Tile type transmit-receive assembly integrating sum-difference network and power supply module

Abstract

The invention, which relates to the technical field of the active phased-array antenna, discloses a tile-type transmit-receive assembly integrating a sum-difference network and a power supply module group, comprising a high-density phased-array T / R assembly, an in-board high-low frequency vertical interconnection structure, a sum-difference network and a power supply module group. The high-density phased array T / R assembly is connected with the in-board high-low frequency vertical interconnection structure, and the in-board high-low frequency vertical interconnection structure is connected with the sum-difference network and the power supply module; the high-density phased array T / R assembly is connected with the antenna, the sum-difference network is connected with the terminal machine, and the power supply module is connected with an external alternating current source. According to the invention, the tile-type T / R assembly module, the sum-difference network module and the power supply module are integrated in one assembly, so that small size and high integration level are realized, and miniaturization and low-cost application of the phased array transceiver system is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of active phased array antennas, and in particular to a tile-type transceiver component integrating a sum-difference network and a power supply module. Background Art

[0002] The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

[0003] The active phased array transceiver (T / R) component is the core component of the active phased array antenna. The component contains the receiving and transmitting links. The transmitting channel and the receiving channel are integrated in one component, sharing the phase shifter, attenuator, RF switch and the transmitting and receiving feed network. The power module is responsible for supplying power to the active RF chip of each channel inside. In a typical phased array radar system, each antenna radiating element is connected to a solid-state phased array T / R component. The phased array T / R component technology uses a computer to control the state of each phase shifter, thereby controlling the component phase reaching each antenna radiating element to change the radiation energy distribution of each radiating antenna unit, change the phase distribution on the antenna aperture to achieve beam scanning in space, and adjust the energy weighting of the radiating unit to enhance the directivity of the array antenna, so as to achieve the purpose of radiating and receiving electromagnetic waves in a set area and obtaining the target location and other electronic equipment information.

[0004] In the prior art, the phased array T / R component adopts the technology of separately designing the transceiver component, the sum-difference network and the power module, and separately modularizing and packaging. There are two implementation methods: one is to integrate and package the RF channel of the T / R component on a small scale, and then put multiple such small-scale packaged components together to form the component array required for the phased array antenna. When the component array works in the receiving state, the RF signal received by the antenna is low-noise amplified, phase-shifted, attenuated, and synthesized, and the amplified RF signal is transmitted to the sum-difference network, and the power module supplies power to the chips of each receiving branch; when the component array works in the transmitting state, the RF signal fed into each sum-difference network is power-distributed, attenuated, phase-shifted, and power-amplified, and the amplified RF signal is transmitted to the antenna array, and the power module supplies power to the chips of each transmitting branch; the second is to integrate and package the RF channel of the T / R component on a large scale, and then cascade this component with the radiating surface array to form a phased array transceiver antenna system. When the component array is working in the receiving state, the RF signal received by the antenna is low-noise amplified, phase-shifted, attenuated, and synthesized, and the amplified RF signal is transmitted to the sum-difference network packaging module, and the power module supplies power to the chips of each receiving branch; when the component array is working in the transmitting state, the RF signal fed into each sum-difference network is power-distributed, attenuated, phase-shifted, and power-amplified, and the amplified RF signal is transmitted to the sum-difference network, and the power module supplies power to the chips of each transmitting branch. However, both methods involve the module cascade between the phased array T / R components, the sum-difference network, and the power module, and the phased array T / R components, the sum-difference network, and the power module need to be modularly designed, individually packaged, and the high and low frequency interfaces between the modules need to be reserved. Such a design makes the module integration low, the design complicated, the cascaded modules are large in size, the alignment requirements between the high and low frequency interfaces are high, and the weight and cost cannot highlight the advantages, which is an important problem faced by the phased array T / R components.

[0005] In summary, in the active phased array T / R components in the field of phased array antennas, the T / R components, sum and difference networks, and power supply modules need to be modularly designed and individually packaged. The components have low integration and large size, which limits the miniaturization and low-cost application of phased array transceiver systems. Summary of the invention

[0006] The purpose of the present invention is to provide a tile-type transceiver component integrating a sum-difference network and a power module in response to the problems existing in the prior art. In the T / R component of the phased array transceiver system, the tile-type T / R component module, the sum-difference network module and the power module module are directly integrated into one component to achieve small size and high integration, thereby achieving miniaturization and low-cost application of the phased array transceiver system.

[0007] The technical solution of the present invention is as follows:

[0008] A tile-type transceiver component integrating a sum-difference network and a power module, comprising:

[0009] High-density phased array T / R components, intra-board high and low frequency vertical interconnection structure, sum and difference network, power supply module;

[0010] The high-density phased array T / R component is connected to the high and low frequency vertical interconnection structure in the board, and the high and low frequency vertical interconnection structure in the board is connected to the sum and difference network and the power module; the high-density phased array T / R component is connected to the antenna, the sum and difference network is connected to the terminal, and the power module is connected to the external AC source.

[0011] Furthermore, the working modes of the tile-type transceiver component include: a transmitting mode and a receiving mode.

[0012] Furthermore, the high-density phased array T / R assembly includes:

[0013] Attenuators, phase shifters, power dividers, combiners, power amplifiers and low noise amplifiers.

[0014] Furthermore, the power amplifier and the low noise amplifier are a chip in the high-density phased array T / R component, which integrates the power amplifier, the low noise amplifier and the radio frequency switch. The radio frequency switch controls whether the chip works in the transmitting branch or the receiving branch.

[0015] Furthermore, the high and low frequency vertical interconnection structure within the board is composed of a strip transmission line, a strip-line coaxial line transition, an interlayer coaxial transmission line, a coaxial line strip-line transition, and a strip transmission line, and the five are in a series relationship.

[0016] Furthermore, the sum-difference network is composed of four 90-degree stripline branch bridges.

[0017] Furthermore, the power supply module is composed of 8 functional circuits, including: a lightning protection circuit, a spike suppression circuit, an input polarity reverse protection circuit, an input filter circuit, a DC / DC conversion circuit, an output filter circuit, a power-on control circuit, and an enable control circuit.

[0018] Furthermore, when the tile-type transceiver component is in receiving mode, the signal transmitted by the antenna is used as the input signal of the high-density phased array T / R component. The high-density phased array T / R component vector-modulates the received signal and outputs the RF signal to the high- and low-frequency vertical interconnection structure in the board. The high- and low-frequency vertical interconnection structure in the board transitions the RF signal and outputs it to the sum-and-difference network as the input signal. The sum-and-difference network vector-superimposes the signal and outputs the sum port and difference port signals, which are transmitted to the terminal for use.

[0019] When the tile-type transceiver component is in the transmitting mode, the sum port and difference port signals input by the terminal are vector synthesized through the sum and difference network, and then output to the high and low frequency vertical interconnection structure inside the board. The high and low frequency vertical interconnection structure inside the board transmits the RF signal for transition and outputs it to the high-density phased array T / R component as the input signal. The high-density phased array T / R component vector modulates the received signal and transmits it to the terminated antenna for use.

[0020] Furthermore, when the tile-type transceiver assembly is in receiving mode, the high-density phased array T / R assembly consists of 128 parallel RF circuits, each of which includes a low-noise amplifier, a phase shifter, and an attenuator, which are connected in series in sequence; the RF signal s(t) transmitted from the antenna is amplified by the low-noise amplifier, and the obtained signal is then passed through the phase shifter and attenuator, and finally the multiplexer synthesizes the output signal x(t) and outputs it to the high and low frequency vertical interconnection structure in the board;

[0021] When the tile-type transceiver assembly is in the transmitting mode, the high-density phased array T / R assembly consists of 128 parallel RF circuits, each of which includes a power amplifier, a phase shifter, and an attenuator, and the three are connected in series in sequence; the RF signal x(t) transmitted by the high and low frequency vertical interconnection structure in the board is distributed through the power divider distribution circuit, and then passes through the phase shifter and attenuator. The obtained signal is amplified by the power amplifier, and finally the output signal s(t) is output to each terminated antenna.

[0022] Furthermore, after the RF signal passes through the high- and low-frequency vertical interconnection structure within the board, it can convert the RF signal x(t) transmitted from the high-density phased array T / R component into a RF signal y(t) and output it to the sum-and-difference network, and it can also convert the RF signal y(t) transmitted from the sum-and-difference network into a RF signal x(t) and output it to the high-density phased array T / R component. At the same time, the high- and low-frequency vertical interconnection structure within the board converts the signal w(t) output by the power module into a signal v(t) for use by each active chip inside the high-density phased array T / R component.

[0023] When the tile-type transceiver assembly is in receiving mode, the sum-difference network performs vector synthesis on each RF signal y(t) transmitted from the high- and low-frequency vertical interconnection structure in the board through a 90-degree stripline branch bridge, and outputs the sum port signal he(t), azimuth difference port signal fw(t), elevation difference port signal fy(t), and double difference port signal sc(t). The double difference port signal sc(t) is terminated and absorbed by a matching load, and the other three signals are used as final output signals for the terminal.

[0024] When the tile-type transceiver assembly is in the transmitting mode, the sum-difference network synthesizes the sum port signal he(t), azimuth difference port signal fw(t), and elevation difference port signal fy(t) transmitted by the terminal through a 90-degree stripline branch bridge to obtain a multi-channel RF signal y(t), which is then output to the high and low frequency vertical interconnection structure in the board.

[0025] When in receiving mode or transmitting mode, the tile-type transceiver component converts the external input AC signal into a signal w(t) and outputs it to the high and low frequency vertical interconnection structure within the board for use.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The present invention integrates high-density phased array T / R components, sum and difference networks and power modules in a printed circuit board through the high and low frequency vertical interconnection structure on the board, thereby realizing miniaturization and high integration of components, avoiding the modular design and separate packaging of T / R components, sum and difference networks and power modules, and achieving the purpose of miniaturization and low-cost application of phased array transceiver system.

[0028] 2. The present invention can be widely applied to miniaturized active phased array antennas. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a main structural block diagram of the tile-type transceiver component of the integrated sum-difference network and power module of the present invention;

[0030] Figure 2 It is a structural block diagram of the receiving state of the high-density phased array T / R component of the present invention;

[0031] Figure 3 It is a structural block diagram of the transmission state of the high-density phased array T / R component of the present invention;

[0032] Figure 4 This is a block diagram of the high and low frequency vertical interconnection structure within the board of the present invention;

[0033] Figure 5 It is a block diagram of the sum-difference network structure of the present invention;

[0034] Figure 6 It is a structural block diagram of the power module of the present invention. DETAILED DESCRIPTION

[0035] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0036] The features and performance of the present invention are further described in detail below in conjunction with the embodiments.

[0037] Embodiment 1

[0038] See also Figure 1 , a tile-type transceiver component integrating a sum-difference network and a power module, specifically comprising the following:

[0039] High-density phased array T / R components, intra-board high and low frequency vertical interconnection structure, sum and difference network, power supply module;

[0040] The high-density phased array T / R component is connected to the high- and low-frequency vertical interconnection structure in the board, and the high- and low-frequency vertical interconnection structure in the board is connected to the sum-and-difference network and the power module; the high-density phased array T / R component is connected to the antenna, the sum-and-difference network is connected to the terminal, and the power module is connected to the external AC source;

[0041] The working modes of the tile-type transceiver assembly include: a transmitting mode and a receiving mode.

[0042] In this embodiment, specifically, when the tile-type transceiver component is in the receiving mode, the signal transmitted by the antenna is used as the input signal of the high-density phased array T / R component. The high-density phased array T / R component vector-modulates the received signal and outputs the RF signal to the high- and low-frequency vertical interconnection structure in the board. The high- and low-frequency vertical interconnection structure in the board transitions the RF signal and outputs it to the sum-and-difference network as the input signal. The sum-and-difference network vector-superimposes the signal and outputs the sum port and the difference port signals, which are transmitted to the terminal for use.

[0043] When the tile-type transceiver component is in the transmitting mode, the sum port and difference port signals input by the terminal are vector synthesized through the sum and difference network, and then output to the high and low frequency vertical interconnection structure inside the board. The high and low frequency vertical interconnection structure inside the board transmits the RF signal for transition and outputs it to the high-density phased array T / R component as the input signal. The high-density phased array T / R component vector modulates the received signal and transmits it to the terminated antenna for use.

[0044] In this embodiment, specifically, the high-density phased array T / R assembly includes:

[0045] Attenuators, phase shifters, power dividers, combiners, power amplifiers and low noise amplifiers.

[0046] In this embodiment, specifically, the power amplifier and the low noise amplifier are a chip in the high-density phased array T / R component, which integrates the power amplifier, the low noise amplifier and the RF switch. The RF switch controls whether the chip works in the transmitting branch or the receiving branch.

[0047] See also Figure 2 In this embodiment, specifically, when the tile-type transceiver assembly is in receiving mode, the high-density phased array T / R assembly is composed of 128 parallel RF circuits, each of which includes a low-noise amplifier, a phase shifter, and an attenuator, which are connected in series in sequence; the RF signal s(t) transmitted from the antenna is amplified by the low-noise amplifier, and the obtained signal is then passed through the phase shifter and the attenuator, and finally the multiplexed output signal x(t) is output to the high and low frequency vertical interconnection structure in the board;

[0048] See also Figure 3 When the tile-type transceiver assembly is in the transmitting mode, the high-density phased array T / R assembly consists of 128 parallel RF circuits, each of which includes a power amplifier, a phase shifter, and an attenuator, and the three are connected in series in sequence; the RF signal x(t) transmitted by the high and low frequency vertical interconnection structure in the board is distributed through the power divider distribution circuit, and then passes through the phase shifter and attenuator. The obtained signal is amplified by the power amplifier, and finally the output signal s(t) is output to each terminated antenna.

[0049] See also Figure 4 In this embodiment, specifically, the high and low frequency vertical interconnection structure within the board is composed of a strip transmission line, a strip-line coaxial line transition, an interlayer coaxial transmission line, a coaxial line strip-line transition, and a strip transmission line, and the five are in a series relationship.

[0050] In this embodiment, specifically, after the RF signal passes through the high and low frequency vertical interconnection structure within the board, it can convert the RF signal x(t) transmitted from the high-density phased array T / R component into a RF signal y(t) and output it to the sum and difference network, and it can also convert the RF signal y(t) transmitted from the sum and difference network into a RF signal x(t) and output it to the high-density phased array T / R component; at the same time, the high and low frequency vertical interconnection structure within the board converts the signal w(t) output by the power module into a signal v(t) for use by each active chip inside the high-density phased array T / R component.

[0051] See also Figure 5 In this embodiment, specifically, the sum-difference network is composed of four 90-degree stripline branch bridges.

[0052] In this embodiment, specifically, when the tile-type transceiver assembly is in the receiving mode, the sum-difference network performs vector synthesis on each RF signal y(t) transmitted from the high- and low-frequency vertical interconnection structure in the board through a 90-degree stripline branch bridge, and outputs a sum port signal he(t), an azimuth difference port signal fw(t), an elevation difference port signal fy(t), and a double difference port signal sc(t), wherein the double difference port signal sc(t) is terminated and absorbed by a matching load, and the other three signals are used as final output signals for the terminal;

[0053] When the tile-type transceiver assembly is in the transmitting mode, the sum-difference network uses a 90-degree stripline branch bridge to vector-synthesize the sum port signal he(t), azimuth difference port signal fw(t), and elevation difference port signal fy(t) transmitted from the terminal to obtain a multi-channel RF signal y(t), which is output to the high and low frequency vertical interconnection structure inside the board.

[0054] See also Figure 6 In this embodiment, specifically, the power supply module is composed of 8 functional circuits, including: a lightning protection circuit, a spike suppression circuit, an input polarity reverse protection circuit, an input filter circuit, a DC / DC conversion circuit, an output filter circuit, a power-on control circuit, and an enable control circuit.

[0055] In this embodiment, specifically, when the tile-type transceiver assembly is in the receiving mode or the transmitting mode, it converts the external input AC signal into the signal w(t) and outputs it to the high and low frequency vertical interconnection structure in the board for use.

[0056] Specifically, when the tile-type transceiver component with integrated sum-difference network and wave controller proposed in this embodiment works in receiving mode, the multiple receiving combination voltages v(t) generated by the power module are transmitted to the RF chip interface to provide low-frequency signals for normal reception of each chip; the component transmits the RF signal s(t) transmitted from each antenna through a low-noise amplifier, a phase shifter, an attenuator, and a combiner in sequence, and then vector synthesizes the RF signal x(t) and outputs it to the high- and low-frequency vertical interconnection structure in the board. After the RF signal x(t) passes through the strip transmission line, the transition from the strip line to the coaxial line, the inter-layer coaxial transmission line, the transition from the coaxial line to the strip line, and the strip transmission line, the RF signal y(t) is obtained and output to the sum-difference network. After the 8-way y(t) RF signal passes through 4 90-degree strip line branch bridges, the output signals of 4 sum-difference network networks are obtained, which are the sum port signal he(t), the azimuth difference port signal fw(t), the elevation difference port signal fy(t), and the double difference port signal sc(t). The double differential port signal sc(t) is a useless signal, which is absorbed by the termination matching load, and the other three useful signals are used as the final output signals and transmitted to the terminal for use.

[0057] Specifically, when the tile-type transceiver component with integrated sum-difference network and wave controller proposed in this embodiment works in the transmission mode, the multiple transmission combination voltages v(t) generated by the power module are transmitted to the RF chip interface to provide low-frequency signals for the normal operation of each chip transmission; the component transmits the sum port signal he(t), azimuth difference port signal fw(t), and elevation difference port signal fy(t) transmitted by the terminal through four 90-degree stripline branch bridges to obtain 8 y(t) RF signals, which are output to the high and low frequency vertical interconnection structure in the board. After the y(t) RF signal passes through the stripline transmission line, the transition from coaxial to stripline, the inter-layer coaxial transmission line, the transition from stripline to coaxial line, and the stripline transmission line, the RF signal x(t) is obtained and output to the high-density phased array T / R component. After the x(t) signal passes through the power divider, attenuator, phase shifter, and power amplifier in sequence, the RF signal s(t) is output, and each s(t) is used as the final output signal and transmitted to the antenna as an excitation source.

[0058] The above-mentioned embodiments only express the specific implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the protection scope of the present application. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the technical solution concept of the present application, and these all belong to the protection scope of the present application.

[0059] This background section is provided to generally present the context of the invention, and the work of the presently named inventors, the work to the extent described in this background section, and aspects of this section that did not constitute prior art at the time of application are neither explicitly nor implicitly admitted to be prior art to the present invention.

Claims

1. A tile-type transceiver component integrating a sum-difference network and a power module, characterized in that: include: High-density phased array T / R components, intra-board high and low frequency vertical interconnection structure, sum and difference network, power supply module; The high-density phased array T / R component is connected to the high and low frequency vertical interconnection structure in the board, and the high and low frequency vertical interconnection structure in the board is connected to the sum and difference network and the power module; the high-density phased array T / R component is connected to the antenna, the sum and difference network is connected to the terminal, and the power module is connected to the external AC source.

2. A tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 1, characterized in that: The working modes of the tile-type transceiver assembly include: a transmitting mode and a receiving mode.

3. A tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 2, characterized in that: The high-density phased array T / R assembly comprises: Attenuators, phase shifters, power dividers, combiners, power amplifiers and low noise amplifiers.

4. A tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 3, characterized in that: The power amplifier and low noise amplifier are a chip in the high-density phased array T / R component, which integrates the power amplifier, low noise amplifier and radio frequency switch. The radio frequency switch controls whether the chip works in the transmitting branch or the receiving branch.

5. The tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 4, characterized in that: The high and low frequency vertical interconnection structure within the board is composed of a strip transmission line, a strip-line coaxial line transition, an interlayer coaxial transmission line, a coaxial line strip-line transition, and a strip transmission line, and the five are in a series relationship.

6. The tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 5, characterized in that: The sum-difference network is composed of four 90-degree stripline branch bridges.

7. A tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 6, characterized in that: The power supply module is composed of 8 functional circuits, including: lightning protection circuit, spike suppression circuit, input polarity reverse protection circuit, input filter circuit, DC / DC conversion circuit, output filter circuit, power-on control circuit, and enable control circuit.

8. The tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 7, characterized in that: When the tile-type transceiver component is in receiving mode, the signal transmitted by the antenna is used as the input signal of the high-density phased array T / R component. The high-density phased array T / R component vector-modulates the received signal and outputs the RF signal to the high- and low-frequency vertical interconnection structure in the board. The high- and low-frequency vertical interconnection structure in the board transitions the RF signal and outputs it to the sum-and-difference network as the input signal. The sum-and-difference network vector-superimposes the signal and outputs the sum port and difference port signals, which are transmitted to the terminal for use. When the tile-type transceiver component is in the transmitting mode, the sum port and difference port signals input by the terminal are vector synthesized through the sum and difference network, and then output to the high and low frequency vertical interconnection structure inside the board. The high and low frequency vertical interconnection structure inside the board transmits the RF signal for transition and outputs it to the high-density phased array T / R component as the input signal. The high-density phased array T / R component vector modulates the received signal and transmits it to the terminated antenna for use.

9. The tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 8, characterized in that: When the tile-type transceiver assembly is in receiving mode, the high-density phased array T / R assembly consists of 128 parallel RF circuits, each of which includes a low-noise amplifier, a phase shifter, and an attenuator, which are connected in series in sequence; the RF signal s(t) transmitted by the antenna is amplified by the low-noise amplifier, and the obtained signal is then passed through the phase shifter and attenuator, and finally the multiplexer synthesizes the output signal x(t) and outputs it to the high and low frequency vertical interconnection structure in the board; When the tile-type transceiver assembly is in the transmitting mode, the high-density phased array T / R assembly consists of 128 parallel RF circuits, each of which includes a power amplifier, a phase shifter, and an attenuator, and the three are connected in series in sequence; the RF signal x(t) transmitted by the high and low frequency vertical interconnection structure in the board is distributed through the power divider distribution circuit, and then passes through the phase shifter and attenuator. The obtained signal is amplified by the power amplifier, and finally the output signal s(t) is output to each terminated antenna.

10. The tile-type transceiver assembly integrating a sum-difference network and a power module according to claim 9, characterized in that: After the RF signal passes through the high- and low-frequency vertical interconnection structure in the board, it can convert the RF signal x(t) transmitted from the high-density phased array T / R component into a RF signal y(t) and output it to the sum-and-difference network, and it can also convert the RF signal y(t) transmitted from the sum-and-difference network into a RF signal x(t) and output it to the high-density phased array T / R component. At the same time, the high- and low-frequency vertical interconnection structure in the board converts the signal w(t) output by the power module into a signal v(t) for use by each active chip inside the high-density phased array T / R component. When the tile-type transceiver assembly is in receiving mode, the sum-difference network performs vector synthesis on each RF signal y(t) transmitted from the high- and low-frequency vertical interconnection structure in the board through a 90-degree stripline branch bridge, and outputs the sum port signal he(t), azimuth difference port signal fw(t), elevation difference port signal fy(t), and double difference port signal sc(t). The double difference port signal sc(t) is terminated and absorbed by a matching load, and the other three signals are used as final output signals for the terminal. When the tile-type transceiver assembly is in the transmitting mode, the sum-difference network synthesizes the sum port signal he(t), azimuth difference port signal fw(t), and elevation difference port signal fy(t) transmitted by the terminal through a 90-degree stripline branch bridge to obtain a multi-channel RF signal y(t), which is then output to the high and low frequency vertical interconnection structure in the board. When in receiving mode or transmitting mode, the tile-type transceiver component converts the external input AC signal into a signal w(t) and outputs it to the high and low frequency vertical interconnection structure within the board for use.

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