Chip packaging device and packaging method

Abstract

The invention discloses a chip packaging device and packaging method, and belongs to the field of chip packaging. A chip packaging device comprises a packaging table, the top of an inner cavity of the packaging table is rotationally connected with a station rotating disc, four sets of packaging clamping grooves are formed in the station rotating disc at equal intervals, the middle of the inner cavity of the packaging table is fixedly connected with a mounting frame, the mounting frame penetrates out of a center empty groove of the station rotating disc, the mounting frame is slidably connected with a plastic packaging cylinder, and the plastic packaging cylinder is fixedly connected with the station rotating disc. The packaging structure further comprises a plastic packaging assembly which is arranged on the mounting rack and is used for carrying out plastic packaging on the chip in the packaging clamping groove; an exhaust assembly; the piston plate slides in the piston bin in a reciprocating manner, so that gas in the plastic package barrel is pumped away, the air pressure in the plastic package barrel is reduced, after an electromagnetic valve in the material blocking hopper is opened, under the action of the air pressure in a cavity in the upper portion of the plastic package barrel, plastic package slurry can rapidly cover and be compacted on the surface of a chip, and therefore the packaging effect is improved; and the protection effect on the chip is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip packaging device and a packaging method. Background Art

[0002] Chip packaging refers to the process of protectively packaging the manufactured integrated circuit chips during the semiconductor manufacturing process. The main purpose of packaging is to protect the chip from physical damage or chemical corrosion and provide a way to connect the electronic signals on the chip to the external circuit. Chip packaging is a complex process that includes a series of steps such as chip pasting, bonding wires, and plastic sealing to ensure that the chip can work reliably and is easy to install on the circuit board.

[0003] At present, when chip plastic encapsulation is performed, it is difficult for the plastic encapsulation slurry to cover the chip surface completely and tightly, resulting in different degrees of adhesion between the plastic encapsulation slurry and the chip in different areas, resulting in reduced plastic encapsulation effect; and the plastic encapsulation slurry may be unevenly dispersed in the storage barrel during continuous long-term production and use, thereby reducing the packaging quality. Therefore, a chip packaging device and packaging method are proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problem that the plastic encapsulation slurry in the prior art is difficult to fully and tightly cover the chip surface, resulting in reduced plastic encapsulation effect; and the plastic encapsulation slurry will be unevenly dispersed during long-term storage in a storage barrel, thereby reducing the packaging quality. A chip packaging device and packaging method are proposed.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A chip packaging device comprises a packaging table, wherein the top of the inner cavity of the packaging table is rotatably connected to a workstation turntable, four groups of packaging card slots are arranged at equal intervals on the workstation turntable, a mounting frame is fixedly connected to the middle of the inner cavity of the packaging table, the mounting frame passes through the central empty slot of the workstation turntable, a plastic sealing cylinder is slidably connected to the mounting frame, and further comprises: a plastic sealing component, which is arranged on the mounting frame and is used to plastic seal the chip in the packaging card slot; and an exhaust component, which is arranged on the plastic sealing cylinder and is used to exhaust the gas in the cavity of the plastic sealing cylinder.

[0007] In order to improve the packaging quality and efficiency, preferably, the plastic sealing component includes a material storage barrel, which is fixed on the top of the mounting frame, and the bottom of the mounting frame is fixedly connected to an electric push rod, the top of the telescopic end of the electric push rod is fixedly connected to the top of the plastic sealing cylinder, an injection molding tube is slidably connected inside the plastic sealing cylinder, the top of the injection molding tube is connected to the inner cavity of the material storage barrel, and a quantitative valve is arranged on the injection molding tube, a material blocking hopper is fixedly connected inside the plastic sealing cylinder, and an electromagnetic valve is arranged inside the output end of the material blocking hopper.

[0008] Furthermore, a driven gear disk is fixedly connected to the bottom of the work station turntable, a servo motor is fixedly connected to the bottom of the inner cavity of the packaging table, a driving gear is fixedly connected to the top of the rotating shaft of the servo motor, the driving gear is meshingly connected to the driven gear disk, and a friction arc bar is fixedly connected to the top of the work station turntable between every two groups of packaging slots, a stirring shaft is rotatably connected in the storage barrel, a stirring paddle is fixedly connected to the outer wall of the stirring shaft, the bottom end of the stirring shaft passes through the storage barrel and the mounting frame, extends to the top of the work station turntable and is fixedly connected to a friction wheel, and the friction wheel slides in contact with the inner wall of the friction arc bar.

[0009] Furthermore, the friction arc strips are arranged in four groups at equal intervals, and the centers of the four groups of friction arc strips coincide with each other, and the distance from the inner wall of the friction arc strip to the center of the workstation turntable is greater than the distance from the side wall of the workstation turntable to the center of the workstation turntable.

[0010] In order to improve the packaging effect, preferably, the exhaust component includes a piston warehouse, which is fixedly connected to the outer wall of the plastic packaging cylinder, and an exhaust groove is opened between the piston warehouse and the inner cavity of the plastic packaging cylinder, and a one-way valve is arranged in the exhaust groove, a piston plate is slidably connected in the piston warehouse, a hinge seat is fixedly connected to the side wall of the piston plate, an exhaust motor is fixedly connected to the bottom of the piston warehouse, the top end of the rotating shaft of the exhaust motor passes through the piston warehouse and is fixedly connected to a rotating disk, a push-pull rod is rotatably connected in the hinge seat, and the other end of the push-pull rod is rotatably connected to the top of the rotating disk.

[0011] In order to improve the use effect of the packaging material, preferably, a pneumatic bin is fixedly connected to the top of the inner cavity of the storage barrel, the top of the stirring shaft passes through the pneumatic bin and is fixedly connected to a pneumatic impeller, a double-headed nozzle is fixedly connected to the outer wall of the pneumatic bin, and the output ends on both sides of the double-headed nozzle are symmetrically and staggered, the top of the piston bin is fixed and connected to an exhaust pipe, the other end of the exhaust pipe is connected to the inner cavity of the double-headed nozzle, and a one-way valve is arranged in the exhaust pipe, the top of the piston bin close to the plastic sealing cylinder side is fixed and connected to an air push pipe, the other end of the air push pipe is connected to the inner cavity of the exhaust pipe, and a one-way valve is arranged in the air push pipe.

[0012] In order to improve the packaging efficiency, preferably, the top of the pneumatic bin is fixed and connected to an air outlet pipe, and the exhaust pipe is fixed and connected to a blowing pipe.

[0013] In order to improve the stability of the chip during packaging, preferably, a sealing ring is fixedly connected to the packaging table, an adsorption groove is opened in the packaging card slot, four groups of adsorption tubes are fixedly connected to the bottom of the workstation turntable, the top of each group of adsorption tubes is connected to the inner cavity of the adsorption groove, and an air guide ring is fixedly connected between the four groups of adsorption tubes. The air guide ring is slidably sleeved in the sealing ring, and the air guide ring is divided into four equal-sized gas cavities by a partition, each of the gas cavity is connected to the corresponding inner cavity of the adsorption tube, and an air guide hole is opened in the middle of each gas cavity.

[0014] In order to facilitate the removal of the packaged chip and adjust the air pressure balance, further, the interior of the sealing ring is half hollow and half solid, the air guide hole is connected to the hollow cavity of the sealing ring, the side wall of the piston chamber is fixed and connected to an exhaust pipe, the other end of the exhaust pipe is connected to the hollow cavity of the air guide ring, and a one-way valve is arranged in the exhaust pipe, the bottom of the sealing ring is fixedly connected to a sealing disk, the bottom end of the adsorption tube slides in contact with the top of the sealing disk, and an air inlet groove is provided on the sealing disk.

[0015] A chip packaging method, the steps are as follows:

[0016] Step 1: Place the substrate to be plastic-encapsulated with the chip installed into the packaging card slot;

[0017] Step 2: Put the plastic sealing tube on the top of the chip and draw the gas inside the plastic sealing tube;

[0018] Step 3: inject a quantitative amount of packaging material into the plastic sealing tube;

[0019] Step 4: Turn the work station turntable to take out the packaged chip.

[0020] Compared with the prior art, the present invention provides a chip packaging device and packaging method, which have the following beneficial effects:

[0021] 1. The chip packaging device, through the piston plate sliding back and forth in the piston chamber, so that the gas in the plastic packaging cylinder is extracted, thereby reducing the air pressure in the plastic packaging cylinder. When the solenoid valve in the plugging hopper is opened, the plastic packaging slurry will quickly cover and compact the chip surface under the action of the air pressure in the upper cavity of the plastic packaging cylinder, thereby improving the packaging effect and ensuring the protection of the chip.

[0022] 2. The chip packaging device, through the rotation of the station turntable and the airflow filled into the pneumatic bin, stirs the plastic packaging slurry in the storage barrel multiple times during the plastic packaging process, ensuring the use effect of the plastic packaging slurry and improving the packaging quality; and the airflow that drives the pneumatic impeller to rotate is output from the blowing pipe, thereby accelerating the condensation speed of the plastic packaging slurry after packaging, effectively improving the packaging efficiency.

[0023] 3. The chip packaging device reduces the air pressure in the adsorption groove through the gas effect generated by the reciprocating sliding of the piston plate in the piston chamber, forming a negative pressure adsorption effect, so that the substrate with the chip is stably adsorbed in the packaging card slot, effectively improving the stability of the chip packaging and ensuring the packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 The overall structure of a chip packaging device proposed by the present invention is shown in FIG. Figure 1 ;

[0025] Figure 2 The overall structure of a chip packaging device proposed by the present invention is shown in FIG. Figure 2 ;

[0026] Figure 3 A schematic diagram of a partially half-section structure of a chip packaging device proposed by the present invention;

[0027] Figure 4 A chip packaging device proposed by the present invention Figure 3 A schematic diagram of the enlarged structure of the middle A area;

[0028] Figure 5 A schematic diagram of the internal cross-sectional structure of a packaging platform of a chip packaging device proposed by the present invention;

[0029] Figure 6 A chip packaging device proposed by the present invention Figure 5 Schematic diagram of the enlarged structure of the middle B area;

[0030] Figure 7 A schematic diagram of the transverse cross-sectional structure of a sealing ring of a chip packaging device proposed by the present invention;

[0031] Figure 8 This is a schematic diagram of the internal structure of a pneumatic chamber of a chip packaging device proposed by the present invention.

[0032] In the figure: 1. Packaging table; 2. Work station turntable; 21. Driven gear plate; 22. Servo motor; 221. Driving gear; 23. Friction arc strip; 3. Packaging card slot; 31. Adsorption slot; 32. Adsorption tube; 4. Mounting frame; 5. Plastic sealing cylinder; 6. Storage barrel; 61. Electric push rod; 62. Injection tube; 63. Blocking hopper; 64. Stirring shaft; 641. Stirring paddle; 642. Friction wheel; 7. Piston bin; 71. Vacuum tank ; 72. Piston plate; 721. Articulated seat; 722. Push-pull rod; 73. Exhaust motor; 731. Rotating disk; 74. Pneumatic chamber; 741. Pneumatic impeller; 742. Double-head nozzle; 75. Exhaust pipe; 751. Push air pipe; 76. Exhaust pipe; 761. Blowing pipe; 8. Sealing ring; 81. Air guide ring; 811. Gas cavity; 812. Air guide hole; 82. Exhaust pipe; 83. Sealing disk; 831. Air inlet groove. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] Embodiment 1:

[0036] Reference Figure 1-Figure 8 A chip packaging device comprises a packaging table 1, wherein a workstation turntable 2 is rotatably connected to the top of the inner cavity of the packaging table 1, and four groups of packaging card slots 3 are arranged at equal intervals on the workstation turntable 2. A mounting frame 4 is fixedly connected to the middle part of the inner cavity of the packaging table 1, and the mounting frame 4 passes through the central empty slot of the workstation turntable 2. A plastic sealing tube 5 is slidably connected to the mounting frame 4, and further comprises: a plastic sealing component, which is arranged on the mounting frame 4, and is used to plastic seal the chip in the packaging card slot 3; an exhaust component, which is arranged on the plastic sealing tube 5, and is used to discharge the gas in the cavity of the plastic sealing tube 5.

[0037] In addition, in order to facilitate the description of the working process of the device, the positions of the four groups of packaging card slots 3 are defined by name, (such as Figure 1As shown in the figure, the packaging card slot 3 located below the plastic sealing tube 5 is the first station, and then it rotates in the clockwise direction, which are the second station, the third station (unloading) and the fourth station (loading); and through the alternating operation of the above four stations, the packaging efficiency is improved and the manpower consumption is effectively reduced.

[0038] Reference Figure 1-Figure 3 The plastic packaging assembly includes a material storage barrel 6, which is fixed on the top of the mounting frame 4, and an electric push rod 61 is fixedly connected to the bottom of the mounting frame 4. The top of the telescopic end of the electric push rod 61 is fixedly connected to the top of the plastic packaging tube 5. An injection tube 62 is slidably connected in the plastic packaging tube 5. The top of the injection tube 62 is connected to the inner cavity of the material storage barrel 6, and a quantitative valve is arranged on the injection tube 62. A blocking hopper 63 is fixedly connected in the plastic packaging tube 5, and an electromagnetic valve is arranged in the output end of the blocking hopper 63; the bottom of the station turntable 2 is fixedly connected to the driven gear disc 21, and the bottom of the inner cavity of the packaging platform 1 is fixedly connected A servo motor 22 is provided, and a driving gear 221 is fixedly connected to the top of the rotating shaft of the servo motor 22. The driving gear 221 is meshed with the driven gear disc 21, and the top of the work station turntable 2 is located between each two groups of packaging slots 3 and is fixedly connected with a friction arc strip 23. A stirring shaft 64 is rotatably connected in the storage barrel 6, and a stirring paddle 641 is fixedly connected to the outer wall of the stirring shaft 64. The bottom end of the stirring shaft 64 passes through the storage barrel 6 and the mounting frame 4, extends to the top of the work station turntable 2 and is fixedly connected with a friction wheel 642, and the friction wheel 642 slides in contact with the inner wall of the friction arc strip 23.

[0039] Through the arrangement of the above structure, the servo motor 22 is turned on, and the driving gear 221 is meshed with the driven gear disc 21 to drive the work station turntable 2 to rotate 90 degrees, so that the packaging card slot 3 with the chip is moved to the fourth work station, and during the rotation of the work station turntable 2, the friction between the friction wheel 642 and the friction arc bar 23 will cause the friction wheel 642 to drive the stirring shaft 64 and the stirring paddle 641 to rotate in the storage barrel 6, thereby stirring the plastic encapsulation slurry in the storage barrel 6, thereby ensuring the use effect of the plastic encapsulation slurry.

[0040] In addition, four groups of friction arc strips 23 are arranged at equal intervals, and the centers of the four groups of friction arc strips 23 coincide. The distance from the inner wall of the friction arc strip 23 to the center of the workstation turntable 2 is greater than the distance from the side wall of the workstation turntable 2 to the center of the workstation turntable 2.

[0041] Reference Figure 3 , Figure 4The exhaust assembly includes a piston bin 7, which is fixedly connected to the outer wall of the plastic packaging tube 5, and an exhaust groove 71 is provided between the piston bin 7 and the inner cavity of the plastic packaging tube 5, and a one-way valve is provided in the exhaust groove 71, a piston plate 72 is slidably connected in the piston bin 7, a hinge seat 721 is fixedly connected to the side wall of the piston plate 72, an exhaust motor 73 is fixedly connected to the bottom of the piston bin 7, the top end of the rotating shaft of the exhaust motor 73 passes through the piston bin 7 and is fixedly connected to a rotating disk 731, a push-pull rod 722 is rotatably connected in the hinge seat 721, and the other end of the push-pull rod 722 is rotatably connected to the top of the rotating disk 731.

[0042] It should be noted that the one-way valve in the air extraction groove 71 can only allow the gas in the plastic packaging tube 5 to enter the piston chamber 7; in addition, when the plastic packaging slurry falls from the blocking hopper 63, the piston plate 72 is in the state closest to the plastic packaging tube 5 to ensure that the plastic packaging slurry falls smoothly.

[0043] Through the arrangement of the above structure, the exhaust motor 73 is turned on to drive the rotating disk 731 to rotate, and the piston plate 72 is driven to slide back and forth in the piston chamber 7 through the cooperation between the push-pull rod 722 and the hinge seat 721. When the piston plate 72 slides to the side close to the rotating disk 731, suction will be generated in the cavity on the side of the piston chamber 7 close to the plastic sealing tube 5, thereby opening the one-way valve in the air extraction groove 71, so that the gas in the plastic sealing tube 5 is sucked into the piston chamber 7, thereby reducing the air pressure in the plastic sealing tube 5. At this time, the solenoid valve in the blocking hopper 63 is opened. Under the action of the air pressure in the upper cavity of the plastic sealing tube 5, the plastic sealing slurry will quickly cover and compact the chip surface, thereby improving the packaging effect and ensuring the protection of the chip; and in the above process, the dust attached to the chip surface will also be sucked away, ensuring the cleanliness of the chip surface and improving the packaging quality.

[0044] Reference Figure 1-Figure 5 and Figure 8 , wherein, a pneumatic bin 74 is fixedly connected to the top of the inner cavity of the storage barrel 6, the top of the stirring shaft 64 penetrates into the pneumatic bin 74 and is fixedly connected to a pneumatic impeller 741, a double-headed nozzle 742 is fixedly connected to the outer wall of the pneumatic bin 74, and the output ends of the double-headed nozzle 742 on both sides are symmetrically and staggeredly arranged, the top of the piston bin 7 is fixed and connected to an exhaust pipe 75, the other end of the exhaust pipe 75 is connected to the inner cavity of the double-headed nozzle 742, and a one-way valve is arranged in the exhaust pipe 75, the top of the piston bin 7 close to the plastic sealing tube 5 is fixed and connected to an air push pipe 751, the other end of the air push pipe 751 is connected to the inner cavity of the exhaust pipe 75, and a one-way valve is arranged in the air push pipe 751; the top of the pneumatic bin 74 is fixed and connected to an air outlet pipe 76, and the air outlet pipe 76 is fixed and connected to a blowing pipe 761.

[0045] It should be noted that the one-way valve in the exhaust pipe 75 is located between the air push pipe 751 and the piston chamber 7; the one-way valve in the exhaust pipe 75 can only allow the gas in the piston chamber 7 to enter the pneumatic chamber 74; the one-way valve in the air push pipe 751 can only allow the gas in the piston chamber 7 to enter the pneumatic chamber 74 along the exhaust pipe 75.

[0046] With the arrangement of the above structure, when the piston plate 72 slides toward the side close to the rotating disk 731, it will squeeze the cavity where the rotating disk 731 is located in the piston chamber 7, thereby opening the one-way valve in the exhaust pipe 75, so that the gas is filled into the pneumatic chamber 74 along the exhaust pipe 75 and the double-headed nozzle 742, thereby pushing the pneumatic impeller 741 to drive the stirring shaft 64 and the stirring paddle 641 to rotate again, thereby stirring the plastic sealing slurry in the storage barrel 6 again, thereby improving the use effect of the plastic sealing slurry; and the gas after pushing the pneumatic impeller 741 to rotate will eventually be output along the outlet pipe 76 and the blowing pipe 761 It is sent to the packaging slot 3 at the second workstation to accelerate the condensation of the plastic encapsulation slurry after packaging, thereby effectively improving the packaging efficiency; and when the piston plate 72 moves toward the side close to the plastic encapsulation tube 5, it will cause a thrust to be generated in the cavity on the side of the piston bin 7 close to the plastic encapsulation tube 5, thereby opening the one-way valve in the air push pipe 751, so that the gas inhaled in the cavity on this side is continued to be transported to the pneumatic bin 74 along the air push pipe 751, the exhaust pipe 75 and the double-headed nozzle 742, thereby driving the stirring shaft 64 and the stirring paddle 641 to stir the plastic encapsulation slurry again, further improving the use effect of the plastic encapsulation slurry.

[0047] Reference Figure 5-Figure 7 , wherein a sealing ring 8 is fixedly connected inside the packaging table 1, an adsorption groove 31 is provided inside the packaging card slot 3, four groups of adsorption tubes 32 are fixedly connected to the bottom of the station turntable 2, the top of each group of adsorption tubes 32 is communicated with the inner cavity of the adsorption groove 31, and an air guide ring 81 is fixedly connected between the four groups of adsorption tubes 32, the air guide ring 81 is slidably sleeved inside the sealing ring 8, and the air guide ring 81 is divided into four gas cavities 811 of equal size by a partition, each gas cavity 811 is communicated with the inner cavity of the adsorption tube 32 corresponding to it, and each gas cavity An air guide hole 812 is provided in the middle part of 811; half of the interior of the sealing ring 8 is hollow and the other half is solid, the air guide hole 812 is connected to the hollow cavity of the sealing ring 8, the side wall of the piston chamber 7 is fixed and connected to an exhaust pipe 82, the other end of the exhaust pipe 82 is connected to the hollow cavity of the air guide ring 81, and a one-way valve is arranged in the exhaust pipe 82, a sealing disk 83 is fixedly connected to the bottom of the sealing ring 8, the bottom end of the adsorption tube 32 slides in contact with the top of the sealing disk 83, and an air inlet groove 831 is provided on the sealing disk 83.

[0048] It should be noted that the cavity in the air guide ring 81 is located at the bottom of the first station and the second station, so as to ensure that adsorption occurs in the packaging card slot 3 at the first station and the second station; the air inlet groove 831 is located between the second station and the fourth station with the third station as the center; so as to ensure that the adsorption effect in the packaging card slot 3 disappears at the third station and the fourth station, so as to facilitate unloading at the third station.

[0049] By setting the above structure, when the piston plate 72 moves to the side close to the plastic sealing tube 5, a suction effect will be generated in the cavity of the plastic sealing tube 5 close to the rotating disk 731, thereby opening the one-way valve in the exhaust pipe 82, so that the gas in the adsorption groove 31 enters the piston chamber 7 along the adsorption tube 32, the air guide ring 81, the air guide hole 812, the sealing ring 8 and the exhaust pipe 82, thereby reducing the air pressure in the adsorption groove 31 at the first station and the second station, forming a negative pressure adsorption effect, so that the substrate with the chip is stably adsorbed in the packaging card slot 3. The stability of chip packaging is effectively improved and the packaging quality is ensured. When the packaging slot 3 moves from the second station to the third station and the fourth station, the gas cavity 811 first moves to the solid air guide ring 81, and the bottom end of the adsorption tube 32 will move to the air inlet groove 831. At this time, the external airflow will be supplemented into the adsorption tube 32, thereby relieving the negative pressure effect in the adsorption groove 31 to facilitate material unloading, and ensure that the subsequent airflow supplemented into the adsorption groove 31 is sucked into the piston chamber 7, so as to achieve balanced regulation of air pressure and ensure the smooth operation of the device.

[0050] Embodiment 2:

[0051] Reference Figure 1-Figure 8 , which is basically the same as the first embodiment, a chip packaging method is proposed based on the first embodiment, and the steps are as follows:

[0052] Step 1: Place the substrate to be plastic-encapsulated with the chip mounted into the packaging card slot 3;

[0053] Step 2: Put the plastic sealing tube 5 on the top of the chip and draw the gas inside the plastic sealing tube 5;

[0054] Step 3: injecting a quantitative amount of packaging material into the plastic sealing tube 5;

[0055] Step 4: Turn the work station turntable 2 to take out the packaged chip.

[0056] Reference Figure 1-Figure 8In the present invention, when in use, firstly, the substrate to be plastic-encapsulated with the chip installed is placed in the packaging card slot 3 at the fourth station, and then the servo motor 22 is turned on, and the driving gear 221 is meshed with the driven gear plate 21 to drive the station turntable 2 to rotate 90 degrees, so that the packaging card slot 3 with the chip installed is moved to the fourth station (i.e., directly below the plastic encapsulation cylinder 5), and in the process of rotation of the station turntable 2, the friction between the friction wheel 642 and the friction arc bar 23 will cause the friction wheel 642 to drive the stirring shaft 64 and the stirring paddle 641 to rotate in the storage barrel 6, thereby stirring the plastic encapsulation slurry in the storage barrel 6, thereby ensuring the use effect of the plastic encapsulation slurry.

[0057] Then, the electric push rod 61 is turned on to retract its telescopic end downward, thereby driving the plastic sealing tube 5 to move downward, and finally making the plastic sealing tube 5 contact the chip substrate and surround the chip in the plastic sealing tube 5. At the same time, the quantitative valve on the injection tube 62 is opened to allow a quantitative amount of plastic sealing slurry to flow into the blocking hopper 63 along the injection tube 62. Then, the exhaust motor 73 is turned on to drive the rotating disk 731 to rotate. Through the cooperation between the push-pull rod 722 and the hinge seat 721, the piston plate 72 will be driven to slide back and forth in the piston chamber 7. When the piston plate 72 slides toward the side close to the rotating disk 731, suction will be generated in the cavity on the side of the piston chamber 7 close to the plastic sealing tube 5, thereby opening the one-way valve in the air extraction groove 71, so that the gas in the plastic sealing tube 5 is sucked into the piston chamber 7, thereby reducing the air pressure in the plastic sealing tube 5. At this time, the solenoid valve in the plugging hopper 63 is opened, and under the action of the air pressure in the upper cavity of the plastic sealing tube 5, the plastic sealing slurry will quickly cover and compact the chip surface, thereby improving the packaging effect and ensuring the protection of the chip. And while the piston plate 72 slides, it will also squeeze the cavity where the rotating disk 731 in the piston bin 7 is located, thereby opening the one-way valve in the exhaust pipe 75, so that the gas is filled into the pneumatic bin 74 along the exhaust pipe 75 and the double-headed nozzle 742, thereby pushing the pneumatic impeller 741 to drive the stirring shaft 64 and the stirring paddle 641 to rotate again, thereby stirring the plastic packaging slurry in the storage barrel 6 again, thereby improving the use effect of the plastic packaging slurry; and the gas after driving the pneumatic impeller 741 to rotate will eventually be transported to the packaging slot 3 at the second workstation along the outlet pipe 76 and the blowing pipe 761, thereby accelerating the condensation of the plastic packaging slurry after packaging, effectively improving the packaging efficiency.

[0058] When the piston plate 72 moves toward the side close to the plastic sealing tube 5, a thrust will be generated in the cavity on the side of the piston chamber 7 close to the plastic sealing tube 5, thereby opening the one-way valve in the air pushing pipe 751, so that the gas sucked in the cavity on this side is continuously transported to the pneumatic chamber 74 along the air pushing pipe 751, the exhaust pipe 75 and the double-headed nozzle 742, thereby driving the stirring shaft 64 and the stirring paddle 641 to stir the plastic sealing slurry again, further improving the use effect of the plastic sealing slurry; at the same time, a suction will be generated in the cavity of the plastic sealing tube 5 close to the rotating disk 731, thereby opening the one-way valve in the exhaust pipe 82, so that the gas in the adsorption groove 31 is discharged along the adsorption pipe 32, the air guide ring 81, the air guide hole 812, the sealing ring 8 and the exhaust pipe 82. Entering into the piston chamber 7, the air pressure in the adsorption groove 31 at the first station and the second station is reduced, forming a negative pressure adsorption effect, so that the substrate with the chip is stably adsorbed in the packaging card slot 3, effectively improving the stability of the chip packaging and ensuring the packaging quality. When the packaging card slot 3 moves from the second station to the third station and the fourth station, the gas cavity 811 first moves to the solid air guide ring 81, and the bottom end of the adsorption tube 32 will move to the air inlet groove 831. At this time, the external airflow will be supplemented into the adsorption tube 32, thereby relieving the negative pressure effect in the adsorption groove 31 to facilitate material unloading, and ensuring that the subsequent airflow supplemented into the adsorption groove 31 is sucked into the piston chamber 7, realizing the balanced adjustment of the air pressure and ensuring the smooth operation of the device.

[0059] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip packaging device, comprising a packaging station (1), characterized in that: The top of the inner cavity of the packaging platform (1) is rotatably connected to a workstation turntable (2), and four groups of packaging slots (3) are arranged at equal intervals on the workstation turntable (2). A mounting frame (4) is fixedly connected to the middle of the inner cavity of the packaging platform (1), and the mounting frame (4) passes through the central empty slot of the workstation turntable (2). A plastic sealing cylinder (5) is slidably connected to the mounting frame (4), and further comprises: A plastic encapsulation component, the plastic encapsulation component being arranged on a mounting frame (4), and being used to plastic encapsulate the chip in the packaging card slot (3); An exhaust component is arranged on the plastic packaging tube (5), and is used to exhaust the gas in the cavity of the plastic packaging tube (5).

2. The chip packaging device according to claim 1, characterized in that: The plastic sealing component comprises a material storage barrel (6), the material storage barrel (6) is fixed on the top of the mounting frame (4), the bottom of the mounting frame (4) is fixedly connected to an electric push rod (61), the top of the telescopic end of the electric push rod (61) is fixedly connected to the top of the plastic sealing cylinder (5), an injection tube (62) is slidably connected inside the plastic sealing cylinder (5), the top of the injection tube (62) is connected to the inner cavity of the material storage barrel (6), and a quantitative valve is arranged on the injection tube (62), a blocking hopper (63) is fixedly connected inside the plastic sealing cylinder (5), and an electromagnetic valve is arranged inside the output end of the blocking hopper (63).

3. The chip packaging device according to claim 2, characterized in that: A driven gear disc (21) is fixedly connected to the bottom of the work station turntable (2), a servo motor (22) is fixedly connected to the bottom of the inner cavity of the packaging table (1), a driving gear (221) is fixedly connected to the top of the rotating shaft of the servo motor (22), the driving gear (221) is meshingly connected to the driven gear disc (21), and a friction arc strip (23) is fixedly connected to the top of the work station turntable (2) between each two groups of packaging slots (3), a stirring shaft (64) is rotatably connected to the inside of the material storage barrel (6), a stirring paddle (641) is fixedly connected to the outer wall of the stirring shaft (64), the bottom end of the stirring shaft (64) passes through the material storage barrel (6) and the mounting frame (4) to extend to the top of the work station turntable (2) and is fixedly connected to a friction wheel (642), and the friction wheel (642) slides in contact with the inner wall of the friction arc strip (23).

4. The chip packaging device according to claim 3, characterized in that: The friction arc strips (23) are arranged in four groups at equal intervals, and the centers of the four groups of friction arc strips (23) coincide with each other. The distance from the inner wall of the friction arc strip (23) to the center of the workstation turntable (2) is greater than the distance from the side wall of the workstation turntable (2) to the center of the workstation turntable (2).

5. The chip packaging device according to claim 3, characterized in that: The exhaust component comprises a piston bin (7), wherein the piston bin (7) is fixedly connected to the outer wall of the plastic packaging tube (5), and an exhaust groove (71) is provided between the piston bin (7) and the inner cavity of the plastic packaging tube (5), and a one-way valve is provided in the exhaust groove (71), a piston plate (72) is slidably connected in the piston bin (7), and a hinge seat (721) is fixedly connected to the side wall of the piston plate (72), an exhaust motor (73) is fixedly connected to the bottom of the piston bin (7), the top end of the rotating shaft of the exhaust motor (73) passes through the piston bin (7) and is fixedly connected to a rotating disk (731), a push-pull rod (722) is rotatably connected in the hinge seat (721), and the other end of the push-pull rod (722) is rotatably connected to the top of the rotating disk (731).

6. The chip packaging device according to claim 5, characterized in that: The top of the inner cavity of the storage barrel (6) is fixedly connected to a pneumatic bin (74), the top of the stirring shaft (64) penetrates into the pneumatic bin (74) and is fixedly connected to a pneumatic impeller (741), the outer wall of the pneumatic bin (74) is fixedly connected to a double-headed nozzle (742), and the output ends of the double-headed nozzle (742) are symmetrically and staggeredly arranged on both sides, the top of the piston bin (7) is fixed and connected to an exhaust pipe (75), the other end of the exhaust pipe (75) is connected to the inner cavity of the double-headed nozzle (742), and a one-way valve is arranged in the exhaust pipe (75), and the top of the piston bin (7) close to the plastic sealing tube (5) is fixed and connected to an air push pipe (751), the other end of the air push pipe (751) is connected to the inner cavity of the exhaust pipe (75), and a one-way valve is arranged in the air push pipe (751).

7. The chip packaging device according to claim 6, characterized in that: The top of the pneumatic bin (74) is fixed and connected to an air outlet pipe (76), and the air outlet pipe (76) is fixed and connected to an air blowing pipe (761).

8. The chip packaging device according to claim 5, characterized in that: A sealing ring (8) is fixedly connected inside the packaging table (1), an adsorption groove (31) is provided inside the packaging card slot (3), four groups of adsorption tubes (32) are fixedly connected to the bottom of the workstation turntable (2), the top end of each group of adsorption tubes (32) is communicated with the inner cavity of the adsorption groove (31), an air guide ring (81) is fixedly connected between the four groups of adsorption tubes (32), the air guide ring (81) is slidably sleeved inside the sealing ring (8), the air guide ring (81) is divided into four equal-sized gas cavities (811) by a partition, each of the gas cavities (811) is communicated with the inner cavity of the corresponding adsorption tube (32), and an air guide hole (812) is provided in the middle of each of the gas cavities (811).

9. The chip packaging device according to claim 8, characterized in that: The interior of the sealing ring (8) is half hollow and half solid, the air guide hole (812) is connected to the hollow cavity of the sealing ring (8), the side wall of the piston chamber (7) is fixed and connected to an exhaust pipe (82), the other end of the exhaust pipe (82) is connected to the hollow cavity of the air guide ring (81), and a one-way valve is arranged in the exhaust pipe (82), the bottom of the sealing ring (8) is fixedly connected to a sealing disk (83), the bottom end of the adsorption tube (32) is fitted and slid with the top of the sealing disk (83), and an air inlet groove (831) is opened on the sealing disk (83).

10. A chip packaging method, using a chip packaging device according to any one of claims 1 to 9, characterized in that: Here are the steps: Step 1: Place the substrate to be plastic-encapsulated with the chip mounted thereon into the packaging card slot (3); Step 2: Sleeve the plastic sealing tube (5) onto the top of the chip and draw in the gas inside the plastic sealing tube (5); Step 3: injecting a quantitative amount of packaging material into the plastic sealing tube (5); Step 4: Turn the workstation turntable (2) to take out the packaged chip.

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