Heat dissipation control method, device and equipment of system-on-chip, and storage medium

Abstract

The invention discloses a heat dissipation control method, device and equipment of a system-on-chip, and a storage medium. The method comprises the following steps: acquiring a first temperature of the system-on-chip and a second temperature of an environment where the system-on-chip is located; under the condition that the first temperature is larger than the second temperature, a target control strategy corresponding to the first temperature is determined in multiple control strategies configured for the cooling-water machine, and cooling water in a cooling water pipeline of the cooling-water machine has different flow speeds under different control strategies; according to the target control strategy, cooling water in a cooling water pipeline of the cooling water machine is controlled to flow so as to dissipate heat of the system-on-chip.

Description

Technical Field

[0001] The present application belongs to the field of vehicle technology, and in particular, relates to a heat dissipation control method, device, equipment and storage medium for a system-level chip. Background Art

[0002] With the continuous development of science and technology, vehicles have more and more functions, making vehicles more and more intelligent. Before the vehicle leaves the factory, in order to verify whether the various functions of the vehicle meet the expected design standards, it is also necessary to conduct reliability testing on the vehicle system. The richness of vehicle functions has increased the demand for computing power of the vehicle terminal, and high computing power will cause the system-on-chip (SOC) to heat up, but the existing vehicle system does not consider the problem of SOC heating when conducting reliability testing. Summary of the invention

[0003] The embodiments of the present application provide a method, device, equipment and storage medium for controlling heat dissipation of a system-level chip, which can reduce the impact of heat generation of the system-level chip on the reliability test of the vehicle system.

[0004] In a first aspect, an embodiment of the present application provides a method for controlling heat dissipation of a system-level chip, the method comprising:

[0005] Acquire a first temperature of the system-on-chip and a second temperature of an environment in which the system-on-chip is located;

[0006] In the case where the first temperature is greater than the second temperature, a target control strategy corresponding to the first temperature is determined among multiple control strategies configured for the chiller, wherein the cooling water in the cooling water pipe of the chiller has different flow rates under different control strategies, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature;

[0007] According to the target control strategy, the flow of cooling water in the cooling water pipeline of the chiller is controlled to dissipate heat for the system-level chip.

[0008] In a second aspect, an embodiment of the present application provides a heat dissipation control device for a system-level chip, the device comprising:

[0009] An acquisition module, used for acquiring a first temperature of the system-on-chip and a second temperature of an environment in which the system-on-chip is located;

[0010] a first determining module, configured to determine, when the first temperature is greater than the second temperature, a target control strategy corresponding to the first temperature among a plurality of control strategies configured for the chiller, wherein under different control strategies, the cooling water in the cooling water pipe of the chiller has different flow rates, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature;

[0011] The control module is used to control the flow of cooling water in the cooling water pipeline of the chiller according to the target control strategy to dissipate heat for the system-level chip.

[0012] In a third aspect, an embodiment of the present application provides an electronic device, comprising: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the heat dissipation control method of the system-level chip as described in any one of the above items is implemented.

[0013] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, on which computer program instructions are stored. When the computer program instructions are executed by a processor, the heat dissipation control method of the system-level chip as described in any one of the above items is implemented.

[0014] In a fifth aspect, an embodiment of the present application provides a computer program product. When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the heat dissipation control method of the system-level chip as described in any one of the above.

[0015] The heat dissipation control method, device, equipment and storage medium of the system-level chip of the embodiment of the present application can determine the target control strategy corresponding to the first temperature among the multiple control strategies configured for the chiller when the first temperature of the system-level chip is greater than the second temperature of the environment in which the system-level chip is located, wherein under different control strategies, the cooling water in the cooling water pipe of the chiller has different flow rates, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature; and according to the target control strategy, the flow of cooling water in the cooling water pipe of the chiller is controlled to dissipate heat for the system-level chip. In this way, when the reliability test of the vehicle-machine system is performed, if the first temperature of the system-level chip is greater than the second temperature of the environment in which the system-level chip is located, the flow of cooling water in the cooling water pipe is controlled according to the target control strategy corresponding to the first temperature to achieve the heat dissipation of the system-level chip, thereby reducing the impact of the heating of the system-level chip on the reliability test of the vehicle-machine system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 It is a flow chart of a heat dissipation control method of a system-level chip provided in an embodiment of the present application;

[0018] Figure 2 It is a schematic diagram of the structure of a heat dissipation control system of a system-on-chip provided by an embodiment of the present application;

[0019] Figure 3 It is a logic schematic diagram of a heat dissipation control method of a system-level chip provided by an embodiment of the present application;

[0020] Figure 4 It is a structural schematic diagram of a heat dissipation control device of a system-on-chip provided in an embodiment of the present application;

[0021] Figure 5 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0024] In order to solve the problems of the prior art, the embodiments of the present application provide a heat dissipation control method, device, equipment and storage medium for a system-level chip. The heat dissipation control method for a system-level chip provided by the embodiments of the present application is first introduced below.

[0025] Figure 1 FIG. 1 is a flow chart showing a method for controlling heat dissipation of a system-level chip according to an embodiment of the present application. Figure 1 As shown, a heat dissipation control method for a system-on-chip may include the following steps S101 to S103.

[0026] S101: Acquire a first temperature of a system-on-chip and a second temperature of an environment where the system-on-chip is located.

[0027] S102. When the first temperature is greater than the second temperature, determine a target control strategy corresponding to the first temperature among multiple control strategies configured for the chiller, wherein under different control strategies, the cooling water in the cooling water pipe of the chiller has different flow rates, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature.

[0028] S103 . According to the target control strategy, control the flow of cooling water in the cooling water pipeline of the chiller to dissipate heat for the system-level chip.

[0029] The heat dissipation control method of the system-level chip of the embodiment of the present application can determine the target control strategy corresponding to the first temperature among the multiple control strategies configured for the chiller when the first temperature of the system-level chip is greater than the second temperature of the environment in which the system-level chip is located, wherein under different control strategies, the cooling water in the cooling water pipe of the chiller has different flow rates, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature; and according to the target control strategy, the flow of cooling water in the cooling water pipe of the chiller is controlled to dissipate heat for the system-level chip. In this way, when the reliability test of the vehicle-machine system is performed, if the first temperature of the system-level chip is greater than the second temperature of the environment in which the system-level chip is located, the flow of cooling water in the cooling water pipe is controlled according to the target control strategy corresponding to the first temperature to achieve the heat dissipation of the system-level chip, thereby reducing the impact of the heating of the system-level chip on the reliability test of the vehicle-machine system.

[0030] The specific implementation methods of the above steps are introduced below.

[0031] In S101, the above-mentioned system-level chip may be a system-level chip of an onboard controller in a reliability test of a vehicle system.

[0032] The above-mentioned acquisition of the first temperature of the system-level chip can be, for example, that the vehicle controller sends the temperature of the SOC (i.e., the first temperature) to the host computer via a controller area network (CAN) or Ethernet. The information transmission method in this application is not limited to CAN or Ethernet, and can also be other information transmission methods, which are not specifically limited here.

[0033] The second temperature of the environment in which the system-level chip is located can be, for example, the vehicle controller in the vehicle system reliability test can be placed in a temperature box, and the temperature box can be used to apply environmental stress to the vehicle controller to control the ambient temperature of the vehicle controller. It should be noted that the second temperature can be set according to different user needs and is not limited to a fixed value, and is not specifically limited here.

[0034] The second temperature of the environment in which the system-level chip is located can be obtained, for example, by the host computer acquiring the internal temperature of the incubator collected by the incubator through the RS485 / 232 interface, that is, the second temperature of the environment in which the system-level chip is located. The information transmission method in this application is not limited to the RS485 / 232 interface, and can also be other information transmission methods, which are not specifically limited here.

[0035] In S102, the situation that the first temperature is greater than the second temperature means that the temperature of the system-level chip is higher than the ambient temperature of the system-level chip. At this time, the system-level chip needs to be cooled to reduce the impact of the heating of the system-level chip on the reliability test of the vehicle system.

[0036] The flow rate of the cooling water in the above target control strategy is positively correlated with the first temperature, that is, the higher the first temperature, the faster the flow rate of the cooling water in the target control strategy.

[0037] Among the above-mentioned multiple control strategies configured for the chiller, the target control strategy corresponding to the first temperature is determined. Exemplarily, it can be that among the different flow rates configured for the chiller, the target flow rate corresponding to the first temperature is determined, and the target flow rate is positively correlated with the first temperature; or, it can also be that among the different powers configured for the chiller, the target power corresponding to the first temperature is determined, and the different powers can be used to control the cooling water in the cooling water pipe of the chiller to have different flow rates, and the target power is positively correlated with the first temperature, so that the flow rate of the cooling water is positively correlated with the first temperature.

[0038] In S103, according to the target control strategy, the flow of cooling water in the cooling water pipe of the chiller is controlled to dissipate the heat of the system-level chip. For example, the flow of cooling water in the cooling water pipe of the chiller can be controlled according to the target flow rate to dissipate the heat of the system-level chip; or, the flow of cooling water in the cooling water pipe of the chiller can be controlled according to the target power to dissipate the heat of the system-level chip.

[0039] As an implementation of the present application, in order to avoid the situation in which the stress applied by the temperature box does not act on the tested sample during the reliability test of the vehicle system, so that the tested sample cannot achieve the expected test purpose, before the above S103, the following may also be included:

[0040] Adjusting the outlet water temperature of the chiller to the second temperature;

[0041] The above S103 may specifically include:

[0042] According to the target control strategy, the cooling water in the cooling water pipeline of the chiller is controlled to flow at the second temperature to dissipate heat for the system-level chip.

[0043] In this embodiment, by adjusting the water outlet temperature of the chiller to the ambient temperature of the system-level chip, it is possible to avoid the situation in which the stress applied by the temperature box does not act on the sample under test during the reliability test of the vehicle system, causing the sample under test to fail to achieve the expected test purpose. Since the water outlet temperature of the chiller is the same as the ambient temperature of the system-level chip, the stress applied by the temperature box can act evenly on each module of the sample under test (such as the vehicle-mounted controller), thereby improving the test quality and accuracy of the sample under test in the reliability test.

[0044] In some embodiments, the above S102 may specifically include:

[0045] When the first temperature is greater than the second temperature, determining a target flow rate corresponding to the first temperature among a plurality of flow rates configured for the chiller, the target flow rate being positively correlated with the first temperature;

[0046] The above S103 may specifically include:

[0047] Control the flow of cooling water in the cooling water pipe of the chiller according to the target flow rate.

[0048] The multiple flow rates configured for the above-mentioned chiller may be, for example, n gradient flow rates Lmin-Lmax.

[0049] Different flow rates correspond to different temperature ranges of the system-level chip. For example, there may be n temperature ranges corresponding to n gradient flow rates Lmin-Lmax, and the temperature ranges do not overlap.

[0050] The target flow rate is positively correlated with the first temperature, that is, the higher the first temperature, the faster the target flow rate.

[0051] In this embodiment, the flow rate of cooling water in the cooling water pipe of the chiller is controlled to dissipate heat for the system-level chip, and multiple flow rates are set to improve the heat exchange efficiency.

[0052] In some embodiments, when the first temperature is greater than the second temperature, determining the target flow rate corresponding to the first temperature among the different flow rates configured for the chiller may specifically include:

[0053] When the first temperature is greater than the second temperature and less than a preset first threshold, a target flow rate corresponding to the first temperature is determined among different flow rates configured for the chiller, and the first threshold is a value associated with the maximum operating temperature of the system-level chip.

[0054] The situation where the above-mentioned first temperature is greater than the second temperature and the first temperature is less than the preset first threshold means that the temperature of the system-level chip is higher than the ambient temperature, but lower than the value associated with the maximum operating temperature of the system-level chip. The system-level chip is relatively safe but still requires heat dissipation to reduce the impact of the heating of the system-level chip on the reliability test of the vehicle system.

[0055] The above-mentioned first threshold is a numerical value associated with the maximum operating temperature of the system-level chip. Exemplarily, it can be the maximum operating temperature of the system-level chip minus 5 degrees. The present application is not limited to this, and it can also be other numerical values ​​associated with the maximum operating temperature of the system-level chip, which are not specifically limited here.

[0056] In this embodiment, on the basis that the first temperature is greater than the second temperature, it is further determined whether the first temperature is less than a preset first threshold value, and the safety status of the system-level chip is identified, so that among the different flow rates configured for the chiller, the flow rate corresponding to the first temperature is selected as the target flow rate to achieve smooth heat dissipation of the system-level chip.

[0057] As another implementation of the present application, in order to quickly dissipate heat for the system-level chip, when the first temperature is greater than the second temperature, determining the target flow rate corresponding to the first temperature among the different flow rates configured for the chiller may also include:

[0058] When the first temperature is greater than or equal to the first threshold and the first temperature is less than or equal to the preset second threshold, among the different flow rates configured for the chiller, the maximum flow rate is determined as the target flow rate, the second threshold is the maximum operating temperature of the system-level chip, and the second threshold is greater than the first threshold.

[0059] The second threshold is the maximum operating temperature of the system-level chip, and the second threshold is greater than the first threshold.

[0060] The situation that the first temperature is greater than or equal to the first threshold and less than or equal to the preset second threshold means that the temperature of the system-level chip is unsafe and is easily damaged, so the system-level chip needs to be quickly cooled.

[0061] The above maximum flow rate may be the fastest flow rate among the different flow rates configured for the chiller.

[0062] In this embodiment, when the first temperature is greater than or equal to the first threshold value and the first temperature is less than or equal to the preset second threshold value, the maximum flow rate is determined as the target flow rate among the different flow rates configured for the chiller to achieve rapid heat dissipation of the system-level chip so that the temperature of the system-level chip becomes safe.

[0063] As another implementation of the present application, in order to ensure that the system-level chip can change the environmental stress as the temperature set in the incubator changes, the above method may further include:

[0064] When the first temperature is less than or equal to the second temperature, and / or the second temperature is less than or equal to a preset third threshold, among the different flow rates configured for the chiller, the minimum flow rate is determined as the target flow rate, the third threshold is the maximum operating environment temperature of the vehicle controller where the system-level chip is located, and the third threshold is less than the second threshold.

[0065] The third threshold may be the maximum operating environment temperature of the vehicle controller where the system-level chip is located, and the third threshold is smaller than the second threshold.

[0066] The situation that the first temperature is less than or equal to the second temperature means that the system-level chip temperature is lower than the ambient temperature.

[0067] The situation that the second temperature is less than or equal to the preset third threshold value means that the ambient temperature of the system-level chip is lower than the maximum operating ambient temperature of the controller.

[0068] The above-mentioned minimum flow rate can be a flow rate that is approximately zero but not equal to zero, so that the cooling water in the chiller remains in a flowing state.

[0069] In this embodiment, when the first temperature is less than or equal to the second temperature, and / or the second temperature is less than or equal to a preset third threshold, the minimum flow rate is selected as the target flow rate among the different flow rates configured for the chiller, which can ensure that the system-level chip can change with the environmental stress as the set temperature of the incubator changes.

[0070] In order to facilitate the understanding of the heat dissipation control method of the system-level chip in the embodiment of the present application, the application process of the heat dissipation control method of the system-level chip is described here, as follows:

[0071] like Figure 2 As shown, the embodiment of the present application provides a heat dissipation control system of a system-level chip, which can be used for reliability testing of a vehicle system. The heat dissipation control system of the system-level chip may include:

[0072] like Figure 2 01 is a temperature chamber, which is used to apply environmental stress to the sample under test, such as temperature field changes.

[0073] like Figure 2 02 is a device under testing (DUT). In this embodiment, the DUT may be a vehicle-mounted controller, and a system on chip (SOC) is provided inside the vehicle-mounted controller.

[0074] like Figure 2 03 is a flow meter, which is used to detect the flow rate at the outlet of the chiller.

[0075] like Figure 2 04 is a thermometer, which is used to collect the return water temperature and outlet water temperature of the chiller.

[0076] like Figure 2 05 in the figure is the power supply, which is used to supply power to the tested sample.

[0077] like Figure 2 06 is a water chiller, which is used to control the water circulation temperature and flow rate supplied to the on-board controller 02.

[0078] like Figure 2 07 is the host computer, which is used to collect the temperature of the vehicle controller and the temperature of the temperature box, and control the water cooler.

[0079] like Figure 3 As shown, the embodiment of the present application provides a heat dissipation control method of a system-level chip, which is suitable for Figure 2 The heat dissipation control system of the system-level chip shown in the figure has the following specific steps:

[0080] 1. Power on the tested sample (e.g., vehicle-mounted controller) through a power supply, the host computer sends a power-on test command, and the vehicle-mounted controller uploads the test information (including the SOC temperature Ts (i.e., the first temperature)) to the host computer through the controller area network (CAN) or Ethernet.

[0081] 2. The host computer obtains the internal temperature Tc (ie, the second temperature) of the incubator collected by the incubator through the RS485 / 232 interface.

[0082] 3. The host computer sends control instructions to the water chiller based on the above collected temperatures (SOC temperature Ts and temperature chamber temperature Tc) and the preset limit temperatures (SOC limit operating temperature Ts_max and vehicle controller maximum operating environment temperature Tmax_environment).

[0083] 4. Working condition 1: Ts_max (i.e. the second threshold mentioned above) ≥ Ts ≥ (Ts_max-5) (i.e. the first threshold mentioned above) (Ts_max: SOC maximum operating temperature), the chiller operates at the maximum flow rate Lmax and water temperature Tc. The heat exchange efficiency is increased by increasing the flow rate of the chiller. In addition, the coolant temperature and the temperature of the temperature chamber are both Tc, so that the stress applied by the environmental chamber can act evenly on each module of the controller, while ensuring that the SOC module with the highest heat generation is below the maximum operating limit temperature, and ensuring that the test stress is not affected to the greatest extent, so that the product reliability test is better verified. In other embodiments, the second threshold can be set as required, for example, the second threshold is Ts_max-7.

[0084] 5. Working condition 2: (Ts_max-5)>Ts>Tc (Ts_max: SOC maximum operating temperature). The chiller works in proportion to the corresponding relationship between temperature and flow rate Lmax~Lmin. Specifically, the temperature range of Ts_max-5~Tc can be divided into n gradients, and the flow rate of Lmax~Lmin can be divided into n gradients. This allows the flow rate of each gradient to change step by step during the rising process of the SOC temperature, thereby ensuring that the chiller is smoothly controlled to enter the heat dissipation process during the SOC temperature rise.

[0085] 6. Working condition 3: Ts≤Tc or Tc≤Tmax_environment (i.e. the third threshold value mentioned above), the chiller works at the flow rate Lmin. That is, when the SOC temperature is too low or the set temperature Tc is lower than the maximum working environment temperature Tmax_environment of the controller, the chiller works at the flow rate Lmin, ensuring that the controller can change the environmental stress as the temperature of the thermostat set temperature changes when the temperature is low or the temperature drops.

[0086] The flow rate Lmin may be a flow rate that is approximately zero but not equal to zero, so that the cooling water in the chiller remains in a flowing state.

[0087] It should be noted that in the above working conditions 2 and 3, the coolant temperature and the temperature of the temperature box are still Tc, which can avoid the situation where the stress applied by the temperature box does not act on the vehicle controller and the expected test purpose (such as aging stress test) cannot be achieved.

[0088] Based on the heat dissipation control method of the system-level chip provided in the above embodiment, the present application also provides a specific implementation of the heat dissipation control device of the system-level chip. Please refer to the following embodiment.

[0089] See also Figure 4 The heat dissipation control device 400 of the system-on-chip provided in the embodiment of the present application may include the following modules: an acquisition module 401, a first determination module 402 and a control module 403.

[0090] An acquisition module 401 is used to acquire a first temperature of the system-on-chip and a second temperature of an environment in which the system-on-chip is located;

[0091] A first determination module 402 is used to determine a target control strategy corresponding to the first temperature from among multiple control strategies configured for the chiller when the first temperature is greater than the second temperature, wherein the cooling water in the cooling water pipe of the chiller has different flow rates under different control strategies, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature;

[0092] The control module 403 is used to control the flow of cooling water in the cooling water pipeline of the chiller according to the target control strategy to dissipate the heat of the system-level chip.

[0093] The heat dissipation control device of the system-level chip of the embodiment of the present application can determine the target control strategy corresponding to the first temperature among the multiple control strategies configured for the chiller when the first temperature of the system-level chip is greater than the second temperature of the environment in which the system-level chip is located, wherein under different control strategies, the cooling water in the cooling water pipe of the chiller has different flow rates, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature; and according to the target control strategy, the flow of cooling water in the cooling water pipe of the chiller is controlled to dissipate heat for the system-level chip. In this way, when the reliability test of the vehicle-machine system is performed, if the first temperature of the system-level chip is greater than the second temperature of the environment in which the system-level chip is located, the flow of cooling water in the cooling water pipe is controlled according to the target control strategy corresponding to the first temperature to achieve the heat dissipation of the system-level chip, thereby reducing the impact of the heating of the system-level chip on the reliability test of the vehicle-machine system.

[0094] In some embodiments, the first determining module 402 may specifically include:

[0095] a determination unit, configured to determine, when the first temperature is greater than the second temperature, a target flow rate corresponding to the first temperature among a plurality of flow rates configured for the chiller, wherein the target flow rate is positively correlated with the first temperature;

[0096] The control module 403 may specifically include:

[0097] The first control unit is used to control the flow of cooling water in the cooling water pipeline of the chiller according to the target flow rate.

[0098] In some embodiments, the above-mentioned determining unit may include:

[0099] The first determination subunit is used to determine a target flow rate corresponding to the first temperature among different flow rates configured for the chiller when the first temperature is greater than the second temperature and the first temperature is less than a preset first threshold, wherein the first threshold is a value associated with the maximum operating temperature of the system-level chip.

[0100] As another implementation of the present application, in order to quickly dissipate heat for the system-level chip, the above-mentioned determination unit may further include:

[0101] The second determination subunit is used to determine the maximum flow rate as the target flow rate among the different flow rates configured for the chiller when the first temperature is greater than or equal to the first threshold and the first temperature is less than or equal to the preset second threshold, the second threshold is the maximum operating temperature of the system-level chip, and the second threshold is greater than the first threshold.

[0102] As another implementation of the present application, in order to ensure that the system-level chip can change the environmental stress as the temperature set in the incubator changes, the above-mentioned device 400 may also include:

[0103] The second determination module is used to determine the minimum flow rate as the target flow rate among different flow rates configured for the chiller when the first temperature is less than or equal to the second temperature and / or the second temperature is less than or equal to a preset third threshold, the third threshold is the maximum operating environment temperature of the vehicle controller where the system-level chip is located, and the third threshold is less than the second threshold.

[0104] As an implementation of the present application, in order to avoid the situation in which the stress applied by the temperature box does not act on the tested sample during the reliability test of the vehicle system, so that the tested sample cannot achieve the expected test purpose, the above-mentioned device 400 may also include:

[0105] An adjustment module, used for adjusting the outlet water temperature of the chiller to a second temperature;

[0106] The control module 403 is further configured to control the cooling water in the cooling water pipe of the chiller to flow at the second temperature according to the target control strategy, so as to dissipate the heat of the system-level chip.

[0107] Based on the heat dissipation control method of the system-level chip provided in the above embodiment, the present application also provides a specific implementation method of the electronic device. Please refer to the following embodiment.

[0108] Figure 5 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application is shown.

[0109] The electronic device may include a processor 501 and a memory 502 storing computer program instructions.

[0110] Specifically, the processor 501 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0111] The memory 502 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 502 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive or a combination of two or more of these. In appropriate cases, the memory 502 may include a removable or non-removable (or fixed) medium. In appropriate cases, the memory 502 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 502 is a non-volatile solid-state memory.

[0112] In certain embodiments, the memory 502 may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk storage medium device, an optical storage medium device, a flash memory device, an electrical, optical or other physical / tangible memory storage device. Thus, in general, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., a memory device) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to an aspect of the present disclosure.

[0113] The processor 501 reads and executes the computer program instructions stored in the memory 502 to implement any one of the heat dissipation control methods for the system-on-chip in the above embodiments.

[0114] In one example, the electronic device may further include a communication interface 503 and a bus 510. Figure 5 As shown, the processor 501, the memory 502, and the communication interface 503 are connected via a bus 510 and communicate with each other.

[0115] The communication interface 503 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0116] Bus 510 includes hardware, software or both, and the parts of electronic equipment are coupled to each other. For example, but not limitation, bus may include accelerated graphics port (AGP) or other graphics bus, enhanced industrial standard architecture (EISA) bus, front side bus (FSB), hypertransport (HT) interconnection, industrial standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations. In appropriate cases, bus 510 may include one or more buses. Although the present application embodiment describes and shows a specific bus, the application considers any suitable bus or interconnection.

[0117] The electronic device can execute the heat dissipation control method of the system-level chip in the embodiment of the present application, thereby realizing the combination Figure 1 and Figure 5 A method and device for controlling heat dissipation of a system-on-chip are described.

[0118] In addition, in combination with the heat dissipation control method of the system-level chip in the above embodiments, the embodiment of the present application can provide a computer-readable storage medium for implementation. The computer-readable storage medium stores computer program instructions; when the computer program instructions are executed by the processor, any one of the heat dissipation control methods of the system-level chip in the above embodiments is implemented.

[0119] In combination with the heat dissipation control method for a system-level chip in the above embodiment, the embodiment of the present application may provide a computer program product. When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes any of the heat dissipation control methods for a system-level chip as described above.

[0120] It should be clear that the present application is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present application.

[0121] The functional blocks shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0122] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0123] Aspects of the present disclosure are described above with reference to the flowchart and / or block diagram of the method, device (system) and computer program product according to the embodiment of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field programmable logic circuit. It can also be understood that each box in the block diagram and / or flowchart and the combination of boxes in the block diagram and / or flowchart can also be implemented by dedicated hardware that performs a specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0124] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

[0125] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A heat dissipation control method for a system-level chip, characterized in that: include: Acquire a first temperature of the system-on-chip and a second temperature of an environment in which the system-on-chip is located; In the case where the first temperature is greater than the second temperature, a target control strategy corresponding to the first temperature is determined among multiple control strategies configured for the chiller, wherein the cooling water in the cooling water pipe of the chiller has different flow rates under different control strategies, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature; According to the target control strategy, the flow of cooling water in the cooling water pipeline of the chiller is controlled to dissipate heat for the system-level chip.

2. The method according to claim 1, characterized in that In the case where the first temperature is greater than the second temperature, determining a target control strategy corresponding to the first temperature among multiple control strategies configured for the chiller includes: When the first temperature is greater than the second temperature, determining a target flow rate corresponding to the first temperature among a plurality of flow rates configured for the chiller, wherein the target flow rate is positively correlated with the first temperature; The step of controlling the flow of cooling water in the cooling water pipeline of the chiller according to the target control strategy includes: The flow of cooling water in the cooling water pipeline of the chiller is controlled according to the target flow rate.

3. The method according to claim 2, characterized in that When the first temperature is greater than the second temperature, determining a target flow rate corresponding to the first temperature among different flow rates configured for the chiller includes: When the first temperature is greater than the second temperature and less than a preset first threshold, a target flow rate corresponding to the first temperature is determined among different flow rates configured for the chiller, and the first threshold is a value associated with the maximum operating temperature of the system-level chip.

4. The method according to claim 3, characterized in that In the case where the first temperature is greater than the second temperature, determining a target flow rate corresponding to the first temperature among different flow rates configured for the chiller, the method further comprising: When the first temperature is greater than or equal to the first threshold and the first temperature is less than or equal to the preset second threshold, among the different flow rates configured for the chiller, the maximum flow rate is determined to be the target flow rate, the second threshold is the maximum operating temperature of the system-level chip, and the second threshold is greater than the first threshold.

5. The method according to claim 4, characterized in that The method further comprises: When the first temperature is less than or equal to the second temperature, and / or the second temperature is less than or equal to a preset third threshold, among the different flow rates configured for the chiller, the minimum flow rate is determined as the target flow rate, the third threshold is the maximum operating environment temperature of the vehicle controller where the system-level chip is located, and the third threshold is less than the second threshold.

6. The method according to claim 1, characterized in that Before controlling the cooling water flow in the cooling water pipeline of the chiller according to the target control strategy to dissipate heat for the system-level chip, the method further includes: adjusting the outlet water temperature of the chiller to the second temperature; According to the target control strategy, controlling the flow of cooling water in the cooling water pipeline of the chiller to dissipate heat for the system-level chip includes: According to the target control strategy, the cooling water in the cooling water pipeline of the chiller is controlled to flow at the second temperature to dissipate heat for the system-level chip.

7. A heat dissipation control device for a system-level chip, characterized in that: include: An acquisition module, used for acquiring a first temperature of the system-on-chip and a second temperature of an environment in which the system-on-chip is located; a first determining module, configured to determine, when the first temperature is greater than the second temperature, a target control strategy corresponding to the first temperature among a plurality of control strategies configured for the chiller, wherein under different control strategies, the cooling water in the cooling water pipe of the chiller has different flow rates, and the flow rate of the cooling water in the target control strategy is positively correlated with the first temperature; The control module is used to control the flow of cooling water in the cooling water pipeline of the chiller according to the target control strategy to dissipate heat for the system-level chip.

8. An electronic device, characterized in that: The electronic device comprises: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the heat dissipation control method of the system-level chip as described in any one of claims 1-6 is implemented.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer program instructions, and when the computer program instructions are executed by a processor, the heat dissipation control method for a system-on-chip according to any one of claims 1 to 6 is implemented.

10. A computer program product, characterized in that When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the heat dissipation control method for a system-on-chip as described in any one of claims 1 to 6.

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