Wafer substrate automatic chamfering machine tool and chamfering method

Abstract

The invention relates to the technical field of wafer substrate chamfering, and provides an automatic wafer substrate chamfering machine tool and a chamfering method.The automatic wafer substrate chamfering machine tool comprises a machine tool body, a machining jig, a material preparing device, a material basket, a wafer positioning table, a basket inserting mechanical arm, a feeding and discharging mechanical arm and a spin-drying table; the deviation correction sensor is suitable for detecting the circle center position and the deflection angle of the to-be-processed wafer substrate; the basket inserting manipulator is used for transferring the to-be-processed wafer substrate from the material basket to the wafer positioning table and is matched with the wafer positioning table to adjust the circle center position and the deflection angle of the to-be-processed wafer substrate; the loading and unloading manipulator is used for loading the adjusted to-be-processed wafer substrate to the processing jig; and the spin-drying table is used for spin-drying the processed wafer substrate. According to the automatic chamfering device, secondary positioning does not need to be carried out in a machine when the wafer substrate is automatically chamfered, the influence of environment factors in the machine is avoided, the machining efficiency is improved, meanwhile, the machined wafer substrate can be spin-dried, and cutting fluid is prevented from polluting the environment.

Description

Technical Field

[0001] The invention relates to the technical field of wafer substrate chamfering, and in particular to an automatic wafer substrate chamfering machine tool and a chamfering method. Background Art

[0002] Automatic chamfering of wafer substrates refers to the use of special chamfering equipment to automatically grind the edges of wafer substrates so that their corners are ground into chamfers or arc shapes.

[0003] In the relevant technical field, the existing chamfering device generally needs to roughly position the wafer substrate outside the machine when automatically chamfering the wafer substrate, place the wafer substrate on the machine tool processing fixture with a loading and unloading robot, and then accurately position the wafer substrate with vision in the machine tool. The position of the wafer substrate is easily affected by the internal environment of the machine tool when the in-machine vision identifies the position of the wafer substrate. After the chamfering of the wafer substrate is completed, the loading and unloading robot directly places the processed wafer substrate in the material basket. At this time, there is cutting fluid on the wafer substrate, which pollutes the environment. Summary of the invention

[0004] The present invention provides an automatic chamfering machine for wafer substrates, which is used to solve the defects of the prior art that the wafer substrate chamfering device needs secondary positioning in the machine, the visual recognition is easily affected by the environmental factors in the machine, the stability and reliability are poor, and the cost is relatively high. The invention realizes that the wafer substrate does not need to be secondary positioned in the machine when automatically chamfering, thus avoiding the influence of the environmental factors in the machine and improving the processing efficiency. At the same time, the processed wafer substrate can be dried to avoid the pollution of the environment by cutting fluid.

[0005] The present invention provides a wafer substrate automatic chamfering machine tool, comprising: A machine tool body, on which a workbench is movably provided, and the workbench can reciprocate between a processing station and a loading and unloading station along a first direction; A processing jig, the processing jig is installed on the workbench; A material preparation device, the material preparation device is arranged in a first direction and is located around the loading and unloading station; A material basket, the material basket is arranged on the material preparation device, and the material basket is used to store wafer substrates; A wafer positioning platform, the wafer positioning platform is arranged on the material preparation device, and a correction sensor is provided on the wafer positioning platform, and the correction sensor is suitable for detecting the center position and deflection angle of the wafer substrate to be processed; A basket manipulator, the basket manipulator is arranged on the material preparation device, the basket manipulator is used to transfer the wafer substrate to be processed from the material basket to the wafer positioning table, and cooperate with the wafer positioning table to adjust the center position and deflection angle of the wafer substrate to be processed; A loading and unloading robot, which is arranged on the machine tool body and located on the peripheral side of the loading and unloading station, and is used to load the adjusted wafer substrate to be processed onto the processing jig; A drying table is arranged on the material preparation device, and is used to dry the processed wafer substrate.

[0006] According to an automatic chamfering machine for wafer substrates provided by the present invention, the wafer positioning table includes a correction mounting frame, a sensor fixing plate, a vacuum rotating suction cup and a rotating assembly, the correction mounting frame is installed on the material preparation device, the correction sensor is installed on the correction mounting frame through the sensor fixing plate, the rotating assembly is installed on the correction mounting frame, the vacuum rotating suction cup is arranged on the rotating assembly, the vacuum rotating suction cup is used to adsorb and fix the wafer substrate to be processed, and the rotating assembly is used to drive the wafer substrate to be processed on the vacuum rotating suction cup to rotate.

[0007] According to an automatic chamfering machine for wafer substrates provided by the present invention, the wafer positioning table also includes a sensor moving module, the sensor moving module is connected between the sensor fixing plate and the correction mounting frame, and the sensor moving module is used to adjust the distance between the correction sensor and the vacuum rotating suction cup.

[0008] According to an automatic chamfering machine for wafer substrates provided by the present invention, the deflection correction sensor comprises a receiving end and a transmitting end, and the receiving end and the transmitting end are spaced apart from each other to form a detection position.

[0009] According to an automatic chamfering machine for wafer substrates provided by the present invention, the basket robot includes a mounting table, a horizontal moving module, a height moving module, a rotating motor, a rotating shaft and an end suction cup, the height moving module is mounted on the material preparation device, the rotating motor is connected to the lifting end of the height moving module through the mounting table, the horizontal moving module is mounted on the rotating shaft, the rotating shaft is arranged at the rotating end of the rotating motor, and the end suction cup is arranged on the moving end of the horizontal moving module.

[0010] According to an automatic chamfering machine for wafer substrates provided by the present invention, the end suction cup includes an upper fork suction cup, a middle fork suction cup and a lower fork suction cup, the upper fork suction cup is provided with a plurality of suction ports, the plurality of suction ports are used for adsorbing the wafer substrate, the middle fork suction cup is provided with a suction groove, the lower fork suction cup is provided with an air inlet, the air inlet is connected to an air source component, and the air inlet is connected to the air inlet through the suction groove.

[0011] According to an automatic chamfering machine for wafer substrates provided by the present invention, the loading and unloading robot includes a base plate, a swing arm, a lifting assembly and a vacuum suction cup, the base plate is installed on the workbench, the connecting end of the swing arm is rotatably connected to the base plate, the vacuum suction cup is connected to the free end of the swing arm through the lifting assembly, and the lifting assembly is used to drive the vacuum suction cup to move in the height direction.

[0012] According to an automatic chamfering machine for wafer substrates provided by the present invention, the spin-drying table includes a mounting seat, a protective shell, a first cylinder, a spin-drying suction cup assembly and a spin-drying rotating assembly, the mounting seat is arranged on the material preparation device, the first cylinder is fixed on the mounting seat, the first cylinder rod of the first cylinder is fixedly connected to the protective shell, the spin-drying rotating assembly is arranged on the material preparation device, a through hole is provided at the center position of the protective shell, the spin-drying rotating assembly is connected to the protective shell through the through hole, and one end of the spin-drying rotating assembly passes through the through hole, and the spin-drying suction cup assembly is arranged on the passing end of the spin-drying rotating assembly.

[0013] According to an automatic chamfering machine for wafer substrates provided by the present invention, the rotation center of the loading and unloading robot is on the perpendicular bisector of the line connecting the centers of the vacuum rotating suction cup and the spin-drying suction cup assembly.

[0014] The present invention also provides a wafer substrate automatic chamfering method, which is applied to the wafer substrate automatic chamfering machine tool as described above, and comprises the following steps: The wafer substrate to be processed is taken out from the material basket by a basket inserting robot and then placed on the wafer positioning table; The wafer positioning table drives the wafer substrate to rotate one circle, collects the rotation angle of the wafer substrate to be positioned and the shielding amount of the wafer substrate to be positioned by the correction sensor in real time, processes the collected data, and obtains the center position and deflection angle of the wafer substrate to be processed; According to the obtained center position of the wafer substrate to be processed, the center position of the wafer substrate to be processed is adjusted by the cooperation of the wafer positioning table and the inserting basket manipulator; According to the obtained deflection angle of the wafer substrate to be processed, the deflection angle of the wafer substrate to be processed is adjusted by the wafer positioning table; The workbench moves to the loading and unloading station, and the loading and unloading robot transfers the wafer substrate from the wafer positioning table to the processing fixture; The worktable moves to the processing station, and the machine tool automatically chamfers the wafer substrate; After the wafer substrate is processed, the workbench moves to the loading and unloading station, and the loading and unloading manipulator transfers the wafer substrate from the processing fixture to the drying table; The drying table rotates to dry the wafer substrate; The basket inserting robot transfers the spin-dried wafer substrate from the spin-drying table to the material basket.

[0015] The automatic chamfering machine tool for wafer substrates provided by the present invention is provided with a wafer positioning table on a material preparation device, and the center position of the wafer substrate to be processed and the deflection angle of the processed groove are detected by a correction sensor on the wafer positioning table, and then the center position and the deflection angle of the wafer substrate to be processed are adjusted according to the detected center position and the deflection angle of the wafer substrate to be processed by utilizing the cooperation between the insert basket manipulator and the wafer positioning table, thereby improving the positioning accuracy, eliminating the need for secondary positioning in the machine, avoiding the influence of environmental factors in the machine, and improving the processing efficiency; at the same time, a spin-drying table is provided to spin-dry the processed wafer substrate to avoid the environment being polluted by cutting fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 The figure is a schematic diagram of the assembly of the automatic chamfering machine for wafer substrates provided by the present invention.

[0018] Figure 2 yes Figure 1 Schematic diagram of the structure of the loading and unloading robot.

[0019] Figure 3 yes Figure 1 Schematic diagram of the structure of the middle basket manipulator.

[0020] Figure 4 yes Figure 1 Schematic diagram of the structure of the wafer positioning table.

[0021] Figure 5 yes Figure 4 Cross-sectional view of the wafer positioning stage.

[0022] Figure 6 yes Figure 1 Schematic diagram of the structure of the middle drying table.

[0023] Figure 7 yes Figure 6 Cross-sectional view of the spin drying table.

[0024] Figure 8 It is a schematic structural diagram of a wafer substrate provided by the present invention.

[0025] Fig. 9 yes Figure 3 Schematic diagram of the structure of the end suction cup.

[0026] Fig.10 yes Fig. 9 Exploded view of the mid-end suction cup.

[0027] Reference numerals: 1. Machine tool body; 11. Bed; 12. X-axis beam; 13. Column; 14. X-axis moving mechanism; 15. Y-axis moving mechanism; 16. Z-axis moving mechanism; 17. Workbench; 2. Processing jig; 3. Loading and unloading manipulator; 31. Bottom plate; 32. Third direct drive motor; 321. Sixth output flange; 33. Swing arm; 34. Second cylinder; 35. Suction cup connecting plate; 36. Vacuum suction cup; 37. Guide rail; 38. Slider; 4. Material preparation device; 41. Base frame; 42. Material basket; 43. Basket manipulator; 431. Horizontal moving module; 4311. Third output flange; 432. Suction cup mounting plate; 4321. Air source hole; 433. End suction cup; 4331. Upper tooth fork suction cup; 43311. Air suction port; 4332. Middle tooth fork suction cup; 43321. Air suction groove; 4333. Lower tooth fork suction cup; 43331. Air inlet; 4334. Sealant; 436. Mounting table; 435. Rotating motor; 4351. Second output flange; 434. Rotating shaft; 437. Height moving module; 4371. First output flange; 44. Wafer positioning table; 441. Correction mounting frame; 442. Correction sensor; 4421. Transmitter; 4422. Receiving end; 443. Sensor fixing plate; 444. Sensor moving module; 445. Vacuum rotary suction cup; 4451. First annular air groove; 4452. First air vent; 446. First direct drive motor; 4461. Fourth output flange; 4462. First hollow hole; 447. First rotary joint; 4471. First air inlet end; 4472. First rotary end; 45. Drying table; 451. Mounting seat; 4511. T-slot; 452. Protective shell; 4521. Drain port; 4522. Through hole; 453. Drying suction cup; 4531. Second annular air groove; 4532. Second air vent; 4533. Annular groove; 454. Second direct drive motor; 4541. Fifth output flange; 4542. Second hollow hole; 455. Second rotary joint; 4551. Second air inlet end; 4552. Second rotary end; 456. First cylinder; 457. Sealing ring; 5. Wafer substrate; 51. Groove. DETAILED DESCRIPTION

[0028] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0030] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0031] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0033] Combine the following Figures 1 to 10, the automatic chamfering machine tool and chamfering method for wafer substrates provided by the embodiments of the present invention are described in detail through specific embodiments and their application scenarios.

[0034] The following is a description of the automatic chamfering machine tool for wafer substrates provided by the present invention. Figures 1 to 7 The automatic chamfering machine tool for wafer substrates includes a machine tool body 1, a processing fixture 2, a material preparation device 4, a material basket 42, a wafer positioning table 44, a basket insertion manipulator 43, a loading and unloading manipulator 3 and a drying table 45. A workbench 17 is movably provided on the machine tool body 1, and the workbench 17 can reciprocate between the processing station and the loading and unloading station along a first direction; the processing fixture 2 is installed on the workbench 17; the material preparation device 4 is arranged in the first direction and is located at the peripheral side of the loading and unloading station; the material basket 42 is arranged on the material preparation device 4, and the material basket 42 is used to store wafer substrates 5; the wafer positioning table 44 is arranged on the material preparation device 4, and a correction sensor 442 is provided on the wafer positioning table 44. The correction sensor 442 is suitable for detecting the center position and deflection angle of the wafer substrate 5 to be processed; the basket robot 43 is arranged on the preparation device 4, and the basket robot 43 is used to transfer the wafer substrate 5 to be processed from the basket 42 to the wafer positioning table 44, and cooperate with the wafer positioning table 44 to adjust the center position and deflection angle of the wafer substrate 5 to be processed; the loading and unloading robot 3 is arranged on the machine tool body 1, and is located on the peripheral side of the loading and unloading station, and the loading and unloading robot 3 is used to load the adjusted wafer substrate 5 to be processed to the processing fixture 2; the drying table 45 is arranged on the preparation device 4, and the drying table 45 is used to dry the processed wafer substrate 5.

[0035] The machine tool host 1 includes a bed 11, an X-axis beam 12, a column 13, an X-axis moving mechanism 14, a Y-axis moving mechanism 15, a Z-axis moving mechanism 16 and a worktable 17. The X-axis beam 12 and the column 13 form a gantry structure installed on the bed 11; the X-axis moving mechanism 14 is installed on the X-axis beam 12 and can reciprocate along the X-axis direction; the Z-axis moving mechanism 16 on which a tool can be installed is installed on the X-axis moving mechanism 14, and on the one hand, it reciprocates along the Z-axis direction, and on the other hand, it reciprocates along the X-axis direction together with the X-axis moving mechanism 14; the Y-axis moving mechanism 15 is installed on the bed 11 and can reciprocate along the Y-axis direction; the worktable 17 is installed on the Y-axis moving mechanism 15, and the processing fixture 2 is installed on the worktable 17.

[0036] In the present application, a wafer positioning table 44 is arranged on the material preparation device 4, and the center position of the wafer substrate 5 to be processed and the deflection angle of the processing groove 51 are detected by the correction sensor 442 on the wafer positioning table 44, and then the center position and the deflection angle of the wafer substrate 5 to be processed are adjusted according to the detected center position and the deflection angle of the wafer substrate 5 to be processed, by utilizing the cooperation between the insert basket robot 43 and the wafer positioning table 44, thereby improving the positioning accuracy, eliminating the need for secondary positioning in the machine, avoiding the influence of environmental factors in the machine, and improving the processing efficiency; at the same time, a spin-drying table 45 is also arranged to spin-dry the processed wafer substrate 5 to avoid the cutting fluid from polluting the environment.

[0037] Reference Figure 4 and Figure 5 In some embodiments, the wafer positioning table 44 includes a deflection correction mounting frame 441, a sensor fixing plate 443, a vacuum rotating suction cup 445 and a rotating assembly. The deflection correction mounting frame 441 is installed on the material preparation device 4, the deflection correction sensor 442 is installed on the deflection correction mounting frame 441 through the sensor fixing plate 443, the rotating assembly is installed on the deflection correction mounting frame 441, and the vacuum rotating suction cup 445 is arranged on the rotating assembly. The vacuum rotating suction cup 445 is used to adsorb and fix the wafer substrate to be processed, and the rotating assembly is used to drive the wafer substrate to be processed on the vacuum rotating suction cup 445 to rotate.

[0038] Reference Figure 4 and Figure 5 In some embodiments, the wafer positioning platform 44 also includes a sensor moving module 444, which is connected between the sensor fixing plate 443 and the correction mounting frame 441, and the sensor moving module 444 is used to adjust the distance between the correction sensor 442 and the vacuum rotating suction cup 445.

[0039] Reference Figure 4 and Figure 5 In some embodiments, the correction sensor 442 includes a receiving end 4422 and a transmitting end 4421, and the receiving end 4422 and the transmitting end 4421 are spaced apart from each other to form a detection position.

[0040] Specifically, the wafer positioning table 44 includes a correction mounting frame 441, a correction sensor 442, a sensor fixing plate 443, a sensor moving module 444, a vacuum rotating suction cup 445, a first direct drive motor 446 and a first rotating joint 447. The vacuum rotating suction cup 445 is installed on the fourth output flange 4461 of the first direct drive motor 446. A first annular air groove 4451 is provided on the upper end surface of the vacuum rotating suction cup 445, and a first vent hole 4452 is provided in the middle of the vacuum rotating suction cup 445. The first rotating end 4472 on the first rotating joint 447 is fixedly connected to the first vent hole 4452 on the vacuum rotating suction cup 445, and the first rotating joint 447 is located in the first hollow hole 4462 of the first direct drive motor 446. The first air inlet end 4471 of the first rotary joint 447 is connected to the first annular air groove 4451 through the first rotary end 4472 and the first air vent 4452. When negative pressure air is introduced into the first air inlet end 4471, a negative pressure state is formed between the first rotary end 4472, the first air vent 4452 and the first annular air groove 4451, so as to adsorb the wafer substrate 5. When the first direct drive motor 446 rotates to drive the vacuum rotary suction cup 445 to rotate, the first rotary end 4472 on the first rotary joint 447 can rotate along with the vacuum rotary suction cup 445, and the first air inlet end 4471 on the first rotary joint 447 is fixed to ensure a stable supply of air source. The first direct drive motor 446 is fixed on the side of the deflection correction mounting frame 441, the sensor moving module 444 is fixedly mounted on the upper end of the deflection correction mounting frame 441, the sensor fixing plate 443 is installed on the output flange of the sensor moving module 444, the transmitting end 4421 of the deflection correction sensor 442 is installed on the upper end of the sensor fixing plate 443, the receiving end 4422 of the deflection correction sensor 442 is installed on the lower end of the sensor fixing plate 443, the wafer substrate 5 is placed between the transmitting end 4421 and the receiving end 4422 of the deflection correction sensor 442, and the sensor moving module 444 can drive the deflection correction sensor 442 to move to adapt to various specifications of wafer substrates 5. The wafer positioning stage 44 uses the first direct drive motor 446 to directly drive the vacuum rotating suction cup 445 to rotate, eliminating the deceleration unit, and has high stability and high positioning accuracy.

[0041] Reference Figure 3 In some embodiments, the basket robot 43 includes a mounting platform 436, a horizontal moving module 431, a height moving module 437, a rotating motor 435 and an end suction cup 433. The height moving module 437 is installed on the material preparation device 4, the rotating motor 435 is connected to the lifting end of the height moving module 437 through the mounting platform 436, the horizontal moving module 431 is arranged at the rotating end of the rotating motor 435, and the end suction cup 433 is arranged on the moving end of the horizontal moving module 431.

[0042] Specifically, the inserting basket robot 43 is a three-degree-of-freedom cylindrical coordinate robot, and the inserting basket robot 43 includes a horizontal moving module 431, a suction cup mounting plate 432, an end suction cup 433, a rotating shaft 434, a rotating motor 435, a mounting platform 436 and a height moving module 437. The height moving module 437 is installed vertically and can move along the Z direction. The mounting platform 436 is fixedly installed on the first output flange 4371 of the height moving module 437, the rotating motor 435 is fixedly installed on the mounting platform 436, and the rotating shaft 434 is installed on the second output flange 4351 of the rotating motor 435. The horizontal moving module 431 is horizontally fixedly installed on the rotating shaft 434, and can move radially along the rotation center of the rotating motor 435. The suction cup mounting plate 432 is fixedly installed on the third output flange 4311 of the horizontal moving module 431, and the end suction cup 433 is installed on the suction cup mounting plate 432 for adsorbing the wafer substrate 5.

[0043] Reference Fig. 9 and Fig.10 In some embodiments, the end suction cup 433 includes an upper fork suction cup 4331, a middle fork suction cup 4332 and a lower fork suction cup 4333, the upper fork suction cup 4331 is provided with a plurality of suction ports 43311, the plurality of suction ports 43311 are used to adsorb the wafer substrate 5, the middle fork suction cup 4332 is provided with a suction groove 43321, the lower fork suction cup 4333 is provided with an air inlet 43331, the air inlet 43331 is connected to the air source component, and the air inlet 43331 is connected to the air inlet 43311 through the suction groove 43321.

[0044] Specifically, the end suction cup 433 includes an upper fork suction cup 4331, a middle fork suction cup 4332 and a lower fork suction cup 4333. The upper fork suction cup 4331 is provided with an air suction port 43311 for adsorbing the wafer substrate 5. An air suction groove 43321 is provided in the middle of the middle fork suction cup 4332. An air inlet 43331 is provided on the lower fork suction cup 4333. A sealant 4334 is applied between the lower fork suction cup 4333 and the middle fork suction cup 4332, and a sealant 4334 is also applied between the middle fork suction cup 4332 and the upper fork suction cup 4331 to prevent air leakage. The air inlet 43331 is connected to the air source hole 4321 on the suction cup mounting plate 432, and the air inlet 43331 is connected to the air suction port 43311 through the air suction groove 43321. After negative pressure gas is introduced into the gas source hole 4321 , a negative pressure state is formed between the gas inlet 43331 , the gas suction groove 43321 and the gas suction port 43311 , thereby adsorbing the wafer substrate 5 .

[0045] Reference Figure 2In some embodiments, the loading and unloading robot 3 includes a base plate 31, a swing arm 33, a lifting assembly and a vacuum suction cup 36. The base plate 31 is installed on the workbench 17. The connecting end of the swing arm 33 is rotatably connected to the base plate 31. The vacuum suction cup 36 is connected to the free end of the swing arm 33 through the lifting assembly. The lifting assembly is used to drive the vacuum suction cup 36 to move in the height direction.

[0046] Specifically, the loading and unloading manipulator 3 includes a base plate 31, a third direct drive motor 32, a swing arm 33, a second cylinder 34, a suction cup connecting plate 35, a vacuum suction cup 36, a guide rail 37 and a slider 38. The third direct drive motor 32 is mounted on the base plate 31, the swing arm 33 is mounted on the sixth output flange 321 of the third direct drive motor 32, the second cylinder 34 is fixedly mounted at the end of the swing arm 33, the guide rail 37 is fixed at the end of the swing arm 33, the slider 38 is slidably connected to the guide rail 37, the suction cup connecting plate 35 is mounted on the slider 38, the second cylinder rod of the second cylinder 34 is fixedly connected to the suction cup connecting plate 35, the vacuum suction cup 36 is mounted on the suction cup connecting plate 35, the second cylinder 34 can drive the vacuum suction cup 36 to move up and down, the use of the third direct drive motor 32 ensures the rotation accuracy of the loading and unloading process, and the use of the guide rail 37 ensures the accuracy of the up and down movement of the vacuum suction cup 36. The use of the third direct drive motor 32 on the loading and unloading robot 3 ensures the rotation accuracy of the loading and unloading process, and the use of the guide rail 37 ensures the accuracy of the up and down movement of the vacuum suction cup 36, thereby improving the loading and unloading accuracy of the loading and unloading robot 3.

[0047] Reference Figure 6 and Figure 7 In some embodiments, the spin-drying table 45 includes a mounting seat 451, a protective shell 452, a first cylinder 456, a spin-drying suction cup 453 assembly and a spin-drying rotating assembly. The mounting seat 451 is arranged on the material preparation device 4, the first cylinder 456 is fixed on the mounting seat 451, the first cylinder rod of the first cylinder 456 is fixedly connected to the protective shell 452, the spin-drying rotating assembly is arranged on the material preparation device 4, a through hole 4522 is provided at the center position of the protective shell 452, the spin-drying rotating assembly is connected to the protective shell 452 through the through hole 4522, and one end of the spin-drying rotating assembly passes through the through hole 4522, and the spin-drying suction cup 453 assembly is arranged on the passing end of the spin-drying rotating assembly.

[0048] Specifically, the spin-drying table 45 includes a mounting base 451, a protective shell 452, a spin-drying suction cup 453, a second direct-drive motor 454, a second rotary joint 455, a first cylinder 456 and a sealing ring 457. Among them, the spin-drying rotating assembly includes a second drive motor and a second rotary joint 455. The spin-drying suction cup 453 is mounted on the fifth output flange 4541 of the second direct-drive motor 454, and a second annular air groove 4531 is provided on the upper end surface of the spin-drying suction cup 453, and a second vent 4532 is provided in the middle of the spin-drying suction cup 453. The second rotating end 4552 on the second rotary joint 455 is fixedly connected to the second vent 4532 on the spin-drying suction cup 453, and the second rotary joint 455 is located in the second hollow hole 4542 of the second direct-drive motor 454. The second air inlet end 4551 of the second rotary joint 455 is connected to the second annular air groove 4531 through the second rotary end 4552 and the second air vent 4532. When negative pressure air is introduced into the second air inlet end 4551, a negative pressure state is formed between the second rotary end 4552, the second air vent 4532 and the second annular air groove 4531 to adsorb the wafer substrate 5. When the second direct drive motor 454 rotates to drive the spin-drying suction cup 453 to rotate, the second rotary end 4552 on the second rotary joint 455 can rotate with the spin-drying suction cup 453, and the second air inlet end 4551 on the second rotary joint 455 is fixed to ensure a stable supply of air source. The second direct drive motor 454 is fixedly mounted on the mounting seat 451, and a drain port 4521 is provided on the protective shell 452, and a through hole 4522 is provided in the middle, and the through hole 4522 cooperates with the axial hole of the spin-drying suction cup 453, and the protective shell 452 is slidably mounted in the T-slot 4511 on the mounting seat 451, and the first cylinder 456 is fixed on the mounting seat 451, and the first cylinder rod of the first cylinder 456 is fixedly connected to the protective shell 452, which can push the protective shell 452 to move up and down along the T-slot 4511, and the spin-drying suction cup 453 is also provided with an annular groove 4533, and the sealing ring 457 is installed in the annular groove 4533, and is located between the spin-drying suction cup 453 and the protective shell 452, so as to prevent the cutting fluid from flowing out from the through hole 4522, and the protective shell 452 prevents the cutting fluid from splashing and collecting the cutting fluid during the process of spinning the wafer, and the drain port 4521 on the protective shell 452 discharges the collected cutting fluid into the container.

[0049] In some embodiments, the rotation center of the loading and unloading robot 3 is on the perpendicular bisector of the line connecting the centers of the vacuum rotating suction cup 445 and the spin-drying suction cup 453 assemblies.

[0050] Specifically, the basket robot 43 is fixed on the base frame 41, the two material baskets 42, the wafer positioning table 44 and the spin-drying table 45 are arranged along a circle with the rotation center of the rotating motor 435 on the basket robot 43 as the center, and are fixedly installed on the base frame 41, the material preparation device 4 is fixedly connected to the machine tool host 1, the processing fixture 2 is installed on the machine tool worktable 17, the loading and unloading robot 3 is installed on the rear side of the bed 11, and the rotation center of the loading and unloading robot 3 is on the perpendicular bisector of the line connecting the center of the vacuum rotating suction cup 445 of the wafer positioning table 44 and the center of the spin-drying suction cup 453 of the spin-drying table 45.

[0051] The present invention also provides a wafer substrate automatic chamfering method, which is applied to a wafer substrate automatic chamfering machine tool, and comprises the following steps: The basket robot 43 moves the end suction cup 433 to the bottom of the wafer substrate 5 in the material basket 42, the vacuum of the end suction cup 433 is turned on to absorb the wafer substrate 5, the wafer substrate 5 is taken out from the material basket 42, and is placed on the vacuum rotating suction cup 445 of the wafer positioning table 44, the negative pressure of the vacuum rotating suction cup 445 is turned on to absorb the wafer substrate 5, the vacuum of the end suction cup 433 is disconnected, and the basket robot 43 is removed.

[0052] The first direct drive motor 446 on the wafer positioning table 44 drives the wafer substrate 5 to rotate one circle, and collects in real time the rotation angle of the wafer substrate 5 to be positioned and the amount of occlusion of the wafer substrate 5 to be positioned by the correction sensor 442, and processes the collected data to determine the center position deviation of the wafer substrate 5 and the vacuum rotating suction cup 445, the angular deviation of the line connecting the center of the wafer substrate 5 and the center of the vacuum rotating suction cup 445 and the line connecting the center of the vacuum rotating suction cup 445 and the center of the rotating motor 435 of the basket robot 43, and the azimuth deviation of the processed groove 51 on the wafer substrate 5 and the line connecting the center of the vacuum rotating suction cup 445 and the center of the rotating motor 435 of the basket robot 43.

[0053] The first direct drive motor 446 on the wafer positioning table 44 is started, and according to the angle deviation value obtained above, the center of the wafer substrate 5 is rotated to the line connecting the center of the vacuum rotating suction cup 445 and the center of the rotating motor 435 of the inserting basket robot 43; the rotating motor 435 of the inserting basket robot 43 rotates, and the horizontal moving module 431 is rotated to the direction of the line connecting the center of the vacuum rotating suction cup 445 and the center of the rotating motor 435 of the inserting basket robot 43, and the horizontal moving module 431 moves the end suction cup 433 to the bottom of the wafer substrate 5, and the height moving module 437 moves up to make the end suction cup 433 contact the wafer substrate 5, and the negative pressure of the end suction cup 433 is opened The wafer substrate 5 is adsorbed, the negative pressure of the vacuum rotating suction cup 445 is disconnected, the height moving module 437 moves up, and the horizontal moving module 431 moves toward the center of the vacuum rotating suction cup 445 by the center position deviation calculated above, so that the center of the wafer substrate 5 to be positioned is coaxial with the center of the vacuum rotating suction cup 445, and the height moving module 437 drives the wafer substrate 5 to be positioned to descend along the Z axis, and places the wafer substrate 5 to be positioned on the vacuum rotating suction cup 445, and the negative pressure of the vacuum rotating suction cup 445 is turned on to adsorb the wafer substrate 5 to be positioned, and the negative pressure of the end suction cup 433 is disconnected, and the basket manipulator 43 is moved to the initial position.

[0054] According to the above-mentioned azimuth deviation, the first direct drive motor 446 rotates the processing groove 51 on the wafer substrate 5 to the connecting line between the center of the vacuum rotary chuck 445 and the center of the rotary motor 435 of the basket robot 43 .

[0055] The third direct drive motor 32 of the loading and unloading robot 3 rotates the swing arm 33 to above the wafer positioning table 44, the second cylinder 34 is pushed out, the vacuum suction cup 36 is turned on to negatively pressure and adsorb the wafer substrate 5, the negative pressure of the vacuum rotating suction cup 445 is disconnected, the second cylinder 34 is retracted, and the machine tool worktable 17 moves to the loading and unloading position of the non-processing area, the third direct drive motor 32 rotates the swing arm 33 to the upper and lower material positions, the second cylinder 34 is pushed out, and the wafer substrate 5 is placed on the processing fixture 2, the negative pressure of the processing fixture 2 is turned on to adsorb the wafer substrate 5, the negative pressure of the vacuum suction cup 36 is disconnected, the second cylinder 34 is retracted, and the loading and unloading robot 3 moves to the initial position.

[0056] The machine tool starts to automatically chamfer the wafer substrate 5 .

[0057] After the processing of the wafer substrate 5 is completed, the machine tool worktable 17 moves to the loading and unloading positions in the non-processing area, the third direct drive motor 32 of the loading and unloading robot 3 rotates the swing arm 33 to the loading and unloading positions, the second cylinder 34 is pushed out, and the vacuum suction cup 36 turns on the negative pressure to adsorb the wafer substrate 5, the negative pressure of the processing fixture 2 is disconnected, and the second cylinder 34 retreats, and the third direct drive motor 32 of the loading and unloading robot 3 rotates the swing arm 33 to the drying table 45, and the second cylinder 34 is pushed out to place the wafer substrate 5 on the drying suction cup 453 on the drying table 45, and the negative pressure of the drying suction cup 453 is turned on to adsorb the wafer substrate 5, the negative pressure of the vacuum suction cup 36 is disconnected, the second cylinder 34 retreats, and the loading and unloading robot 3 moves to the initial position.

[0058] The first cylinder 456 on the drying table 45 is pushed out to push the protective shell 452 upward, and the second direct drive motor 454 rotates at high speed to dry the wafer substrate 5. The second direct drive motor 454 stops rotating, and the first cylinder 456 retracts to drive the protective shell 452 downward.

[0059] The basket robot 43 moves the end suction cup 433 to below the wafer substrate 5 on the spin-drying table 45, the vacuum of the end suction cup 433 is turned on to adsorb the wafer substrate 5, the negative pressure of the spin-drying suction cup 453 is disconnected, the basket robot 43 moves the wafer substrate 5 to the material basket 42, the vacuum of the end suction cup 433 is disconnected, and the basket robot 43 moves to the initial position.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer substrate automatic chamfering machine, characterized in that: include: A machine tool body, on which a workbench is movably provided, and the workbench can reciprocate between a processing station and a loading and unloading station along a first direction; A processing jig, the processing jig is installed on the workbench; A material preparation device, the material preparation device is arranged in a first direction and is located around the loading and unloading station; A material basket, the material basket is arranged on the material preparation device, and the material basket is used to store wafer substrates; A wafer positioning platform, the wafer positioning platform is arranged on the material preparation device, and a correction sensor is provided on the wafer positioning platform, and the correction sensor is suitable for detecting the center position and deflection angle of the wafer substrate to be processed; A basket manipulator, the basket manipulator is arranged on the material preparation device, the basket manipulator is used to transfer the wafer substrate to be processed from the material basket to the wafer positioning table, and cooperate with the wafer positioning table to adjust the center position and deflection angle of the wafer substrate to be processed; A loading and unloading robot, which is arranged on the machine tool body and located on the peripheral side of the loading and unloading station, and is used to load the adjusted wafer substrate to be processed onto the processing jig; A drying table is arranged on the material preparation device, and is used to dry the processed wafer substrate.

2. The automatic chamfering machine for wafer substrates according to claim 1, characterized in that: The wafer positioning table includes a deflection correction mounting frame, a sensor fixing plate, a vacuum rotating suction cup and a rotating assembly. The deflection correction mounting frame is installed on the material preparation device. The deflection correction sensor is installed on the deflection correction mounting frame through the sensor fixing plate. The rotating assembly is installed on the deflection correction mounting frame. The vacuum rotating suction cup is arranged on the rotating assembly. The vacuum rotating suction cup is used to adsorb and fix the wafer substrate to be processed. The rotating assembly is used to drive the wafer substrate to be processed on the vacuum rotating suction cup to rotate.

3. The automatic chamfering machine for wafer substrates according to claim 2, characterized in that: The wafer positioning platform also includes a sensor moving module, which is connected between the sensor fixing plate and the deviation correction mounting frame, and is used to adjust the distance between the deviation correction sensor and the vacuum rotating suction cup.

4. The automatic chamfering machine for wafer substrates according to claim 3, characterized in that: The deflection correction sensor comprises a receiving end and a transmitting end, and the receiving end and the transmitting end are spaced apart from each other to form a detection position.

5. The automatic chamfering machine for wafer substrates according to any one of claims 1 to 4, characterized in that: The basket insertion robot includes a mounting platform, a horizontal moving module, a height moving module, a rotating motor, a rotating shaft and an end suction cup. The height moving module is mounted on the material preparation device. The rotating motor is connected to the lifting end of the height moving module through the mounting platform. The horizontal moving module is mounted on the rotating shaft, which is arranged at the rotating end of the rotating motor. The end suction cup is arranged on the moving end of the horizontal moving module.

6. The automatic chamfering machine for wafer substrates according to claim 5, characterized in that: The end suction cup includes an upper fork suction cup, a middle fork suction cup and a lower fork suction cup. The upper fork suction cup is provided with a plurality of suction ports, which are used to adsorb wafer substrates. The middle fork suction cup is provided with a suction groove, and the lower fork suction cup is provided with an air inlet, which is connected to an air source component, and the air inlet is connected to the suction port through the suction groove.

7. The automatic chamfering machine for wafer substrates according to any one of claims 1 to 4, characterized in that: The loading and unloading robot includes a base plate, a swing arm, a lifting assembly and a vacuum suction cup. The base plate is installed on the workbench. The connecting end of the swing arm is rotatably connected to the base plate. The vacuum suction cup is connected to the free end of the swing arm through the lifting assembly. The lifting assembly is used to drive the vacuum suction cup to move in the height direction.

8. The automatic chamfering machine for wafer substrates according to claim 2, characterized in that: The spin-drying table includes a mounting seat, a protective shell, a first cylinder, a spin-drying suction cup assembly and a spin-drying rotating assembly. The mounting seat is arranged on the material preparation device, the first cylinder is fixed on the mounting seat, the first cylinder rod of the first cylinder is fixedly connected to the protective shell, the spin-drying rotating assembly is arranged on the material preparation device, a through hole is provided at the center position of the protective shell, the spin-drying rotating assembly is connected to the protective shell through the through hole, and one end of the spin-drying rotating assembly passes through the through hole, and the spin-drying suction cup assembly is arranged on the passing end of the spin-drying rotating assembly.

9. The automatic chamfering machine for wafer substrates according to claim 8, characterized in that: The rotation center of the loading and unloading robot is on the perpendicular bisector of the line connecting the centers of the vacuum rotating suction cup and the spin-drying suction cup assembly.

10. A method for automatic chamfering of wafer substrates, applied to the automatic chamfering machine tool for wafer substrates as claimed in any one of claims 1 to 9, characterized in that: The steps include: The wafer substrate to be processed is taken out from the material basket by a basket inserting robot and then placed on the wafer positioning table; The wafer positioning table drives the wafer substrate to rotate one circle, collects the rotation angle of the wafer substrate to be positioned and the shielding amount of the wafer substrate to be positioned by the correction sensor in real time, processes the collected data, and obtains the center position and deflection angle of the wafer substrate to be processed; According to the obtained center position of the wafer substrate to be processed, the center position of the wafer substrate to be processed is adjusted by the cooperation of the wafer positioning table and the inserting basket manipulator; According to the obtained deflection angle of the wafer substrate to be processed, the deflection angle of the wafer substrate to be processed is adjusted by the wafer positioning table; The workbench moves to the loading and unloading station, and the loading and unloading robot transfers the wafer substrate from the wafer positioning table to the processing fixture; The worktable moves to the processing station, and the machine tool automatically chamfers the wafer substrate; After the wafer substrate is processed, the workbench moves to the loading and unloading station, and the loading and unloading manipulator transfers the wafer substrate from the processing fixture to the drying table; The drying table rotates to dry the wafer substrate; The basket inserting robot transfers the spin-dried wafer substrate from the spin-drying table to the material basket.

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