Packaging structure and method for effectively reducing fragility of cutting channel in glass core structure

Abstract

The invention discloses a packaging structure and method capable of effectively reducing the fragility of a cutting channel in a glass core structure. According to the packaging structure and the packaging method, the problem of fragile cutting channels in the packaging process of the glass core structure can be effectively reduced, the packaging process of the whole glass core structure can be simplified while the smooth completion of the glass core packaging process is ensured, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and in particular to a packaging structure and method that can effectively reduce the fragility of a cutting path in a glass core structure. Background Art

[0002] As a new type of packaging substrate, glass substrate has a smoother surface than plastic substrate; under the same area, the number of holes opened on the glass substrate is much greater than that on the organic substrate. The spacing between the through holes on the glass substrate can be less than 100 microns, which can directly increase the interconnection density between chips by 10 times. The increase in interconnection density can accommodate more transistors, thereby achieving more complex designs and more efficient use of space. At the same time, glass substrates show better properties than plastic substrates in terms of thermal properties and physical stability. Their more heat-resistant properties ensure that the glass substrate is not easy to warp or deform at high temperatures. In addition, the unique electrical properties of the glass core (glass substrate through hole) make its dielectric loss lower, allowing clearer signal and power transmission. In this way, the power loss during signal transmission will be reduced, and the overall efficiency of the chip will naturally be improved. Compared with ABF plastic substrates, the thickness of the glass core substrate can be reduced by about half. The thinning of the substrate thickness can effectively improve the signal transmission speed and power efficiency. The packaging structures currently prepared using glass substrates are mainly as follows Figure 1 As shown, a conductive structure is formed on a glass substrate by through glass via technology (TGV), and a multi-layer metal redistribution layer (RDL), a multi-layer insulation layer (PA) and a signal output structure (solder ball) are formed on both sides of the glass substrate. Figure 1 As shown in the structure, the layers in the glass core packaging structure are as follows: 10-glass substrate, 11-first metal redistribution layer (RDL1), 12-second metal redistribution layer (RDL2), 13-first insulating layer (PA1), 14-second insulating layer (PA2), 15-third metal redistribution layer (RDL3), 16-fourth metal redistribution layer (RDL4), 17-third insulating layer (PA3), 18-fifth metal redistribution layer (RDL5), 19-conductive structure (solder ball).

[0003] like Figure 2 As shown in a, the TGV process and other processes (such as photolithography, thin film deposition, wet etching, high temperature baking, etc.) are used to prepare Figure 1It was found during the process of glass core packaging structure shown in the figure that the cutting paths between adjacent working units would become abnormally fragile. In some cases, the glass substrate would break during the subsequent packaging preparation process, seriously affecting the normal progress of the subsequent packaging process. Analysis shows that there are three main reasons why the cutting paths become abnormally fragile during the glass substrate packaging process: (1) In the process of forming a through-hole structure on the glass substrate using the TGV process, chemical solutions are used to corrode the laser-induced treated positions on the glass substrate. After the through-hole structure is formed, the stress structure inside the glass substrate will change significantly (the positions with through-holes and those without through-holes will be subjected to uneven stress); (2) In the subsequent formation of RDL1, RDL2, RDL3, RDL4 and RDL5, multiple thin film deposition processes and wet etching processes will be performed, which will also generate stress on the cutting paths between adjacent working units; (3) When the film layer inside the working unit on the glass substrate accumulates to a certain number of layers, the stress borne by the working unit will be significantly abnormal compared to the stress borne by the cutting path. Figure 2 As shown in FIG. 2 , due to various factors, the texture of the glass in the cutting lanes between adjacent operating units on the glass substrate (mainly involving toughness, hardness, etc.) is different from the texture of the glass in the operating unit.

[0004] In order to ensure the smooth progress of the subsequent packaging process, there are two main methods to solve the problem of fragile cutting paths:

[0005] (1) In the preparation of Figure 1 When the RDL1 and RDL2 layers are shown in the structure, the cutting path of the glass substrate covering the metal film layer is completely retained without pattern design. After the entire glass core structure packaging process is completed, the cutting path covering the metal film layer is removed and the cutting operation is performed. The top view of the structure with the cutting path covering the metal film layer completely retained is shown in the figure below. Figure 3 As shown in a, the cutting path covers the metal film layer and the side view of the remaining structure is as follows Figure 3 As shown in Figure b, the glass core structure prepared by this process can effectively reduce the difference between the stress of the glass on the cutting path and the stress of the glass in the operation unit, so as to avoid the cutting path becoming abnormally fragile, because the cutting path is covered with the entire metal film layer.

[0006] (2) In the preparation of Figure 1 When the RDL1 and RDL2 layers are shown in the structure, the glass substrate cutting path is covered with a metal film layer for patterning design. After the entire glass core structure packaging process is completed, the cutting path patterned metal film layer is removed and the cutting operation is performed. The top view of the cutting path metal film layer patterned design structure is shown in Figure 4 As shown in a, the side view of the patterned design structure of the metal film layer of the cutting path is as follows Figure 4As shown in Figure b, the glass core structure prepared by this process can effectively reduce the difference between the stress of the glass on the cutting path and the stress of the glass in the operation unit, so as to avoid the cutting path becoming abnormally fragile.

[0007] As mentioned above, there are two existing packaging processes that reduce the stress on the glass core cutting path by retaining a metal film layer covering the entire surface and retaining a patterned metal film layer at the glass core cutting path, thereby reducing the problem of the fragility of the glass core cutting path. After the glass core structure packaging process is completed, these two packaging structures and methods need to first remove the metal film layer retained at the glass core cutting path (if the metal film layer is not removed, the cutting operation cannot be carried out normally) before the glass core structure product can be cut. The process is slightly cumbersome and the production cost is high. Therefore, how to effectively reduce the fragility of the glass core cutting path while simplifying the entire packaging process and reducing the production cost has always been a hot topic in the field of glass substrate research. Summary of the invention

[0008] In order to solve the above technical problems, the purpose of the present invention is to provide a packaging structure and method that can effectively reduce the fragility of the cut line in the glass core structure. The packaging structure and method can effectively reduce the fragility of the cut line in the glass core structure packaging process, and while ensuring the smooth completion of the glass core packaging process, it can also simplify the packaging process of the entire glass core structure and reduce production costs.

[0009] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented by the following technical solutions: a packaging method that can effectively reduce the fragility of the cutting path in the glass core structure, mainly comprising the following steps:

[0010] S1, forming a through hole structure and a shallow groove structure on a glass substrate;

[0011] S2, filling the groove structure of the glass substrate with a non-metallic material having a large Young's modulus;

[0012] S3, complete the subsequent packaging processes including multiple metal redistribution layers, multiple insulation layers, conductive structures, etc.

[0013] The non-metallic material with a large Young's modulus in step S2 is epoxy resin, silicon oxide insulating material or other insulating materials; in this embodiment, the organic material is photosensitive epoxy resin.

[0014] A packaging structure that can effectively reduce the fragility of the cutting path in the glass core structure prepared according to the above method comprises a glass carrier (10), a through-hole structure (203) formed on the glass carrier (10) by TGV technology, and a groove structure (204) with a small depth formed on the glass carrier by TGV technology;

[0015] A non-metallic material with a large Young's modulus is filled in the groove structure to form a non-metallic film layer (21), and the upper surface of the non-metallic film layer (21) is flush with the surface of the glass carrier plate; after the groove structure formed in the cutting path of the entire glass core structure is filled with the non-metallic material with a large Young's modulus, the non-metallic film layer (21) presents a mesh structure;

[0016] A plurality of metal redistribution layers, a plurality of insulation layers and a conductive packaging structure are respectively arranged on both sides of the glass core structure, wherein the plurality of metal redistribution layers include a first metal redistribution layer (22), a second metal redistribution layer (23), a third metal redistribution layer (26), a fourth metal redistribution layer (27) and a fifth metal redistribution layer (29); the plurality of insulation layers include a first insulation layer (24) and a second insulation layer (25); and the conductive packaging structure is a conductive structure (30).

[0017] Furthermore, the groove structure (204) is located at a position of a cutting path between adjacent operating units on the glass core structure.

[0018] Furthermore, after the cutting groove structure is filled with a non-metallic material with a large Young's modulus, the non-metallic film layer presenting a mesh structure significantly increases the toughness of the cutting position, thereby solving the problem of the fragility of the cutting position of the glass core structure.

[0019] The beneficial effects of the present invention are mainly the following two points: (1) by forming a non-metallic film layer with a mesh structure at the position of the glass core cutting path, the stress on the glass core structure is effectively reduced, thereby reducing the fragility of the cutting path in the glass core structure; (2) the non-metallic film layer filled in the cutting path groove of the glass core structure can be directly cut without removal, which can effectively simplify the packaging process and reduce the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a diagram of the packaging structure currently prepared using a glass substrate.

[0021] Figure 2 In order to prepare the Figure 1 Problems found during the glass core packaging structure shown.

[0022] Figure 3 The top view of the structure is completely retained for the cutting path covering the metal film layer ( Figure 3 a), side view of the structure where the cutting path covers the metal film layer and retains all the parts ( Figure 3 b).

[0023] Figure 4 Top view of the structure designed for the patterning of the metal film layer of the cutting path ( Figure 4a), Side view of the patterned design structure of the metal film layer of the cutting path ( Figure 4 b).

[0024] Figure 5 In order to form a through-hole structure on the glass carrier by using the TGV technology, a groove structure with a relatively small depth is formed on the glass carrier by using the TGV technology.

[0025] Figure 6 For Figure 5 The structural diagram of the shallower groove structure is filled with a non-metallic material with a larger Young's modulus.

[0026] Figure 7 This is a top view of the glass core structure after the groove structure formed in the cutting path of the entire glass core structure is filled with a non-metallic material with a large Young's modulus.

[0027] Figure 8 This is a top view after the cutting groove structure is filled with non-metallic material with a large Young's modulus.

[0028] Fig. 9 For Figure 2 Subsequent packaging processes including multiple metal redistribution layers, multiple insulation layers, and conductive structures are completed on the glass core structure shown. DETAILED DESCRIPTION

[0029] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0030] (1) A through-hole structure is formed on a glass substrate by TGV (Through Glass Via, TGV) technology, and a groove structure with a small depth is formed on a glass substrate by TGV technology to obtain the following Figure 5 10 is a glass carrier, 201 is the lower surface of the glass carrier, 202 is the upper surface of the glass carrier, 203 is a through hole structure formed on the glass carrier, and 204 is a groove structure formed on the glass carrier. It should be noted that the groove structure 204 is located at the cutting path position between adjacent working units on the glass core structure.

[0031] (2) Figure 5 The shallow groove structure shown is filled with non-metallic material with a large Young's modulus, and the Figure 6 The structure shown in FIG. 21 is a non-metallic film layer filled with a large Young's modulus, and the upper surface of the non-metallic film layer is flush with the surface of the glass carrier. After the groove structure formed in the cutting path of the entire glass core structure is filled with a non-metallic material with a large Young's modulus, the top view of the glass core structure is as shown in FIG. Figure 7 As shown in FIG. 1 , the organic film layer presents a grid shape. The top view after the cutting groove structure is filled with non-metallic material with a large Young's modulus is as shown in FIG. Figure 8As shown, the non-metallic film layer with a mesh structure can significantly increase the toughness of the glass substrate, especially the cutting path position, thereby effectively solving the problem of the fragility of the cutting path position of the glass core structure.

[0032] (3) Figure 2 The glass core structure shown in the figure is then followed by a packaging process including multiple metal redistribution layers, multiple insulation layers, and conductive structures to obtain the following Fig. 9 The structure shown in FIG. 22 is a first metal redistribution layer (RDL1), 23 is a second metal redistribution layer (RDL2), 24 is a first insulating layer (PA1), 25 is a second insulating layer (PA2), 26 is a third metal redistribution layer (RDL3), 27 is a fourth metal redistribution layer (RDL4), 28 is a third insulating layer (PA3), 29 is a fifth metal redistribution layer (RDL5), and 30 is a conductive structure (solder ball).

[0033] It is worth noting that: in the description of the present invention, the meaning of "multiple" is two or more than two, unless otherwise clearly and specifically defined. In the present invention, unless otherwise clearly stipulated and defined, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; the circuits described in the present invention are all commonly used circuits in the art, and other related components are all existing commonly used components. For ordinary technicians in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0034] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A method for effectively reducing the fragile packaging of the cut line in the glass core structure, characterized in that: The steps include: S1, forming a through hole structure and a shallow groove structure on a glass substrate; S2, filling the groove structure of the glass substrate with a non-metallic material having a large Young's modulus; S3, completing the subsequent packaging process, wherein the packaging process includes multiple metal redistribution layers, multiple insulation layers, and a conductive packaging structure.

2. The method according to claim 1, characterized in that: The non-metallic material with a large Young's modulus in step S2 is epoxy resin or silicon oxide insulating material.

3. A packaging structure capable of effectively reducing the fragility of the cutting path in the glass core structure prepared by the method according to claim 1, characterized in that: It comprises a glass carrier (10), a through-hole structure (203) is formed on the glass carrier (10) by using the TGV technology, and a groove structure (204) with a relatively small depth is formed on the glass carrier by using the TGV technology; A non-metallic material with a large Young's modulus is filled in the groove structure to form a non-metallic film layer (21), and the upper surface of the non-metallic film layer (21) is flush with the surface of the glass carrier plate; after the groove structure formed in the cutting path of the entire glass core structure is filled with the non-metallic material with a large Young's modulus, the non-metallic film layer (21) presents a mesh structure; A plurality of metal redistribution layers, a plurality of insulation layers and a conductive packaging structure are respectively arranged on both sides of the glass core structure, wherein the plurality of metal redistribution layers include a first metal redistribution layer (22), a second metal redistribution layer (23), a third metal redistribution layer (26), a fourth metal redistribution layer (27) and a fifth metal redistribution layer (29); the plurality of insulation layers include a first insulation layer (24) and a second insulation layer (25); and the conductive packaging structure is a conductive structure (30).

4. The packaging structure capable of effectively reducing the fragility of the cutting line in the glass core structure according to claim 3, characterized in that: The groove structure (204) is located at a cutting path position between adjacent operation units on the glass core structure.

5. The packaging structure capable of effectively reducing the fragility of the cutting line in the glass core structure according to claim 2, characterized in that: The non-metallic film layer presenting a mesh structure significantly increases the toughness of the cutting path position to solve the problem of the fragility of the cutting path position of the glass core structure.

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