Electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric film sensor

Abstract

The invention discloses an electrode pin welding machine for a substrate magnetron sputtering deposition piezoelectric film sensor, relates to the technical field of welding machines, and aims to solve the problems that the hot melting effect of a welding material is poor, the welding material cannot be fully melted and the welding quality of a pin is reduced due to contact dislocation between the welding material and a welding heating head. According to the electrode pin welding machine for the substrate magnetron sputtering deposition piezoelectric film sensor, the guide groove of the heat conduction head is matched with the arc cushion block, when a welding wire is conducted to the position of the heat conduction head, a welding material enters the guide groove and makes direct contact with the heat conduction head for hot melting, and meanwhile the guide groove limits the welding material; and when the welding material is in contact with the conical surface of the heat conduction head, a gap exists between the front end of the material and the conical surface of the heat conduction head, so that the hot melting effect is poor.

Description

Technical Field

[0001] The invention relates to the technical field of welding machines, in particular to an electrode pin welding machine for a substrate magnetron sputtering deposited piezoelectric film sensor. Background Art

[0002] At present, the sensor electrode pin welding machine is a device specially used to weld and connect the electrode pins of the sensor with other electronic components or circuit boards. Through precise welding operations, it ensures that the electrode pins form reliable electrical and mechanical connections with the corresponding connection parts to ensure that the sensor can work normally. It is widely used in industries that require the use of sensors, such as electronic manufacturing, automotive electronics, and medical equipment. Common welding equipment uses a soldering iron tip to heat and melt the solder to connect the electrode pins and the welding parts. By controlling parameters such as the temperature, contact time, and pressure of the soldering iron tip, a good welding effect can be achieved; When welding the electrode pins, the contact between the welding material and the welding heating head is misaligned, resulting in poor hot melting effect of the welding material, inability to fully melt the welding material, and reducing the welding quality of the pins. Summary of the invention

[0003] To achieve the above objectives, the present invention is implemented through the following technical solutions: an electrode pin welding machine for a substrate magnetron sputtering deposited piezoelectric thin film sensor, comprising: A frame, an electric control box is fixedly installed on the top of the frame, and a mechanical arm is fixedly installed inside the frame; A welding mechanism, wherein the welding mechanism is installed at the end of the robot arm, and a wire guide mechanism is installed on the top of the welding mechanism; A fixing mechanism, which is fixedly mounted at the center of the top of the frame, and is used to fix the circuit board after the electrodes are pre-fixed; Wherein, the welding mechanism comprises a support block, the support block is fixedly connected to the end of the mechanical arm, and a sleeve plate is fixedly installed on the outer side of the support block, a welding gun is fixedly installed on the inner wall of the sleeve plate, and a heat conducting head is fixedly installed on the bottom end of the welding gun, the heat conducting head is a conical head with an outer diameter gradually decreasing from top to bottom, and a guide groove is opened on the outer side of the heat conducting head, and the guide groove of the heat conducting head cooperates with the arc pad block, when the welding wire is conducted to the position of the heat conducting head, the welding material enters the guide groove and directly contacts with the heat conducting head for hot melting, and at the same time, the guide groove limits the welding material to avoid deformation of the welding material during conduction, and when contacting with the conical surface of the heat conducting head, there is a gap between the front end of the material and the conical surface of the heat conducting head, resulting in poor hot melting effect. The guide groove of the heat conducting head gradually decreases in width from top to bottom, and an arc pad is fixedly installed at the guide groove of the heat conducting head. The arc pad cooperates with the guide groove of the heat conducting head to limit the material conducted to the heat conducting head at the top of the guide groove, thereby limiting the upward deformation and movement of the material when the hot melting speed is lower than the conduction speed, thereby avoiding the melting position of the material being too high, resulting in a large distance from the welding position, and making it impossible for the melted material to accurately fall into the welding position, resulting in reduced welding quality. The arc pad is installed on the top of the guide groove, and a connecting plate is fixedly installed on the bottom of the support block, and a fixing tube is fixedly installed on the inner wall of the connecting plate, and a wire guide tube is fixedly installed on the inner wall of the fixing tube, and the bottom end opening of the wire guide tube corresponds to the guide groove of the heat conducting head.

[0004] Preferably, the wire guiding mechanism comprises a support plate, the support plate is fixedly mounted on the top of the support block, and a motor is fixedly mounted on the outer side of the support plate, one end of the support plate away from the motor is fixedly mounted by a fixed shaft, and a wheel frame is fixedly mounted on the outer side of the support plate away from the fixed shaft, a connecting pipe is fixedly mounted on the outer side of the wheel frame, and one end of the connecting pipe away from the wheel frame is fixedly connected to the top of the wire guiding tube, and a wire guiding wheel is rotatably mounted on the inner wall of the wheel frame, and a concave annular groove is opened at the center position of the outer side of the wire guiding wheel, and the concave annular groove of the wire guiding wheel is used to limit the conducted wire-shaped welding material, so that the material passes through the wire guiding wheel from the gap position of the concave annular groove between the wire guiding wheels, thereby limiting the conduction direction of the material to avoid deviation of the conduction direction, resulting in deformation and tortuosity of the material and inability to be smoothly transported to the welding position, resulting in inability to complete the welding.

[0005] Preferably, the wire guide wheel is rotatably connected to the inner wall of the wheel frame through an axle rod, and the wire guide wheel is symmetrically installed along the center position of the axis of the wheel frame, and a driving shaft is rotatably installed on the inner wall of the support plate, one end of the driving shaft is fixedly connected to the output end of the motor, and a wire guide roller is fixedly installed on the outer side of the driving shaft, and stripes are evenly opened on the outer side of the wire guide roller, and the wire guide roller cooperates with the driven roller to make the material bend between the wire guide roller and the driven roller, so that the friction between the wire guide roller and the material through the stripes on its surface and the bending of the materials on both sides is increased, so that the wire guide roller accurately drives the material to conduct, and the wire guide roller is located between the fixed shaft and the wheel frame, and driven rollers are installed obliquely below both sides of the wire guide roller, and the driven roller is rotatably connected to the inner wall of the support plate through a rod.

[0006] Preferably, the fixing mechanism comprises a support frame, guide rails are fixedly installed on both sides of the top of the support frame, a sliding frame is slidably installed on the support frame through the guide rails, a hollow slot plate is fixedly installed on the top of the sliding frame, a through slot is symmetrically opened on the top of the hollow slot plate, a side plate is fixedly installed on the top of the hollow slot plate, the side plates are symmetrically installed on both sides of the through slot along the axis center position of the through slot, and slide grooves are opened on the tops of the opposite surfaces of the side plates, sliding beams are slidably installed between the side plates through the slide grooves, the sliding beams are symmetrically installed between the side plates, fixing plates are fixedly installed at both ends of the opposite surfaces of the side plates, fixing rods are fixedly installed between the fixing plates, the fixing rods are symmetrically installed along the axis center position of the fixing plates, and the fixing The outer side of the fixed rod is slidably adapted to the inner wall of the sliding beam, and a spring is fixedly installed between the sliding beams, and a slot plate is fixedly installed on the top of the sliding beam. A strip groove is opened on the top of the inner wall of the slot plate, and a rubber strip is fixedly installed in the strip groove of the slot plate. Side pressure blocks are rotatably installed on both sides of the top of the sliding beam, and one end of the side pressure block is tilted. After the circuit board is clamped and fixed, the side pressure block is rotated to limit the side pressure blocks to press and limit the two sides of the top of the circuit board, so as to avoid deformation and bending of the circuit board due to the clamping force during the process of clamping and fixing the circuit board, causing the motor pins to tilt, affecting the positioning accuracy during welding, causing the welding position to be wrong and damaging the circuit board, and the side pressure block is tilted upward at one end away from the sliding beam.

[0007] The present invention provides an electrode pin welding machine for a substrate magnetron sputtering deposited piezoelectric film sensor. It has the following beneficial effects: 1. The electrode pin welding machine of the substrate magnetron sputtering deposited piezoelectric thin film sensor cooperates with the guide groove of the thermal head and the arc pad. When the welding wire is conducted to the position of the thermal head, the welding material enters the guide groove and directly contacts the thermal head for hot melting. At the same time, the guide groove restricts the welding material to avoid deformation of the welding material during conduction. When contacting the conical surface of the thermal head, there is a gap between the front end of the guide wire and the conical surface of the thermal head, resulting in a poor hot melting effect.

[0008] 2. The electrode pin welding machine of the substrate magnetron sputtering deposited piezoelectric thin film sensor cooperates with the guide groove of the thermal conductive head through the arc pad block, so that the arc pad block at the top of the guide groove restricts the material conducted to the thermal conductive head, thereby restricting the upward deformation and movement of the material when the hot melting speed is lower than the conduction speed, avoiding the material melting position being too high, resulting in a large distance from the welding position, making it impossible for the melted material to fall accurately into the welding position, resulting in reduced welding quality.

[0009] 3. The electrode pin welding machine of the substrate magnetron sputtering deposited piezoelectric thin film sensor limits the conducted wire-shaped welding material through the concave annular groove of the wire guide wheel, so that the material passes through the wire guide wheel from the gap position of the concave annular groove between the wire guide wheels, and limits the conduction direction of the material to avoid the conduction direction from being offset, which causes the material to be deformed and tortuous and cannot be smoothly transported to the welding position, resulting in the inability to complete the welding.

[0010] 4. The electrode pin welding machine of the substrate magnetron sputtering deposited piezoelectric thin film sensor cooperates with the guide roller and the driven roller to make the material bend between the guide roller and the driven roller, so that the friction between the stripes on the guide roller's surface and the material, combined with the bending of the materials on both sides, increases the friction between the material and the guide roller, so that the guide roller can accurately drive the material to conduct.

[0011] 5. The electrode pin welding machine of the substrate magnetron sputtering deposited piezoelectric thin film sensor is designed to tilt the side pressure block at one end. After the circuit board is clamped and fixed, the side pressure block is rotated to clamp and limit the two sides of the top of the circuit board to avoid deformation and bending of the circuit board due to the clamping force during the clamping and fixing process, causing the motor pin to tilt, affecting the positioning accuracy during welding, causing the welding position to be wrong and damaging the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the external structure of an electrode pin welding machine for a substrate magnetron sputtering deposited piezoelectric thin film sensor according to the present invention; Figure 2 This is a side view of a substrate magnetron sputtering deposited piezoelectric film sensor structure of the present invention; Figure 3 It is a schematic diagram of the welding mechanism structure of the present invention; Figure 4 It is a side view of the welding mechanism structure of the present invention; Figure 5 It is a schematic diagram of the position structure of the welding mechanism and the wire guide mechanism of the present invention; Figure 6 It is a schematic diagram of the structure of the guide wire mechanism of the present invention; Figure 7 It is a side view of the guide wire mechanism structure of the present invention; Figure 8It is a structural schematic diagram of the fixing mechanism of the present invention; Fig. 9 It is a partial structural schematic diagram of the fixing mechanism of the present invention.

[0013] In the figure: 1, frame; 2, welding mechanism; 3, wire guide mechanism; 4, fixing mechanism; 5, electric control box; 6, mechanical arm; 21, support block; 22, connecting plate; 23, fixed pipe; 24, sleeve plate; 25, welding gun; 26, wire guide tube; 27, heat conduction head; 28, arc pad; 31, support plate; 32, connecting pipe; 33, motor; 34, wheel frame; 35, wire guide wheel; 36, fixed shaft; 37, driving shaft; 38, driven roller; 39, wire guide roller; 401, support frame; 402, guide rail; 403, sliding frame; 404, empty slot plate; 405, side plate; 406, sliding beam; 407, rubber strip; 408, slot plate; 409, fixing plate; 410, fixing rod; 411, spring; 412, side pressure block. DETAILED DESCRIPTION

[0014] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0015] The first embodiment, as Figures 1 to 5 As shown, the present invention provides a technical solution: an electrode pin welding machine for a substrate magnetron sputtering deposition piezoelectric film sensor, comprising: A frame 1, an electric control box 5 is fixedly installed on the top of the frame 1, and a mechanical arm 6 is fixedly installed inside the frame 1; A welding mechanism 2, which is installed at the end of a mechanical arm 6, and a wire guide mechanism 3 is installed on the top of the welding mechanism 2; A fixing mechanism 4, which is fixedly mounted at the center of the top of the frame 1, and is used to fix the circuit board after the electrodes are pre-fixed; Among them, the welding mechanism 2 includes a support block 21, which is fixedly connected to the end of the mechanical arm 6, and a sleeve plate 24 is fixedly installed on the outer side of the support block 21, a welding gun 25 is fixedly installed on the inner wall of the sleeve plate 24, and a heat-conducting head 27 is fixedly installed on the bottom end of the welding gun 25. The circuit is connected to the welding gun 25, so that the welding gun 25 heats the heat-conducting head 27, so that the heat-conducting head 27 has a higher temperature. When the conical tip of the heat-conducting head 27 is close to the position of the electrode pin, the wire guide mechanism 3 drives the welding material from the top of the wire guide tube 26 into the inside of the wire guide tube 26, and then guides the wire through the wire guide tube 26, so that the wire guide tube 26 guides the welding material in the direction of the heat-conducting head 27, so that the welding material contacts the heat-conducting head 27, and the welding material is heated by the heat-conducting head 27 to melt it. When the welding material contacts the heat-conducting head 27, the welding material moves to the guide groove position of the heat-conducting head 27, and the heat-conducting head 27 is a gradually decreasing outer diameter from top to bottom. A small conical head is provided, and a guide groove is provided on the outer side of the heat conducting head 27, the guide groove of the heat conducting head 27 gradually decreases in width from top to bottom, and an arc pad 28 is fixedly installed at the guide groove of the heat conducting head 27, and the arc pad 28 is installed at the top of the guide groove. A connecting plate 22 is fixedly installed at the bottom of the support block 21, and a fixed tube 23 is fixedly installed on the inner wall of the connecting plate 22. The guide groove of the heat conducting head 27 cooperates with the arc pad 28. After the welding material enters the guide groove position, the arc pad 28 cooperates with the guide groove to limit the conduction of the welding material. When the amount of welding material conduction is large, the welding material is restricted to prevent it from moving upward, so that the welding material is melted in the guide groove, and under the gravity of the molten material itself and the characteristics of the guide groove decreasing in width from top to bottom, the molten material flows downward along the conical shape of the heat conducting head 27 to weld the electrode pin to the circuit board, and a wire guide tube 26 is fixedly installed on the inner wall of the fixed tube 23, and the bottom end opening of the wire guide tube 26 corresponds to the guide groove of the heat conducting head 27.

[0016] The second embodiment is based on the first embodiment. Figure 6 to Figure 7 As shown, the wire guiding mechanism 3 includes a support plate 31, which is fixedly mounted on the top of the support block 21, and a motor 33 is fixedly mounted on the outer side of the support plate 31, one end of the support plate 31 away from the motor 33 is fixedly mounted by a fixed shaft 36, and one end of the outer side of the support plate 31 away from the fixed shaft 36 is fixedly mounted with a wheel frame 34, and a connecting pipe 32 is fixedly mounted on the outer side of the wheel frame 34, and the welding wire coil material is fixed by the fixed shaft 36, so that one end of the material passes through the guide roller 39 and the driven roller 38, and the material enters the wheel frame 34 after passing through, so that the guide roller 35 symmetrically mounted in the wheel frame 34 restricts the material, so that the material finally enters the connecting pipe 32, and is guided by the connecting pipe 32 to be conducted and transported to the welding mechanism 2, and the end of the connecting pipe 32 away from the wheel frame 34 is fixedly connected to the top of the guide tube 26, and the inner wall of the wheel frame 34 is rotatably mounted with a guide roller 35, and an inner concave annular groove is provided at the center position of the outer side of the guide roller 35.

[0017] The wire guide wheel 35 is rotatably connected to the inner wall of the wheel frame 34 through a shaft rod, and the wire guide wheel 35 is symmetrically installed along the center position of the axis of the wheel frame 34. A driving shaft 37 is rotatably installed on the inner wall of the support plate 31. One end of the driving shaft 37 is fixedly connected to the output end of the motor 33. A wire guide roller 39 is fixedly installed on the outer side of the driving shaft 37. The outer side of the wire guide roller 39 is evenly provided with stripes. During transportation, the driving shaft 37 is driven by the motor 33 to rotate, so that the driving shaft 37 drives the wire guide roller 39 to rotate when rotating. The friction between the wire guide roller 39 and the material is utilized to cooperate with the driven roller 38 to conduct the material to the gap between the wire guide wheels 35. The wire guide roller 39 is located between the fixed shaft 36 and the wheel frame 34. Driven rollers 38 are installed obliquely below both sides of the wire guide roller 39. The driven roller 38 is rotatably connected to the inner wall of the support plate 31 through a rod.

[0018] The third embodiment is based on the first and second embodiments. Figures 8 to 9 As shown, the fixing mechanism 4 includes a support frame 401, guide rails 402 are fixedly installed on both sides of the top of the support frame 401, and a sliding frame 403 is slidably installed on the support frame 401 through the guide rails 402, and an empty slot plate 404 is fixedly installed on the top of the sliding frame 403, and through slots are symmetrically opened on the top of the empty slot plate 404. The worker puts the circuit board pre-fixed with the electrode into the empty slot of the empty slot plate 404, and drives the sliding beams 406 on both sides to approach the center position through the spring 411, and fixes the circuit board during the movement by the sliding beam 406, and at the same time, the rubber strips 407 in the grooves of the slot plate 408 are used to press the edges of the two ends of the top of the circuit board to limit the movement of the circuit board, and the top of the empty slot plate 404 is fixedly installed with side plates 405, and the side plates 405 are symmetrically installed on both sides of the through slot along the center position of the axis of the through slot, and sliding grooves are opened on the tops of the opposite surfaces of the side plates 405.

[0019] A sliding beam 406 is slidably installed between the side plates 405 through a slide groove, and the sliding beam 406 is symmetrically installed between the side plates 405. Fixed plates 409 are fixedly installed at both ends of the opposite surfaces of the side plates 405. A fixed rod 410 is fixedly installed between the fixed plates 409. The fixed rod 410 is symmetrically installed along the center position of the axis of the fixed plate 409, and the outer side of the fixed rod 410 is slidably adapted to the inner wall of the sliding beam 406. A spring 411 is fixedly installed between the sliding beams 406, and a groove plate 408 is fixedly installed on the top of the sliding beam 406. The sliding beams 406 on both sides are connected to the circuit board at both ends through the springs. 411 applies the same force to make the circuit board in the center of the empty slot and fix the circuit board in position. Then the worker rotates the side pressure blocks 412 on both sides of the sliding beam 406 to make the side pressure blocks 412 tilt up away from one end of the sliding beam 406 to restrict both sides of the circuit board so that the circuit board is fixed flatly in the center of the empty slot. A groove is provided on the top of the inner wall of the slot plate 408, and rubber strips 407 are fixedly installed in the grooves of the slot plate 408. Side pressure blocks 412 are rotatably installed on both sides of the top of the sliding beam 406, and the side pressure blocks 412 tilt upward away from one end of the sliding beam 406.

[0020] When in use, the worker puts the circuit board pre-fixed with the electrode into the fixing mechanism 4 for fixing and positioning, and then controls the robot arm 6 through the electric control box 5, so that the robot arm 6 drives the welding mechanism 2 to approach the electrode pin welding position, and then the wire guide mechanism 3 drives the welding material to approach the welding position, so that the welding mechanism 2 heats the welding material to melt it at the electrode pin welding position, and welds the pin.

[0021] In the fixing mechanism 4, the worker puts the circuit board pre-fixed with the electrode into the empty slot of the empty slot plate 404, and drives the sliding beams 406 on both sides to approach the center position through the spring 411, and fixes the circuit board during the movement by the sliding beam 406. At the same time, the rubber strip 407 in the slot of the slot plate 408 is used to press the edges at both ends of the top of the circuit board to limit the movement of the circuit board. At the same time, the sliding beams 406 on both sides apply the same force to both ends of the circuit board through the spring 411, so that the circuit board is in the center position of the empty slot, and the circuit board is positioned and fixed. Then the worker rotates the side pressure blocks 412 on both sides of the sliding beam 406, so that the side pressure blocks 412 are tilted and bent away from one end of the sliding beam 406 to limit the two sides of the circuit board, so that the circuit board is fixed flatly in the center position of the empty slot.

[0022] In the welding mechanism 2, the circuit is connected with the welding gun 25, so that the welding gun 25 heats the heat-conducting head 27, so that the heat-conducting head 27 has a higher temperature. When the conical tip of the heat-conducting head 27 is close to the position of the electrode pin, the wire guide mechanism 3 drives the welding material from the top of the wire guide tube 26 into the inside of the wire guide tube 26, and then guides the wire through the wire guide tube 26, so that the wire guide tube 26 guides the welding material in the direction of the heat-conducting head 27, so that the welding material contacts the heat-conducting head 27, and the welding material is heated by the heat-conducting head 27 to melt it. When the material contacts the thermal conductive head 27, the welding material moves to the guide groove position of the thermal conductive head 27, and cooperates with the arc pad 28 through the guide groove of the thermal conductive head 27. After the welding material enters the guide groove position, the arc pad 28 cooperates with the guide groove to limit the conduction of the welding material. When the amount of welding material conduction is large, the welding material is restricted to prevent it from moving upward, so that the welding material is melted in the guide groove, and under the gravity of the molten material itself and the characteristic that the width of the guide groove decreases from top to bottom, the molten material flows downward along the conical shape of the thermal conductive head 27 to weld the electrode pins to the circuit board.

[0023] In the wire guide mechanism 3, the welding wire roll material is fixed by the fixed shaft 36, so that one end of the material passes through the wire guide roller 39 and the driven roller 38, and then enters the wheel frame 34, so that the wire guide wheel 35 symmetrically installed in the wheel frame 34 restricts the material, so that the material finally enters the connecting pipe 32, and is guided by the connecting pipe 32 to be conducted and transported to the welding mechanism 2. During transportation, the driving shaft 37 is driven to rotate by the motor 33, so that the driving shaft 37 drives the wire guide roller 39 to rotate when rotating, and utilizes the friction between the wire guide roller 39 and the material to cooperate with the driven roller 38 to conduct the material to the gap between the wire guide wheels 35.

[0024] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. An electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensors, characterized in that: include: A frame (1), an electric control box (5) being fixedly mounted on the top of the frame (1), and a mechanical arm (6) being fixedly mounted inside the frame (1); A welding mechanism (2), the welding mechanism (2) being mounted at the end of a mechanical arm (6), and a wire guide mechanism (3) being mounted on the top of the welding mechanism (2); A fixing mechanism (4), the fixing mechanism (4) being fixedly mounted at a central position on the top of the frame (1), the fixing mechanism (4) being used to fix the circuit board after the electrodes are pre-fixed; The welding mechanism (2) comprises a support block (21), the support block (21) is fixedly connected to the end of the robot arm (6), and a sleeve plate (24) is fixedly mounted on the outer side of the support block (21), a welding gun (25) is fixedly mounted on the inner wall of the sleeve plate (24), a heat conducting head (27) is fixedly mounted on the bottom end of the welding gun (25), the heat conducting head (27) is a conical head with an outer diameter gradually decreasing from top to bottom, a guide groove is provided on the outer side of the heat conducting head (27), the guide groove of the heat conducting head (27) has a width gradually decreasing from top to bottom, and an arc pad (28) is fixedly mounted at the guide groove of the heat conducting head (27), and the arc pad (28) is mounted on the top of the guide groove.

2. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 1, characterized in that: A connecting plate (22) is fixedly mounted on the bottom of the support block (21), a fixing tube (23) is fixedly mounted on the inner wall of the connecting plate (22), a wire guide tube (26) is fixedly mounted on the inner wall of the fixing tube (23), and a bottom end opening of the wire guide tube (26) corresponds to a guide groove of the heat conducting head (27).

3. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 2, characterized in that: The wire guide mechanism (3) comprises a support plate (31), the support plate (31) being fixedly mounted on the top of the support block (21), and a motor (33) being fixedly mounted on the outer side of the support plate (31), one end of the support plate (31) away from the motor (33) being fixedly mounted by a fixed shaft (36), and one end of the support plate (31) away from the fixed shaft (36) being fixedly mounted by a wheel frame (34).

4. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 3, characterized in that: A connecting pipe (32) is fixedly mounted on the outer side of the wheel frame (34); one end of the connecting pipe (32) away from the wheel frame (34) is fixedly connected to the top end of the wire guide tube (26); a wire guide wheel (35) is rotatably mounted on the inner wall of the wheel frame (34); and a concave annular groove is provided at the center of the outer side of the wire guide wheel (35).

5. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 4, characterized in that: The guide wire wheel (35) is rotatably connected to the inner wall of the wheel frame (34) via a shaft rod, and the guide wire wheel (35) is symmetrically installed along the center position of the axis of the wheel frame (34). A driving shaft (37) is rotatably installed on the inner wall of the support plate (31), and one end of the driving shaft (37) is fixedly connected to the output end of the motor (33).

6. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 5, characterized in that: A guide wire roller (39) is fixedly mounted on the outer side of the driving shaft (37), and stripes are evenly arranged on the outer side of the guide wire roller (39). The guide wire roller (39) is located between the fixed shaft (36) and the wheel frame (34). Driven rollers (38) are installed obliquely below both sides of the guide wire roller (39), and the driven rollers (38) are rotatably connected to the inner wall of the support plate (31) through a rod.

7. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 6, characterized in that: The fixing mechanism (4) comprises a support frame (401), guide rails (402) are fixedly mounted on both sides of the top of the support frame (401), a sliding frame (403) is slidably mounted on the support frame (401) via the guide rails (402), a hollow slot plate (404) is fixedly mounted on the top of the sliding frame (403), and through slots are symmetrically formed on the top of the hollow slot plate (404).

8. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 7, characterized in that: A side plate (405) is fixedly mounted on the top of the hollow slot plate (404); the side plates (405) are symmetrically mounted on both sides of the through slot along the center position of the axis of the through slot, and sliding grooves are provided on the tops of the opposite surfaces of the side plates (405).

9. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 8, characterized in that: A sliding beam (406) is slidably installed between the side plates (405) via a sliding groove. The sliding beam (406) is symmetrically installed between the side plates (405). Fixed plates (409) are fixedly installed at both ends of the opposite surfaces of the side plates (405). A fixed rod (410) is fixedly installed between the fixed plates (409). The fixed rod (410) is symmetrically installed along the center position of the axis of the fixed plate (409), and the outer side of the fixed rod (410) is slidably adapted to the inner wall of the sliding beam (406). A spring (411) is fixedly installed between the sliding beams (406).

10. The electrode pin welding machine for substrate magnetron sputtering deposition piezoelectric thin film sensor according to claim 9, characterized in that: A groove plate (408) is fixedly mounted on the top of the sliding beam (406), a groove is formed on the top of the inner wall of the groove plate (408), and a rubber strip (407) is fixedly mounted in the groove of the groove plate (408), and side pressure blocks (412) are rotatably mounted on both sides of the top of the sliding beam (406), and one end of the side pressure block (412) away from the sliding beam (406) is tilted upward.

Images