A method for manufacturing a matrix lamp group module rigid-flex combined board

Abstract

The application discloses a manufacturing method of a matrix lamp group module rigid-flexible combined board, taking a rigid plate to sequentially manufacture a surface circuit pattern and a solder mask opening pattern, the surface circuit pattern in the range of the solder mask opening pattern being a soldering circuit pattern; taking a flexible copper-clad plate to manufacture a circuit pattern, forming a circuit pattern core plate; taking a first cover film to manufacture an opening pattern and paste the opening pattern to the circuit pattern core plate, then manufacturing a hollow circuit pattern, forming a pasted film flexible plate; manufacturing a plurality of stainless steel reinforcements to the pasted film flexible plate, forming a flexible unit plate; aligning and superimposing and soldering the soldering circuit pattern and the hollow circuit pattern, forming the rigid-flexible combined board; the rigid-flexible combined board is split into multiple modules and independently processed, so that the processing flow is shortened and the processing difficulty is reduced; the flexible plate and the rigid plate are fixed through soldering, the flexible plate and the heat dissipation module are connected through magnetic attraction, when local faults occur, relatively independent problems are formed, and the problems do not affect each other, so that the difficulty and cost of maintenance are reduced.

Description

Technical Field

[0001] This invention relates to the field of rigid-flex circuit board manufacturing, and more particularly to a method for manufacturing a matrix lamp module rigid-flex circuit board. Background Technology

[0002] Rigid-flex boards, due to their combination of rigidity and flexibility and their ability to meet the needs of complex circuit designs, are widely used in power modules, automotive lighting systems, and other fields.

[0003] With the development of the intelligent connected vehicle industry, vehicle lights are also showing a trend of multi-functional and interactive development. Therefore, some vehicle light modules have adopted matrix LED light groups set on rigid-flexible composite plates. The flexibility of the flexible plate is used to realize the non-planar design of the light group, and a heat dissipation module is matched to dissipate the large amount of heat generated when the light group is working. The rigid plate realizes the function control role, and adjusts the LED light group to achieve different display requirements.

[0004] The existing method for manufacturing rigid-flex boards for automotive headlight modules is as follows: pressing the core boards of each unit together into a board, then peeling off the cover to expose the flexible core board layer, forming a rigid-flex board. For heat dissipation requirements, copper blocks are embedded; or pressing the flexible board and the rigid board together to form a whole board, then peeling off the cover to expose the flexible core board layer, and finally attaching the heat dissipation module to the back of the board corresponding to the headlight assembly, forming a rigid-flex board.

[0005] However, the two existing manufacturing methods mentioned above have the following problems:

[0006] The rigid-flex plate is formed by compression molding, and heat dissipation components are attached to the back of the flexible plate, making the heat dissipation components, flexible plate and rigid plate a whole. This means that when the lamp module or heat dissipation module fails, the whole plate needs to be replaced, which is difficult and costly to repair.

[0007] Embedding copper blocks on the circuit board to achieve heat dissipation is costly and difficult to process, and it also increases the circuit board area, which is not conducive to installation and application.

[0008] When flexible boards are used in non-planar applications, attaching heat dissipation components to the surface of the flexible board requires forming a corresponding non-planar structure, which makes the attachment difficult and hinders the application of rigid-flexible composite boards.

[0009] Therefore, in order to solve the problems mentioned in the background technology, it is necessary to provide a method for manufacturing a modular rigid-flex plate for matrix lamp groups. Summary of the Invention

[0010] This invention aims to address the problem of existing thick copper high-current-carrying rigid-flex boards requiring thin boards and high current-carrying capacity, and proposes a method for manufacturing a modular rigid-flex board for matrix lamp groups. The manufacturing method includes the following steps:

[0011] S10: Take a rigid plate and sequentially fabricate surface circuit patterns and solder resist window patterns, wherein the surface circuit patterns within the solder resist window pattern range are solder circuit patterns, forming a rigid unit board; S20: Take a flexible copper-clad laminate and fabricate circuit patterns to form a circuit pattern core board; take a first cover film and fabricate window patterns to form a window cover film, attach the window cover film to the surface of the circuit pattern core board, and then fabricate hollow circuit patterns to form a film-coated flexible board; the window patterns correspond to the areas of the hollow circuit patterns; fabricate several stainless steel reinforcements on the surface of the film-coated flexible board, arranged in a matrix reinforcement; take a second cover film and fabricate reinforcement window patterns corresponding to the several stainless steel reinforcements, attach them to the areas of the matrix reinforcement to form a flexible unit board;

[0012] S30: Align and weld the welding circuit pattern and the hollow circuit pattern together to form the rigid-flexible bonded plate.

[0013] Furthermore, the flexible film-coated board is formed as follows: the flexible copper-clad board is a single-sided flexible copper-clad board; a layer of the first covering film is taken to form the windowed covering film; the windowed covering film is attached to the surface of the circuit pattern core board where the circuit pattern is located, and then the hollowed-out circuit pattern is made on the circuit pattern core board in the area of ​​the windowed pattern.

[0014] Furthermore, the flexible film-coated board is formed as follows: the flexible copper-clad board is a double-sided flexible copper-clad board; two layers of the first covering film are taken to form two layers of the windowed covering film; the windowed covering film is attached to both sides of the circuit pattern core board, and then the hollowed-out circuit pattern is made on the circuit pattern core board in the windowed pattern area.

[0015] Furthermore, the flexible film board is formed as follows: the flexible copper-clad board is a single-sided flexible copper-clad board; a layer of the first covering film is taken to form the windowed covering film; the windowed covering film is attached to the surface of the circuit pattern core board where the circuit pattern is located, and then the hollowed-out circuit pattern is made on the circuit pattern core board in the area of ​​the windowed pattern.

[0016] Furthermore, the flexible film-coated board is formed as follows: the flexible copper-clad board is a double-sided flexible copper-clad board; two layers of the first covering film are taken to form two layers of the windowed covering film; the two layers of the windowed covering film are respectively attached to both sides of the circuit pattern core board, and then the hollowed-out circuit pattern is made on the circuit pattern core board in the windowed pattern area.

[0017] Furthermore, the stainless steel reinforcement is larger on one side than the reinforcement window pattern.

[0018] Furthermore, the rigid-flex plate includes a heat dissipation module, the heat dissipation module is made of magnet, and one side of the magnet has several protrusions corresponding to several stainless steel reinforcements.

[0019] Furthermore, the surface with the aforementioned protrusions is a non-planar structure.

[0020] Furthermore, the welded circuit pattern and the hollowed-out circuit pattern are mutually matched tooth shapes.

[0021] Furthermore, the fabrication of several stainless steel reinforcements includes: adding an extension area to the periphery of the film-coated flexible plate, and fabricating stainless steel reinforcements in the extension area, wherein the area of ​​the stainless steel reinforcements is larger than that of the stainless steel reinforcements.

[0022] Furthermore, the fabrication of the welded circuit pattern includes: adding a rigid plate extension area to the periphery of the area of ​​the welded circuit pattern, and fabricating a reinforcing welded pattern to the rigid plate extension area; the fabrication of the hollowed-out circuit pattern includes: adding a flexible plate extension area to the periphery of the area of ​​the hollowed-out circuit pattern, and fabricating a reinforcing hollowed-out pattern to the flexible plate extension area; and aligning and welding the reinforcing welded pattern and the reinforcing hollowed-out pattern together.

[0023] Furthermore, there are several welding circuit patterns, arranged into a welding circuit matrix pattern; there are several hollow circuit patterns, arranged into a hollow circuit matrix pattern; the alignment and overlapping welding is to align and overlap the welding circuit matrix pattern with the hollow circuit matrix pattern.

[0024] The technical solution of this invention breaks down the rigid-flex plate into three independent modules: a flexible plate, a rigid plate, and a heat dissipation module, and processes them independently, thereby shortening the processing flow and reducing the processing difficulty. By welding the flexible plate to the rigid plate and magnetically connecting the flexible plate to the heat dissipation module, the flexible plate and the rigid plate form a detachable structure. In the application process, when a local failure occurs, it can form a relatively independent problem that does not affect each other, which facilitates maintenance and replacement and further reduces the cost of subsequent maintenance. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the process flow of the rigid-flex circuit board according to an embodiment of the present invention.

[0027] Figure 2 This is a schematic diagram of the cross-sectional structure of the rigid unit plate according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic cross-sectional view of the circuit pattern core board according to an embodiment of the present invention;

[0029] Figure 4 This is a schematic cross-sectional view of the flexible film-coated plate according to an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the cross-sectional structure of the flexible unit plate according to an embodiment of the present invention;

[0031] Figure 6 This is a schematic cross-sectional view of a film-coated flexible plate according to an embodiment of the present invention;

[0032] Figure 7 This is a schematic diagram of the cross-sectional structure of another film-coated flexible plate according to an embodiment of the present invention;

[0033] Figure 8 This is a schematic diagram of the planar structure of the stainless steel reinforcement according to an embodiment of the present invention;

[0034] Figure 9 for Figure 8 Schematic diagram of the AA section structure;

[0035] Figure 10 This is a schematic diagram of the cross-sectional structure of the rigid-flexible plate according to an embodiment of the present invention;

[0036] Figure 11 This is a planar schematic diagram of the mutually matching tooth profiles according to an embodiment of the present invention;

[0037] Figure 12 This is a schematic diagram of a planar structure with stainless steel reinforcement according to an embodiment of the present invention;

[0038] Figure 13 This is a schematic diagram of a planar structure with reinforced welding patterns and reinforced hollow patterns according to an embodiment of the present invention.

[0039] Explanation of icon numbers:

[0040]

[0041] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0043] It should be noted that all directional indications (such as up, down, left, right, front, back, inside, outside, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0044] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0046] Please see Figure 1 , Figure 1 This is a schematic diagram of the process flow according to an embodiment of the present invention.

[0047] The manufacturing process of this invention includes using Figure 1 The implementation of each step in the process will be described below. Figure 1 The process of each step will be explained step by step.

[0048] Please see Figure 2 , Figure 2 This is a schematic diagram of the cross-sectional structure of the rigid unit plate according to an embodiment of the present invention.

[0049] Step S10:

[0050] A rigid plate is used to sequentially fabricate a surface circuit pattern 1010 and a solder resist window pattern 1020. The surface circuit pattern within the solder resist window pattern is a solder circuit pattern 1030, forming a rigid unit plate 10. That is, a surface circuit pattern 1010 is fabricated on the rigid plate, a solder resist layer is fabricated on the surface of the rigid plate, and a window is made in the solder resist layer to form a solder resist window pattern 1020. The exposed part of the circuit pattern is the solder resist circuit pattern 1030, which is used for subsequent welding with the flexible unit plate 20, providing a basis for subsequent processing.

[0051] Figure 3 This is a schematic cross-sectional view of the circuit pattern core board according to an embodiment of the present invention; Figure 4 This is a schematic cross-sectional view of the flexible film-coated plate according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the cross-sectional structure of the flexible unit plate according to an embodiment of the present invention.

[0052] Step S20:

[0053] A flexible copper-clad laminate is used to create a circuit pattern 2010, forming a circuit pattern core board 20. A first cover film 3010 is used to create a window pattern 3020, forming a window cover film 3030. The window cover film 3030 is attached to the surface of the circuit pattern core board 20, and then a hollow circuit pattern 3040 is created to form a film-coated flexible board 30. The area of ​​the window pattern 3020 corresponds to the area of ​​the hollow circuit pattern 3040. Several stainless steel reinforcements 4010 are made on the surface of the film-coated flexible board 30, arranged in a matrix reinforcement. A second cover film 4020 is used to create a reinforcing window pattern 4030 corresponding to the several stainless steel reinforcements, and it is attached to the area of ​​the matrix reinforcement to form a flexible unit board 40.

[0054] Please see Figure 4 In this embodiment of forming the flexible copper-clad laminate 30, the flexible copper-clad laminate is a single-sided flexible copper-clad laminate. A first cover film 3010 is taken and a windowed cover film 3030 is made. The windowed cover film 3030 is attached to the surface of the circuit pattern 2010 of the circuit pattern core board 20. Then, a hollow circuit pattern 3040 is made on the circuit pattern core board 20 in the windowed area. Since the single-sided copper-clad laminate itself has a certain support, the circuit pattern 2010 can be made directly on its copper surface and then the windowed cover film 3010 is attached. Then, the windowed area corresponding to the windowed cover film 3010 is cut with a laser. In the windowed area of ​​the single-sided flexible copper-clad laminate, the insulating dielectric layer of other areas except the hollow circuit pattern 3040 is removed, so that the hollow circuit pattern 3040 is formed on the single-sided copper-clad laminate.

[0055] Please see Figure 6 , Figure 6 This is a schematic diagram of the cross-sectional structure of another film-coated flexible plate according to an embodiment of the present invention.

[0056] In one embodiment of forming a flexible laminate 30A, the flexible copper-clad laminate is a double-sided flexible copper-clad laminate. Two layers of first cover film 3010 are taken to form two layers of windowed cover film 3030. The windowed cover film 3030 is attached to both sides of the circuit pattern core board 20, and then a hollowed-out circuit pattern 3040 is made on the circuit pattern core board 20 in the windowed pattern area. Since the structure of the double-sided copper-clad laminate is similar to that of the single-sided copper-clad laminate, the processing method is also similar. The difference is that an additional layer of windowed cover film 3030 needs to be attached, which will not be described in detail here.

[0057] It is worth noting that laser cutting is a non-contact processing method, without stress impact and with high positioning accuracy. Therefore, the cut surface is delicate and smooth, and will not deform the lines at the cut edge. It can meet the processing requirements of high precision and complex shapes. In contrast, punching relies on stress impact to break through the plate layer, which has poor precision and burrs on the punched surface, and is prone to deforming the line pattern 2010 next to the punched surface. Therefore, the hollow line pattern 3040 in this embodiment is made by laser cutting.

[0058] Please see Figure 7 , Figure 7 This is a schematic diagram of the cross-sectional structure of a film-coated flexible plate according to an embodiment of the present invention.

[0059] In another embodiment of forming a flexible laminated board 30B, two layers of first cover film 3010 can be taken first to form two layers of windowed cover film 3020; a single layer of copper is taken, and a layer of windowed cover film 3010 is attached to one side of the single layer of copper. Then, circuit patterns 2010 and hollow circuit patterns 3040 are made on the single layer of copper. Then, another layer of windowed cover film 3010 is attached to the other side of the single layer of copper. Since the single layer of copper has a certain degree of flexibility, attaching a layer of windowed cover film 3010 to the single layer of copper first serves as a support layer, which facilitates the subsequent production of circuit patterns 2010 and hollow circuit patterns 3040.

[0060] In practical applications, flexible circuit boards are relatively thin. Therefore, based on the above manufacturing methods, it is generally preferred to use a film-coated flexible board 30 or a film-coated flexible board 30A to provide support for the cutout circuit pattern 3040 by utilizing the insulating dielectric layer of the copper-clad laminate itself (usually made of polyimide). This avoids the problem of weak support for a single layer of copper when using another film-coated flexible board 30B. When the thickness of a single layer of copper is relatively thick (e.g., ≥70μm), the three processing methods are equally effective.

[0061] Please see Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of the planar structure of the stainless steel reinforcement according to an embodiment of the present invention; Figure 9 for Figure 8A schematic diagram of the AA section structure.

[0062] In this embodiment, in order to match the non-planar design of the LED light group welded on the flexible board, the stainless steel reinforcement 4010 is designed as a number, replacing a whole piece of stainless steel reinforcement 4010 with a large number, so that the setting of the stainless steel reinforcement 4010 can better fit the non-planar structure of the light group. Furthermore, the stainless steel reinforcement 4010 is set as a matrix, and each matrix corresponds one-to-one with the LED light beads in the light group, which can better target heat dissipation.

[0063] In this embodiment, the stainless steel reinforcement 4010 is larger than the reinforcement window pattern 4030 on one side. That is, a part of the second covering film 4020 is pressed onto the stainless steel reinforcement 4010 to prevent the stainless steel reinforcement 4010 from being easily pulled and damaged by the magnetic attraction between the stainless steel reinforcement 4010 and the heat dissipation mold. Therefore, the second covering film 4020 mainly plays the role of protecting the stainless steel reinforcement 4010.

[0064] It is worth noting that the second cover film 4020 is applied to the surface of the first cover film 3010. The first cover film 3010 is made of polyimide, and direct application can easily result in weak adhesion. Therefore, before applying the second cover film 4020, the first cover film 3010 needs to be subjected to plasma surface roughening treatment. Specifically, a dry film is applied to the surface area of ​​the first cover film 3010 that does not need to be covered with the second cover film 4020, and a dry film pattern is made. Then, plasma treatment is performed, the dry film is removed, and then the second cover film 4020 is applied.

[0065] Please see Figure 10 , Figure 10 This is a schematic diagram of the cross-sectional structure of the rigid-flexible plate according to an embodiment of the present invention.

[0066] In this embodiment, the rigid-flex plate 50 includes a heat dissipation module 5010. The heat dissipation module 5010 is made of magnet. One side of the magnet has several protrusions corresponding to several stainless steel reinforcements 4010, forming a magnetically attractive structure with the stainless steel reinforcements 4010. The processing is simple. Furthermore, it enables convenient replacement of the heat dissipation module 5010 when problems occur during the application of the rigid-flex plate 50, reducing maintenance costs.

[0067] It is worth noting that the magnet's single-sided design is a non-planar structure that matches and fits the lamp assembly, and the other side of the magnet can use thermally conductive adhesive to attach heat dissipation fins and other more efficient heat dissipation components, further improving heat dissipation efficiency.

[0068] Please continue reading. Figure 10 .

[0069] Step S30:

[0070] The welding circuit pattern 1030 and the hollow circuit pattern 3040 are aligned and welded together to form a rigid-flexible bonded plate 50.

[0071] Please see Figure 11 , Figure 11 This is a planar schematic diagram of the mutually matching tooth profiles according to an embodiment of the present invention.

[0072] In this embodiment, the welding circuit pattern 1030 and the hollow circuit pattern 3040 are mutually matched tooth shapes. That is, by designing the hollow circuit pattern 3040 as a tooth structure, the welding circuit pattern 1030 and the hollow circuit pattern 3040 are aligned and superimposed into mutually staggered tooth shapes, which increases the contact surface between the welding circuit pattern 1030 and the hollow circuit pattern 3040. After subsequent welding processes, the stability of the welding between the rigid unit board 10 and the flexible unit board 40 is ensured.

[0073] Please see Figure 12 , Figure 12 This is a schematic diagram of a planar structure reinforced with stainless steel according to an embodiment of the present invention.

[0074] In this embodiment, the fabrication of several stainless steel reinforcements 4010 includes: adding an extension area to the periphery of the film-coated flexible plate 30, and fabricating stainless steel reinforcing reinforcements 4010A in the extension area. The area of ​​stainless steel reinforcing reinforcements 4010A is larger than that of stainless steel reinforcements 4010. By setting stainless steel reinforcing reinforcements 4010A, the magnetic attraction effect is further strengthened. The fabrication method of stainless steel reinforcements 4010A is the same as that of stainless steel reinforcements 4010.

[0075] Please see Figure 13 , Figure 13 This is a schematic diagram of a planar structure with reinforced welding patterns and reinforced hollow patterns according to an embodiment of the present invention.

[0076] In this embodiment, the fabrication of the welded circuit pattern 1030 includes: adding a rigid plate extension area to the periphery of the area of ​​the welded circuit pattern 1030, and fabricating a reinforcing welded pattern 1030A to the rigid plate extension area; the fabrication of the hollowed-out circuit pattern 3040 includes: adding a flexible plate extension area to the periphery of the area of ​​the hollowed-out circuit pattern 3040, and fabricating a reinforcing hollowed-out pattern to the flexible plate extension area; the reinforcing welded pattern 1030A and the reinforcing hollowed-out pattern are aligned and welded together, similar to the reinforcement with stainless steel 4010A. The reinforcing welded pattern 1030A is fabricated simultaneously with the welded circuit pattern 1030. By setting the reinforcing welded pattern 1030A and the reinforcing hollowed-out pattern, the weld strength between the flexible plate and the rigid plate is improved after welding.

[0077] Please refer to it again. Figure 13 .

[0078] Furthermore, there are several welding circuit patterns 1030, which are arranged into a welding circuit matrix pattern; there are several hollow circuit patterns 3040, which are arranged into a hollow circuit matrix pattern 3040B; the alignment and superposition welding is to align and superposition the welding circuit matrix pattern and the hollow circuit matrix pattern 3040B one by one. In this embodiment, by designing several independent welding circuit patterns 1030 and hollow circuit patterns 3040 in the welding circuit matrix pattern and the hollow circuit matrix pattern 3040B and making them correspond one-to-one, multiple solder points are formed, which are electrically connected to multiple LED beads to meet the electrical connection requirements of the LED lamp group matrix.

[0079] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a modular rigid-flexible composite plate for a matrix lighting unit, characterized in that, The manufacturing method includes the following steps: S10: Take a rigid plate and sequentially fabricate a surface circuit pattern and a solder resist window pattern. The surface circuit pattern within the range of the solder resist window pattern is a solder circuit pattern, forming a rigid unit plate. S20: Take a flexible copper-clad laminate to create a circuit pattern, forming a circuit pattern core board; take a first cover film to create a window pattern, forming a window cover film; attach the window cover film to the surface of the circuit pattern core board, and then create a hollow circuit pattern to form a film-coated flexible board; the window pattern corresponds to the area of ​​the hollow circuit pattern; create several stainless steel reinforcements on the surface of the film-coated flexible board, arranged in a matrix reinforcement; take a second cover film to create a reinforcement window pattern corresponding to the several stainless steel reinforcements, and attach it to the area of ​​the matrix reinforcement to form a flexible unit board; S30: Align and weld the welding circuit pattern and the hollowed-out circuit pattern to form the rigid-flexible bonded plate; The rigid-flex plate includes a heat dissipation module, which is made of magnet. One side of the magnet has several protrusions corresponding to several stainless steel reinforcements. The several protrusions and the stainless steel reinforcements form a magnetically attractive structure.

2. The method for manufacturing a modular rigid-flexible composite plate for a matrix lighting group as described in claim 1, characterized in that, The flexible board is formed as follows: the flexible copper-clad board is a single-sided flexible copper-clad board; a layer of the first covering film is taken to form the windowed covering film; the windowed covering film is attached to the surface of the circuit pattern core board where the circuit pattern is located, and then the hollowed-out circuit pattern is made on the circuit pattern core board in the area of ​​the windowed pattern.

3. The method for manufacturing a modular rigid-flexible composite plate for a matrix lighting group as described in claim 1, characterized in that, The flexible film-coated board is formed as follows: the flexible copper-clad board is a double-sided flexible copper-clad board; two layers of the first cover film are taken to form two layers of the windowed cover film; the two layers of the windowed cover film are respectively attached to both sides of the circuit pattern core board, and then the hollow circuit pattern is made on the circuit pattern core board in the windowed pattern area.

4. The method for manufacturing a modular rigid-flexible composite plate for a matrix lighting group as described in claim 1, characterized in that, The stainless steel reinforcement is larger on one side than the reinforcement window pattern.

5. The method for manufacturing a modular rigid-flexible composite plate for a matrix lighting group as described in claim 1, characterized in that, The side with the aforementioned protrusions is a non-planar structure.

6. The method for manufacturing a modular rigid-flexible composite plate for a matrix lighting group as described in claim 1, characterized in that, The welded circuit pattern and the hollowed-out circuit pattern are mutually matched tooth shapes.

7. The method for manufacturing a modular rigid-flexible composite plate for a matrix lighting unit as described in claim 1, characterized in that, The fabrication of several stainless steel reinforcements includes: adding an extension area to the periphery of the film-coated flexible plate, and fabricating stainless steel reinforcements in the extension area, wherein the area of ​​the stainless steel reinforcements is larger than that of the stainless steel reinforcements.

8. The method for manufacturing a modular rigid-flexible composite plate for a matrix lamp group as described in claim 1, characterized in that, The process of creating the welding circuit pattern includes: adding a rigid plate extension area to the periphery of the area of ​​the welding circuit pattern, and creating a reinforcing welding pattern in the rigid plate extension area; The process of creating the hollowed-out circuit pattern includes: adding a flexible plate extension area to the periphery of the area of ​​the hollowed-out circuit pattern, and creating a reinforced hollowed-out pattern in the flexible plate extension area; The reinforcing weld pattern and the reinforcing hollow pattern are aligned and superimposed for welding.

9. The method for manufacturing a modular rigid-flexible composite plate for a matrix lamp group as described in claim 1, characterized in that, There are several welding circuit patterns, which are arranged into a welding circuit matrix pattern; There are several hollowed-out line patterns, which are arranged into a hollowed-out line matrix pattern; The alignment and overlapping welding involves aligning and overlapping the welding line matrix pattern with the hollowed-out line matrix pattern.

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