Piezoelectric acceleration sensor with temperature and manufacturing method thereof

Abstract

The invention relates to a piezoelectric acceleration sensor with temperature and a manufacturing method thereof, and belongs to the technical field of temperature piezoelectric acceleration sensors, the piezoelectric acceleration sensor comprises a shell, a sealing socket is fixed at the top end of the shell, an isolation plate is fixed at the bottom of an inner cavity of the shell, and a temperature vibration structure is arranged at the top end of the isolation plate; the temperature vibration structure comprises a core body fixed to the top end of the isolation plate, a piezoelectric crystal is fixed to the top end of the core body and is a piezoelectric ceramic chip, a mass block is fixed to the top end of the piezoelectric crystal, the outer surface of the mass block is sleeved with a fastening ring, and clamping blocks are clamped to the left end and the right end of the core body. According to the piezoelectric acceleration sensor with temperature and the manufacturing method thereof, the vibration temperature structure is arranged, so that the sensor has vibration and temperature monitoring functions without installing a temperature sensor and a vibration sensor, the number of openings for installing equipment can be reduced, the power supply demand can be reduced, and the manual wiring cost can be saved.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature piezoelectric acceleration sensors, in particular to a temperature-controlled piezoelectric acceleration sensor and a manufacturing method thereof. Background Art

[0002] Piezoelectric accelerometer is a sensor that uses the piezoelectric effect to measure acceleration. It is an inertial sensor and is mainly composed of a mass block, a damper, an elastic element, a sensitive element, and an adaptive circuit. During the acceleration process, the sensor measures the inertial force on the mass block and uses Newton's second law to obtain the acceleration value.

[0003] With the development of industry, the demand for safe and efficient production is increasing. Therefore, the monitoring requirements for normal operation of equipment have been greatly improved, and it is developing towards diversification. Generally, it is necessary to monitor the vibration and temperature of the equipment during operation. In the past, vibration sensors and temperature sensors were installed separately. The two are completely independent and need to be powered and wired on site separately. Multiple installation positions need to be reserved on the equipment. In many occasions, it is not convenient to open multiple installation holes or multi-way power supply on the equipment. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a piezoelectric acceleration sensor with temperature and a method for manufacturing the same, which has the advantages of not requiring multiple mounting holes, thus solving the problem of requiring multiple mounting holes.

[0005] To achieve the above object, the present invention provides the following technical solution: A method for manufacturing a piezoelectric acceleration sensor with temperature, comprising a housing, a sealing socket is fixed to the top of the housing, an isolation plate is fixed to the bottom of the inner cavity of the housing, and a temperature vibration structure is provided on the top of the isolation plate;

[0006] The temperature vibration structure includes a core body fixed on the top of an isolation plate, a piezoelectric crystal is fixed on the top of the core body, and the piezoelectric ceramic chip is fixed on the top of the piezoelectric crystal, a mass block is fixed on the top of the piezoelectric crystal, a fastening ring is sleeved on the outer surface of the mass block, blocks are clamped at the left and right ends of the core body, a bracket is fixed on the wall opposite to the two blocks, a cover plate is clamped on the inner side of the top of the bracket, a circuit board is fixed on the bottom wall inside the bracket, the temperature vibration structure also includes a temperature chip electrically connected to the input end of the sealing socket, and the temperature vibration structure also includes a pressing structure arranged on the inner top wall of the bracket for pressing the fastening ring to the inner side thereof.

[0007] Furthermore, the bracket is H-shaped, and the core, piezoelectric crystal, mass block and fastening ring are all located on the inner side of the lower end of the bracket.

[0008] Furthermore, a center hole is opened on the left side of the bottom wall of the inner cavity of the shell, and the temperature chip is fixed to the bottom wall of the inner cavity of the center hole.

[0009] Furthermore, both left and right ends of the core body are provided with plugging slots for plugging the card blocks therein.

[0010] Furthermore, both left and right walls on the inner side of the top end of the bracket are provided with a slot, and both left and right ends of the cover plate are located inside the slot.

[0011] Furthermore, the output end of the temperature chip 11 is electrically connected to the input end of the circuit board 9 through a wire.

[0012] Furthermore, the output end of the circuit board is electrically connected to the input end of the sealed socket through a wire, and three communication holes are opened on the top of the cover plate.

[0013] Furthermore, the compression structure includes a cross bar fixed to the left and right ends of the inner lower end of the bracket, two springs are sleeved on the outer surface of the cross bar, and two moving blocks are slidably connected to the outer surface of the cross bar. The lower ends of the two moving blocks are hingedly connected to hinged rods, and the ends of the two hinged rods away from the moving blocks are hingedly connected to compression plates, and pull blocks are fixed to the left and right ends of the top of the compression plate.

[0014] Furthermore, the opposite walls of the left and right moving blocks are each provided with a sliding hole for the cross bar to penetrate and slide inside.

[0015] The present invention also provides a method for manufacturing a piezoelectric acceleration sensor with temperature based on any one of the above items, comprising the following steps:

[0016] S1. The piezoelectric crystal is adhered to the isolation plate by an adhesive, the piezoelectric crystal is adhered and fixed to the core by an adhesive, and the mass block is adhered to the piezoelectric crystal, and the fastening ring is sleeved on the surface of the mass block;

[0017] S2. Perform an initial sensitivity test on the sensitive parts obtained through step S1, and place them in a high-low temperature and humidity test chamber for aging test;

[0018] S3, fix the temperature chip in the center hole of the shell by adhesive, and cure it at room temperature for 24 hours, insert the two blocks of the bracket into the plug-in slots of the sensitive part obtained by S1, and use adhesive to fix them together, so that the fastening ring 7 squeezes the pressing structure so that the pressing structure can firmly press it on the mass block and adhere it to the shell, and perform high-temperature curing at 80°C, and then install the circuit board into the bracket;

[0019] S4, test the finished sensor of the board obtained in S3, adjust the voltage sensitivity and DC bias voltage of the sensor to the specified range by adjusting the resistance, and then perform power-on aging after completion;

[0020] S5. The cover plate can be glued and fixed in the bracket, so that the temperature chip is electrically connected to the circuit board and the sealing socket, and the circuit board is electrically connected to the sealing socket. Then, the silicone potting glue can be poured into the shell. After curing, the potting effect is tested. Finally, the sealing socket and the shell are fixed by a laser welding machine, and the output is tested again.

[0021] S6. Weld the semi-finished sensor with dots, perform sandblasting, and finally inspect the finished sensor.

[0022] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0023] The piezoelectric acceleration sensor with temperature and the manufacturing method thereof are provided with a vibration temperature structure so that the sensor has vibration and temperature monitoring functions without installing a temperature sensor and a vibration sensor, thereby reducing the number of openings for installing equipment, reducing power supply requirements, and saving labor wiring costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the present invention;

[0025] Figure 2 It is a structural schematic diagram of the appearance of the sensor of the present invention;

[0026] Figure 3 It is a schematic diagram of the structure of the support of the present invention;

[0027] Figure 4 It is a structural schematic diagram of the core of the present invention;

[0028] Figure 5 It is a structural schematic diagram of the compression structure of the present invention.

[0029] In the figure: 1 housing, 2 sealing socket, 3 isolation plate, 4 core, 5 piezoelectric crystal, 6 mass block, 7 fastening ring, 71 cross bar, 72 moving block, 73 spring, 74 hinge rod, 75 pressing plate, 76 pulling block, 8 bracket, 81 card block, 9 circuit board, 10 cover plate, 11 temperature chip. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figures 1 to 2 A piezoelectric acceleration sensor with temperature and a manufacturing method thereof in this embodiment include a shell 1, a sealing socket 2 is fixed to the top of the shell 1, an isolation plate 3 is fixed to the bottom of the inner cavity of the shell 1, and a temperature vibration structure is provided on the top of the isolation plate 3.

[0032] See also Figures 1 to 5 The temperature vibration structure in this embodiment includes a core body 4 fixed on the top of the isolation plate 3, a piezoelectric crystal 5 is fixed on the top of the core body 4 and is a piezoelectric ceramic chip, a mass block 6 is fixed on the top of the piezoelectric crystal 5, a fastening ring 7 is sleeved on the outer surface of the mass block 6, clamping blocks 81 are clamped at the left and right ends of the core body 4, a bracket 8 is fixed on the wall opposite to the two clamping blocks 81, a cover plate 10 is clamped on the inner side of the top of the bracket 8, a circuit board 9 is fixed on the bottom wall inside the bracket 8, the temperature vibration structure also includes a temperature chip 11 electrically connected to the input end of the sealing socket 2, and the temperature vibration structure also includes a pressing structure arranged on the inner top wall of the bracket 8 for pressing the fastening ring 7 to the inner side thereof.

[0033] The bracket 8 is H-shaped, and the core 4 , the piezoelectric crystal 5 , the mass block 6 and the fastening ring 7 are all located on the inner side of the lower end of the bracket 8 so that the above-mentioned components can be assembled and installed in the bracket 8 .

[0034] In addition, a center hole is opened on the left side of the bottom wall of the inner cavity of the shell 1, and the temperature chip 11 is fixed to the bottom wall of the inner cavity of the center hole, so that the temperature chip 11 can be installed in the shell 1 and the sensitive parts composed of the isolation plate 3, the core 4, the piezoelectric crystal 5, the mass block 6 and the fastening ring 7 can be isolated.

[0035] In addition, both left and right ends of the core body 4 are provided with insertion slots for the card blocks 81 to be inserted therein, so that the bracket 8 can be connected to the core body 4 together.

[0036] In addition, both left and right walls on the inner side of the top end of the bracket 8 are provided with slots, and both left and right ends of the cover plate 10 are located inside the slots, so that the cover plate 10 can be placed inside the bracket 8.

[0037] At the same time, the output end of the temperature chip 11 is electrically connected to the input end of the circuit board 9 through the wire, so that the temperature chip 11 can be connected to the circuit board 9 and the input end of the sealing socket 2 through the wire.

[0038] Moreover, the output end of the circuit board 9 is electrically connected to the input end of the sealed socket 2 through a wire, and three connecting holes are opened on the top of the cover plate 10, so that the wires used to connect the circuit board 9 to the temperature chip 11 and the sealed socket 2 can pass through the inside of the cover plate 10 through the connecting through holes, so that the circuit board 9 can be connected to the temperature chip 11 and the sealed socket 2.

[0039] See also Figure 1 and Figure 5 The pressing structure in this embodiment includes a cross bar 71 fixed to the left and right ends of the inner lower end of the bracket 8, two springs 73 are sleeved on the outer surface of the cross bar 71, and two moving blocks 72 are slidably connected to the outer surface of the cross bar 71. The lower ends of the two moving blocks 72 are hingedly connected to hinge rods 74, and the ends of the two hinge rods 74 away from the moving blocks 72 are hingedly connected to pressing plates 75, and pull blocks 76 are fixed to the left and right ends of the top of the pressing plate 75.

[0040] Secondly, the opposite walls of the left and right moving blocks 72 are each provided with a sliding hole for the cross bar 71 to pass through and slide inside, so that the moving block 72 can move on the surface of the cross bar 71, so that the moving block 72 can contact and squeeze the spring 73.

[0041] The present invention also provides a method for manufacturing a piezoelectric acceleration sensor with temperature based on any one of the above items, comprising the following steps:

[0042] S1, the piezoelectric crystal 5 is adhered to the isolation plate 3 by an adhesive, the piezoelectric crystal 5 is adhered and fixed to the core 4 by an adhesive, and the mass block 6 is adhered to the piezoelectric crystal 5, and the fastening ring 7 is sleeved on the surface of the mass block 6;

[0043] S2. Perform an initial sensitivity test on the sensitive parts obtained through step S1, and place them in a high-low temperature and humidity test chamber for aging test;

[0044] S3, fix the temperature chip 11 in the center hole of the housing 1 by adhesive, and cure it at room temperature for 24 hours, insert the two blocks 81 of the bracket 8 into the plug-in slots of the sensitive part obtained by S1, and use adhesive to adhere and fix them together, so that the fastening ring 7 squeezes the pressing structure so that the pressing structure can firmly press it on the mass block 6 and adhere it to the housing 1, and perform high-temperature curing at 80°C, and then install the circuit board 9 into the bracket 8;

[0045] S4, test the finished sensor of the board obtained in S3, adjust the voltage sensitivity and DC bias voltage of the sensor to the specified range by adjusting the resistance, and then perform power-on aging after completion;

[0046] S5, the cover plate 10 can be adhered and fixed in the bracket 8, so that the temperature chip 11 is electrically connected to the circuit board 9 and the sealing socket 2, and the circuit board 9 is electrically connected to the sealing socket 2, and the silicone potting glue can be poured into the shell 1. After curing, the potting effect is tested, and then the sealing socket 2 and the shell 1 are fixed by a laser welding machine, and the output is tested again;

[0047] S6. Weld the semi-finished sensor with dots, perform sandblasting, and finally inspect the finished sensor.

[0048] It should be noted that the electronic components appearing in the text are all commonly known to the public in the prior art, and the control method is controlled by the control end, which is a known device in the prior art, and the existing disclosed power connection technology and power supply provision are also common knowledge in the field, so this application will not go into details.

[0049] The working principle of the above embodiment is:

[0050] When in use, the piezoelectric crystal 5, the isolation plate 3, the core 4, the fastening ring 7 and the mass block 6 are combined together, and the two clamping blocks 81 of the bracket 8 are inserted into the two insertion slots of the core 4, so that the fastening ring 7 presses the pressing plate 75, and the pressing plate 75 pushes the two moving blocks 72 to move back to each other through the two hinge rods 74, so that the moving blocks 72 press the spring 73, so that the pressing plate 75 can firmly press the fastening ring 7 to the surface of the mass block 6, and the circuit board 9 and the temperature chip 11 are respectively installed on the inner side of the bracket 8 and the center hole of the shell 1. The cover plate 10 is fixed on the bracket 8, and the wires of the circuit board 9 pass through the cover plate 10 and are connected to the temperature chip 11 and the sealing socket 2 respectively. By utilizing the positive piezoelectric effect of the piezoelectric crystal 5, the mass system generates an amount of charge proportional to the vibration amount and the acceleration, and the acceleration charge is converted and amplified by the circuit to become an acceleration voltage signal. The sensor has a vibration monitoring function, and the temperature chip 11 is used to enable the sensor to have a temperature monitoring function, thereby reducing the number of openings for installing the equipment, reducing the power supply requirements, and saving the cost of manual wiring.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A piezoelectric acceleration sensor with temperature, comprising a housing (1), characterized in that: A sealing socket (2) is fixed to the top of the shell (1), an isolation plate (3) is fixed to the bottom of the inner cavity of the shell (1), and a temperature vibration structure is provided at the top of the isolation plate (3); The temperature vibration structure comprises a core (4) fixed at the top of an isolation plate (3), a piezoelectric crystal (5) fixed at the top of the core (4) and the piezoelectric ceramic chip, a mass block (6) fixed at the top of the piezoelectric crystal (5), a fastening ring (7) sleeved on the outer surface of the mass block (6), clamping blocks (81) clamped at the left and right ends of the core (4), a bracket (8) fixed on the opposite wall of the two clamping blocks (81), a cover plate (10) clamped on the inner side of the top of the bracket (8), a circuit board (9) fixed on the inner bottom wall of the bracket (8), the temperature vibration structure also comprises a temperature chip (11) electrically connected to the input end of the sealing socket (2), and the temperature vibration structure also comprises a pressing structure arranged on the inner top wall of the bracket (8) for pressing the fastening ring (7) to the inner side thereof.

2. A piezoelectric acceleration sensor with temperature according to claim 1, characterized in that: The support (8) is H-shaped, and the core (4), the piezoelectric crystal (5), the mass block (6) and the fastening ring (7) are all located on the inner side of the lower end of the support (8).

3. The piezoelectric acceleration sensor with temperature according to claim 1, characterized in that: A central hole is provided on the left side of the bottom wall of the inner cavity of the shell (1), and the temperature chip (11) is fixed to the bottom wall of the inner cavity of the central hole.

4. The piezoelectric acceleration sensor with temperature according to claim 1, characterized in that: Both left and right ends of the core body (4) are provided with plugging slots for plugging the card block (81) therein.

5. The piezoelectric acceleration sensor with temperature according to claim 1, characterized in that: The left and right walls on the inner side of the top end of the bracket (8) are both provided with a card slot, and the left and right ends of the cover plate (10) are both located inside the card slot.

6. The piezoelectric acceleration sensor with temperature according to claim 1, characterized in that: The output end of the temperature chip (11) is electrically connected to the input end of the circuit board (9) via a wire.

7. The piezoelectric acceleration sensor with temperature according to claim 1, characterized in that: The output end of the circuit board (9) is electrically connected to the input end of the sealed socket (2) via a wire, and three communication holes are formed at the top of the cover plate (10).

8. The piezoelectric acceleration sensor with temperature according to claim 1, characterized in that: The compression structure comprises a cross bar (71) fixed to the left and right ends of the inner side of the lower end of the bracket (8); two springs (73) are sleeved on the outer surface of the cross bar (71); two moving blocks (72) are slidably connected to the outer surface of the cross bar (71); the lower ends of the two moving blocks (72) are hingedly connected to hinge rods (74); the ends of the two hinge rods (74) away from the moving blocks (72) are hingedly connected to compression plates (75); and pull blocks (76) are fixed to the left and right ends of the top of the compression plate (75).

9. The piezoelectric acceleration sensor with temperature according to claim 6, characterized in that: The opposite walls of the left and right moving blocks (72) are each provided with a sliding hole for the cross bar (71) to pass through and slide inside.

10. A method for manufacturing a piezoelectric acceleration sensor with temperature according to any one of claims 1 to 9, comprising the following steps: S1. The piezoelectric crystal (5) is adhered to the isolation plate (3) by means of an adhesive, the piezoelectric crystal (5) is adhered and fixed to the core (4) by means of an adhesive, and the mass block (6) is adhered to the piezoelectric crystal (5), and the fastening ring (7) is sleeved on the surface of the mass block (6); S2. Perform an initial sensitivity test on the sensitive parts obtained through step S1, and place them in a high-low temperature and humidity test chamber for aging test; S3, the temperature chip (11) is fixed in the central hole of the housing (1) by adhesive, and cured at room temperature for 24 hours, and then the two clamping blocks (81) of the bracket (8) are inserted into the plug-in slots of the sensitive component obtained in S1, and the two clamping blocks (81) are fixed together by adhesive, and the fastening ring (7) is pressed on the pressing structure so that the pressing structure can firmly press it on the mass block (6) and adhere it to the housing (1), and then cured at a high temperature of 80°C, and the circuit board (9) is installed in the bracket (8); S4, test the finished sensor of the board obtained in S3, adjust the voltage sensitivity and DC bias voltage of the sensor to the specified range by adjusting the resistance, and then perform power-on aging after completion; S5, the cover plate (10) can be glued and fixed in the bracket (8), so that the temperature chip (11) is electrically connected to the circuit board (9) and the sealing socket (2), and the circuit board (9) is electrically connected to the sealing socket (2), and then the silicone potting glue can be poured into the housing (1), and the potting effect can be tested after curing, and then the sealing socket (2) and the housing (1) are fixed by a laser welding machine, and the output is tested again; S6. Weld the semi-finished sensor with dots, perform sandblasting, and finally inspect the finished sensor.

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