Liquid forming device and method

Abstract

The invention provides a liquid forming device and method. The liquid forming device comprises a forming cavity, wherein a preformed part is placed in the forming cavity; the resin storage part is used for containing resin conveyed into the forming cavity; the forming cavity and the resin storage part are arranged in the first cavity, and the first cavity can be heated; the resin collecting part is used for collecting redundant resin in the forming cavity; the vacuumizing part is used for vacuumizing the first cavity; the resin collecting part and the vacuumizing part are arranged in the second cavity. According to the liquid forming device, liquid forming components are all integrated in the same device, cross-equipment connection between the components is avoided, and the temperature stability during heating of the first cavity is guaranteed. According to the liquid forming device, the first cavity can be heated, the first cavity can be vacuumized through the vacuumizing part, defoaming, pouring and curing of resin can be carried out in the liquid forming device, the efficiency is improved, and meanwhile the forming cavity can be prevented from being carried.

Description

Technical Field

[0001] The present disclosure relates to the technical field of liquid molding, and in particular to a liquid molding device and method. Background Art

[0002] As a cutting-edge manufacturing technology, liquid molding technology has an irreplaceable position in many cutting-edge manufacturing fields due to its unique advantages. The core of this process is to cleverly use the vacuum environment to accurately control the flow and penetration of resin to manufacture high-precision, high-quality products. Especially in the aviation and aerospace industries, facing the requirements of component precision and strength, the liquid molding process has shown extraordinary adaptability, which not only guarantees product quality, but also greatly promotes the improvement of large-scale production capacity, injecting strong impetus into the vigorous development of the aviation and aerospace fields.

[0003] Existing liquid molding equipment mainly consists of an oven, a resin collector, and a vacuum pump connected by pipes. During the resin infusion process, the pipes often connect the tooling and the resin collector through the oven door gap, causing the oven to dissipate heat during resin infusion, resulting in the actual temperature in the oven not matching the displayed temperature, affecting the molding effect and performance of the product. In addition, an additional vacuum oven is usually required for degassing before resin infusion, which makes the equipment connection complex and the operation efficiency low. Summary of the invention

[0004] In order to solve the problems existing in the related art, the present disclosure provides a liquid forming device and method.

[0005] According to a first aspect of an embodiment of the present disclosure, there is provided a liquid forming device, comprising:

[0006] A molding cavity, in which the preform is placed;

[0007] A resin storage portion, connected to the first end of the molding cavity, the resin storage portion being used to hold the resin transported into the molding cavity;

[0008] A first cavity, wherein the molding cavity and the resin storage portion are disposed in the first cavity, and the first cavity can be heated;

[0009] A resin collecting portion, connected to the second end of the molding cavity, and used for collecting excess resin in the molding cavity;

[0010] A vacuum pumping unit, the vacuum pumping unit is used to vacuum the first cavity;

[0011] The second cavity is fixedly connected to the first cavity, and the resin collecting part and the vacuuming part are arranged in the second cavity.

[0012] In some embodiments of the present disclosure, the resin storage portion is connected to the first end of the molding cavity through a first flow path; the resin collection portion is connected to the second end of the molding cavity through a second flow path, and the second flow path runs through the wall between the first cavity and the second cavity.

[0013] In some embodiments of the present disclosure, the resin collecting part is a closed structure; the vacuuming part is connected to the resin collecting part through a first passage, a first valve is provided on the first passage, and the opening of the first valve is adjustable.

[0014] In some embodiments of the present disclosure, one end of the first passage communicating with the resin collecting portion is located above the liquid level in the resin collecting portion; and / or,

[0015] One end of the second flow path communicating with the resin collecting portion is located above the liquid level in the resin collecting portion.

[0016] In some embodiments of the present disclosure, the vacuum pumping part is connected to the first cavity through a second passage, and the second passage runs through the wall between the first cavity and the second cavity; a second valve is provided on the second passage, and the second valve is located in the second cavity, and the opening of the second valve is adjustable.

[0017] In some embodiments of the present disclosure, the molding cavity is formed by a mold below and a bag film above, the bag film includes an inner bag film and an outer bag film, the second passage is connected to the bag film space formed by the inner bag film, the outer bag film and the mold, and the second valve is used to control the suction speed of the vacuum part in the bag film space.

[0018] In some embodiments of the present disclosure, an end of the first passage close to the vacuum pumping portion is connected to an end of the second passage close to the vacuum pumping portion.

[0019] In some embodiments of the present disclosure, a thermal insulation layer is provided on the wall surface enclosing the first cavity.

[0020] According to a second aspect of an embodiment of the present disclosure, a liquid molding method is provided, which is applied to the liquid molding device as described above, and the liquid molding method comprises:

[0021] Opening the second valve and the vacuum pump of the liquid molding device, sucking air into the first cavity through the second passage to degas the resin in the resin storage part, and closing the second valve after the degassing is completed;

[0022] Opening the first valve of the liquid molding device, sucking air into the resin collecting part through the first passage to generate negative pressure in the resin collecting part, so that the resin in the resin storage part is drawn into the molding cavity for infusion, and closing the first valve after the infusion is completed;

[0023] The resin storage portion is removed from the first cavity, and the molding cavity is heated through the first cavity to solidify the resin in the molding cavity to obtain a molded part.

[0024] In some embodiments of the present disclosure, the step of sucking air into the resin collecting portion through the first passage to generate negative pressure in the resin collecting portion so that the resin in the resin storage portion is drawn into the molding cavity for infusion includes:

[0025] After the first valve is opened, the vacuuming part sucks air from the resin collecting part through the first passage, so that negative pressure is generated in the resin collecting part;

[0026] The negative pressure of the resin collecting portion generates suction force on the second flow path, so that the second flow path generates negative pressure;

[0027] The negative pressure of the second flow path generates suction force on the molding cavity, so that the molding cavity generates negative pressure;

[0028] The negative pressure of the molding cavity generates suction force on the first flow path, so that the first flow path generates negative pressure;

[0029] The negative pressure of the first flow path generates suction force on the resin in the resin storage portion, so that the resin flows into the molding cavity for pouring.

[0030] The beneficial effects of the present disclosure include but are not limited to: the liquid molding device provided by the present disclosure includes a first cavity and a second cavity that are fixedly connected, the molding cavity and the resin storage part are arranged in the first cavity, and the resin collection part and the vacuum part are arranged in the second cavity, that is, the components of liquid molding are all integrated and arranged in the same device, avoiding cross-device connection between components, simplifying the device, and ensuring the temperature stability when the first cavity is heated. In addition, the first cavity can be heated to solidify the resin in the molding cavity, and the vacuum part can also vacuum the first cavity to degas the resin in the resin storage part in the first cavity, thereby achieving that the degassing, infusion, and solidification of the resin can all be carried out in the liquid molding device, which improves efficiency while avoiding the transportation of the molding cavity.

[0031] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings incorporated into the specification and constituting a part of the specification illustrate embodiments of the present disclosure and are used together with the description to explain the principles of the embodiments of the present disclosure. In these drawings, similar reference numerals are used to represent similar elements. The drawings described below are some embodiments of the present disclosure, rather than all embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 is a schematic diagram of a liquid forming device according to an exemplary embodiment of the present disclosure;

[0034] Figure 2 It is a schematic diagram of a liquid molding device according to an exemplary embodiment of the present disclosure when used as a resin degassing device;

[0035] Figure 3 is a schematic diagram of a liquid forming device according to an exemplary embodiment of the present disclosure;

[0036] Figure 4 It is a schematic flow chart of a liquid forming method according to an exemplary embodiment of the present disclosure;

[0037] Figure 5 It is a schematic flow chart of a liquid forming method according to another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the present disclosure clearer, the technical solution of the present disclosure will be clearly and completely described in combination with the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other without conflict.

[0039] The liquid molding equipment in the related art mainly consists of an oven, a resin collector, and a vacuum pump connected by pipes. During the resin infusion process, the pipes often connect the tooling and the resin collector through the oven door gap, which causes the oven to dissipate heat during resin infusion, resulting in the actual temperature in the oven not matching the displayed temperature, affecting the molding effect and performance of the product. In addition, an additional vacuum oven is usually required for degassing before resin infusion, which makes the equipment connection complicated and the operation efficiency low.

[0040] In order to solve the above technical problems, the present disclosure provides a liquid molding device, which includes a first cavity and a second cavity that are fixedly connected, the molding cavity and the resin storage part are arranged in the first cavity, and the resin collection part and the vacuum part are arranged in the second cavity, that is, the liquid molding components are all integrated and arranged in the same device, avoiding cross-device connection between components, simplifying the device, and ensuring the temperature stability when the first cavity is heated. In addition, the first cavity can be heated to solidify the resin in the molding cavity, and the vacuum part can also vacuum the first cavity to degas the resin in the resin storage part in the first cavity, thereby achieving that the degassing, infusion, and curing of the resin can all be carried out in the liquid molding device, which improves efficiency while avoiding the transportation of the molding cavity.

[0041] The present disclosure provides a liquid forming device, such as Figure 1 As shown, the liquid molding device 100 includes a molding cavity 10, a resin storage part 20, a first cavity 30, a resin collecting part 40, a vacuum part 50 and a second cavity 60. The preform is placed in the molding cavity 10. The resin storage part 20 is connected to the first end of the molding cavity 10. The resin storage part 20 is used to hold the resin transported to the molding cavity 10. The molding cavity 10 and the resin storage part 20 are arranged in the first cavity 30, and the first cavity 30 can be heated. For example, the first cavity can be the inner cavity of an oven. The resin collecting part 40 is connected to the second end of the molding cavity 10, and the resin collecting part 40 is used to collect excess resin in the molding cavity 10. The vacuum part 50 is used to vacuum the first cavity 30. The second cavity 60 is fixedly connected to the first cavity 30, and the resin collecting part 40 and the vacuum part 50 are arranged in the second cavity 60. The liquid molding device 100 includes a first cavity 30 and a second cavity 60 which are fixedly connected. The molding cavity 10 and the resin storage part 20 are arranged in the first cavity 30, and the resin collection part 40 and the vacuum part 50 are arranged in the second cavity 60, that is, the components of liquid molding are integrated and arranged in the same device, which avoids cross-device connection between components, simplifies the device, and ensures the temperature stability when the first cavity 30 is heated. In addition, the first cavity 30 can be heated to solidify the resin in the molding cavity 10, and the vacuum part 50 can also vacuum the first cavity 30 to degas the resin in the resin storage part 20 in the first cavity 30, thereby achieving that the degassing, infusion, and curing of the resin can all be carried out in the liquid molding device 100, which improves efficiency and avoids the transportation of the molding cavity.

[0042] In one embodiment, if Figure 1As shown, the resin storage part 20 is connected to the first end of the molding cavity 10 through the first flow path 11; the resin collection part 40 is connected to the second end of the molding cavity 10 through the second flow path 12, and the second flow path 12 runs through the wall between the first cavity 30 and the second cavity 60.

[0043] The resin storage part 20 is disposed in the first cavity 30, and the first cavity 30 can be heated, so that the resin can be preheated during the resin infusion process, thereby improving the fluidity of the resin and reducing the viscosity of the resin. The resin storage part 20 is in the first cavity 30, and is connected to the first end of the molding cavity 10 through the first flow path 11 to transport the resin into the molding cavity 10. In this way, the resin in the resin storage part 20 can be preheated through the first cavity 30, and the cross-equipment connection between the resin storage part 20 and the molding cavity 10 is avoided, thereby ensuring the airtightness of the first cavity 30, thereby ensuring the temperature stability of the first cavity 30 when heated.

[0044] It is understandable that the first cavity 30 can be heated, so the resin storage part 20 is arranged in the first cavity 30 to preheat the resin during the resin infusion process. The vacuuming part 50 does not need to be heated, so the vacuuming part 50 is arranged in the second cavity 60 without a heating function to avoid high temperature damage to the components in the vacuuming part 50. In addition, the resin in the resin collecting part 40 does not need to be heated, so the resin collecting part 40 can be arranged in the second cavity 60 without a heating function.

[0045] After the resin infusion is completed, before the first cavity 30 is set to heat up to solidify the resin in the molding cavity 10, the resin storage part 20, the first flow path 11 and the second flow path 12 can be taken out from the first cavity 30 to prevent the remaining resin in the resin storage part 20, the first flow path 11 and the second flow path 12 from solidifying and affecting the subsequent cleaning and reuse.

[0046] The resin collecting part 40 is arranged in the second cavity 60. After the resin is poured into the molding cavity 10, the excess resin is transported from the second end of the molding cavity 10 to the resin collecting part 40 through the second flow path 12. The second flow path 12 runs through the wall between the first cavity 30 and the second cavity 60, that is, the resin collecting part 40 and the resin pouring part (resin storage part 20 and molding cavity 10) are integrated in the liquid molding device 100, avoiding cross-device connection between parts, simplifying the device, and ensuring the airtightness of the first cavity 30, thereby ensuring the temperature stability of the first cavity 30 when heated.

[0047] In one embodiment, if Figure 1As shown, the resin collecting part 40 is a closed structure; the vacuuming part 50 is connected to the resin collecting part 40 through the first passage 21, and the first passage 21 is provided with a first valve 31, and the opening of the first valve 31 is adjustable.

[0048] During the process of pouring the resin from the resin storage part 20 into the molding cavity 10, the vacuuming part 50 is connected to the resin collecting part 40 through the first passage 21, and when the first valve 31 on the first passage 21 is opened, the vacuuming part 50 evacuates the sealed resin collecting part 40 to generate negative pressure in the resin collecting part 40. The negative pressure in the resin collecting part 40 generates suction force on the air in the second flow path 12, so that negative pressure is generated in the second flow path 12. The negative pressure in the second flow path 12 generates suction force on the air in the molding cavity 10, so that negative pressure is generated in the molding cavity 10. The negative pressure in the molding cavity 10 generates suction force on the air in the first flow path 11, so that negative pressure is generated in the first flow path 11. One end of the first flow path 11 that is connected to the resin storage part 20 is located below the liquid level in the resin storage part 20, and the negative pressure in the first flow path 11 generates suction force on the resin in the resin storage part 20, so that the resin in the resin storage part 20 is extracted into the molding cavity 10 for the resin pouring. It can be understood that the vacuum pump 50, i.e., the power component for resin infusion, is integrated with the resin infusion components (resin storage unit 20 and molding cavity 10) in the liquid molding device 100, thereby avoiding cross-device connection between components and simplifying the device.

[0049] The first passage 21 is provided with a first valve 31 , and the opening of the first valve 31 is adjustable. By adjusting the opening of the first valve 31 , the vacuuming speed of the vacuuming part 50 can be controlled, thereby controlling the speed of resin injection in the molding cavity 10 .

[0050] In this embodiment, during the resin infusion process in the molding cavity 10, the vacuum unit 50 performs air suction and provides power for the resin infusion through the passage formed by the first passage 21-resin collecting unit 40-second flow path 12-molding cavity 10-first flow path 11. After the resin infusion in the molding cavity 10 is completed, the excess resin in the molding cavity 10 is transported to the resin collecting unit 40 through the second flow path 12. The liquid molding device 100 can realize the resin infusion and the preparation of the molded parts through a simple structure, saving the construction cost of the device and improving the preparation efficiency of the molded parts.

[0051] In one embodiment, if Figure 1 As shown, one end of the first passage 21 communicating with the resin collecting part 40 is located above the liquid level in the resin collecting part 40 ; and one end of the second flow path 12 communicating with the resin collecting part 40 is located above the liquid level in the resin collecting part 40 .

[0052] During the resin infusion process in the molding cavity 10, the vacuum unit 50 sucks air and provides power for the resin infusion through the first passage 21-resin collecting portion 40-second flow path 12-molding cavity 10-first flow path 11. If one end of the first passage 21 connected to the resin collecting portion 40 is located below the liquid level in the resin collecting portion 40, the end of the first passage 21 connected to the resin collecting portion 40 is blocked by the resin in the resin collecting portion 40, and the vacuum unit 50 cannot vacuum through the passage formed by the first passage 21-resin collecting portion 40-second flow path 12-molding cavity 10-first flow path 11 to provide power for the resin infusion. Similarly, if one end of the second flow path 12 connected to the resin collection part 40 is located below the liquid level in the resin collection part 40, the one end of the second flow path 12 connected to the resin collection part 40 is blocked by the resin in the resin collection part 40, and the vacuuming part 50 cannot vacuumize the passage formed by the first passage 21-resin collection part 40-second flow path 12-molding cavity 10-first flow path 11 to provide power for the resin infusion. Therefore, one end of the first passage 21 connected to the resin collection part 40 and one end of the second flow path 12 connected to the resin collection part 40 need to be set above the liquid level in the resin collection part 40, so as to form a passage of the first passage 21-resin collection part 40-second flow path 12-molding cavity 10-first flow path 11 during the resin infusion process, and the vacuuming part 50 performs vacuuming to provide power for the resin infusion.

[0053] In one embodiment, a release agent may be applied to the inner wall of the resin collecting portion 40 to facilitate the cleaning of the resin. In addition, the resin collecting portion 40 needs to be removed from the second cavity 60 regularly and the resin therein needs to be cleaned to prevent the resin collected in the resin collecting portion 40 from overflowing excessively or the liquid level from being too high, thereby blocking the first passage 21 and the second flow path 12.

[0054] In one embodiment, if Figure 1 As shown, the vacuum part 50 is connected to the first cavity 30 through the second passage 22, and the second passage 22 runs through the wall between the first cavity 30 and the second cavity 60; a second valve 32 is provided on the second passage 22, and the second valve 32 is located in the second cavity 60, and the opening of the second valve 32 is adjustable.

[0055] The vacuuming part 50 is connected to the first cavity 30 through the second passage 22, and the second passage 22 is provided with a second valve 32. Before the resin is poured into the molding cavity 10, the second valve 32 can be opened so that the vacuuming part 50 can vacuum the first cavity 30 to generate a negative pressure in the first cavity 30, thereby degassing the resin in the resin storage part 20 in the first cavity 30 to prevent the presence of bubbles in the resin and affect the performance of the prepared molded part. After the resin in the resin storage part 20 is degassed, the second valve 32 can be closed, the first valve 31 can be opened, and the resin pouring can be started. It can be seen that the degassing and pouring of the resin can be completed in the liquid molding device 100, avoiding the resin being degassed in an external degassing device and then moved to the liquid molding device, which is complicated to operate and bubbles may be generated during the movement.

[0056] The second valve 32 on the second passage 22 has an adjustable opening. By adjusting the opening of the second valve, the speed of the vacuuming part 50 in evacuating the first cavity 30 can be controlled, so that the appropriate resin degassing speed can be set according to different resin types.

[0057] For example, the liquid molding device 100 in this embodiment can also be used as a dedicated resin degassing device, such as Figure 2 As shown in the figure, there is no need to set up a resin infusion component (resin storage part and molding cavity), a resin collection part and a second flow path in the device. Only a vacuum pumping part 50, a second passage 22 and a second valve 32 are set. When the resin storage part 20 is placed in the first cavity 30 and the resin in the resin storage part 20 is to be degassed, the second valve 32 is opened and the opening of the second valve 32 is adjusted so that the vacuum pumping part 50 in the second cavity 60 can vacuum the first cavity 30 to achieve degassed resin in the resin storage part 20.

[0058] Exemplarily, the first flow path 11 , the second flow path 12 , the first passage 21 , and the second passage 22 may all be pipes formed of polytetrafluoroethylene tubes.

[0059] Exemplarily, the first valve 31 and the second valve 32 may both be double-inserted ball valves.

[0060] In one embodiment, if Figure 3 As shown, the molding cavity 10 is formed by a mold below and a bag film above, the bag film includes an inner bag film (not shown in the figure) and an outer bag film (not shown in the figure), the second passage 22 is connected to the bag film space formed by the inner bag film, the outer bag film and the mold, and the second valve 32 is used to control the suction speed of the vacuum part 50 in the bag film space.

[0061] In this embodiment, the mold is located below the molding cavity 10, and the inner bag film and the outer bag film are located above the molding cavity 10 respectively, that is, the molding cavity 10 is formed by the mold and the double bag film. This ensures that when one layer of the inner bag film or the outer bag film is damaged, the molding cavity 10 can still be guaranteed to be airtight. Only when both the inner bag film and the outer bag film are damaged, the airtight state of the molding cavity 10 will be destroyed. Therefore, the setting of the double bag film can form a "double insurance" for the airtight state of the molding cavity 10, effectively improving the success rate of preparing molded parts.

[0062] When the mold is located below the molding cavity 10 and the inner bag film and the outer bag film are located above the molding cavity 10 in sequence, the second flow path 12 can still be connected to the second end of the molding cavity 10 to suck out the air in the molding cavity 10 through negative pressure and extract the resin in the resin storage part 20 into the molding cavity 10. The second passage 22 can be connected to the bag film space enclosed by the inner bag film, the outer bag film and the mold. The suction part 50 suctions the bag film space enclosed by the inner bag film, the outer bag film and the mold through the second passage 22, so that the outer bag film is attached to the top of the inner bag film. In addition, the second valve 32 can control the suction speed of the vacuum part 50 in the bag film space. For example, when the bag film space is small, the second valve 32 can be set to a smaller opening so that the outer bag film can be slowly and evenly attached to the top of the inner bag film.

[0063] In one embodiment, if Figure 1 As shown, one end of the first passage 21 close to the vacuum part 50 is connected to one end of the second passage 22 close to the vacuum part 50. That is, the first passage 21 and the second passage 22 are connected to the same outlet of the vacuum part 50, which simplifies the device structure and avoids complicated pipeline connection.

[0064] In one embodiment, if Figure 1 As shown, a thermal insulation layer 70 is provided on the wall surface enclosing the first cavity 30. The first cavity 30 can be heated, so that the resin in the resin storage part 20 can be preheated during the resin infusion process, and the resin in the molding cavity 10 can be cured by heating after the resin infusion is completed. The thermal insulation layer 70 is provided on the wall surface enclosing the first cavity 30, such as a rock wool thermal insulation layer, so that the first cavity 30 can be insulated, heat loss in the first cavity 30 can be avoided, and the temperature in the first cavity 30 can be further maintained stable.

[0065] The present disclosure provides a liquid forming method, which is applied to the liquid forming device as described above, combined with Figure 1 and Figure 4 As shown, the liquid forming device includes:

[0066] S100, opening the second valve 32 and the vacuum pumping unit 50 of the liquid molding device 100, sucking air into the first cavity 30 through the second passage 22 to degas the resin in the resin storage unit 20, and closing the second valve 32 after the degassing is completed;

[0067] S200, opening the first valve 31 of the liquid molding device 100, and sucking air into the resin collecting part 40 through the first passage 21 to generate negative pressure in the resin collecting part 40, so that the resin in the resin storage part 20 is drawn into the molding cavity 10 for pouring, and after the pouring is completed, closing the first valve 31;

[0068] S300 , removing the resin storage portion 20 from the first cavity 30 , and heating the molding cavity 10 through the first cavity 30 to solidify the resin in the molding cavity 10 to obtain a molded part.

[0069] The liquid molding method provided in this embodiment, in a liquid molding device 100 with a simple structure, can achieve one-stop degassing, infusion, and curing of the resin by controlling the opening and closing of the first valve 31 and the second valve 32, as well as the heating function of the first cavity 30, thereby improving the preparation efficiency of the molded parts and avoiding the transportation of the molding cavity.

[0070] In one embodiment, the resin collecting portion 40 is sucked through the first passage 21 to generate negative pressure in the resin collecting portion 40, so that the resin in the resin storage portion 20 is drawn into the molding cavity 10 for infusion. Figure 1 and Figure 5 As shown, including:

[0071] S201, after the first valve 31 is opened, the vacuuming unit 50 sucks air from the resin collecting unit 40 through the first passage 21, so that negative pressure is generated in the resin collecting unit 40;

[0072] S202, the negative pressure of the resin collecting part 40 generates suction force on the second flow path 12, so that the second flow path 12 generates negative pressure;

[0073] S203, the negative pressure of the second flow path 12 generates suction force on the molding cavity, so that the molding cavity 10 generates negative pressure;

[0074] S204, the negative pressure of the molding cavity 10 generates suction force on the first flow path 11, so that the first flow path 11 generates negative pressure;

[0075] S205 , the negative pressure of the first flow path 11 generates suction force on the resin in the resin storage portion 20 , so that the resin flows into the molding cavity 10 for pouring.

[0076] In this embodiment, during the resin infusion process in the molding cavity 10, the vacuum unit 50 performs air suction and provides power for the resin infusion through the passage formed by the first passage 21-resin collection unit 40-second flow path 12-molding cavity 10-first flow path 11, and extracts the resin in the resin storage unit 20 into the molding cavity 10 for resin infusion. This method can control the resin infusion only by controlling the opening and closing and the opening degree of the first valve 31, and has simple operation, high degree of automation, and controllable infusion speed, thereby improving the success rate and efficiency of the preparation of the molded parts.

[0077] In order to more clearly explain the technical solution of the present disclosure, Examples 1-2 are given by using the liquid forming device provided by the exemplary embodiment of the present disclosure and according to the liquid forming method provided by the exemplary embodiment of the present disclosure.

[0078] Example 1

[0079] Combination Figure 1 As shown:

[0080] The second valve 32 and the vacuum pump 50 are opened, and the first cavity 30 is sucked through the second passage 22 to degas the resin in the resin storage part 20. After the degassing is completed, the second valve 32 is closed.

[0081] The first cavity 30 is heated to the preheating temperature, the first valve 31 is opened, and the vacuum unit 50 sucks air from the resin collecting unit 40 through the first passage 21, so that negative pressure is generated in the resin collecting unit 40; the negative pressure of the resin collecting unit 40 generates suction force on the second flow path 12, so that negative pressure is generated in the second flow path 12; the negative pressure of the second flow path 12 generates suction force on the molding cavity, so that negative pressure is generated in the molding cavity 10; the negative pressure of the molding cavity 10 generates suction force on the first flow path 11, so that negative pressure is generated in the first flow path 11; the negative pressure of the first flow path 11 generates suction force on the resin in the resin storage unit 20, so that the resin flows into the molding cavity 10 for infusion. After the infusion is completed, the first valve 31 is closed.

[0082] The resin storage part 20, the first flow path 11 and the second flow path 12 are removed from the first cavity 30, the first cavity 30 is heated to a curing temperature, and the molding cavity 10 is heated by the first cavity 30 to cure the resin in the molding cavity 10 to obtain a molded part.

[0083] Example 2

[0084] Combination Figure 3 As shown:

[0085] The first cavity 30 is heated to the preheating temperature, and the first valve 31 and the second valve 32 are opened. The vacuuming part 50 sucks air from the resin collecting part 40 through the first passage 21, so that negative pressure is generated in the resin collecting part 40; the negative pressure of the resin collecting part 40 generates suction force on the second flow path 12, so that the second flow path 12 generates negative pressure; the negative pressure of the second flow path 12 generates suction force on the molding cavity, so that negative pressure is generated in the molding cavity 10; the negative pressure of the molding cavity 10 generates suction force on the first flow path 11, so that negative pressure is generated in the first flow path 11; the negative pressure of the first flow path 11 generates suction force on the resin in the resin storage part 20, so that the resin flows into the molding cavity 10 for infusion. At the same time, the vacuuming part 50 sucks air from the bag film space enclosed by the inner bag film, the outer bag film and the mold through the second passage 22. After the infusion is completed, the first valve 31 is closed and the second valve 32 is kept open.

[0086] The resin storage part 20, the first flow path 11 and the second flow path 12 are removed from the first cavity 30, the first cavity 30 is heated to a curing temperature, and the molding cavity 10 is heated by the first cavity 30 to cure the resin in the molding cavity 10 to obtain a molded part.

[0087] The contents described above may be implemented individually or in combination in various ways, and these variations are all within the protection scope of the present disclosure.

[0088] Finally, it should be noted that in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0089] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A liquid forming device, characterized in that: include: A molding cavity, in which a preform is placed; A resin storage portion, connected to the first end of the molding cavity, and used for containing the resin transported into the molding cavity; A first cavity, wherein the molding cavity and the resin storage portion are disposed in the first cavity, and the first cavity can be heated; A resin collecting portion, connected to the second end of the molding cavity, and used for collecting excess resin in the molding cavity; A vacuum pumping unit, the vacuum pumping unit is used to vacuum the first cavity; The second cavity is fixedly connected to the first cavity, and the resin collecting part and the vacuuming part are arranged in the second cavity.

2. The liquid forming device according to claim 1, characterized in that: The resin storage portion is communicated with the first end of the molding cavity through a first flow path; the resin collection portion is communicated with the second end of the molding cavity through a second flow path, and the second flow path runs through the wall between the first cavity and the second cavity.

3. The liquid forming device according to claim 2, characterized in that: The resin collecting part is a closed structure; the vacuuming part is connected with the resin collecting part through a first passage, and a first valve is provided on the first passage, and the opening degree of the first valve is adjustable.

4. The liquid forming device according to claim 3, characterized in that: One end of the first passage communicating with the resin collecting portion is located above the liquid level in the resin collecting portion; and / or, One end of the second flow path communicating with the resin collecting portion is located above the liquid level in the resin collecting portion.

5. The liquid forming device according to claim 3, characterized in that: The vacuum pumping part is connected to the first cavity through a second passage, and the second passage runs through the wall between the first cavity and the second cavity; a second valve is provided on the second passage, and the second valve is located in the second cavity, and the opening of the second valve is adjustable.

6. The liquid forming device according to claim 5, characterized in that: The molding cavity is formed by a mold below and a bag film above, the bag film includes an inner bag film and an outer bag film, the second passage is connected to the bag film space formed by the inner bag film, the outer bag film and the mold, and the second valve is used to control the suction speed of the vacuum part in the bag film space.

7. The liquid forming device according to claim 5, characterized in that: One end of the first passage close to the vacuum pumping portion is communicated with one end of the second passage close to the vacuum pumping portion.

8. The liquid forming device according to any one of claims 1 to 7, characterized in that: A heat-insulating layer is provided on the wall surface surrounding the first cavity.

9. A liquid forming method, characterized in that: Applied to the liquid forming device according to any one of claims 1 to 8, the liquid forming method comprises: Opening the second valve and the vacuum pump of the liquid molding device, sucking air into the first cavity through the second passage to degas the resin in the resin storage part, and closing the second valve after the degassing is completed; Opening the first valve of the liquid molding device, sucking air into the resin collecting part through the first passage to generate negative pressure in the resin collecting part, so that the resin in the resin storage part is drawn into the molding cavity for infusion, and closing the first valve after the infusion is completed; The resin storage portion is removed from the first cavity, and the molding cavity is heated through the first cavity to solidify the resin in the molding cavity to obtain a molded part.

10. The liquid forming method according to claim 9, characterized in that: The step of sucking air into the resin collecting portion through the first passage to generate negative pressure in the resin collecting portion so that the resin in the resin storage portion is drawn into the molding cavity for infusion includes: After the first valve is opened, the vacuuming part sucks air from the resin collecting part through the first passage, so that negative pressure is generated in the resin collecting part; The negative pressure of the resin collecting portion generates suction force on the second flow path, so that the second flow path generates negative pressure; The negative pressure of the second flow path generates suction force on the molding cavity, so that the molding cavity generates negative pressure; The negative pressure of the molding cavity generates suction force on the first flow path, so that the first flow path generates negative pressure; The negative pressure of the first flow path generates suction force on the resin in the resin storage portion, so that the resin flows into the molding cavity for pouring.

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