Processing method and processing device for composite structure
By forming a deposition structure on the surface of the substrate and performing cutting, milling and punching, the problems of high production costs and low utilization rates of negative electrode columns and midframe materials in the prior art are solved, and continuous production and high-efficiency material utilization are achieved.
Patent Information
- Application Number
- CN202411589544.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-02-25
AI Technical Summary
In the prior art, when producing negative electrode columns, mobile phones, iPads, and display screen midframe materials, there are problems of high manufacturing costs and low utilization rates, making it difficult to achieve continuous production.
Using the processing method of composite structures, continuous production is achieved by continuously transporting the substrate to the deposition station, forming a deposition structure on the surface of the substrate, and cutting, milling and punching after the deposition structure is formed.
It realizes a composite structure with low production cost and high material utilization rate, improves production efficiency, and is suitable for the continuous production of negative electrode columns, mobile phones, iPads, and display frame materials.
Smart Images
Figure CN119501593A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of composite materials, and in particular to a processing method and a processing device for a composite structure. Background Art
[0002] In the existing technology, in order to improve the strength, corrosion resistance or thermal and electrical conductivity of some materials, it is often necessary to set up some composite materials; for example, manufacturers of smart phones, iPads, and display screens are actively exploring breakthroughs in body materials, such as the currently highly anticipated titanium alloy middle frame. The high processing difficulty brought by titanium alloy due to its inherent properties has brought considerable challenges to manufacturers. The traditional solution that only relies on CNC milling processing is difficult to meet the needs of industrialization; for example, the use of composite materials for the negative electrode of the battery can improve battery performance, reduce costs and enhance conductivity.
[0003] However, in the prior art, when producing negative electrode columns, copper plates and aluminum plates are subjected to stamping or integrated upsetting processes to obtain negative electrode columns, which makes it difficult to achieve continuous production, has high production costs and low utilization rates, and the production of middle frame materials for mobile phones, iPads, and display screens also has problems such as high manufacturing costs and low utilization rates. Summary of the invention
[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a processing method for a composite structure, which realizes a continuous preparation and continuous deposition process when preparing a composite structure of a negative electrode column or a composite structure of a middle frame of a mobile phone, iPad, display screen, etc., with low production cost and high material utilization rate.
[0005] According to the processing method of the composite structure of an embodiment of the present invention, the processing method includes: transporting a substrate to a deposition station; after the substrate is transported to the deposition station, processing a deposition structure on the surface of the substrate; cutting the substrate after processing the deposition structure, or milling and punching the substrate after processing the deposition structure.
[0006] According to the processing method of the composite structure of the embodiment of the present invention, after the substrate is continuously transported to the deposition station, a deposition structure is formed on the surface of the substrate, and after the deposition structure is formed, it is directly cut to form the material strips required for the middle frame materials of mobile phones, iPads, display screens, etc., or the deposition structure is milled and punched to form the negative electrode column, that is, the middle frame materials of mobile phones, etc. and the negative electrode column can be continuously produced, and the deposition structure is set on the surface of the substrate by deposition, so as to achieve high utilization rate of continuous materials and improve production efficiency.
[0007] According to the processing method of the composite structure of an embodiment of the present invention, after the substrate is transported to the deposition station, the method includes: forming a deposition layer on the surface of the substrate so that the deposition layer and the substrate form a plate composite, and cutting the plate composite.
[0008] According to the processing method of the composite structure of an embodiment of the present invention, the surface processing of the substrate to form a deposition layer includes: adding a deposition raw material into a deposition device, driving the deposition raw material to rotate at a high speed; controlling the deposition device to move in a first direction so that the deposition raw material contacts the substrate for stirring friction to plastically soften the deposition raw material, and controlling the deposition device or the substrate to move in a second direction so that a deposition layer is formed on the surface of the substrate.
[0009] According to the processing method of the composite structure of an embodiment of the present invention, controlling the deposition device or the substrate to move along the second direction includes: controlling the substrate to move repeatedly along the second direction and controlling the deposition device to move along the first direction away from the substrate while switching the direction of the repeated movement to form a multi-layer deposition layer.
[0010] According to the processing method of the composite structure of an embodiment of the present invention, after the substrate is transported to the deposition station, the method includes: after the substrate is transported to the deposition station, depositing a plurality of deposition columns on the surface of the substrate; after milling the plurality of deposition columns, punching the substrate along the corresponding deposition columns to form negative pole columns, or punching the substrate along the corresponding deposition columns, milling the deposition columns to form the negative pole columns.
[0011] According to the processing method of the composite structure of an embodiment of the present invention, a deposition raw material is added into a deposition device, and the deposition raw material is driven to rotate at a high speed; the deposition device is controlled to move along a first direction so that the deposition raw material contacts the substrate and stirs and rubs the deposition raw material, and the deposition device is controlled to gradually move away from the substrate along the first direction to form a deposition column; the deposition device or the substrate is continued to be controlled to move along the second direction, and the deposition raw material is controlled to contact the substrate, and another deposition column is deposited on one side of the deposition column at intervals, thereby depositing a plurality of deposition columns in sequence.
[0012] According to an embodiment of the present invention, the processing method of the composite structure includes: setting the substrate in the form of a coil and continuously feeding it to the deposition station after leveling, feeding, and surface treatment; continuously transporting the substrate to a cutting position for cutting after deposition, and leveling, milling, striping, and vibrating the substrate again, or continuously transporting the substrate to a leveling, milling, and punching position for leveling, milling, and punching again, and then continuing to vibrate the substrate.
[0013] An embodiment of the present invention also provides a composite structure processing device, which is suitable for the above-mentioned composite structure processing method, including: a coil rack and an operating table; the coil rack is arranged on one side of the operating table, the substrate is rolled and arranged on the coil rack, a material conveying device is arranged above the operating table, a deposition device is arranged on the side of the material conveying device away from the coil rack, a cutting device is arranged on the side of the deposition device away from the material conveying device, or a milling device and a punching device are arranged on the side of the deposition device away from the material conveying device.
[0014] According to the processing device of the embodiment of the present invention, when a material conveying device, a deposition device and a cutting device are provided on the operating table, the structure preparation of the middle frame composite material of mobile phones, display screens and iPads can be carried out; when a material conveying device, a deposition device, a milling device and a punching device are provided on the operating table, the composite structure of the negative electrode column can be prepared. Through the processing device, continuous deposition is achieved to form a composite structure, thereby improving production efficiency, increasing material utilization and reducing production costs.
[0015] According to the composite structure processing device of an embodiment of the present invention, the material conveying device includes an upper roller group and a lower roller group spaced apart in the up and down directions, one end of the substrate is arranged between the upper roller group and the lower roller group, and is suitable for conveying the substrate when the upper roller group and the lower roller group rotate.
[0016] According to the composite structure processing device of the embodiment of the present invention, the deposition raw material in the deposition device can be delivered by any one of rod delivery, wire delivery, particle delivery and powder delivery.
[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0019] Figure 1 It is a schematic diagram of the structure of a middle frame material of a mobile phone or the like formed by a processing method of a composite structure according to an embodiment of the present invention;
[0020] Figure 2 It is a schematic diagram of an implementation method of forming a negative electrode column by a processing method of a composite structure according to an embodiment of the present invention;
[0021] Figure 3 is a schematic diagram of another implementation method of forming a negative electrode column by a processing method of a composite structure according to an embodiment of the present invention;
[0022] Figure 4is an overall flow chart of a method for processing a composite structure according to an embodiment of the present invention;
[0023] Figure 5 The process of processing composite materials of the composite structure of the embodiment of the present invention is to process composite materials of the middle frame of mobile phones, etc. Figure 1 ;
[0024] Figure 6 The process of processing composite materials of the composite structure of the embodiment of the present invention is to process composite materials of the middle frame of mobile phones, etc. Figure 2 ;
[0025] Figure 7 is a flow chart of a method for processing a negative electrode column of a composite structure according to an embodiment of the present invention;
[0026] Figure 8 It is a flow chart of processing a plurality of negative poles according to a method for processing a composite structure according to an embodiment of the present invention.
[0027] Reference numerals:
[0028] A composite structure processing device 100,
[0029] Coil rack 1, substrate 11, limiting rod 12, material conveying device 2, upper roller group 21, lower roller group 22, deposition equipment 3, deposition structure 4, cutting device 5, material strip 6, milling device 7, punching device 8, negative electrode column 9, operating table 10. DETAILED DESCRIPTION
[0030] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.
[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0033] Reference below Figure 1-Figure 8 A processing method for a composite structure and a processing device 100 for a composite structure according to an embodiment of the present invention are described. When preparing a composite structure of a negative electrode column 9 or a composite structure of a middle frame of a mobile phone, an iPad, a display screen, etc., continuous preparation is achieved and the composite structure is made through a continuous deposition process, thereby achieving low production cost and high material utilization.
[0034] like Figure 1-8 As shown, according to a method for processing a composite structure according to an embodiment of the present invention, the processing method comprises the following steps:
[0035] S1: transport the substrate 11 to the deposition station; in practice, when manufacturing composite structures of middle frames such as mobile phones, iPads and display screens, the substrate 11 can generally be made of materials such as stainless steel, titanium alloy or copper plate. Materials such as stainless steel, titanium alloy or copper plate can meet the strength requirements, and the thickness of the substrate 11 can be set to 1-5mm.
[0036] When manufacturing the negative electrode column 9, the substrate 11 can generally be a copper alloy substrate 11. The copper alloy substrate 11 has high strength, high conductivity and corrosion resistance. The negative electrode column 9 is a conductive electrode of the battery, and it is necessary to select a copper alloy substrate 11 with good conductivity. The applicable thickness of the substrate 11 can also be set to 1-5mm; and, whether it is manufacturing a middle frame composite structure such as a mobile phone, iPad and display screen or a composite structure of the negative electrode column 9, the substrate 11 can generally be a rolled substrate 11. The rolled substrate 11 can improve the continuity of the substrate 11 being transported to the deposition station, thereby improving the continuity of manufacturing the composite structure.
[0037] Before conveying the substrate 11 to the deposition station, the substrate 11 can be leveled, surface treated and other steps. Leveling refers to making the surface of the substrate 11 smoother, and surface treatment refers to removing impurities or dust on the surface of the substrate 11. Through these two steps, it is convenient to improve the integrity and reliability of the connection between the deposition structure 4 and the substrate 11 when setting the deposition structure 4 on the surface of the substrate 11.
[0038] S2: After the substrate 11 is transported to the deposition station, a deposition structure 4 is processed on the surface of the substrate 11; generally, a material conveying device 2 can be used to convey the substrate 11 to the deposition station. The deposition station refers to a position where a deposition device 3 can be set above the substrate 11 so that the deposition device 3 can deposit the substrate 11. The thickness and size of the deposition structure 4 can be adjusted according to actual needs, such as the size requirements of the mobile phone middle frame material and the size requirements of the negative electrode column 9, that is, the above-mentioned substrate 11 is transported to the deposition station through the material conveying device 2, and deposition can be carried out, so that the conveying and deposition of the substrate 11 are carried out continuously, and the substrate 11 can be continuously conveyed, and the deposition can also be continuously deposited, thereby improving the production efficiency of preparing negative electrode columns 9 or middle frame composite materials such as mobile phones.
[0039] S3: Cutting the substrate 11 after the deposition structure 4 is processed, or milling and punching the substrate 11 after the deposition structure 4 is processed. That is, there are differences in the size and shape of the middle frame materials of mobile phones, iPad middle frames or other display screens and the negative electrode column 9. For example, the middle frame composite materials required by mobile phones, iPads, display screens, etc. generally require larger-sized long strips, while the composite materials of the negative electrode column 9 require smaller sizes, but the thickness may be greater than the thickness of the middle frame composite materials; that is, after the substrate 11 is provided with the deposition structure 4, a composite part is formed. According to different needs, the composite part can be cut, or the composite part can be milled and punched. Milling is to fine-process the deposition structure 4 to achieve the required shape and structure, and punching is to cut the composite part to form a single piece. That is to say, according to the manufacture of mobile phone middle frames and iPad middle frames, etc., the composite part formed by the substrate 11 and the deposition structure 4 can be directly cut, or according to the manufacture of the negative electrode column 9, the composite part formed by the substrate 11 and the deposition structure 4 can be milled and punched. Of course, in actual operation, milling can be performed first and then punching, or punching can be performed first and then milling.
[0040] Therefore, the processing method of the composite structure of the embodiment of the present invention can not only continuously process the middle frame composite structure of mobile phones, iPads, display screens, etc., but also continuously process the negative electrode column 9, and when preparing the composite structure of the negative electrode column 9 or the middle frame composite structure of mobile phones, iPads, display screens, etc., a continuous deposition process is used to make them, thereby achieving low production cost and high material utilization.
[0041] In some embodiments, after the substrate 11 is transported to the deposition station, the following steps are included:
[0042] S21: A deposition layer is formed on the surface of the substrate 11 so that the deposition layer and the substrate 11 form a plate composite; that is, stainless steel, titanium alloy or copper plate and other materials are selected, and a deposition layer is set on the surface of the substrate 11 such as stainless steel, titanium alloy or copper plate. The structure formed by the substrate 11 and the deposition layer is a plate composite. The plate composite is used as a middle frame material for mobile phones, etc., and has the effects of being light, durable and impact-resistant.
[0043] S31: Cutting the composite sheet. That is, after the deposition layer is formed on the surface of the substrate 11, the composite sheet with the deposition layer is cut by the cutting device 5, and can be cut into multiple strips of different required sizes, so as to form the material strip 6 of the composite structure of the mobile phone middle frame. The cutting process needs to ensure accuracy and stability to ensure that the size of the material strip 6 meets the production requirements of the mobile phone middle frame. At the same time, the cutting device 5 should have efficient cutting capabilities to meet the needs of continuous automated production.
[0044] In some embodiments, forming a deposition layer on the surface of the substrate 11 includes the following steps:
[0045] S211: Add the deposition raw materials into the deposition device 3, and drive the deposition raw materials to rotate at high speed.
[0046] First of all, the deposition method can be any one of the deposition methods of rod feeding, wire feeding, particle feeding, and powder feeding. The deposition raw material can be aluminum alloy materials of grades such as 6061, 6063, and 6013. For example, in the case of wire feeding deposition, the deposition device 3 can cut the wire feeding material into particles. At this time, it is equivalent to the friction between the particle raw material in the deposition device 3 and the substrate 11, and the friction generates heat to form a deposition layer of the deposition raw material; of course, in practice, the rod feeding method can also be used to make the rod repeatedly rub against the substrate 11, and the deposition raw material can also form a deposition layer after stirring friction heat.
[0047] S212: Control the deposition device 3 to move along the first direction, so that the deposition raw material contacts the substrate 11 for stirring friction to soften the deposition raw material plastically, and control the deposition device 3 or the substrate 11 to move along the second direction, so that a deposition layer is formed on the surface of the substrate 11.
[0048] In practice, the deposition equipment 3 can adopt a commonly used mechanical equipment with a lifting device, a translation device and a stirring and conveying structure. The lifting device can adopt a cylinder, a screw or an electric rod and other structures, and the translation device can also be controlled by another set of cylinders or screws and other structures to control the lifting and lowering, forward and backward movement, left and right movement, etc. of the deposition equipment 3.
[0049] For example, the up and down movement of the lifting device can make the deposition raw material contact with the substrate 11, that is, the first direction is the up and down direction. When the deposition raw material in the deposition device 3 contacts with the substrate 11, the stirring and conveying structure in the deposition device 3 can stir and frictionally generate heat between the deposition raw material and the substrate 11. After the deposition raw material of the deposition device 3 contacts with the substrate 11, and the deposition device 3 is controlled to move along the second direction, a corresponding deposition layer will be formed. The second direction intersects with the first direction. If the first direction is a vertical direction, the second direction is a horizontal direction. Then, the deposition layer formed after stirring and frictionally generating heat can become one with the substrate 11 and adhere to the surface of the substrate 11 to improve the performance of the substrate 11, such as strength, heat resistance or corrosion resistance.
[0050] When the second direction is a horizontal direction, that is, the horizontal direction can be understood as a horizontal plane, and the deposition device 3 can move along the X direction, Y direction or oblique direction on the horizontal plane to form deposition layers of different areas.
[0051] That is, before the substrate 11 moves to the deposition device 3, the deposition device 3 maintains its original position and after the substrate 11 moves to the bottom of the deposition device 3, the deposition device 3 begins to descend and allows the deposition raw material to contact the substrate 11. At the same time, the stirring and rotating structure in the deposition device 3 generates heat through stirring friction between the deposition raw material and the substrate 11. When the deposition is completed, the deposition device 3 can be controlled to move upward to separate from the deposition layer, thereby facilitating the substrate 11 provided with the deposition layer to proceed to the next step of the process.
[0052] In some embodiments, controlling the deposition device 3 or the substrate 11 to move along the second direction comprises the following steps:
[0053] S2121: Control the substrate 11 to move repeatedly in the second direction and control the deposition device 3 to move in the first direction away from the substrate 11 while switching the direction of the repeated movement to form a multi-layer deposition layer.
[0054] That is to say, at this time, the deposition device 3 can remain fixed in the horizontal direction. When the deposition device 3 moves vertically to make the deposition raw material contact with the substrate 11, the deposition device 3 does not move, and the substrate 11 can be controlled to move repeatedly at the bottom of the deposition device 3. The second direction at this time is the direction intersecting with the up and down direction, such as the horizontal direction, so that the deposition raw material in the deposition device 3 and the substrate 11 are stirred and rubbed to generate heat, forming a deposition structure 4 attached to the surface of the substrate 11, and the repeated movement of the substrate 11 can be achieved by the forward and reverse repeated movement of the material conveying device 2; the form of the deposition device 3 is not limited, and both gantry and robot types are possible; of course, when designing the operation, the position of the substrate 11 can be kept unchanged when the substrate 11 moves to the bottom of the deposition device 3, and the deposition device 3 is controlled to move relative to the substrate 11, so that the deposition raw material in the deposition device 3 and the substrate 11 are stirred and rubbed to generate heat, and a deposition layer can also be formed. Of course, considering the convenience of operation and the ease of controlling the area, shape and other factors of the deposition layer, the deposition layer is generally formed by controlling the movement of the deposition device 3.
[0055] When forming a deposition layer, multiple deposition layers can be repeatedly formed to achieve the required protection effect or the required strength effect, or structural requirements, such as a deposition layer of 0.5-4mm, which can be set to 2-10 layers, and the design of each deposition layer, such as moving from the deposition device 3 from the left to the right to complete the formation of a deposition layer, when switching from the right to the left to deposit the second deposition layer, the deposition device 3 can be switched to continue moving in the direction away from the substrate 11, that is, the deposition device 3 needs to be moved slightly upward for a certain distance to facilitate the next layer of deposition, that is, the distance that the deposition device 3 moves upward can make room for the deposition thickness formed by each deposition, so as to facilitate the formation of multiple deposition layers. The multiple deposition layers form a plate structure, which can improve the structural strength and heat resistance of the plate composite formed by the plate structure and the substrate. At the same time, although multiple deposition layers are designed, the thickness of each deposition layer is relatively thin, and the effect of lightness can be achieved.
[0056] In some embodiments, after the substrate 11 is transported to the deposition station, the following steps are included:
[0057] S21: After the substrate 11 is transported to the deposition station, a plurality of deposition columns are deposited on the surface of the substrate 11; that is, after the substrate 11 is continuously transported to the bottom of the deposition device 3, the deposition raw material in the deposition device 3 contacts the substrate 11, and under the action of the stirring and conveying structure inside the deposition device 3, the deposition raw material and the substrate 11 are stirred and rubbed to generate heat, causing the deposition raw material to plastically soften to form a deposition layer. Of course, at this time, a plurality of deposition columns can be deposited on the surface of the substrate 11, and the plurality of deposition columns are spaced apart. In this way, each deposition column and the substrate 11 at the corresponding position can form a negative electrode column blank, which can facilitate the subsequent processing of the negative electrode column blank to form a negative electrode column 9.
[0058] S22: After milling a plurality of deposition columns, the substrate 11 is punched out along the corresponding deposition columns to form a negative electrode column 9, or after punching out the substrate 11 along the corresponding deposition columns, the deposition columns are milled to form a negative electrode column 9.
[0059] When a plurality of deposition columns are provided on the surface of the substrate 11, each deposition column can be milled first. The deposition columns are aluminum columns, such as 1060 aluminum, that is, the aluminum columns are processed first. Milling is a mechanical processing method that uses a milling cutter as a tool to process the surface of an object. Milling can be used to process planes, grooves, formed surfaces, etc. First, each aluminum column is finely processed into the required structure of the negative electrode column 9 by milling, and then a plurality of substrates 11 with aluminum columns are punched. When punching, the substrate 11 is punched along each aluminum column to form a single negative electrode column 9.
[0060] In addition, the substrate 11 provided with multiple aluminum columns may be punched out first, and the punched aluminum columns and the substrate 11 may form a single negative electrode column blank, and then the aluminum columns of each negative electrode column blank may be milled, that is, finely processed into the required structure of the negative electrode column 9. Whether the substrate 11 provided with multiple aluminum columns is punched out and then each aluminum column is milled, or multiple aluminum columns are milled and then the substrate 11 provided with multiple processed aluminum columns is punched out, the production efficiency may be improved, and mass production of multiple negative electrode columns 9 may be realized, and the flexibility during processing may be higher.
[0061] In some embodiments, after the substrate 11 is transported to the deposition station, depositing a plurality of deposition columns on the surface of the substrate 11 includes:
[0062] S211: Add the deposition raw materials into the deposition device 3, and drive the deposition raw materials to rotate at high speed.
[0063] The deposition raw materials in the form of particles, filaments or rods are placed in the deposition device 3, and when the substrate 11 is conveyed to the bottom of the deposition device 3 by the material conveying device 2, the deposition raw materials can be conveyed through the deposition device 3 to contact the substrate 11. The stirring and conveying structure in the deposition device 3 makes the deposition raw materials rotate at a high speed and stir and rub with the substrate 11 to generate heat. The deposition raw materials are plastically softened, and the movement of the substrate 11 or the deposition device 3 can be controlled to cause relative movement between the deposition device 3 and the substrate 11, so that the deposition raw materials are deposited on the surface of the substrate 11.
[0064] S212: Control the deposition device 3 to move along the first direction so that the deposition raw material contacts the substrate 11 to perform friction stir deposition manufacturing, and control the deposition device 3 to gradually move away from the substrate 11 along the first direction to form a deposition column.
[0065] In practice, when the substrate 11 is placed at the bottom of the deposition device 3, and the deposition device 3 and the substrate 11 are placed in a vertical direction, the first direction is the vertical direction. The deposition device 3 is controlled to move in the first direction until the deposition raw material contacts the substrate 11, and stirring friction occurs between the deposition raw material and the substrate 11. In the process of the deposition device 3 moving away from the substrate 11, a deposition column is formed. Since the volume and area of the negative electrode column to be formed by the deposition column are relatively small, the discharge port of the deposition device 3 allows the deposition raw material to be sufficient to form the required cross-sectional area of the deposition column, and the deposition raw material is in contact with the substrate 11 at the same time during the stirring friction process. The deposition device 3 is gradually moved upward away from the substrate 11 to form a roughly processed deposition column. Since subsequent processing is still required, the roughly processed deposition column can meet the requirements. Therefore, the entire process is automated, the deposition method, principle and operation are simpler, and the forming speed is fast.
[0066] S213: Continue to control the deposition device 3 or the substrate 11 to move along the second direction, and control the deposition raw material to contact the substrate 11, and deposit another deposition column on one side of a deposition column, thereby depositing multiple deposition columns in sequence.
[0067] That is, after a deposition column is formed by deposition, the deposition device 3 can be moved upward to separate the deposition device 3 from the formed deposition column, and the deposition device 3 can be moved in the second direction, which is the horizontal direction, or the substrate 11 can be moved in the second direction, so that the second deposition column can continue to be deposited on one side of the first deposition column, and the deposition device 3 moves in the first direction away from the substrate 11, so that the second deposition column also forms a certain height. In this way, multiple deposition columns arranged at intervals can be deposited, thereby improving the efficiency of batch production. When producing the negative electrode column 9, batch punching and batch milling can be performed to reduce the difficulty of processing and improve the production efficiency of the negative electrode column 9. Moreover, the way in which the deposition device 3 gradually moves away from the substrate 11 improves the uniformity and strength of the finally formed deposition structure 4, and also enables the effective utilization of the deposition raw materials.
[0068] It should be noted that the substrate 11 is arranged in a roll. After a section of the substrate 11 is arranged with the deposition structure 4 and is milled, punched, etc., the rolled substrate 11 can continue to be transported by the material conveying device 2 to the lower part of the deposition equipment 3 for the deposition of the next section of the substrate 11. That is, the whole process can be carried out continuously, which greatly improves the efficiency of forming the composite structure.
[0069] In addition, the thickness of the deposition structure 4 is 0-10mm. In practice, when the deposition structure 4 is a deposition layer and forms a composite plate, that is, when the material is used for the middle frame of a mobile phone, iPad and display screen, the thickness of the deposition layer of the middle frame composite can be 3mm, and when the negative pole 9 is produced, the thickness of the deposited aluminum column can be 5mm. By limiting the thickness of the deposition structure 4 forming the middle frame composite, the structural strength requirements are met, and the heat resistance and durability of the structure are increased, while ensuring the lightness of the composite; and limiting the thickness of the deposition column forming the negative pole column 9, that is, limiting the height of the formed negative pole column 9, improving the conductivity of the negative pole column 9, while not making the negative pole column 9 too large. When the negative pole column 9 is too large, there may be problems such as easy expansion, deformation, and microcracks in volume, that is, while improving the conductivity of the negative pole column 9, the deformation of the negative pole column 9 can be reduced.
[0070] In some embodiments, the processing method of the composite structure includes: setting the substrate 11 in the form of a coil and continuously feeding it to a deposition station after leveling, feeding, and surface treatment; continuously transporting the substrate 11 to a cutting position for cutting after deposition, and leveling, milling, striping, and vibrating again; or continuously transporting the substrate 11 to a leveling, milling, and punching position after deposition, leveling, milling, and punching again, and then continuing to vibrate.
[0071] First, the substrate 11 is arranged in the form of a coil, so that the substrate 11 can be continuously transported to the next step, and the operation is convenient, and only the coil needs to be unrolled. The arrangement of the coil also makes it more convenient to unfold the substrate, and the unfolded substrate can be leveled at the same time and sent to the next step for surface treatment, wherein the surface treatment is to make the surface of the coil flat and free of impurities, etc., so that the connection performance between the deposition structure and the substrate 11 is more stable, and the quality of deposition is improved; and for the plate structure of the composite material, after deposition to form a deposition layer and after cutting, the cut material strips 6 can continue to be leveled, milled, striped, and vibrated to ensure that the composite material plate can be flatter, and further refined processing can be performed, and vibration can increase its density and hardness, and increase the life of the composite material plate, and finally cleaning, drying, testing, packaging and other operations are performed to form a qualified mobile phone, iPad, display screen and other middle frame composite structure.
[0072] In addition, for the processing of the negative electrode column 9, similarly, the coil material is used to carry out the leveling, feeding, surface treatment and other procedures to feed the deposition station. After feeding and deposition, it is leveled again, milled and punched. Milling can be done first and then punched, or punching can be done first and then milling. However, after milling and punching are completed, vibration grinding operations are continued to ensure density. Of course, cleaning, testing, packaging and other operations are still required in the end to form a qualified negative electrode column 9 structure.
[0073] The processing method of the composite structure according to the embodiment of the present invention adopts the form of a coil, and the composite structure is prepared through a continuous process, which can also omit the transportation link and improve the production efficiency.
[0074] The embodiment of the present invention discloses a composite structure processing device 100 , which is applicable to the composite structure processing method mentioned above, and includes: a coil rack 1 and an operating table 10 .
[0075] Among them, the coil rack 1 is arranged on one side of the operating table 10, the substrate 11 is rolled and arranged on the coil rack 1, a material conveying device 2 is arranged above the operating table 10, a deposition device 3 is arranged on the side of the material conveying device 2 away from the coil rack 1, a cutting device 5 is arranged on the side of the deposition device 3 away from the material conveying device 2, or a milling device 7 and a punching device 8 are arranged on the side of the deposition device 3 away from the material conveying device 2.
[0076] Specifically, the coil rack 1 is used to place a rolled substrate 11. The rolled substrate 11 is provided with a plurality of limit rods 12 on both sides of the width of the substrate 11. The plurality of limit rods 12 can limit the substrate 11 during the process of rotating and retracting the rolled substrate 11, so that the substrate 11 can be transported to the position of the deposition device 3 by the material conveying device 2 along a predetermined path; the material conveying device 2 is arranged at the end of the operating table 10 and is movably connected to the end of the substrate 11. When the substrate 11 is arranged at the material conveying device 2, it can move along the material conveying device 2 to the bottom of the deposition device 3 at the rear side, such as Figure 1 As shown, a cutting device 5 is provided at the rear side of the deposition device 3 , and the cutting device 5 cuts the formed composite part to form a material strip 6 of a middle frame material of a mobile phone or the like.
[0077] Or, if Figure 2 and Figure 3 As shown, a milling device 7 and a punching device 8 are provided at the rear side of the deposition device 3, which are used to mill the deposition column or punch the substrate 11 provided with the deposition column, respectively. Figure 2 After deposition, milling is performed first and then punching is performed. Figure 3 This is a state where after deposition, blanking is performed first and then milling is performed.
[0078] That is, the coil rack 1, the material conveying device 2, the deposition equipment 3 and the cutting device 5 are used to continuously process the composite materials of the middle frame of the mobile phone, etc., and the coil rack 1, the material conveying device 2, the deposition equipment 3, the milling device 7 and the punching device 8 are used to continuously process the composite materials of the negative electrode column 9.
[0079] Furthermore, the rolled substrate 11 can continue to rotate the rolled substrate 11 on the coil rack 1, or continue to drive the material conveying device 2, so that the next stage of the substrate 11 continues to be located at the bottom of the deposition device 3 for deposition operation, after a length of the substrate 11 is deposited and cut, or after being milled and punched after deposition. That is, the rolled substrate 11 cooperates with the deposition device 3 to realize continuous processing of the composite structure and achieve higher material utilization.
[0080] In some embodiments, the material conveying device 2 includes an upper roller group 21 and a lower roller group 22 spaced apart in the up and down directions, one end of the substrate 11 is disposed between the upper roller group 21 and the lower roller group 22, and is suitable for conveying the substrate 11 when the upper roller group 21 and the lower roller group 22 rotate.
[0081] In practice, a gap is provided between the upper roller group 21 and the lower roller group 22, and the gap is used to place the substrate 11. When the substrate 11 is located in the gap, the upper roller group 21 and the lower roller group 22 are driven to rotate by the driving mechanism. At this time, the surface of the substrate 11 can be leveled under the action of the upper roller group 21 and the lower roller group 22, thereby increasing the adhesion of the deposition structure 4 to the substrate 11 during the subsequent deposition operation, and improving the flatness and integrity of the deposition structure 4 and the substrate 11. Of course, in actual operation, a surface treatment structure can also be provided between the coil rack 1 and the material conveying device 2. The surface treatment structure mainly processes or cleans impurities, dust, etc. on the surface of the substrate 11, further improving the deposition structure 4 formed on the surface of the substrate 11, ensuring that the deposition structure 4 is more uniform, and also improving the yield rate.
[0082] It should be noted that a stirring and conveying structure is provided in the deposition device 3 . The stirring and conveying structure includes a conveying screw. The conveying screw is used to convey the deposition material and cut the deposition material into particles.
[0083] In practice, the conveying screw has threads and a relatively rough surface. When the deposition raw material is placed in the deposition device 3 and the conveying screw is driven to rotate, if the deposition raw material is granular, the conveying screw can convey the granular deposition raw material, so that the deposition raw material contacts the substrate 11, so that the deposition material and the substrate are stirred and rubbed, and the deposition raw material is plastically softened so as to form a deposition structure on the surface of the substrate 11.
[0084] In some embodiments, the deposition raw material in the deposition device 3 can be delivered by any one of rod feeding, wire feeding, particle feeding, and powder feeding.
[0085] Among them, deposition can be carried out through a variety of different types of deposition raw materials. For example, when the deposition raw material is wire feeding or rod feeding, and when the deposition material in the deposition device 3 is wire material, the screw can cut the wire deposition material during the rotation of the conveying screw, and finally the filamentary deposition material is formed into granular deposition material, and the conveying screw conveys the granular deposition material to contact with the substrate; if it is a rod feeding material, the rod material can also be deposited by friction with the substrate during the stirring and conveying process; that is, deposition can be carried out using any deposition raw material of rod feeding, wire feeding, granular feeding, and powder feeding, thereby improving the flexibility of selecting deposition materials.
[0086] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0087] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A method for processing a composite structure, characterized in that: The processing method comprises: transporting the substrate to a deposition station; After the substrate is transported to the deposition station, a deposition structure is processed on the surface of the substrate; The substrate after processing the deposition structure is cut, or the substrate after processing the deposition structure is milled and punched.
2. The method for processing a composite structure according to claim 1, characterized in that: After the substrate is transported to the deposition station, the method comprises: Processing the surface of the substrate to form a deposition layer, so that the deposition layer and the substrate form a plate composite; The composite sheet material is cut.
3. The method for processing a composite structure according to claim 2, characterized in that: Processing the surface of the substrate to form a deposition layer comprises: Adding deposition raw materials into a deposition device, and driving the deposition raw materials to rotate at high speed; The deposition device is controlled to move along a first direction so that the deposition raw material contacts the substrate for stirring and friction so as to plastically soften the deposition raw material. The deposition device or the substrate is controlled to move along a second direction so that a deposition layer is formed on the surface of the substrate.
4. The method for processing a composite structure according to claim 3, characterized in that: The controlling the deposition device or the substrate to move along the second direction comprises: The substrate is controlled to move repeatedly along the second direction and the deposition device is controlled to move along the first direction away from the substrate while the direction of the repeated movement is switched, so as to form a multi-layer deposition layer.
5. The method for processing a composite structure according to claim 1, characterized in that: After the substrate is transported to the deposition station, the method comprises: After the substrate is transported to the deposition station, a plurality of deposition columns are deposited on the surface of the substrate; After the plurality of deposition columns are milled, the substrate is punched out along the corresponding deposition columns to form negative electrode columns, or after the substrate is punched out along the corresponding deposition columns, the deposition columns are milled to form the negative electrode columns.
6. The method for processing a composite structure according to claim 5, characterized in that: After the substrate is transported to the deposition station, depositing a plurality of deposition columns on the surface of the substrate comprises: Adding deposition raw materials into a deposition device, and driving the deposition raw materials to rotate at high speed; Controlling the deposition device to move along a first direction, so that the deposition raw material contacts the substrate and stirs and rubs the deposition raw material, and controlling the deposition device to gradually move away from the substrate along the first direction to form a deposition column; The deposition device or the substrate is continuously controlled to move along the second direction, and the deposition raw material is controlled to contact the substrate, and another deposition column is deposited on one side of the deposition column at intervals, so that a plurality of deposition columns are deposited in sequence.
7. The method for processing a composite structure according to claim 1, characterized in that: include: The substrate is arranged in a coiled form and continuously fed to the deposition station after leveling, feeding and surface treatment; After the substrate is deposited, it is continuously transported to a cutting position for cutting, and is leveled, milled, striped, and vibrated again. Alternatively, after the substrate is deposited, it is continuously transported to a leveling, milling, and punching position for leveling, milling, and punching again, and then continues to vibrate.
8. A composite structure processing device, applicable to the composite structure processing method according to any one of claims 1 to 7, characterized in that: include: Coil racks and operating tables; The coil rack is arranged on one side of the operating table, the substrate is rolled and arranged on the coil rack, a material conveying device is arranged above the operating table, a deposition device is arranged on the side of the material conveying device away from the coil rack, a cutting device is arranged on the side of the deposition device away from the material conveying device, or a milling device and a punching device are arranged on the side of the deposition device away from the material conveying device.
9. The composite structure processing device according to claim 8, characterized in that: The material conveying device comprises an upper roller group and a lower roller group spaced apart in the up-down direction, one end of the substrate is arranged between the upper roller group and the lower roller group, and is suitable for conveying the substrate when the upper roller group and the lower roller group rotate.
10. The composite structure processing device according to claim 8, characterized in that: The deposition raw material in the deposition device can be delivered by any one of rod delivery, wire delivery, particle delivery and powder delivery.