Structural member and electronic equipment

Abstract

The embodiment of the invention discloses a structural member and electronic equipment, relates to the technical field of electronic equipment, and is used for solving the technical problem that a carbon fiber composite material is easy to generate ESD (Electro-Static Discharge). The structural member comprises a structural member body and a conductive part. The structural part body comprises an insulating part and carbon fiber filaments, the carbon fiber filaments are embedded in the insulating part, and a part of the carbon fiber filaments are exposed out of the insulating part. And at least part of the conductive part is contacted and electrically connected with the exposed carbon fibers. Due to the fact that the carbon fiber filaments have good conductivity, the conductive part arranged on the structural part body can be communicated with the exposed carbon fiber filaments to form a conductive path, and the carbon fiber filaments in the structural part can serve as a discharging path of electrostatic current. Meanwhile, the conductive part in the structural member can also be used as a point location for electric connection. When a large current passes through the structural member, an electrostatic current can be discharged outwards through the carbon fiber filaments and the conductive part, so that the problem of ESD is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a structural component and electronic equipment. Background Art

[0002] At present, the middle frames or shells of electronic devices such as mobile phones, tablets, and laptops are mostly made of composite materials such as aluminum alloy, magnesium alloy, stainless steel, and titanium alloy, which makes it difficult to reduce the weight of electronic devices. Although carbon fiber composite materials have the characteristics of high strength, light weight, and good flexibility, they have poor electrical conductivity. When a large current passes through, carbon fiber composite materials are prone to electrostatic discharge (ESD), causing electronic devices in electronic devices to burn out. Summary of the invention

[0003] The embodiments of the present application provide a structural component and an electronic device for solving the technical problem that carbon fiber composite materials are prone to ESD.

[0004] In order to achieve the above objectives, this application adopts the following technical solutions:

[0005] In a first aspect of an embodiment of the present application, a structural member is provided, the structural member comprising a structural member body and a conductive portion. The structural member body comprises an insulating member and carbon fiber filaments, the carbon fiber filaments are embedded in the insulating member, and a portion of the carbon fiber filaments is exposed outside the insulating member. At least a portion of the conductive portion is in contact with and electrically connected to the exposed carbon fiber filaments.

[0006] As can be seen from the above, the embodiment of the present application is achieved by exposing a portion of the carbon fiber filaments embedded in the insulating member outside the insulating member. At the same time, a conductive portion is provided on the structural member body so that at least a portion of the conductive portion is in contact with the carbon fiber filaments. In this way, since the carbon fiber filaments themselves have good electrical conductivity, the conductive portion provided on the structural member body can be connected to the exposed carbon fiber filaments to form a conductive path, so that the carbon fiber filaments in the structural member can be used as a discharge path for electrostatic current. At the same time, the conductive portion in the structural member can also be used as an electrical connection point. When a large current passes through the structural member, the electrostatic current can be discharged outward through the carbon fiber filaments and the conductive portion, thereby reducing the problem of ESD.

[0007] In some embodiments, a groove is provided on the surface of the structural member body, and a portion of the carbon fiber filaments is exposed in the groove. At least a portion of the conductive part is provided in the groove of the structural member body, and the conductive part is in contact with and electrically connected to the carbon fiber filaments exposed in the groove. Thus, by providing a groove on the surface of the structural member body, a portion of the carbon fiber filaments embedded in the insulating member can be exposed in the groove. At this time, at least a portion of the conductive part can be provided in the groove and in contact with the exposed carbon fiber filaments, thereby ensuring good contact between the conductive part and the exposed carbon fiber filaments under the shaping effect of the groove on the conductive part.

[0008] In some embodiments, a plurality of carbon fiber filaments are provided. The groove includes a groove wall, a groove bottom, and a groove space surrounded by the groove wall and the groove bottom. At least one of the groove wall, the groove bottom, and the groove space is provided with exposed carbon fiber filaments. Thus, the carbon fiber filaments in the groove can be exposed in at least one of the groove wall, the groove bottom, and the groove space, so that the conductive part can contact the exposed carbon fiber filaments at multiple positions of the structural part body, thereby improving the reliability of the contact between the conductive part and the carbon fiber filaments.

[0009] In some embodiments, a plurality of grooves are provided on the surface of the structural member body, and the structural member body includes a first wall surface and a second wall surface connected to each other. A portion of the grooves are provided on the first wall surface, and another portion of the grooves are provided on the second wall surface. Thus, a portion of the grooves can be provided on the first wall surface of the structural member body, so that the conductive portion can be provided on the first wall surface of the structural member body. Another portion of the grooves can also be provided on the second wall surface of the structural member body, so that the conductive portion can also be provided on the second wall surface of the structural member body. In this way, the electrical connection points of the structural member can be increased, thereby facilitating the electrical connection between the structural member and the electronic device.

[0010] In some embodiments, the outer surface of the exposed carbon fiber filaments protrudes from the bottom of the groove, and the conductive part contacts and electrically connects with the outer surface of the carbon fiber filaments protruding from the bottom of the groove. Thus, the outer surface of the carbon fiber filaments exposed in the groove can be in the form of a structure protruding from the bottom of the groove, so that the structural member can be grooved by ion beam etching or photolithography.

[0011] In some embodiments, the exposed carbon fiber filaments have a first cross-sectional surface, the first cross-sectional surface is flush with the groove wall, and the conductive portion is in contact with and electrically connected to the first cross-sectional surface of the carbon fiber filaments. Thus, the first cross-sectional surface of the carbon fiber filaments exposed in the groove can be flush with the groove wall, so that the structural member can be grooved by polishing, grinding or drawing.

[0012] In some embodiments, the exposed carbon fiber filaments have a second cross-sectional surface, the second cross-sectional surface is flush with the groove bottom, and the conductive portion is in contact with and electrically connected to the second cross-sectional surface of the carbon fiber filaments. Thus, the second cross-sectional surface of the carbon fiber filaments exposed in the groove can be flush with the groove bottom, and the structural member can also be grooved by polishing, grinding or drawing.

[0013] In some embodiments, the groove further includes a partition wall, which is connected to the groove bottom and spaced apart from the groove wall. The exposed carbon fiber filaments have a third cross-sectional surface, which is flush with the side wall of the partition wall, and the conductive portion is in contact with and electrically connected to the third cross-sectional surface of the carbon fiber filaments. Thus, the third cross-sectional surface of the carbon fiber filaments exposed in the groove can be flush with the side wall of the partition wall, so that the structural member can be grooved by ion beam etching, photolithography, polishing, grinding or wire drawing.

[0014] In some embodiments, the conductive part includes a conductive layer and a primer layer. The primer layer is disposed in the groove of the structural part body, and the primer layer is in contact with and electrically connected to the exposed carbon fiber filaments. The conductive layer is filled in the groove of the structural part body, and the conductive layer is in contact with and electrically connected to the primer layer. Thus, the exposed carbon fiber filaments can be in contact with and electrically connected to the primer layer, and the conductive layer can be in contact with and electrically connected to the primer layer, thereby forming a three-layer force-bearing structure of carbon fiber filaments, primer layer, and conductive layer, thereby improving the reliability of the connection between the conductive part and the carbon fiber filaments, and avoiding the separation between the conductive part and the carbon fiber filaments.

[0015] In some embodiments, the exposed carbon fiber filaments are provided with an uneven surface, and the grooves include groove walls and groove bottoms. The base layer is plated on the groove walls and groove bottoms, and contacts the uneven surface of the exposed carbon fiber filaments. Thus, the surface of the carbon fiber filaments can be roughened to make the surface of the carbon fiber filaments uneven, thereby increasing the specific surface area of ​​the carbon fiber filaments, and further improving the bonding strength between the base layer and the carbon fiber filaments.

[0016] In some embodiments, the interface between the conductive layer and the primer layer is fused to form an alloy, thereby improving the bonding strength between the conductive layer and the primer layer, thereby making it difficult for the conductive layer and the primer layer to separate.

[0017] In some embodiments, the conductive layer is made of tin, bismuth, gallium or indium. Thus, tin, bismuth, gallium or indium is a low melting point metal that can be conformally combined with the carbon fiber filaments in liquid state and can be conformally filled in the groove. After hardening and shaping, it can also serve as an electrical connection point, so that the structural member can be electrically connected to an external electronic device.

[0018] In some embodiments, the material of the base layer includes chromium, nickel, titanium, copper, iron or aluminum. Thus, chromium, nickel, titanium, copper, iron or aluminum can be fused with the above-mentioned tin, bismuth, gallium or indium to form an alloy to improve the bonding strength between the conductive layer and the base layer.

[0019] In some embodiments, the structural member further includes a connector, which is disposed on the conductive portion and electrically connected to the conductive portion. Thus, the provision of the connector facilitates electrical connection between the structural member and an external electronic device.

[0020] In some embodiments, the connector includes a pad, a conductive spring or a conductive silicone. Thus, different connector structures can be selected according to different electronic device structures.

[0021] In some embodiments, the structural member further comprises a metal plating layer, which is plated on the outer surface of the structural member body, and the conductive portion is electrically connected to the metal plating layer. Thus, the conductive portion is electrically connected to the metal plating layer, so that the metal plating layer of the structural member can be used as a reference ground for the electronic device, so that the electronic device can be grounded through the metal plating layer.

[0022] In some embodiments, the structural member further comprises graphene, the graphene is embedded in the insulating member, and the graphene is in contact with the carbon fiber filaments. Therefore, the graphene has good thermal conductivity, so that the structural member can be used as a good thermal conductive medium.

[0023] In some embodiments, the structural member is a middle frame or a back cover of an electronic device. Thus, the structural member can be used as a middle frame or a back cover of an electronic device, so that the structural member is electrically connected to the electronic devices in the electronic device to reduce ESD problems.

[0024] In a second aspect of the embodiments of the present application, an electronic device is provided, the electronic device comprising a circuit board, a connector and a structural member in the above embodiment, the connector being electrically connected between the circuit board and the structural member. The structural member of the electronic device has the same technical effect as the structural member in the above first aspect, and will not be described in detail here.

[0025] In some embodiments, the connector is disposed on the circuit board and is electrically connected to the circuit board. The connector on the circuit board is electrically connected to the conductive portion on the structural member. Thus, the connector can be disposed on the circuit board, and the circuit board can be electrically connected to the conductive portion on the structural member through the connector, thereby achieving conduction between the circuit board and the structural member.

[0026] In some embodiments, the electronic device further includes a middle frame, the middle frame includes a middle plate and a frame connected to each other, and the material of the middle plate and the frame is the above-mentioned structural member. The conductive part is arranged on the middle plate, and the connector is arranged in the middle position of the circuit board and is electrically connected to the circuit board. The connector on the circuit board is electrically connected to the conductive part on the middle plate. Thus, the connector can be arranged on the circuit board, and the middle plate can be provided with a conductive part corresponding to the position of the connector, so that the middle plate and the circuit board can be electrically connected through the electrical connection between the connector and the conductive part.

[0027] In some embodiments, the electronic device further comprises a middle frame, the middle frame comprises a middle plate and a frame connected to each other, and the materials of the middle plate and the frame are the above-mentioned structural members. The conductive part is arranged on the frame, and the connector is arranged at the edge of the circuit board and is electrically connected to the circuit board. The connector on the circuit board is electrically connected to the conductive part on the frame. Thus, the connector can be arranged on the circuit board, and the frame can be provided with a conductive part corresponding to the position of the connector, so that the frame and the circuit board can be connected through the electrical connection between the connector and the conductive part.

[0028] In some embodiments, the connector is disposed on the structural member and is electrically connected to the conductive portion. The circuit board is electrically connected to the connector on the structural member. Thus, the connector may also be disposed on the structural member, and the circuit board may be electrically connected to the connector on the structural member, thereby achieving conduction between the circuit board and the structural member.

[0029] In some embodiments, the electronic device further includes a middle frame, the middle frame includes a middle plate and a frame connected to each other, and the materials of the middle plate and the frame are the above-mentioned structural parts. The conductive part is arranged on the middle plate, the connector is arranged on the middle plate and electrically connected to the conductive part, and the circuit board is electrically connected to the connector on the middle plate. Therefore, the connector can also be arranged on the middle plate of the middle frame, so that the circuit board can be electrically connected and conductive to the middle plate through the connector.

[0030] In some embodiments, the electronic device further includes a middle frame, the middle frame includes a middle plate and a frame connected to each other, and the materials of the middle plate and the frame are the above-mentioned structural members. The conductive part is arranged on the frame, the connector is arranged on the frame and electrically connected to the conductive part, and the circuit board is electrically connected to the connector on the frame. Therefore, the connector can also be arranged on the frame of the above-mentioned middle frame, so that the circuit board can be electrically connected to the frame through the connector and conduct. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of a three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0032] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the electronic equipment;

[0033] Figure 3 for Figure 2 A schematic diagram of the three-dimensional structure of a middle frame of an electronic device;

[0034] Figure 4 for Figure 3 A schematic diagram of a three-dimensional structure in which a portion of the middle frame is cut out as a structural member;

[0035] Figure 5 for Figure 4 A schematic diagram of the planar structure of the carbon fiber arrangement in the middle structural member;

[0036] Figure 6 for Figure 4 A schematic diagram of the three-dimensional structure of the middle structural member body;

[0037] Figure 7 for Figure 6 AA cross-sectional structure diagram of the middle structural part Figure 1 ;

[0038] Figure 8 for Figure 6 AA cross-sectional structure diagram of the middle structural part Figure 2 ;

[0039] Fig. 9 for Figure 6 AA cross-sectional structure diagram of the middle structural part Figure 3 ;

[0040] Fig.10 for Figure 6 AA cross-sectional structure diagram of the middle structural part Figure 4 ;

[0041] Fig.11 for Fig. 9 A schematic cross-sectional view of the conductive portion filled in the groove of the middle structural member body;

[0042] Fig.12 for Fig.11 Schematic diagram of the three-dimensional structure of the surface roughening of carbon fiber filaments Figure 1 ;

[0043] Fig.13 for Fig.11 Schematic diagram of the three-dimensional structure of the surface roughening of carbon fiber filaments Figure 2 ;

[0044] Fig.14 for Fig.11 An enlarged structural diagram of the A portion of the middle structural member body;

[0045] Fig.15 for Fig. 9 A schematic cross-sectional view of a welding pad disposed in a groove of a middle structural member body;

[0046] Fig.16 for Fig. 9 A schematic diagram of a three-dimensional structure in which a metal coating is plated on the surface of the middle structural part body;

[0047] Fig.17 for Fig.16 Schematic diagram of the structure of the mixed weaving of carbon fiber filaments and graphene fibers in the main body of the middle structure;

[0048] Fig.18 A schematic diagram of a use state of an electronic device provided in an embodiment of the present application;

[0049] Fig.19 It is a schematic diagram of the cross-sectional structure of a carbon fiber plate in the prior art;

[0050] Fig. 20 for Fig.18 Schematic diagram of the three-dimensional structure of the circuit board in the electronic equipment Figure 1 ;

[0051] Fig.21 To contain Fig. 20 A schematic diagram of a cross-sectional structure of an electronic device with a circuit board in the middle;

[0052] Fig. 22 for Fig.21 A schematic diagram of the enlarged structure of the electronic device at B;

[0053] Fig.23 for Fig.18 Schematic diagram of the three-dimensional structure of the circuit board in the electronic equipment Figure 2 ;

[0054] Fig.24 To contain Fig.23 A schematic diagram of a cross-sectional structure of an electronic device with a circuit board in the middle;

[0055] Fig.25 A three-dimensional structure diagram of a structural member provided in an embodiment of the present application Figure 1 ;

[0056] Fig.26 for Fig.25 A schematic diagram of the planar structure of the middle structural member as the middle plate of the electronic equipment;

[0057] Fig. 27 A three-dimensional structure diagram of a structural member provided in an embodiment of the present application Figure 2 ;

[0058] Fig.28 A schematic diagram of the three-dimensional structure of a structural member provided in an embodiment of the present application applied in a notebook computer.

[0059] Reference numerals:

[0060] 01-electronic device; 02-structural part; 03-laptop; 100-middle frame; 200-display screen; 300-back cover; 400-circuit board; 500-battery; 101-hollow part; 110-middle plate; 120-frame; 121-frame antenna; 122-slot; 123-break; 130-local area; 210-structural part body; 220-conductive part; 211-carbon fiber filament; 212-insulating part; 213-groove; 2131-groove bottom; 2132-groove wall; 2133-groove space; 2134-partition wall; 211a-first section; 211b-second Sectional surface; 211c-third sectional surface; 221-conductive layer; 222-base layer; 223-alloy area; 2111-pit; 2112-gap; 230-pad; 240-metal plating; 250-graphene; 410-substrate; 420-chip; 430-memory; 440-shielding cover; 450-connector; 460-wire; 451-conductive silicone; 452-conductive spring; 470-patch antenna; 480-grounding point; 490-feeding point; 210a-first wall; 210b-second wall; 310-computer body; 320-screen; 330-housing. DETAILED DESCRIPTION

[0061] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0062] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0063] In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the changes in the orientation of the components in the drawings.

[0064] The present application embodiment provides an electronic device 01. Figure 1 As shown, the electronic device 01 can be a mobile phone, a tablet computer, an e-reader, a laptop computer, a wearable device, a drone or other electronic product. The present application embodiment does not impose any special restrictions on the specific type of the electronic device 01. In order to better illustrate the content of the present application embodiment, the electronic device 01 is a mobile phone as an example for description.

[0065] The electronic device 01, such as Figure 1 As shown, the electronic device 01 may include a middle frame 100, a display screen 200, and a back cover 300. The display screen 200 may be connected to one side of the middle frame 100 by pasting, and the back cover 300 may be connected to the side of the middle frame 100 away from the display screen 200 by screwing, welding, bonding, or snapping. The embodiment of the present application does not impose any special restrictions on the connection method between the components of the electronic device 01. Figure 1 As shown, the electronic device 01 may have a length direction, a width direction, and a thickness direction. For the convenience of explanation, the following embodiments will use the X direction as the length direction of the electronic device 01, the Y direction as the width direction of the electronic device 01, and the Z direction as the thickness direction of the electronic device 01. Taking a mobile phone as an example, the outline of the mobile phone may be a rectangle, the direction where the long side is located may be the length direction of the mobile phone, and the direction where the short side is located may be the width direction of the mobile phone.

[0066] Figure 2 The schematic diagram of the exploded structure of the electronic device 01 is shown. In order to realize the relevant functions of the electronic device 01, the electronic device 01 may also include a circuit board 400 and a battery 500. The circuit board 400 may be electrically connected to multiple chips, memories, antennas and other electronic devices, and the battery 500 may be electrically connected to the circuit board 400 to provide the power required by the circuit board 400. According to the structural design of different electronic devices 01, the circuit board 400 and the battery 500 may be installed between the middle frame 100 and the back cover 300, or between the middle frame 100 and the display screen 200. The embodiment of the present application does not impose any special restrictions on the installation positions of the circuit board 400 and the battery 500.

[0067] In addition, if Figure 2 As shown, in order to facilitate the installation of the battery 500, a hollow portion 101 can also be opened on the middle frame 100 so that the battery 500 can be installed in the hollow portion 101. The embodiment of the present application does not impose any special restrictions on the internal structure of the electronic device 01. In the following embodiments, for the convenience of explanation, the hollow parts such as grooves and holes are marked with arrow-marked lines, and the other parts are marked with arrow-free marking lines. The same marking method will be used in the drawings of the following embodiments, and will not be repeated.

[0068] In order to reduce the structural weight of the electronic device 01, the embodiment of the present application provides a structural member 02. For example, the middle frame 100 of the electronic device 01 may adopt the structural member 02 provided in the embodiment of the present application. Figure 3 As shown, Figure 2Schematic diagram of the three-dimensional structure of the middle frame 100 in the electronic device 01. The middle frame 100 may include a middle plate 110 and a frame 120, and the frame 120 may be connected to the periphery of the middle plate 110. Among them, the material of the middle plate 110 and the frame 120 may be a carbon fiber composite material, and the middle plate 110 and the frame 120 may be an integrally formed structural member 02, or a structural member 02 formed by bonding, screwing or riveting. In order to better show the specific structure of the structural member 02, the following will be described in detail as the area shown by the dotted line in the figure, and the local area 130 of the middle plate 110 will be cut out as the structural member 02.

[0069] In addition, the frame 120 of the middle frame 100 may also be made of the same material as the structural member 02, and the back cover 300 of the electronic device 01 may also be made of the same material as the structural member 02. The present embodiment of the application does not impose any special restrictions on the specific structural parts in which the structural member 02 can be applied in the electronic device 01. The following only takes the middle plate 110 as an example to illustrate the structure of the structural member 02 in the intercepted local area 130.

[0070] Based on this, Figure 4 As shown, Figure 3 Schematic diagram of the enlarged structure of the local area 130 of the middle plate 110 intercepted therein. The structural member 02 provided in the embodiment of the present application may include a structural member body 210 and a conductive part 220, wherein the conductive part 220 is disposed on the structural member body 210 and connected to the structural member body 210. The structural member body 210 may include carbon fiber filaments 211 and an insulating member 212, wherein the carbon fiber filaments 211 are embedded in the insulating member 212, and a portion of the carbon fiber filaments 211 may be exposed outside the insulating member 212 by means of grooving or opening holes, so that the carbon fiber filaments 211 and the conductive part 220 can be in contact and electrically connected, so that the carbon fiber filaments 211 and the conductive part 220 are conductive, so that the conductive part 220 can be used as a welding point on the structural member 02 for connecting to the above-mentioned circuit board 400 ( Figure 2 shown) and battery 500 ( Figure 2 The insulating member 212 may be an insulating material such as resin or ceramic, and the carbon fiber filaments 211 may be embedded in the insulating member 212 by processes such as brushing glue coating and molding. The present application embodiment does not impose any special restrictions on the specific material of the insulating member 212 and the preparation process of the structural member body 210. In some embodiments, as Figure 4 As shown, a plurality of carbon fiber filaments 211 may be provided, and the plurality of carbon fiber filaments 211 may be provided along the X direction and arranged along the Y direction, and the plurality of carbon fiber filaments 211 may also be provided in layers along the Z direction. Figure 5As shown, the plurality of carbon fiber filaments 211 may also be arranged in a mesh shape in the XY plane. The embodiment of the present application does not impose any particular limitation on the specific number and arrangement of the carbon fiber filaments 211 in the insulating member 212 .

[0071] in, Figure 4 and Figure 5 The spacing between the carbon fiber filaments 211 shown in the figure does not represent the actual spacing between the carbon fiber filaments 211 in the carbon fiber composite material, but is only used as a schematic diagram of the specific arrangement of the carbon fiber filaments 211 in the insulating member 212. The density between the carbon fiber filaments 211 in the actual carbon fiber composite material is much greater than the density shown in the figure. When the density between the carbon fiber filaments 211 is relatively large, during the process of brushing glue coating and compression molding of the carbon fiber composite material, there are situations such as mutual overlap, entanglement, and parallel lines between the carbon fiber filaments 211, so that the carbon fiber filaments 211 in the carbon fiber composite material can be mutually conductive. At the same time, due to the large density between the carbon fiber filaments 211, the spacing between the carbon fiber filaments 211 is small, so that there is also indirect coupling between the carbon fiber filaments 211, which can also make the carbon fiber filaments 211 in the carbon fiber composite material conductive.

[0072] On this basis, the structural member 02 provided in the application embodiment, such as Figure 6 As shown, the structure of the structural member 02 before the conductive part 220 is provided is shown. For example, a groove 213 can be opened on the surface of the structural member body 210 so that a part of the carbon fiber filament 211 is exposed in the groove 213. The groove 213 may include a groove bottom 2131, a groove wall 2132, and a groove space 2133 surrounded by the groove bottom 2131 and the groove wall 2132. The carbon fiber filament 211 exposed in the groove 213 may be located at the groove bottom 2131, or at the groove wall 2132, or in the groove space 2133. The embodiment of the present application does not impose any special restrictions on the specific position of the carbon fiber filament 211 exposed in the groove 213.

[0073] Among them, the method of opening the groove 213 can be to use mechanical equipment through computer numerical control (CNC), polishing, grinding, wire drawing and other process methods, or ion beam etching or photolithography and other methods can be used to open the groove 213 on the surface of the structural part body 210. Of course, different shapes of grooves 213 can be opened on the surface of the structural part body 210 by using different processing techniques. For example, a rectangular groove 213 can be formed by CNC processing, and the embodiment of the present application does not impose special restrictions on the processing technology and specific shape of the groove 213. For better explanation, the following embodiments will illustrate the shape of the groove 213 and the carbon fiber filaments 211 exposed in the groove 213.

[0074] For example, Figure 7 As shown, the groove 213 ( Figure 6 Of course, according to different processing techniques, the carbon fiber filaments 211 exposed in the groove 213 can be in the shape of a cylindrical curved surface, or in the shape of a truncated cross section. As long as there are exposed carbon fiber filaments 211 in the groove 213, the embodiment of the present application does not impose any special restrictions on the specific shape of the carbon fiber filaments 211 exposed in the groove 213.

[0075] For example, Figure 8 As shown, the groove 213 ( Figure 6 The shape of the groove 213 (as shown) can also be a trapezoid. In some embodiments, the above-mentioned processing technology can be used to remove only the insulating member 212 in the groove 213, while retaining the carbon fiber filaments 211 located at the groove bottom 2131, so that the outer surface of the carbon fiber filaments 211 located at the groove bottom 2131 can protrude from the groove bottom 2131, and the conductive part 220 can contact and electrically connect with the outer surface of the carbon fiber filaments 211 protruding from the groove bottom 2131. In other embodiments, the above-mentioned processing technology can also be used to simultaneously remove the carbon fiber filaments 211 and the insulating member 212 in the groove 213, so that the carbon fiber filaments 211 located at the groove wall 2132 can have a first cross-sectional surface 211a, and the first cross-sectional surface 211a can be flush with the groove wall 2132, so that the conductive part 220 can also contact and electrically connect with the first cross-sectional surface 211a of the carbon fiber filaments 211 of the groove wall 2132. Of course, a combination of the above processing techniques may also be used, so that the carbon fiber filaments 211 exposed in the groove 213 have both an outer surface protruding from the groove bottom 2131 and a first section surface 211 a flush with the groove wall 2132 .

[0076] For example, Fig. 9 As shown, the rest of the structure is Figure 8 The structure shown in FIG. 1 is the same as that shown in FIG. 2 , except that the above processing technology can also be used to simultaneously remove the groove 213 ( Figure 6 The carbon fiber filaments 211 and the insulating member 212 in the groove 213 are formed by the conductive part 220, and the conductive part 220 is formed by the conductive part 220. The conductive part 220 is ...

[0077] For example, Fig.10 As shown, the above processing technology can also be used to remove the groove 213 ( Figure 6The conductive portion 220 may be provided with a portion of the carbon fiber filaments 211 and a portion of the insulating member 212 in the groove 2133, so that the retained carbon fiber filaments 211 and the insulating member 212 form a partition wall 2134 connected to the groove bottom 2131, and the partition wall 2134 may be spaced apart from the groove wall 2132. The partition wall 2134 may include the carbon fiber filaments 211 and the insulating member 212, and the carbon fiber filaments 211 on the partition wall 2134 may have a third section plane 211c, and the third section plane 211c may be flush with the side wall of the partition wall 2134, so that the conductive portion 220 may also contact and be electrically connected with the third section plane 211c of the carbon fiber filaments 211 on the side wall of the partition wall 2134. At this time, the exposed carbon fiber filaments 211 are located in the groove space 2133. Of course, there may be multiple partition walls 2134 on the groove bottom 2131, and the embodiment of the present application does not impose any special restrictions on the specific number of the partition walls 2134.

[0078] Of course, in order to allow a portion of the carbon fiber filaments 211 embedded in the insulating member 212 to be exposed outside the insulating member 212, a portion of the carbon fiber filaments 211 can also be made to protrude from the surface of the structural member body 210 when the structural member body 210 is manufactured. That is, the surface of the structural member body 210 is provided with carbon fiber filaments 211 and insulating members 212 protruding relative to the surface of the structural member body 210. For example, a multi-layer carbon fiber filament 211 structure can be used in a part of the structural member body 210, so that the carbon fiber filaments 211 at the local position protrude from the surface of the structural member body 210 after brushing glue coating or molding. At this time, it is only necessary to directly remove the insulating member 212 protruding from the surface of the structural member body 210 by CNC, polishing, grinding, wire drawing, ion beam etching or photolithography, so that there is no need to open a groove 213 on the surface of the structural member body 210, and it can also be achieved that a portion of the carbon fiber filaments 211 embedded in the insulating member 212 can be exposed outside the insulating member 212.

[0079] The above embodiment is an example of the specific shape of the groove 213 and the carbon fiber filaments 211 exposed in the groove 213. The conductive part 220 disposed in the groove 213 will be described in detail below. Fig.11 As shown, the conductive part 220 may include a conductive layer 221 and a base layer 222. The base layer 222 is disposed in the groove 213 ( Fig. 9 The bottom layer 222 is directly connected to the carbon fiber filaments 211 exposed in the groove 213. The bottom layer 222 can be plated in the groove 213 by electroplating, chemical plating, etc., so that the bottom layer 222 is directly connected to the carbon fiber filaments 211. The number of layers of the bottom layer 222 can be one layer or multiple layers. The embodiment of the present application does not impose any special restrictions on the number of layers of the bottom layer 222. The conductive layer 221 is filled in the groove 213, and the conductive layer 221 is connected to the bottom layer 222.

[0080] In addition, in more embodiments, along the Z direction, the surface of the conductive portion 220 may protrude from the surface of the insulating member 212, may be flush with the surface of the insulating member 212, or may be lower than the surface of the insulating member 212. The embodiment of the present application does not impose any special restrictions on the surface height of the conductive portion 220 along the Z direction.

[0081] In order to ensure the connection strength between the base layer 222 and the carbon fiber filaments 211 exposed in the groove 213, the surface of the carbon fiber filaments 211 exposed in the groove 213 can be roughened to make the surface of the carbon fiber filaments 211 uneven, thereby increasing the specific surface area of ​​the carbon fiber filaments 211 and improving the base layer 222 ( Fig.11 The roughening treatment may be liquid phase oxidation etching, plasma treatment or irradiation treatment, and the embodiment of the present application does not impose any particular restrictions on the specific method of roughening treatment. The surface of the roughened carbon fiber filament 211 may be Figure 8 The outer surface of the carbon fiber filament 211 of the protruding groove bottom 2131 shown in the figure may also be Figure 8 The first section surface 211a shown flush with the groove wall 2132 may also be Fig. 9 The second section surface 211b shown flush with the groove bottom 2131 may also be Fig.10 The third section surface 211c on the side wall of the partition wall 2134 is shown.

[0082] In some embodiments, Fig.12 As shown, during the roughening treatment, different roughening treatment processes can form pits 2111 on the surface of the carbon fiber filaments 211. The shape of the pits 2111 can be various shapes such as triangle, circle, rectangle, etc. The embodiment of the present application does not impose any special restrictions on the specific shape and depth of the pits 2111. Fig.11 The carbon fiber filaments 211 and the base layer 222 can be embedded in the pit 2111, which not only increases the connection area between the carbon fiber filaments 211 and the base layer 222, but also increases the bite force between the base layer 222 and the carbon fiber filaments 211, thereby improving the bonding strength between the base layer 222 and the carbon fiber filaments 211. The area of ​​the pit 2111 on the surface of the carbon fiber filaments 211 can be 1 μm 2 -1mm 2 The depth of the pit 2111 on the surface of the carbon fiber filament 211 can be 1-1000 μm. If the size of the pit 2111 is too large, the specific surface area of ​​the carbon fiber filament 211 will be reduced, thereby affecting the bonding strength between the base layer 222 and the carbon fiber filament 211. If the size of the pit 2111 is too small, the base layer 222 cannot be embedded in the pit 2111, which will also affect the bonding strength between the base layer 222 and the carbon fiber filament 211.

[0083] In other embodiments, Fig.13 As shown, during the roughening treatment, different roughening treatment processes can also form dense gaps 2112 on the surface of the carbon fiber filaments 211. The embodiment of the present application does not impose any special restrictions on the density of the gaps 2112. Fig.11 The bottom layer 222 and the carbon fiber filaments 211 may be embedded in the gap 2112 to improve the bonding strength between the bottom layer 222 and the carbon fiber filaments 211. The length, width and depth of the gap 2112 on the surface of the carbon fiber filaments 211 may be 1-1000 μm. If the size of the gap 2112 is too large, the specific surface area of ​​the carbon fiber filaments 211 will also be reduced, thereby affecting the bonding strength between the bottom layer 222 and the carbon fiber filaments 211. If the size of the gap 2112 is too small, the bottom layer 222 cannot be embedded in the gap 2112, which will also affect the bonding strength between the bottom layer 222 and the carbon fiber filaments 211.

[0084] On this basis, if Fig.14 As shown, Fig.11 For example, the conductive layer 221 can be made of metal tin with a low melting point, which can fill the groove 213 ( Fig. 9 As shown in the figure), a gap between the conductive layer 221 and the groove 213 can be avoided, thereby preventing the conductive layer 221 from having a gap with the groove 213, which would affect the connection strength between the conductive layer 221 and the groove 213. After solidification, the metal tin can form a welding surface on the side away from the base layer 222, thereby being used as a welding point. The base layer 222 can be made of metal chromium, and the liquid metal tin can be fused with the metal chromium to form an alloy. That is, an alloy region 223 shown by the dotted line in the figure can be formed between the interface of the conductive layer 221 and the base layer 222, thereby improving the bonding strength between the conductive layer 221 and the base layer 222.

[0085] Of course, the material of the conductive layer 221 can also be gallium, bismuth, indium or other metals with low melting points, and the material of the base layer 222 can also be titanium, nickel, copper, iron or aluminum or other metals or alloys thereof, which can also form an alloy between the interface between the conductive layer 221 and the base layer 222. Among them, the melting point of the metal can be 50°C-350°C. If the melting point of the metal is too high, it will be difficult to fuse with the base layer 222 to form an alloy, and the insulating part 212 is easily oxidized. If the melting point of the metal is too low, the stability of the alloy is affected. The embodiment of the present application does not impose any special restrictions on the specific materials of the conductive layer 221 and the base layer 222.

[0086] In addition, if Fig.15 As shown, the structural member 02 may also include a connecting member 450 ( Fig. 20In some embodiments, the connector 450 may include a pad 230. The pad 230 may be disposed on a side of the conductive layer 221 away from the base layer 222, and the pad 230 is electrically connected to the conductive layer 221, so that the structural member 02 may be electrically connected to other electronic devices through the pad 230. The conductive layer 221 may partially fill the groove 213 ( Fig. 9 The conductive layer 221 may also completely fill the groove 213, so that the pad 230 protrudes from the surface of the insulating member 212. The embodiment of the present application does not impose any special restrictions on the relative position relationship between the pad 230 and the insulating member 212.

[0087] In some embodiments, Fig.16 As shown, the structural member 02 may also include a metal coating 240, which is coated on the outer surface of the structural member body 210, and the conductive portion 220 may be electrically connected to the metal coating 240. Along the Z direction in the figure, the conductive portion 220 may be flush with the surface of the metal coating 240, and the conductive portion 220 may also be protruding or recessed relative to the surface of the metal coating 240. The embodiment of the present application does not impose any special restrictions on the relative positional relationship between the conductive portion 220 and the metal coating 240. For example, when the structural member 02 is used as the electronic device 01 ( Figure 2 The middle frame 100 (shown) Figure 2 When the structural member 02 is used as the back cover 300 ( Figure 2 When the structure body 210 is formed as shown in FIG. 1 , the structure body 210 may also be coated with a metal coating 240 on one side. The embodiment of the present application does not impose any special restrictions on the position and quantity of the metal coating 240.

[0088] Considering the electronic device 01( Figure 2 In order to meet the heat dissipation requirements of the structural member 02, the structural member body 210 of the structural member 02 may further include graphene 250. In some embodiments, as shown in FIG. Fig.17 As shown, the graphene 250 can be configured as graphene fibers, and the graphene fibers can be mixed and woven with the carbon fiber filaments 211. In other embodiments, the graphene 250 can also be configured as graphene powder, and the graphene powder can be embedded in the insulating member 212 ( Fig.15 The graphene 250 may be hot-pressed with the carbon fiber filaments 211 before being formed, or may be in-situ composited with the carbon fiber filaments 211 during the process of embedding the insulating member 212. The embodiment of the present application does not impose any particular restrictions on the specific method of composite graphene 250 with the carbon fiber filaments 211. In this way, the structural member 02 can also be used as a good heat conducting medium.

[0089] In the above embodiments, the environment in which the carbon fiber filaments 211 exposed outside the insulating member 212 are located is different according to different scenarios of the structural member 02. For example, when the groove 213 is opened by CNC, polishing, grinding, wire drawing and other methods, the carbon fiber filaments 211 exposed outside the insulating member 212 may be the carbon fiber filaments 211 in contact with the air in the groove 213. When the groove 213 is opened by ion beam etching or photolithography and other methods, since a protective gas is required during the processing, the carbon fiber filaments 211 exposed outside the insulating member 212 may be the carbon fiber filaments 211 in contact with the protective gas in the groove 213. When the conductive part 220 is filled in the groove 213, the carbon fiber filaments 211 exposed outside the insulating member 212 may be the carbon fiber filaments 211 in contact with the conductive part 220 and electrically connected in the groove 213.

[0090] The above embodiment takes the structural member 02 as the middle frame 100 of the electronic device 01 as an example, and introduces the specific structure of the structural member 02 in detail. The following will introduce the working principle of the middle frame 100 in detail in combination with the specific structure of the structural member 02. Fig.18 As shown, in order to reduce the weight of the electronic device 01, a high-strength, light-weight, and flexible carbon fiber composite board is usually selected as the middle frame 100 ( Figure 2 as shown) or rear cover 300 ( Figure 2 shown).

[0091] Since carbon fiber itself has the property of absorbing electromagnetic waves, and the carbon fiber composite material formed by combining carbon fiber with insulating material has hysteresis characteristics, carbon fiber composite materials have the problem of self-absorption and passive inter-modulation (PIM). Fig.19 As shown, metal 2 is usually plated on the surface of the carbon fiber composite plate 1, and there is insulation 3 between the carbon fiber composite plate 1 and the metal 2. The human body is prone to static electricity during activities, and when holding the electronic device 01, the static electricity will be transmitted to the electronic device 01. When a large current passes through the metal 2 (such as static electricity), a type of charge (such as positive charge) will be generated on the surface of the metal 2. At this time, since the carbon fiber in the carbon fiber composite plate 1 has good conductivity, the carbon fiber can generate another type of charge (such as negative charge) through electrostatic induction. In this way, with the frequent use of the electronic device 01, the carbon fiber in the carbon fiber composite plate 1 continues to accumulate charge. Since the carbon fiber is plastic-sealed in the insulation 3 and cannot be discharged to the outside, when the charge accumulates to a certain threshold, it will be released directly to the nearest electronic device, causing the electronic device in the electronic device 01 to burn out.

[0092] The structural member 02 provided in the embodiment of the present application is as follows: Fig.11As shown, by providing a groove 213 ( Fig. 9 As shown in FIG. 2 ), a portion of the carbon fiber filament 211 is exposed in the groove 213, and the conductive part 220 directly contacts the carbon fiber filament 211. In this way, the conductive part 220 in the groove 213 can directly conduct with the carbon fiber filament 211 exposed in the groove 213, so that the carbon fiber filament 211 encapsulated in the insulating part 212 can serve as a discharge path for the electrostatic current. For example, Fig.16 As shown, when the outer surface of the structural component body 210 is plated with a metal coating 240, the metal coating 240 can be used as a reference ground. Since the conductive part 220 is electrically connected to the metal coating 240, the electrostatic current can finally flow to the metal coating 240 through the carbon fiber filaments 211 and the conductive part 220, thereby avoiding the ESD problem caused by the lack of a discharge path for the electrostatic current.

[0093] In addition, as in the above embodiment Fig.14 As shown, since the surface of the carbon fiber filaments 211 exposed in the groove 213 is roughened, the bonding strength between the base layer 222 and the carbon fiber filaments 211 is improved. At the same time, since the conductive layer 221 of the low melting point metal material can be fused with the base layer 222 to form an alloy in the liquid state, the bonding strength between the conductive layer 221 and the base layer 222 is improved, thereby forming a three-layer force-bearing structure of the carbon fiber filaments 211, the base layer 222 and the conductive layer 221. When the outer surface of the structural part body 210 is plated with a metal coating 240, the connection strength of the metal coating 240 on the structural part body 210 can also be improved by welding the conductive layer 221 and the metal coating 240, thereby avoiding the problem of the metal coating 240 falling off from the structural part body 210 when the temperature fluctuates greatly due to the different thermal expansion coefficients of the metal coating 240 and the structural part body 210.

[0094] In order to better demonstrate the application of the structural member 02 provided in the embodiment of the present application in the electronic device 01, in some implementations, such as Fig. 20 As shown, the circuit board 400 in the electronic device 01 may include electronic devices such as a substrate 410, a chip 420, a memory 430, a shielding cover 440, a plurality of connectors 450, and a wire 460. The wire 460 is disposed on the substrate 410, and the chip 420, the memory 430, and the shielding cover 440 may be electrically connected to the surface of the substrate 410 by surface mount technology (SMT), and the chip 420 and the memory 430 may also be electrically connected by the wire 460.

[0095] Of course, according to the different functional requirements of the electronic device 01, the circuit board 400 may also include other electronic devices such as a fingerprint module, a camera module, and a microphone. Each electronic device may be electrically connected to the circuit board 400 individually, or may be electrically connected to each other through a wire 460. The embodiment of the present application does not impose any special restrictions on the type, quantity, and connection method of the electronic devices on the circuit board 400.

[0096] Continue to see Fig. 20 , usually, in order to determine the operating voltage of each electronic device, each electronic device will be electrically connected to the reference ground through a connector 450. For example, the connector 450 can be set on the circuit board 400 and electrically connected to the circuit board 400. The connector 450 may include a conductive silicone 451 and a conductive spring 452. For example, the conductive silicone 451 can be set on the periphery of the shielding cover 440 for grounding the shielding cover 440. The conductive spring 452 can be set on the periphery of the chip 420 and the memory 430 for grounding the chip 420 and the memory 430. Of course, different electronic devices can use different types of connectors 450 for grounding. In addition, the connector 450 can be set on the same side of the circuit board 400 as the electronic device, or it can be set on a different side of the circuit board 400 from the electronic device. The embodiment of the present application does not impose special restrictions on the type of connector 450 selected for grounding the electronic device and the setting position of the connector 450.

[0097] In the above embodiment, the structural member 02 ( Fig.16 The metal plating layer 240 in the embodiment shown in FIG. 1 can be used as a reference ground. Fig.21 As shown, the circuit board 400 can be arranged between the middle frame 100 and the display screen 200 of the electronic device 01, and the connector 450 on the circuit board 400 can be welded to the conductive part 220 on the middle frame 100. Since the conductive part 220 is electrically connected to the metal plating layer 240, the electronic device on the circuit board 400 can be grounded through the connector 450. For example, along the Z direction in the figure, the surface of the conductive part 220 is lower than the surface of the middle frame 100 facing the circuit board 400, so that the metal plating layer 240 can be grounded in the groove 213 ( Figure 6 The conductive part 220 is electrically connected to the inner surface of the conductive part 220, thereby increasing the thickness of the metal plating layer 240 along the Z direction at the conductive part 220. During welding, the metal plating layer 240 will not be separated from the conductive part 220 due to the metal plating layer 240 being too thin, thereby ensuring the quality of welding.

[0098] Of course, if Fig.21As shown, along the Z direction in the figure, a pad 230 can also be provided on the surface of the conductive part 220, and the pad 230 is electrically connected to the conductive part 220. The pad 230 can also be electrically connected to the metal plating layer 240, so that the connector 450 can also be electrically connected to the middle frame 100 through the pad 230. The embodiment of the present application does not impose any special restrictions on whether the pad 230 is provided at the position of the conductive part 220 on the middle frame 100.

[0099] Among them, Fig. 22 As shown, Fig.21 Schematic diagram of the enlarged structure at B in the figure. According to the different heights of the connector 450 along the Z direction, different distances S between the metal plating layer 240 and the conductive part 220 can be set, so that the depth of the groove 213 on the structural part body 210 can accommodate the connector 450, so as to reduce the thickness of the electronic device 01 in the Z direction, thereby facilitating the thinness of the electronic device 01. In addition, when the conductive part 220 is used as the point of electrical connection of the circuit board 400, since the conductive part 220 forms a three-layer force-bearing structure of carbon fiber filaments 211, base layer 222 and conductive layer 221, when the conductive part 220 is welded, it can withstand the high-pressure point contact of the connector 450, and the problem of damage to the welding point is not easy to occur, thereby ensuring the welding quality between the structural part body 210 and the circuit board 400.

[0100] Example, combined Fig. 20 and Fig.21 As shown, the conductive part 220 can be disposed on the middle plate 110 ( Figure 3 As shown in the figure, the connector 450 can be arranged in the middle position of the circuit board 400 and be electrically connected to the circuit board 400. Among them, the middle position of the circuit board 400 can be an area outside the range L from the edge of the circuit board 400, 0≤L≤1cm, and the embodiment of the present application does not impose special restrictions on the middle position and edge position of the circuit board 400. In this way, the circuit board 400 can be electrically connected to the conductive part 220 on the middle plate 110 through the connector 450. Of course, the connector 450 can also be arranged on the middle plate 110, and the connector 450 is electrically connected to the conductive part 220 on the middle plate 110, so that the middle plate 110 can be electrically connected to the middle position of the circuit board 400 through the connector 450. The embodiment of the present application does not impose special restrictions on the connector 450 being arranged on the middle plate 110 or on the circuit board 400.

[0101] In some embodiments, Fig.23As shown, the electronic device on the circuit board 400 may also include a patch antenna 470, a grounding point 480 and a feeding point 490, and the patch antenna 470 is electrically connected to the grounding point 480 and the feeding point 490, respectively. Among them, the grounding point 480 and the feeding point 490 can be set at the edge of the circuit board 400. Of course, according to the requirements of different functions of the antenna, more patch antennas 470, grounding points 480 and feeding points 490 on the circuit board 400 can be set, and the embodiment of the present application does not impose special restrictions on the specific number of patch antennas 470, grounding points 480 and feeding points 490 on the circuit board 400.

[0102] On this basis, if Fig.24 As shown, the conductive part 220 in the above embodiment can be arranged not only on the middle plate 110 of the middle frame 100, but also on the frame 120 of the middle frame 100. For example, the conductive part 220 can be arranged on the inner side wall of the frame 120, and the connector 450 can be arranged on the inner side wall of the frame 120 and electrically connected to the conductive part 220. Of course, the number of connectors 450 arranged on the inner side wall of the frame 120 can be multiple, and the embodiment of the present application does not impose special restrictions on the specific number of connectors 450 on the frame 120. In addition, the connector 450 and the circuit board 400 can be either point contact or surface contact. The connector 450 can be arranged on the circuit board 400, or on the middle plate 110 or the frame 120. The embodiment of the present application also does not impose special restrictions on the contact form and setting position between the connector 450 and the circuit board 400.

[0103] Example, combined Fig.23 and Fig.24 As shown, the conductive part 220 can be arranged on the frame 120, the connector 450 can be arranged on the frame 120 and electrically connected to the conductive part 220, and the frame 120 can be electrically connected to the edge position of the circuit board 400 through the connector 450. The edge position of the circuit board 400 refers to the area within the range L from the edge of the circuit board 400, 0≤L≤1cm. In addition, the connector 450 can also be arranged at the edge position of the circuit board 400 and electrically connected to the circuit board 400, so that the circuit board 400 can be electrically connected to the conductive part 220 on the frame 120 through the connector 450. The embodiment of the present application does not impose any special restrictions on the connector 450 being arranged on the frame 120 or on the circuit board 400.

[0104] In some embodiments, Fig.23As shown, the grounding point 480 and the feeding point 490 can be set at the edge of the circuit board 400, so that the grounding point 480 and the feeding point 490 can be electrically connected to the connector 450 on the inner wall of the frame 120, respectively, so as to realize the function of grounding the patch antenna 470 line. In addition, when the side of the electronic device 01 has electronic devices such as a data interface, a fingerprint module, a microphone, etc., the function of grounding the electronic devices such as the data interface, the fingerprint module, the microphone, etc. can also be realized by setting the connector 450 on the frame 120. The embodiment of the present application does not impose special restrictions on the electronic devices on the side of the electronic device 01.

[0105] For example, Fig.24 As shown, when the shape of the structural member body 210 is designed to be the frame 100 ( Figure 3 When the shape of the structure body 210 is shaped as shown in FIG. 1 , the structure body 210 may include a first wall surface 210a and a second wall surface 210b connected to each other. In this case, the first wall surface 210a may be the wall surface of the middle plate 110 facing the circuit board 400, and the second wall surface 210b may be the wall surface of the frame 120 facing the circuit board 400. In addition, as shown in FIG. Fig.25 As shown, the structural member body 210 can also be designed as a plate structure. In this case, the first wall surface 210a can be the plate surface of the plate structure, and the second wall surface 210b can be the side surface of the plate structure. The groove 213 in the above embodiment can be partially opened on the first wall surface 210a, and the other part can be opened on the second wall surface 210b. Of course, when the thickness of the structural member body 210 along the Z direction is large enough, the groove 213 can also be completely opened on the second wall surface 210b. The embodiment of the present application does not impose any special restrictions on the specific shape of the structural member body 210 and the setting position of the groove 213.

[0106] Based on this, Fig.26 As shown, the electronic device 01 may further include a middle plate 110, a metal frame antenna 121, and a plurality of grounding points 480 and a feeding point 490. A slot 122 may be provided between the middle plate 110 and the frame antenna 121. A break 123 for disconnecting the frame antenna 121 may be provided on the frame antenna 121. The plurality of grounding points 480 and the feeding point 490 are provided between the middle plate 110 and the frame antenna 121. Fig.25 As shown, the conductive portion 220 ( Fig.16 As shown). In this way, when the structural member body 210 is used as the middle plate 110, a plurality of conductive parts 220 can be provided on the side wall of the middle plate 110, so that a plurality of grounding points 480 and feeding points 490 can be electrically connected to the conductive parts 220 respectively, thereby realizing the function of grounding the frame antenna 121.

[0107] In addition, if Fig. 27 As shown, it can be seen from the above embodiments that, according to different functional requirements, a plurality of conductive parts 220 can be provided on the first wall surface 210a and the second wall surface 210b of the structural member body 210. Fig.14 As shown, since each conductive part 220 forms a three-layer structure of carbon fiber filaments 211, base layer 222 and conductive layer 221, the conductive part 220 is also connected with the metal plating layer 240 ( Fig.16 As shown in the figure, the conductive parts 220 are connected to each other, so that the multiple conductive parts 220 can fix the metal plating layer 240 at different positions. In this way, the conductive parts 220 not only meet the requirements of the welding points, but also prevent the metal plating layer 240 from falling off the surface of the structural part body 210.

[0108] The above embodiments are examples of the application of the structural component 02 in the electronic device 01, and the electronic device 01 is mainly a mobile phone. In addition, the structural component 02 can also be applied to other electronic devices 01. For example, the structural component 02 can also be applied to electronic devices 01 such as laptop computers 03, tablet computers, and drones.

[0109] For example, Fig.28 As shown, the laptop computer 03 may include a computer body 310, a screen 320, and a housing 330. The housing 330 may be rotatably connected to the computer body 310 by means of hinges, shafts, and the like, and the screen 320 may be connected to the side of the housing 330 facing the computer body 310 by means of gluing, snapping, and the like. Among them, the structural member 02 provided in the embodiment of the present application may serve as the housing 330. That is, a plurality of conductive portions 220 ( Fig. 27 As shown), the screen 320 can be connected by the connecting member 450 ( Fig.24 As shown) is electrically connected to the conductive portion 220 on the housing 330, thereby achieving the function of grounding the screen 320.

[0110] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A structural member, characterized in that: include: A structural member body, comprising an insulating member and carbon fiber filaments, wherein the carbon fiber filaments are embedded in the insulating member and a portion of the carbon fiber filaments are exposed outside the insulating member; as well as, A conductive portion, at least a portion of which is in contact with and electrically connected to the exposed carbon fiber filaments.

2. The structural member according to claim 1, characterized in that: A groove is provided on the surface of the structural member body, and a portion of the carbon fiber filaments is exposed in the groove; At least a portion of the conductive portion is disposed in the groove of the structural component body, and the conductive portion is in contact with and electrically connected to the carbon fiber filaments exposed in the groove.

3. The structural member according to claim 2, characterized in that: The carbon fiber filaments are provided in plurality; the groove comprises a groove wall, a groove bottom, and a groove space surrounded by the groove wall and the groove bottom; At least one of the groove wall, the groove bottom and the groove space is provided with exposed carbon fiber filaments.

4. The structural member according to claim 2, characterized in that: The surface of the structural member body is provided with a plurality of grooves, and the structural member body comprises a first wall surface and a second wall surface connected to each other; A portion of the grooves is disposed on the first wall surface, and another portion of the grooves is disposed on the second wall surface.

5. The structural member according to claim 3, characterized in that: The exposed outer surface of the carbon fiber filament protrudes from the groove bottom, and the conductive part contacts and is electrically connected to the outer surface of the carbon fiber filament protruding from the groove bottom.

6. The structural member according to claim 3, characterized in that: The exposed carbon fiber filaments have a first section surface, the first section surface is flush with the groove wall, and the conductive portion is in contact with and electrically connected to the first section surface of the carbon fiber filaments.

7. The structural member according to claim 3, characterized in that: The exposed carbon fiber filaments have a second section surface, the second section surface is flush with the groove bottom, and the conductive portion is in contact with and electrically connected to the second section surface of the carbon fiber filaments.

8. The structural member according to any one of claims 1 to 7, characterized in that: The conductive part includes a conductive layer and a primer layer; The bottom layer is arranged in the groove of the structural member body, and the bottom layer is in contact with and electrically connected to the exposed carbon fiber filaments; The conductive layer is filled in the groove of the structural component body, and the conductive layer is in contact with and electrically connected to the base layer.

9. The structural member according to claim 8, characterized in that: The exposed carbon fiber filaments are provided with an uneven surface, and the groove comprises a groove wall and a groove bottom; The primer layer is plated on the groove wall and the groove bottom, and is in contact with the uneven surface of the exposed carbon fiber filaments.

10. The structural member according to claim 8, characterized in that: The conductive layer and the primer layer are fused at their interfaces to form an alloy.

11. The structural member according to claim 8, characterized in that The material of the conductive layer includes tin, bismuth, gallium or indium.

12. The structural member according to claim 8, characterized in that The material of the primer layer includes chromium, nickel, titanium, copper, iron or aluminum.

13. The structural member according to any one of claims 1 to 12, characterized in that: The structural member also includes a connecting member; The connecting member is disposed on the conductive portion and is electrically connected to the conductive portion.

14. The structural member according to claim 13, characterized in that The connecting piece includes a soldering pad, a conductive spring or a conductive silicone.

15. The structural member according to any one of claims 1 to 14, characterized in that: The structural member further comprises a metal coating; The metal plating layer is plated on the outer surface of the structural component body, and the conductive part is electrically connected to the metal plating layer.

16. The structural member according to any one of claims 1 to 14, characterized in that: The structural member further comprises graphene, and the graphene is embedded in the insulating member; The graphene is in contact with the carbon fiber filaments.

17. The structural member according to any one of claims 1 to 16, characterized in that: The structural member is a middle frame or a back cover of an electronic device.

18. An electronic device, characterized in that: include: Circuit boards; The structural member according to any one of claims 1 to 17; as well as, A connecting member is electrically connected between the circuit board and the structural member.

19. The electronic device according to claim 18, characterized in that: The connecting member is disposed on the circuit board and is electrically connected to the circuit board; The connecting member on the circuit board is electrically connected to the conductive portion on the structural member.

20. The electronic device according to claim 18, characterized in that The connecting member is disposed on the structural member and is electrically connected to the conductive part; The circuit board is electrically connected to the connecting member on the structural member.

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