A laser etching processing control method for watch parts

Abstract

The present application relates to the field of laser etching technology, and specifically to a laser etching processing control method for watch parts, the method comprising: the present application determines the possible degree of heat accumulation by analyzing the distribution of workpieces, and then obtains the thermal performance values ​​of different areas according to the possible degree of heat accumulation, and then obtains the limiting coefficient of the processing path through the thermal performance values, and calculates the output value of the objective function based on the avoidance coefficient of each workpiece area; based on the output value of the objective function, a planned etching path is obtained in combination with a path planning algorithm; laser etching of watch parts is performed through the planned etching path; by accurately planning the movement trajectory of the laser beam, the idle time is reduced, and repeated etching is avoided, thereby improving the processing accuracy, efficiency and quality of watch parts, reducing material waste, ensuring the clarity and consistency of the etching pattern, and improving the aesthetics and functionality of the product.

Description

Technical Field

[0001] The present application relates to the technical field of laser etching, and in particular to a method for controlling laser etching processing of watch parts. Background Art

[0002] As consumers' demands for personalized, artistic and functional products continue to increase, the processing accuracy of watch parts and components in the traditional craft field of watch manufacturing continues to improve. Laser etching technology, as an advanced non-contact processing method, has gradually become an important breakthrough in the field of watch parts and components processing with its advantages of high precision, high flexibility and non-destructive processing of materials. Through the precise control of the laser beam, it is possible to achieve fine engraving of complex patterns in a very small space, which not only enhances the aesthetic value of watches, but also provides a new way to achieve functional identification, anti-counterfeiting technology, etc.

[0003] During the laser etching process, due to the arrangement of parts and components, some areas may be repeatedly heated and cut, resulting in abnormal temperatures and heat accumulation, which will affect the processing accuracy of parts and components. Therefore, the processing path needs to be planned to reduce the impact of heat accumulation. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a method for controlling laser etching processing of watch parts to solve the existing problems.

[0005] A laser etching processing control method for watch parts in the present application adopts the following technical solution:

[0006] An embodiment of the present application provides a method for controlling laser etching processing of watch parts, the method comprising the following steps:

[0007] Obtain each workpiece area on the watch parts plate to be etched;

[0008] Obtaining adjacent workpiece regions of each workpiece region based on the distance between each workpiece region and other workpiece regions; calculating the possible degree of heat accumulation of each workpiece region based on the distance between each workpiece region and the corresponding adjacent workpiece region, combined with the area of ​​each workpiece region and the laser energy of the laser beam during etching;

[0009] Based on the difference between the possible degree of heat accumulation of each workpiece area and the corresponding adjacent workpiece area, combined with the distance between each workpiece area and the corresponding adjacent workpiece area, the thermal performance value of each workpiece area is calculated; based on the difference between the thermal performance values ​​of each workpiece area and the corresponding adjacent workpiece area, the avoidance coefficient of each workpiece area is constructed;

[0010] Determine the objective function of the path planning algorithm based on the avoidance coefficient of each workpiece area; obtain the planned etching path based on the output value of the objective function in combination with the path planning algorithm;

[0011] Laser etching of watch parts using planned etching paths.

[0012] In one embodiment, the process of acquiring the adjacent workpiece regions is as follows:

[0013] The neighborhood of each workpiece region is obtained based on the neighborhood of each pixel point on the edge line of each workpiece region; and the adjacent workpiece region of each workpiece region is determined based on the neighborhood of each workpiece region.

[0014] In one embodiment, the process of obtaining the neighborhood of each workpiece region is as follows:

[0015] A circle is drawn with each pixel point on the edge line of each workpiece area as the center and a preset radius to obtain a circular area as the neighborhood of each pixel point on the edge line, and the area occupied by the neighborhood of all pixel points on the edge line is taken as the neighborhood of each workpiece area.

[0016] In one embodiment, the process of acquiring the adjacent workpiece regions of each workpiece region is as follows:

[0017] If, in addition to the current workpiece region, there are other workpiece regions that intersect with the neighborhood of the current workpiece region, then the other workpiece regions are regarded as respective adjacent workpiece regions of the current workpiece region.

[0018] In one embodiment, the expression for the possible degree of heat accumulation is:

[0019] , where Indicates the possible degree of heat accumulation in workpiece area a; represents the area of ​​workpiece region a; n represents the number of adjacent workpiece regions of workpiece region a; represents the shortest distance between the edge of workpiece region a and its bth adjacent workpiece region; It represents the laser energy of the laser beam when etching the workpiece area a.

[0020] In one embodiment, the determination of the thermal performance value includes:

[0021] Calculating the difference between the possible degree of heat accumulation of each adjacent workpiece region of any workpiece region and the any workpiece region, and calculating the result of an exponential function with a natural constant as the base and the difference as the exponent;

[0022] Based on the calculation result of the exponential function, the shortest distance between any workpiece region and the edges of each adjacent workpiece region, and the possible degree of heat accumulation in any workpiece region, the thermal performance value of any workpiece region is obtained.

[0023] In one embodiment, the process of obtaining the thermal performance value of any workpiece area is as follows:

[0024] For each adjacent workpiece region of any one of the workpiece regions, calculating a ratio of a calculation result of the exponential function of the adjacent workpiece region to the shortest distance;

[0025] Calculate the average of the ratios of all adjacent workpiece regions of any workpiece region; and use the product of the average and the possible degree of heat accumulation of any workpiece region as the thermal performance value of any workpiece region.

[0026] In one embodiment, the avoidance coefficient is expressed as:

[0027] , where represents the avoidance coefficient of workpiece area a, represents the thermal performance value of workpiece area a, n represents the number of adjacent workpiece areas of workpiece area a, represents the thermal performance value of the bth adjacent workpiece area of ​​workpiece area a, It is an exponential function with the natural constant e as its base.

[0028] In one embodiment, the process of obtaining the output value of the objective function is:

[0029] The product of the area of ​​each workpiece region and the avoidance coefficient is calculated and recorded as the first product; the average value of the first product of all workpiece regions is taken as the output value of the objective function.

[0030] In one embodiment, the output value of the objective function is combined with a path planning algorithm to obtain a planned etching path, specifically:

[0031] An image composed of all workpiece areas on the plate is used as the input of the path planning algorithm, wherein the output value of the objective function guides the selection of the path planning algorithm, plans the laser etching processing path, and outputs the planned etching path.

[0032] This application has at least the following beneficial effects:

[0033] The present application determines the possible degree of heat accumulation by analyzing the distribution of workpieces, and then obtains the thermal performance values ​​of different areas according to the possible degree of heat accumulation, and then obtains the limitation coefficient of the processing path through the thermal performance values, and calculates the output value of the objective function based on the avoidance coefficient of each workpiece area; based on the output value of the objective function, a planned etching path is obtained in combination with a path planning algorithm; laser etching of watch parts is performed through the planned etching path; the problem of abnormal temperature and heat accumulation caused by repeated heating and cutting in some areas, which affects the processing accuracy of parts, is avoided; by accurately planning the movement trajectory of the laser beam, the idle time is reduced and repeated etching is avoided, thereby improving the processing accuracy, efficiency and quality of watch parts, reducing material waste, ensuring the clarity and consistency of the etching pattern, and improving the aesthetics and functionality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A flowchart of a laser etching processing control method for watch parts provided in this application;

[0036] Figure 2 Schematic diagram of the acquisition process of adjacent workpiece areas. DETAILED DESCRIPTION

[0037] In order to further explain the technical means and effects adopted by the present application to achieve the predetermined invention purpose, the following is a detailed description of a laser etching processing control method for watch parts proposed in the present application, its specific implementation method, structure, features and effects, in combination with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "another embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics in one or more embodiments may be combined in any suitable form.

[0038] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0039] The specific scheme of the laser etching processing control method for watch parts provided by the present application is described in detail below with reference to the accompanying drawings.

[0040] An embodiment of the present application provides a method for controlling laser etching processing of watch parts.

[0041] Specifically, a laser etching processing control method for watch parts is provided as follows. Figure 1 , the method comprises the following steps:

[0042] Step S1, obtaining each workpiece area on the watch component plate to be etched.

[0043] The main purpose of this application is to plan the path in the process of watch parts processing. Therefore, the drawings of watch parts processing are first obtained, and then the drawings are input into the control system of the laser etcher to read the processing drawings of the parts to be processed. The areas of each watch parts in the processing drawings are the workpiece areas. According to the purpose of the watch parts, suitable plates such as metal, plastic, ceramic, etc. are selected for subsequent laser etching.

[0044] Step S2, obtaining the adjacent workpiece area of ​​each workpiece area based on the distance between each workpiece area and other workpiece areas; calculating the possible degree of heat accumulation of each workpiece area based on the distance between each workpiece area and the corresponding adjacent workpiece area, combined with the area of ​​each workpiece area and the laser energy of the laser beam during etching.

[0045] Laser etching of watch parts is a technology that uses high-energy laser beams to perform precision processing on watch parts. The principle is that after the laser beam is focused, it generates high temperature on the surface of the material, causing the material to melt or vaporize locally, thereby achieving the etching of patterns, text or complex structures. In the process of laser etching parts, the energy distribution and movement path of the laser beam directly affect the accuracy, quality and efficiency of etching. The energy distribution of the laser beam determines the depth and uniformity of the etching area. If the energy distribution is uneven, it may lead to inconsistent etching depth, affecting the dimensional accuracy and surface quality of the parts. In addition, whether the planning of the moving path is reasonable will also directly affect the integrity and accuracy of the etching pattern, avoiding errors caused by path deviation. Therefore, through path planning, the movement sequence and trajectory of the laser beam can be optimized to avoid repeated etching or missing areas, and ensure the integrity and consistency of the etching pattern. Secondly, reasonable path planning can reduce the ineffective movement of the laser beam during empty movement, shorten processing time, and improve production efficiency.

[0046] When planning the laser etching path, it is necessary to analyze the impact of the etching process on the workpiece surface, because if the path is uneven, it may lead to inconsistent energy distribution, and the laser energy received by the local area is too high or too low, resulting in uneven etching depth and increased surface roughness. And if the path of the laser beam is uneven, some areas may receive too much laser energy, causing local overheating, excessive melting or vaporization of the material, and the formation of pits or ablation marks. Therefore, it is necessary to analyze the distribution of the path during the processing process to avoid local heat accumulation due to path repetition, which affects the quality of the workpiece.

[0047] Because there will be scraps in laser etching, that is, the entire workpiece will be cut completely, and the size of the cut will be larger than the actual workpiece size. In a large plate, multiple small workpieces will be cut. In order to save materials and avoid large waste, the layout of the cut parts will be optimized. Then, when the distance between the two workpieces is close, heat will be accumulated during the cutting process. Therefore, the possible degree of heat accumulation can be obtained according to the layout of the workpieces, specifically:

[0048] First, for each workpiece area on the plate, each adjacent workpiece area of ​​the workpiece area is obtained. Taking workpiece area a as an example, the process of obtaining its adjacent workpiece areas is specifically as follows:

[0049] Take the pixel points on the edge line of the workpiece area a when etching as the center and draw a circle with a radius of r=2, and the obtained circular area is used as the neighborhood of each pixel point on the edge line, and the area occupied by the neighborhood of all pixel points on the edge line is used as the neighborhood of the workpiece area a; if, except for the workpiece area a in the plate, the other workpiece areas intersect with the neighborhood of the workpiece area a, that is, there is an intersection area between the other workpiece areas and the neighborhood of the workpiece area a, then the other workpiece areas are used as the adjacent workpiece areas of the workpiece area a. It should be noted that the embodiment of the present application only sets one value of the radius r. In other embodiments of the present application, the implementer can set the value of the radius r according to the actual situation.

[0050] Furthermore, the possible degree of heat accumulation in each workpiece area is calculated, and the expression is:

[0051] , where Indicates the possible degree of heat accumulation in workpiece area a; represents the area of ​​workpiece region a; n represents the number of adjacent workpiece regions of workpiece region a; represents the shortest distance between the edge of workpiece region a and its bth adjacent workpiece region; It represents the laser energy of the laser beam when etching the workpiece area a.

[0052] Because in the process of laser etching, the larger the processing area, the more likely it is to generate heat accumulation, and the more adjacent workpiece areas there are, the more likely it is that the area will be repeatedly heated and cut during the processing, resulting in abnormal temperature and heat accumulation. Therefore, Indicates the possibility of heat accumulation. In order to prevent the waste of raw materials during the processing, as many workpieces as possible will be arranged on a plate. Therefore, the closer the distance between the current workpiece area and the adjacent workpiece area is, the greater the possibility of heat accumulation. And the higher the energy of the processing laser, the more likely it is to cause heat accumulation.

[0053] Step S3, based on the difference between the possible degree of heat accumulation of each workpiece area and the corresponding adjacent workpiece area, combined with the distance between each workpiece area and the corresponding adjacent workpiece area, calculate the thermal performance value of each workpiece area; based on the difference between the thermal performance values ​​of each workpiece area and the corresponding adjacent workpiece area, construct the avoidance coefficient of each workpiece area.

[0054] According to the above calculation, the possible degree of heat accumulation in each workpiece area of ​​the plate is obtained, and then the processing path is planned. During the processing, by optimizing the movement sequence of the laser beam, reducing the idle time, improving the processing efficiency, ensuring that each workpiece area is etched only once, avoiding material waste and surface quality degradation caused by repeated etching. The greater the possible degree of heat accumulation in each workpiece area, the higher the possibility of heat accumulation in the workpiece area, and the greater the possibility of cyclic processing.

[0055] The thermal performance value of each workpiece area is obtained according to the possible degree of heat accumulation in each workpiece area. The expression is:

[0056] , where Indicates the thermal performance value of the workpiece area a, represents the possible degree of heat accumulation in workpiece area a, n represents the number of adjacent workpiece areas of workpiece area a, Indicates the possible degree of heat accumulation in the bth adjacent workpiece area of ​​workpiece area a, represents the shortest distance between the edge of workpiece region a and its bth adjacent workpiece region, It is an exponential function with the natural constant e as its base.

[0057] The closer the workpiece region a is to its adjacent workpiece region, the easier it is for them to affect each other during the etching process. The difference between the possible heat accumulation of the adjacent workpiece region and the workpiece region a is further compared. The larger the difference, the greater the influence of the adjacent workpiece region on the workpiece region a. Therefore, the greater the thermal performance value of the workpiece region a. To express the relationship of the difference, so that the calculation results are all positive numbers, and the larger the calculation result, the greater the impact produced, and the greater the thermal performance value of the workpiece area a.

[0058] Furthermore, when the thermal performance value of a certain area is larger, it means that path avoidance is required during cutting. In other words, in order to prevent the current area from generating large heat accumulation due to multiple processing, the number of processing times of the current area needs to be reduced. When the neighborhood of workpiece area a intersects with multiple workpiece areas, workpiece area a will be repeatedly processed. Therefore, in order to prevent multiple processing in the processing cluster area, the avoidance coefficient of each workpiece area is calculated to limit the planned path. The expression of the avoidance coefficient of each workpiece area is:

[0059] , where represents the avoidance coefficient of workpiece area a, represents the thermal performance value of workpiece area a, n represents the number of adjacent workpiece areas of workpiece area a, represents the thermal performance value of the bth adjacent workpiece area of ​​workpiece area a, It is an exponential function with the natural constant e as its base.

[0060] Because when performing path planning, the first thing to consider is the impact of the current workpiece area on the adjacent workpiece area, and then consider its impact on the farther area. When the processing path of each local area reaches the local optimum, the processing path of the entire processing part will reach the global optimum. The greater the difference between the current workpiece area and its adjacent workpiece area, the greater the avoidance coefficient of the current area during path planning.

[0061] Step S4, determining the objective function of the path planning algorithm based on the avoidance coefficient of each workpiece area; and obtaining the planned etching path based on the output value of the objective function in combination with the path planning algorithm.

[0062] When performing etching path planning, a greedy algorithm is used for path planning in the embodiment of the present application. It should be noted that there are many existing path planning methods, and implementers can also use other path planning algorithms for etching path planning, and this application does not make specific restrictions. Among them, the greedy algorithm is a well-known technology, which is an algorithm strategy that takes the best choice under the current state in each step of selection, in the hope of achieving the global optimality through a series of locally optimal choices. Obtain the avoidance coefficient of each workpiece area, and obtain the objective function based on the avoidance coefficient. The objective function is used to define the optimization direction of the path and make the best decision. The expression for calculating the objective function is:

[0063]

[0064] In the formula, represents the output value of the objective function, represents the avoidance coefficient of workpiece area a, represents the area of ​​the workpiece region a, and m represents the number of all workpiece regions in the plate. is the first product.

[0065] Because the avoidance coefficient is used to limit whether the current workpiece area can be processed multiple times, and the effective area represents the complexity of the current workpiece area. If the complexity is higher, the output target value is larger, then the reference weight of the current area during path planning is greater.

[0066] The image composed of all workpiece areas on the plate is used as the input of the greedy algorithm, wherein the output value of the objective function obtained above guides the selection of the greedy algorithm, plans the processing path of laser etching, and outputs the planned etching path. The greedy algorithm is a well-known technology, and the specific process is not repeated here.

[0067] Step S5, laser etching the watch parts through the planned etching path.

[0068] Laser etching of watch parts is performed through the planned etching path. The steps are as follows:

[0069] 1. Select the appropriate material according to the etching requirements, and use computer-aided design (CAD) software to design the pattern or text to be etched, and then import the design data into the control system of the laser etcher; then, according to the type of material and etching depth, set the laser power, scanning speed, focus depth and other parameters;

[0070] 2. Place the material to be etched accurately on the workbench, and use a clamp or other fixing device to ensure that it does not move during the etching process; after starting the laser etcher, the laser beam scans the surface of the material according to the planned etching path, and the high energy causes the surface of the material to partially melt, vaporize or chemically react, thereby forming the desired etching pattern;

[0071] 3. After etching is completed, check the clarity and accuracy of the etched pattern to ensure that it meets the design requirements, and perform post-processing steps such as cleaning and polishing as needed to improve the quality and aesthetics of the etched surface;

[0072] 4. Record information such as laser parameters and material type used in the etching process, and save data on the design pattern and etching results for subsequent reference and analysis.

[0073] It should be noted that the laser etching step in step S5 is a well-known technology. In addition to the planned etching path, the implementer can also use other laser etching methods to perform laser etching of watch parts, and this application does not make specific restrictions.

[0074] The schematic diagram of the acquisition process of adjacent workpiece areas is shown in Figure 2 shown.

[0075] In summary, the embodiments of the present application determine the possible degree of heat accumulation by analyzing the distribution of the workpiece, and then obtain the thermal performance values ​​of different areas according to the possible degree of heat accumulation, and then obtain the limitation coefficient of the processing path through the thermal performance values, and calculate the output value of the objective function based on the avoidance coefficient of each workpiece area; based on the output value of the objective function, a planned etching path is obtained in combination with a path planning algorithm; laser etching of watch parts is performed through the planned etching path; the problem of abnormal temperature and heat accumulation caused by repeated heating and cutting in some areas, which affects the processing accuracy of parts, is avoided; by accurately planning the movement trajectory of the laser beam, the idle time is reduced and repeated etching is avoided, thereby improving the processing accuracy, efficiency and quality of watch parts, reducing material waste, ensuring the clarity and consistency of the etching pattern, and improving the aesthetics and functionality of the product.

[0076] It should be noted that the above-mentioned sequence of the embodiments of the present application is only for description and does not represent the advantages and disadvantages of the embodiments. The above-mentioned specific embodiments of the present application are described. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0077] The various embodiments in the present application are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0078] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Modifications to the technical solutions recorded in the aforementioned embodiments, or equivalent replacement of some of the technical features therein, do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A laser etching processing control method for watch parts, characterized in that: The method comprises the following steps: Obtain each workpiece area on the watch parts plate to be etched; Obtaining adjacent workpiece regions of each workpiece region based on the distance between each workpiece region and other workpiece regions; calculating the possible degree of heat accumulation of each workpiece region based on the distance between each workpiece region and the corresponding adjacent workpiece region, combined with the area of ​​each workpiece region and the laser energy of the laser beam during etching; Based on the difference between the possible degree of heat accumulation of each workpiece area and the corresponding adjacent workpiece area, combined with the distance between each workpiece area and the corresponding adjacent workpiece area, the thermal performance value of each workpiece area is calculated; based on the difference between the thermal performance values ​​of each workpiece area and the corresponding adjacent workpiece area, the avoidance coefficient of each workpiece area is constructed; Determine the objective function of the path planning algorithm based on the avoidance coefficient of each workpiece area; obtain the planned etching path based on the output value of the objective function in combination with the path planning algorithm; Laser etching of watch parts using planned etching paths.

2. A method for controlling laser etching of watch parts as claimed in claim 1, characterized in that: The process of obtaining the adjacent workpiece area is as follows: The neighborhood of each workpiece region is obtained based on the neighborhood of each pixel point on the edge line of each workpiece region; and the adjacent workpiece region of each workpiece region is determined based on the neighborhood of each workpiece region.

3. A laser etching processing control method for watch parts as claimed in claim 2, characterized in that: The process of obtaining the neighborhood of each workpiece area is as follows: A circle is drawn with each pixel point on the edge line of each workpiece area as the center and a preset radius to obtain a circular area as the neighborhood of each pixel point on the edge line, and the area occupied by the neighborhood of all pixel points on the edge line is taken as the neighborhood of each workpiece area.

4. A laser etching processing control method for watch parts as claimed in claim 2, characterized in that: The process of obtaining the adjacent workpiece areas of each workpiece area is as follows: If, in addition to the current workpiece region, there are other workpiece regions that intersect with the neighborhood of the current workpiece region, then the other workpiece regions are regarded as respective adjacent workpiece regions of the current workpiece region.

5. A laser etching processing control method for watch parts as claimed in claim 1, characterized in that: The expression for the possible degree of heat accumulation is: , where Indicates the possible degree of heat accumulation in workpiece area a; represents the area of ​​workpiece region a; n represents the number of adjacent workpiece regions of workpiece region a; represents the shortest distance between the edge of workpiece region a and its bth adjacent workpiece region; It represents the laser energy of the laser beam when etching the workpiece area a.

6. A method for controlling laser etching of watch parts as claimed in claim 1, characterized in that: The determination of the thermal performance value includes: Calculating the difference between the possible degree of heat accumulation of each adjacent workpiece region of any workpiece region and the any workpiece region, and calculating the result of an exponential function with a natural constant as the base and the difference as the exponent; Based on the calculation result of the exponential function, the shortest distance between any workpiece region and the edges of each adjacent workpiece region, and the possible degree of heat accumulation in any workpiece region, the thermal performance value of any workpiece region is obtained.

7. A laser etching processing control method for watch parts as claimed in claim 6, characterized in that: The process of obtaining the thermal performance value of any workpiece area is as follows: For each adjacent workpiece region of any one of the workpiece regions, calculating a ratio of a calculation result of the exponential function of the adjacent workpiece region to the shortest distance; Calculating the average of the ratios of all adjacent workpiece regions of any workpiece region; The product of the mean value and the possible degree of heat accumulation of any workpiece region is taken as the thermal performance value of any workpiece region.

8. A method for controlling laser etching of watch parts as claimed in claim 1, characterized in that: The expression of the avoidance coefficient is: , where represents the avoidance coefficient of workpiece area a, represents the thermal performance value of workpiece area a, n represents the number of adjacent workpiece areas of workpiece area a, represents the thermal performance value of the bth adjacent workpiece area of ​​workpiece area a, It is an exponential function with the natural constant e as its base.

9. A method for controlling laser etching of watch parts as claimed in claim 1, characterized in that: The process of obtaining the output value of the objective function is as follows: The product of the area of ​​each workpiece region and the avoidance coefficient is calculated and recorded as the first product; the average value of the first product of all workpiece regions is taken as the output value of the objective function.

10. The laser etching processing control method for watch parts according to claim 1, characterized in that: The output value based on the objective function is combined with the path planning algorithm to obtain the planned etching path, specifically: An image composed of all workpiece areas on the plate is used as the input of the path planning algorithm, wherein the output value of the objective function guides the selection of the path planning algorithm, plans the laser etching processing path, and outputs the planned etching path.

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