Wiring body and display device

Abstract

This wiring body is provided with: a first resin layer having a first main surface and a second main surface, and having a through-hole penetrating from the first main surface to the second main surface; a conductive layer disposed in the through hole; and a first adhesive layer that covers the first resin layer and the conductive layer from the first main surface side.

Description

Technical Field

[0001] The present disclosure relates to a wiring body and a display device. Background Art

[0002] Conventionally, there is known a structure in which a conductive mesh pattern from which a substrate layer is removed is mounted on a display device via a transparent adhesive layer (for example, Japanese Unexamined Patent Application Publication No. 2017-504094).

[0003] Here, the conductive mesh pattern mounted on the display device is formed with a very fine line width pattern in order to reduce visibility. In the above-mentioned wiring body, the shape of the mesh pattern may be deformed due to the removal of the substrate layer. On the other hand, there is a problem that when a substrate layer is provided to maintain the shape of the mesh pattern, the thickness of the wiring body increases.

[0004] Therefore, an object of the present disclosure is to provide a wiring body and a display device that can maintain the shape of a conductive layer and reduce the thickness. Summary of the invention

[0005] A wiring body according to one aspect of the present disclosure comprises: a first resin layer having a first main surface and a second main surface and having a through hole extending from the first main surface to the second main surface; a conductive layer arranged in the through hole; and a first adhesive layer covering the first resin layer and the conductive layer from the first main surface side.

[0006] A display device according to one aspect of the present disclosure includes the above-mentioned wiring body.

[0007] According to one aspect of the present disclosure, it is possible to provide a wiring body and a display device capable of maintaining the shape of a conductive layer and reducing the thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a plan view showing one embodiment of a conductive member including a wiring body.

[0009] Figure 2 It is along Figure 1 Cross-sectional view along line II-II.

[0010] Figure 3 It is a cross-sectional view showing a conductive member according to a modification.

[0011] Figure 4 is a cross-sectional view showing one embodiment of a display device.

[0012] Figure 5 It is a top view of an antenna including a wiring body.

[0013] Figure 6 It is along Figure 5 An enlarged cross-sectional view taken along line VI-VI is shown.

[0014] Figure 7 It is shown Figure 6 An enlarged cross-sectional view of the structure near the end surface of the first conductive wire is shown.

[0015] Figure 8 It is a schematic cross-sectional view showing a method for manufacturing a wiring body.

[0016] Fig. 9 It is a schematic cross-sectional view showing a method for manufacturing a wiring body.

[0017] Description of Reference Numerals

[0018] 1 ... first adhesive layer, 2 ... second adhesive layer, 5 ... conductive layer, 7 ... first resin layer, 7a ... first main surface, 7b ... second main surface, 7c ... through hole, 8 ... second resin layer, 80 ... first portion, 81 ... second portion, 82 ... cover portion, 84 ... inorganic particles, 85 ... metal microparticles, 100 ... display device, 200 ... wiring body DETAILED DESCRIPTION

[0019] Some embodiments of the present disclosure are described in detail below, but the present disclosure is not limited to the following embodiments.

[0020] Figure 1 2 is a plan view showing a conductive member 20 including a wiring body 200 according to an embodiment of the present disclosure. Figure 2 It is along Figure 1 The conductive member 20 includes an antenna 300 , and the antenna 300 includes a wiring body 200 . Figure 1 and Figure 2 The conductive component 20 shown, i.e., the wiring body 200, comprises: a first resin layer 7, a conductive layer 5, and a first adhesive layer 1. The first resin layer 7 has a first main surface 7a and a second main surface 7b. The first resin layer 7 has a through hole 7c that passes from the first main surface 7a to the second main surface 7b. The first resin layer 7 has: an insulating resin portion 7A, which is a region having the through hole 7c, and a light-transmitting resin layer 7B. The conductive layer 5 is arranged in the through hole 7c. The conductive layer 5 has: a conductor portion 3, which includes a portion extending in a direction along the main surfaces 7a, 7b and including a pattern including a plurality of openings 3a. The insulating resin portion 7A is configured to be buried in the opening 3a of the conductor portion 3. Figure 2 In FIG. 1 , the conductive layer 5 is shown in a deformed state, and the width of the conductor portion 3 is emphasized. In addition, the thickness of each layer is also shown in a deformed state. The details of the thickness of each layer will be described later. Figure 1In the example shown, the conductive layer 5 is formed near one short side of the conductive member 20, but the position where the conductive layer 5 is formed is not particularly limited, and the conductive layer 5 may be formed near the long side. The first adhesive layer 1 covers the first resin layer 7 and the conductive layer 5 from the first main surface 7a side. The first adhesive layer 1 is a layer that exerts an adhesive force on other members when the wiring body 200 is bonded to other members on the first main surface 7a side. The main surface 1a of the first adhesive layer 1 is configured to contact the first main surface 7a of the first resin layer 7. In addition, the first adhesive layer 1 may not cover the entire surface of the first resin layer 7 and the first main surface 7a side of the conductive layer 5.

[0021] The first adhesive layer 1 has a light transmittance of a degree required when the conductive member 20 is incorporated into a display device. Specifically, the total light transmittance of the first adhesive layer 1 may be 90 to 100%. The haze of the first adhesive layer 1 may be 0 to 5%.

[0022] The material of the first adhesive layer 1 may also be, for example, acrylic acid, polyurethane, silicone, etc. The thickness of the first adhesive layer 1 may also be 50 to 250 μm. The dielectric constant of the first adhesive layer 1 may also be 2.5 to 4.5@1 MHz.

[0023] The conductor portion 3 constituting the conductive layer 5 includes: a portion having a pattern including openings 3a. The pattern including openings 3a is a grid-like pattern including a plurality of openings 3a regularly arranged and formed by a plurality of linear portions intersecting each other. The conductor portion 3 having a grid-like pattern can function well as a radiation conductor and a power supply line of the antenna 300, for example. In addition, the conductor portion 3 has a planar pattern without openings 3a. The conductor portion 3 having a planar pattern functions as a terminal and a ground pad portion described later. In addition, the details of the structure of the pattern of the conductor portion 3 of the conductive layer 5 will be described later.

[0024] The conductor part 3 may also contain a metal. The conductor part 3 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum and tin, and may contain copper. The conductor part 3 may also be a plated metal formed by a plating method. The conductor part 3 may also contain non-metallic elements such as phosphorus within a range that maintains appropriate conductivity.

[0025] The conductor part 3 may also be a laminate composed of a plurality of layers. In addition, the conductor part 3 may also have a blackened layer as a surface layer on the opposite side to the first adhesive layer 1. The blackened layer may help improve the visibility of the display device in which the conductive member is incorporated. Here, the opposite side of the first adhesive layer 1 is set as the surface layer, but the first adhesive layer 1 side may also be the surface layer. In this case, the first adhesive layer 1 may also have a blackened layer as a surface layer.

[0026] The insulating resin portion 7A is formed of a resin having light transmittance, and is provided so as to bury the opening 3a of the conductor portion 3. Usually, the insulating resin portion 7A and the conductor portion 3 are formed with flat surfaces. In addition, the flatness here may also be slightly uneven (the conductive layer has a portion lower than the surface of the resin layer). That is, the outermost surface of the insulating resin portion 7A and the conductor portion 3 may not be completely on the same plane.

[0027] The light-transmitting resin layer 7B is formed of a resin having light transmissivity. The total light transmittance of the light-transmitting resin layer 7B may be 90 to 100%. The haze of the light-transmitting resin layer 7B may be 0 to 5%.

[0028] The difference in refractive index between the first adhesive layer 1 and the light-transmitting resin layer 7B may also be less than 0.1. Thus, it is easy to further ensure good visibility of the displayed image. The refractive index (nd25) of the light-transmitting resin layer 7B may be, for example, more than 1.0, or less than 1.7, less than 1.6, or less than 1.5. The refractive index can be measured by a reflection spectrophotometer. From the perspective of uniformity of the optical path length, the conductor portion 3, the insulating resin portion 7A, and the light-transmitting resin layer 7B may also have substantially the same thickness.

[0029] The resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B may also be a cured product of a curable resin composition (a photocurable resin composition or a thermosetting resin composition). The curable resin composition forming the insulating resin portion 7A and / or the light-transmitting resin layer 7B includes a curable resin, and examples thereof include acrylic resins, amino resins, cyanic acid resins, isocyanic acid resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dichloroprene resins, benzocyclobutene resins, episulfide resins, enethiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and unsaturated double bonds, as well as ultraviolet curing resins containing functional groups that cause polymerization reactions by ultraviolet rays, such as cyclic ethers and vinyl ethers.

[0030] The resin forming the insulating resin portion 7A and the resin forming the light-transmitting resin layer 7B may be the same. The insulating resin portion 7A and the light-transmitting resin layer 7B formed of the same resin have the same refractive index, so the uniformity of the optical path length passing through the conductive member 20 can be further improved. In the case where the resin forming the insulating resin portion 7A and the resin forming the light-transmitting resin layer 7B are the same, for example, by patterning a single curable resin layer by imprinting or the like, the insulating resin portion 7A and the light-transmitting resin layer 7B can be easily formed at once.

[0031] You can also use Figure 3The conductive member 20 (wiring body 200) is shown. Figure 3 The conductive component 20 (wiring body 200) shown also includes: a second adhesive layer 2 covering the first resin layer 7 and the conductive layer 5 from the second main surface 7b side. The second adhesive layer 2 is a layer that exerts adhesive force on other components when the wiring body 200 is bonded to other components on the second main surface 7b side. The main surface 2a of the second adhesive layer 2 is configured to contact the second main surface 7b of the first resin layer 7. However, in the case where the second resin layer 8 described later is provided on the second main surface 7b, the second adhesive layer 2 is in contact with the second resin layer 8. In addition, the thickness, material, and other characteristics of the second adhesive layer 2 may be the same as those of the first adhesive layer 1. However, the first adhesive layer 1 and the second adhesive layer 2 may also be selected to have different thicknesses and materials. In addition, the second adhesive layer 2 may not cover the entire surface of the second main surface 7b side of the first resin layer 7 and the conductive layer 5.

[0032] The conductive member described above as an example can be incorporated into a display device as, for example, a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic EL display device. Figure 4 It is a cross-sectional view showing one embodiment of a display device in which the wiring body 200 is incorporated. Figure 4 The display device 100 shown in the figure includes: an image display unit 10 having an image display region 10S, a polarizing plate 30, a conductive member 20, and a cover glass 40. The polarizing plate 30, the conductive member 20, and the cover glass 40 are stacked in this order from the image display unit 10 side on the image display region 10S side of the image display unit 10. The structure of the display device 100 is not limited to Figure 4 The polarizer 30 can be changed as needed. For example, the polarizer 30 can be provided between the glass cover 40 and the conductive member 20. The image display unit 10 can also be a liquid crystal display unit, for example. As the polarizer 30 and the glass cover 40, components commonly used in display devices can be used. The polarizer 30 and the glass cover 40 may not necessarily be provided. Figure 4 In the embodiment, a glass cover 40 is provided on the second main surface 7b side. Therefore, as the wiring body 200, a Figure 3 However, in the case where the glass cover 40 is omitted, it is also possible to use Figure 2 The wiring body 200 shown. The light for image display emitted from the image display region 10S of the image display unit 10 passes through a path having a highly uniform optical path length including the conductive member 20. Thus, a highly uniform and good image display with moiré suppressed can be performed.

[0033] Next, refer to Figure 5 The structure of the antenna 300 including the wiring body 200 according to the embodiment of the present disclosure will be described in detail. The antenna 300 is configured to include the conductive layer 5 described above. Figure 5 is a top view of the antenna 300 . Figure 5 A portion of the antenna 300 having the wiring body 200 is shown in an enlarged manner. In the following description, the XY coordinates are set on a plane parallel to the main surface 1S. The Y-axis direction is the direction along the main surface 1S. Figure 1 In the example shown, it corresponds to the direction perpendicular to the side 20a of the conductive member 20. The center side of the conductive member 20 is set as the positive side in the Y-axis direction, and the outer peripheral side of the conductive member 20 is set as the negative side in the Y-axis direction. The X-axis direction is the direction perpendicular to the Y-axis direction along the main surface 1S. Figure 1 In the example shown, it corresponds to the direction in which the side 20a of the conductive member 20 extends. The side in which the side 20a of the conductive member 20 extends is set as the positive side in the X-axis direction, and the other side is set as the negative side in the X-axis direction. Figure 5 In the illustrated example, the antenna 300 is illustrated as a single antenna element, but the present invention is not limited thereto, and a plurality of antennas 300 may be arranged in the X-axis direction to form an array antenna.

[0034] Conductive layer 5 of antenna 300 includes electrode 26 including radiation electrode 21 and feeder lines 25A and 25B, terminals 22A and 22B, and ground pads 24A, 24B and 24C. Antenna 300 has an axisymmetric structure with respect to a center line CL parallel to the Y-axis direction.

[0035] The radiation electrode 21 is a region where the antenna 300 radiates signals. The radiation electrode 21 has a circular shape. The center of the radiation electrode 21 is arranged on the center line CL. The radiation electrode 21 is arranged at a position away from the side 20a of the conductive member 20 toward the positive side in the Y-axis direction. The radiation electrode 21 has a diameter R.

[0036] The feed lines 25A and 25B are lines for supplying power to the radiation electrode 21. That is, the antenna 300 functions as a dual-polarization antenna. For example, a tilted polarized wave signal in the direction in which the tilted portion 25b of the feed line 25A extends can be supplied via the feed line 25A, and a tilted polarized wave signal in the direction in which the tilted portion 25b of the feed line 25B extends can be supplied via the feed line 25B. The feed lines 25A and 25B have a vertical portion 25a extending perpendicularly to the side 20a of the conductive member 20, and a tilted portion 25b tilted with respect to the Y-axis direction. The vertical portion 25a of the feed line 25A extends from the terminal 22A formed on the side of the side 20a of the conductive member 20 to the positive side in the Y-axis direction. The vertical portion 25a of the feed line 25A extends parallel to the center line CL (that is, the Y-axis direction) at a position separated from the center line CL to the negative side in the X-axis direction.

[0037] The inclined portion 25b of the feed line 25A is inclined so as to approach the center line CL side (i.e., the positive side in the X-axis direction) as it goes toward the positive side in the Y-axis direction from the end of the vertical portion 25a on the positive side in the Y-axis direction. The end of the inclined portion 25b on the positive side in the Y-axis direction is connected to the outer peripheral edge 21a of the radiation electrode 21. The feed line 25A has a constant width dimension W1 in the vertical portion 25a and the inclined portion 25b. In addition, the feed line 25A has a line length L1 which is the total dimension of the length dimension of the vertical portion 25a and the length dimension of the inclined portion 25b. Here, the width dimension W1 is a dimension in the in-plane direction of the planar antenna 300 in a direction orthogonal to the extending direction of the vertical portion 25a and the inclined portion 25b, and the line length L1 is a dimension in the in-plane direction of the planar antenna 300 along the extending direction of the vertical portion 25a and the inclined portion 25b.

[0038] In addition, Figure 5 In the example shown, the vertical portion 25a of the feed line 25A is arranged at a position further away from the negative side of the radiation electrode 21 in the X-axis direction. In addition, the end of the vertical portion 25a of the feed line 25A on the positive side of the Y-axis direction (i.e., the connection portion with the inclined portion 25b) is arranged at a position further away from the negative side of the Y-axis direction than the end of the radiation electrode 21 on the negative side of the Y-axis direction. However, the arrangement and shape of the vertical portion 25a and the inclined portion 25b are not particularly limited. The feed line 25B has a structure that is axially symmetrical with the feed line 25A with respect to the center line CL. In the present embodiment, the inclined portion 25b of the feed line 25A and the inclined portion 25b of the feed line 25B are connected to the outer peripheral edge 21a of the radiation electrode 21 in a manner that is orthogonal to a virtual line extending the inclined portion 25b of the feed line 25A and a virtual line extending the inclined portion 25b of the feed line 25B. That is, the angle formed by the virtual line extending the inclined portion 25 b of the power supply line 25A and the virtual line extending the inclined portion 25 b of the power supply line 25B is 90 degrees.

[0039] The terminals 22A and 22B are terminals connected to the power supply lines 25A and 25B, respectively. The terminals 22A and 22B are connected to external input / output terminals to supply power to the radiation electrode 21 via the power supply lines 25A and 25B. The terminals 22A and 22B are arranged near the side 20a of the conductive member 20. The terminals 22A and 22B extend from the negative end of the vertical portion 25a of the power supply lines 25A and 25B in the Y-axis direction to the negative side in the Y-axis direction to the side 20a. The terminals 22A and 22B extend in the Y-axis direction with a constant width dimension W2. The terminals 22A and 22B extend in the Y-axis direction with a length dimension L2. Here, the width dimension W2 is a dimension in the in-plane direction of the planar antenna 300 in a direction orthogonal to the extension direction of the terminals 22A and 22B, and the length dimension L2 is a dimension in the in-plane direction of the planar antenna 300 along the extension direction of the terminals 22A and 22B.

[0040] The grounding pad portions 24A, 24B, and 24C are regions that are electrically grounded. The grounding pad portions 24A, 24B, and 24C are connected to ground terminals (not shown). The grounding pad portions 24A, 24B, and 24C are insulated from the terminals 22A and 22B by being arranged with a gap GP relative to the terminals 22A and 22B. The grounding pad portion 24A is formed to extend along the side portion 20a in the X-axis direction in the region between the terminals 22A and 22B. The grounding pad portion 24B is formed to extend along the side portion 20a in the X-axis direction in the region on the negative side of the terminal 22A in the X-axis direction. The grounding pad portion 24C is formed to extend along the side portion 20a in the X-axis direction in the region on the positive side of the terminal 22B in the X-axis direction. The grounding pad portions 24A, 24B, and 24C extend in the X-axis direction in a strip shape with a constant width in the Y-axis direction. The widths of the ground land portions 24A, 24B, and 24C are the same as the length dimension L2 of the terminals 22A and 22B.

[0041] As described above, the terminal 22A as a signal line has a structure sandwiched by the ground pads 24A and 24B from both sides in the X-axis direction. The terminal 22B as a signal line has a structure sandwiched by the ground pads 24A and 24C from both sides in the X-axis direction. In this way, the terminals 22A and 22B are coplanar lines.

[0042] like Figure 5As shown, the antenna 300 has a grid-shaped conductor pattern 50 as the conductor portion 3. Among the components of the antenna 300, the radiation electrode 21 and the feed lines 25A and 25B (electrodes) have the grid-shaped conductor pattern 50. The grid-shaped conductor pattern 50 includes a plurality of first conductive lines 51 and a plurality of second conductive lines 52. The first conductive line 51 is a linear conductor portion 3 extending parallel to the Y-axis direction. The plurality of first conductive lines 51 are arranged to be separated from each other in the X-axis direction. The plurality of first conductive lines 51 are arranged to be separated at equal intervals. The second conductive line 52 is a linear conductor portion 3 extending parallel to the X-axis direction. The plurality of second conductive lines 52 are arranged to be separated from each other in the Y-axis direction. The plurality of second conductive lines 52 are arranged to be separated at equal intervals. The thickness of the conductive lines 51 and 52 is not particularly limited, and may be set to 1 to 3 μm, for example. In addition, the spacing between the conductive lines 51 and 52 is not particularly limited, and may be set to 50 to 300 μm, for example. Furthermore, the first conductive line 51 may not be parallel to the Y-axis direction as long as it extends in the Y-axis direction, and the second conductive line 52 may not be parallel to the X-axis direction as long as it extends in the X-axis direction.

[0043] In the present embodiment, the radiation electrode 21 and the feed lines 25A and 25B have end conductive lines constituting the outer periphery. In the radiation electrode 21, the shape formed by the end conductive lines is a circular shape. In addition, the circular shape of the radiation electrode 21 is not limited to a strictly perfect circular shape, and also includes deviations caused by manufacturing errors, etc. In addition, the end conductive lines constituting the outer periphery of the radiation electrode 21 are not only composed of curved lines, but may also include straight lines, wavy lines, etc. in part. Furthermore, the radiation electrode 21 and the feed lines 25A and 25B may not include end conductive lines. In this case, the shape of connecting the front ends of the first conductive lines 51 or the second conductive lines 52 included in the mesh-shaped conductor pattern 50 may be a circular shape.

[0044] The terminal 22 has a second conductor layer 56 extending in a planar manner over substantially the entire region of the terminal 22. When referred to as "the terminal 22", the terminal 22A and the terminal 22B are not distinguished but both are referred to. Figure 5 In the embodiment, the second conductor layer 56 is formed in the entire area of ​​the terminal 22, but the area of ​​the second conductor layer 56 is not particularly limited. For example, the area of ​​the second conductor layer 56 may be 95% or more of the area of ​​the entire terminal 22. In addition, the grounding pad portions 24A, 24B, and 24C also have the second conductor layer 56. However, the grounding pad portions 24A, 24B, and 24C may also have a structure having a grid-shaped conductor pattern 50.

[0045] Next, refer to Figure 6 , the detailed cross-sectional structure of the wiring body 200 is described. Figure 6 It is along Figure 5The cross-sectional view of the line VI-VI is shown. Figure 6 As shown, the wiring body 200 includes the above-mentioned first adhesive layer 1, the conductive layer 5, and the first resin layer 7. The conductor pattern 50 of the conductive layer 5 has conductive lines 51 and 52 extending linearly along the extending direction of the first resin layer 7 (see Figure 5 Here, the extending direction of the first conductive line 51 corresponds to the Y-axis direction. The extending direction of the second conductive line 52 corresponds to the X-axis direction. Figure 6 The first conductive line 51 is shown in the figure, so the Y-axis direction is equivalent to the extension direction. Therefore, the orthogonal direction orthogonal to the extension direction is equivalent to the X-axis direction. The height direction is equivalent to the Z-axis direction. In addition, the side from the first main surface 7a toward the second main surface 7b in the height direction is equivalent to the positive side of the Z-axis direction. The other side from the second main surface 7b toward the first main surface 7a in the height direction is equivalent to the negative side of the Z-axis direction. However, the direction in the height direction is not particularly limited, and the first main surface 7a can also be the surface layer (upper part). Figure 6 FIG. 2 shows a cross-sectional view of the first conductive line 51 when it is cut in the orthogonal direction, that is, the X-axis direction. Figure 6 2 shows the structure of the first conductive line 51 , but the second conductive line 52 also has the same structure, so the description is omitted.

[0046] The first conductive line 51 has side surfaces 61A and 61B that are opposite to each other in the width direction, i.e., the X-axis direction. The side surface 61A is arranged on the negative side in the X-axis direction, and the side surface 61B is arranged on the positive side in the X-axis direction. The first conductive line 51 has an end surface 62 on the other side in the height direction (the negative side in the Z-axis direction). The first conductive line 51 has an end surface 63 on one side in the height direction (the positive side in the Z-axis direction).

[0047] The first resin layer 7 has a trench 70 in which the first conductive line 51 is arranged. In the present embodiment, the trench 70 constitutes a through hole 7c extending from the second main surface 7b on one side in the height direction (positive side in the Z-axis direction) of the first resin layer 7 to the first main surface 7a on the other side (negative side in the Z-axis direction). The trench 70, i.e., the through hole 7c, is in a grid shape. The side surfaces 61A and 61B of the first conductive line 51 are in surface contact with the inner surface of the trench 70. In addition, the width (dimension in the X-axis direction) of the first conductive line 51 is constant in the height direction. However, the width of the first conductive line 51 may also be widened as it moves toward one side in the height direction (positive side in the Z-axis direction).

[0048] The first conductive line 51 has a first portion 80 whose height from the second main surface 7b is lower than the first main surface 7a of the first resin layer 7. Figure 6, the height dimension of the lowest part of the height of the first part 80 from the second main surface 7b is indicated by "H1". That is, the first part 80 is arranged at a position closer to the second main surface 7b side (positive side in the Z-axis direction) than the first main surface 7a. In the present embodiment, the end surface 62 is curved in the width direction (X-axis direction) in such a way that the central part 62a protrudes to the negative side in the Z-axis direction. Therefore, at least the edge of the end surface 62 in the width direction corresponds to the first part 80. The central part 62a located closest to the negative side in the Z-axis direction of the end surface 62 may also correspond to the first part 80. In this case, the entire end surface 62 corresponds to the first part. Alternatively, the central part 62a may not correspond to the first part 80. In this case, the height of a part near the central part 62a from the second main surface 7b is higher than or equal to the first main surface 7a of the first resin layer 7. The first adhesive layer 1 enters the through hole 7c and contacts the first part 80 of the first conductive line 51 in the through hole 7c. The first adhesive layer 1 is in contact with substantially the entire region of the end surface 62. The shape of the end surface 62 is not limited to the above-described shape, and is not limited to a curved shape in which the central portion 62a protrudes.

[0049] The first conductive line 51 has a second portion 81 whose height from the first main surface 7a is lower than the second main surface 7b of the first resin layer 7. Figure 6 In the figure, the height dimension of the lowest part of the height of the second portion 81 from the first main surface 7a is indicated by "H2". That is, the second portion 81 is arranged at a position closer to the first main surface 7a side (negative side in the Z-axis direction) than the second main surface 7b. In the present embodiment, the end surface 63 has a shape in the width direction (X-axis direction) such that the edge is oriented toward the negative side in the Z-axis direction as it moves toward the outside in the width direction. The area near the center portion in the width direction of the end surface 63 is arranged at the same height as the second main surface 7b. The first resin layer 7 has a cover portion 82 (also refer to Figure 7 The cover portion 82 extends toward the center portion in the width direction along the curved shape of the second portion 81. Therefore, a portion of the edge of the end surface 63 on both sides in the width direction is covered by the second main surface 7b, and a portion of the center side is exposed from the second main surface 7b.

[0050] The height difference between the second main surface 7b and the second portion 81 is smaller than the height difference between the first main surface 7a and the first portion 80. When comparing the two, the first portion 80 and the second portion 81, which are farthest from the main surfaces 7a and 7b, are compared. The height difference between the first main surface 7a and the first portion 80 at the lowest position is indicated by "G1". The height difference between the second main surface 7b and the second portion 81 at the lowest position is indicated by "G2". At this time, "G1>G2" holds.

[0051] The wiring body 200 further includes: a second resin layer 8 covering the first resin layer 7 and the conductive layer 5 from the second main surface 7b side. The second resin layer 8 is a layer called a hard coat layer. The main surface 8a of the second resin layer 8 is arranged to be in contact with the second main surface 7b of the first resin layer 7 and the end surface 63 of the first conductive line 51. The second resin layer 8 may also be a layer containing a resin and an inorganic filler. As an example of a resin constituting the second resin layer 8, an acrylic resin may be cited. As an example of an inorganic filler, silicon dioxide may be cited. The thickness of the second resin layer 8 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, or 10 μm or less, 5 μm or less, or 2 μm or less.

[0052] Figure 7 It is shown Figure 6 FIG. 5 is an enlarged cross-sectional view of the structure near the end surface 63 of the first conductive line 51. Figure 7 , the structure near the boundary between the second resin layer 8 and the first resin layer 7 will be described. The second resin layer 8 includes inorganic particles 84. Metal microparticles 85 are dispersed on the interface side between the first resin layer 7 and the second resin layer 8.

[0053] Inorganic particles 84 are dispersed in the second resin layer 8. In addition, a part of the inorganic particles 84 may also be exposed from the main surface 8a of the second resin layer 8 and contact the first resin layer 7. As the inorganic particles 84, for example, silicon dioxide, aluminum oxide, titanium dioxide, tantalum oxide, zirconium oxide, silicon nitride, barium titanate, barium carbonate, magnesium carbonate, aluminum hydroxide, magnesium hydroxide, lead titanate, lead zirconate titanate, lead lanthanum zirconate titanate, gallium oxide, spinel, mullite, cordierite, talc, aluminum titanate, barium silicate, boron nitride, calcium carbonate, barium sulfate, calcium sulfate, zinc oxide, magnesium titanate, hydrotalcite, mica, calcined kaolin, and carbon may be cited. The inorganic particles 84 may also be a single one or a combination of two or more.

[0054] The shape of the inorganic particles 84 is not particularly limited, and may be, for example, spherical, ellipsoidal, polyhedral, plate-like, scaly, or columnar.

[0055] The average particle size of the inorganic particles 84 may be, for example, 10 nm or more, 15 nm or more, or 20 nm or less, or 400 nm or less, 300 nm or less, or 200 nm or less. The average particle size of the inorganic particles 84 is calculated by observing a cross section of the wiring body 200 along the thickness direction by TEM, measuring the maximum length of each of the inorganic particles 84 existing within a range of 1.5 μm in the extension direction of the wiring body 200 in the TEM image of the cross section, and averaging the lengths.

[0056] The metal microparticles 85 may be one or more inorganic particles selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, and may contain Pd. The metal microparticles 85 may be one or a combination of two or more inorganic particles.

[0057] The shape of the metal fine particles 85 is not particularly limited, and may be, for example, spherical, ellipsoidal, polyhedral, plate-like, scaly, columnar, or the like.

[0058] The average particle size of the metal microparticles 85 may be 10 nm or less, 8 nm or less, or 5 nm or less from the viewpoint of excellent transparency of the conductive member 20. The average particle size of the metal microparticles 85 may be, for example, 0.1 nm or more, 0.5 nm or more, or 1 nm or more. The average particle size of the metal microparticles 85 is calculated by observing a cross section of the wiring body 200 along the thickness direction by TEM, measuring the maximum length of each of the metal microparticles 85 existing in the range of 1.5 μm in the extension direction of the wiring body 200 in the TEM image of the cross section, and averaging them.

[0059] The average particle size of the metal microparticles 85 may be smaller than the average particle size of the inorganic particles 84. The ratio of the average particle size of the metal microparticles 85 to the average particle size of the inorganic particles 84 (average particle size of the metal microparticles 85 / average particle size of the inorganic particles 84) may be 0.3 or less, or 0.1 or less, or 0.01 or more, 0.02 or more, or 0.05 or more.

[0060] The state in which the inorganic particles 84 are dispersed in the second resin layer 8 means that when a cross section along the thickness direction of the wiring body 200 is observed by TEM, at least one particle exists in each grid when a 500 μm square grid is set. The state in which the metal microparticles 85 are dispersed on the interface side between the first resin layer 7 and the second resin layer 8 means that in the first resin layer 7, the metal microparticles 85 are dispersed within a range of 100 μm in the thickness direction at the boundary between the main surfaces 7b and 8a. The state in which the metal microparticles 85 are dispersed within this range means that when a cross section along the thickness direction of the wiring body 200 is observed by TEM, at least one particle exists in each grid when a 100 nm square grid is set.

[0061] Next, refer to Figure 8 and Fig. 9 , a method for manufacturing the wiring body 200 is described. Figure 8 and Fig. 9 2 is a schematic cross-sectional view showing a method for manufacturing the wiring body 200. First, Figure 8 As shown in FIG. 1 , a material having a second resin layer 8 formed on the upper surface of a substrate 9 is prepared. Figure 8 and Fig. 9 In, with Figures 2 to 4 , 6, and 7 are different in that the first main surface 7a is arranged on the upper side and the second main surface 7b is arranged on the lower side.

[0062] As the substrate 9, for example, COP (cycloolefin polymer), PET (polyethylene terephthalate), PC (polycarbonate) or the like may be used without particular limitation. The second resin layer 8 contains inorganic particles 84 (see Figure 7 ). A third resin layer 11 shown by a virtual line is stacked on the main surface 8a of the second resin layer 8. The third resin layer 11 contains metal microparticles 85 (see Figure 7 ). The third resin layer 11 is removed by ashing treatment or the like. At this time, the resin component of the third resin layer 11 is removed, but the metal microparticles 85 present in the third resin layer 11 are not removed, but remain on the main surface 8a side of the second resin layer 8. The first resin layer 7 is formed by applying a resin composition including a resin component forming the first resin layer 7 on the main surface 8a on which the metal microparticles 85 are deposited. A grid-like through-hole 7c is formed in the first resin layer 7. The conductive layer 5 is formed by performing non-electroplating and / or electroplating treatment on the components (including the substrate 9, the metal microparticles 85, the second resin layer 8, and the components of the first resin layer 7) forming the grid-like through-hole 7c.

[0063] Then, if Fig. 9 As shown, the substrate 9 is removed. The method of removing the substrate 9 is not particularly limited, and a method such as peeling off the substrate 9 after forming the first adhesive layer 1 on the first main surface 7a side of the first resin layer 7 may be adopted. Thus, the wiring body 200 is completed.

[0064] Next, the functions and effects of the wiring body 200 and the display device 100 according to the present embodiment will be described.

[0065] The wiring body 200 of this embodiment comprises: a first resin layer 7, which has a first main surface 7a and a second main surface 7b, and has a through hole 7c that passes from the first main surface 7a to the second main surface 7b; a conductive layer 5, which is arranged in the through hole 7c; and a first adhesive layer 1, which covers the first resin layer 7 and the conductive layer 5 from the first main surface 7a side.

[0066] The wiring body 200 includes: a first resin layer 7 having a first main surface 7a and a second main surface 7b, and having a through hole 7c penetrating from the first main surface 7a to the second main surface 7b. The conductive layer 5 is arranged in the through hole 7c of the first resin layer 7. Therefore, the conductive layer 5 can be supported by the first resin layer 7 without being supported by a substrate or the like, and the shape of the conductive layer 5 can be maintained. The wiring body 200 includes a first adhesive layer 1 covering the first resin layer 7 and the conductive layer 5 from the first main surface 7a side. Therefore, the wiring body 200 can be bonded to other components through the first adhesive layer 1 or the like without passing through the substrate. As a result, the thickness of the substrate or the like can be omitted. By the above, the shape of the conductive layer 5 can be maintained and the thickness of the wiring body 200 can be reduced.

[0067] Alternatively, the conductive layer 5 may include a first portion 80 whose height from the second main surface 7b is lower than the first main surface 7a of the first resin layer 7, and the first adhesive layer 1 is in contact with the first portion 80 of the conductive layer 5 in the through hole 7c. In this case, the adhesion between the first adhesive layer 1 and the first resin layer 7 and the conductive layer 5 can be improved by the anchoring effect of the first adhesive layer 1 entering the through hole 7c.

[0068] The wiring body 200 may further include a second resin layer 8 covering the first resin layer 7 and the conductive layer 5 from the second main surface 7b side. In this case, the second resin layer 8 can protect the conductive layer 5 from the second main surface 7b side.

[0069] The second resin layer 8 may include the inorganic particles 84. In this case, the weather resistance and rust resistance of the wiring body 200 are improved.

[0070] The metal microparticles 85 may be dispersed on the interface side of the first resin layer 7 and the second resin layer 8. In this case, when viewed from the second main surface 7b side, the metal microparticles 85 are present around the interface between the conductive layer 5 and the first resin layer 7. Therefore, the color of the metal microparticles 85 blends with the color of the conductive layer 5, and the visibility of the interface between the conductive layer 5 and the first resin layer 7 can be suppressed from becoming high.

[0071] The wiring body 200 may further include: a second adhesive layer 2 covering the first resin layer 7 and the conductive layer 5 from the second main surface 7b side. In this case, the wiring body 200 can be bonded to other components on both sides of the first main surface 7a and the second main surface 7b, so the wiring body 200 can be applied to a device having a stacked structure.

[0072] Alternatively, the conductive layer 5 may include a second portion 81 whose height from the first principal surface 7a is lower than that of the second principal surface 7b of the first resin layer 7. In this case, when viewed from the second principal surface 7b, the second portion 81 is disposed at a position deeper than the second principal surface 7b and is difficult to see. As described above, the invisibility of the conductive layer 5 can be improved. In addition, the second portion 81 is disposed at the edge of the end surface 63 in the width direction, and therefore cannot be seen from the line of sight V in the oblique direction to the second principal surface 7b (see FIG. 1 ). Figure 7 ).

[0073] The height difference between the second main surface 7b and the second portion 81 may be smaller than the height difference between the first main surface 7a and the first portion 80. In this case, the conductor volume of the conductive layer 5 can be ensured and the invisibility of the conductive layer 5 can be improved.

[0074] The first resin layer 7 may include a cover portion 82 that covers the second portion 81. In this case, the adhesion between the first resin layer 7 and the conductive layer 5 can be improved.

[0075] The conductive layer 5 may be arranged in the through holes 7c provided in a grid shape. In this case, the conductive layer 5 in a grid shape can be formed.

[0076] A display device according to one aspect of the present disclosure includes the above-mentioned wiring body.

[0077] According to the above-described display device 100 , the same operation and effects as those of the above-described wiring body 200 can be obtained.

[0078] The present disclosure is not limited to the above-described embodiments.

[0079] In the above-mentioned embodiment, the wiring body 200 is applied to the display device 100, but the application destination of the wiring body 200 is not particularly limited. It can be applied to, for example, window glass. For example, Figure 2 When the second adhesive layer 2 is not provided, the first adhesive layer 1 is adhered to the glass portion to form a transparent antenna or the like.

[0080] In the above-described embodiment, the wiring body 200 has the second resin layer 8. However, the second resin layer 8 may be omitted. Accordingly, the inorganic particles 84 and the metal fine particles 85 may also be omitted.

[0081] [Mode 1] A wiring body, wherein:

[0082] have:

[0083] A first resin layer having a first main surface and a second main surface, and having a through hole penetrating from the first main surface to the second main surface;

[0084] a conductive layer disposed in the through hole; and

[0085] The first adhesive layer covers the first resin layer and the conductive layer from the first main surface side.

[0086] [Mode 2] The wiring body according to Mode 1, wherein:

[0087] The conductive layer includes a first portion having a height from the second main surface lower than that of the first main surface of the first resin layer.

[0088] The first adhesive layer is in contact with the first portion of the conductive layer in the through hole.

[0089] [Mode 3] The wiring body according to Mode 1 or 2, wherein:

[0090] The device further includes a second resin layer covering the first resin layer and the conductive layer from the second main surface side.

[0091] [Mode 4] The wiring body according to Mode 3, wherein:

[0092] The second resin layer includes inorganic particles.

[0093] [Mode 5] The wiring body according to Mode 3 or 4, wherein:

[0094] Metal fine particles are dispersed on the interface side between the first resin layer and the second resin layer.

[0095] [Mode 6] The wiring body according to any one of Modes 1 to 5, wherein

[0096] The invention further includes a second adhesive layer covering the first resin layer and the conductive layer from the second main surface side.

[0097] [Mode 7] The wiring body according to Mode 2, wherein:

[0098] The conductive layer includes a second portion whose height from the first main surface is lower than that of the second main surface of the first resin layer.

[0099] [Mode 8] The wiring body according to Mode 7, wherein:

[0100] A height difference between the second main surface and the second portion is smaller than a height difference between the first main surface and the first portion.

[0101] [Mode 9] The wiring body according to Mode 7 or 8, wherein:

[0102] The first resin layer includes a cover portion that covers the second portion from the second main surface side.

[0103] [Mode 10] The wiring body according to any one of Modes 1 to 9, wherein

[0104] The conductive layer is disposed in the through holes provided in a grid pattern. [Aspect 11] A display device comprising the wiring body according to any one of aspects 1 to 10.

Claims

1. A wiring body, wherein: have: A first resin layer having a first main surface and a second main surface, and having a through hole penetrating from the first main surface to the second main surface; a conductive layer disposed in the through hole; as well as The first adhesive layer covers the first resin layer and the conductive layer from the first main surface side.

2. The wiring body according to claim 1, wherein The conductive layer includes a first portion having a height from the second main surface lower than that of the first main surface of the first resin layer. The first adhesive layer is in contact with the first portion of the conductive layer in the through hole.

3. The wiring body according to claim 1, wherein The device further includes a second resin layer covering the first resin layer and the conductive layer from the second main surface side.

4. The wiring body according to claim 3, wherein The second resin layer includes inorganic particles.

5. The wiring body according to claim 3, wherein Metal fine particles are dispersed on the interface side between the first resin layer and the second resin layer.

6. The wiring body according to claim 1, wherein The invention further includes a second adhesive layer covering the first resin layer and the conductive layer from the second main surface side.

7. The wiring body according to claim 2, wherein The conductive layer includes a second portion whose height from the first main surface is lower than that of the second main surface of the first resin layer.

8. The wiring body according to claim 7, wherein A height difference between the second main surface and the second portion is smaller than a height difference between the first main surface and the first portion.

9. The wiring body according to claim 7, wherein The first resin layer includes a cover portion that covers the second portion from the second main surface side.

10. The wiring body according to claim 1, wherein The conductive layer is disposed in the through holes arranged in a grid shape.

11. A display device, wherein: A wiring body according to any one of claims 1 to 10 is provided.

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