Electronic device and method of manufacturing electronic device

Abstract

An electronic device and a method of manufacturing the electronic device are disclosed. The electronic device includes: a display module including a bending area bent along a virtual bending axis, a first non-bending area and a second non-bending area spaced apart from each other, where the bending area is between the first non-bending area and the second non-bending area, and the display module includes a front surface and a rear surface opposite to the front surface; a first protective member below the rear surface and overlapping the first non-bending region; a second protective member over the rear surface, overlapping the second non-bending region, and facing the first protective member; a functional layer between the first protective member and the second protective member; and a protective layer on the rear surface, overlapping the bending region, and contacting a side surface of the first protective member, a side surface of the functional layer, and a side surface of the second protective member.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0107438 filed in the Korean Intellectual Property Office on August 17, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present disclosure described herein relate to electronic devices having improved reliability. Background Art

[0004] The electronic device is activated according to the electrical signal. The electronic device may include a device having various electronic components such as a display unit that displays an image or an input sensing unit that detects an external input. The electronic components may be electrically connected to each other through signal lines arranged differently.

[0005] Various numbers of signal lines may be provided according to the number of electronic components or a processing environment, and the signal lines are designed to be bent and arranged in an appropriate space to reduce or prevent electrical signal interference within a panel area. Summary of the invention

[0006] Embodiments of the present disclosure provide an electronic device in which penetration of resin between adhesive layers can be reduced or prevented because an area to which a resin in a space between curved panels is applied is limited.

[0007] According to one or more embodiments, an electronic device includes: a display module, including a bending area bent along a virtual bending axis, a first non-bending area and a second non-bending area spaced apart from each other, wherein the bending area is between the first non-bending area and the second non-bending area, and the display module includes a front surface and a rear surface opposite to the front surface; a first protective member, below the rear surface and overlapping with the first non-bending area; a second protective member, above the rear surface, overlapping with the second non-bending area, and facing the first protective member; a functional layer, between the first protective member and the second protective member; and a protective layer, on the rear surface, overlapping with the bending area, and contacting a side surface of the first protective member, a side surface of the functional layer, and a side surface of the second protective member.

[0008] A side surface of the first protective member may be closer to the bending region than a side surface of the functional layer and a side surface of the second protective member.

[0009] The functional layer may expose a portion of the rear surface of the first protective member that is in contact with the protective layer.

[0010] The electronic device may further include a first adhesive layer between the first non-bending area and the first protective member, a second adhesive layer between the first protective member and the functional layer, a third adhesive layer between the functional layer and the second protective member, and a fourth adhesive layer between the second non-bending area and the second protective member.

[0011] The first adhesive layer, the second adhesive layer, the third adhesive layer, and the fourth adhesive layer may include a pressure-sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, or an optically clear resin (OCR).

[0012] The protective layer may contact a side surface of the first adhesive layer, a side surface of the second adhesive layer, a side surface of the third adhesive layer, and a side surface of the fourth adhesive layer.

[0013] The electronic device may further include a window panel including a base portion over the display module, a bezel pattern at at least a portion of an edge of a rear surface of the base portion, and a hard coating layer over a front surface of the base portion.

[0014] A rear surface of the base portion overlapping the bezel pattern or a front surface of the base portion overlapping the bezel pattern may have a chamfered shape.

[0015] The electronic device may further include a driving element on the front surface and overlapping the second non-bending region.

[0016] The electronic device may further include a main circuit board on the front surface and overlapping the second non-bending region.

[0017] The electronic device may further include a cover member over the front surface and overlapping the bent area.

[0018] The electronic device may further include an anti-reflection panel over the display module and having a side surface contacting the cover member.

[0019] The display module may include: a display panel including a base layer, a transistor above the base layer, a light emitting element connected to the transistor, and an encapsulation layer configured to cover the light emitting element and including an inorganic layer and an organic layer; and an input sensor directly on the encapsulation layer and including a conductive layer and at least one sensing insulating layer.

[0020] The protective layer may include resin.

[0021] According to one or more embodiments, a method for manufacturing an electronic device includes: providing an initial electronic device, the initial electronic device including: a display module, including a first non-bending area, a bending area, and a second non-bending area; a first protective member, on a rear surface of the display module and overlapping with the first non-bending area; a second protective member, on a rear surface of the display module and overlapping with the second non-bending area; and a functional layer, on the first protective member; applying resin to a first area overlapping with the bending area and between the first protective member and the second protective member and to a second area at an edge of the functional layer adjacent to the bending area and spaced apart from the first area; and bending the bending area relative to a bending axis extending in one direction so that the second protective member faces the functional layer.

[0022] The area of ​​the first region may be greater than the area of ​​the second region.

[0023] The second region may extend in one direction.

[0024] The second region may include sub-units spaced apart from each other in one direction.

[0025] The method may further include merging the resin applied to the first region and the resin applied to the second region in a space defined among the first protective member, the functional layer, the second protective member, and a rear surface of the display module overlapping the bending region.

[0026] The method may further include inserting additional resin into the space after bending the bending region. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other aspects of the present disclosure will become apparent by describing in detail the embodiments of the present disclosure with reference to the attached drawings.

[0028] Figure 1 is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0029] Figure 2A is an exploded perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0030] Figure 2B is a block diagram of an electronic device according to one or more embodiments of the present disclosure.

[0031] Figure 3A is a cross-sectional view of a display module according to one or more embodiments of the present disclosure.

[0032] Figure 3B yes Figure 3A An enlarged cross-sectional view of a display module.

[0033] Figure 4is a plan view of a display panel according to one or more embodiments of the present disclosure.

[0034] Figure 5 is a plan view of an input sensor according to one or more embodiments of the present disclosure.

[0035] Fig. 6A is a cross-sectional view of an electronic device according to one or more embodiments of the present disclosure.

[0036] Figure 6B is a cross-sectional view of an electronic device according to one or more embodiments of the present disclosure.

[0037] FIG. 7A to FIG. 7D is a cross-sectional view illustrating a method of manufacturing an electronic device according to one or more embodiments of the present disclosure.

[0038] Figure 8 is a rear view of a display panel according to one or more embodiments of the present disclosure.

[0039] Fig. 9 is a rear view of a display panel according to one or more embodiments of the present disclosure.

[0040] Fig.10 is a rear view of a display panel according to one or more embodiments of the present disclosure.

[0041] Fig.11A is a cross-sectional view showing an electronic device according to a comparative example.

[0042] Fig. 11B is a rear view of a display panel according to a comparative example.

[0043] Fig. 11C is a cross-sectional view showing an electronic device according to a comparative example. DETAILED DESCRIPTION

[0044] By referring to the detailed description and drawings of the embodiments, it is easier to understand the aspects of some embodiments of the present disclosure and the methods for implementing them. The described embodiments are provided as examples so that the present disclosure will be thorough and complete, and the aspects of the present disclosure will be fully conveyed to those skilled in the art. Therefore, processes, elements and techniques that are redundant, irrelevant or unrelated to the description of the embodiments, or are not necessary for a person of ordinary skill in the art to fully understand the aspects of the present disclosure can be omitted. Unless otherwise stated, in all drawings and written descriptions, the same figure numerals, marks or combinations thereof represent the same elements, and therefore, their repeated descriptions can be omitted.

[0045] The described embodiments may have various modifications and may be implemented in different forms, and should not be construed as being limited to the embodiments described herein. The use of "may", "can" or "may not" when describing an embodiment corresponds to one or more embodiments of the present disclosure. The present disclosure covers all modifications, equivalents and substitutions within the scope of the ideas and techniques of the present disclosure. In addition, each of the features of the various embodiments of the present disclosure may be combined with each other in part or in whole, and various technical interconnections and drives are possible. Each embodiment may be implemented independently of one another, or may be implemented in association.

[0046] In the drawings, the relative sizes of elements, layers, and regions may be exaggerated for clarity and / or descriptive purposes. In addition, the use of cross-hatching and / or shading in the drawings is generally provided to clarify boundaries between adjacent elements. As such, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for specific materials, material properties, dimensions, proportions, commonalities between the illustrated elements, and / or any other characteristics, attributes, properties, etc. of the elements.

[0047] Various embodiments are described herein with reference to cross-sectional views as schematic diagrams of embodiments and / or intermediate structures. As such, variations in the shapes illustrated, such as due to manufacturing techniques and / or tolerances, should be expected. In addition, the specific structural or functional descriptions disclosed herein are merely illustrative for the purpose of describing embodiments according to the concepts of the present disclosure. Therefore, the embodiments disclosed herein should not be interpreted as being limited to the illustrated shapes of elements, layers, or regions, but should include deviations in shapes such as those caused by manufacturing.

[0048] For ease of explanation, spatial relative terms such as "below", "below", "lower", "lower side", "below", "above", "upper side", etc. can be used in this article to describe the relationship between an element or feature and another element (multiple elements) or feature (multiple features) as shown in the figure. It will be understood that, in addition to the orientation depicted in the figure, the spatial relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below", "below" or "below" other elements or features will be oriented "above" other elements or features. Therefore, the exemplary terms "below" and "below" can include both upper and lower orientations. The device can be oriented in addition (for example, rotated 90 degrees or in other orientations), and the spatial relative descriptors used in this article should be interpreted accordingly. Similarly, when the first part is described as being arranged "on" the second part, this means that the first part is arranged at the upper or lower side of the second part, without being limited to the upper side of the second part based on the direction of gravity.

[0049] In addition, the phrase "in a plan view" means when the object portion is observed from above, and the phrase "in a schematic cross-sectional view" means when a schematic cross section taken by vertically cutting the object portion is observed from the side. The term "overlap" or "overlapped" means that the first object can be above or below the second object, or on one side of the second object, and vice versa. In addition, the term "overlap" can include stacking, facing or facing, extending on, covering or partially covering, or any other suitable term as will be appreciated and understood by a person of ordinary skill in the art. The expression "not overlap" can include meanings such as "spaced apart from each other", "offset from each other" or "separated from each other" and any other suitable equivalents as will be appreciated and understood by a person of ordinary skill in the art. The terms "face" and "facing" can mean that the first object can be directly opposite or indirectly opposite to the second object. In the case where a third object is inserted between the first object and the second object, the first object and the second object can be understood to be indirectly opposite to each other, although still facing each other.

[0050] It will be understood that when an element, layer, region, or component is referred to as being "formed on," "on," "connected to," or "(operably or communicatively) coupled to" another element, layer, region, or component, it may be directly formed on, directly on, directly connected to, or directly coupled to, or indirectly formed on, indirectly on, indirectly connected to, or indirectly coupled to, such that one or more intervening elements, layers, regions, or components may be present. Furthermore, this may collectively mean direct or indirect coupling or connection, as well as integral or non-integral coupling or connection. For example, when a layer, region, or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region, or component, it may be directly electrically connected or directly electrically coupled to the other layer, region, or component, or there may be one or more intervening layers, regions, or components. One or more intervening components may include switches, resistors, capacitors, etc. When describing embodiments, unless explicitly described as being directly connected, the expression of connection indicates electrical connection, and "directly connected / directly coupled" or "directly on..." means that one component is directly connected or directly coupled to another component, or is directly on another component, without the presence of intervening components.

[0051] In addition, in this specification, when a part of a layer, film, region, plate, etc. is formed on another part, the formation direction is not limited to the upper direction, but includes forming the part on the side surface or in the lower direction. On the contrary, when a part of a layer, film, region, plate, etc. is formed "under" another part, this includes not only the case where the part is "directly under" another part, but also the case where there is another part between the part and the other part. At the same time, other expressions describing the relationship between components (such as "between...", "directly between..." or "adjacent to..." and "directly adjacent to...") can be interpreted similarly. It will be understood that when an element or layer is referred to as "between" two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intermediate elements or layers may also be present.

[0052] For the purposes of this disclosure, when following an element of a list, expressions such as "at least one of," "any of," or "one or more of," modify the elements of the entire list without modifying the individual elements of the list. For example, "at least one of X, Y, and Z," and "at least one selected from the group consisting of X, Y, and Z," may be interpreted as any combination of only X, only Y, only Z, two or more of X, Y, and Z (such as, for example, XYZ, XYY, YZ, and ZZ), or any variation thereof. Similarly, the expression "at least one of A and B" may include A, B, or A and B. As used herein, "or" generally means "and / or," and the term "and / or" includes any and all combinations of one or more of the relevant listed items. For example, the expression "A and / or B" may include A, B, or A and B. Similarly, when following an element of a list, expressions such as "at least one of," "a plurality of," "one of," and other prepositional phrases modify the elements of the entire list without modifying the individual elements of the list.

[0053] It will be understood that although the terms "first", "second", "third", etc. can be used in this article to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms do not correspond to a specific order, position or priority, and are only used to distinguish an element, member, component, region, area, layer, section or part from another element, member, component, region, area, layer, section or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, first component, first area, first layer or first section described below can be referred to as the second element, second component, second area, second layer or second section. Describing an element as a "first" element may not require or imply the presence of a second element or other elements. The terms "first", "second", etc. can also be used in this article to distinguish between elements of different categories or groups. For the sake of simplicity, the terms "first", "second", etc. can respectively represent "first category (or first group)", "second category (or second group)", etc.

[0054] In the example, the x-axis, y-axis and / or z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. The same applies to the first direction, the second direction and / or the third direction.

[0055] The terms used herein are only used for the purpose of describing the embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "a" and "an" are intended to also include the plural forms, and the plural forms are intended to also include the singular forms, unless the context clearly indicates otherwise. It will be further understood that when used in this specification, the terms "comprises", "comprising", "have", "having", "includes" and "including" specify the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof.

[0056] When one or more embodiments can be implemented differently, a specific process order can be performed differently from the described order. For example, two processes described in succession can be performed substantially simultaneously, or in the reverse order of the described order.

[0057] As used herein, the terms "substantially", "about", "approximately" and similar terms are used as approximate terms rather than as terms of degree, and are intended to allow for inherent deviations in measurements or calculations that will be recognized by those of ordinary skill in the art. For example, "substantially" may include a range of +5% / -5% of the corresponding value. In view of the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "approximately" or "approximately" as used herein include the values ​​and mean within an acceptable deviation range for a particular value determined by those of ordinary skill in the art. For example, "approximately" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value. In addition, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure."

[0058] In some embodiments, related to one or more functional blocks (e.g., block diagrams), units and / or modules, well-known structures and devices may be shown in the drawings to avoid unnecessary blurring of various embodiments. It will be understood by those skilled in the art that such blocks, units and / or modules are physically implemented by logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wire connectors and other electronic circuits. This can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Software may be used to program and control the blocks, units and / or modules implemented by microprocessors or other similar hardware to perform various functions discussed herein, and they may be selectively driven by firmware and / or software. In addition, each block, unit and / or module may be implemented by dedicated hardware, or may be implemented by a combination of dedicated hardware that performs some functions and a processor (e.g., one or more programmed microprocessors and associated circuits) that performs functions different from those of the dedicated hardware. In addition, in some embodiments, without departing from the scope of the present disclosure, blocks, units and / or modules may be physically separated into two or more interacting separate blocks, units and / or modules. Furthermore, in some embodiments, blocks, units and / or modules may be physically combined into more complex blocks, units and / or modules without departing from the scope of the present disclosure.

[0059] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0060] Figure 1 is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0061] Figure 2A is an exploded perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0062] Figure 2B is a block diagram of an electronic device according to one or more embodiments of the present disclosure.

[0063] refer to Figures 1 to 2B , the electronic device EA can be a device activated according to an electrical signal. The electronic device EA may include one or more embodiments. For example, the electronic device EA can be used for large electronic devices such as televisions, monitors, or outdoor billboards, and small and medium-sized electronic devices such as personal computers (PCs), laptops, personal digital assistants, vehicle navigation units, game consoles, portable electronic devices, and cameras. In addition, these are presented only as one or more embodiments, and can be used for other electronic devices without departing from the present disclosure. In one or more embodiments, the electronic device EA is shown as a smart phone.

[0064] The electronic device EA can display an image IM in a third direction DR3 on a display surface FS parallel to the first direction DR1 and the second direction DR2. The image IM may include a still image and a dynamic image. Figure 1 , a viewing window and an icon are shown as examples of the image IM. The display surface FS on which the image IM is displayed may correspond to the front surface of the electronic device EA, and may correspond to the front surface of the window panel WP.

[0065] In one or more embodiments, a front surface (or upper surface) and a rear surface (or lower surface) of each component are defined relative to a direction in which the image IM is displayed. The front surface and the rear surface may face each other in a third direction DR3, and a normal direction of each of the front surface and the rear surface may be parallel to the third direction DR3.

[0066] Meanwhile, directions indicated by the first direction DR1 , the second direction DR2 , and the third direction DR3 are relative concepts and may be changed to other directions. In the present specification, the wording “on a plane” may refer to a state when viewed in the third direction DR3 .

[0067] refer to Figure 2A, the electronic device EA may include a window panel WP, an anti-reflection panel RPP, a display module DM, a cover member CM, a driving element F-IC, a driving controller DCM, protection members PF1 and PF2, a functional layer MP, an electronic module EM, a power module PSM, and a housing HU. In one or more embodiments, the window panel WP and the housing HU may be coupled to each other to constitute the appearance of the electronic device EA. Figure 2A A state before one area of ​​the display module DM is bent is shown.

[0068] The window panel WP may include an optically transparent insulating material. For example, the window panel WP may include glass or plastic. The window panel WP may have a multi-layer structure or a single-layer structure. For example, the window panel WP may include a plurality of plastic films coupled by an adhesive, or may include a glass substrate and a plastic film coupled by an adhesive.

[0069] As described above, the display surface FS of the window panel WP may define the front surface of the electronic device EA. The transmission area TA may be an optically transparent area. For example, the transmission area TA may be an area having a visible light transmittance of about 90% or more.

[0070] The bezel area BZA may be an area having relatively low light transmittance compared to the transmission area TA. The bezel area BZA may define the shape of the transmission area TA. The bezel area BZA may be adjacent to the transmission area TA and may surround the transmission area TA.

[0071] The bezel area BZA may be formed by a bezel pattern BP (see Fig. 6A ) and may have a border pattern BP (see Fig. 6A ). The bezel area BZA may overlap with the peripheral area NAA of the display module DM to reduce or prevent the peripheral area NAA from being visually recognized from the outside. Meanwhile, this is only illustrative, and in the window panel WP, according to one or more embodiments of the present disclosure, the bezel area BZA may be omitted.

[0072] The anti-reflection panel RPP may be located under the window panel WP. The anti-reflection panel RPP may reduce the reflectivity of an external light beam input from the window panel WP. The anti-reflection panel RPP according to one or more embodiments of the present disclosure may be omitted and may be a component included in the display module DM.

[0073] The display module DM may display an image IM and may detect an external input. The display module DM may include a front surface IS including an active area AA and a peripheral area NAA. The active area AA may be an area activated according to an electrical signal.

[0074] In one or more embodiments, the active area AA may be an area on which the image IM is displayed, and at the same time may be an area in which an external input is detected. The transmissive area TA may overlap the entire surface or at least a portion of the active area AA.

[0075] Therefore, the user can visually recognize the image IM through the transmission area TA, or an external input can be provided through the transmission area TA. However, this is only an example. In the display module DM according to one or more embodiments of the present disclosure, the area on which the image IM is displayed and the area in which the external input is detected can be separated from each other within the active area AA, and the present disclosure is not limited to one or more embodiments.

[0076] The peripheral area NAA may be an area covered by the frame area BZA. The peripheral area NAA may be adjacent to the active area AA. The peripheral area NAA may surround the active area AA. Figure 4 )'s driving elements, driving wiring lines, etc. may be arranged in the peripheral area NAA.

[0077] The display module DM may include a display panel DP and an input sensor ISP. The display panel DP may be a component that substantially generates an image IM. The image IM generated by the display panel DP may be visually recognized by a user from the outside through the transmissive area TA. The input sensor ISP may detect an external input input through the window panel WP.

[0078] In a state in which the display panel DP is not bent, the display module DM according to the present disclosure may include first non-bending areas NBA1 sequentially arranged in a first direction DR1 (see Figure 4 ), bending area BA (see Figure 4 ) and a second non-bending area NBA2 (see Figure 4 The bending area BA may be bent along a virtual bending axis AX extending in the second direction DR2. In a state in which the bending area BA is bent, a rear surface of the display module DM overlapping the first non-bending area NBA1 and a rear surface of the display module DM overlapping the second non-bending area NBA2 may face each other.

[0079] The external input may include various types of input provided from outside the electronic device EA. For example, the external input may include contact with a part of the user's body (such as a hand) and an external input (e.g., hovering) applied near or adjacent to the electronic device EA at a certain distance (e.g., a predetermined distance). In addition, the external input may have various forms, such as force, pressure, and light, and the present disclosure is not limited to one or more embodiments.

[0080] The cover member CM is located on the display module DM. For example, the cover member CM may be located on the display panel DP overlapping the bending area BA. The cover member CM may relieve stress generated when a portion of the display panel DP overlapping the bending area BA is bent.

[0081] The cover member CM according to one or more embodiments includes a synthetic resin. For example, the cover member CM may include at least one of acrylonitrile butadiene styrene copolymer (ABS), urethane acrylate (UA), polyurethane (PU), polyethylene (PE), ethylene vinyl acetate (EVA), and polyvinyl chloride (PVC).

[0082] The driving element F-IC may include a driving element for driving the display panel DP. For example, the driving element F-IC may include a signal controller for controlling the display panel DP. The signal controller may receive an input image signal, and may convert the input image signal into image data corresponding to the operation of the pixel PX. In addition, the signal controller may receive various control signals, such as a vertical synchronization signal, a horizontal synchronization signal, a main clock signal, and a data enable signal, and may output signals corresponding to these signals. In addition, the driving element F-IC may also include a circuit unit for controlling the input sensor ISP, and the present disclosure is not limited to one or more embodiments.

[0083] The driving controller DCM may include a main circuit board MCB and a flexible circuit board FCB. The driving controller DCM may be electrically connected to the display module DM and may control the display panel DP and the input sensor ISP. The flexible circuit board FCB may be connected to the far end of the display panel DP and may connect the main circuit board MCB and the driving element F-IC.

[0084] The main circuit board MCB may also include a plurality of electronic components mounted on the main circuit board MCB. The electronic components may be electrically connected via circuit wiring lines. The main circuit board MCB may be electrically connected to the display module DM connected to the driving element F-IC via a flexible circuit board FCB.

[0085] In addition, the main circuit board MCB may further include a protective cap covering the electronic components. The protective cap may be a protective cover made of metal and may be connected to the main circuit board MCB by welding. The main circuit board MCB may be electrically connected to the motherboard of the electronic module EM by a connector. The flexible circuit board FCB may include a flexible film, a plurality of circuit wiring lines arranged on the flexible film, and pads corresponding to the pads included in the display panel DP.

[0086] The protection members PF1 and PF2 may be arranged on the rear surface of the display panel DP. In a state where the display panel DP is not bent, the first protection member PF1 may be located on the rear surface of the display module DM overlapping the first non-bending area NBA1, and the second protection member PF2 may be located on the rear surface of the display module DM overlapping the second non-bending area NBA2. Therefore, the first protection member PF1 and the second protection member PF2 may be spaced apart from each other.

[0087] The protective members PF1 and PF2 may include a base layer having a plastic film. The plastic film may include a thermoplastic resin. For example, the thermoplastic resin may include at least one selected from the group consisting of polyethylene terephthalate (PET), polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), polystyrene (PS), polyacrylonitrile (PAN), styrene-acrylonitrile copolymer (SAN), acrylonitrile-butadiene-styrene (ABS), polymethyl methacrylate (PMMA) and a combination thereof. The electronic device EA according to the present disclosure includes protective members PF1 and PF2 arranged on the rear surface of the display panel DP, so that it can have suitable heat resistance, suitable fatigue strength and suitable electrical properties, and can be less affected by temperature and humidity.

[0088] The material constituting the protection members PF1 and PF2 is not limited to resin and may include an organic / inorganic composite material. The protection members PF1 and PF2 may include a porous organic layer and an inorganic material filling the pores of the organic layer.

[0089] The functional layer MP may be located on the rear surface of the display panel DP. In more detail, when the display panel DP is bent, the functional layer MP may be located between the first protective member PF1 and the second protective member PF2. The functional layer MP may be provided in the form of a plate. The functional layer MP may include a plurality of layers. For example, the functional layer MP may include a light shielding layer, a heat dissipation layer, a buffer layer, and a plurality of adhesive layers.

[0090] The light shielding layer can be used to solve the problem that the components arranged in the display module DM are mapped onto the window panel WP through the active area AA. The light shielding layer may include a binder and a plurality of pigment particles dispersed therein. The pigment particles may include carbon black, etc. The electronic device EA according to one or more embodiments may include a light shielding layer, and thus may have an effect of improving the light shielding property.

[0091] The heat dissipation layer can effectively dissipate the heat generated by the display module DM. The heat dissipation layer may include at least one of graphite, copper (Cu), and aluminum (Al) having suitable heat dissipation properties, but the present disclosure is not limited thereto. The heat dissipation layer may improve the heat dissipation properties and may have electromagnetic wave shielding or electromagnetic wave absorbing properties.

[0092] The buffer layer may be a synthetic resin foam. The buffer layer may include a matrix and a plurality of pores. The buffer layer may have elasticity and may have a porous structure.

[0093] The substrate may include a flexible material. The substrate includes a synthetic resin. For example, the substrate may include at least one of acrylonitrile butadiene styrene copolymer (ABS), polyurethane (PU), polyethylene (PE), ethylene vinyl acetate (EVA), and polyvinyl chloride (PVC).

[0094] The plurality of pores may appropriately absorb impact applied to the buffer layer. The plurality of pores may define the buffer layer having a porous structure.

[0095] According to one or more embodiments, at least one of the light shielding layer, the heat dissipation layer, and the buffer layer included in the functional layer MP may be omitted, and a plurality of layers may be provided as a single layer, but the present disclosure is not limited to the one or more embodiments.

[0096] The electronic module EM includes a motherboard and various functional modules mounted on the motherboard to operate the electronic device EA. The motherboard can be electrically connected to the display module DM through a connector. Here, the motherboard can include a rigid type printed circuit board. The electronic module EM is electrically connected to the power module PSM. The electronic module EM and the power module PSM can be accommodated in the housing HU.

[0097] The power supply module PSM provides the power required for the overall operation of the electronic device EA. The power supply module PSM may include a universal battery device.

[0098] like Figure 2B As shown in FIG. 1 , the display module DM may include a display panel DP and an input sensor ISP. The input sensor ISP detects a user's input. The capacitive input sensor ISP may be located on the display panel DP.

[0099] The electronic module EM may include a control module 10, a wireless communication module 20, an image input module 30, an audio input module 40, an audio output module 50, a memory 60, and an external interface module 70. The electronic module EM may include a main circuit board, and the module may be mounted on the main circuit board, or may be electrically connected to the main circuit board through a flexible circuit board. The input sensor ISP may be connected to the main circuit board through a connector, etc. The electronic module EM is electrically connected to the power supply module PSM.

[0100] The control module 10 controls the overall operation of the electronic device EA. For example, the control module 10 activates or deactivates the display module DM according to the user's input. The control module 10 can control the image input module 30, the audio input module 40 and the audio output module 50 according to the user's input. The control module 10 may include at least one microprocessor.

[0101] The wireless communication module 20 may send / receive wireless signals to / from another terminal using a Bluetooth line or a Wi-Fi line. The wireless communication module 20 may send / receive voice signals using a general communication line. The wireless communication module 20 may include a plurality of antenna modules.

[0102] The image input module 30 may process an image signal, and may convert the processed image signal into image data that may be displayed on the display module DM. The audio input module 40 may receive an external audio signal through a microphone in a recording mode, a voice recognition mode, etc., and may convert the received external audio signal into electrical voice data. The audio output module 50 may convert audio data received from the wireless communication module 20 or audio data stored in the memory 60 into sound, and may output the converted sound to the outside.

[0103] The external interface module 70 may be used as an interface to an external charger, a wired / wireless data port, a card socket (eg, a memory card and a Subscriber Identity Module (SIM) / User Identity Module (UIM) card), and the like.

[0104] The power supply module PSM may provide the power required for the overall operation of the electronic device EA. The power supply module PSM may include a universal battery device.

[0105] The electro-optical module ELM may be an electronic component that outputs or receives an optical signal. The electro-optical module ELM may include a camera module and / or a proximity sensor. The camera module captures an external image through a sensing area.

[0106] Figure 3A is a cross-sectional view of a display module according to one or more embodiments of the present disclosure. Figure 3B yes Figure 3A An enlarged cross-sectional view of a display module. Figure 4 is a plan view of a display panel according to one or more embodiments of the present disclosure. Figure 5 is a plan view of an input sensor according to one or more embodiments of the present disclosure.

[0107] refer to Figure 3A and Figure 3B , the display module DM may include a display panel DP and an input sensor ISP.

[0108] The display panel DP may include a base substrate BS, a circuit element layer ML-D, a display element layer EML, and a thin film encapsulation layer TFE. The input sensor ISP may include a plurality of sensing insulating layers TIL1, TIL2, and TIL3 and a plurality of conductive layers TML1 and TML2.

[0109] The base substrate BS may be a base layer on which the circuit element layer ML-D, the display element layer EML, the thin film encapsulation layer TFE, and the input sensor ISP may be stacked. The base substrate BS may be flexible or rigid and may be provided as a single layer or may have a multi-layer structure, but the present disclosure is not limited thereto.

[0110] The circuit element layer ML-D may be located on the base substrate BS. The circuit element layer ML-D may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit element layer ML-D may constitute a pixel PX (see Figure 4 ) signal line or control circuit.

[0111] The display element layer EML may be located on the circuit element layer ML-D. The display element layer EML may include an organic light emitting diode. However, this is only an example, and the display element layer EML according to one or more embodiments of the present disclosure may include an inorganic light emitting diode, an organic-inorganic light emitting diode, or a liquid crystal layer.

[0112] The thin film encapsulation layer TFE may include an organic layer OEL and a plurality of inorganic layers LIL and UIL sealing the organic layer OEL. The thin film encapsulation layer TFE may seal the display element layer EML to block moisture and oxygen introduced into the display element layer EML.

[0113] The inorganic layers LIL and UIL can reduce or prevent external moisture or oxygen from penetrating into the display element layer EML. The inorganic layers LIL and UIL may include silicon nitride, silicon oxide, or a mixture obtained by combining them. The inorganic layers LIL and UIL may be formed by a deposition process.

[0114] The organic layer OEL may be located on the display element layer EML to provide a flat surface. Curves, particles, etc. formed on the upper surface of the display element layer EML may be covered by the organic layer OEL, and thus may have little effect on components (eg, input sensors ISP) formed on the organic layer OEL.

[0115] The input sensor ISP is located on the thin film encapsulation layer TFE. The input sensor ISP can be directly located on the thin film encapsulation layer TFE and can be formed by a continuous process with the thin film encapsulation layer TFE. The input sensor ISP can detect external input using a self-capacitance method or a mutual capacitance method. The sensing pattern included in the input sensor ISP can be variously modified, arranged, and connected according to the method.

[0116] The input sensor ISP may include sensing insulating layers TIL1, TIL2, and TIL3 and one or more conductive layers TML1 and TML2. The sensing insulating layers TIL1, TIL2, and TIL3 may include an inorganic material or an organic material.

[0117] The first sensing insulating layer TIL1 may be directly located on the second inorganic layer UIL of the thin film encapsulation layer TFE. The first conductive layer TML1 is located on the first sensing insulating layer TIL1. The second sensing insulating layer TIL2 may be located on the first sensing insulating layer TIL1 and may cover the first conductive layer TML1. The second conductive layer TML2 is located on the second sensing insulating layer TIL2. The third sensing insulating layer TIL3 may be located on the second sensing insulating layer TIL2 and may cover the second conductive layer TML2. However, the present disclosure is not limited thereto, and the first sensing insulating layer TIL1 may be omitted, and the first conductive layer TML1 may be directly located on the second inorganic layer UIL, but the present disclosure is not limited to one or more embodiments.

[0118] The conductive layers TML1 and TML2 according to one or more embodiments may include a single layer of metal or a single layer of a transparent conductive material. For example, the metal may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof.

[0119] The transparent conductive material may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). In addition, the transparent conductive material may include conductive polymers such as poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, etc.

[0120] In addition, the conductive layers TML1 and TML2 may include a metal layer having a multi-layer structure. The multi-layer metal layer may have a three-layer structure of, for example, titanium / aluminum / titanium. The multi-layer conductive layers TML1 and TML2 may include at least one metal layer and at least one transparent conductive layer.

[0121] refer to Figure 4 , the active area AA of the display panel DP may be an area on which an image is displayed, and the peripheral area NAA thereof may be an area on which a driving circuit, a driving wiring line, etc. are arranged. The light emitting elements included in the plurality of pixels PX may be arranged in the active area AA. The active area AA may be aligned with the transmissive area TA (see Figure 1 ) overlaps at least a portion of the peripheral area NAA (see Figure 1 ) may be covered by a border area BZA.

[0122] The display panel DP according to one or more embodiments may include a first non-bending area NBA1, a bending area BA, and a second non-bending area NBA2 arranged in a first direction DR1. The first non-bending area NBA1 may include an active area AA and a peripheral area NAA adjacent to the active area AA.

[0123] A plurality of signal lines GL, DL, PL, and EL may be connected to the pixel PX and may transmit an electrical signal to the pixel PX. Among the signal lines included in the display panel DP, a scan line GL, a data line DL, a power line PL, and a light emitting control line EL are shown. However, this is only an example, and the signal lines GL, DL, PL, and EL according to one or more embodiments of the present disclosure may further include an initialization voltage line, but the present disclosure is not limited to one or more embodiments.

[0124] The power pattern VDD may be located in the peripheral area NAA. The power pattern VDD may be connected to a plurality of power lines PL. Therefore, the display panel DP may include the power pattern VDD, and thus may provide the same power signal to a plurality of pixels PX.

[0125] The display pads PDD are arranged in the peripheral area NAA. The display pads PDD may include a first pad D1 and a second pad D2. A plurality of first pads D1 may be arranged to be connected to the data lines DL, respectively. The second pad D2 may be connected to the power pattern VDD and may be electrically connected to the power line PL. The display panel DP may be connected to the flexible circuit board FCB through the display pads PDD, and thus, an electrical signal provided from the main circuit board MCB may be provided to the pixel PX. Meanwhile, in addition to the first pads D1 and the second pads D2, the display pads PDD may also include conductive layers TML1 and TML2 (see Figure 3B ) or may further include pads for receiving other electrical signals, but the present disclosure is not limited to one or more embodiments.

[0126] refer to Figure 5 , the input sensor ISP may include a plurality of sensing electrodes TE1 and TE2, a plurality of sensing wiring lines TL1, TL2, and TL3, and a plurality of sensing pads PDT. The input sensor ISP may be divided into an active area AA-I and a peripheral area NAA-I adjacent to the active area AA-I. The peripheral area NAA-I may (e.g., in a plan view) surround the active area AA-I. The active area AA-I may be adjacent to the transmissive area TA (see Figure 1 ) overlaps at least a portion of the peripheral area NAA-I (see Figure 1 ) may be covered by a border area BZA.

[0127] The plurality of sensing electrodes TE1 and TE2 may include first sensing electrodes TE1 and second sensing electrodes TE2.

[0128] The first sensing electrode TE1 may extend in the first direction DR1, may be provided in plurality, and may be arranged in the second direction DR2. The first sensing electrode TE1 may include a first sensing pattern SP1 and a first bridge pattern BP1. The first sensing pattern SP1 may be arranged in the first direction DR1. At least one first bridge pattern BP1 may be connected to two first sensing patterns SP1 adjacent to each other.

[0129] The second sensing electrode TE2 may extend in the second direction DR2, may be provided in plurality, and may be arranged in the first direction DR1. The second sensing electrode TE2 may include a second sensing pattern SP2 and a second bridge pattern BP2. The second sensing pattern SP2 may be arranged in the second direction DR2. At least one second bridge pattern BP2 may extend from two second sensing patterns SP2 adjacent to each other.

[0130] The sensing wiring lines TL1, TL2, and TL3 may be arranged in the peripheral area NAA-I. The sensing wiring lines TL1, TL2, and TL3 may include a first sensing wiring line TL1, a second sensing wiring line TL2, and a third sensing wiring line TL3.

[0131] The first sensing wiring line TL1 may be connected to the second sensing electrode TE2. The second sensing wiring line TL2 may be connected to one end of the first sensing electrode TE1. The third sensing wiring line TL3 may be connected to the other end of the first sensing electrode TE1. The other end of the first sensing electrode TE1 may be opposite to one end of the first sensing electrode TE1 in the first direction DR1.

[0132] The first sensing electrode TE1 according to one or more embodiments of the present disclosure may be connected to the second sensing wiring line TL2 and the third sensing wiring line TL3. Therefore, for the first sensing electrode TE1 having a relatively long length compared to the second sensing electrode TE2, the sensitivity according to the region may be uniformly maintained. However, this is only an example, and the third sensing wiring line TL3 according to one or more embodiments of the present disclosure may be omitted, but the present disclosure is not limited to one or more embodiments.

[0133] The sensing pads PDT may be arranged in the peripheral area NAA-I. The sensing pads PDT may include a first sensing pad TP1, a second sensing pad TP2, and a third sensing pad TP3. The first sensing pad TP1 may be connected to the first sensing wiring line TL1 and electrically connected to the second sensing electrode TE2. The second sensing pad TP2 may be connected to the second sensing wiring line TL2. The third sensing pad TP3 may be connected to the third sensing wiring line TL3. Therefore, the second sensing pad TP2 and the third sensing pad TP3 may be electrically connected to the first sensing electrode TE1.

[0134] However, the present disclosure is not limited thereto, and the sensing pads PDT of the input sensor ISP may be arranged on the same layer as the display pads PDD of the display panel DP through contact holes defined in the sensing insulating layers TIL1, TIL2, and TIL3, but the present disclosure is not limited to one or more embodiments.

[0135] Fig. 6A is a cross-sectional view of an electronic device according to one or more embodiments of the present disclosure. Figure 6B is a cross-sectional view of an electronic device according to one or more embodiments of the present disclosure.

[0136] Fig. 6A The display panel DP (see Figure 4 ) in a state where the bending area BA is bent. The bending area BA may be bent with a curvature (eg, a predetermined curvature) along a virtual bending axis AX extending in the second direction DR2.

[0137] refer to Fig. 6A , the electronic device EA according to one or more embodiments may include a window panel WP, an anti-reflection panel RPP, a display module DM, protection members PF1 and PF2, a functional layer MP, a cover member CM, and a protection layer RS. In addition, the electronic device EA may include adhesive layers AM-W, AM-R, AM1, AM2, AM3, and AM4 arranged between adjacent components. Each of the adhesive layers AM-W, AM-R, AM1, AM2, AM3, and AM4 may include one of a pressure-sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, and an optically clear resin (OCR).

[0138] The window panel WP may include a base part WB, a hard coating layer HC, and a frame pattern BP. The base part WB may include an optically transparent insulating material. For example, the base part WB may include a glass substrate or a synthetic resin film. The hard coating layer HC for protecting the base part WB may be located on the front surface or the rear surface of the base part WB. The hard coating layer HC may reduce or prevent damage to the base part WB due to scratches, etc. In addition, an anti-fingerprint layer may be further located in the base part WB.

[0139] The frame pattern BP defines a frame area BZA (see Figure 1 ). The bezel pattern BP may be located at an edge of the rear surface of the base portion WB.

[0140] The frame pattern BP as a coloring layer may be formed by coating. The frame pattern BP may include a polymer resin and a pigment mixed with the polymer resin. For example, the polymer resin may be an acrylic resin or a polyester, and the pigment may be a carbon-based pigment.

[0141] According to one or more embodiments, an edge of one of the front surface and the rear surface of the base part WB may have a chamfered shape. For example, the edge WU of the front surface of the base part WB may have a rounded shape, and the edge WB of the rear surface thereof may have an angled shape. The frame pattern BP may overlap the edge WB having a chamfered shape on the rear surface to cover the edge WB.

[0142] The anti-reflection panel RPP may be located under the window panel WP. The anti-reflection panel RPP may reduce reflectivity of an external light beam input from the window panel WP. The window panel WP and the anti-reflection panel RPP may be coupled with an adhesive layer AM-W therebetween.

[0143] The anti-reflection panel RPP may be located on the front surface of the display module DM overlapping the first non-bending area NBA1. The anti-reflection panel RPP and the display module DM may be coupled with an adhesive layer AM-R therebetween.

[0144] The cover member CM may be located on the front surface of the display module DM overlapping the bending area BA. The cover member CM may relieve stress generated when a portion of the display panel DP overlapping the bending area BA is bent.

[0145] The first protection member PF1 may be located on the rear surface of the display module DM overlapping the first non-bending area NBA1. The display module DM and the first protection member PF1 may be coupled by the first adhesive layer AM1. According to one or more embodiments, the side surface P-E1 of the first protection member PF1 may be aligned with the side surface of the first adhesive layer AM1 in the third direction DR3.

[0146] The functional layer MP may be located under the first protective member PF1. The functional layer MP and the first protective member PF1 may be coupled by a second adhesive layer AM2. According to one or more embodiments, the side surface ME of the functional layer MP may be aligned with the side surface of the second adhesive layer AM2 in the third direction DR3. The functional layer MP and the second adhesive layer AM2 may expose a portion of the back surface PB of the first protective member PF1 adjacent to the side surface ME of the functional layer MP.

[0147] The third adhesive layer AM3 may be located between the functional layer MP and the second protection member PF2. A side surface of the third adhesive layer AM3 may be located further inside the display module DM than a side surface ME of the functional layer MP and a side surface PE2 of the second protection member PF2.

[0148] The second protective member PF2 may be located on the rear surface of the display module DM overlapping the second non-bending area NBA2. The display module DM and the second protective member PF2 may be coupled by a fourth adhesive layer AM4.

[0149] The electronic device EA according to one or more embodiments may include a protective layer RS. When the display module DM is bent, the protective layer RS ​​may be located in an inner space defined by the rear surface of the display module DM overlapping the bending area BA, the side surface P-E1 of the first protective member PF1, the side surface ME of the functional layer MP, the side surface P-E2 of the second protective member PF2, and the side surfaces of the adhesive layers AM1, AM2, AM3, and AM4.

[0150] Therefore, the protective layer RS ​​according to one or more embodiments of the present disclosure may contact the side surface P-E1 of the first protective member PF1, the side surface ME of the functional layer MP, the side surface P-E2 of the second protective member PF2, and the side surfaces of the adhesive layers AM1, AM2, AM3, and AM4. In addition, the protective layer RS ​​may contact the back surface PB of the first protective member PF1.

[0151] When the protective layer RS ​​is located in the above-mentioned internal space, the protective layer RS ​​can support the display module DM to maintain the shape of the bending area BA when the display module DM is bent. In addition, the protective layer RS ​​can reduce or prevent impurities and the like from being introduced into the electronic device EA through the bending area BA. The protective layer RS ​​according to one or more embodiments may include a resin.

[0152] Since the area to which the resin is applied is provided in the process of forming the protection layer RS, the present disclosure may reduce or prevent the possibility of a problem in which the resin penetrates between the adhesive layers AM1 , AM2 , AM3 , and AM4 when the bending area BA is bent.

[0153] refer to Figure 6B According to one or more embodiments, the electronic device EA-a may include a window panel WP, an anti-reflection panel RPP, a display module DM, protection members PF1 and PF2, a functional layer MP, a cover member CM, and a protection layer RS. In addition, the electronic device EA-a may include adhesive layers AM-W, AM-R, AM1, AM2, AM3-a, and AM4 arranged between adjacent components.

[0154] The window panel WP, the anti-reflection panel RPP, the display module DM, the protection members PF1 and PF2, the functional layer MP, the cover member CM, the protection layer RS ​​and the adhesive layers AM-W, AM-R, AM1, AM2 and AM4 included in the electronic device EA-a are described with reference to FIG. Fig. 6A , and the differences will be mainly described.

[0155] The third adhesive layer AM3-a may be located between the functional layer MP and the second protective member PF2. A side surface of the third adhesive layer AM3-a may be located inside the display module DM from the side surface ME of the functional layer MP and the side surface PE2 of the second protective member PF2.

[0156] The third adhesive layer AM3-a according to one or more embodiments may include a first layer P1, a second layer P2, and a third layer P3 sequentially stacked in the third direction DR3. Each of the first layer P1 and the third layer P3 may include one of a PSA film, an OCA film, and an OCR.

[0157] The second layer P2 may include metal. According to one or more embodiments, the second layer P2 may include metal and thus may be used as a ground. The display module DM may be connected to the second layer P2. Through the second layer P2, static electricity introduced into the display module DM may be discharged to the outside, or a path for static electricity to flow may be provided. Therefore, a display module DM with improved reliability may be provided.

[0158] In the following, reference will be made to FIG. 7A to FIG. 7D The process of applying the protective layer RS ​​is described.

[0159] FIG. 7A to FIG. 7D is a cross-sectional view illustrating a method of manufacturing an electronic device according to one or more embodiments of the present disclosure. Figures 1 to 6A The same / similar components described in the drawings will be described herein and their repeated description will be omitted.

[0160] refer to Fig. 7A , a method of manufacturing an electronic device according to one or more embodiments may include providing an operation of an initial electronic device.

[0161] The display module DM may be provided in a bending area BA (see Fig. 6A ) in a state before bending, that is, in a state where a window panel WP, an anti-reflection panel RPP, a display module DM, a first protective member PF1, a second protective member PF2, a functional layer MP and adhesive layers AM-W, AM-R, AM1, AM2, AM3 and AM4 are arranged, an initial electronic device is provided.

[0162] Thereafter, the method may include mixing the resin RS (which may be Fig. 6A The operation of applying the resin RS to the initial electronic device is the same as or similar to the protective layer RS. According to the present disclosure, in the operation of applying the resin RS, parts of the resin RS can be applied to different areas. For example, the first resin R1 can be applied to the first area. The "first area" can be defined as the bending area BA (see FIG. 1 ) formed between the first protection member PF1 and the second protection member PF2 and the display module DM before the display module DM is bent. Fig. 6A )The area between the overlapping rear surfaces.

[0163] The second resin R2 may be applied to the second region. The "second region" may be defined as the area in the edge of the functional layer MP that is adjacent to the bending area BA (see Fig. 6A The second region may be defined on the surface MU of the functional layer MP exposed by the third adhesive layer AM3.

[0164] According to the present disclosure, the first region and the second region may be spaced apart from each other. In addition, the area of ​​the first region may be greater than the area of ​​the second region. A plurality of second regions may be provided, and the plurality of second regions may be spaced apart from each other. Figures 8 to 10 Describe it.

[0165] Afterwards, refer to Figure 7B The method may include an operation of bending the display module DM. In the operation of bending the display module DM, the bending area BA (see Fig. 6A ) may be bent along a virtual bending axis AX extending in one direction. In this case, the first protection member PF1 and the second protection member PF2 may be bent to face each other.

[0166] The first resin R1 and the second resin R2 arranged in the regions spaced apart from each other may merge with each other when bent.

[0167] Afterwards, refer to Figure 7C , the method may further include an operation of inserting an additional resin. In the operation of inserting an additional resin, after the display module DM is completely bent, when the resin RS is not sufficiently applied to the inner space defined by the rear surface of the display module DM overlapping the bending area BA, the side surface P-E1 of the first protective member PF1, the side surface ME of the functional layer MP, the side surface P-E2 of the second protective member PF2, and the side surfaces of the adhesive layers AM1, AM2, AM3, and AM4, the resin RS may be additionally applied by the insertion device NZ. According to one or more embodiments, the operation of inserting an additional resin may be omitted.

[0168] Afterwards, refer to Fig.7D , the inner space defined in the state in which the bending area BA of the display module DM is bent may be filled with the resin RS. In this case, the resin RS may contact the side surface P-E1 of the first protective member PF1, the side surface ME of the functional layer MP, the side surface P-E2 of the second protective member PF2, and the side surfaces of the adhesive layers AM1, AM2, AM3, and AM4.

[0169] According to the present disclosure, when the bending area BA (see Fig. 6A) When the display module DM is bent, the first resin R1 applied to the first region and the second resin R2 applied to the second region (the first region and the second region are spaced apart from each other) merge, and thus, the penetration of the resin RS between the adhesive layers AM1, AM2, AM3 and AM4 can be reduced or prevented. Therefore, by reducing the corrugation defect in the display module DM, an electronic device EA with improved display quality can be provided.

[0170] Figures 8 to 10 This is an embodiment related to the already described first region to which the first resin R1 is applied and the second region to which the second resin R2 is applied.

[0171] Figure 8 is a rear view of a display panel according to one or more embodiments of the present disclosure. Fig. 9 is a rear view of a display panel according to one or more embodiments of the present disclosure. Fig.10 is a rear view of a display panel according to one or more embodiments of the present disclosure.

[0172] refer to Figure 8 , the first area RA1 may be defined as an area formed between the first protection member PF1 and the second protection member PF2. The second area RA2 may be defined on the surface MU of the functional layer MP exposed by the third adhesive layer AM3. According to one or more embodiments, the first area RA1 and the second area RA2 may extend in the same direction. The first area RA1 and the second area RA2 may be spaced apart from each other on a plane. The area of ​​the first area RA1 may be greater than the area of ​​the second area RA2.

[0173] refer to Fig. 9 , the first area RA1 may be defined as an area formed between the first protective member PF1 and the second protective member PF2. The second area RA2 may be defined on the surface MU of the functional layer MP exposed by the third adhesive layer AM3.

[0174] In one or more embodiments, the second region RA2 may include a (2-1)th region RA2-1 and a (2-2)th region RA2-2. The (2-1)th region RA2-1 and the (2-2)th region RA2-2 may be spaced apart from each other in the direction in which the first region RA1 extends. The first region RA1, the (2-1)th region RA2-1, and the (2-2)th region RA2-2 may be spaced apart from each other on a plane. The area of ​​the first region RA1 may be greater than the sum of the area of ​​the (2-1)th region RA2-1 and the area of ​​the (2-2)th region RA2-2.

[0175] refer to Fig.10, the first area RA1 may be defined as an area formed between the first protective member PF1 and the second protective member PF2. The second area RA2 may be defined on the surface MU of the functional layer MP exposed by the third adhesive layer AM3.

[0176] In one or more embodiments, the second area RA2 may include a first sub-area r1, a second sub-area r2, a third sub-area r3, a fourth sub-area r4, a fifth sub-area r5, and a sixth sub-area r6. The first sub-area r1, the second sub-area r2, the third sub-area r3, the fourth sub-area r4, the fifth sub-area r5, and the sixth sub-area r6 may be arranged in the form of points spaced apart from each other in a direction in which the first area RA1 extends.

[0177] The first region RA1 and the first subregion r1, the second subregion r2, the third subregion r3, the fourth subregion r4, the fifth subregion r5, and the sixth subregion r6 may be spaced apart from each other on a plane. The area of ​​the first region RA1 may be greater than the sum of the areas of the first subregion r1, the second subregion r2, the third subregion r3, the fourth subregion r4, the fifth subregion r5, and the sixth subregion r6. Fig.10 Six sub-regions are shown, but the present disclosure is not limited thereto, and sub-regions may be added or omitted.

[0178] Fig.11A is a cross-sectional view showing an electronic device according to a comparative example. Fig. 11B is a rear view of a display panel according to a comparative example. Fig. 11C is a cross-sectional view showing an electronic device according to a comparative example.

[0179] The electronic device EA-S according to one or more embodiments may have an area to which the resin RS-S is applied before the display module DM-S is bent, the area corresponding to the Fig. 6AThe area RA-S to which the resin RS-S is applied is different from that of the electronic device EA of one or more embodiments of the display module DM-S. According to one or more embodiments, before the display module DM-S is bent, the area RA-S to which the resin RS-S is applied may overlap with the area between the first protective member PF1-S and the second protective member PF2-S to overlap with one surface PU of the first protective member PF1-S exposed from the functional layer MP-S, and overlap with the surface MU of the functional layer MP-S exposed from the third adhesive layer AM3. Unlike in the present disclosure, when the areas to which the resin RS-S is applied are connected to each other without being spaced apart from each other, and when the display module DM-S is bent, a peeling defect CC in which the resin RS-S penetrates between the adhesive layers AM1, AM2, AM3, and AM4 may occur. When the resin RS-S penetrated between the adhesive layers AM1, AM2, AM3, and AM4 is visually identified through the window panel WP-S, a corrugation defect in the display module DM-S may occur.

[0180] According to the present disclosure, when the display module DM (see Figure 7B ) of the bending area BA (see Fig. 6A ) is bent, applied to the first area RA1 (see Figure 8 ) of the first resin R1 (see Figure 7B ) and located in the second area RA2 (see Figure 8 ) in the second resin R2 (see Figure 7B ) (wherein the first area RA1 and the second area RA2 are spaced apart from each other) may be merged, and thus the resin RS may be reduced or prevented (see Figure 7C ) on the adhesive layers AM1, AM2, AM3 and AM4 (see Figure 7C ) between. Therefore, by reducing the corrugation defect in the display module DM, an electronic device EA with improved display quality can be provided (see Fig. 6A ).

[0181] According to one or more embodiments of the present disclosure, an electronic device may be provided in which, when resins applied to regions spaced apart from each other merge with each other during bending, a moire defect in a display module is reduced and thus display quality is improved.

[0182] Although described above with reference to one or more embodiments of the present disclosure, it will be appreciated that those skilled in the art or persons of ordinary skill in the art may make various modifications and changes to the present disclosure without departing from the spirit and technical scope of the present disclosure described in the appended claims.

[0183] Therefore, the technical scope of the present disclosure is not limited to the detailed description of this specification, but should be defined by the appended claims (and their functional equivalents included therein).

Claims

1. Electronic equipment, including: A display module comprising a bending area bent along a virtual bending axis, a first non-bending area and a second non-bending area spaced apart from each other, wherein the bending area is between the first non-bending area and the second non-bending area, and the display module comprises a front surface and a rear surface opposite to the front surface; a first protective member below the rear surface and overlapping the first non-bending region; a second protective member over the rear surface, overlapping the second non-bending region, and facing the first protective member; a functional layer between the first protective member and the second protective member; and A protective layer, on the rear surface, overlaps the bent region and contacts a side surface of the first protective member, a side surface of the functional layer, and a side surface of the second protective member.

2. The electronic device according to claim 1, wherein: The side surface of the first protective member is closer to the bending region than the side surface of the functional layer and the side surface of the second protective member.

3. The electronic device according to claim 2, wherein: The functional layer exposes a portion of the rear surface of the first protective member that is in contact with the protective layer.

4. The electronic device according to claim 1 further includes a first adhesive layer between the first non-bending area and the first protective member, a second adhesive layer between the first protective member and the functional layer, a third adhesive layer between the functional layer and the second protective member, and a fourth adhesive layer between the second non-bending area and the second protective member.

5. The electronic device according to claim 4, wherein: The first adhesive layer, the second adhesive layer, the third adhesive layer, and the fourth adhesive layer include a pressure-sensitive adhesive film, an optically transparent adhesive film, or an optically transparent resin.

6. The electronic device according to claim 4, wherein: The protective layer contacts a side surface of the first adhesive layer, a side surface of the second adhesive layer, a side surface of the third adhesive layer, and a side surface of the fourth adhesive layer.

7. The electronic device according to claim 1 further includes a window panel, the window panel including a base portion above the display module, a frame pattern at at least a portion of an edge of a rear surface of the base portion, and a hard coating layer over a front surface of the base portion.

8. The electronic device according to claim 7, wherein: The rear surface of the base portion overlapped with the frame pattern or the front surface of the base portion overlapped with the frame pattern has a chamfered shape. 9 . The electronic device of claim 1 , further comprising a driving element on the front surface and overlapping the second non-bending area. 10 . The electronic device according to claim 9 , further comprising a main circuit board on the front surface and overlapping the second non-bending area. 11 . The electronic device according to claim 1 , further comprising a cover member over the front surface and overlapping the bent area. 12 . The electronic device according to claim 11 , further comprising an anti-reflection panel over the display module and having a side surface contacting the cover member.

13. The electronic device according to claim 1, wherein: The display module comprises: A display panel including a base layer, a transistor over the base layer, a light emitting element connected to the transistor, and an encapsulation layer configured to cover the light emitting element and including an inorganic layer and an organic layer; and An input sensor is directly on the packaging layer and includes a conductive layer and at least one sensing insulating layer.

14. The electronic device according to claim 1, wherein: The protective layer includes resin.

15. A method of manufacturing an electronic device, the method comprising: An initial electronic device is provided, the initial electronic device comprising: A display module comprising a first non-bending area, a bending area, and a second non-bending area; a first protection member on a rear surface of the display module and overlapping the first non-bending area; a second protection member on the rear surface of the display module and overlapping the second non-bending area; and a functional layer on the first protective member; applying resin to a first region overlapping the bending region and between the first protective member and the second protective member and a second region at an edge of the functional layer adjacent to the bending region and spaced apart from the first region; and The bending region is bent with respect to a bending axis extending in one direction so that the second protective member faces the functional layer.

16. The method according to claim 15, wherein: The area of ​​the first region is greater than the area of ​​the second region.

17. The method according to claim 15, wherein: The second region extends in the one direction.

18. The method according to claim 15, wherein: The second region includes sub-units spaced apart from each other in the one direction.

19. The method of claim 15, further comprising merging the resin applied to the first area and the resin applied to the second area in a space defined between the first protective member, the functional layer, the second protective member, and the rear surface of the display module overlapping the bending area.

20. The method of claim 19, further comprising inserting additional resin into the space after bending the bending region.

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