Semiconductor substrate fixing device

Abstract

The invention discloses a semiconductor substrate fixing device, which comprises two partition plates, two transverse plates, two pressing mechanisms, a plurality of bearing mechanisms, two placing blocks and a bottom plate, and is characterized in that the two transverse plates are arranged at the two transverse ends of the bottom plate; the two partition plates are arranged at the two longitudinal ends of the bottom plate. A plurality of strip-shaped notches are formed in the bottom plate, side grooves are formed in the side faces of the strip-shaped notches, and the positions of the strip-shaped notches correspond to the positions of the bearing mechanisms; the placing block is arranged on the outer side of the transverse plate, a limiting groove is formed in the placing block, and the pressing mechanism is arranged on the placing block; a plurality of longitudinal grooves are formed in the partition plate, and the bearing mechanisms are installed on the longitudinal grooves. Therefore, the integrity and the design freedom degree of the semiconductor substrate can be effectively kept, cracks or deformation caused by additional stress is avoided, meanwhile, the heat conduction efficiency between the chip and the radiator is improved, good heat dissipation performance is ensured, the service life of the chip is prolonged, and the overall reliability is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor substrates, and in particular to a semiconductor substrate fixing device. Background Art

[0002] Semiconductor substrates are crucial components in the semiconductor industry and are usually made of flat solid materials such as silicon, quartz or sapphire. As the carrier of semiconductor chips, the main function of semiconductor substrates is to provide a stable platform for growing semiconductor materials and manufacturing electronic components such as transistors on its surface.

[0003] Fixing the semiconductor substrate is a critical step in the semiconductor manufacturing process. Fixing the semiconductor substrate ensures that the substrate can maintain a stable position during subsequent manufacturing processes such as crystal growth, cutting, polishing and packaging, thereby ensuring the quality and performance of the chip.

[0004] However, when a semiconductor substrate needs to be fixed, a hole is usually made on its surface first and then fixed with screws. However, drilling will destroy the integrity of the substrate surface, occupy the design space of the substrate, and reduce the freedom of substrate design. In addition, drilling may also introduce additional stress, causing cracks or deformation of the substrate in subsequent processes.

[0005] On the other hand, the larger contact area between the semiconductor substrate and the fixture after it is fixed will hinder heat dissipation and affect the heat dissipation performance of the chip. Long-term high temperature environment will accelerate the aging of the chip and reduce its service life. Summary of the invention

[0006] The present application aims to solve one of the technical problems in the related art at least to some extent.

[0007] To this end, one purpose of the present application is to propose a semiconductor substrate fixing device that can effectively maintain the integrity and design freedom of the semiconductor substrate, avoid cracks or deformation caused by additional stress, and at the same time improve the heat conduction efficiency between the chip and the heat sink, ensuring good heat dissipation performance, thereby extending the chip service life and improving overall reliability.

[0008] To achieve the above-mentioned purpose, the first embodiment of the present application proposes a semiconductor substrate fixing device, including two baffle plates, two transverse plates, two pressing mechanisms, multiple receiving mechanisms, two placement blocks and a bottom plate, wherein the two transverse plates are arranged at the two ends of the bottom plate in the transverse direction; the two baffle plates are arranged at the two ends of the bottom plate in the longitudinal direction; the bottom plate is provided with a plurality of slots, the sides of the slots are provided with side slots, and the positions of the slots and the positions of the receiving mechanisms correspond to each other; the placement block is arranged on the outer side of the transverse plate, the placement block is provided with a limiting groove, and the pressing mechanism is arranged on the placement block; the baffle plate is provided with a plurality of longitudinal grooves, the The receiving mechanism is installed on the longitudinal groove; the receiving mechanism includes a receiving block, a first mounting block, a compression spring, a second mounting block, a cone block and an adjustment assembly, wherein the receiving block is "L"-shaped and is arranged inside the longitudinal groove; the cone block is installed on one side of the bottom of the receiving block; the first mounting block is arranged on one side of the receiving block, and the second receiving block is arranged on the side wall of the baffle plate; one end of the compression spring is connected to the bottom of the first mounting block, and the other end of the compression spring is connected to the top of the second mounting block; the adjustment assembly is arranged at the bottom of the baffle plate, and the position of the adjustment assembly corresponds to the position of the side groove.

[0009] The semiconductor substrate fixing device of the embodiment of the present application can effectively maintain the integrity and design freedom of the semiconductor substrate, avoid cracks or deformation caused by additional stress, and at the same time improve the heat conduction efficiency between the chip and the heat sink, ensuring good heat dissipation performance, thereby extending the service life of the chip and improving overall reliability.

[0010] In addition, the semiconductor substrate fixing device proposed in the present application may also have the following additional technical features:

[0011] In one embodiment of the present application, the pressing mechanism includes a rotating assembly, two arc-shaped members, an adjusting assembly and a rotating screw, wherein the rotating assembly is installed on the placing block, and the ends of the two arc-shaped members are rotatably connected to the rotating assembly; the adjusting assembly is arranged in the middle of the two arc-shaped members, and the rotating screw is installed on the adjusting assembly; and the bottom of the rotating screw is arranged inside the limiting groove.

[0012] In one embodiment of the present application, it is characterized in that the adjusting assembly includes a connecting block, a baffle and a receiving spring, wherein the top of the connecting block is a cone that matches the cone block; the baffle is installed on one side of the connecting block, and the baffle is provided with a slot; one end of the receiving spring is connected to the connecting block, and the other end of the receiving spring is connected to the side wall of the baffle plate; the size of the baffle and the size of the side groove correspond to each other.

[0013] In one embodiment of the present application, the rotating assembly includes a rotating rod, an annular block, two connecting shafts and a mounting frame, wherein the mounting frame is installed on the placing block, and a vertical groove is opened on the mounting frame; the annular block is arranged on the vertical groove; the two connecting shafts are installed on both sides of the annular block, and the connecting shafts are installed at the bottom of the arc-shaped member; the rotating rod is arranged on the annular block.

[0014] In one embodiment of the present application, the adjustment assembly includes two protrusions, two rotating disks and a threaded block, wherein the two rotating disks are respectively mounted on the threaded blocks; the two protrusions are respectively arranged on the outer sides of the rotating disks; and the rotating screw and the threaded block are threadedly connected.

[0015] In one embodiment of the present application, the outer end of the arc-shaped member is arc-shaped, and the outer end of the arc-shaped member corresponds to the position of the transverse plate.

[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0018] Figure 1 This is a schematic diagram of the structure of the semiconductor substrate fixing device of the present application;

[0019] Figure 2 It is a schematic cross-sectional structural diagram of the receiving mechanism of the semiconductor substrate fixing device of the present application;

[0020] Figure 3 This is a schematic structural diagram of a semiconductor substrate fixing device A of the present application;

[0021] Figure 4 This is a schematic structural diagram of an adjustment component of a semiconductor substrate fixing device of the present application;

[0022] Figure 5 This is a schematic structural diagram of a bottom plate of a semiconductor substrate fixing device of the present application.

[0023] As shown in the figure:

[0024] 1. baffle plate; 11. longitudinal groove; 2. transverse plate;

[0025] 3. Pressing mechanism; 31. Rotating assembly; 311. Rotating rod; 312. Ring block; 313. Coupling shaft; 314. Vertical slot; 315. Mounting frame; 32. Arc-shaped member; 33. Adjusting assembly; 331. Protrusion; 332. Rotating disk; 333. Threaded block; 34. Rotating screw;

[0026] 4. receiving mechanism; 41. receiving block; 42. first mounting block; 43. compression spring; 44. second mounting block; 45. cone block; 46. adjustment assembly; 461. linkage block; 462. baffle; 4621. slot; 463. receiving spring;

[0027] 5. Placement block; 51. Limiting groove; 6. Bottom plate; 61. Strip notch; 62. Side groove. DETAILED DESCRIPTION

[0028] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0029] The semiconductor substrate fixing device according to the embodiment of the present application is described below with reference to the accompanying drawings.

[0030] like Figure 1 As shown, the semiconductor substrate fixing device of the embodiment of the present application may include two baffle plates 1, two transverse plates 2, two pressing mechanisms 3, a plurality of receiving mechanisms 4, two placement blocks 5 and a bottom plate 6.

[0031] The two transverse plates 2 are arranged at the two ends of the bottom plate 6. It should be noted that the height of the transverse plates 2 is not higher than the height of the placement blocks 5, and the height difference between the transverse plates 2 and the placement blocks 5 is used to place the semiconductor substrate.

[0032] The two baffle plates 1 are arranged at both ends of the bottom plate 6 in the longitudinal direction. The bottom plate 6 is provided with a plurality of slots 61 , and the sides of the slots 61 are provided with side slots 62 . The positions of the slots 61 and the receiving mechanism 4 correspond to each other.

[0033] It should be noted that, in this embodiment, a plurality of strip notches 61 are provided, the strip notches 61 correspond to each other in pairs, and the positions of the strip notches 61 and the receiving mechanism 4 correspond to each other.

[0034] The placement block 5 is arranged on the outer side of the transverse plate 2 , a limiting groove 51 is opened on the placement block 5 , the pressing mechanism 3 is arranged on the placement block 5 , a plurality of longitudinal grooves 11 are opened on the baffle plate 1 , and the receiving mechanism 4 is installed on the longitudinal grooves 11 .

[0035] It should be noted that the length of the longitudinal groove 11 described in this embodiment is greater than the length of the receiving mechanism 4 , so that the receiving mechanism 4 can move up and down inside the longitudinal groove 11 .

[0036] The receiving mechanism 4 may include a receiving block 41 , a first mounting block 42 , a compression spring 43 , a second mounting block 44 , a cone block 45 and an adjustment assembly 46 .

[0037] Among them, the receiving block 41 is "L"-shaped, the receiving block 41 is arranged inside the longitudinal groove 11, the cone block 45 is installed on one side of the bottom of the receiving block 41, the first mounting block 42 is arranged on one side of the receiving block 41, and the second receiving block 41 is arranged on the side wall of the baffle plate 1. One end of the compression spring 43 is connected to the bottom of the first mounting block 42, and the other end of the compression spring 43 is connected to the top of the second mounting block 44.

[0038] It should be noted that the receiving block 41 in this embodiment is used to place the substrate. When the substrate is placed on the horizontal panel of the receiving block 41, the substrate will press the receiving block 41 and drive the mounting block to move downward. In the process of the mounting block moving downward, the compression spring 43 will be squeezed, and the cone block 45 at the bottom of the receiving mechanism 4 will press the adjusting component 33, forcing the adjusting component 33 to move laterally.

[0039] The manipulating assembly 46 is disposed at the bottom of the baffle plate 1, and the position of the manipulating assembly 46 corresponds to the position of the side groove 62. It should be noted that the manipulating assembly 46 described in this embodiment can freely extend and retract from the side groove 62 when moving.

[0040] In one embodiment of the present application, Figure 3 As shown, the pressing mechanism 3 may include a rotating component 31 , two arc-shaped members 32 , an adjusting component 33 and a rotating screw 34 .

[0041] Among them, the rotating component 31 is installed on the placing block 5, the ends of the two arc-shaped parts 32 are rotatably connected to the rotating component 31, the adjusting component 33 is arranged in the middle of the two arc-shaped parts 32, the rotating screw 34 is installed on the adjusting component 33, and the bottom of the rotating screw 34 is arranged inside the limiting groove 51.

[0042] It should be noted that the rotating screw 34 described in this embodiment can determine the position of the arc-shaped member 32 , and the length of the hypotenuse on one side of the arc-shaped head of the arc-shaped member 32 is smaller than the length of the hypotenuse on the other side of the arc-shaped member 32 .

[0043] Specifically, after the relevant personnel place the substrate on the receiving mechanism 4, in order to ensure the stability of its placement, the two sides of the substrate need to be fixed. At this time, the relevant personnel need to rotate the rotating component 31. When the rotating component 31 is rotated clockwise (with Figure 3The arc plate will use the adjustment component 33 as a fulcrum to drive the arc head of the arc member 32 to move downward, thereby clamping the substrate. Similarly, when the rotating component 31 rotates counterclockwise, the arc head of the arc member 32 will move upward to release the clamping of the substrate.

[0044] In one embodiment of the present application, Figure 2 As shown, the adjusting assembly 46 may include a linkage block 461 , a baffle 462 and a receiving spring 463 .

[0045] Among them, the top of the connecting block 461 is a cone that matches the cone block 45, the baffle 462 is installed on one side of the connecting block 461, the baffle 462 is provided with a slot 4621, one end of the receiving spring 463 is connected to the connecting block 461, and the other end of the receiving spring 463 is connected to the side wall of the baffle plate 1, and the size of the baffle 462 corresponds to the size of the side groove 62.

[0046] Specifically, when the substrate is placed on the receiving block 41 and / or the substrate is clamped by the pressing mechanism 3, the cone block 45 at the bottom of the substrate will press the linkage block 461, and the cone block 45 and the linkage block 461 will directly produce relative pressing and sliding, which will force the linkage block 461 to move toward the receiving spring 463 and compress the receiving spring 463, thereby driving the baffle 462 to slide toward the inside of the side groove 62, thereby releasing the baffle 462 from blocking the strip notch 61 (such as Figure 5 As shown), heat dissipation is increased and dust can be prevented from entering the side of the baffle plate 1 through the strip notch 61 during normal operation, making it easier to clean it.

[0047] Furthermore, when the cone block 45 slides downward, the provided engaging groove 4621 can engage the end of the cone block 45 , thereby preventing the cone block 45 from further moving.

[0048] In one embodiment of the present application, Figure 3 As shown, the rotating assembly 31 may include a rotating rod 311 , an annular block 312 , two connecting shafts 313 and a mounting bracket 315 .

[0049] Among them, the mounting frame 315 is installed on the placement block 5, a vertical groove 314 is opened on the mounting frame 315, the annular block 312 is set on the vertical groove 314, two connecting shafts 313 are installed on both sides of the annular block 312, and the connecting shaft 313 is installed at the bottom of the arc member 32, and the rotating rod 311 is set on the annular block 312.

[0050] Specifically, when the rotating rod 311 is rotated and moves clockwise, the connecting shaft 313 on the rotating rod 311 will also rotate clockwise, thereby driving the right side of the arc-shaped member 32 to tilt up and driving the arc-shaped member 32 to rotate around the adjustment component 33. At this time, the arc-shaped protrusion 331 on the arc-shaped member 32 will move downward to clamp the upper side of the substrate.

[0051] In one embodiment of the present application, Figure 3 As shown, the adjustment assembly 33 may include two protrusions 331 , two rotating disks 332 and a threaded block 333 .

[0052] The two rotating disks 332 are respectively mounted on the threaded blocks 333 , the two protrusions 331 are respectively arranged on the outer sides of the rotating disks 332 , and the rotating screw rod 34 and the threaded blocks 333 are threadedly connected.

[0053] Furthermore, if Figure 3 As shown, the outer end of the arc-shaped member 32 is arc-shaped, and the outer end of the arc-shaped member 32 corresponds to the position of the transverse plate 2.

[0054] It should be noted that when the rotating screw rod 34 described in this embodiment rotates, the threaded block 333 can be located at different heights on the threaded rod. When the threaded block 333 is close to the top of the rotating screw rod 34, the arc member 32 can clamp a thicker substrate.

[0055] It should be noted that when the relevant staff needs to clamp and fix the substrate, the substrate is first placed on multiple receiving blocks 41, and the left and right sides of the substrate are respectively at the bottom of the corresponding arc-shaped member 32. At this time, the rotating rod 311 is rotated clockwise, and the rotating rod 311 will rotate on the vertical groove 314, and drive the connecting shaft 313 to move upward along the clockwise direction, thereby causing the arc-shaped member 32 to rotate around the protrusion 331 through the rotating disk 332, so that the arc-shaped protrusion 331 part of the arc-shaped member 32 moves downward, thereby clamping both sides of the substrate.

[0056] At this time, the entire substrate will move downward. During the movement of the substrate, the multiple receiving blocks 41 will be pressed downward. When the receiving blocks 41 are pressed downward, the first mounting block 42 will be driven downward and the compression spring 43 will be compressed. At the same time, the cone block 45 will slide relative to the linkage block 461, and force the linkage block 461 to press the receiving spring 463 on its right side, thereby driving the baffle 462 to move. During the movement of the baffle 462 to the right, the cone block 45 will approach the clamping groove 4621 and pre-clamp the clamping groove 4621 to prevent the cone block 45 from moving excessively. At the same time, after the baffle 462 moves, the strip notch 61 on the bottom plate 6 will be exposed, which is beneficial to the heat dissipation at the bottom of the semiconductor substrate.

[0057] The semiconductor substrate fixing device provided in the embodiment of the present application can be applied to the fixing and clamping of semiconductor substrates. It should be noted that in the specific use process, in view of the diversity of the size of semiconductor substrates, the device needs to ensure that the size of the semiconductor substrate does not exceed the fixed size of the fixing device during the process of fixing the semiconductor substrate, that is, the width of the semiconductor substrate to be fixed is not less than the distance between the two opposite receiving blocks 41, and the length of the semiconductor substrate to be fixed is not less than the distance between the arc-shaped protrusions 331 of the two arc-shaped members 32, so as to ensure the stability of the semiconductor substrate clamping.

[0058] In summary, the semiconductor substrate fixing device of the embodiment of the present application can effectively maintain the integrity and design freedom of the semiconductor substrate, avoid cracks or deformation caused by additional stress, and at the same time improve the heat conduction efficiency between the chip and the heat sink, ensuring good heat dissipation performance, thereby extending the chip service life and improving overall reliability.

[0059] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0060] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0061] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and deform the above embodiments within the scope of the present application.

Claims

1. A semiconductor substrate fixing device, characterized in that: It includes two baffle plates, two transverse plates, two pressing mechanisms, multiple receiving mechanisms, two placement blocks and a bottom plate, wherein: The two transverse plates are arranged at two ends of the bottom plate in the transverse direction; The two baffle plates are arranged at both ends of the bottom plate in the longitudinal direction; The bottom plate is provided with a plurality of slots, the sides of the slots are provided with side slots, and the positions of the slots and the receiving mechanism correspond to each other; The placing block is arranged on the outer side of the horizontal plate, a limiting groove is provided on the placing block, and the pressing mechanism is arranged on the placing block; The baffle plate is provided with a plurality of longitudinal grooves, and the receiving mechanism is installed on the longitudinal grooves; The receiving mechanism comprises a receiving block, a first mounting block, a compression spring, a second mounting block, a cone block and an adjustment assembly, wherein: The receiving block is "L" shaped and is arranged inside the longitudinal groove; The cone block is installed on one side of the bottom of the receiving block; The first mounting block is arranged on one side of the receiving block, and the second receiving block is arranged on the side wall of the baffle plate; One end of the compression spring is connected to the bottom of the first mounting block, and the other end of the compression spring is connected to the top of the second mounting block; The adjusting component is arranged at the bottom of the baffle plate, and the position of the adjusting component corresponds to the position of the side groove.

2. The semiconductor substrate fixing device according to claim 1, characterized in that: The pressing mechanism includes a rotating assembly, two arc-shaped members, an adjusting assembly and a rotating screw, wherein: The rotating assembly is installed on the placement block, and the ends of the two arc-shaped members are rotatably connected to the rotating assembly; The adjusting assembly is arranged in the middle of the two arc-shaped members, and the rotating screw is mounted on the adjusting assembly; The bottom of the rotating screw is arranged inside the limiting groove.

3. The semiconductor substrate fixing device according to claim 1, characterized in that: The adjustment assembly includes a linkage block, a baffle and a receiving spring, wherein: The top of the linkage block is a cone that matches the cone block; The baffle is installed on one side of the linkage block, and the baffle is provided with a slot; One end of the receiving spring is connected to the linkage block, and the other end of the receiving spring is connected to the side wall of the baffle plate; The size of the baffle plate and the size of the side groove correspond to each other.

4. The semiconductor substrate fixing device according to claim 2, characterized in that: The rotating assembly includes a rotating rod, an annular block, two connecting shafts and a mounting frame, wherein: The mounting frame is mounted on the placement block, and a vertical slot is provided on the mounting frame; The annular block is arranged on the vertical groove; The two coupling shafts are installed on both sides of the annular block, and the coupling shaft is installed at the bottom of the arc-shaped member; The rotating rod is arranged on the annular block.

5. The semiconductor substrate fixing device according to claim 2, characterized in that: The adjustment assembly includes two protrusions, two rotating disks, and a threaded block, wherein: The two rotating disks are respectively mounted on the threaded blocks; The two protrusions are respectively arranged on the outer sides of the rotating disk; The rotating screw rod and the threaded block are threadedly connected.

6. The semiconductor substrate fixing device according to claim 2, characterized in that: The outer end of the arc-shaped member is arc-shaped, and the positions of the outer end of the arc-shaped member and the transverse plate correspond to each other.

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