Transceiving multi-beam network and antenna based on ultra-multi-layer mixed pressing PCB (Printed Circuit Board) process

Abstract

The invention relates to a transmitting-receiving multi-beam network and antenna based on an ultra-multilayer mixed pressing PCB technology. The transmitting-receiving multi-beam network comprises a microwave combining network layer, a dielectric substrate and a multi-beam chip layer. The microwave combining network layer and the multi-beam chip layer are sequentially arranged on the dielectric substrate; any one of the microwave combining network layers is connected with the multi-beam chip layer through a quasi-coaxial vertical via hole; capacitance and inductance branches are arranged on the periphery of the joint of the microwave combining network layer and the quasi-coaxial vertical via hole. Through the arrangement, a plurality of independent wave beams are supported, the phased array profile is effectively reduced, high inter-channel isolation is realized, space crosstalk is reduced, and good matching of the antenna is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of radar antennas, and in particular to a transceiver multi-beam network and antenna based on an ultra-multi-layer mixed-pressure PCB process. Background Art

[0002] Phased array antenna, also known as phase-controlled array antenna, is an antenna that adjusts its radiation pattern by precisely controlling the feeding phase of each radiating element in the array. In recent years, this technology has been widely used in many technical fields such as radar systems, communications, remote control and telemetry, and electronic countermeasures.

[0003] Traditional phased array antennas mostly use a brick-type multi-beam architecture and achieve high-density integration through micro-assembly technology, but the overall size and weight are large, the cost is high, and it is not conducive to large-scale rapid manufacturing.

[0004] The tile-type phased array antenna architecture has broad research prospects because its device circuit layout is parallel to the antenna surface, has low profile, and is easy to integrate with the platform. At present, there are tile-type architectures for co-aperture phased array antennas for transmission and reception, and tile-type architectures for multi-beam phased array antennas. However, there is no clear technical solution for the scalable tile-type architecture of multi-beam co-aperture phased array antennas for transmission and reception. Summary of the invention

[0005] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a transceiver multi-beam network and antenna based on an ultra-multi-layer mixed-pressure PCB process, so as to reduce the phased array profile, achieve high channel isolation, reduce spatial crosstalk, and thus improve the performance of the antenna.

[0006] To achieve the above-mentioned purpose of the invention, the present invention provides a transceiver multi-beam network based on an ultra-multi-layer mixed-pressure PCB process, comprising a microwave combining network layer, a dielectric substrate, and a multi-beam chip layer;

[0007] The microwave combining network layer and the multi-beam chip layer are sequentially arranged on the dielectric substrate;

[0008] Any of the microwave combining network layers and the multi-beam chip layer are connected via quasi-coaxial vertical vias;

[0009] The microwave combining network layer is provided with capacitor and inductor branches around the connection with the quasi-coaxial vertical via hole.

[0010] According to a technical solution of the present invention, the microwave combining network layer has N layers, and shielding layers are provided above and below any one of the microwave combining network layers, and the shielding layers have N+1 layers.

[0011] According to a technical solution of the present invention, the transceiver multi-beam network is expanded by interconnecting connectors.

[0012] According to a technical solution of the present invention, the circuit of the microwave combining network layer is realized by cascading multi-stage Wilkins bridges of microstrip lines based on a buried resistor process, and the characteristic impedance of the microstrip lines is a standard 50 ohm characteristic impedance.

[0013] According to a technical solution of the present invention, any one of the microwave combining network layers forms an independent beam.

[0014] According to a technical solution of the present invention, the microwave combining network layers are of equal phase.

[0015] According to a technical solution of the present invention, a stripline impedance converter and a chip interface are provided on the multi-beam chip layer, the chip interface is connected to the stripline impedance converter, and the stripline impedance converter is connected to the quasi-coaxial vertical via through a BGA solder ball.

[0016] According to a technical solution of the present invention, the transceiver multi-beam network further includes: a clock network layer, a data network layer, a data download network layer, and a chip selection network layer.

[0017] According to one aspect of the present invention, there is provided a tile-type phased array antenna including the above-mentioned transceiver multi-beam network, comprising a radiation unit layer and a control chip layer.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention proposes a broadband, low-loss multi-beam network based on a novel coaxial-like process, which achieves high channel-to-channel isolation through multi-stage Wilkins bridge cascade and stripline structure design.

[0020] 2. The multi-layer network integrated PCB pressing process is used to achieve high-density integration of multi-beam networks, effectively reducing the phased array profile while supporting multiple independent beams.

[0021] 3. The multi-beam network can be easily connected vertically with external circuits to achieve expansion, optimize the transmission line impedance value, and compress the vertical transmission distance of the signal.

[0022] 4. A shielding layer design is used between microwave combining network layers to improve the isolation of the beam network and reduce spatial crosstalk.

[0023] 5. The present invention significantly reduces production costs through a stacked multi-beam network architecture and a multi-layer network integrated PCB pressing process, making it easier to mass produce and promote applications.

[0024] 6. By loading capacitor and inductor branches near the quasi-coaxial vertical via used for feeding, the inductance and capacitance brought by the quasi-coaxial structure are offset to achieve good matching of the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram schematically shows the overall cascade structure of the multi-beam network of the present invention;

[0027] Figure 2 A schematic diagram showing the cascade structure of a multi-beam transceiver network of the present invention;

[0028] Figure 3 A schematic diagram showing the network distribution of the microwave combining network layer of the present invention;

[0029] Figure 4 A schematic diagram showing the hierarchical structure of the microwave combining network layer of the present invention;

[0030] Figure 5 A schematic diagram showing the structure of the microwave combining network layer and the shielding layer stripline combining network of the present invention;

[0031] Figure 6 Schematically showing a schematic diagram of a microwave combining network layer power splitter and combiner of the present invention;

[0032] Figure 7 The schematic diagram of the capacitor and inductor branches loaded near the coaxial vertical vias in the microwave combining network layer of the present invention is schematically shown.

[0033] 1-capacitor and inductor branches; 2-microwave combining network layer; 3-multi-beam chip layer; 4-feeder line. DETAILED DESCRIPTION

[0034] The description of the embodiments of this specification should be combined with the corresponding drawings, which should be considered as part of the complete specification. In the drawings, the shape or thickness of the embodiments may be enlarged and indicated for simplification or convenience. Furthermore, the parts of each structure in the drawings will be described separately. It is worth noting that the elements not shown in the drawings or not described in words are in a form known to ordinary technicians in the relevant technical field.

[0035] The description of the embodiments herein and any reference to directions and orientations are only for the convenience of description and are not to be construed as any limitation on the scope of protection of the present invention. The following description of the preferred embodiments may involve combinations of features, which may exist independently or in combination, and the present invention is not particularly limited to the preferred embodiments. The scope of the present invention is defined by the claims.

[0036] like Figures 1 to 7 As shown, an embodiment of the present invention is a transceiver multi-beam network device of a tile-type phased array antenna based on an ultra-multi-layer mixed-pressure PCB process, and the device is a power receiving combining network and / or a transmitting power distribution network of the antenna.

[0037] like Figure 1 As shown, the multi-beam network device includes a microwave combining network layer 2, a dielectric substrate, and a multi-beam chip layer 3;

[0038] The microwave combining network layer 2 and the multi-beam chip layer 3 are sequentially arranged on the dielectric substrate;

[0039] Multiple multi-beam networks can be connected and expanded to form a multi-beam phased array module, which is convenient for vertical interconnection with external circuits.

[0040] The transceiver multi-beam network based on the ultra-multi-layer mixed-pressure PCB process can significantly reduce the phased array profile, while realizing multiple simultaneous independent beams, saving connector interconnection, significantly reducing production costs, and facilitating mass production, promotion and application.

[0041] The multi-beam network cascade structure is as follows Figure 2 As shown, the circuit of the microwave combining network layer 2 is realized by cascading multi-stage Wilkins bridges of microstrip lines based on the buried resistance process. The characteristic impedance of the microstrip line is the standard 50 ohm characteristic impedance. Each layer of the microwave combining network layer 2 is isolated by a shielding layer. The output connection of the microwave combining network layer 2 and the multi-beam chip layer 3 is realized based on quasi-coaxial vertical vias. The multi-beam network layout considers the quasi-coaxial through holes for vertical interconnection between the microwave combining network layers 2.

[0042] The network distribution of microwave combined network layer 2 is as follows Figure 3 As shown, each microwave combining network layer 2 forms at least one independent beam, and the microwave combining network layer 2 is equiphase. The microwave combining network layer 2 based on PCB technology can be standardized and extended, and interconnected through connectors.

[0043] The transceiver multi-beam network can also set up other functional layers through PCB technology, such as clock network layer, data network layer, data download network layer, and chip select network layer.

[0044] like Figure 4As shown, the microwave combining network layer 2 has N layers, and shielding layers are provided above and below any microwave combining network layer 2. The shielding layers have N+1 layers. The shielding layers are provided to achieve high isolation of the multi-beam network and avoid spatial crosstalk.

[0045] Each microwave combining network layer 2 forms at least one independent beam, and the microwave combining network layer 2 is equiphase, any microwave combining network layer 2 and the multi-beam chip layer 3 are connected to the BGA solder ball through a quasi-coaxial vertical via transition, and the BGA solder ball is connected to the multi-beam chip layer 3;

[0046] like Figure 7 As shown, the microwave combining network layer 2 is provided with capacitor and inductor branches 1 on the feeder line 4 connected to the quasi-coaxial vertical via.

[0047] By arranging the capacitor and inductor branches 1 on the feed line 4 between the quasi-coaxial vertical vias, the inductance and capacitance caused by the quasi-coaxial structure are offset, thereby achieving good matching of the antenna.

[0048] The transceiver multi-beam network is expanded through connector interconnection.

[0049] A stripline impedance converter and a chip interface are provided on the multi-beam chip layer 3. The chip interface is connected to the stripline impedance converter, and the stripline impedance converter is connected to the quasi-coaxial vertical via through a BGA solder ball.

[0050] The stripline combining network structure of the microwave combining network layer 2 of the multi-layer PCB multi-beam network is as follows Figure 5 As shown, the microstrip line is connected to the BGA solder ball through a quasi-coaxial vertical via transition, the BGA solder ball is connected to the stripline impedance transformer on the multi-beam chip layer 3, and the stripline impedance transformer is connected to the chip interface of the multi-beam chip.

[0051] Figure 6 yes Figure 5 Enlarged schematic diagram of the power divider and combiner parts.

[0052] This embodiment also provides a tile-type phased array antenna including the above-mentioned transceiver multi-beam network, including a radiation unit layer, a control chip layer, and a power supply network layer.

[0053] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A transceiver multi-beam network based on ultra-multi-layer mixed-pressure PCB technology, characterized in that: It includes a microwave combining network layer, a dielectric substrate, and a multi-beam chip layer; The microwave combining network layer and the multi-beam chip layer are sequentially arranged on the dielectric substrate; Any of the microwave combining network layers and the multi-beam chip layer are connected via quasi-coaxial vertical vias; The microwave combining network layer is provided with capacitor and inductor branches around the connection with the quasi-coaxial vertical via hole.

2. The transceiver multi-beam network according to claim 1, characterized in that: The microwave combining network layer has N layers, and shielding layers are arranged above and below any microwave combining network layer, and the shielding layer has N+1 layers.

3. The transceiver multi-beam network according to claim 1, characterized in that: The transceiver multi-beam network is expanded by interconnecting connectors.

4. The transceiver multi-beam network according to claim 1, characterized in that: The circuit of the microwave combining network layer is realized by cascading a multi-stage Wilkins bridge of a microstrip line based on a buried resistor process, and the characteristic impedance of the microstrip line is a standard 50 ohm characteristic impedance.

5. The transceiver multi-beam network according to claim 1, characterized in that: Any of the microwave combining network layers forms an independent beam.

6. The transceiver multi-beam network according to claim 1, characterized in that: The microwave combining network layers are of equal phase.

7. The transceiver multi-beam network according to claim 1, characterized in that: A stripline impedance converter and a chip interface are provided on the multi-beam chip layer. The chip interface is connected to the stripline impedance converter. The stripline impedance converter is connected to the quasi-coaxial vertical via through a BGA solder ball.

8. The transceiver multi-beam network according to claim 1, characterized in that: The transceiver multi-beam network also includes: a clock network layer, a data network layer, a data download network layer, and a chip selection network layer.

9. A tile-type phased array antenna comprising a transceiver multi-beam network as claimed in any one of claims 1 to 8, characterized in that: Including radiation unit layer and control chip layer.

Images