Transfer device for semiconductor wafer test and transfer method thereof

Abstract

The invention belongs to the technical field of semiconductor wafer testing, and discloses a semiconductor wafer testing transfer device and a transfer method thereof.The semiconductor wafer testing transfer device comprises a transfer frame body, a protective cover is arranged at the top of the transfer frame body, a supporting frame is arranged in the transfer frame body, and a supporting rod is arranged in the supporting frame; the two ends of the supporting rod are each sleeved with an attaching block, vertical blocks are arranged at the bottoms of the two attaching blocks, clamping and conveying plates are arranged at the bottoms of the two vertical blocks, the supporting rod, the vertical blocks, the clamping and conveying plates, the leveling frame, the guiding and conveying plate, the buffering block and the receiving and conveying frame are matched, so that the device moves at one end of the supporting rod, and under the connection of the vertical blocks and the clamping and conveying plates, the clamping and conveying plates can move at one end of the supporting rod. The two leveling frames are driven to move when the semiconductor wafer is conveyed, position deviation during conveying of the semiconductor wafer is avoided, the conveying quality of the semiconductor wafer by the conveying device is improved, and the semiconductor wafer is conveyed to the surface of the guiding and conveying plate and conveyed to the interior of the receiving and conveying frame along the inclined guiding and conveying plate.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor wafer testing, and in particular relates to a semiconductor wafer testing transfer device and a transfer method thereof. Background Art

[0002] Semiconductor wafer testing is a crucial step in the semiconductor manufacturing process, aimed at ensuring the quality and performance of the wafer. The goal of the test is to detect whether the integrated circuits on each wafer meet the design specifications to ensure its reliability and functionality in subsequent production and applications. A transfer device is required to transport the semiconductor wafers to the designated workstation for subsequent testing. The transfer device is set at a certain angle so that the semiconductor wafers stored on its surface can slide down.

[0003] However, the existing semiconductor wafer testing transfer device and transfer method are not perfect and still have certain defects: When semiconductor wafers are being transferred, their position is prone to shifting, which may cause the probe to fail to properly contact the target solder joint, resulting in unreliable test results. Position shift may lead to multiple adjustments during the production process, affecting the efficiency of subsequent inspections. When semiconductor wafers are being transferred, the collision force between the semiconductor wafer and the transfer structure is large, and the surface of the semiconductor wafer may be worn. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor wafer testing transfer device and a transfer method thereof to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a transfer device for semiconductor wafer testing and a transfer method thereof, comprising a transfer frame, a protective cover is arranged on the top of the transfer frame, a support frame is arranged inside the transfer frame, a support rod is arranged inside the support frame, both ends of the support rod are sleeved with bonding blocks, the bottoms of the two bonding blocks are arranged with vertical blocks, the bottoms of the two vertical blocks are arranged with clamping plates, one side of the two clamping plates is arranged with a leveling frame, one side of the transfer frame is arranged with a guide plate, the bottom of the transfer frame is arranged with two pressure-resistant bases, one side of one of the pressure-resistant bases is fixedly installed with an L-shaped plate, a buffer rod is arranged inside the L-shaped plate, and a receiving rack is arranged on one side of the L-shaped plate Preferably, the two fitting blocks are movably mounted on the two end portions of the support rod respectively, the bottom ends of the two vertical blocks are fixedly mounted with limiting plates, one side of the two clamping plates is provided with an arc plate, and one side of the support frame is fixedly mounted with a positioning side plate.

[0006] Preferably, a plurality of positioning holes are provided on one side of the positioning side plate, a circular hole is provided on one side of the two fitting blocks, and a protrusion is fixedly mounted on one side of the two vertical blocks.

[0007] Preferably, one side of the two protrusions is provided with a positioning bar, one end of the two positioning bars is respectively connected to the internal threads of the two circular holes and the multiple positioning holes, and the multiple positioning holes are arranged at equal intervals.

[0008] Preferably, two concave holes are opened on one side of the two limit plates, and a torsion bar is provided on one side of the two arc plates. One end of the two torsion bars is respectively connected to the internal threads of the four concave holes, and the positions of two adjacent concave holes are corresponding.

[0009] Preferably, two reinforcing ribs are fixedly installed on one side of the two leveling frames, one end of the four reinforcing ribs are respectively fixedly connected to one side of the two clamping plates, a buffer block is sleeved on one end of the buffer rod, a spring is wound around the outside of the buffer rod, and the receiving frame is arranged on one side of the top of the buffer block.

[0010] Preferably, strong suction cups are provided on both sides of the two compression-resistant bases, two transparent observation windows are provided inside the protective cover, and sealing cover plates are slidably installed on both sides of the protective cover.

[0011] A method for transferring a semiconductor wafer test transfer device comprises the following steps: Step 1: Equipment inspection: Ensure that the test equipment and transfer device are working properly, check the temperature of the test environment to ensure that it meets the requirements, and adsorb the four strong suction cups to the bottom surface of the test position to make the subsequent transfer of semiconductor wafers by the transfer frame more stable. At this time, the transfer frame has a certain inclination angle; Step 2: Check the surface of the wafer to avoid defects, place the complete semiconductor wafer on the surface of the transfer rack, and move the two bonding blocks in advance to adjust the distance between the two leveling racks so that the semiconductor wafer can be transported in the area between the two leveling racks, thus avoiding positional displacement of the semiconductor wafer during transfer; Step 3: The semiconductor wafer is transferred to the surface of the guide plate and transported to the inside of the pick-up rack along the inclined guide plate; Step 4: Confirm the identification of the semiconductor wafer to ensure that the correct wafer is moved to the correct location.

[0012] The beneficial effects of the present invention are as follows: 1. The present invention cooperates with the support rod, vertical block, clamping plate, leveling frame, guide plate, buffer block and receiving frame to move the two bonding blocks in sequence, so that they can move at one end of the support rod. Under the connection between the vertical block and the clamping plate, the two leveling frames will be driven to move. Therefore, the distance between the two protrusions can be adjusted by moving the two bonding blocks, which is convenient for gathering according to the diameter of the semiconductor wafer, so that the semiconductor wafer is transferred within the area of ​​the two leveling frames, avoiding position displacement of the semiconductor wafer during transfer, and improving the quality of the transfer device for the semiconductor wafer. The semiconductor wafer is transferred to the surface of the guide plate and transported to the inside of the receiving frame along the inclined guide plate.

[0013] 2. The present invention cooperates with the set protrusions, positioning holes, positioning strips, torsion strips, concave holes and limit plates. After the leveling frame reaches a suitable position, one end of the two positioning strips are sequentially embedded into the inside of the circular hole and the positioning hole, and the three are threadedly connected, so that the vertical block and the positioning side plate can be limited and fixed, thereby ensuring the stability of the leveling frame. The arc plate can move up and down on one side of the limit plate, and one end of the torsion strip is embedded into the inside of the concave hole, and the two are threadedly connected, so that the clamping plate and the limit plate can be limited and installed. Through this structure, the position height of the leveling frame can be adjusted according to the thickness of the semiconductor wafer, thereby improving the usability of the transfer device.

[0014] 3. The present invention cooperates with the reinforcement ribs, buffer rods, springs, transparent observation windows and circular holes, and the clamping plate and the leveling frame are connected by two reinforcement ribs, thereby enhancing the firmness between the leveling frame and the clamping plate. After the semiconductor wafer falls into the receiving rack and is collected, the force is transmitted to the buffer block, and the buffer block can move downward at one end of the buffer rod. The spring can be compressed and deformed after being subjected to force, converting kinetic energy into elastic potential energy, thereby reducing the collision force between the semiconductor wafer and the receiving rack. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a partial bottom view structural schematic diagram of the present invention; Figure 3 For the present invention Figure 2 The enlarged view of point A in the middle; Figure 4 It is a partial side view structural schematic diagram of the present invention; Figure 5 It is a partial front view structural schematic diagram of the powerful suction cup of the present invention; Figure 6 It is a partial front view structural schematic diagram of the leveling frame of the present invention; In the figure: 1. Transfer frame; 2. Protective cover; 3. Compression-resistant base; 4. Sealing cover; 5. Strong suction cup; 6. Transparent observation window; 7. Support frame; 8. Support rod; 9. Fitting block; 10. Vertical block; 11. Bump; 12. Positioning side plate; 13. Positioning hole; 14. Positioning strip; 15. Limiting plate; 16. Clamping plate; 17. Reinforcement rib; 18. Leveling frame; 19. Arc plate; 20. Twisting strip; 21. Concave hole; 22. L-shaped plate; 23. Buffer rod; 24. Buffer block; 25. Spring; 26. Transfer frame; 27. Guide plate. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] like Figures 1 to 6 As shown, the embodiment of the present invention provides a technical solution of a semiconductor wafer testing transfer device and a transfer method thereof: Embodiment 1

[0018] like Figure 1-2 As shown, a transfer device for testing semiconductor wafers comprises a transfer frame 1, a protective cover 2 is arranged on the top of the transfer frame 1, a support frame 7 is arranged inside the transfer frame 1, a support rod 8 is arranged inside the support frame 7, both ends of the support rod 8 are sleeved with fitting blocks 9, the bottoms of the two fitting blocks 9 are arranged with vertical blocks 10, the bottoms of the two vertical blocks 10 are arranged with clamping plates 16, one side of the two clamping plates 16 is arranged with a leveling frame 18, a guide plate 27 is arranged on one side of the transfer frame 1, and two pressure-resistant bases 3 are arranged at the bottom of the transfer frame 1, one side of the pressure-resistant base 3 is fixedly installed with an L-shaped plate 22, and the inside of the L-shaped plate 22 is provided with a buffer Rod 23, a pick-up rack 26 is provided on one side of the L-shaped plate 22, two fitting blocks 9 are movably mounted on the two end portions of the support rod 8 respectively, limiting plates 15 are fixedly installed on the bottom ends of the two vertical blocks 10, arc plates 19 are provided on one side of the two clamping plates 16, and a positioning side plate 12 is fixedly installed on one side of the support frame 7, which is convenient for gathering according to the diameter of the semiconductor wafers so that the semiconductor wafers are transferred within the area of ​​the two leveling racks 18, avoiding position displacement of the semiconductor wafers during transfer, and improving the quality of the transfer device for the semiconductor wafers. The semiconductor wafers are transferred to the surface of the guide plate 27 and transported to the inside of the pick-up rack 26 along the inclined guide plate 27. Embodiment 2

[0019] Based on the first embodiment, Figure 2-4 As shown, one side of the two protrusions 11 is provided with a positioning bar 14, one end of the two positioning bars 14 is respectively connected to the internal threads of the two circular holes and multiple positioning holes 13, and the positions of the multiple positioning holes 13 are arranged at equal intervals. Two concave holes 21 are provided on one side of the two limiting plates 15, and one side of the two arc-shaped plates 19 is provided with a torsion bar 20, one end of the two torsion bars 20 is respectively connected to the internal threads of the four concave holes 21, and the positions of two adjacent concave holes 21 are corresponding. One end of the torsion bar 20 is embedded in the inside of the concave hole 21, and the two are threadedly connected, so that the clamping plate 16 and the limiting plate 15 can be limited and installed. Through this structure, the position height of the leveling frame 18 can be adjusted according to the thickness of the semiconductor wafer, thereby improving the usability of the transfer device. Embodiment 3

[0020] On the basis of the first and second embodiments, Figure 1 , Figure 5 and Figure 6 As shown, two reinforcing ribs 17 are fixedly installed on one side of the two leveling frames 18, and one end of the four reinforcing ribs 17 is fixedly connected to one side of the two clamping plates 16 respectively. A buffer block 24 is sleeved on one end of the buffer rod 23, and a spring 25 is wound around the outside of the buffer rod 23. The receiving rack 26 is arranged on one side of the top of the buffer block 24. Strong suction cups 5 are arranged on both sides of the two pressure-resistant bases 3. Two transparent observation windows 6 are arranged inside the protective cover 2. Sealing cover plates 4 are slidably installed on both sides of the protective cover 2, which strengthens the firmness between the leveling frame 18 and the clamping plate 16. After the semiconductor wafer falls into the receiving rack 26 for collection, the force is transmitted to the buffer block 24, and the buffer block 24 can move downward at one end of the buffer rod 23, and the spring 25 can be compressed and deformed after being subjected to force.

[0021] A method for transferring a semiconductor wafer test transfer device comprises the following steps: Step 1: Equipment inspection: Ensure that the test equipment and transfer device are working properly, check the temperature of the test environment to ensure that it meets the requirements, and adsorb the four strong suction cups 5 to the bottom surface of the test position to make the subsequent transfer of the semiconductor wafer by the transfer frame 1 more stable. At this time, the transfer frame 1 has a certain inclination angle; Step 2: Check the surface of the wafer to avoid defects, place the complete semiconductor wafer on the surface of the transfer rack 1, and move the two bonding blocks 9 in advance to adjust the distance between the two leveling racks 18 so that the semiconductor wafer can be transported in the area between the two leveling racks 18, thereby avoiding positional deviation of the semiconductor wafer during transfer; Step 3: The semiconductor wafer is transferred to the surface of the guide plate 27 and transported to the inside of the transfer rack 26 along the inclined guide plate 27; Step 4: Confirm the identification of the semiconductor wafer to ensure that the correct wafer is moved to the correct location.

[0022] The working principle and use process of the present invention: Semiconductor wafer testing is a crucial step in the semiconductor manufacturing process, which aims to ensure the quality and performance of the wafer. The goal of the test is to detect whether the integrated circuit on each wafer meets the design specifications to ensure its reliability and functionality in subsequent production and application. It is necessary to use a transfer device to transport the semiconductor wafer to a designated workstation for subsequent testing. The transfer device is set at a certain angle, so that the semiconductor wafer stored on its surface can slide down, and the four strong suction cups 5 are mutually adsorbed with the bottom surface of the test position, so that the transfer rack 1 can subsequently transfer the semiconductor wafer. The transfer rack 1 has a certain inclination angle at this time. Check the surface of the wafer to avoid defects. Place the complete semiconductor wafer on the surface of the transfer rack 1, and move the two bonding blocks 9 in turn to make them move at one end of the support rod 8. Under the connection of the vertical block 10 and the clamping plate 16, the two leveling racks 18 will be driven to move. Therefore, by moving the two bonding blocks 9, the distance between the two protrusions 11 can be adjusted, which is convenient for gathering according to the diameter of the semiconductor wafer, so that the semiconductor wafer is transferred within the area of ​​the two leveling racks 18, avoiding position deviation of the semiconductor wafer during transfer, and improving the transfer efficiency. The device can ensure the quality of semiconductor wafer transfer. The semiconductor wafer is transferred to the surface of the guide plate 27 and transported to the inside of the receiving rack 26 along the inclined guide plate 27. After the leveling rack 18 reaches the appropriate position, one end of the two positioning bars 14 is sequentially embedded into the inside of the circular hole and the positioning hole 13. The three are threadedly connected, so that the vertical block 10 and the positioning side plate 12 can be limited and fixed, which ensures the stability of the leveling rack 18. The arc plate 19 can move up and down on one side of the limiting plate 15, and one end of the twisting bar 20 is embedded into the inside of the concave hole 21. The two are threadedly connected, so that the clamping plate 16 and the limiting plate 16 can be fixed. The plate 15 is limited and installed. Through this structure, the position height of the leveling frame 18 can be adjusted according to the thickness of the semiconductor wafer, which improves the usability of the transfer device. The clamping plate 16 and the leveling frame 18 are connected by two reinforcing ribs 17, which strengthens the firmness between the leveling frame 18 and the clamping plate 16. After the semiconductor wafer falls into the receiving rack 26 and is collected, the force is transmitted to the buffer block 24, and the buffer block 24 can move downward at one end of the buffer rod 23. The spring 25 can be compressed and deformed after being subjected to force, and the kinetic energy is converted into elastic potential energy, which reduces the collision force between the semiconductor wafer and the receiving rack 26.

[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer testing transfer device, comprising a transfer frame (1), characterized in that: A protective cover (2) is arranged on the top of the transfer frame (1), a support frame (7) is arranged inside the transfer frame (1), a support rod (8) is arranged inside the support frame (7), both ends of the support rod (8) are sleeved with fitting blocks (9), the bottoms of the two fitting blocks (9) are arranged with vertical blocks (10), the bottoms of the two vertical blocks (10) are arranged with clamping plates (16), one side of the two clamping plates (16) is arranged with a leveling frame (18), one side of the transfer frame (1) is arranged with a guide plate (27), and the bottom of the transfer frame (1) is arranged with two pressure-resistant bases (3), one side of one of the pressure-resistant bases (3) is fixedly mounted with an L-shaped plate (22), the inside of the L-shaped plate (22) is arranged with a buffer rod (23), and one side of the L-shaped plate (22) is arranged with a receiving frame (26).

2. A semiconductor wafer testing transfer device according to claim 1, characterized in that: The two fitting blocks (9) are movably mounted on the two ends of the support rod (8), the bottom ends of the two vertical blocks (10) are fixedly mounted with a limiting plate (15), one side of the two clamping plates (16) is provided with an arc plate (19), and one side of the support frame (7) is fixedly mounted with a positioning side plate (12).

3. The semiconductor wafer testing transfer device according to claim 2, characterized in that: A plurality of positioning holes (13) are provided on one side of the positioning side plate (12), a circular hole is provided on one side of the two fitting blocks (9), and a protrusion (11) is fixedly mounted on one side of the two vertical blocks (10).

4. The semiconductor wafer testing transfer device according to claim 3, characterized in that: A positioning strip (14) is provided on one side of the two protrusions (11), one end of the two positioning strips (14) is respectively connected to the internal threads of the two circular holes and the plurality of positioning holes (13), and the plurality of positioning holes (13) are arranged at equal intervals.

5. The semiconductor wafer testing transfer device according to claim 2, characterized in that: Two concave holes (21) are provided on one side of the two limit plates (15), and twist bars (20) are provided on one side of the two arc-shaped plates (19). One end of the two twist bars (20) is respectively connected to the internal threads of the four concave holes (21), and the positions of two adjacent concave holes (21) are corresponding.

6. The semiconductor wafer testing transfer device according to claim 1, characterized in that: Two reinforcing ribs (17) are fixedly mounted on one side of the two leveling frames (18), one end of the four reinforcing ribs (17) is fixedly connected to one side of the two clamping plates (16), one end of the buffer rod (23) is sleeved with a buffer block (24), the outside of the buffer rod (23) is wound with a spring (25), and the receiving frame (26) is arranged on one side of the top of the buffer block (24).

7. The semiconductor wafer testing transfer device according to claim 1, characterized in that: Strong suction cups (5) are provided on both sides of the two pressure-resistant bases (3), two transparent observation windows (6) are provided inside the protective cover (2), and sealing cover plates (4) are slidably mounted on both sides of the protective cover (2).

8. A method for transferring a semiconductor wafer test transfer device, the method being applicable to the semiconductor wafer test transfer device according to claims 1 to 7, characterized in that : Includes the following steps: Step 1: Equipment inspection: Ensure that the test equipment and transfer device are working properly, check the temperature of the test environment to ensure that it meets the requirements, and attach the four strong suction cups (5) to the bottom surface of the test position to each other, so that the transfer frame (1) can transfer the semiconductor wafer more stably in the future. At this time, the transfer frame (1) has a certain tilt angle; Step 2: Check the surface of the wafer to avoid defects, place the complete semiconductor wafer on the surface of the transfer frame (1), and move the two bonding blocks (9) in advance to adjust the distance between the two leveling frames (18) so that the semiconductor wafer can be transported in the area between the two leveling frames (18), thereby avoiding positional deviation of the semiconductor wafer during transfer; Step 3: The semiconductor wafer is transferred to the surface of the guide plate (27), and transported along the inclined guide plate (27) to the interior of the receiving rack (26); Step 4: Confirm the identification of the semiconductor wafer to ensure that the correct wafer is moved to the correct location.

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