Antenna module realized by packaging of multiple layers of substrates and electronic device

Abstract

There is provided an antenna module implemented by a multi-layer package, the antenna module including: a PCB including a plurality of layers; an RFIC disposed on a first surface of the outermost surface of the PCB; the first array antenna is arranged on a second surface perpendicular to the first surface in the outermost contour surface of the PCB; the second array antenna is arranged on a third surface, perpendicular to the first surface and the second surface, of the outermost contour surface of the PCB; and a third array antenna disposed on a fourth surface perpendicular to the second surface and the third surface of the outermost surface of the PCB. The first to third signal lines connected to the first to third array antennas respectively form first to third coplanar waveguide structures in which first to third ground regions are formed.

Description

Technical Field

[0001] The present invention relates to a multi-layer circuit antenna package for millimeter wave band communication. In addition, the present invention relates to an electronic device having an antenna module in the form of a multi-layer circuit antenna package. Background Art

[0002] The millimeter wave band communication method developed to transmit GBps-level ultra-high-speed and large-capacity AV data can transmit large-capacity data several times faster than existing short / medium-distance communication methods such as WiFi, WLAN, and WPAN.

[0003] Unlike existing short / medium-distance communication methods, in this millimeter-wave band communication method, the antenna and RFIC are separated, which is difficult to achieve by connecting them with cables. In the millimeter-wave band, the attenuation of the signal is dozens of times that of the existing commercial frequency band. In addition, the price of signal cables dedicated to the millimeter-wave band is usually as high as tens of dollars, which has become a major obstacle to the commercialization of 60GHz communication modules. Therefore, an antenna and packaging design technology is required to prevent signal loss and attenuation by placing the antenna and RFIC in the shortest distance in the millimeter-wave band.

[0004] As an existing technology for realizing millimeter wave band antenna / package, a technology that has an antenna and a stripline or microstrip signal transmission line built into a multilayer circuit and electrically connected to an RFIC is widely used. This method realizes the wide bandwidth required in the millimeter wave band by realizing the TEM (Transverse Electro Magnetic) mode required for broadband signal wiring.

[0005] The use of the above-mentioned stripline or microstrip multilayer circuit method is an ideal way to achieve the performance of the antenna. However, in the case of the stripline, there is a structure in which a signal line is arranged in the middle layer, and a ground layer is arranged above and below the signal line, respectively, so at least three layers are required. In addition, in the case of the microstrip, it includes a layer for configuring the signal line and a ground layer arranged above or below the signal line, so at least two layers are required. Therefore, in the case of designing a multilayer circuit by mixing the antenna, RF interface, inner cavity, power line, etc., the number of stacked layers reaches approximately 7 to 10 layers. In the case of the LTCC (Low Temperature Co-fired Ceramic) process for realizing the above-mentioned multilayer circuit, the production cost is high, which has become a major obstacle to the commercialization of millimeter wave band communication technology. Summary of the invention

[0006] The present invention aims to provide a multi-layer circuit antenna package for millimeter wave band communication with a structure having a minimum number of stacked layers.

[0007] The present invention aims to provide a structure that minimizes the signal phase difference of each patch in a patch array antenna structure for millimeter wave band communication.

[0008] The present invention aims to provide an antenna module which is realized with a relatively low height and is capable of transmitting signals to a front area, a lower area, and a side area.

[0009] The present invention aims to provide a structure that minimizes signal interference between a plurality of array antennas.

[0010] An antenna module implemented by a multi-layer package in one aspect of the present specification includes: a PCB including a plurality of layers; an RFIC disposed on a first surface of the outermost surface of the PCB; a first array antenna disposed on a second surface perpendicular to the first surface of the outermost surface of the PCB; a second array antenna disposed on a third surface perpendicular to the first surface and the second surface of the outermost surface of the PCB; and a third array antenna disposed on a fourth surface perpendicular to the second surface and the third surface of the outermost surface of the PCB. First to third signal lines connected to the first to third array antennas respectively form first to third coplanar waveguide tube structures having first to third grounding areas.

[0011] According to an embodiment, the first surface and the fourth surface form surfaces facing each other. The second surface and the third surface are formed between the first surface and the fourth surface. The plurality of layers include a layer formed with a plurality of ground layers and a plurality of coplanar waveguides. The plurality of layers have a form of stacking from the first layer to the twelfth layer, the first surface forms a surface of the first layer of the plurality of layers, and a second layer forming the first ground layer of the plurality of ground layers is formed on the opposite surface of the first surface of the first layer.

[0012] According to an embodiment, the third layer stacked on the second layer has a first coplanar waveguide tube, the first coplanar waveguide tube has a first signal line and a first grounding area, and the first signal line and the first grounding area are electrically connected to the first array antenna. The fourth layer stacked on the third layer forms a second grounding layer, and the fifth layer stacked on the fourth layer has a second coplanar waveguide tube, the second coplanar waveguide tube has a second signal line and a second grounding area, and the second signal line and the second grounding area are electrically connected to the second array antenna.

[0013] According to the embodiment, the sixth layer stacked on the fifth layer forms a third ground layer, the seventh layer stacked on the sixth layer has a third coplanar waveguide, the third coplanar waveguide has a third signal line and a third ground region, and the third signal line and the third ground region are electrically connected to the third array antenna. A plurality of fourth ground layers and a plurality of non-metallic regions formed in the inner region of the plurality of fourth ground layers are formed on the eighth to twelfth layers stacked on the seventh layer. The third array antenna is formed in the non-metallic region of the twelfth layer.

[0014] The electronic device on the other hand of the present specification includes: a display panel for displaying images and information; a communication module for wirelessly receiving signals about the images and information from an external device; and a control unit for converting the signals received from the communication module and providing them to the display panel; the communication module includes a transceiver circuit, a first antenna resonance element, a second antenna resonance element and a third antenna resonance element; the communication module also includes: a first coplanar waveguide tube for transmitting a plurality of the signals between the transceiver circuit and the first antenna resonance element at a frequency between 10 GHz and 300 GHz; a second coplanar waveguide tube for transmitting a plurality of the signals between the transceiver circuit and the second antenna resonance element at a frequency between 10 GHz and 300 GHz; and a third coplanar waveguide tube for transmitting a plurality of the signals between the transceiver circuit and the third antenna resonance element at a frequency between 10 GHz and 300 GHz.

[0015] According to an embodiment, the first coplanar waveguide is interposed between the second coplanar waveguide and the transceiver circuit, the second coplanar waveguide is interposed between the first coplanar waveguide and the third coplanar waveguide, the third coplanar waveguide is interposed between the second coplanar waveguide and the third antenna resonant element, the first antenna resonant element is interposed between the second coplanar waveguide and the transceiver circuit, the second antenna resonant element is interposed between the first coplanar waveguide and the second coplanar waveguide, and the third antenna resonant element is interposed on an opposite side to the transceiver circuit.

[0016] According to an embodiment, when the first antenna resonant element, the second antenna resonant element, and the third antenna resonant element receive the signal received from the external device, the control unit measures signal strength and controls to select a plurality of antenna resonant elements with the largest signal strength to receive the signal.

[0017] The above-mentioned multi-layer circuit antenna package provides a structure that can wirelessly transmit broadband signals with a minimum number of stacked layers.

[0018] The above-mentioned multi-layer circuit antenna package has less loss when transmitting signals and has economical process cost.

[0019] The multilayer circuit antenna package described above can minimize interference between a plurality of array antennas having different structures by configuring an antenna module in which a plurality of coplanar waveguides are stacked and separated from each other by a plurality of ground layers.

[0020] The following detailed description will further clarify the scope of the additional application of this specification. However, those skilled in the art can clearly understand the various changes and modifications within the concept and scope of this specification, so it should be understood that the detailed description and specific embodiments such as the preferred embodiments of this specification are only examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a diagram for explaining the configuration of the wireless display system of this embodiment.

[0022] Figure 2 It is a block diagram illustrating the detailed configuration of a communication device and an electronic device.

[0023] Figure 3 A structural diagram showing a wireless communication performed between an electronic device having a display and another communication device that can be arranged in various positions.

[0024] Figure 4 The structure of the antenna module arranged at the lower part of the electronic device is shown.

[0025] Figure 5 The structure in which the antenna module of the embodiment is disposed in an electronic device and the structure in which the antenna module is fastened to the electronic device are shown.

[0026] Figure 6 A cross-sectional view and a three-dimensional structure of a substrate on which an antenna module is formed are shown.

[0027] Figure 7 A front view of a substrate on which an antenna module is formed is shown.

[0028] Figure 8 Shows Figure 7 A partial stereoscopic view of the antenna module and a cross-sectional view on a specific line.

[0029] Figure 9a Shown by Figure 8 A side view of a portion of an antenna module formed by a plurality of overlapping patch antennas.

[0030] Figure 9b Shows Figure 9a The sizes and spacing distances of radiators arranged on different layers in a side view of the antenna module, and the spacing distance between the radiator and the ground wall.

[0031] Fig.10 The via wall forming structure of the embodiment is shown.

[0032] Fig.11a and Fig.11b Yes Figure 8 The front view of the antenna module is shown by layers.

[0033] Fig.12a It is shown Figure 8 Figure 1 shows the first and third layers of the antenna module.

[0034] Figure 12b It is shown Figure 8 Figure 1. The first and fifth layers of the antenna module.

[0035] Fig.12c It is shown Figure 8 Figure 1. The first and seventh layers of the antenna module.

[0036] Fig.13a and Fig.13b A front perspective view and a side view of an antenna module implemented by a multi-layer antenna package are shown.

[0037] Fig.14a It is shown that the stacked Figure 8 FIG. 10 and 12 of the plurality of patch antennas of the antenna module.

[0038] Fig.14b It is shown that the configuration is Figure 8 A diagram of an overlapping configuration structure of multiple patch antennas in an array antenna configuration area of ​​an antenna module.

[0039] Fig.15 A cross-sectional view and a three-dimensional structure of a substrate on which an antenna module is formed are shown.

[0040] Fig.16 Shows Fig.15 A partial stereoscopic view of the antenna module and a cross-sectional view on a specific line.

[0041] Fig.17a Yes Fig.16 A front view of the third array antenna of the antenna module is shown in layers.

[0042] Fig.17b It is shown Fig.16 Figure 1. The first and seventh layers of the antenna module.

[0043] Fig.18a It is shown that the stacked Fig.16 FIG. 10 and 12 of the plurality of patch antennas of the antenna module.

[0044] Fig.18b It is shown that the configuration is Fig.16 A diagram of an overlapping configuration structure of multiple patch antennas in an array antenna configuration area of ​​an antenna module.

[0045] Fig.19 1 is a flowchart showing the operation of the electronic device for transmitting and receiving wireless signals with the communication device of the present specification.

[0046] Fig. 20 A flowchart of a method for an electronic device of the present specification to select, change, or restore a wireless beamforming signal for transmitting and receiving an A / V signal is shown. DETAILED DESCRIPTION

[0047] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0048] The following is a more detailed description of the embodiments related to this specification with reference to the accompanying drawings. The suffixes "module" and "unit" used in the following description are given or used interchangeably for the convenience of writing the specification, and do not have different meanings or functions.

[0049] For example, the image / audio (hereinafter referred to as A / V) transmission device of the embodiment of the present specification serves as an intelligent device that adds computer support functions to the broadcast receiving function. While fully performing the broadcast receiving function, it also adds Internet functions, etc., so that it can have more convenient-to-use interfaces such as handwriting input devices, touch screens, and space remote controls.

[0050] In addition, by connecting to the Internet and a computer with the support of a wired or wireless Internet function, it is also possible to perform functions such as e-mail, web browsing, banking, games, etc. In order to realize such various functions, a standardized general-purpose OS (operating system) can be used.

[0051] Therefore, in the A / V transmission apparatus described in this specification, for example, various application programs can be freely added or deleted on a general-purpose OS kernel, thereby making it possible to execute user-friendly and diverse functions.

[0052] Figure 1 It is a diagram for explaining the configuration of the wireless display system of this embodiment.

[0053] Reference Figure 1 , the wireless display system of this embodiment includes a communication device 100 and an electronic device 200 .

[0054] The wireless display system may be a system in which the communication device 100 transmits A / V data to the electronic device 200 in a wireless manner and the electronic device 200 outputs the A / V data.

[0055] The communication device 100 may be a device capable of encoding images and audio and transmitting the encoded content images and audio in a wireless manner.

[0056] An example of the communication device 100 may be an AIO (All In One) box capable of transmitting data, and as an example, may be a set-top box.

[0057] As another example of the communication device 100 , an external device such as a set-top box or a USB memory may be connected. The communication device 100 may transmit an image signal or an audio signal received from the connected external device to the electronic device 200 .

[0058] The electronic device 200 may be a display device capable of receiving encoded images and audio in a wireless manner and performing decoding on the received images and audio.

[0059] The communication device 100 and the electronic device 200 may constitute a video wall display system.

[0060] In a video wall, a display having a thin bezel plays an important role in the visualization of content images. In order to have a thin bezel of the display, it is more efficient to have only components that can play a minimum role and to implement circuits or components for the main functions in additional devices.

[0061] The communication device 100 may determine the type of the content image and determine the compression rate of the content image based on the determined type. The compression rate of the content image may be defined as the ratio of the size of the image data before encoding to the size of the image data after encoding.

[0062] The types of content images may include a static image type, a general video type, and a game video type.

[0063] The communication device 100 may compress the content image according to the determined compression rate, and transmit the compressed content image to the electronic device 200 in a wireless manner.

[0064] The electronic device 200 may restore the compressed content image received from the communication device 100 and display the restored content image on a display. For example, the electronic device 200 may be a display device.

[0065] Figure 2 Detailed block diagram of the communication device and the electronic device. Figure 2 The communication device 100 may include a microphone 110 , a Wi-Fi module 120 , a Bluetooth module 130 , a memory 140 , an RF transmitting module 150 , and a processor 190 .

[0066] Microphone 110 may receive audio signals and pass them to processor 190 .

[0067] The microphone 110 can receive the voice uttered by the user.

[0068] The Wi-Fi module 120 may perform wireless communication through the Wi-Fi standard.

[0069] The Wi-Fi module 120 may perform wireless communication with an external device or the electronic device 200 through the Wi-Fi standard.

[0070] The Bluetooth module 130 may perform wireless communication via the Bluetooth Low Energy (BLE) standard.

[0071] The Bluetooth module 130 may perform wireless communication with an external device such as a remote controller or the electronic device 200 through the Bluetooth Low Energy (BLE) standard.

[0072] The memory 140 may store programs for signal processing and control, and store image or voice or data signals after signal processing.

[0073] The memory 140 may perform a function for temporarily storing an image or voice or data signal input from the outside, and may also store information related to a prescribed image through a channel memory function.

[0074] The RF transmitting module 150 may transmit the A / V signal to the RF receiving module 240 of the electronic device 200 through RF (Radio Frequency) communication.

[0075] The RF transmitting module 150 may transmit the compressed A / V signal in a digital form to the RF receiving module 240 .

[0076] The RF transmitting module 150 may transmit the A / V signal to the RF receiving module 240 through one or more channels.

[0077] The processor 190 may control the overall operation of the communication device 100 .

[0078] The processor 190 may be configured as a system on chip (SoC).

[0079] A plurality of processors 190 may be provided.

[0080] The processor 190 may compress an image signal or an audio signal input from the outside, and may transfer the compressed signal to the RF transmission module 150 .

[0081] The processor 190 may have an encoder for compressing an image signal or an audio signal.

[0082] The processor 190 may be named a main SoC.

[0083] The processor 190 may have one or more interfaces for connecting with external devices. For example, the processor 190 may have one or more HDMI ports and one or more USB ports.

[0084] The processor 190 may also have a tuner for receiving broadcast signals.

[0085] The electronic device 200 may include a Wi-Fi module 210 , a Bluetooth module 220 , an IR receiving module 230 , an RF receiving module 240 , a memory 250 , a display panel 260 , and a processor 290 .

[0086] The Wi-Fi module 210 may perform wireless communication through the Wi-Fi standard.

[0087] The Wi-Fi module 210 may perform wireless communication with an external device or the communication device 100 through the Wi-Fi standard.

[0088] The Bluetooth module 220 may perform wireless communication via the Bluetooth Low Energy (BLE) standard.

[0089] The Bluetooth module 220 may perform wireless communication with an external device such as a remote controller or the A / V transmission device 200 through the Bluetooth Low Energy (BLE) standard.

[0090] The IR receiving module 230 may receive a signal from a remote controller (not shown) through IR (Infrared) communication.

[0091] The RF receiving module 240 may receive the A / V signal from the RF transmitting module 150 .

[0092] The RF receiving module 240 may include a plurality of antennas and may be disposed at a lower end of the display panel 260 .

[0093] As an example of the RF receiving module 240, a first antenna module and a second antenna module may be included. The first antenna module and the second antenna module may each include a plurality of antennas.

[0094] As another example of the RF receiving module 240 , an antenna module may be included. Such an antenna module may include a plurality of antennas.

[0095] The RF receiving module 240 may receive the compressed A / V signal in a digital form from the RF transmitting module 150 , and may transmit the received A / V signal to the processor 290 .

[0096] The memory 250 may store programs for signal processing and control, and may store image or voice or data signals after signal processing.

[0097] The display panel 260 may be a display panel 260 capable of displaying an image signal received from the processor 290. As an example of such a display panel 260, an LED panel may be used.

[0098] The display panel 260 may display an image signal according to driving of a timing controller (not shown).

[0099] The processor 290 can control the overall operation of the electronic device 200 .

[0100] The processor 290 may restore the compressed A / V signal received by the RF receiving module 240. To this end, the processor 290 may include a decoder.

[0101] On the other hand, the antenna module configured in the electronic device of this specification is described. In this regard, Figure 3 A structural diagram showing a wireless communication performed between an electronic device having a display and another communication device that can be arranged in various positions.

[0102] Reference Figure 3 The communication device 100 may be arranged in the front direction, the lower direction, the one side direction or the other side direction of the electronic device 200. The communication device 100 may be an AV transmission device that transmits AV content to the electronic device 200. The communication device 100 may be a set-top box, but is not limited thereto. The electronic device 200 may be an AV receiving device that receives AV content from the communication device 100. The electronic device 200 may be a display device, but is not limited thereto. The electronic device 200 receives data from the communication device 100, but may also transmit data to the communication device 100.

[0103] The communication device 100 may be disposed in a first direction D1 which is a lower direction of the electronic device 200. In this regard, the electronic device 200 may transmit or receive a wireless signal toward the first direction D1 which is a lower direction. The upper direction of the electronic device 200 may be defined as a second direction D2.

[0104] The communication device 100 may be disposed in the third direction D3 as the left direction or the fourth direction D4 as the right direction of the electronic device 200. In this regard, the electronic device 200 may transmit or receive a wireless signal toward the third direction D3 as the left direction or the fourth direction D4.

[0105] The communication device 100 may be arranged in a fifth direction D5 which is a front direction of the electronic device 200. In this regard, the electronic device 200 may transmit or receive a wireless signal toward the fifth direction D5 which is a front direction. The rear direction of the electronic device 200 may be defined as a sixth direction D6.

[0106] On the other hand, there may be obstacles between the communication device 100 and the electronic device 200, resulting in the inability to form a wireless link on a LOS (Line-of-sight) path. In this regard, the electronic device 200 can send and receive wireless signals through a wireless link on a non-LOS (non-line-of-sight) path such as a reflection path. The communication device 100 can send or receive wireless signals in the direction of the ceiling as the upper front direction. Communication can be performed between the communication device 100 and the electronic device 200 through wireless signals reflected by the ceiling or wall.

[0107] On the other hand, the electronic device of the present specification includes a plurality of antenna modules (structures), and can perform wireless communication with a communication device through the plurality of antenna modules (structures). In this regard, Figure 4 The structure of the antenna module arranged at the lower part of the electronic device is shown.

[0108] Reference Figure 3 and Figure 4 The electronic device 200 may include a display panel 260 and antenna modules 1000 a and 1000 b. The first antenna module 1000 a and the second antenna module 1000 b may be disposed around the display panel 260 . Figure 4 The first antenna module 1000a and the second antenna module 1000b can be respectively Figure 7 The antenna module 1000 and Fig.15 Corresponding to the antenna module 1000.

[0109] The first antenna module 1000 a may be disposed on one side of the electronic device 200 , and the second antenna module 1000 b may be disposed on the other side of the electronic device 200 .

[0110] The first antenna module 1000 a may include a first array antenna 1100 a , a fourth array antenna 1100 b , a second array antenna 1300 , and a third array antenna 1200 .

[0111] The first array antenna 1100a operates as a horizontally polarized antenna that receives or transmits signals in the left direction. The fourth array antenna 1100b operates as a horizontally polarized antenna that receives or transmits signals in the right direction. The first array antenna 1100a can radiate polarized signals that are polarized along the X-axis direction and move toward the Y-axis direction on the left. The fourth array antenna 1100b can radiate polarized signals that are polarized along the X-axis direction and move toward the Y-axis direction on the right.

[0112] The third array antenna 1200 operates as a vertically polarized antenna that receives or transmits signals in the downward direction. The second array antenna 1300 operates as a horizontally polarized antenna that receives or transmits signals in the front direction. The third array antenna 1200 can radiate polarized signals that are polarized along the X-axis direction and move toward the Z-axis direction at the bottom. The second array antenna 1300 can radiate polarized signals that are polarized along the Y-axis direction and move toward the X-axis direction.

[0113] The second antenna module 1000 b may include a first array antenna 1100 a , a fourth array antenna 1100 b , a second array antenna 1300 , and a third array antenna 1200 .

[0114] The first array antenna 1100a operates as a horizontally polarized antenna that receives or transmits signals in the left direction. The fourth array antenna 1100b operates as a horizontally polarized antenna that receives or transmits signals in the right direction. The first array antenna 1100a can radiate polarized signals that are polarized along the X-axis direction and move toward the Y-axis direction on the left. The fourth array antenna 1100b can radiate polarized signals that are polarized along the X-axis direction and move toward the Y-axis direction on the right.

[0115] The third array antenna 1200 operates as a horizontally polarized antenna that receives or transmits signals in a downward direction. The second array antenna 1300 operates as a horizontally polarized antenna that receives or transmits signals in a frontal direction. The third array antenna 1200 can radiate polarized signals that are polarized along the Y-axis direction and move toward the Z-axis direction at the bottom. The second array antenna 1300 can radiate polarized signals that are polarized along the Y-axis direction and move toward the X-axis direction.

[0116] On the other hand, the antenna module of the present specification can be configured as a horizontal configuration structure. In this regard, Figure 5 The structure in which the antenna module of the embodiment is disposed in an electronic device and the structure in which the antenna module is fastened to the electronic device are shown. Figure 5 (a) shows a structure in which the antenna module 1000 is disposed in a lower area of ​​the electronic device 200 . Figure 5 (b) shows a structure in which the antenna module 1000 is fastened to a support structure such as a heat sink 204 .

[0117] Reference Figure 5 (a), the antenna module 1000 can be combined with the end of the heat sink 204 configured in the space between the first cover 201 and the second cover 202. The antenna module 1000 may include a plurality of surfaces. The first surface S1 of the plurality of surfaces can be formed to face the upper direction of the electronic device 200, and the second surface S2 can be formed to face the front direction of the electronic device 200. The third surface S3 of the plurality of surfaces can be formed to face the right side direction of the electronic device 200, and the fourth surface S4 can be formed to face the lower direction of the electronic device 200. The fifth surface S5 of the plurality of surfaces can be formed to face the back direction of the electronic device 200, and the sixth surface (not shown) can be formed to face the left side direction of the electronic device 200.

[0118] The length of the lower end of the first cover 201 combined with the antenna module 1000 can be implemented as a prescribed length (e.g., 9.8 mm) or less. One side end and the back of the antenna module 1000 can be combined with the side area and the back of the first cover 201 so that the antenna module 1000 is configured to be parallel to the horizontal plane. The assembly structure or the pressing structure can be assembled or pressed in the lower direction or the upper direction.

[0119] Reference Figure 5 (b), the support structure such as the heat sink 204 includes a first end 204a, a second end 204b, and a third end 204c coupled to the antenna module 1000. A first hole 204d may be formed at the first end 204a of the heat sink 204, and a second hole 204e may be formed at the second end 204b. The area in which electronic components such as RFIC chips are configured in the antenna module 1000 may be coupled to the third end 204c of the heat sink 204. Thus, heat generated from the electronic components such as the RFIC chips may be discharged to the external area through the heat sink 204.

[0120] A plurality of holes may be formed in a specific area of ​​the antenna module 1000 where no radiator is configured. A first through hole 1001 and a second through hole 1002 may be formed on one side and the other side of the antenna module 1000. A first screw 205a may be coupled to the first hole 204d of the heat sink 204 and the first through hole 1001 of the antenna module 1000. A second screw 205b may be coupled to the second hole 204e of the heat sink 204 and the second through hole 1002 of the antenna module 1000. Figure 5 The antenna module 1000 and a supporting structure such as the heat sink 204 may be combined by a combination structure of screws and holes.

[0121] On the other hand, the antenna module configured in the electronic device of this specification is described. In this regard, Figure 6A cross-sectional view and a three-dimensional structure of a substrate on which an antenna module is formed are shown. Figure 7 FIG. 1 shows a front view of a substrate on which an antenna module is formed. Figure 8 Shows Figure 7 A partial stereoscopic view of the antenna module and a cross-sectional view on a specific line.

[0122] Figure 6 (a) is a cross-sectional view of the antenna module 1000 showing a structure in which a plurality of array antennas are arranged on a substrate 1010 . Figure 6 (b) is a diagram showing a three-dimensional structure of a substrate 1010 having a plurality of surfaces. Figure 6 (c) is composed of Figure 6 (a) is a cross-sectional view of an antenna module 1000 formed of a plurality of layers.

[0123] Reference Figure 6 , the substrate 1010 may include a first surface S1 to a sixth surface S6. The RFIC chip 1400 may be configured on the first surface S1 of the substrate 1010. The first array antenna 1100a may be configured on the second surface S2 of the substrate 1010. The second array antenna 1300 may be configured on the third surface S3 of the substrate 1010. The third array antenna 1200 may be configured on the fourth surface S4 of the substrate 1010. The fourth array antenna 1100b may be configured on the fifth surface S5 of the substrate 1010.

[0124] Figure 7 (a) is a diagram showing a substrate on which the antenna module 1000 is formed divided into regions. Figure 7 (b) is a diagram showing a plurality of array antennas arranged in respective areas of the antenna module 1000 . Figure 7 (c) is a diagram showing a structure for applying a feeding signal to a part of antenna elements arranged in the array antenna arrangement area.

[0125] Reference Figure 7 , the substrate 1010 may include a center portion CR and a periphery PE surrounding the center portion CR. The periphery PE of the substrate 1010 may include a first portion P1 to a fourth portion P4. The first portion P1 constitutes a lower region of the substrate 1010, and the second portion P2 constitutes a side region of the substrate 1010. The third portion P3 constitutes the other side region of the substrate 1010, and the fourth portion P4 constitutes an upper region of the substrate 1010. The antenna module 1000 may include a substrate 1010 and a third array antenna 1200 configured in the array antenna configuration region 1010r.

[0126] Figure 8 (a) shows a perspective view of a side area based on the center of the antenna module 1000 . Figure 8(b) shows a cross-sectional view taken along line AA′ of the antenna module 1000 . Figure 8 (c) shows a cross-sectional view taken along line BB′ of the antenna module 1000 .

[0127] Reference Figures 6 to 8 , the first array antenna 1100a is configured on the second surface S2 of the substrate 1010. The third array antenna 1200 can be configured on the third surface S3 and the internal space of the substrate 1010. The second array antenna 1300 can be configured on the fourth surface S4 of the substrate 1010. The area where the second array antenna 1300 is configured can form a first ground layer 1100g of a first coplanar waveguide structure.

[0128] A fourth array antenna 1100b may also be disposed on the fifth surface S5 of the substrate 1010. The area where the first array antenna 1100a and the fourth array antenna 1100b are disposed may form a second ground layer 1200g of a second coplanar waveguide structure. The area where the third array antenna 1200 is disposed may form a third ground layer 1300g of a third coplanar waveguide structure.

[0129] The inner grounding wall 1130-1, GW formed on the inner side of the substrate 1010 can act as a grounding for the radiation of the plurality of patch antennas PA1 to PA12, CP1 to CP12. The grounding wall 1130, GW acts as a reflector that suppresses the side radiation of the patch antennas PA1 to PA12, CP1 to CP12. In addition, the outer grounding wall 1130-2, GW formed on the outer side of the substrate 1010 suppresses the radiation of the dipole antennas DA21 to DA23 of the side radiation structure toward the opposite side, and acts as a reflector toward the side direction. The grounding wall 1130, GW suppresses the back radiation of the dipole antennas DA1 to DA14 of the front radiation structure, and acts as a reflector toward the front direction.

[0130] The grounding walls 1130 and GW are formed on the side of the antenna module 1000 by connecting the plurality of grounding layers formed in the plurality of layers through the plurality of vias. The grounding walls 1130 and GW may include a plurality of horizontal grounding walls GH1 and GH2 and a plurality of vertical grounding walls GV1 to GV4. The first patch antenna and the second patch antenna may be arranged inside the space formed by the plurality of horizontal grounding walls GH1 and GH2, the plurality of vertical grounding walls GV1 and GV2, and the grounding layer inside the PCB.

[0131] Reference Figures 5 to 8, the antenna module 1000 of this specification is described. The antenna module 1000 may include a substrate 1010, a first array antenna 1100a, a second array antenna 1300, a third array antenna 1200, a fourth array antenna 1100b, and an RFIC 1400 as a millimeter wave transceiver circuit.

[0132] The substrate 1010 may have a first surface S1, a fourth surface S4, and a periphery PE. The periphery PE may be formed between the first surface S1 and the fourth surface S4. The first surface S1 may be formed as an opposite side to the fourth surface S4. A grounding region and an array antenna configuration region 1010r may be formed on the fourth surface S4. The substrate 1010 may be implemented as a multi-layer substrate. For example, the substrate 1010 may be implemented as a 12-layer substrate, but is not limited thereto and may be changed according to the application.

[0133] The fourth surface S4 of the substrate 1010 is divided into a central portion CR, a first portion P1, a second portion P2, a third portion P3, and a fourth portion P4. The second portion P2 is formed on the left side of the first portion P1, and the third portion P3 is formed on the right side of the first portion P1. The array antenna configuration area 1010r can be formed in the central portion CR inside the grounding area that is the first portion P1 and the fourth portion P4. A grounding area is configured in the second portion P2, and a first through hole 1001 is configured inside the grounding area. A grounding area is configured in the third portion P3, and a second through hole 1002 is configured inside the grounding area. Screws can be inserted into the first through hole 1001 of the second portion P2 and the second through hole 1002 of the third portion P3 to fasten the antenna module 1000 to a supporting structure such as a heat sink inside the electronic device.

[0134] A first array antenna 1100a is formed in the outer peripheral surface PE region of the second portion P2. A fourth array antenna 1100b is formed in the outer peripheral surface PE region of the third portion P3. The first array antenna 1100a and the fourth array antenna 1100b can form beam patterns toward multiple side regions of the electronic device. The first array antenna 1100a and the fourth array antenna 1100b can radiate multiple horizontally polarized signals toward multiple side regions of the electronic device.

[0135] The first array antenna 1100a may include a plurality of dipole antennas DA21 to DA23. The fourth array antenna 1100b may include a plurality of dipole antennas DA24 to DA26. The first array antenna 1100a may be implemented as three antenna elements on one side of the periphery PE of the substrate 1010, and the fourth array antenna 1100b may be implemented as three antenna elements on the other side of the periphery PE of the substrate 1010. The first array antenna 1100a may be implemented as a 1x3 array antenna on one side of the substrate 1010, but is not limited thereto. The fourth array antenna 1100b may be implemented as a 1x3 array antenna on the other side of the substrate 1010, but is not limited thereto.

[0136] A third array antenna 1200 may be formed on the fourth surface S4 of the substrate 1010. The third array antenna 1200 may form a beam pattern toward the lower region of the electronic device. The third array antenna 1200 may radiate a horizontally polarized signal toward the lower region of the electronic device. The third array antenna 1200 may be implemented as 12 antenna elements at the center portion CR of the substrate 1010.

[0137] The third array antenna 1200 may include a plurality of patch antennas PA1 to PA12 formed on the fourth surface S4 of the substrate 1010. The third array antenna 1200 may be implemented as twelve 1x12 array antennas at the center portion CR of the substrate 1010, but is not limited thereto.

[0138] Each patch antenna of the third array antenna 1200 may include a first patch element 1220 and a second patch element 1210. The second patch element 1210 may be stacked on the first patch element 1220 in the Z-axis direction as the height direction to couple the signal of the first patch element 1220. The center of the second patch antenna 1210 may be formed to be offset relative to the center of the first patch antenna 1220 in the Y-axis direction as the horizontal axis direction.

[0139] In this regard, the second patch antennas 1210 in the first, third, fifth, seventh, ninth, and eleventh columns may be configured to deviate toward the right region with respect to the first patch antenna 1220 based on the Y axis. The second patch antennas 1210 in the second, fourth, sixth, eighth, tenth, and twelfth columns may be configured to deviate toward the left region with respect to the first patch antenna 1220 based on the Y axis. Thus, the second patch antennas 1210 may be configured to deviate alternately in different directions relative to the first patch antenna 1220.

[0140] The current direction of the signal applied to the second patch antenna 1210 of the first area is formed from the right direction to the left direction. The current direction of the signal applied to the second patch antenna 1210 of the first column, the third column, the fifth column, the seventh column, the ninth column, and the eleventh column is formed from the right direction to the left direction. The current direction of the signal applied to the second patch antenna 1210 of the second area is formed from the left direction to the right direction. The current direction of the signal applied to the second patch antenna 1210 of the second column, the fourth column, the sixth column, the eighth column, the tenth column, and the twelfth column is formed from the left direction to the right direction. Therefore, the current direction of the signal applied to the second patch antenna 1210 and the corresponding first patch antenna 1220, which are configured to deviate alternately in different directions from each other, is in opposite directions. Therefore, it is necessary to make the phase difference of the signal applied to the second patch antenna 1210 configured to deviate alternately become 180 degrees to form a current in the same direction. To this end, RFIC 1400 may control a phase shifter so that the phase difference of the signal applied to the second patch antennas 1210 arranged in an alternately offset manner becomes 180 degrees.

[0141] In this regard, a first feed signal FS1 may be applied to the coupling patch CP1 of the second patch antenna 1210 as the first column. A second feed signal FS2 may be applied to the coupling patch CP2 of the second patch antenna 1210 as the second column. If the first feed signal FS1 and the second feed signal FS2 are in-phase signals, the directions of the electric fields formed on the coupling patches CP1 and CP2 may be formed in opposite directions. The directions of the electric fields formed by the plurality of coupling patches CP1 and CP2 must be formed in the same direction in order to form a directional beam. To this end, the phase difference between the first feed signal FS1 and the second feed signal FS2 needs to be formed to be 180 degrees.

[0142] Similarly, the seventh feed signal FS7 may be applied to the coupling patch CP7 of the second patch antenna 1210 as the seventh column. The eighth feed signal FS8 may be applied to the coupling patch CP8 of the second patch antenna 1210 as the eighth column. If the seventh feed signal FS7 and the eighth feed signal FS8 are in-phase signals, the directions of the electric fields formed on the coupling patches CP7 and CP8 may be formed in opposite directions. The directions of the electric fields formed by the plurality of coupling patches CP7 and CP8 must be formed in the same direction in order to form a directional beam. To this end, the phase difference between the seventh feed signal FS7 and the eighth feed signal FS8 needs to be formed to be 180 degrees.

[0143] Therefore, the phases of the first feed signal FS1, the third feed signal FS3, the fifth feed signal FS5, and the seventh feed signal FS7 applied to the coupling patches CP1, CP3, CP5, and CP7 of the second patch antenna 1210 as the first column, the third column, the fifth column, and the seventh column have the first phase value. On the other hand, the phases of the second feed signal FS2, the fourth feed signal FS4, the sixth feed signal FS6, and the eighth feed signal FS8 applied to the coupling patches CP2, CP4, CP6, and CP8 of the second patch antenna 1210 as the second column, the fourth column, the sixth column, and the eighth column have the second phase value that is 180 degrees different from the first phase value.

[0144] A second array antenna 1300 may be formed at a first portion P1 of the periphery PE of the substrate 1010. The second array antenna 1300 may form a beam pattern toward a front area of ​​the electronic device. The second array antenna 1300 may radiate a horizontally polarized signal toward the front area of ​​the electronic device.

[0145] The second array antenna 1300 may include a plurality of dipole antennas DA1 to DA14 formed at a first portion P1 of the periphery PE of the substrate 1010. The second array antenna 1300 may be implemented as 14 antenna elements at the lower side of the periphery PE of the substrate 1010. The second array antenna 1300 may be implemented as 14 1x14 array antennas at the lower side of the periphery PE of the substrate 1010, but is not limited thereto.

[0146] RFIC1400 can be configured to send and receive signals at a frequency between 10 GHz and 400 GHz using at least one of the first array antenna 1100a, the fourth array antenna 1100b, the third array antenna 1200, and the second array antenna 1300. RFIC1400 can be configured to send and receive signals at a frequency between 10 GHz and 400 GHz using at least one of the plurality of dipole antennas DA21 to DA26, the plurality of patch antennas PA1 to PA12, and the plurality of dipole antennas DA1 to DA14. RFIC1400 can be referred to as a Radio Frequency Integrated Chip (RFIC).

[0147] The number of elements of the second array antenna 1300 forming a beam pattern toward the front region may be set to be greater than the number of elements of the third array antenna 1200 forming a beam pattern toward the lower region. The number of elements of the third array antenna 1200 forming a beam pattern toward the lower region may be set to be greater than the number of first array antennas 1100a and fourth array antennas 1100b forming beam patterns toward a plurality of side regions.

[0148] In this regard, 12 of the 32 pins of the RFIC 1400 may be connected to the third array antenna 1200 that forms a beam pattern toward the lower region. 14 of the 32 pins of the RFIC 1400 may be connected to the second array antenna 1300 that forms a beam pattern toward the front region. 6 of the 32 pins of the RFIC 1400 may be connected to the first array antenna 1100a and the fourth array antenna 1100b that form beam patterns toward a plurality of side regions.

[0149] In this regard, since the second array antenna 1300 has the largest number of elements, it is capable of transmitting signals over a long distance to the front area of ​​the electronic device, but has a narrower beam coverage. The beam direction can be changed by beamforming in the horizontal direction of the front area to compensate for the narrower beam coverage. The number of elements of the second array antenna 1300 can be implemented as a plurality of elements along the Y-axis direction and can be implemented as one element along the Z-axis direction. For example, the second array antenna 1300 can be implemented as a 1x14 array antenna.

[0150] The electronic device needs to perform wireless communication with another electronic device configured in the lower area. For wireless communication, beamforming can be implemented in the lower area of ​​the electronic device in a horizontal direction as the Y-axis direction with narrow beam coverage as a unit. On the other hand, the lower area of ​​the electronic device does not need to transmit signals at a longer distance than the front area. The number of elements of the third array antenna 1200 can be implemented as a plurality along one axis and can be implemented as one along another axis. For example, the third array antenna 1200 can be implemented as a 1x8 or 1x10 or 1x12 array antenna.

[0151] In an indoor propagation environment equipped with an electronic device, signals can also be transmitted to multiple side areas of the electronic device. For multiple side areas of the electronic device, it is more important to achieve wide beam coverage without beamforming than to transmit signals over long distances. In this regard, since the first array antenna 1100a and the fourth array antenna 1100b have the least number of elements, wide beam coverage can be provided to multiple side areas of the electronic device. Thus, the number of elements of the first array antenna 1100a and the fourth array antenna 1100b can be implemented as a plurality of elements along one axis, and can be implemented as one element along another axis. For example, the first array antenna 1100a and the fourth array antenna 1100b can be implemented as a 1x3 array antenna on one side and the other side.

[0152] On the other hand, the plurality of patch antennas of the third array antenna 1300 of the present specification may be stacked so that a portion of the area overlaps. In this regard, Figure 9a Shown by Figure 8 A side view of a portion of an antenna module formed by a plurality of overlapping patch antennas. Figure 9bShows Figure 9a The sizes and spacing distances of radiators arranged on different layers in a side view of the antenna module, and the spacing distance between the radiator and the ground wall.

[0153] Reference Figures 7 to 9a , the array antenna configuration area 1010r forms a first vertical region VR1 including a plurality of layers. A first patch antenna 1220 and a second patch antenna 1210 may be configured in the first vertical region VR1. The second patch antenna 1210 is connected to a fourth portion SL4 of the plurality of signal connection lines SL1 to SL4. The second patch antenna 1210 may be configured to deviate toward one side or the other side along the Y-axis direction of the first patch antenna 1220, so that the signal transmitted to the second patch antenna 1210 is coupled to the first patch antenna 1220.

[0154] Reference Figures 7 to 9b , the second patch antenna 1210 can be formed with a length of d=2*R2 along an axial direction. The distance b from one end of the second patch antenna 1210 to the portion connected to the fourth portion SL4 of the plurality of signal connection lines can be formed to a value of b=R2. In this regard, the feeding connection area of ​​the second patch antenna 1210 can deviate from the center of the second patch antenna 1210 toward one axial direction and can be formed at a central portion in another axial direction. The distance g from the feeding connection area of ​​the second patch antenna 1210 to the horizontal ground wall GH2 can be formed to be greater than a specified interval so that the characteristic changes according to the operating frequency are below a critical value. The distance g' from the other end of the second patch antenna 1210 to the vertical ground wall GV3 can be formed to be greater than a specified interval so that the characteristic changes according to the operating frequency are below a critical value.

[0155] Reference Figures 7 to 9b , the antenna module 1000 having a plurality of layers of the present specification is described. In the antenna module 1000 disclosed in the present specification, the fourth portion SL4 connected to the second patch antenna 1210 may be configured in the dielectric region. In this case, the signal via corresponding to the fourth portion SL4 may be configured in the dielectric region so as not to be electrically connected to the ground region of the fourth lower conductive layer 1144. In this regard, a slit region SR1 may be formed in the ground region of the fourth lower conductive layer 1144.

[0156] The antenna module 1000 may include at least one lower conductive layer below the fourth lower conductive layer 1144. In this regard, the antenna module 1000 may include the fourth lower conductive layer 1144 and a third lower conductive layer 1143 disposed below the fourth lower conductive layer 1144. The third lower conductive layer 1143 may be spaced apart from one end and the other end of the third portion SL3 by a predetermined interval and be disposed on the same layer as the third portion SL3. Therefore, the plurality of lower conductive layers 1140 may include the third lower conductive layer 1143 and the fourth lower conductive layer 1144.

[0157] On the other hand, one end of the third portion SL3 and one end of the third lower conductive layer 1143 may be an internal portion of the lower region of the second patch antenna 1210. In this regard, the region where the conductive layer is removed between one end of the third portion SL3 and one end of the third lower conductive layer 1143 may also be referred to as the second slit region SR2. The third lower conductive layer 1143 may also be electrically connected to the grounding region of the fourth lower conductive layer 1144 and implemented as a grounding layer. Alternatively, the third lower conductive layer 1143 may also be electrically separated from the grounding region of the fourth lower conductive layer 1144 and implemented as a signal line.

[0158] On the other hand, the antenna module 1000 may further include a second lower conductive layer 1142 disposed at the lower portion of the third portion SL3 as a feed line. A grounding region of a fourth lower conductive layer 1144 above the third lower conductive layer 1143 may also be referred to as a third lower conductive layer. Therefore, the plurality of lower conductive layers 1140 may include a first lower conductive layer 1141, a second lower conductive layer 1142, and a third lower conductive layer 1143.

[0159] The second lower conductive layer 1142 may include a third slit region SR3 where the conductive layer is removed in a region corresponding to the lower region of the second patch antenna 1210. The length of the third slit region SR3 on one axis may be greater than the length of the plurality of pads of the fourth portion SL4 as the signal via on one axis. Therefore, the third slit region SR3 where the conductive layer is removed from the second ground layer GND2 at the lower end is formed at the portion where the fourth portion SL4 connected to the second patch antenna 1210 is connected to the third portion SL3.

[0160] The region where the conductive layer is removed, such as the plurality of slit regions SR1 to SR3, can be referred to as an open space. The open space, such as the plurality of slit regions SR1 to SR3, can reduce the resonant frequency of the antenna to a low frequency band without increasing the size of the patch antenna. Therefore, as part of the ground region is removed, the overall height of the antenna increases, thereby enabling broadband operation.

[0161] In addition, the plurality of lower conductive layers 1140 may include a first lower conductive layer 1141, a second lower conductive layer 1142, a third lower conductive layer 1143, and a fourth lower conductive layer 1144. The first lower conductive layer 1141 may be configured adjacent to the pad of the second portion SL2 to cover the lower region of the region where the second patch antenna 1210 is configured. The first lower conductive layer 1141 may be implemented as a ground layer. Alternatively, depending on the application, the first lower conductive layer 1141 may also be implemented as a conductive layer in a floating state without being electrically connected to the ground layer. The first lower conductive layer 1141 may also be implemented as a plurality of separate conductive layers, a portion of which may act as a ground layer, and the remaining portions may act as a conductive layer in a floating state.

[0162] On the other hand, the antenna module 1000 may further include a plurality of vertical ground walls 1131 to 1134 formed of a plurality of pads above the ground region of the fourth lower conductive layer 1144. The first patch antenna 1220 and a portion of the second patch antenna 1210 may be overlapped and stacked in the space between the plurality of vertical ground walls 1131 and 1132.

[0163] A plurality of patch antennas stacked in another layer with overlapping areas in the antenna module 1000 of the present specification may be arranged in a space formed by the ground wall 1130. Figures 7 to 9b The ground wall 1130 may be formed along a side region of the substrate 1010 implemented by a plurality of layers. In this regard, the ground wall 1130 may include a plurality of conductive pads configured on a plurality of layers and a plurality of vias connecting the plurality of conductive pads. The ground wall 1130 including the plurality of conductive pads and the plurality of vias may be referred to as a ground via wall.

[0164] The grounding wall 1130 may include a first grounding wall 1131 formed along one side area of ​​the first vertical region VR1 and a second grounding wall 1132 formed along another side area. The grounding wall 1130 may also include a third grounding wall 1133 formed along one side area of ​​the second vertical region VR2 and a fourth grounding wall 1134 formed along one side of the third vertical region VR3.

[0165] The ground wall 1130 can be arranged at the edge of the substrate 1010 and the edge of the array antenna configuration area 1010r with the first patch antenna 1220 as the center. It can be arranged at least one of the four surfaces of the upper, lower, left and right regions with the first patch antenna 1220 as the center. The ground wall 1130 can be connected to the ground layer to improve the antenna gain. Alternatively, the ground wall 1130 can also be composed of a conductor wall in a floating state composed only of a via pad without a vertical connection portion.

[0166] Relatedly, Fig.10 The via wall forming structure of the embodiment is shown. Fig.10 The via wall may form a plurality of signal connection lines, or may be connected to a ground plane. The via pads VP1 to VPn in the form of copper foil may be arranged on the entire layer of the substrate 1010, or may be arranged on only a part of the layer.

[0167] Reference Fig.10 (a) and Fig.10 (b), the ground wall may include vertical connection portions VC1, VC2 to VCn-1, and a plurality of via pads VP1, VP2 to VPn-1. Figure 6 (a), adjacent pads among the plurality of pads VP1, VP2 to VPn-1 may be connected to each other through one of the vertical connection portions VC1, VC2 to VCn-1. Fig.10 (b), at least one adjacent pad among the plurality of pads VP1, VP2 to VPn-1 of the ground wall 1130 may not be connected by the vertical connection portion.

[0168] As an example, the first pad VP1 and the second pad VP2 can be coupled without a vertical connection portion, and the remaining pads can be connected through the vertical connection portions VP2 to VPn-1. However, this structure is not limited to this, and can be configured to be connected or not connected according to each layer. In this regard, in the case where a plurality of signal lines are arranged in an area adjacent to the via wall, the via wall can also be coupled without a vertical connection portion. On the other hand, when coupled without a vertical connection portion, a plurality of conductive layers can also form an EBG (electronic band gap) structure without being electrically connected to the ground layer. Thereby, mutual interference caused by adjacent radiators or signal lines can be reduced, or deformation caused by pressure or heat applied to the substrate 1010 can be prevented.

[0169] On the contrary, refer to Fig.10(c), the plurality of pads VP1, VP2 to VPn-1 of the ground wall 1130 may also be coupled without a vertical connection portion. Figures 7 to 9b The plurality of vertical ground walls GV1 to GV5 can be implemented as Fig.10 (a) to Fig.10 Any one of the multiple grounded walls of (c).

[0170] The following describes the configuration structure of each layer of the antenna module of this specification. Fig.11a and Fig.11b Yes Figure 8 The antenna module is shown in a front view by layer. Fig.12a It is shown Figure 8 Figure 1 shows the first and third layers of the antenna module.

[0171] Figure 12b It is shown Figure 8 Figure 1. The first and fifth layers of the antenna module. Fig.12c It is shown Figure 8 Figure 1. The first and seventh layers of the antenna module.

[0172] Reference Figures 6 to 12c , each layer of the antenna module 1000 is described in detail. The antenna module 1000 may be composed of a first layer La1 configured with a transceiver circuit 1400, a fifth layer La5 and a sixth layer La6 formed with a plurality of feeders for the second array antenna 1300. In addition, the antenna module 1000 may also include a seventh layer La7 formed with a plurality of feeders for the third array antenna 1200, and a twelfth layer La12 configured with a plurality of antenna elements of the third array antenna 1200.

[0173] The first layer La1 may be provided with a transceiver circuit 1400, which may have a plurality of pins and signal connection lines connected to the plurality of pins. The transceiver circuit 1400 may be provided with a central line of an axial direction of the first layer La1 as a reference.

[0174] The second layer La2 is formed with a metal layer, which can be configured as the first ground layer GND1 of the first layer La1. A plurality of dipole antennas DA21 to DA26 of the first array antenna 1100a and the fourth array antenna 1100b can be configured in one side and the other side area of ​​the third layer La3. The ends of the plurality of first feed lines Fa1 to Fa6 of the plurality of dipole antennas DA21 to DA26 can be connected to the plurality of signal connection lines of the first layer La1 through the first vias Va1 to Va6. A ground pattern GL, GR with a via can be formed on one side and the other side of each of the plurality of first feed lines Fa1 to Fa6 to form a first ground portion GP1. Therefore, the plurality of first feed lines Fa1 to Fa6 can be formed as a coplanar waveguide structure.

[0175] The fourth layer La4 is formed with a metal layer, which can be configured as the ground layer GND2 of the third layer La3. The plurality of first feed lines of the third layer La3 are arranged between the ground layer of the second layer La2 and the ground layer of the fourth layer La4. Thus, the plurality of first feed lines of the third layer La3 are formed into a first coplanar waveguide structure in which a ground layer is formed in the upper layer and the lower layer in the height direction. A portion of the metal layer of the ground layer of the second layer La2 and the ground layer of the fourth layer La4 can be removed so that the plurality of first vias can be vertically connected.

[0176] On the XY plane, the plurality of dipole antennas DA1 to DA14 of the second array antenna 1300 may be disposed in the lower region of the fifth layer La5. Ends of the plurality of second feed lines of the plurality of dipole antennas DA1 to DA14 may be connected to the plurality of lines of the first layer La1 through second vias Vb1 to Vb14.

[0177] The sixth layer La6 is formed with a metal layer, which can be configured as the ground layer GND3 of the fifth layer La5. The plurality of second feed lines of the fifth layer La5 are arranged between the ground layer of the fourth layer La4 and the ground layer of the sixth layer La6. Thus, the plurality of second feed lines of the fifth layer La5 are formed into a second coplanar waveguide structure having ground layers formed in the upper layer and the lower layer in the height direction. A portion of the metal layer of the ground layer of the fourth layer La4 and the ground layer of the sixth layer La6 can be removed so that the first via and the second via can be vertically connected.

[0178] The seventh layer La7 may be provided with a plurality of third feeders of the plurality of second patch antennas CP1 to CP12 of the third array antenna 1200. The distances between one end and the other end of the plurality of third feeders may be formed to be the same. The third vias Vc1 to Vc12 formed at one end of the plurality of third feeders may be used to electrically connect to the plurality of wires of the first layer La1.

[0179] The eighth layer La8 is formed with a metal layer, which can be configured as a fourth ground layer GND4. The plurality of third feed lines of the seventh layer La7 are arranged between the ground layer of the sixth layer La6 and the ground layer of the eighth layer La8. Thus, the plurality of third feed lines of the seventh layer La7 are formed into a third coplanar waveguide structure having ground layers formed in the upper layer and the lower layer in the height direction. A portion of the metal layer provided in the ground layer of the sixth layer La6 and the ground layer of the eighth layer La8 can be removed so that the plurality of second vias and the plurality of third vias can be vertically connected.

[0180] As mentioned above, the second layer La2, the fourth layer La4, the sixth layer La6, and the eighth layer La8 can respectively constitute the first ground layer GND1 to the fourth ground layer GND4. The ground layers are electrically connected by using a plurality of connecting vias connecting a plurality of ground layers. The substrate 1010 may include the first ground layer GND1 of the transceiver circuit 1400 to the fourth ground layer GND4 of the third array antenna 1200. The first array antenna 1100a and the fourth array antenna 1100b can be configured as antennas and signal lines in a layer between the first ground layer GND1 and the second ground layer GND2.

[0181] The third array antenna 1200 can be configured as an antenna and a signal line on the upper layer of the fourth ground layer GND4. The second array antenna 1300 can be configured as an antenna and a signal line between the metal layer as the ground layer of the fourth layer La4 and the metal layer as the ground layer of the sixth layer La6. Thus, the first array antenna 1100a, the fourth array antenna 1100b, the third array antenna 1200, and the second array antenna 1300 can isolate the respective signal lines from each other through the second ground layer GND2 to the fourth ground layer GND4. Therefore, the mutual interference generated between the respective signal lines of the plurality of array antennas isolated from each other by the second ground layer GND2 to the fourth ground layer GND4 will be reduced.

[0182] The lengths of the plurality of feed lines from RFIC1400 to the third array antenna 1200 can be configured to be the same for all antenna elements. The lengths of the plurality of feed lines of the third array antenna 1200 can be determined as the sum of the first length L1a to the fourth length L4a. For all second patch antennas CP1 to CP12 of the third array antenna 1200, the lengths of the plurality of feed lines can be the same. For all second patch antennas CP1 to CP12, the first length L1a to the fourth length L4a can be the same, respectively. Thus, the plurality of signals applied from RFIC1400 to all second patch antennas CP1 to CP12 become in phase, so that a beam can be formed toward the center.

[0183] The third vias Vc1 to Vc12 are formed to be vertically connected from the first layer La1 to the seventh layer La7. A grounding area composed of a metal layer and an array antenna configuration area 1010r as a first dielectric area from which the metal layer is removed may be formed in the eighth layer La8 to the twelfth layer La12. A plurality of coupling patches CP1 to CP12 connected to the ends of the third vias Vc1 to Vc12 may be configured in the tenth layer La10. The plurality of coupling patches CP1 to CP12 may be referred to as a feed plate.

[0184] A plurality of grounding regions formed of metal layers formed on the first layer La1 to the twelfth layer La12 are connected by a plurality of vias. A plurality of coupling patches CP1 to CP12 of the third array antenna may be disposed on the tenth layer La10.

[0185] The twelfth layer La12 may be provided with a plurality of first patch antennas PA1 to PA12 of the third array antenna 1200. Adjacent antennas among the plurality of first patch antennas PA1 to PA12 may be arranged at equal intervals from each other. The centers of the plurality of second patch antennas CP1 to CP12 may be arranged offset along the Y-axis direction as the horizontal axis direction relative to the centers of the plurality of first patch antennas PA1 to PA12.

[0186] Hereinafter, the dipole antenna configuration structure of the antenna module 1000 implemented by the multi-layered antenna package of the present specification will be described with reference to the accompanying drawings. Fig.13a and Fig.13b A front perspective view and a side view of an antenna module implemented by a multi-layer antenna package are shown.

[0187] Reference Fig.13a and Fig.13b The antenna module 1000 may include a first ground plane 1011, a second ground plane 1012, a signal line 1020, and a dipole antenna. The dipole antenna may include Figure 7 and Fig.12a The dipole antennas DA21 to DA23 of the first array antenna 1100a or the fourth array antenna 1100b. The dipole antennas may be composed of Figure 7 and Figure 12b The second array antenna 1300 includes dipole antennas DA1 to DA14.

[0188] Reference Figure 7 , Fig.11a , Fig.12a as well as Fig.13b, an antenna module 1000 configured in a plurality of layers implemented by a dipole antenna is described. As described above, the antenna module 1000 may include a first ground plane 1011, a second ground plane 1012, a signal line 1020, and a dipole antenna. The first ground plane 1011 and the signal line 1020 are configured on the same plane. The second ground plane 1012 and the signal line 1020 are configured on different planes. In the dipole antenna constituting the first array antenna 1100a, the second ground plane 1012 may be configured in the first layer La1. In the dipole antenna constituting the first array antenna 1100a, the first ground plane 1011 and the signal line 1120 may be configured in the third layer La3.

[0189] The antenna module 1000 may include a ground wall 1130, a GW, and a dielectric region 1010d. A plurality of first vias V1a may be adjacently arranged at an end of the ground wall 1130 adjacent to the dielectric region 1010d. A transmission line section 1020r1 may be formed inside the ground wall 1130. Inside the ground wall 1130 and the GW, a plurality of vias may be arranged in the ground regions on both sides of the signal line 1020. Therefore, the signal line 1020 inside the ground wall 1130 and the GW forms a coplanar waveguide structure of a symmetrical structure.

[0190] On the other hand, the plurality of second vias V2a may be disposed only in the grounding region 1011a on one side of the signal line 1020 in the first region of the dielectric region 1010d. Therefore, in the first region of the dielectric region 1010d, the signal line 1020 forms a coplanar waveguide structure of an asymmetrical structure. The first region of the dielectric region adjacent to the grounding wall 1130 may form an E-field transition section 1020r2.

[0191] The second region of the dielectric region 1010d may form a radiator section 1030r3. The radiator section 1030r3 may be provided with the first array antenna 1100a or the second array antenna 1300 implemented by a dipole antenna.

[0192] The area with the strongest electric field strength in the radiator interval 1030r3 is the direction parallel to the substrate, that is, the horizontal direction. The dipole antenna in the radiator interval 1030r3 can be formed to have a horizontal polarization characteristic. The area with the strongest electric field strength in the coplanar waveguide structure inside the ground wall 1130 and GW is the direction perpendicular to the substrate, that is, the vertical direction. Therefore, it is necessary to change a part of the transmission line structure in the electric field transition interval 1020r2 to achieve a transition between the vertical electric field component of the transmission line and the horizontal electric field component of the antenna. To this end, the plurality of second vias V2a can be configured only in the ground area 1011a on one side of the signal line 1020 in the first area of ​​the dielectric area 1010d.

[0193] Hereinafter, the patch antenna configuration structure of the antenna module 1000 implemented by the multi-layered antenna package of the present specification will be described with reference to the accompanying drawings. Fig.14a It is shown that the stacked Figure 8 FIG. 10 and 12 of the plurality of patch antennas of the antenna module. Fig.14b It is shown that the configuration is Figure 8 A diagram of an overlapping configuration structure of multiple patch antennas in an array antenna configuration area of ​​an antenna module.

[0194] Reference Fig.14a , the distance between each of the plurality of first patch antennas PA1 to PA12 may be formed identically at the third interval G3. The distance between each of the plurality of first patch antennas PA1 to PA12 may be formed identically at the third interval G3 on the Y axis. On the other hand, the distance between each of the plurality of second patch antennas CP1 to CP12 may be separated by the first interval G1 or the second interval G2 on the Y axis. The length of the first interval G1 may be less than the length of the third interval G3. The length of the second interval G2 may be greater than the length of the third interval G3.

[0195] Reference Fig.14b , the plurality of first patch antennas 1220 and the plurality of second patch antennas 1210 may be arranged on a first horizontal axis Hy1 corresponding to the center of the array antenna arrangement region 1010r.

[0196] The centers of the plurality of patch antennas in the first group of the plurality of first patch antennas 1220 may be aligned along the first vertical axis Vx1. The centers of the plurality of patch antennas in the first group of the plurality of second patch antennas 1210 may be aligned along the second vertical axis Vx2. The second vertical axis Vx2 may be spaced apart from the first vertical axis Vx1 in parallel to the positive direction of the Y axis.

[0197] The centers of the second group of the plurality of first patch antennas 1220 may be aligned along the third vertical axis Vx3. The centers of the second group of the plurality of second patch antennas 1210 may be aligned along the fourth vertical axis Vx4. The fourth vertical axis Vx4 may be spaced apart from the third vertical axis Vx3 in parallel to the negative direction of the Y axis.

[0198] The first patch antenna 1220 may be formed of a circular patch antenna having a first diameter R1. The second patch antenna 1210 may be formed of a circular patch antenna having a second diameter R2 that is smaller than the first diameter R1. The first patch antenna 1220 and the second patch antenna 1210 may be configured to have an overlapping region Ro having an arc region in the horizontal axis direction. The length of the overlapping region Ro between the first patch antenna 1210 and the second patch antenna 1220 may be less than the radius R2 of the second patch antenna 1210.

[0199] When the offset portion of the second patch antenna 1210, for example, the right / left portion, is connected to the connection regions CR2 and CR3 through the feed via, the polarization of the electromagnetic wave radiated from the second patch antenna 1210 is formed only in the left and right directions. The connection regions CR2 and CR3 are formed at a portion (offset point) offset from the center point of the second patch antenna 1210 by a predetermined distance.

[0200] The current distribution in the region adjacent to the connection regions CR2 and CR3 is higher than the current distribution in the peripheral region. The mode formed by the second patch antenna 1210 that forms the current distribution in the left-right direction as described above is the TE11 mode.

[0201] The connection regions CR2 and CR3 may be formed in the direction away from the center of the second patch antenna 1210 along the Y-axis direction of the second patch antenna 1210. Therefore, a dominant current distribution is formed in the left-right direction in the current generated by the second patch antenna 1210. Therefore, the antenna element including the first patch antenna 1210 and the second patch antenna 1220 will operate like the TE11 mode. As a result, the main polarization (co-polarization) radiation performance in the left-right direction is increased, rather than the cross-polarization (cross-polarization) component in the up-down direction, thereby improving the antenna gain performance.

[0202] The TE11 mode attenuates the current components in the up and down directions and virtually eliminates them. As a result, the main polarization radiation corresponding to the horizontal polarization increases, thereby improving the antenna gain. In addition, the cross-polarization component decreases, and it is expected that the data throughput performance will be improved due to the improvement of MIMO performance.

[0203] On the other hand, in the antenna module implemented by the multi-layer package of the present specification, the third array antenna configured in the center of the PCB can realize vertical polarization in addition to horizontal polarization. Fig.15 The cross-sectional view and the three-dimensional structure of the substrate formed with the antenna module are shown. Fig.16 Shows Fig.15 A partial stereoscopic view of the antenna module and a cross-sectional view on a specific line.

[0204] Fig.15 (a) is a diagram showing a substrate on which the antenna module 1000 is formed divided into regions. Fig.15 (b) is a diagram showing a plurality of array antennas arranged in respective areas of the antenna module 1000 . Fig.15 (c) is a diagram showing a structure for applying a feeding signal to a part of antenna elements arranged in the array antenna arrangement area.

[0205] Reference Fig.15 , the substrate 1010 may include a center portion CR and a periphery PE surrounding the center portion CR. The periphery PE of the substrate 1010 may include a first portion P1 to a fourth portion P4. The first portion P1 constitutes a lower region of the substrate 1010, and the second portion P2 constitutes a side region of the substrate 1010. The third portion P3 constitutes the other side region of the substrate 1010, and the fourth portion P4 constitutes an upper region of the substrate 1010. The antenna module 1000 may include a substrate 1010 and a third array antenna 1200 configured in the array antenna configuration region 1010r.

[0206] Fig.16 (a) shows a perspective view of a side area based on the center of the antenna module 1000 . Fig.16 (b) shows a cross-sectional view taken along line AA′ of the antenna module 1000 . Fig.16 (c) shows a cross-sectional view taken along line BB′ of the antenna module 1000 .

[0207] Reference Figure 6 , Fig.15 as well as Fig.16, the first array antenna 1100a is configured on the second surface S2 of the substrate 1010. The third array antenna 1200 can be configured on the third surface S3 and the internal space of the substrate 1010. The second array antenna 1300 can be configured on the fourth surface S4 of the substrate 1010. The area where the second array antenna 1300 is configured can form a first ground layer 1100g of a first coplanar waveguide structure.

[0208] A fourth array antenna 1100b may also be disposed on the fifth surface S5 of the substrate 1010. The area where the first array antenna 1100a and the fourth array antenna 1100b are disposed may form a second ground layer 1200g of a second coplanar waveguide structure. The area where the third array antenna 1200 is disposed may form a third ground layer 1300g of a third coplanar waveguide structure.

[0209] The inner grounding wall 1130-1 and GW formed on the inner side of PCB1010 can act as a grounding for the radiation of multiple patch antennas PA1 to PA12 and CP1 to CP12. The grounding wall 1130 and GW act as a reflector to suppress the side radiation of the patch antennas PA1 to PA12 and CP1 to CP12. In addition, the outer grounding wall 1130-2 and GW formed on the outer side of PCB1010 suppresses the radiation of the dipole antennas DA21 to DA23 of the side radiation structure toward the opposite side, and acts as a reflector toward the side direction. The grounding wall 1130 and GW suppress the back radiation of the dipole antennas DA1 to DA14 of the front radiation structure, and acts as a reflector toward the front direction.

[0210] The grounding walls 1130 and GW are formed on the side of the antenna module 1000 by connecting the plurality of grounding layers formed in the plurality of layers through the plurality of vias. The grounding walls 1130 and GW may include a plurality of horizontal grounding walls GH1 and GH2 and a plurality of vertical grounding walls GV1 to GV4. The first patch antenna and the second patch antenna may be arranged inside the space formed by the plurality of horizontal grounding walls GH1 and GH2, the plurality of vertical grounding walls GV1 and GV2, and the grounding layer inside the PCB.

[0211] The spacing distances, sizes, etc. between the ground wall 1130, GW and the plurality of virtual patterns DP1, DP2 can be implemented within a specified range based on the half-wavelength period of 60 GHz as the operating frequency. Here, the spacing distances Dy1, Dx1 between the ground wall 1130, GW and the virtual pattern DP1 can be defined as the distance from the virtual pattern DP1 to the upper end of the ground wall 1130, GW on the horizontal axis and the vertical axis. The spacing distances Dy2, Dx2 between the ground wall 1130, GW and the virtual pattern DP2 can be defined as the distance from the virtual pattern DP1 to the lower end of the ground wall 1130, GW on the horizontal axis and the vertical axis. The spacing distance Dpy between the plurality of virtual patterns DP1, DP2 adjacent in the horizontal axis direction can be implemented within a specified range based on the half-wavelength of 60 GHz. The layer position, size, and overlapping area with the plurality of first patch antennas 1220 of the plurality of second patch antennas 1210 as the plurality of coupling patches can be designed in consideration of the radiation characteristics and array characteristics.

[0212] Reference Figure 6 , Fig.15 as well as Fig.16 , the antenna module 1000 of this specification is described. The antenna module 1000 may include a substrate 1010, a first array antenna 1100a, a second array antenna 1300, a third array antenna 1200, a fourth array antenna 1100b, and an RFIC 1400 as a millimeter wave transceiver circuit.

[0213] The substrate 1010 may have a first surface S1, a fourth surface S4, and a periphery PE. The periphery PE may be formed between the first surface S1 and the fourth surface S4. The first surface S1 may be formed as an opposite side to the fourth surface S4. A grounding region and an array antenna configuration region 1010r may be formed on the fourth surface S4. The substrate 1010 may be implemented as a multi-layer substrate. For example, the substrate 1010 may be implemented as a 12-layer substrate, but is not limited thereto and may be changed according to the application.

[0214] The fourth surface S4 of the substrate 1010 is divided into a central portion CR, a first portion P1, a second portion P2, a third portion P3, and a fourth portion P4. The second portion P2 is formed on the left side of the first portion P1, and the third portion P3 is formed on the right side of the first portion P1. The array antenna configuration area 1010r can be formed in the central portion CR inside the grounding area that is the first portion P1 and the fourth portion P4. A grounding area is configured in the second portion P2, and a first through hole 1001 is configured inside the grounding area. A grounding area is configured in the third portion P3, and a second through hole 1002 is configured inside the grounding area. Screws can be inserted into the first through hole 1001 of the second portion P2 and the second through hole 1002 of the third portion P3 to fasten the antenna module 1000 to a supporting structure such as a heat sink inside the electronic device.

[0215] The fourth surface S4 forms the outmost surface of the PCB 1010. The fourth surface S4 may be formed as a metal layer connected to the ground. The inner surface of the metal layer may be provided with a first region RS1 provided with the first patch antenna 1220, and a second region RS2 and a third region RS3 on both sides of the first region RS1 that do not act as a ground.

[0216] As the same region as the first region RS1, a first vertical region VR1 may be formed from the outermost surface of the PCB 1010 to the upper ground layer in the antenna direction of the internal layer of the PCB where the plurality of signal connection lines of the third portion SL3 are arranged. The first vertical region VR1 may be formed by the plurality of patch antennas 1210, 1220 and dielectric material arranged in the first vertical region VR1. The outer peripheral surface of the first vertical region VG1 may form a plurality of ground walls.

[0217] As the same region as the second region RS2, a second vertical region VR2 may be formed from the outermost surface of the PCB1010 to the ground layer inside the PCB. The interior of the second vertical region VR2 may be formed by a plurality of first parasitic metals (parasitic metallic) DP1 and a dielectric substance. A plurality of grounding walls may be formed on the outer peripheral surface of the second vertical region VR2. As the same region as the third region RS3, a third vertical region VR3 may be formed from the outermost surface of the PCB1010 to the ground layer inside the PCB. The interior of the third vertical region VR3 may be formed by a plurality of second parasitic metals DP2 and a dielectric substance. A plurality of grounding walls may be formed on the outer peripheral surface of the third vertical region VR3. The plurality of first parasitic metals DP1 and the plurality of second parasitic metals DP2 may correspond to the plurality of first virtual patterns and the plurality of second virtual patterns.

[0218] The first vertical height Vh1 of the first vertical region VR1 may be greater than the second vertical height Vh2 of the second vertical region VR2. The first vertical height Vh1 of the first vertical region VR1 may be greater than the third vertical height Vh3 of the third vertical region VR3. The second vertical height Vh2 of the second vertical region VR2 may be the same as the third vertical height Vh3 of the third vertical region VR3.

[0219] The first surface S1 of the substrate 1010 is divided into a central portion CR, a first portion P1, a second portion P2, a third portion P3, and a fourth portion P4. The second portion P2 is formed on the left side of the first portion P1, and the third portion P3 is formed on the right side of the first portion P1. A grounding region is configured in the first portion P1, and a second virtual array pattern region 1010d2 is formed inside. An array antenna configuration region 1010r is formed in the central portion CR. A grounding region is configured in the fourth portion P4, and a first virtual array pattern region 1010d1 is formed inside. A grounding region is configured in the second portion P2, and a first through hole 1001 is configured inside the grounding region. A grounding region is configured in the third portion P3, and a second through hole 1002 is configured inside the grounding region. Screws can be inserted into the first through hole 1001 of the second portion P2 and the second through hole 1002 of the third portion P3 to fasten the antenna module 1000 to a supporting structure such as a heat sink inside the electronic device.

[0220] A first array antenna 1100a is formed in the outer peripheral surface PE region of the second portion P2. A fourth array antenna 1100b is formed in the outer peripheral surface PE region of the third portion P3. The first array antenna 1100a and the fourth array antenna 1100b can form beam patterns toward multiple side regions of the electronic device. The first array antenna 1100a and the fourth array antenna 1100b can radiate multiple vertically polarized signals toward multiple side regions of the electronic device.

[0221] The first array antenna 1100a may include a plurality of dipole antennas DA21 to DA23. The fourth array antenna 1100b may include a plurality of dipole antennas DA24 to DA26. The first array antenna 1100a may be implemented as three antenna elements on one side of the periphery PE of the substrate 1010, and the fourth array antenna 1100b may be implemented as three antenna elements on the other side of the periphery PE of the substrate 1010. The first array antenna 1100a may be implemented as a 1x3 array antenna on one side of the substrate 1010, but is not limited thereto. The fourth array antenna 1100b may be implemented as a 1x3 array antenna on the other side of the substrate 1010, but is not limited thereto.

[0222] A third array antenna 1200 may be formed on the first surface S1 of the substrate 1010. The third array antenna 1200 may form a beam pattern toward the lower region of the electronic device. The third array antenna 1200 may radiate a vertically polarized signal toward the lower region of the electronic device. The third array antenna 1200 may be implemented as 12 antenna elements at the center portion CR of the substrate 1010.

[0223] The third array antenna 1200 may include a plurality of patch antennas PA1 to PA12 formed on the first surface S1 of the substrate 1010. In the XY plane, a plurality of dummy patterns DP1 and DP2 are arranged in the upper and lower regions of the plurality of patch antennas PA1 to PA12, thereby suppressing side surface radiation. The third array antenna 1200 may be implemented as 12 1x12 array antennas in the center portion CR of the substrate 1010, but is not limited thereto.

[0224] Each patch antenna of the third array antenna 1200 may include a first patch antenna 1220 and a second patch antenna 1210. The second patch antenna 1210 may be stacked on the first patch antenna 1220 in the Z-axis direction as the height direction to couple the signal of the first patch antenna 1220. The center of the second patch antenna 1210 may be formed to be offset relative to the center of the first patch antenna 1220 in the X-axis direction as the vertical axis direction.

[0225] In this regard, the second patch antennas 1210 in the first, third, fifth, eighth, tenth, and twelfth columns may be configured to deviate toward the lower region relative to the first patch antenna 1220 with the X-axis as a reference. The second patch antennas 1210 in the second, fourth, sixth, seventh, ninth, and eleventh columns may be configured to deviate toward the upper region relative to the first patch antenna 1220 with the X-axis as a reference. Thus, the second patch antennas 1210 may be configured to deviate alternately toward different directions relative to the first patch antenna 1220.

[0226] The current direction of the signal applied to the second patch antenna 1210 of the first column, the third column, the fifth column, the eighth column, the tenth column, and the twelfth column is formed from the lower direction to the upper direction. The current direction of the signal applied to the second patch antenna 1210 of the second column, the fourth column, the sixth column, the seventh column, the ninth column, and the eleventh column is formed from the upper direction to the lower direction. Therefore, the current direction of the signal applied to the second patch antenna 1210 and the corresponding first patch antenna 1220 configured in an alternating manner in different directions is in opposite directions. Therefore, it is necessary to make the phase difference of the signal applied to the second patch antenna 1210 configured in an alternating manner 180 degrees to form a current in the same direction. To this end, RFIC1400 can control the phase shifter so that the phase difference of the signal applied to the second patch antenna 1210 configured in an alternating manner becomes 180 degrees.

[0227] In this regard, a first feed signal FS1 may be applied to the coupling patch CP1 of the second patch antenna 1210 as the first column. A second feed signal FS2 may be applied to the coupling patch CP2 of the second patch antenna 1210 as the second column. If the first feed signal FS1 and the second feed signal FS2 are in-phase signals, the directions of the electric fields formed on the coupling patches CP1 and CP2 may be formed in opposite directions. The directions of the electric fields formed by the plurality of coupling patches CP1 and CP2 must be formed in the same direction in order to form a directional beam. To this end, the phase difference between the first feed signal FS1 and the second feed signal FS2 needs to be formed to be 180 degrees.

[0228] Similarly, the seventh feed signal FS7 may be applied to the coupling patch CP7 of the second patch antenna 1210 as the seventh column. The eighth feed signal FS8 may be applied to the coupling patch CP8 of the second patch antenna 1210 as the eighth column. If the seventh feed signal FS7 and the eighth feed signal FS8 are in-phase signals, the directions of the electric fields formed on the coupling patches CP7 and CP8 may be formed in opposite directions. The directions of the electric fields formed by the plurality of coupling patches CP7 and CP8 must be formed in the same direction in order to form a directional beam. To this end, the phase difference between the seventh feed signal FS7 and the eighth feed signal FS8 needs to be formed to be 180 degrees.

[0229] Therefore, the phases of the first feed signal FS1, the third feed signal FS3, the fifth feed signal FS5, and the eighth feed signal FS8 applied to the coupling patches CP1, CP3, CP5, and CP8 of the second patch antenna 1210 as the first column, the third column, the fifth column, and the eighth column have the first phase value. On the other hand, the phases of the second feed signal FS2, the fourth feed signal FS4, the sixth feed signal FS6, and the seventh feed signal FS7 applied to the coupling patches CP2, CP4, CP6, and CP7 of the second patch antenna 1210 as the second column, the fourth column, the sixth column, and the seventh column have the second phase value that is 180 degrees different from the first phase value.

[0230] A second array antenna 1300 may be formed at a first portion P1 of the periphery PE of the substrate 1010. The second array antenna 1300 may form a beam pattern toward a front area of ​​the electronic device. The second array antenna 1300 may radiate a horizontally polarized signal toward the front area of ​​the electronic device.

[0231] The second array antenna 1300 may include a plurality of dipole antennas DA1 to DA14 formed at a first portion P1 of the periphery PE of the substrate 1010. The second array antenna 1300 may be implemented as 14 antenna elements at the lower side of the periphery PE of the substrate 1010. The second array antenna 1300 may be implemented as 14 1x14 array antennas at the lower side of the periphery PE of the substrate 1010, but is not limited thereto.

[0232] RFIC1400 can be configured to send and receive signals at a frequency between 10 GHz and 400 GHz using at least one of the first array antenna 1100a, the fourth array antenna 1100b, the third array antenna 1200, and the second array antenna 1300. RFIC1400 can be configured to send and receive signals at a frequency between 10 GHz and 400 GHz using at least one of the plurality of dipole antennas DA21 to DA26, the plurality of patch antennas PA1 to PA12, and the plurality of dipole antennas DA1 to DA14. RFIC1400 can be referred to as a Radio Frequency Integrated Chip (RFIC).

[0233] The number of elements of the second array antenna 1300 forming a beam pattern toward the front region may be set to be greater than the number of elements of the third array antenna 1200 forming a beam pattern toward the lower region. The number of elements of the third array antenna 1200 forming a beam pattern toward the lower region may be set to be greater than the number of first array antennas 1100a and fourth array antennas 1100b forming beam patterns toward a plurality of side regions.

[0234] In this regard, 12 of the 32 pins of the RFIC 1400 may be connected to the third array antenna 1200 that forms a beam pattern toward the lower region. 14 of the 32 pins of the RFIC 1400 may be connected to the second array antenna 1300 that forms a beam pattern toward the front region. 6 of the 32 pins of the RFIC 1400 may be connected to the first array antenna 1100a and the fourth array antenna 1100b that form beam patterns toward a plurality of side regions.

[0235] In this regard, since the second array antenna 1300 has the largest number of elements, it is capable of transmitting signals over a long distance to the front area of ​​the electronic device, but has a narrower beam coverage. The beam direction can be changed by beamforming in the horizontal direction of the front area to compensate for the narrower beam coverage. The number of elements of the second array antenna 1300 can be implemented as a plurality of elements along the Y-axis direction and can be implemented as one element along the Z-axis direction. For example, the second array antenna 1300 can be implemented as a 1x14 array antenna.

[0236] The electronic device needs to perform wireless communication with another electronic device configured in the lower area. For wireless communication, beamforming can be implemented in the lower area of ​​the electronic device in a horizontal direction as the Y-axis direction with narrow beam coverage as a unit. On the other hand, the lower area of ​​the electronic device does not need to transmit signals at a longer distance than the front area. The number of elements of the third array antenna 1200 can be implemented as a plurality along one axis and can be implemented as one along another axis. For example, the third array antenna 1200 can be implemented as a 1x8 or 1x10 or 1x12 array antenna.

[0237] In an indoor propagation environment equipped with an electronic device, signals can also be transmitted to multiple side areas of the electronic device. For multiple side areas of the electronic device, it is more important to achieve wide beam coverage without beamforming than to transmit signals over long distances. In this regard, since the first array antenna 1100a and the fourth array antenna 1100b have the least number of elements, wide beam coverage can be provided to multiple side areas of the electronic device. Thus, the number of elements of the first array antenna 1100a and the fourth array antenna 1100b can be implemented as a plurality of elements along one axis, and can be implemented as one element along another axis. For example, the first array antenna 1100a and the fourth array antenna 1100b can be implemented as a 1x3 array antenna on one side and the other side.

[0238] On the other hand, the present specification describes the configuration structure of each layer of the antenna module. Fig.17a Yes Fig.16 The third array antenna of the antenna module is shown in a front view in layers. In this regard, Fig.11a and Fig.17a Yes Fig.16 The antenna module is shown in a front view by layer. Fig.17b It is shown Fig.16 Figure 1. The first and seventh layers of the antenna module.

[0239] Reference Figure 15 to Figure 17b , the various layers of the antenna module 1000 are described in detail. In this regard, the detailed description of the first layer La1 to the seventh layer La7 of the antenna module has been Fig.11a Therefore, repeated description is omitted.

[0240] Reference Figure 15 to Figure 17b , the third array antenna 1200 of the antenna module 1000 is described by layer. The eighth layer La8 is formed with a metal layer, which can be configured as a fourth ground layer GND4. The plurality of third feed lines of the seventh layer La7 are arranged between the ground layer of the sixth layer La6 and the ground layer of the eighth layer La8. Thus, the plurality of third feed lines of the seventh layer La7 are formed into a third coplanar waveguide structure in which a ground layer is formed in the upper layer and the lower layer in the height direction. The plurality of metal layers provided in the ground layer of the sixth layer La6 and the ground layer of the eighth layer La8 can be partially removed so that the second via and the third via can be vertically connected.

[0241] As mentioned above, the second layer La2, the fourth layer La4, the sixth layer La6, and the eighth layer La8 can respectively constitute the first ground layer GND1 to the fourth ground layer GND4. The ground layers are electrically connected by using a plurality of connecting vias connecting a plurality of ground layers. The substrate 1010 may include the first ground layer GND1 of the transceiver circuit 1400 to the fourth ground layer GND4 of the third array antenna 1200. The first array antenna 1100a and the second array antenna 1100b can be configured as antennas and signal lines in a layer between the first ground layer GND1 and the second ground layer GND2.

[0242] The third array antenna 1200 can be configured as an antenna and a signal line on the upper layer of the fourth ground layer GND4. The second array antenna 1300 can be configured as an antenna and a signal line between the metal layer as the ground layer of the fourth layer La4 and the metal layer as the ground layer of the sixth layer La6. Thus, the first array antenna 1100a, the fourth array antenna 1100b, the third array antenna 1200, and the second array antenna 1300 can isolate the respective signal lines from each other through the second ground layer GND2 to the fourth ground layer GND4. Therefore, the mutual interference generated between the respective signal lines of the plurality of array antennas isolated from each other by the second ground layer GND2 to the fourth ground layer GND4 will be reduced.

[0243] The lengths of the plurality of feed lines from RFIC1400 to the third array antenna 1200 can be configured to be the same for all antenna elements. The lengths of the plurality of feed lines of the third array antenna 1200 can be determined as the sum of the first length L1a to the fourth length L4a. For all second patch antennas CP1 to CP12 of the third array antenna 1200, the lengths of the plurality of feed lines can be the same. For all second patch antennas CP1 to CP12, the first length L1a to the fourth length L4a can be the same, respectively. Thus, the plurality of signals applied from RFIC1400 to all second patch antennas CP1 to CP12 become in phase, so that a beam can be formed toward the center.

[0244] The third vias Vc1 to Vc12 are formed to be vertically connected from the first layer La1 to the seventh layer La7. A grounding area composed of a metal layer and an array antenna configuration area 1010r as a first dielectric area from which the metal layer is removed may be formed in the eighth layer La8 to the twelfth layer La12. A plurality of coupling patches CP1 to CP12 connected to the ends of the third vias Vc1 to Vc12 may be configured in the tenth layer La10. The plurality of coupling patches CP1 to CP12 may be referred to as a feed plate.

[0245] A plurality of grounding regions formed of metal layers formed on the first layer La1 to the twelfth layer La12 are connected by a plurality of vias. A plurality of coupling patches CP1 to CP12 of the third array antenna may be disposed on the tenth layer La10.

[0246] A portion of the metal layer forming the ground wall GW may be disposed on the eleventh layer La11. A second dielectric region 1010d1 and a third dielectric region 1010d2 may be formed in the upper and lower regions of the eleventh layer La11, where the metal layer for grounding is removed. A plurality of dummy patterns DP1 and DP2 may be disposed inside the second dielectric region 1010d1 and the third dielectric region 1010d2.

[0247] A grounding region composed of a metal layer and a second dielectric region 1010d1 and a third dielectric region 1010d2 as the removed metal layer may also be formed in the tenth layer La10 to the twelfth layer La12. The second dielectric region 1010d1 and the third dielectric region 1010d2 may correspond to the first virtual array pattern region 1010d1 and the second virtual array pattern region 1010d2.

[0248] The twelfth layer La12 may be provided with a plurality of first patch antennas PA1 to PA12 of the third array antenna 1200. Adjacent antennas among the plurality of first patch antennas PA1 to PA12 may be arranged at equal intervals from each other. The centers of the plurality of second patch antennas CP1 to CP12 may be arranged offset along the X-axis direction, which is the vertical axis direction, relative to the centers of the plurality of first patch antennas PA1 to PA12.

[0249] Hereinafter, the patch antenna configuration structure of the antenna module 1000 implemented by the multi-layered antenna package of the present specification will be described with reference to the accompanying drawings. Fig.18a It is shown that the stacked Fig.16 FIG. 10 and 12 of the plurality of patch antennas of the antenna module. Fig.18b It is shown that the configuration is Fig.16 A diagram of an overlapping configuration structure of multiple patch antennas in an array antenna configuration area of ​​an antenna module.

[0250] Reference Fig.18a , the distance between each of the plurality of first patch antennas PA1 to PA12 may be formed identically at the third interval G3. The distance between each of the plurality of second patch antennas CP1 to CP12 may be formed identically at the third interval G3 on the X-axis. On the other hand, the distance between each of the plurality of second patch antennas CP1 to CP12 may be separated by the first interval G1 on the X-axis. The length of the first interval G1 may be smaller than the length of the third interval G3.

[0251] Reference Fig.18b , the first patch antenna 1220 can be arranged on the first horizontal axis Hy1 corresponding to the center of the array antenna configuration area 1010r. The centers of the plurality of patch antennas of the first group among the plurality of second patch antennas 1210 can be aligned along the second horizontal axis Hy2 direction and arranged in the first region RG1. The second horizontal axis Hy2 can be spaced apart from the first horizontal axis Hy1 in parallel with a prescribed interval and arranged in the first region RG1. The centers of the plurality of patch antennas of the second group among the plurality of second patch antennas 1210 can be aligned along the third horizontal axis Hy3 direction and arranged in the second region RG2. The third horizontal axis Hy3 can be spaced apart from the first horizontal axis Hy1 in parallel with a prescribed interval and arranged in the second region RG2.

[0252] The first patch antenna 1220 may be composed of a circular patch antenna having a first diameter R1. The second patch antenna 1210 may be composed of a circular patch antenna having a second diameter R2 that is smaller than the first diameter R1. The first patch antenna 1220 and the second patch antenna 1210 may be configured to have an overlapping region Ro having an arc region in the vertical axis direction. The overlapping region Ro between the first patch antenna 1220 and the second patch antenna 1210 belonging to the first group may be configured in the first region RG1. The overlapping region Ro between the first patch antenna 1220 and the second patch antenna 1210 belonging to the second group may be configured in the second region RG2. The length of the overlapping region Ro between the first patch antenna 1210 and the second patch antenna 1220 may be less than the radius R2 of the second patch antenna 1210.

[0253] When the offset portion of the second patch antenna 1210, such as the upper / lower portion, is connected to the connection regions CR2 and CR3 through the feed via, the polarization of the electromagnetic wave radiated from the second patch antenna 1210 is formed in the up-down direction. The connection regions CR2 and CR3 are formed at a portion (offset point) offset by a predetermined distance from the center point of the second patch antenna 1210.

[0254] The current distribution in the region adjacent to the connection regions CR2 and CR3 is higher than the current distribution in the peripheral region. The mode formed by the second patch antenna 1210 that forms the current distribution in the vertical direction as described above is the TE11 mode.

[0255] The connection regions CR2 and CR3 may be formed in the second patch antenna 1210 in a direction away from the center of the second patch antenna 1210 in the X-axis direction. Therefore, a dominant current distribution is formed in the up-down direction in the current generated by the second patch antenna 1210. Therefore, the antenna element including the first patch antenna 1210 and the second patch antenna 1220 will operate like the TE11 mode. Thus, the antenna gain performance is improved by increasing the main polarization (co-polarization) radiation performance in the up-down direction instead of the cross-polarization (cross-polarization) component in the left-right direction.

[0256] Through the TE11 mode, the current components in the left and right directions are attenuated and substantially eliminated. As a result, the main polarization radiation corresponding to the vertical polarization increases, thereby improving the antenna gain. In addition, the cross-polarization component is reduced, and it can be expected that the data throughput performance will be improved due to the improvement of MIMO performance.

[0257] Hereinafter, an antenna module implemented by a multi-layer package according to one aspect of the present specification will be described. The multi-layer package has a plurality of array antennas formed into a plurality of coplanar waveguide structures. Figures 4 to 18b , an antenna module implemented by a multi-layer package formed into a plurality of coplanar waveguide structures is described.

[0258] The antenna module 1000 may include a PCB 1010, an RFIC 1400, a first array antenna 1100a, a second array antenna 1300, and a third array antenna 1200. The antenna module 1000 may further include a first coplanar waveguide WG1, a second coplanar waveguide WG2, and a third coplanar waveguide WG3.

[0259] PCB1010 may include a plurality of layers. RFIC1400 is disposed on a first surface S1 in the outermost surface of PCB1010. The first array antenna 1100a is disposed on a second surface S2 perpendicular to the first surface S1 in the outermost surface of PCB1010. The second array antenna 1300 is disposed on a third surface S3 perpendicular to the first surface S1 and the second surface S2 in the outermost surface of PCB1010. The third array antenna 1200 is disposed on a fourth surface S4 perpendicular to the second surface S2 and the third surface S3 in the outermost surface of PCB1010.

[0260] The first surface S1 and the fourth surface S4 form surfaces facing each other. The second surface S2 and the third surface S3 are formed between the first surface S1 and the fourth surface S4. The plurality of layers have a plurality of layers formed with a plurality of ground layers and a plurality of coplanar waveguides. The plurality of layers can be configured in a form stacked from the first layer La1 to the twelfth layer La12. The first surface S1 forms one surface of the first layer La1 among the plurality of layers. A second layer La2 forming the first ground layer GND1 among the plurality of ground layers is formed on the opposite surface of the first surface S1 of the first layer La1.

[0261] The third layer La3 stacked on the second layer La2 has a first coplanar waveguide WG1. The first coplanar waveguide WG1 has first signal lines Fa1 to Fa3 and a first ground area GP1. The first signal lines Fa1 to Fa3 and the first ground area GP1 may be electrically connected to the first array antenna 1100a.

[0262] The fourth layer La4 stacked on the third layer La3 forms a second ground layer GND2. The fifth layer La5 stacked on the fourth layer La4 has a second coplanar waveguide WG2. The second coplanar waveguide WG2 has second signal lines Fb1 to Fb3 and a second ground region GP2. The second signal lines Fb1 to Fb14 and the second ground region GP2 can be electrically connected to the second array antenna 1300.

[0263] The sixth layer La6 stacked on the fifth layer La5 forms a third ground layer GDN3. The seventh layer La7 stacked on the sixth layer La6 has a third coplanar waveguide tube WG3. The third coplanar waveguide tube WG3 has third signal lines Fc1 to Fc12 and a third ground area GP3. The third signal lines Fc1 to Fc12 and the third ground area GP3 can be electrically connected to the third array antenna 1200. Therefore, the first coplanar waveguide tube WG1, the second coplanar waveguide tube WG2, and the third coplanar waveguide tube WG3 can be isolated by a plurality of ground layers GND1, GND2, and GND3, so that mutual interference can be minimized.

[0264] A plurality of fourth ground layers GND4 and a plurality of non-metal regions formed in the inner regions of the plurality of fourth ground layers GND4 are formed in the eighth layer La8 to the twelfth layer La12 stacked on the seventh layer La7. The third array antenna 1200 is formed in the non-metal region of the twelfth layer La12.

[0265] On the other hand, the second surface S2 in the outermost surface of the PCB 1010 may include a first array antenna configuration area 1010r1 and an area formed by respective ground layers configured in a plurality of layers to form a first ground wall 1151. Therefore, the first ground wall 1151 may act as a reflector for the first array antenna 1100a. Thus, interference between the first array antenna 1100a and other array antennas may be reduced.

[0266] A plurality of first connection lines CL1 may be formed to electrically connect the first array antenna 1100a and the RFIC1400. The plurality of first connection lines CL1 may be composed of a plurality of first horizontal lines HL1 formed in the first layer La1, a plurality of first vertical lines VL1 vertically connected from the first layer La1 to the third layer La3, and a plurality of first coplanar waveguide tubes WG1 formed in the third layer La3. The plurality of first horizontal lines HL1 form a first identical length, and the lengths of the plurality of first coplanar waveguide tubes WG1 form a second identical length, so that the plurality of first connection lines CL1 may form the same length. Therefore, the respective elements from the RFIC1400 to the first array antenna 1100a may form the same length. Thus, the phase of the wireless signal applied to the first array antenna 1100a may be uniformly controlled.

[0267] On the other hand, the antenna module 1000 implemented by the multi-layer package of the present specification may also include a fourth array antenna 1100b. The fourth array antenna 1100b may be arranged on a fifth surface S5 perpendicular to the third surface S3 and the fourth surface S4 in the outermost surface of the PCB 1010. The second surface S2 and the fifth surface S5 form surfaces facing each other.

[0268] The antenna module 1000 implemented by the multi-layer package in the present specification may be formed with a plurality of ground walls to reduce interference between array antennas. In this regard, the third surface S3 in the outermost surface of the PCB 1010 may include a second array antenna configuration area 1010r2 and an area where the second ground wall 1152 is formed by each ground layer configured in a plurality of layers. Therefore, the second ground wall 1152 can act as a reflector for the second array antenna 1300. As a result, the interference between the second array antenna 1300 and other array antennas can be reduced.

[0269] A plurality of second connection lines CL2 may be formed to electrically connect the second array antenna 1300 and the RFIC1400. The plurality of second connection lines CL2 may be composed of a plurality of second horizontal lines HL2 formed in the first layer La1, a plurality of second vertical lines VL2 vertically connected from the first layer La1 to the fifth layer La5, and a plurality of second coplanar waveguide tubes WG2 formed in the fifth layer La5. The plurality of second vertical lines VL2 form a third identical length, and the lengths of the plurality of second coplanar waveguide tubes WG2 form a fourth identical length. Therefore, the plurality of second connection lines CL2 may form the same length. Therefore, the respective elements from the RFIC1400 to the second array antenna 1300 may form the same length. Thus, the phase of the wireless signal applied to the second array antenna 1300 may be controlled in the same manner.

[0270] The plurality of second coplanar waveguide tubes WG2 may be formed in an even number and may form a left-right symmetrical structure with respect to the X-axis. In order to make each element from RFIC1400 to the second array antenna 1300 have the same length, the plurality of second coplanar waveguide tubes WG2 may be formed in an even number and may form a left-right symmetrical structure with respect to the X-axis.

[0271] The second array antenna 1300 may include 14 antenna elements. The plurality of second coplanar waveguides WG2 may include a first waveguide to a fourteenth waveguide. The first waveguide may include a first line Fb1 of a plurality of second signal lines and a plurality of ground patterns GL, GR arranged on both sides. The fourteenth waveguide may include a fourteenth line Fb14 of a plurality of second signal lines and a plurality of ground patterns arranged on both sides.

[0272] The four pins configured in the first area Sd1 of RFIC1400 and the first antenna element DA1 to the fourth antenna element DA4 of the second array antenna 1300 can be electrically connected through the first waveguide to the fourth waveguide in the plurality of second coplanar waveguides WG2. The four pins configured in the second area Sd2 of RFIC1400 and the fifth antenna element DA5, the sixth antenna element DA6, the ninth antenna element DA9, and the tenth antenna element DA10 of the second array antenna 1300 can be electrically connected through the fifth waveguide, the sixth waveguide, the ninth waveguide, and the tenth waveguide in the plurality of second coplanar waveguides WG2. The four pins configured in the third area Sd3 of RFIC1400 and the eleventh antenna element DA11 to the fourteenth antenna element DA14 of the second array antenna 1300 can be electrically connected through the eleventh waveguide to the fourteenth waveguide in the plurality of second coplanar waveguides WG2. The two pins arranged in the fourth region Sd4 of the RFIC 1400 and the seventh antenna element DA7 and the eighth antenna element DA8 of the second array antenna 1300 may be electrically connected via the seventh waveguide and the eighth waveguide in the plurality of second coplanar waveguides WG2 .

[0273] The first area Sd1 and the third area Sd3 of RFIC1400 can be arranged at positions opposite to each other. The second area Sd2 and the fourth area Sd4 of RFIC1400 can be arranged at positions opposite to each other. The two pins of the fourth area Sd4 of RFIC1400 and the seventh antenna element and the eighth antenna element of the second array antenna 1300 can form the shortest distance. The plurality of second coplanar waveguide tubes WG2 can form a left-right symmetrical structure based on the central axis of the seventh antenna element and the eighth antenna element of the second array antenna 1300. The plurality of second coplanar waveguide tubes WG2 can be formed along the X-axis direction, and the plurality of first coplanar waveguide tubes can be formed along the Y-axis direction. Therefore, the first coplanar waveguide tube WG1 and the second coplanar waveguide tube WG2 can be arranged in a vertical position while being isolated by a plurality of ground layers. As a result, the ends of the first signal line and the second signal line constituting the first coplanar waveguide tube WG1 and the second coplanar waveguide tube WG2 are arranged vertically, so that the mutual interference between the plurality of orthogonal signals can be minimized.

[0274] The third array antenna 1200 configured on the fourth surface S4 in the outermost surface of PCB1010 may include a plurality of antenna elements. Each of the plurality of antenna elements may be composed of two patch antenna structures. The first patch antenna 1220 of the two patch antennas may be configured on the fourth surface of PCB1010. The second patch antenna 1210 of the two patch antennas may be configured to be separated from the first patch antenna 1220 and may be configured in one of the plurality of layers inside PCB1010. A portion of the first patch antenna 1220 and a portion of the second patch antenna 1210 may be stacked to overlap each other.

[0275] The fourth surface S4 in the outermost surface of PCB1010 may be formed as a metal layer connected to the ground. The inner area of ​​the metal layer may be formed as a non-metal area in which the first patch antenna 1220 is configured. The non-metal area of ​​PCB1010 may form a first inner space VR1. The first inner space VR1 may be formed as the same area as the non-metal area of ​​PCB1010. The first vertical area from the outermost surface of PCB1010 to the ground layer formed on the upper part of the inner layer in which a plurality of third coplanar waveguides WG3 are configured inside PCB1010 may form the first inner space VR1 formed of a dielectric material.

[0276] The second patch antenna 1210 may be disposed on the tenth layer of the first internal space VR1. The outer peripheral surface of the first internal space VR1 may form a plurality of third ground walls GV1 and GV2 of each layer connected by a plurality of vias. Therefore, the plurality of third ground walls GV1 and GV2 may act as a reflector for the third array antenna 1200. Thus, the interference between the third array antenna 1200 and other array antennas can be reduced.

[0277] On the other hand, a plurality of third connection lines may be formed to electrically connect the third array antenna 1200 and the RFIC 1400. The plurality of third connection lines CL3 may include a plurality of third horizontal lines SL1, a plurality of third vertical lines SL2, a plurality of third coplanar waveguide tubes WG3, and a plurality of fourth vertical lines SL4. A plurality of third horizontal lines SL1 may be formed in the first layer La1. A plurality of third vertical lines SL2 may vertically connect the seventh layer La7 from the first layer La1. A plurality of third coplanar waveguide tubes WG3 may be formed in the seventh layer La7. A plurality of fourth vertical lines SL4 may vertically connect the plurality of third coplanar waveguide tubes WG3 and the plurality of second patch antennas 1210.

[0278] The first length R1 as the radius of the first patch antenna 1220 may be greater than the second length R2 as the radius of the second patch antenna. The center of the second patch antenna 1210, the center of the first patch antenna 1220, and the feeding regions CR2 and CR3 of the second patch antenna 1210 connected to the fourth vertical line may be arranged on a straight line.

[0279] The plurality of third vertical lines SL2 form a fifth equal length, the lengths of the plurality of second coplanar waveguides WG2 form a sixth equal length, and the plurality of fourth vertical lines SL4 form a seventh equal length. Therefore, the plurality of third connecting lines CL3 can form the same length. Therefore, the respective elements from RFIC1400 to the third array antenna 1200 can form the same length. Thus, the phase of the wireless signal applied to the third array antenna 1200 can be controlled in the same manner.

[0280] The plurality of third horizontal lines SL1 formed in the first layer La1 may form a plurality of signal connection lines. A first group of the plurality of third horizontal lines SL1 among the plurality of signal connection lines electrically connected to the plurality of second patch antennas 1210 may be arranged in the first region RG1 with the first horizontal axis as a reference. A second group of the plurality of third horizontal lines SL1 among the plurality of signal connection lines electrically connected to the plurality of second patch antennas 1210 may be arranged in the second region RG2 with the first horizontal axis as a reference.

[0281] The plurality of third coplanar waveguide tubes WG3 formed in the seventh layer La7 may form a plurality of signal connection lines. A first group of the plurality of third coplanar waveguide tubes WG3 electrically connected to the plurality of second patch antennas 1210 among the plurality of signal connection lines may be arranged in the first region RG1 with the first horizontal axis as a reference. A second group of the plurality of third coplanar waveguide tubes WG3 electrically connected to the plurality of second patch antennas 1210 among the plurality of signal connection lines may be arranged in the second region RG2 with the first horizontal axis as a reference.

[0282] The plurality of third coplanar waveguide tubes WG3 may be formed in an even number and may form a left-right symmetrical structure with respect to the X-axis. In order to make each element from RFIC1400 to the third array antenna 1200 have the same length, the plurality of third coplanar waveguide tubes WG3 may be formed in an even number and may form a left-right symmetrical structure with respect to the X-axis.

[0283] The third array antenna 1200 may include 12 antenna elements. The plurality of third coplanar waveguides WG3 may include a first waveguide to a twelfth waveguide. The first waveguide may include a first line Fc1 of a plurality of third signal lines and a plurality of ground patterns GL, GR arranged on both sides. The twelfth waveguide may include a twelfth line Fc12 of a plurality of third signal lines and a plurality of ground patterns arranged on both sides.

[0284] The six pins arranged in the second area Sd2 of RFIC1400 and the second antenna element, the fourth antenna element, the sixth antenna element, the seventh antenna element, the ninth antenna element, and the eleventh antenna element of the third array antenna 1200 can be electrically connected through the second waveguide, the fourth waveguide, the sixth waveguide, the seventh waveguide, the ninth waveguide, and the eleventh waveguide arranged in the first area RG1 among the plurality of third coplanar waveguides WG3. The six pins arranged in the fourth area Sd4 of RFIC1400 and the first antenna element, the third antenna element, the fifth antenna element, the eighth antenna element, the tenth antenna element, and the twelfth antenna element of the third array antenna 1200 can be electrically connected through the first waveguide, the third waveguide, the fifth waveguide, the eighth waveguide, the tenth waveguide, and the twelfth waveguide arranged in the second area RG2 among the plurality of third coplanar waveguides WG3.

[0285] The plurality of third coplanar waveguides WG3 arranged in the first region RG1 and the plurality of third coplanar waveguides WG3 arranged in the second region RG2 can form an asymmetric structure with respect to the Y axis. The plurality of third coplanar waveguides WG3 arranged in the first region RG1 can form a left-right symmetric structure with respect to the X axis. The plurality of third coplanar waveguides WG3 arranged in the second region can form a left-right symmetric structure with respect to the X axis.

[0286] The above describes an antenna module implemented by a multilayer package formed into a plurality of coplanar waveguide structures in one aspect of the present specification. The following describes an electronic device having a communication module implemented by a multilayer package formed into a plurality of coplanar waveguide structures in another aspect of the present specification.

[0287] In this regard, see Figures 1 to 18b , an electronic device having a communication module implemented by a multi-layer package formed into a plurality of coplanar waveguide structures is described. The electronic device 200 may include a display panel 260, a communication module, and a control unit. The RF receiving module 240 and the processor 290 of the electronic device 200 may correspond to the communication module 240 and the control unit 290, respectively.

[0288] Communication module 240 may receive signals regarding images and information from an external device in a wireless manner. Control unit 290 may convert the signals received from communication module 240 and provide them to display panel 260. Communication module 240 may include transceiver circuit 1400, first antenna resonant element 1100a, second antenna resonant element 1300, and third antenna resonant element 1200.

[0289] The communication module 240 may correspond to the antenna module 1000. The communication module 240 (or the antenna module 1000) of the electronic device 200 may further include a first coplanar waveguide WG1, a second coplanar waveguide WG2, and a third coplanar waveguide WG3.

[0290] First coplanar waveguide WG1 may communicate a plurality of signals at frequencies between 10 GHz and 300 GHz between transceiver circuit 1400 and first antenna resonating element 1100a. Second coplanar waveguide WG2 may communicate a plurality of signals at frequencies between 10 GHz and 300 GHz between transceiver circuit 1400 and second antenna resonating element 1300. Third coplanar waveguide WG3 may communicate a plurality of signals at frequencies between 10 GHz and 300 GHz between transceiver circuit 1400 and third antenna resonating element 1200.

[0291] First coplanar waveguide WG1 may be interposed between second coplanar waveguide WG2 and transceiver circuit 1400. Second coplanar waveguide WG2 may be interposed between first coplanar waveguide WG1 and third coplanar waveguide WG3. Third coplanar waveguide WG3 may be interposed between second coplanar waveguide WG2 and third antenna resonant element 1200. Third antenna resonant element 1200 may be disposed on the opposite side to transceiver circuit 1400.

[0292] On the other hand, control unit 290 may select a particular plurality of antenna resonating elements based on a measurement of the strength of a signal received from an external device. In this regard, control unit 290 may measure the signal strength when first antenna resonating element 1100a, second antenna resonating element 1300, and third antenna resonating element 1200 receive a signal received from an external device. Control unit 290 may control to select a plurality of antenna resonating elements with the greatest signal strength to receive the signal.

[0293] On the other hand, control unit 290 may use more than two antenna structures (modules) to select a specific plurality of antenna resonant elements. Fig.19 1 is a flowchart showing the operation of the communication device of this specification and the electronic device for transmitting and receiving wireless signals. Fig.19 , a method for the electronic device 200 of this specification to receive or send wireless signals through a plurality of array antennas of a first antenna structure and a second antenna structure is described.

[0294] Reference Figures 1 to 19, the method of changing or restoring the A / V signal transceiver beam of this specification is described. When the power of the communication device 100 and the electronic device 200 is turned on (S11), the electronic device 200 can identify the device ID of the communication device 100 (S12). The electronic device 200 can perform settings for wireless communication with the communication device 100 based on the device ID. The electronic device 200 can search for the configuration position and rotation state of the identified communication device 100 (S13).

[0295] The electronic device 200 may search for the front area, the lower area, the one side area, and the other side area of ​​the electronic device 200 in which the communication device 100 is configured. In this regard, the electronic device 200 may determine whether the communication device 100 is configured in the lower area of ​​the electronic device 200 (S14). The electronic device 200 may determine whether the communication device 100 is configured in the front area or one of the two side areas of the electronic device 200 (S16).

[0296] If the communication device 100 is arranged in the lower area of ​​the electronic device 200, it can be determined whether the communication device 100 operates in a horizontal polarization mode according to the rotation state of the communication device 100 (S15). In this regard, if the communication device 100 is arranged within a specified angle range based on 0 degrees, it can be determined that it operates in a horizontal polarization mode. If the communication device 100 is arranged within a specified angle range based on 90 degrees, it can be determined that it operates in a vertical polarization mode.

[0297] If the communication device 100 is configured in the prescribed range of 0 degrees and operates in a horizontal polarization mode, the 1T1R operation can be performed by the horizontally polarized antennas in the first antenna structure 1000a and the second antenna structure 1000b (S21). In this regard, the 1T1R operation can be performed by the third array antenna 1200 of the first antenna structure 1000a operating with the horizontally polarized antenna (S21).

[0298] If the communication device 100 operates in a vertical polarization mode within a specified range of 90 degrees, 1T1R operation (S22) can be performed by the vertically polarized antenna in the first antenna structure 1000a and the second antenna structure 1000b. In this regard, 1T1R operation (S22) can be performed by the third array antenna 1200 of the second antenna structure 1000b that utilizes the vertically polarized antenna operation. Therefore, the communication device 100 and the electronic device 200 can perform 1T1R operation through either the first antenna structure 1000a or the second antenna structure 1000b. On the other hand, if the communication device 100 operates in a slant polarization mode within a specified range of 45 degrees, 1T2R operation (S23) can also be performed by the first antenna structure 1000a and the second antenna structure 1000b.

[0299] If the communication device 100 is disposed on the front side or one of the two side sides of the electronic device 200 (S16), a diversity operation (S23) can be performed by the first antenna structure 1000a and the second antenna structure 1000b. Thus, a diversity operation of sending or receiving a plurality of identical polarized signals can be performed by the first antenna structure 1000a and the second antenna structure 1000b.

[0300] In summary, if the communication device 100 is not configured in the front area or one of the two side surfaces of the electronic device 200, the 1T1R action (S21, S22) can be performed through any one of the first antenna structure 1000a and the second antenna structure 1000b. If the communication device 100 is configured in the front area or one of the two side surfaces of the electronic device 200, the 1T2R action (S23) can be performed through the first antenna structure 1000a and the second antenna structure 1000b. Therefore, the communication device 100 and the electronic device 200 can perform the 1T2R action through the first antenna structure 1000a and the second antenna structure 1000b.

[0301] On the other hand, the electronic device of the present specification can appropriately select a plurality of array antennas of the first antenna structure and the second antenna structure based on the location of the communication device, and receive the A / V signal through optimal beamforming. In this regard, Fig. 20 A flowchart of a method for an electronic device of this specification to select, change, or restore a wireless beamforming signal for transmitting or receiving an A / V signal is shown. Fig. 20 After selecting / changing the operation mode of multiple array antennas, you can execute Fig.19 beam selection or change or recovery process, but not limited to this.

[0302] Reference Figures 1 to 20 , a method for an electronic device to select, change, or restore a wireless beamforming signal for transmitting and receiving an A / V signal is described. The processor 290 can retrieve a beam that can be formed between the communication device 100 and the electronic device 200 (S111). The processor 290 can obtain all beams that can be formed between the communication device 100 and the electronic device 200 as a search result. On the other hand, all beams may include a pair of beams consisting of a transmission beam for transmitting an A / V signal at the communication device 100 and a reception beam for receiving an A / V signal at the electronic device 200.

[0303] In addition, the processor 290 may obtain an effective beam among the beams 300 that are retrieved as being capable of being formed between the communication device 100 and the electronic device 200 (S112). The effective beam may be at least one beam that is actually selected for transceiving the A / V signal among all the beams retrieved by the processor 290. Alternatively, the effective beam may be at least one beam that is capable of transceiving the A / V signal at a minimum transmission speed or higher among the beams 300 that are capable of being formed between the communication device 100 and the electronic device 200.

[0304] In addition, the processor 290 may acquire a beam angle based on a beam ID (S113). The beam ID may be an ID for identifying each of the beams 300 formed in the communication device 100 and the electronic device 200. The beam angle may include a beam reception angle as an angle on the electronic device 200 side and a beam transmission angle as an angle on the communication device 100 side. The beam reception angle and the beam transmission angle may be angles measured with reference to a LOS path formed between the communication device 100 and the electronic device 200.

[0305] In addition, the processor 290 may obtain whether at least one effective beam is formed within the sensing range of the sensor (not shown) (S121). The sensor (not shown) may obtain at least a part or all of the position and speed of the object.

[0306] In addition, when the processor 290 obtains that an effective beam is formed within the sensing range of the sensor (not shown), a reference range may be set (S122). The reference range may be a range where an A / V signal transmission and reception failure is expected to occur during the object monitoring execution described later. The reference range may be a range that becomes a reference for the processor 290 to transmit a beam change instruction or a beam restoration instruction during the object monitoring execution described later.

[0307] In addition, the processor 290 may start object monitoring (S131). The object monitoring may be an action of monitoring at least a part or all of the position and speed of an object located between the communication device 100 and the electronic device 200.

[0308] On the other hand, the processor 290 may adjust the set reference range (S132). The processor 290 may adjust the reference range according to the object, or may not adjust the reference range. That is, according to an embodiment, step S132 may be an omissible step. The processor 290 may adjust the reference range set in step S122. For example, the processor 290 may obtain the speed of the object and adjust the reference range based on the speed of the object.

[0309] The electronic device 200 of an embodiment of the present specification can adjust the width of the reference range in real time in consideration of the speed of the object, thereby maximizing the transmission efficiency and minimizing the A / V signal transmission and reception errors by maximizing the time for transmitting the A / V signal with the main beam having a faster transmission speed. The processor 290 can obtain whether the object has entered the reference range (S133).

[0310] When the processor 290 determines that the object has not entered the reference range, the processor 290 may not transmit the beam change instruction and continue to determine whether the object has entered the reference range.

[0311] On the other hand, when the processor 290 obtains that the object has entered the reference range, a beam change instruction may be transmitted to the communication device 100 (S141). The beam change instruction may be an instruction for changing the beam for transmitting and receiving A / V signals. According to the beam change instruction, any beam in the effective beam may be changed to a beam for transmitting and receiving A / V signals. According to the beam change instruction, the beam selected for transmitting and receiving A / V signals may be a sub-beam.

[0312] In this regard, when an object enters the reference range and the wireless communication performance on the LOS path between the communication device 100 and the electronic device 200 is reduced, a wireless link may be set through another path. The electronic device 200 may set the wireless link so that the wireless signal transmitted from the communication device 100 is reflected by the ceiling or the wall.

[0313] On the other hand, the processor 290 may obtain whether the object deviates from the reference range (S142). The processor 290 may obtain whether the object deviates from the reference range after the beam is changed because the object enters the reference range.

[0314] If the processor 290 obtains that the object has not deviated from the reference range, it may not transmit the beam restoration instruction and continue to obtain whether the object has deviated from the reference range. On the other hand, if the processor 290 obtains that the object has deviated from the reference range, it may transmit the beam restoration instruction to the communication device 100 (S143).

[0315] As described above, electronic device 200 may select a specific array antenna composed of a specific plurality of antenna resonant elements in one or more antenna structures (modules) to receive wireless signals. In this regard, electronic device 200 may select a specific array antenna with a specific polarization to receive wireless signals.

[0316] In this regard, see Figures 4 to 19, a method for selecting a specific array antenna with a specific polarization to receive a wireless signal is described. The first array antenna 1100a and the second array antenna 1200 are composed of horizontally polarized antennas. The first antenna resonant element 1100a and the second antenna resonant element 1300 constitute the first array antenna 1100a and the second array antenna 1200. The signals received by the first array antenna 1100a and the second array antenna 1200 are signals received in a direction horizontal to the bottom surface of the display panel 260.

[0317] On the other hand, third array antenna 1200 may be composed of a horizontally polarized antenna or a vertically polarized antenna. A plurality of third antenna resonant elements 1200 constitute third array antenna 1200. When third array antenna 1200 is composed of a horizontally polarized antenna, the signal received by third array antenna 1200 is a signal received in a direction horizontal to the back surface of display panel 260. When third array antenna 1200 is composed of a vertically polarized antenna, the signal received by third array antenna 1200 is a signal received in a direction vertical to the back surface of display panel 260.

[0318] On the other hand, beam directions can be formed along different paths by configuring the second array antenna 1300 in the front direction of the electronic device 200. The beam direction of the signal received by the second array antenna 1300 may make it impossible to receive the received signal when receiving the received signal on the first path. The control unit 290 can be controlled to change the beam direction of the received signal received by the second array antenna 1300 to the second path. In this regard, the beam direction of the second array antenna 1300 can be changed to the horizontal axis direction. In addition, by configuring a plurality of second array antennas 1300 in the vertical axis direction, the beam direction of the second array antenna 1300 can also be changed to the vertical axis direction.

[0319] On the other hand, the communication module 240 of the electronic device 200 can be implemented by a PCB 1010 including a plurality of layers of a multi-layer packaging structure. The first surface S1 in the outermost surface of the PCB 1010 is provided with an RFIC 1400 as a transceiver circuit. The first array antenna 1100a is provided on a second surface S2 perpendicular to the first surface S1 in the outermost surface of the PCB 1010. The second array antenna 1300 is provided on a third surface S3 perpendicular to the first surface S1 and the second surface S2 in the outermost surface of the PCB 1010. The third array antenna 1200 is provided on a fourth surface S4 perpendicular to the second surface S2 and the third surface S3 in the outermost surface of the PCB 1010.

[0320] On the other hand, in the present specification, a plurality of grounding walls may be formed in the communication module 240 of the electronic device 200 to reduce interference between array antennas. The second surface S2 in the outermost surface of the PCB 1010 may include a first array antenna configuration area 1010r1 and an area where the first grounding wall 1151 is formed by each grounding layer configured in a plurality of layers. Therefore, the first grounding wall 1151 may act as a reflector for the first array antenna 1100a. Thus, the interference between the first array antenna 1100a and other array antennas can be reduced.

[0321] In this regard, the third surface S3 in the outermost surface of the PCB 1010 may include a second array antenna configuration area 1010r2 and an area where the second ground wall 1152 is formed by respective ground layers configured in a plurality of layers. Therefore, the second ground wall 1152 may act as a reflector for the second array antenna 1300. Thus, interference between the second array antenna 1300 and other array antennas may be reduced.

[0322] On the other hand, the communication module 240 of the electronic device 200 of the present specification may further include a fourth array antenna 1100b. The fourth array antenna 1100b may be disposed on a fifth surface S5 perpendicular to the third surface S3 and the fourth surface S4 in the outermost surface of the PCB 1010. The second surface S2 and the fifth surface S5 form surfaces facing each other.

[0323] On the other hand, the communication module 240 of the electronic device 200 of the present specification may be formed with a plurality of connection lines connecting the plurality of array antennas and the RFIC 1400. In this regard, a plurality of first connection lines CL1 may be formed to electrically connect the first array antenna 1100a and the RFIC 1400. The plurality of first connection lines CL1 may be composed of a plurality of first horizontal lines HL1 formed on the first layer La1, a plurality of first vertical lines VL1 vertically connecting the first layer La1 to the third layer La3, and a plurality of first coplanar waveguides WG1 formed on the third layer La3.

[0324] The plurality of first horizontal lines HL1 form a first uniform length, the lengths of the plurality of first coplanar waveguides WG1 form a second uniform length, and thus the plurality of first connecting lines CL1 can form a uniform length. Therefore, the respective elements from RFIC1400 to the first array antenna 1100a can form a uniform length. Thus, the phases of the wireless signals applied to the first array antenna 1100a can be uniformly controlled.

[0325] A plurality of second connection lines CL2 may be formed to electrically connect the second array antenna 1300 and the RFIC1400. The plurality of second connection lines CL2 may be composed of a plurality of second horizontal lines HL2 formed in the first layer La1, a plurality of second vertical lines VL2 vertically connected from the first layer La1 to the fifth layer La5, and a plurality of second coplanar waveguide tubes WG2 formed in the fifth layer La5. The plurality of second vertical lines VL2 form a third identical length, and the lengths of the plurality of second coplanar waveguide tubes WG2 form a fourth identical length. Therefore, the plurality of second connection lines CL2 may form the same length. Therefore, the respective elements from the RFIC1400 to the second array antenna 1300 may form the same length. Thus, the phase of the wireless signal applied to the second array antenna 1300 may be controlled in the same manner.

[0326] A plurality of third connection lines may be formed to electrically connect the third array antenna 1200 and the RFIC 1400. The plurality of third connection lines CL3 may include a plurality of third horizontal lines SL1, a plurality of third vertical lines SL2, a plurality of third coplanar waveguide tubes WG3, and a plurality of fourth vertical lines SL4. A plurality of third horizontal lines SL1 may be formed in the first layer La1. A plurality of third vertical lines SL2 may vertically connect the seventh layer La7 from the first layer La1. A plurality of third coplanar waveguide tubes WG3 may be formed in the seventh layer La7. A plurality of fourth vertical lines SL4 may vertically connect the plurality of third coplanar waveguide tubes WG3 and the plurality of second patch antennas 1210.

[0327] On the other hand, the second array antenna 1300 may include 14 antenna elements. The plurality of second coplanar waveguides WG2 may include the first waveguide to the fourteenth waveguide. The first waveguide may include the first line Fb1 of the plurality of second signal lines and the plurality of ground patterns GL, GR arranged on both sides. The fourteenth waveguide may include the fourteenth line Fb14 of the plurality of second signal lines and the plurality of ground patterns arranged on both sides.

[0328] The four pins configured in the first area Sd1 of RFIC1400 and the first antenna element DA1 to the fourth antenna element DA4 of the second array antenna 1300 can be electrically connected through the first waveguide to the fourth waveguide in the plurality of second coplanar waveguides WG2. The four pins configured in the second area Sd2 of RFIC1400 and the fifth antenna element DA5, the sixth antenna element DA6, the ninth antenna element DA9, and the tenth antenna element DA10 of the second array antenna 1300 can be electrically connected through the fifth waveguide, the sixth waveguide, the ninth waveguide, and the tenth waveguide in the plurality of second coplanar waveguides WG2. The four pins configured in the third area Sd3 of RFIC1400 and the eleventh antenna element DA11 to the fourteenth antenna element DA14 of the second array antenna 1300 can be electrically connected through the eleventh waveguide to the fourteenth waveguide in the plurality of second coplanar waveguides WG2. The two pins arranged in the fourth region Sd4 of the RFIC 1400 and the seventh antenna element DA7 and the eighth antenna element DA8 of the second array antenna 1300 may be electrically connected via the seventh waveguide and the eighth waveguide in the plurality of second coplanar waveguides WG2 .

[0329] The third array antenna 1200 configured on the fourth surface S4 in the outermost surface of PCB1010 may include a plurality of antenna elements. Each of the plurality of antenna elements may be composed of two patch antenna structures. The first patch antenna 1220 of the two patch antennas may be configured on the fourth surface of PCB1010. The second patch antenna 1210 of the two patch antennas may be configured to be separated from the first patch antenna 1220 and may be configured in one of the plurality of layers inside PCB1010. A portion of the first patch antenna 1220 and a portion of the second patch antenna 1210 may be stacked to overlap each other.

[0330] The fourth surface S4 in the outermost surface of PCB1010 may be formed as a metal layer connected to the ground. The inner area of ​​the metal layer may be formed as a non-metal area in which the first patch antenna 1220 is configured. The non-metal area of ​​PCB1010 may form a first inner space VR1. The first inner space VR1 may be formed as the same area as the non-metal area of ​​PCB1010. The first vertical area from the outermost surface of PCB1010 to the ground layer formed on the upper part of the inner layer in which a plurality of third coplanar waveguides WG3 are configured inside PCB1010 may form the first inner space VR1 formed of a dielectric material.

[0331] The second patch antenna 1210 may be disposed on the tenth layer of the first internal space VR1. The outer peripheral surface of the first internal space VR1 may form a plurality of third ground walls GV1 and GV2 of each layer connected by a plurality of vias. Therefore, the plurality of third ground walls GV1 and GV2 may act as a reflector for the third array antenna 1200. Thus, the interference between the third array antenna 1200 and other array antennas can be reduced.

[0332] On the other hand, the plurality of signal connection lines of the third array antenna 1200 of the communication module 240 of the electronic device 200 of the present specification can be implemented by a plurality of third coplanar waveguide tubes WG3. In this regard, the plurality of third coplanar waveguide tubes WG3 formed in the seventh layer La7 can form a plurality of signal connection lines. The first group of the plurality of third coplanar waveguide tubes WG3 electrically connected to the plurality of second patch antennas 1210 among the plurality of signal connection lines can be arranged in the first region RG1 with the first horizontal axis as the reference. The second group of the plurality of third coplanar waveguide tubes WG3 electrically connected to the plurality of second patch antennas 1210 among the plurality of signal connection lines can be arranged in the second region RG2 with the first horizontal axis Hy1 as the reference.

[0333] On the other hand, in the communication module 240 of the electronic device 200 of the present specification, the third array antenna 1200 may include 12 antenna elements. The six pins configured in the second area Sd2 of the RFIC1400 and the second antenna element, the fourth antenna element, the sixth antenna element, the seventh antenna element, the ninth antenna element, and the eleventh antenna element of the third array antenna 1200 may be electrically connected through the second waveguide, the fourth waveguide, the sixth waveguide, the seventh waveguide, the ninth waveguide, and the eleventh waveguide configured in the first area RG1 among the plurality of third coplanar waveguides WG3. The six pins configured in the fourth area Sd4 of the RFIC1400 and the first antenna element, the third antenna element, the fifth antenna element, the eighth antenna element, the tenth antenna element, and the twelfth antenna element of the third array antenna 1200 may be electrically connected through the first waveguide, the third waveguide, the fifth waveguide, the eighth waveguide, the tenth waveguide, and the twelfth waveguide configured in the second area RG2 among the plurality of third coplanar waveguides WG3.

[0334] The plurality of third coplanar waveguides WG3 arranged in the first region RG1 and the plurality of third coplanar waveguides WG3 arranged in the second region RG2 can form an asymmetric structure with respect to the Y axis. The plurality of third coplanar waveguides WG3 arranged in the first region RG1 can form a left-right symmetric structure with respect to the X axis. The plurality of third coplanar waveguides WG3 arranged in the second region can form a left-right symmetric structure with respect to the X axis.

[0335] The antenna module implemented by multi-layer packaging and the electronic device having the antenna module are described above. The technical effects of the antenna module implemented by multi-layer packaging and the electronic device having the antenna module of the present specification are as follows.

[0336] The present invention aims to provide a multi-layer circuit antenna package for millimeter wave band communication with a structure having a minimum number of stacked layers.

[0337] The present invention aims to provide a structure that minimizes the signal phase difference of each patch in a patch array antenna structure for millimeter wave band communication.

[0338] The present invention aims to provide an antenna module which is realized with a relatively low height and is capable of transmitting signals to a front area, a lower area, and a side area.

[0339] The present invention aims to provide a structure that minimizes signal interference between a plurality of array antennas.

[0340] The applicable additional scope of this specification can be made clear by the following detailed description. However, since a person of ordinary skill in the art can clearly understand the various changes and modifications within the concept and scope of this specification, it should be understood that the specific embodiments of the preferred embodiments described in detail and this specification are only examples. The detailed description should not be interpreted restrictively in all aspects, but should be considered as exemplary. The scope of the present invention should be determined by a reasonable interpretation of the attached claims, and all changes within the equivalent scope of the present invention fall within the scope of the present invention.

Claims

1. An antenna module, implemented by multi-layer packaging, wherein: The antenna module comprises: PCB, including multiple layers; RFIC, disposed on a first surface of the outermost surface of the PCB; A first array antenna is arranged on a second surface of the outermost surface of the PCB that is perpendicular to the first surface; A second array antenna is arranged on a third surface of the outermost surface of the PCB that is perpendicular to the first surface and the second surface; and A third array antenna is arranged on a fourth surface of the outermost surface of the PCB that is perpendicular to the second surface and the third surface; The first surface and the fourth surface form surfaces facing each other; The second surface and the third surface are formed between the first surface and the fourth surface; The plurality of layers include a layer formed with a plurality of ground layers and a plurality of coplanar waveguides; The plurality of layers are stacked from the first layer to the twelfth layer; The first surface forms a surface of a first layer of the plurality of layers; A second layer forming a first ground layer among the plurality of ground layers is formed on the opposite side of the first surface of the first layer; A third layer stacked on the second layer has a first coplanar waveguide; The first coplanar waveguide has a first signal line and a first grounding area; The first signal line and the first ground area are electrically connected to the first array antenna; A fourth layer stacked on the third layer forms a second ground layer; A fifth layer stacked on the fourth layer has a second coplanar waveguide; The second coplanar waveguide has a second signal line and a second ground area; The second signal line and the second ground area are electrically connected to the second array antenna; A sixth layer stacked on the fifth layer forms a third ground layer; The seventh layer stacked on the sixth layer has a third coplanar waveguide; The third coplanar waveguide has a third signal line and a third grounding area; The third signal line and the third grounding area are electrically connected to the third array antenna; A plurality of fourth grounding layers and a plurality of non-metallic regions formed in the inner regions of the plurality of fourth grounding layers are formed on the eighth to twelfth layers stacked on the seventh layer; The third array antenna is formed in the non-metal area of ​​the twelfth layer.

2. The antenna module according to claim 1, wherein: The second surface of the outermost surface of the PCB includes a first array antenna configuration area and an area where a first ground wall is formed by each ground layer configured in the plurality of layers.

3. The antenna module according to claim 1, wherein: A plurality of first connection lines are formed for electrically connecting the first array antenna and the RFIC; The plurality of first connecting lines are composed of a plurality of first horizontal lines formed on the first layer, a plurality of first vertical lines vertically connected from the first layer to the third layer, and a plurality of first coplanar waveguides formed on the third layer; A plurality of the first vertical lines form a first same length, and a plurality of the lengths of the first coplanar waveguide tubes form a second same length, so that a plurality of the first connecting lines form a same length.

4. The antenna module according to claim 1, wherein: Also included is a fourth array antenna disposed on a fifth surface perpendicular to the third surface and the fourth surface in the outermost surface of the PCB; The second surface and the fifth surface form surfaces facing each other.

5. The antenna module according to claim 1, wherein: The third surface of the outermost surface of the PCB includes a second array antenna configuration area and an area where a second ground wall is formed by each ground layer configured in the plurality of layers.

6. The antenna module according to claim 1, wherein: A plurality of second connection lines are formed for electrically connecting the second array antenna and the RFIC; The plurality of second connecting lines are composed of a plurality of second horizontal lines formed on the first layer, a plurality of second vertical lines vertically connected from the first layer to the fifth layer, and a plurality of second coplanar waveguides formed on the fifth layer.

7. The antenna module according to claim 6, wherein: A plurality of the second vertical lines form a third same length, and a plurality of the second coplanar waveguide tubes form a fourth same length, so that a plurality of the second connecting lines form the same length.

8. The antenna module according to claim 7, wherein: The plurality of second coplanar waveguides are formed in an even number and form a bilaterally symmetrical structure with respect to the X-axis.

9. The antenna module according to claim 8, wherein: The second array antenna includes 14 antenna elements; The four pins arranged in the first area of ​​the RFIC and the first antenna element to the fourth antenna element of the second array antenna are electrically connected through the first waveguide to the fourth waveguide in the plurality of the second coplanar waveguides respectively; The four pins arranged in the second area of ​​the RFIC and the fifth antenna element, the sixth antenna element, the ninth antenna element, and the tenth antenna element of the second array antenna are electrically connected through the fifth waveguide, the sixth waveguide, the ninth waveguide, and the tenth waveguide of the plurality of second coplanar waveguides, respectively; The four pins arranged in the third area of ​​the RFIC and the eleventh antenna element to the fourteenth antenna element of the second array antenna are electrically connected through the eleventh waveguide to the fourteenth waveguide in the plurality of the second coplanar waveguides respectively; The two pins arranged in the fourth area of ​​the RFIC and the seventh antenna element and the eighth antenna element of the second array antenna are electrically connected respectively through the seventh waveguide and the eighth waveguide of the plurality of second coplanar waveguides.

10. The antenna module according to claim 9, wherein: The first region and the third region of the RFIC are arranged at positions facing each other; The second region and the fourth region of the RFIC are arranged at positions facing each other; The two pins of the fourth area of ​​the RFIC form the shortest distance with the seventh antenna element and the eighth antenna element of the second array antenna; The plurality of second coplanar waveguides form a bilaterally symmetrical structure with respect to the central axes of the seventh antenna element and the eighth antenna element of the second array antenna.

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