponds to it; a matching target material mounting groove and a sputtering cavity are arranged in the target material fixing disk; a pair of target material positioning blocks cooperating with the target material mounting groove are slidably connected to the target material fixing disk, and a first positioning mechanism cooperating with the target material fixing disk is arranged in the target material positioning block; a first lifting mechanism cooperating with the target material fixing disk is arranged in the connecting protective chamber.

[0006] Further; it is characterized in that: the angle adjustment mechanism includes a plurality of first coaxial gears that are coaxially rotatably connected in a fixed control block, a plurality of second driving gears are rotatably connected in the fixed control block, and the second driving gears are respectively meshed with the corresponding first coaxial gears; a first right-angle connecting rod, a second right-angle connecting rod and a third right-angle connecting rod are rotatably connected to the fixed control block, and the first right-angle connecting rod, the second right-angle connecting rod and the third right-angle connecting rod are respectively coaxially fixed with the corresponding first coaxial gears; a curved connecting rod is rotatably connected to the first right-angle connecting rod, the second right-angle connecting rod and the third right-angle connecting rod are all rotatably connected, a connecting and fixing block is coaxially fixed under the base plate, and the curved connecting rods are all rotatably connected to the connecting and fixing block.

[0007] Further; it is characterized in that: the first lifting mechanism includes a first driving gear and a first internal gear which are connected and rotated in the connecting protection cavity, and the first internal gear is meshed with the first driving gear; a pair of first rotating pinions are connected and rotated in the connecting protection cavity, and the first rotating pinions are meshed with the first internal gear, and the first rotating pinions are coaxially fixed with lifting studs, and a magnetron controller and a fixed screw sleeve are slidably connected in the connecting protection cavity, and the magnetron controller is fixedly connected to the fixed screw sleeve; the lifting studs are screwed with the fixed screw sleeve; the lifting studs are symmetrically arranged on both sides of the magnetron controller; and the lower part of the magnetron controller is fixedly connected to the target material fixing plate.

[0008] Furthermore; it is characterized in that: the first positioning mechanism includes a positioning column, a first sliding disk and a movable pull rod which are slidably connected on the target material fixing plate, the positioning column, the first sliding disk and the movable pull rod are coaxially fixed, and the positioning column and the movable pull rod are respectively located on both sides of the first sliding disk; a return spring is connected to the outer sleeve of the movable pull rod, one end of the return spring is fixed to the first sliding disk, and the other end of the return spring is fixed to the target material positioning block; an arc groove matching with the target material positioning block is provided on the target material fixing plate; a positioning hole matching with the positioning column is provided on the target material fixing plate.

[0009] Furthermore; it is characterized in that: target material positioning blocks are fixedly connected to target material limiting blocks; target material limiting blocks are matched with corresponding target material mounting grooves; when the target material limiting blocks on the same target material fixing plate are fitted with the side of the target material mounting groove, the angle between the centers of the target material mounting grooves at the other ends of the two target material limiting blocks is not greater than 180°.

[0010] Furthermore, it is characterized in that: the diameter of the sputtering chamber is not less than the diameter of the substrate.

[0011] Furthermore, it is characterized in that: the first rotating mechanism includes a first rotating worm and a first rotating worm wheel which are rotatably connected in the vacuum chamber, the first rotating worm wheel is meshed with the first rotating worm; the first rotating worm wheel is coaxially fixed to the rotating disk.

[0012] Furthermore, it is characterized in that: the fixed control blocks are all located at the edge of the rotating disk.

[0013] Compared with the prior art, the gain effect of the present invention is: 1. The setting of the angle adjustment mechanism effectively solves the problem of insufficient coating thickness and uniformity caused by the flatness of the target material or substrate in the prior art.

[0014] 2. Under the action of the first rotating mechanism, the cooperation between multiple substrates and the target material fixing plate enables multiple substrates to be magnetron sputtered at the same time, greatly improving the coating efficiency.

[0015] 3. The setting that the diameter of the sputtering chamber is not less than the diameter of the substrate ensures that the bombarded linear running molecules can cover the entire substrate area, ensuring the uniformity.

[0016] 4. The setting of the first lifting mechanism enables the target material to be lowered above the substrate during bombardment, effectively avoiding the atomic escape problem caused by the sputtering of the target material, thereby ensuring the thickness and uniformity of the coating.

[0017] 5. The setting of the first positioning mechanism greatly facilitates the installation of the target material. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a stereogram of the present invention.

[0019] Figure 2 It is a three-dimensional diagram of the local structure of the present invention.

[0020] Figure 3 This is a cutaway view of the present invention.

[0021] Figure 4 It is a three-dimensional diagram of the angle adjustment mechanism of the present invention.

[0022] Figure 5 It is a three-dimensional diagram of the first rotating mechanism of the present invention.

[0023] Figure 6 It is a three-dimensional diagram of the first lifting mechanism of the present invention.

[0024] Figure 7 It is a partial cutaway view of the first positioning mechanism of the present invention.

[0025] Figure 8 It is a partial stereoscopic diagram of the first positioning mechanism of the present invention.

[0026] In the figure: 1, vacuum chamber, 2, connecting protection chamber, 3, magnetron controller, 4, fixing screw sleeve, 5, lifting stud, 6, first rotating pinion, 7, first internal gear, 8, first driving gear, 9, substrate, 10, fixed control block, 11, rotating disk, 12, first rotating worm gear, 13, first rotating worm, 14, connecting fixed block, 15, curved connecting rod, 16, first right-angle connecting rod, 17, second right-angle connecting rod, 18, third right-angle connecting rod, 19, first coaxial gear, 20, second driving gear, 21, target fixing disk, 22, target positioning block, 23, target limiting block, 24, positioning column, 25, first sliding disk, 26, reset spring, 27, movable pull rod, 28, sputtering chamber. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention. Example 1

[0029] A device for improving the thickness and uniformity of target material magnetron sputtering; comprising a vacuum chamber 1 and a connecting protective chamber 2, wherein the connecting protective chamber 2 is fixedly connected to the top of the vacuum chamber 1; a rotating disk 11 is rotatably connected in the vacuum chamber 1, and a plurality of fixed control blocks 10 are fixedly connected to the rotating disk 11, each of which is provided with a substrate 9, and each of the fixed control blocks 10 is provided with an angle adjustment mechanism matched with the corresponding substrate 9; a target material fixing disk 21 is provided in the vacuum chamber 1, and the target material fixing disk 21 is located above one of the substrates 9 and concentrically corresponds thereto; a first lifting mechanism matched with the target material fixing disk 21 is provided in the connecting protective chamber 2; the diameter of the sputtering chamber 28 is not less than the diameter of the substrate 9.

[0030] The angle adjustment mechanism includes a plurality of first coaxial gears 19 coaxially rotatably connected in a fixed control block 10, a plurality of second driving gears 20 are rotatably connected in the fixed control block 10, and the second driving gears 20 are respectively meshed with the corresponding first coaxial gears 19; a first right-angle connecting rod 16, a second right-angle connecting rod 17 and a third right-angle connecting rod 18 are rotatably connected to the fixed control block 10, and the first right-angle connecting rod 16, the second right-angle connecting rod 17 and the third right-angle connecting rod 18 are respectively coaxially fixed with the corresponding first coaxial gears 19; a curved connecting rod 15 is rotatably connected to the first right-angle connecting rod 16, the second right-angle connecting rod 17 and the third right-angle connecting rod 18, and a connecting and fixing block 14 is coaxially fixed below the base plate 9, and the curved connecting rods 15 are all rotatably connected to the connecting and fixing block 14.

[0031] The first lifting mechanism includes a first driving gear 8 and a first internal gear 7 which are rotatably connected in the connecting protection chamber 2, and the first internal gear 7 is meshed with the first driving gear 8; a pair of first rotating pinions 6 are rotatably connected in the connecting protection chamber 2, and the first rotating pinions 6 are meshed with the first internal gear 7, and the first rotating pinions 6 are coaxially fixed with a lifting stud 5, and a magnetron controller 3 and a fixed screw sleeve 4 are slidably connected in the connecting protection chamber 2, and the magnetron controller 3 is fixedly connected to the fixed screw sleeve 4; the lifting studs 5 are screwed with the fixed screw sleeve 4; the lifting studs 5 are symmetrically arranged on both sides of the magnetron controller 3; and the lower part of the magnetron controller 3 is fixedly connected to the target material fixing plate 21.

[0032] like Figure 1 , 2 , 3, 4 and 6: when magnetron sputtering coating is required, the staff can first adjust the angle of the substrate on the substrate 9 through the angle adjustment mechanism. During this process, the corresponding motor drives the corresponding second driving gear 20 and the first coaxial gear 19 to rotate. The rotation of the first coaxial gear 19 will drive the corresponding first right-angle connecting rod 16, the second right-angle connecting rod 17 or the third right-angle connecting rod 18 to move, thereby adjusting the position of the substrate 9 and the connecting and fixing block 14; so that the substrate to be coated corresponds to the target material; then the target is adjusted by the first lifting mechanism The height of the target material fixing plate 21 is adjusted. During this process, the motor drives the first rotating pinion 6 to rotate simultaneously through the first driving gear 8 and the first internal gear 7. The rotation of the first rotating pinion 6 can drive the magnetron controller 3 and the fixed screw sleeve 4 to slide through the lifting stud 5. The sliding of the magnetron controller 3 can drive the target material fixing plate 21 and the target material to adjust the height. At the same time, the diameter of the sputtering chamber 28 is not less than the diameter of the substrate 9. Thereby, it can be ensured that the bombarded linear running molecules can cover the entire substrate area, thereby ensuring the thickness and uniformity of the coating, and also greatly improving the sputtering efficiency. Example 2

[0033] A device for improving the thickness and uniformity of target material magnetron sputtering; comprising a vacuum chamber 1 and a connecting protection chamber 2, wherein the connecting protection chamber 2 is fixedly connected to the top of the vacuum chamber 1; a rotating disk 11 is rotatably connected in the vacuum chamber 1, and a first rotating mechanism matching the rotating disk 11 is provided in the vacuum chamber 1; a plurality of fixed control blocks 10 are fixedly connected to the rotating disk 11, each of which is provided with a substrate 9, and each of which is provided with an angle adjustment mechanism matching the corresponding substrate 9; a target material fixing disk 21 is provided in the vacuum chamber 1, and the target material fixing disk 21 is located above one of the substrates 9 and concentrically corresponds thereto; a first lifting mechanism matching the target material fixing disk 21 is provided in the connecting protection chamber 2.

[0034] The angle adjustment mechanism includes a plurality of first coaxial gears 19 coaxially rotatably connected in a fixed control block 10, a plurality of second driving gears 20 are rotatably connected in the fixed control block 10, and the second driving gears 20 are respectively meshed with the corresponding first coaxial gears 19; a first right-angle connecting rod 16, a second right-angle connecting rod 17 and a third right-angle connecting rod 18 are rotatably connected to the fixed control block 10, and the first right-angle connecting rod 16, the second right-angle connecting rod 17 and the third right-angle connecting rod 18 are respectively coaxially fixed with the corresponding first coaxial gears 19; a curved connecting rod 15 is rotatably connected to the first right-angle connecting rod 16, the second right-angle connecting rod 17 and the third right-angle connecting rod 18, and a connecting and fixing block 14 is coaxially fixed below the base plate 9, and the curved connecting rods 15 are all rotatably connected to the connecting and fixing block 14.

[0035] The first lifting mechanism includes a first driving gear 8 and a first internal gear 7 which are rotatably connected in the connecting protection chamber 2, and the first internal gear 7 is meshed with the first driving gear 8; a pair of first rotating pinions 6 are rotatably connected in the connecting protection chamber 2, and the first rotating pinions 6 are meshed with the first internal gear 7, and the first rotating pinions 6 are coaxially fixed with a lifting stud 5, and a magnetron controller 3 and a fixed screw sleeve 4 are slidably connected in the connecting protection chamber 2, and the magnetron controller 3 is fixedly connected to the fixed screw sleeve 4; the lifting studs 5 are screwed with the fixed screw sleeve 4; the lifting studs 5 are symmetrically arranged on both sides of the magnetron controller 3; and the lower part of the magnetron controller 3 is fixedly connected to the target material fixing plate 21.

[0036] The diameter of the sputtering chamber 28 is not smaller than the diameter of the substrate 9 .

[0037] The first rotating mechanism includes a first rotating worm 13 and a first rotating worm wheel 12 which are rotatably connected in the vacuum chamber 1 , and the first rotating worm wheel 12 is meshed with the first rotating worm 13 ; the first rotating worm wheel 12 is coaxially fixed to the rotating disk 11 .

[0038] The fixed control blocks 10 are all located at the edge of the rotating disk 11 .

[0039] like Figure 1 , 2, 3, 4, 5 and 6: On the basis of Example 1, when the coating of the substrate corresponding to the target material is completed, the rotating disk 11 can be driven to rotate by the first rotating mechanism, and the rotation of the rotating disk 11 can drive the substrate 9 to rotate through the fixed control block 10 and the connecting fixed block 14, thereby realizing the rotation of the substrate on the substrate 9. During this process, the motor drives the first rotating worm gear 12 and the rotating disk 11 to rotate through the first rotating worm 13; when the next substrate corresponds to the target material, the substrate can be coated, thereby completing the corresponding coating operation; it is achieved that multiple substrates can be magnetron sputtered at the same time, which greatly improves the coating efficiency. Example 3

[0040] The first positioning mechanism includes a positioning column 24, a first sliding disk 25 and a movable pull rod 27 which are slidably connected on the target material fixing disk 21. The positioning column 24, the first sliding disk 25 and the movable pull rod 27 are all coaxially fixed, and the positioning column 24 and the movable pull rod 27 are respectively located on both sides of the first sliding disk 25; a return spring 26 is connected to the outer sleeve of the movable pull rod 27, one end of the return spring 26 is fixed to the first sliding disk 25, and the other end of the return spring 26 is fixed to the target material positioning block 22; an arc groove matching with the target material positioning block 22 is provided on the target material fixing disk 21; a positioning hole matching with the positioning column 24 is provided on the target material fixing disk 21; target material limiting blocks 23 are fixed to the target material positioning blocks 22; the target material limiting blocks 23 are matched with the corresponding target material mounting grooves; when the target material limiting blocks 23 on the same target material fixing disk 21 are fitted with the side of the target material mounting groove, the angle between the centers of the target material mounting grooves at the other ends of the two target material limiting blocks 23 is not greater than 180°.

[0041] like Figure 7 and 8As shown: On the basis of the first or second embodiment, when the target material needs to be installed or replaced, the target material positioning block 22 can be slid to a position that fits the target material installation groove, and then the target material is placed in the target material installation groove. After the target material is installed in place, the target material positioning block 22 can be rotated. The cooperation between the target material positioning block 22 and the target material installation groove in the target material fixing plate 21 ensures the positioning of the target material. The angle between the centers of the target material installation grooves at the other ends of the two target material limiting blocks 23 is not greater than 180°, which ensures that the target material can be smoothly installed in the target material installation groove; in this process, the target material limiting block 23 and the target material The mounting groove is always matched; at the same time, due to the setting of the positioning hole, the positioning of the target positioning block 22 can be achieved; when the target positioning block 22 needs to be slid, the movable pull rod 27 can be pulled first to drive the first sliding disk 25 and the positioning column 24 to slide, and the matching between the positioning column 24 and the positioning hole is released. When the movable pull rod 27 is released, the reset spring 26 will give a certain pressure to the first sliding disk 25. When the positioning column 24 corresponds to the positioning hole, its matching can be achieved, thereby realizing the positioning of the target positioning block 22; it not only greatly facilitates the installation of the target, but also ensures the stability of the target after installation.

[0042] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. A device for improving the thickness and uniformity of target material magnetron sputtering; characterized in that: The invention comprises a vacuum chamber (1) and a connecting protection chamber (2), wherein the connecting protection chamber (2) is fixedly connected to the top of the vacuum chamber (1); a rotating disk (11) is rotatably connected in the vacuum chamber (1), and a first rotating mechanism cooperating with the rotating disk (11) is provided in the vacuum chamber (1); a plurality of fixed control blocks (10) are fixedly connected to the rotating disk (11), each of the fixed control blocks (10) is provided with a substrate (9), and each of the fixed control blocks (10) is provided with an angle adjustment mechanism cooperating with a corresponding substrate (9); A target material fixing plate (21) is provided, and the target material fixing plate (21) is located above one of the substrates (9) and concentrically corresponds thereto; a matching target material installation groove and a sputtering cavity (28) are provided in the target material fixing plate (21); a pair of target material positioning blocks (22) matching the target material installation grooves are slidably connected to the target material fixing plate (21), and a first positioning mechanism matching the target material fixing plate (21) is provided in the target material positioning blocks (22); and a first lifting mechanism matching the target material fixing plate (21) is provided in the connection protection cavity (2).

2. The device for improving the thickness and uniformity of target material magnetron sputtering according to claim 1, characterized in that: The angle adjustment mechanism comprises a plurality of first coaxial gears (19) coaxially rotatably connected in a fixed control block (10); a plurality of second driving gears (20) are rotatably connected in the fixed control block (10); the second driving gears (20) are respectively meshed with the corresponding first coaxial gears (19); a first right-angle connecting rod (16), a second right-angle connecting rod (17) and a third right-angle connecting rod (18) are rotatably connected to the fixed control block (10); the first right-angle connecting rod (16), the second right-angle connecting rod (17) and the third right-angle connecting rod (18) are respectively coaxially fixedly connected to the corresponding first coaxial gears (19); the first right-angle connecting rod (16), the second right-angle connecting rod (17) and the third right-angle connecting rod (18) are all rotatably connected to a curved connecting rod (15); a connecting fixed block (14) is coaxially fixedly connected below the base plate (9); the curved connecting rods (15) are all rotatably connected to the connecting fixed block (14).

3. The device for improving the target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The first lifting mechanism comprises a first driving gear (8) and a first internal gear (7) rotatably connected in the connecting protection cavity (2), the first internal gear (7) meshing with the first driving gear (8); a pair of first rotating pinions (6) rotatably connected in the connecting protection cavity (2), the first rotating pinions (6) meshing with the first internal gear (7), the first rotating pinions (6) coaxially fixedly connected with a lifting stud (5), a magnetron controller (3) and a fixed screw sleeve (4) slidably connected in the connecting protection cavity (2), the magnetron controller (3) and the fixed screw sleeve (4) being fixedly connected; the lifting studs (5) are screwed with the fixed screw sleeve (4); the lifting studs (5) are symmetrically arranged on both sides of the magnetron controller (3); and the lower part of the magnetron controller (3) is fixedly connected to a target material fixing plate (21).

4. The device for improving the thickness and uniformity of target material magnetron sputtering according to claim 1, characterized in that: The first positioning mechanism comprises a positioning column (24), a first sliding disk (25) and a movable pull rod (27) which are slidably connected on the target material fixing disk (21); the positioning column (24), the first sliding disk (25) and the movable pull rod (27) are all coaxially fixedly connected; the positioning column (24) and the movable pull rod (27) are respectively located on both sides of the first sliding disk (25); a return spring (26) is connected to the outer sleeve of the movable pull rod (27); one end of the return spring (26) is fixedly connected to the first sliding disk (25), and the other end of the return spring (26) is fixedly connected to the target material positioning block (22); an arcuate sliding groove matching the target material positioning block (22) is provided on the target material fixing disk (21); and a positioning hole matching the positioning column (24) is provided on the target material fixing disk (21).

5. The device for improving the thickness and uniformity of target material magnetron sputtering according to claim 4, characterized in that: The target material positioning blocks (22) are all fixedly connected with target material limiting blocks (23); the target material limiting blocks (23) are all matched with corresponding target material installation grooves; when the target material limiting blocks (23) on the same target material fixing plate (21) are fitted with the side surface of the target material installation groove, the angle between the centers of the target material installation grooves at the other ends of the two target material limiting blocks (23) is no greater than 180°.

6. The device for improving the thickness and uniformity of target material magnetron sputtering according to claim 1, characterized in that: The diameter of the sputtering chamber (28) is not less than the diameter of the substrate (9).

7. The device for improving target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The first rotating mechanism comprises a first rotating worm (13) and a first rotating worm wheel (12) which are rotatably connected in the vacuum chamber (1); the first rotating worm wheel (12) is meshed with the first rotating worm (13); and the first rotating worm wheel (12) is coaxially fixedly connected to the rotating disk (11).

8. The device for improving target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The fixed control blocks (10) are all located at the edge of the rotating disk (11).

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