A method, system, computer, and storage medium for chip appearance inspection

Abstract

This invention provides a chip appearance inspection method, system, computer, and storage medium. The method includes the following steps: acquiring back inspection data of a wafer and uploading the corresponding yield report of the wafer to a first cloud drive path; determining whether the number of chips is greater than a standard value; if the number of chips is greater than or equal to the standard value, comparing various abnormal parameters of the chips based on the back inspection data; if the various abnormal parameters are less than preset values, diverting the back inspection data to a second cloud drive path; performing front appearance inspection on the wafer based on first detection parameters to obtain front inspection data; and merging the front inspection data with optoelectronic test data for outgoing processing. By performing diversion and merging operations based on different cloud drive paths for the back inspection data of the wafer, wafer sources with abnormal back inspection documents are not included in the merging process, which avoids the problem of low wafer yield caused by abnormal back inspection documents and the problem of a large number of HOLD abnormal products, reducing the time for processing abnormal wafer sources and lowering production costs.

Description

Technical Field

[0001] This invention relates to the field of chip appearance inspection technology, and in particular to a chip appearance inspection method, system, computer, and storage medium. Background Technology

[0002] In the field of LED chip manufacturing, some products require back-side inspection. The current inspection method is to perform back-side inspection with an iron ring after the chip source is split and before the film is flipped. Because the chip source is attached to the iron ring during inspection and the expansion of the mother and daughter rings is not used, abnormal chip sources such as blue film wrinkles may exist due to the influence of processes such as chip mounting and cutting and splitting.

[0003] In existing technologies, the principle of appearance inspection is to use a camera to capture an image and then process and calculate the image. If there are wrinkles in the blue film, it will cause the image to be out of focus and blurry when capturing the image, which will further lead to the distortion of the inspection results and the failure to locate the target. This will result in a large number of abnormal HOLD products in subsequent processes. Engineers will then need to perform secondary judgment processing on the abnormal HOLD wafers, which will affect the inspection efficiency. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a chip appearance inspection method, system, computer and storage medium, which aims to solve the technical problem that image detection in the prior art is distorted and affects the detection efficiency.

[0005] To achieve the above objectives, in a first aspect, the present invention provides: a chip appearance inspection method, comprising the following steps:

[0006] Obtain image data of the back side of the wafer, perform back-side appearance inspection based on the back-side image data, obtain back-side inspection data of the wafer, and upload the yield report corresponding to the wafer to the first cloud drive path;

[0007] The number of grains corresponding to the wafer is obtained based on the image data, and it is determined whether the number of grains is greater than a standard value.

[0008] If the number of grains is greater than or equal to the standard value, the abnormal parameters of the grains are compared based on the back inspection data;

[0009] If any of the abnormal parameters are less than the preset value, the back inspection data will be diverted to the second cloud drive path;

[0010] When performing front-side appearance inspection on the wafer, determine whether there is back-side inspection data corresponding to the wafer in the second cloud drive path;

[0011] If the back inspection data is not found in the second cloud drive path, the front appearance inspection of the wafer is performed based on the first detection parameters to obtain the front inspection data.

[0012] The positive inspection data and photoelectric test data are combined and sent out.

[0013] According to one aspect of the above technical solution, after the step of determining whether the number of grains is less than a standard value, the method further includes:

[0014] If the number of grains is less than the standard value, the back inspection data will be diverted to a third cloud drive path.

[0015] According to one aspect of the above technical solution, after the step of comparing various abnormal parameters of the grain based on the back inspection data, the method further includes:

[0016] If any of the abnormal parameters exceed the preset value, the back inspection data will be uploaded to the third cloud drive path.

[0017] According to one aspect of the above technical solution, the method further includes:

[0018] After completing the back-side appearance inspection of the wafer, determine whether the yield report exists in the first cloud drive path, or whether the back inspection data exists in the second cloud drive path.

[0019] If the yield report is not found in the first cloud drive path, and the back inspection data is not found in either the second or third cloud drive path, then the wafer outbound process is deemed to have failed.

[0020] According to one aspect of the above technical solution, after the step of determining whether back inspection data corresponding to the wafer exists in the second cloud drive path, the method further includes:

[0021] If the back inspection data exists in the second cloud drive path, the front appearance inspection of the wafer is performed based on the second detection parameters to obtain the front inspection data.

[0022] The back inspection data is retrieved based on the second cloud drive path, and the front inspection data, the back inspection data, and the photoelectric test data are combined and sent out.

[0023] Secondly, the present invention provides a chip appearance inspection system, comprising:

[0024] The back-side inspection module is used to acquire image data of the back side of the wafer, perform back-side appearance inspection based on the back-side image data, obtain back-side inspection data of the wafer, and upload the yield report corresponding to the wafer to the first cloud drive path.

[0025] The first judgment module is used to obtain the number of grains corresponding to the wafer based on the image data, and to determine whether the number of grains is greater than a standard value;

[0026] An anomaly comparison module is used to compare various abnormal parameters of the grains based on the back inspection data if the number of grains is greater than or equal to the standard value.

[0027] The first diversion module is used to divert the back inspection data to the second cloud drive path if each of the abnormal parameters is less than a preset value.

[0028] The front inspection module is used to determine whether there is back inspection data corresponding to the wafer in the second network disk path when performing front appearance inspection on the wafer;

[0029] The path detection module is used to perform front appearance inspection on the wafer based on the first detection parameters if the back inspection data is not found in the second cloud drive path, so as to obtain the front inspection data.

[0030] The first data merging module is used to merge the positive inspection data and the photoelectric test data before sending them out of the station.

[0031] According to one aspect of the above technical solution, the system further includes:

[0032] The second distribution module is used to upload the back inspection data to the third cloud drive path if each of the abnormal parameters is greater than a preset value.

[0033] According to one aspect of the above technical solution, the system further includes:

[0034] The third distribution module is used to upload the back inspection data to a third cloud drive path if each of the abnormal parameters is greater than a preset value.

[0035] According to one aspect of the above technical solution, the system further includes:

[0036] The outbound module is used to determine whether the yield report exists in the first network disk path or whether the back inspection data exists in the second network disk path after the back appearance inspection of the wafer is completed.

[0037] If the yield report is not found in the first cloud drive path, and the back inspection data is not found in either the second or third cloud drive path, then the wafer outbound process is deemed to have failed.

[0038] According to one aspect of the above technical solution, the system further includes:

[0039] The second file-combining module is used to perform front appearance inspection on the wafer based on the second detection parameters if the back inspection data exists in the second cloud drive path, and obtain front inspection data.

[0040] The back inspection data is retrieved based on the second cloud drive path, and the front inspection data, the back inspection data, and the photoelectric test data are combined and sent out.

[0041] Thirdly, the present invention provides a computer, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the chip appearance inspection method as described in the above technical solution.

[0042] Fourthly, the present invention provides a storage medium storing a computer program thereon, characterized in that the program, when executed by a processor, implements the chip appearance inspection method as described in the above technical solution.

[0043] Compared with the prior art, the beneficial effects of the present invention are as follows: After completing the back-side appearance inspection of the wafer, the number of dies is identified based on image data. By comparing the standard value with the number of dies, if the number of dies is less than the standard value, it indicates that the data is out of focus or blurry, and there is a problem with the image data. If the number of dies is greater than or equal to the standard value, a secondary screening is performed based on specific abnormal parameters to divert the back-side inspection documents with inspection problems to a third cloud drive path. During subsequent merging and outgoing, the merging and splitting operations are performed according to the different cloud drive paths of the wafer's back-side inspection data. Since wafer sources with abnormal back-side documents are not included in the merging, the problem of low wafer yield caused by abnormal back-side inspection documents and the problem of a large number of HOLD abnormal products can be avoided, reducing the time for processing abnormal wafer sources and reducing production costs. Attached Figure Description

[0044] Figure 1 This is a flowchart of the chip appearance inspection method in the first embodiment of the present invention;

[0045] Figure 2 This is a structural block diagram of the chip appearance inspection system in the second embodiment of the present invention;

[0046] Figure 3 This is a schematic diagram of the hardware structure of the computer in the third embodiment of the present invention;

[0047] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0048] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of the invention are illustrated in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0049] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0051] Please see Figure 1 The diagram shows a flowchart of the chip appearance inspection method in the first embodiment of the present invention. Figure 1 As shown, the method includes the following steps:

[0052] Step S100: Obtain image data of the back side of the wafer, perform back-side appearance inspection based on the back-side image data to obtain back-side inspection data of the wafer, and upload the yield report corresponding to the wafer to the first cloud drive path.

[0053] For ease of understanding, the traditional inspection method includes the following steps: After the back appearance inspection of the source material is performed, the yield report file is sent to the designated cloud drive path A, and the back inspection document is sent to the designated cloud drive path B. When leaving the site, check whether there are corresponding files in the corresponding cloud drive paths. Once the source material operation is confirmed to be completed, it is sent out and flows to the subsequent processes.

[0054] Step S200: Obtain the number of dies corresponding to the wafer based on the image data, and determine whether the number of dies is greater than a standard value.

[0055] Specifically, the standard value is adjusted according to the specifications of the wafer. Considering the accuracy of the test, the standard value is slightly lower than the total number of wafers corresponding to a complete wafer.

[0056] Step S300: If the number of dies is greater than or equal to the standard value, compare the various abnormal parameters of the dies based on the back inspection data. It is understood that if the number of dies is greater than or equal to the standard value, it indicates that the preceding processes of the wafer meet the standards and there is no blue film wrinkling problem. Conversely, if the number of dies is less than the standard value, it indicates that the wafer has blue film wrinkles, leading to image defocusing. The aforementioned abnormal parameters are for detecting individual anomalies caused by blue film wrinkles and defocusing. The number of each individual anomaly is compared with the anomaly threshold set in the recipe. If it exceeds the set value, it indicates that there is an image defocusing problem.

[0057] Specifically, after determining whether the number of grains is less than a standard value, the method further includes:

[0058] If the number of wafers is less than the standard value, the back inspection data is diverted to the third disk path. The third disk path is used to store wafer data with blue film wrinkling anomalies, i.e., abnormal back inspection data.

[0059] Step S400: If each of the abnormal parameters is less than a preset value, the back inspection data is diverted to the second cloud drive path. The second cloud drive path is used to store wafer back inspection data where the number of dies is greater than the standard value and the abnormal parameters are less than the preset value, that is, wafer back inspection data whose yield is not affected by blue film wrinkles.

[0060] Specifically, after comparing the various abnormal parameters of the grains based on the back inspection data, the method further includes:

[0061] If any of the abnormal parameters exceed the preset value, the back inspection data will be uploaded to the third cloud drive path.

[0062] Preferably, in this embodiment, after completing the back-side appearance inspection of the wafer, it is determined whether the yield report exists in the first cloud drive path, or whether the back-side inspection data exists in the second cloud drive path.

[0063] If the yield report is not found in the first cloud drive path, and the back inspection data is not found in either the second or third cloud drive paths, then the wafer outbound process is deemed to have failed. The presence of a yield report in the first cloud drive path, or the presence of back inspection data in the second and third cloud drive paths, determines whether the wafer has completed the corresponding inspection process.

[0064] Step S500: During the front appearance inspection of the wafer, it is determined whether there is back inspection data corresponding to the wafer in the second network disk path. Before performing the front appearance inspection of the wafer, based on the search of the second network disk path, it is determined whether the wafer has abnormal back inspection data due to blue film wrinkles, and a flow test is performed accordingly.

[0065] Step S600: If the back inspection data is not found in the second cloud drive path, perform front appearance inspection on the wafer based on the first detection parameters to obtain front inspection data.

[0066] Step S700: Combine the positive inspection data and the photoelectric test data for output.

[0067] Furthermore, in this embodiment, after determining whether back inspection data corresponding to the wafer exists in the second cloud drive path, the method further includes:

[0068] If the back inspection data exists in the second cloud drive path, the front appearance inspection of the wafer is performed based on the second detection parameters to obtain the front inspection data.

[0069] The back inspection data is retrieved based on the second network disk path, and the front inspection data, the back inspection data, and the photoelectric test data are merged and sent out. If the back inspection data exists in the second network disk path, it means that the data does not have the problem of blue film wrinkles and can be merged normally. This reduces the detection distortion caused by blue film wrinkles, which leads to a decrease in product yield; at the same time, it reduces the generation of abnormal products in subsequent processes and improves production efficiency.

[0070] In summary, the chip appearance inspection method in the above embodiments of the present invention identifies the number of chips based on image data after completing the back appearance inspection of the wafer. By comparing the standard value with the number of chips, if the number of chips is less than the standard value, it indicates that the data is out of focus or blurry, and there is a problem with the image data. If the number of chips is greater than or equal to the standard value, a secondary screening is performed based on specific abnormal parameters to divert the back inspection documents with inspection problems to a third cloud drive path. During subsequent file merging and outgoing, the diversion and merging operations are performed according to the different cloud drive paths of the wafer's back inspection data. Since wafer sources with abnormal back inspection documents are not included in the merging, the problem of low wafer source yield caused by abnormal back inspection documents and the problem of a large number of HOLD abnormal products can be avoided, reducing the time for processing abnormal wafer sources and reducing production costs.

[0071] Please refer to Figure 2 The second embodiment of the present invention provides a chip appearance inspection system, including: a back detection module 100, a first judgment module 200, an anomaly comparison module 300, a first diversion module 400, a front detection module 500, a path detection module 600, and a first merging module 700.

[0072] The back-side inspection module 100 is used to acquire image data of the back side of the wafer, perform back-side appearance inspection based on the back-side image data, obtain back-side inspection data of the wafer, and upload the yield report corresponding to the wafer to the first cloud drive path.

[0073] The first judgment module 200 is used to obtain the number of grains corresponding to the wafer based on the image data, and to determine whether the number of grains is greater than a standard value;

[0074] The anomaly comparison module 300 is used to compare various abnormal parameters of the grains based on the back inspection data if the number of grains is greater than or equal to the standard value.

[0075] The first diversion module 400 is used to divert the back inspection data to the second cloud drive path if each of the abnormal parameters is less than a preset value;

[0076] The front inspection module 500 is used to determine whether there is back inspection data corresponding to the wafer in the second network disk path when performing front appearance inspection on the wafer;

[0077] The path detection module 600 is used to perform front appearance inspection on the wafer based on the first detection parameters if the back inspection data is not found in the second cloud disk path, and obtain front inspection data.

[0078] The first data merging module 700 is used to merge the positive inspection data and the photoelectric test data for outgoing data.

[0079] Preferably, in this embodiment, the system further includes:

[0080] The second distribution module is used to upload the back inspection data to the third cloud drive path if each of the abnormal parameters is greater than a preset value.

[0081] Preferably, in this embodiment, the system further includes:

[0082] The third distribution module is used to upload the back inspection data to a third cloud drive path if each of the abnormal parameters is greater than a preset value.

[0083] Preferably, in this embodiment, the system further includes:

[0084] The outbound module is used to determine whether the yield report exists in the first network disk path or whether the back inspection data exists in the second network disk path after the back appearance inspection of the wafer is completed.

[0085] If the yield report is not found in the first cloud drive path, and the back inspection data is not found in either the second or third cloud drive path, then the wafer outbound process is deemed to have failed.

[0086] Preferably, in this embodiment, the system further includes:

[0087] The second file-combining module is used to perform front appearance inspection on the wafer based on the second detection parameters if the back inspection data exists in the second cloud drive path, and obtain front inspection data.

[0088] The back inspection data is retrieved based on the second cloud drive path, and the front inspection data, the back inspection data, and the photoelectric test data are combined and sent out.

[0089] It should be noted that the modules can be functional modules or program modules, and can be implemented in software or hardware. For modules implemented in hardware, the modules can reside in the same processor; or the modules can be located in different processors in any combination.

[0090] Example 3

[0091] A third embodiment of this application provides a computer that may include a processor 81 and a memory 82 storing computer program commands.

[0092] Specifically, the processor 81 may include a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.

[0093] The memory 82 may include a mass storage device for data or commands. For example, and not limitingly, the memory 82 may include a hard disk drive (HDD), a floppy disk drive, a solid-state drive (SSD), flash memory, an optical disk drive, a magneto-optical disk drive, magnetic tape, or a Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 82 may include removable or non-removable (or fixed) media. Where appropriate, the memory 82 may be internal or external to a data processing device. In a particular embodiment, the memory 82 is non-volatile memory. In a particular embodiment, the memory 82 includes read-only memory (ROM) and random access memory (RAM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), an electrically alterable read-only memory (EAROM), or flash memory, or a combination of two or more of these. Where appropriate, the RAM can be Static Random-Access Memory (SRAM) or Dynamic Random-Access Memory (DRAM). DRAM can be Fast Page Mode Dynamic Random-Access Memory (FPMDRAM), Extended Data Out Dynamic Random-Access Memory (EDODRAM), Synchronous Dynamic Random-Access Memory (SDRAM), etc.

[0094] The memory 82 can be used to store or cache various data files that need to be processed and / or communicated, as well as possible computer program commands executed by the processor 81.

[0095] The processor 81 reads and executes computer program commands stored in the memory 82 to implement any of the chip appearance inspection methods in the above embodiments.

[0096] In some embodiments, the computer may further include a communication interface 83 and a bus 80. For example, Figure 3 As shown, the processor 81, memory 82, and communication interface 83 are connected through bus 80 and complete communication with each other.

[0097] The communication interface 83 is used to enable communication between the various modules, devices, units, and / or equipment in the embodiments of this application. The communication interface 83 can also enable data communication with other components such as external devices, image / data acquisition devices, databases, external storage, and image / data processing workstations.

[0098] Bus 80 includes hardware, software, or both, that couples computer components together. Bus 80 includes, but is not limited to, at least one of the following: data bus, address bus, control bus, expansion bus, and local bus. For example, and not as a limitation, bus 80 may include an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local Bus (VLB) bus, or other suitable buses, or a combination of two or more of these. Where appropriate, bus 80 may include one or more buses. Although specific buses are described and illustrated in the embodiments of this application, this application considers any suitable bus or interconnection.

[0099] Example 4

[0100] The fourth embodiment of this application provides a readable storage medium. This readable storage medium stores computer program commands; when executed by a processor, these computer program commands implement any of the chip appearance inspection methods described in the above embodiments.

[0101] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for inspecting the appearance of a chip, characterized in that, Includes the following steps: Obtain the back image data of the wafer, perform back appearance inspection based on the back image data to obtain the back inspection data of the wafer, and upload the yield report corresponding to the wafer to the first cloud drive path; The number of dies corresponding to the wafer is obtained based on the back image data, and it is determined whether the number of dies is greater than the standard value. If the number of grains is greater than or equal to the standard value, then there are no blue film wrinkles. Based on the back inspection data, the abnormal parameters of the grains are compared. If any of the abnormal parameters are less than the preset value, the back inspection data will be diverted to the second cloud drive path; If any of the abnormal parameters exceeds a preset value, the back inspection data will be uploaded to a third cloud drive path; If the number of grains is less than the standard value, blue film wrinkles exist, and the back inspection data is diverted to the third cloud drive path; When performing front-side appearance inspection on the wafer, determine whether there is back-side inspection data corresponding to the wafer in the second cloud drive path; If the back inspection data is not found in the second cloud drive path, the front appearance inspection of the wafer is performed based on the first detection parameters to obtain the front inspection data. The positive inspection data and photoelectric test data are combined and sent out of the station; If the back inspection data exists in the second cloud drive path, the front appearance inspection of the wafer is performed based on the second detection parameters to obtain the front inspection data. The back inspection data is retrieved based on the second cloud drive path, and the front inspection data, the back inspection data, and the photoelectric test data are combined and sent out.

2. The chip appearance inspection method according to claim 1, characterized in that, The method further includes: After completing the back-side appearance inspection of the wafer, determine whether the yield report exists in the first disk path, or whether the back inspection data exists in the second disk path or the third disk path. If the yield report is not found in the first cloud drive path, and the back inspection data is not found in either the second or third cloud drive path, then the wafer outbound process is deemed to have failed.

3. A chip appearance inspection system for implementing the chip appearance inspection method of claim 1 or 2, characterized in that, include: The back-side inspection module is used to acquire image data of the back side of the wafer, perform back-side appearance inspection based on the back-side image data, obtain back-side inspection data of the wafer, and upload the yield report corresponding to the wafer to the first cloud drive path. The first judgment module is used to obtain the number of grains corresponding to the wafer based on the image data, and to determine whether the number of grains is greater than a standard value; An anomaly comparison module is used to compare various abnormal parameters of the grains based on the back inspection data if the number of grains is greater than or equal to the standard value. The first diversion module is used to divert the back inspection data to the second cloud drive path if each of the abnormal parameters is less than a preset value. The front inspection module is used to determine whether there is back inspection data corresponding to the wafer in the second network disk path when performing front appearance inspection on the wafer; The path detection module is used to perform front appearance inspection on the wafer based on the first detection parameters if the back inspection data is not found in the second cloud drive path, so as to obtain the front inspection data. The first data merging module is used to merge the positive inspection data and the photoelectric test data before sending them out of the station.

4. The chip appearance inspection system according to claim 3, characterized in that, The system also includes: The second diversion module is used to divert the back inspection data to the third cloud drive path if the number of chips is less than the standard value.

5. The chip appearance inspection system according to claim 4, characterized in that, The system also includes: The third distribution module is used to upload the back inspection data to a third cloud drive path if each of the abnormal parameters is greater than a preset value.

6. A computer comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the chip appearance inspection method as described in any one of claims 1-2.

7. A storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the chip appearance inspection method as described in any one of claims 1-2.

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