Electronic device and electronic equipment

Abstract

The embodiment of the invention provides an electronic device and electronic equipment. The electronic device comprises a first circuit board, a second circuit board, a first cellular radio frequency front end, a non-cellular radio frequency front end and a system-on-chip, the first circuit board and the second circuit board are arranged at an interval, and the first circuit board is in circuit connection with the second circuit board; one of the first cellular radio frequency front end and the non-cellular radio frequency front end is arranged on the first circuit board, and the other one is arranged on the second circuit board, or both the first cellular radio frequency front end and the non-cellular radio frequency front end are arranged on the second circuit board; the system-on-chip is arranged on the first circuit board and is electrically connected with the first cellular radio frequency front end and the non-cellular radio frequency front end. The electronic equipment comprises a shell and the electronic device, and the electronic device is installed in the shell. According to the embodiment, heat sources can be arranged dispersedly, and the defect that heat conduction materials are used for transmitting heat in a traditional scheme is overcome.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device and an electronic equipment. Background Art

[0002] like Figure 1 As shown in Figure 1, in traditional folding screen mobile phones, the main heat source is arranged in the main frame of the device, which causes the temperature rise of the main frame to be high when the device is working, affecting the reliability of the device and user experience. Compared with the main frame, the temperature rise of the sub-frame is lower. Figure 2 As shown, in order to achieve uniform heat distribution, an existing solution is to use a thermally conductive material that spans the shaft to transfer the heat of the main frame to the sub-frame, thereby achieving thermal balance between the main frame and the sub-frame. However, the thermally conductive material needs to span the shaft, which further increases the complexity and difficulty of the shaft design. Moreover, the thermally conductive material will take up part of the space of the entire machine. Under the same thickness of the entire machine, it will cause the battery volume to decrease and the battery capacity design value to decrease. The price of thermally conductive materials is relatively high, which will increase the cost of the entire machine. In addition, due to the gap in the shaft area, the mechanism movement will occur, so the thermal conductivity of the shaft area is not good, which results in a high cost of cross-axis heat transfer, but limited effect. Summary of the invention

[0003] The embodiments of the present application provide an electronic device and an electronic device that can disperse heat sources and avoid the defects of traditional solutions that use thermal conductive materials to transfer heat.

[0004] In a first aspect, an embodiment of the present application provides an electronic device, including a first circuit board, a second circuit board, a first cellular RF front end, a non-cellular RF front end and a system-level chip; the first circuit board and the second circuit board are arranged at intervals, and the first circuit board is circuit-connected to the second circuit board; one of the first cellular RF front end and the non-cellular RF front end is arranged on the first circuit board, and the other is arranged on the second circuit board, or the first cellular RF front end and the non-cellular RF front end are both arranged on the second circuit board; the system-level chip is arranged on the first circuit board, and is electrically connected to both the first cellular RF front end and the non-cellular RF front end.

[0005] In this solution, by placing the cellular RF front end and the non-cellular RF front end on different circuit boards, the heat source can be dispersed in different areas of the electronic device to avoid heat concentration, which is beneficial to improving the heat dissipation and heat distribution performance of the whole device. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity.

[0006] In one implementation of the first aspect, the electronic device further includes a non-cellular antenna module, the non-cellular antenna module is arranged on the first circuit board or the second circuit board, and the non-cellular antenna module is electrically connected to the non-cellular RF front end. By dispersing the heat sources such as the non-cellular antenna module, the cellular RF front end and the non-cellular RF front end, heat concentration can be avoided, and the heat dissipation performance and heat distribution performance of the whole machine can be further improved. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance capacity.

[0007] In an implementation of the first aspect, the electronic device also includes a non-cellular RF chip, which is arranged on the first circuit board or the second circuit board, and the non-cellular RF chip is electrically connected to the non-cellular antenna module; the system-level chip is electrically connected to the non-cellular RF chip. By dispersing heat sources such as the non-cellular RF chip, the non-cellular antenna module, the cellular RF front end and the non-cellular RF front end, heat concentration can be avoided, and the heat dissipation performance and heat distribution performance of the whole machine can be further improved. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitor capacity.

[0008] In an implementation of the first aspect, the electronic device further includes a first cellular antenna module, the first cellular antenna module is arranged on the first circuit board or the second circuit board, and the first cellular antenna module is electrically connected to the first cellular RF front end. By dispersing several or all heat sources in the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, the cellular RF front end and the non-cellular RF front end, heat concentration can be avoided, and the heat dissipation performance and heat distribution performance of the whole machine can be further improved. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance capacity.

[0009] In an implementation of the first aspect, the electronic device also includes a first cellular RF chip, the first cellular RF chip is arranged on the first circuit board or the second circuit board, the first cellular RF chip is electrically connected to the first cellular antenna module; the system-level chip is electrically connected to the first cellular RF chip. By dispersing several or all heat sources in the first cellular RF chip, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, the cellular RF front end and the non-cellular RF front end, heat concentration can be avoided, and the heat dissipation performance and heat distribution performance of the whole machine can be further improved. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance capacity.

[0010] In an implementation of the first aspect, the electronic device further includes a first cellular radio frequency chip and a first cellular antenna module, the first cellular radio frequency chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular radio frequency front end, the first cellular radio frequency chip, the first cellular antenna module, the first cellular radio frequency front end and the non-cellular antenna module are all arranged on the first circuit board, and the non-cellular radio frequency chip and the non-cellular radio frequency front end are all arranged on the second circuit board; the system-level chip is electrically connected to the first cellular radio frequency chip. By arranging the first cellular radio frequency chip, the first cellular antenna module, the first cellular radio frequency front end and the non-cellular antenna module, as well as the non-cellular radio frequency chip and the non-cellular radio frequency on different circuit boards, the heat source can be dispersed in different areas of the electronic device to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, it is not necessary to set a thermal conductive material between the different areas of the electronic device, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity.

[0011] In an implementation of the first aspect, the electronic device further includes a first cellular radio frequency chip and a first cellular antenna module, the first cellular radio frequency chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular radio frequency front end, the first cellular antenna module, the non-cellular radio frequency chip, the non-cellular antenna module and the non-cellular radio frequency front end are all arranged on the first circuit board, and the first cellular radio frequency chip and the first cellular radio frequency front end are both arranged on the second circuit board; the system-level chip is electrically connected to the first cellular radio frequency chip. By arranging the first cellular antenna module, the non-cellular radio frequency chip, the non-cellular antenna module and the non-cellular radio frequency front end, as well as the first cellular radio frequency chip and the first cellular radio frequency front end on different circuit boards, the heat source can be dispersed in different areas of the electronic device to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, it is not necessary to set a thermal conductive material between the different areas of the electronic device, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity.

[0012] In an implementation of the first aspect, the first cellular antenna module includes an N77 module, an N79 module, and a medium-high frequency MHB module; the electronic device also includes a power amplifier, and the system-level chip is electrically connected to the first cellular radio frequency chip through the power amplifier. The power amplifier has a power amplification function and can improve the problem of large signal loss across the axis.

[0013] In an implementation of the first aspect, the electronic device further includes a first cellular RF chip, a first cellular antenna module, a second cellular RF chip, a second cellular RF front end, and a second cellular antenna module. The first cellular RF chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular RF front end, the second cellular RF chip is electrically connected to the second cellular antenna module, the second cellular antenna module is electrically connected to the second cellular RF front end, the first cellular RF chip, the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, and the non-cellular RF front end are all arranged on the first circuit board, and the second cellular RF chip, the second cellular RF front end, and the second cellular antenna module are all arranged on the second circuit board; the system-level chip is electrically connected to the first cellular RF chip and the second cellular RF chip. By arranging the first cellular RF chip, the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, and the non-cellular RF front end, as well as the second cellular RF chip, the second cellular RF front end, and the second cellular antenna module on different circuit boards, the heat source can be dispersed in different areas of the electronic device to avoid heat concentration, which is conducive to improving the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, there is no need to provide heat-conducting materials between the different regions of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance.

[0014] In an implementation of the first aspect, the electronic device further includes a first power amplifier disposed on the first circuit board, and the system-level chip is electrically connected to the first cellular radio frequency chip through the first power amplifier; and / or the electronic device further includes a second power amplifier disposed on the second circuit board, and the system-level chip is electrically connected to the second cellular radio frequency chip through the second power amplifier. The power amplifier has a power amplification function, and can improve the problem of large signal loss across the axis.

[0015] In an implementation of the first aspect, the electronic device further includes a first cellular radio frequency chip and a first cellular antenna module, the first cellular radio frequency chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular radio frequency front end, and the first cellular radio frequency chip, the first cellular radio frequency front end, the first cellular antenna module, the non-cellular radio frequency chip, the non-cellular radio frequency front end, and the non-cellular antenna module are all arranged on a second circuit board. By arranging the system-level chip, the first cellular radio frequency chip, the first cellular radio frequency front end, the first cellular antenna module, the non-cellular radio frequency chip, the non-cellular radio frequency front end, and the non-cellular antenna module on different circuit boards, respectively, the heat source can be dispersed in different areas of the electronic device to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, there is no need to set a thermal conductive material between the different areas of the electronic device, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity.

[0016] In an implementation of the first aspect, the electronic device further includes a third power amplifier disposed on the second circuit board, and the system-level chip is electrically connected to the first cellular radio frequency chip via the third power amplifier. The power amplifier has a power amplification function and can improve the problem of large signal transaxial loss.

[0017] In an implementation of the first aspect, the electronic device further includes a camera module, the camera module is arranged on the second circuit board, the camera module is electrically connected to the system-level chip through a flexible circuit board, and the cross-axis loss of the flexible circuit board is 1dB / 100mm to 2dB / 100mm. The cross-axis loss of such a flexible circuit board is low, and the camera module transmits signals to the system-level chip through the low-loss flexible circuit board, which can improve the cross-axis loss.

[0018] In an implementation of the first aspect, a non-cellular RF chip, a non-cellular RF front end, a non-cellular antenna module, and a system-level chip are all arranged on a first circuit board; the electronic device also includes a first cellular RF chip and a first cellular antenna module, the first cellular RF chip and the first cellular antenna module are both arranged on a second circuit board, the first cellular RF chip and the first cellular antenna module are electrically connected; the system-level chip is electrically connected to the first cellular RF chip. By arranging the non-cellular RF chip, the non-cellular RF front end, the non-cellular antenna module and the system-level chip, as well as the first cellular RF chip and the first cellular antenna module on different circuit boards, the heat source can be dispersed in different areas of the electronic device to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, there is no need to set a thermal conductive material between the different areas of the electronic device, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity.

[0019] In an implementation of the first aspect, the electronic device further includes a first power management chip and a second power management chip, the first power management chip is arranged on the first circuit board and electrically connected to the system-level chip, and the second power management chip is arranged on the second circuit board and electrically connected to the system-level chip. By arranging the first power management chip, the second power management chip, the non-cellular radio frequency chip, the non-cellular radio frequency front end, the non-cellular antenna module and the system-level chip, the first cellular radio frequency chip and the first cellular antenna module on different circuit boards respectively, the heat source can be dispersed in different areas of the electronic device to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, there is no need to set a thermal conductive material between the different areas of the electronic device, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitor capacity.

[0020] In the second aspect, the embodiment of the present application provides an electronic device, including a housing and the electronic device, wherein the electronic device is installed in the housing. This solution can disperse the heat source, avoid the defect of the traditional solution of using heat-conducting materials to transfer heat, and make the heat dissipation performance and heat distribution performance of the electronic device better. There is no need to set heat-conducting materials between different areas of the electronic device, which can reduce costs, save space, and is conducive to increasing the battery volume and improving the design value of the capacitance.

[0021] In an implementation of the second aspect, the housing includes a first housing and a second housing, and the electronic device further includes a hinge, the hinge connects the first housing and the second housing, and the hinge is used to generate a mechanism movement to make the first housing and the second housing rotate relative to each other, so that the electronic device can be folded or unfolded; the first circuit board is installed in the first housing, and the second circuit board is installed in the second housing. This solution can be applied to folding screen devices, greatly improving the heat dissipation performance and heat distribution performance of folding screen electronic devices, reducing costs, saving space, increasing the volume of the battery, and improving the design value of the capacitor capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the thermal distribution simulation of a traditional folding screen mobile phone;

[0023] Figure 2 This is a schematic diagram of the heat distribution solution for traditional folding screen mobile phones;

[0024] Figure 3 It is a schematic diagram of the hardware framework structure of the electronic device according to the embodiment of the present application;

[0025] Figure 4 It is a schematic diagram of the appearance structure of an electronic device according to an embodiment of the present application;

[0026] Figure 5 is a schematic diagram of the appearance structure of another electronic device according to an embodiment of the present application;

[0027] Figure 6 is a plan view schematically showing a device arrangement of an electronic device according to an embodiment of the present application;

[0028] Figure 7 is a plan view schematically showing a device arrangement of another electronic device according to an embodiment of the present application;

[0029] Figure 8 is a plan view schematically showing a device arrangement of another electronic device according to an embodiment of the present application;

[0030] Fig. 9 is a plan view schematically showing a device arrangement of another electronic device according to an embodiment of the present application;

[0031] Fig.10ais a plan view schematically showing a device arrangement of another electronic device according to an embodiment of the present application;

[0032] Fig.10b It is a plan view schematically showing the arrangement of components of another electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0033] For ease of understanding, the relevant technical terms involved in the embodiments of the present application are explained and described below.

[0034] In the description of the embodiments of the present application, unless otherwise specified, "plurality" refers to two or more.

[0035] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood to imply or suggest relative importance or implicitly indicate the number of technical features indicated. Features qualified as "first" or "second" may explicitly or implicitly include one or more of the features.

[0036] "Connect" should be understood in a broad sense, for example, "connect" can be detachably connected or non-detachably connected; it can be directly connected or indirectly connected through an intermediate medium. "Fix" should also be understood in a broad sense, for example, "fix" can be directly fixed or indirectly fixed through an intermediate medium.

[0037] The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "top", "bottom", etc., are only references to the directions of the drawings. The directional terms are for better and clearer explanation and understanding of the embodiments of the present application, and do not explicitly or implicitly indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, etc., and therefore cannot be understood as limiting the embodiments of the present application.

[0038] In the description of the embodiments of the present application, unless otherwise specified, "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone.

[0039] The following embodiments of the present application provide an electronic device, including but not limited to mobile phones (such as candy-bar phones, foldable phones, curved screen phones, etc.), tablet computers, laptops (including foldable laptops), smart screens, smart bracelets, smart watches, mixed reality devices (such as MR head-mounted devices), virtual reality devices (such as VR glasses), augmented reality devices, vehicle-mounted devices (such as car computers), etc.

[0040] The following first describes the basic hardware framework of the electronic device in the embodiment of the present application, and then describes in detail the design of the electronic device for distributing the heat sources.

[0041] Figure 3 FIG. 1 is a schematic diagram showing a hardware framework structure of an electronic device 100 according to an embodiment of the present application. It can be understood that: Figure 3 The components of the electronic device 100 shown are only for illustration purposes. The electronic device 100 may have more Figure 3 More or fewer components may be shown, two or more components may be combined, or there may be a different configuration of components. Figure 3 The various components shown in the EMBODIMENTS 2000 may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application specific integrated circuits.

[0042] like Figure 3 As shown, the electronic device 100 may include a system on chip (SoC) 110, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 101, an antenna 102, a cellular radio frequency module 150, a non-cellular radio frequency module 160, a camera 193, a display screen 194, etc.

[0043] The system-level chip 110 may include one or more processing units, for example, the system-level chip 110 may include an AP (application processor, AP), a modem (Modem), a graphics processor (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), a controller, a memory, a video codec, a digital signal processor (digital signal processor, DSP), a baseband processor, and / or a neural-network processing unit (neural-network processing unit, NPU), etc. Among them, different processing units may be independent devices, or may be integrated in one or more system-level chips.

[0044] The USB interface 130 is an interface that complies with the USB standard specification, and specifically can be a Mini USB interface, a Micro USB interface, a USB Type C interface, etc. The USB interface 130 can be used to connect a charger to charge the electronic device 100, and can also be used to transfer data between the electronic device 100 and a peripheral device. It can also be used to connect headphones to play audio through the headphones. The interface can also be used to connect other electronic devices, such as AR devices, etc.

[0045] It is understandable that the interface connection relationship between the modules illustrated in the embodiment of the present invention is only a schematic illustration and does not constitute a structural limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may also adopt different interface connection methods in the above embodiments, or a combination of multiple interface connection methods.

[0046] The charging management module 140 is used to receive charging input from a charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from a wired charger through the USB interface 130. In some wireless charging embodiments, the charging management module 140 may receive wireless charging input through a wireless charging coil of the electronic device 100. While the charging management module 140 is charging the battery 142, it may also power the electronic device through the power management module 141.

[0047] The power management module 141 is used to connect the battery 142, the charging management module 140 and the system-on-chip 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and supplies power to the system-on-chip 110, the display screen 194, the camera 193, the cellular radio frequency module 150 and the non-cellular radio frequency module 160. The power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle number, battery health status (such as leakage, impedance, etc.). In some other embodiments, the power management module 141 can also be set in the system-on-chip 110. In other embodiments, the power management module 141 and the charging management module 140 can also be set in the same device.

[0048] The communication function of the electronic device 100 can be implemented through the antenna 101, the antenna 102, the cellular radio frequency module 150, the non-cellular radio frequency module 160, the modem and the baseband processor.

[0049] Antenna 101 and antenna 102 both represent a type of antenna, and the number of antennas in each type is not limited. As needed, antenna 101 may include one or more antennas, and antenna 102 may include one or more antennas. Antenna 101 and antenna 102 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve the utilization of the antenna. For example, antenna 101 can be reused as a diversity antenna for a wireless local area network. In some other embodiments, the antenna can be used in conjunction with a tuning switch.

[0050] The cellular RF module 150 can provide solutions for cellular communications including 2G / 3G / 4G / 5G, etc., applied to the electronic device 100. The cellular RF module 150 may include a cellular RF chip, a cellular RF front end, and a cellular antenna module, etc. The cellular RF module 150 can receive electromagnetic waves from the antenna 101, and filter, amplify, and process the received electromagnetic waves, and transmit them to the modem for demodulation. The cellular RF module 150 can also amplify the signal modulated by the modem, and convert it into electromagnetic waves for radiation through the antenna 101. In some embodiments, at least one partial functional module of the cellular RF module 150 can be integrated in the system-level chip 110. In some embodiments, at least one partial functional module of the cellular RF module 150 can be set in the same device as at least one partial module of the system-level chip 110.

[0051] The modem may include a modulator and a demodulator. Among them, the modulator is used to modulate the low-frequency baseband signal to be sent into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After the low-frequency baseband signal is processed by the baseband processor, it is transmitted to the AP. The AP outputs a sound signal through an audio device (not limited to a speaker, a receiver, etc.), or displays an image or video through a display screen 194. In some embodiments, the modem may be an independent device. In other embodiments, the modem may be independent of the system-level chip 110 and be set in the same device as the cellular radio frequency module 150 or other functional modules.

[0052] The non-cellular radio frequency module 160 can provide non-cellular communication solutions including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication technology (NFC), infrared technology (IR), etc., which are applied to the electronic device 100. Among them, GNSS can include global positioning system (GPS), global navigation satellite system (GLONASS), Beidou navigation satellite system (BDS), quasi-zenith satellite system (QZSS) and / or satellite based augmentation system (SBAS).

[0053] The non-cellular RF module 160 may include a non-cellular RF chip, a non-cellular RF front-end modules (FEM), and a non-cellular antenna module. The non-cellular RF module 160 receives electromagnetic waves via the antenna 102, modulates the electromagnetic wave signal, performs filtering, and sends the processed signal to the system-level chip 110. The non-cellular RF module 160 may also receive a signal to be sent from the system-level chip 110, modulate the signal, amplify the signal, and convert it into an electromagnetic wave for radiation via the antenna 102.

[0054] In some embodiments, the antenna 101 of the electronic device 100 is coupled to the cellular radio frequency module 150, and the antenna 102 is coupled to the non-cellular radio frequency module 160, so that the electronic device 100 can communicate with the network and other devices through wireless communication technology. The wireless communication technology may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology, etc.

[0055] The electronic device 100 implements the display function through a GPU, a display screen 194, and an AP. The GPU is a micro-system-level chip for image processing, which connects the display screen 194 and the AP. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The system-level chip 110 may include one or more GPUs that execute program instructions to generate or change display information.

[0056] The display screen 194 is used to display images, videos, etc. The display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), Miniled, MicroLed, Micro-OLED, a quantum dot light-emitting diode (QLED), etc. In some embodiments, as Figure 3 As shown, the electronic device 100 may include 1 or N display screens (represented by display screens 1 to N) 194, where N is a positive integer greater than 1.

[0057] The electronic device 100 can realize the shooting function through ISP, camera 193, video codec, GPU, display screen 194 and AP.

[0058] The ISP is used to process the data fed back by the camera 193. For example, when taking a photo, the shutter is opened, and the light is transmitted to the camera photosensitive element through the lens. The light signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing and converts it into an image visible to the naked eye. The ISP can also perform algorithm optimization on the noise and brightness of the image. The ISP can also optimize the exposure, color temperature and other parameters of the shooting scene. In some embodiments, the ISP can be set in the camera 193.

[0059] The camera 193 is used to capture still images or videos. The object generates an optical image through the lens and projects it onto the photosensitive element. The photosensitive element can be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the optical signal into an electrical signal, and then transmits the electrical signal to the ISP for conversion into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV or other format. In some embodiments, Figure 3 As shown, the electronic device 100 may include 1 or N cameras (represented by cameras 1 to N) 193, where N is a positive integer greater than 1.

[0060] Figure 4 and Figure 5 The external structures of two electronic devices 1 of the embodiments of the present application are illustrated. Schematically, the electronic device 1 can be a folding mobile phone, which can be an external folding screen mobile phone (the screen is on the outside after folding) or an internal folding screen mobile phone (the screen is hidden on the inside after folding).

[0061] like Figure 4 and Figure 5 As shown, the electronic device 1 may include a first housing 11, a first circuit board 12, a hinge 13, a second housing 14, and a second circuit board 15. The hinge 13 is connected between the first housing 11 and the second housing 14, and the hinge 13 can generate a mechanical movement so that the first housing 11 and the second housing 14 rotate relative to each other, so that the electronic device 1 can be folded or unfolded.

[0062] refer to Figure 4 As shown, when the electronic device 1 is held normally by a user, the hinge 13 extends approximately horizontally, and the first housing 11 and the second housing 14 are folded toward the middle from the upper and lower sides, or unfolded from the middle toward the upper and lower sides, respectively, so that the electronic device 1 can be held normally by a user. Figure 4The electronic device 1 shown is called a "small folding mobile phone". Figure 5 As shown, when the electronic device 1 is normally held by the user, the hinge 13 extends substantially in the vertical direction, and the first housing 11 and the second housing 14 are folded from the left and right sides to the middle, or unfolded from the middle to the left and right sides, respectively, so that the electronic device 1 can be held normally by the user. Figure 5 The electronic device 1 shown is called a "large folding phone".

[0063] like Figure 4 and Figure 5 As shown, the first circuit board 12 is installed in the first housing 11, and the second circuit board 15 is installed in the second housing 14. Schematically, the first circuit board 12 and the second circuit board 15 can be connected by a flexible connector, and inter-board data transmission is realized through the flexible connector; or, the first circuit board 12 and the second circuit board 15 can be connected by a flexible connector and matched with a single or multiple coaxial lines to realize inter-board data transmission; or, the first circuit board 12 and the second circuit board 15 can communicate through millimeter wave technology. Various devices can be arranged on both the first circuit board 12 and the second circuit board 15, which will be explained below.

[0064] Figure 6 It is a schematic plan view of the arrangement of components on the first circuit board 12 and the second circuit board 15 in the electronic device 1 of the first embodiment.

[0065] like Figure 6 As shown, a system-level chip 125 and a cellular RF module (RFsystem) 123 may be arranged on the first circuit board 12. The cellular RF module 123 may include a first cellular RF chip 123a, a first cellular RF front end 123b, and a first cellular antenna module 123c. The system-level chip 125 may be electrically connected to the first cellular RF chip 123a, the first cellular RF chip 123a may be electrically connected to the first cellular RF front end 123b, and the first cellular RF front end 123b may be electrically connected to the first cellular antenna module 123c. Among them:

[0066] The system-on-chip 125 may integrate an AP, a Modem, and the like.

[0067] The first cellular RF chip 123a is a RF transceiver (RF transceiver or RFIC), and its functions may include: 1. Transmission: Modulate, amplify, filter and other processes the digital signal from the modem to convert it into a cellular RF signal suitable for wireless transmission, and send the cellular RF signal. 2. Reception: Receive the cellular RF signal from the antenna, amplify, filter and demodulate it to convert it into a digital signal for processing by the baseband processor. 3. Frequency conversion: Convert the cellular RF signal between different frequency bands. For example, the electronic device 1 needs to support communications in multiple frequency bands at the same time (such as 2G, 3G, 4G, 5G, etc.). The first cellular RF chip 123a can perform frequency conversion as needed to enable the electronic device 1 to communicate on different frequency bands. 4. RF front-end control: Control the operation of the first cellular RF front-end 123b.

[0068] The first cellular RF front end 123b is connected between the first cellular RF chip 123a and the first cellular antenna module 123c, and is used to filter, amplify, reduce noise, switch channels, filter matching, impedance matching, etc. on the cellular RF signal. Specifically, the first cellular RF front end 123b may include a transmitting end and a receiving end. The transmitting end may include components such as a power amplifier (PA), a duplexer, or a multiplexer. The transmitting end may amplify and filter the weaker cellular RF signal generated by the first cellular RF chip 123a during the signal transmission process. The receiving end may include devices such as a filter, an LNA, and an RF switch. The receiving end may amplify and filter the received cellular RF signal to a range suitable for the operation of the first cellular RF chip 123a during the signal reception process.

[0069] The first cellular RF front end 123b may include all cellular RF front ends in the electronic device 1, that is, all cellular RF front ends in the electronic device 1 may be arranged on the first circuit board 12. Alternatively, the first cellular RF front end 123b may include only a portion of the cellular RF front ends in the electronic device 1, and the other portion of the cellular RF front ends may be arranged on the second circuit board 15.

[0070] The first cellular antenna module 123c is used to connect the first cellular RF front end 123b and the first cellular antenna (described below), and is used to transmit RF signals between the first cellular RF front end 123b and the first cellular antenna, and may also have filtering and modulation functions. Schematically, the first cellular antenna module 123c may include transmission cables, ground feeds, matching circuits, matching devices, and other devices.

[0071] The first cellular antenna module 123c may include all cellular antenna modules in the electronic device 1, that is, all cellular antenna modules are arranged on the side where the first circuit board 12 is located. Alternatively, the first cellular antenna module 123c may include only a part of the cellular antenna modules in the electronic device 1, such as a low-band diversity (LB DIV) antenna module and a low-band multiple-input multiple-output (LB MIMO) antenna module 2. Another part of the cellular antenna modules in the electronic device 1, such as the LB MIMO antenna module 1 and the low-band main (LB Main) antenna module, may be arranged on the side where the second circuit board 15 is located. For these cellular antenna modules arranged on one side of the second circuit board 15, a cellular RF front end matching them may be arranged on the side of the second circuit board 15.

[0072] The electronic device 1 also includes a first cellular antenna (in this embodiment, the antenna may also be referred to as a radiator), and the first cellular antenna is used to realize the transmission and reception of cellular radio frequency signals. This embodiment does not limit the structural form of the first cellular antenna. For example, the first cellular antenna may be a slot antenna, a middle frame radiator, an LDS (Laser-Direct-Structuring) antenna, a PCB (Printed Circuit Board) antenna, a ceramic antenna, a patch antenna arranged on a circuit board, etc. The position of the first cellular antenna can be set as needed. For example, the first cellular antenna may be close to the first cellular radio frequency front end 123b. The first cellular antenna may include all cellular antennas in the electronic device 1; or, the first cellular antenna may include only a part of the cellular antennas in the electronic device 1, such as a low-frequency diversity antenna, a low-frequency MIMO antenna, a low-frequency main antenna, etc.

[0073] like Figure 6 As shown, a non-cellular antenna module 121 and a non-cellular RF front end 124 may also be arranged on the first circuit board 12. Wherein:

[0074] The non-cellular RF front end 124 is a non-cellular RF front end, which can be electrically connected to the GPS antenna module 121b, for example, through a transmission line (such as a coaxial line, a soft or hard board, etc.). The non-cellular RF front end 124 can be, for example, an LNA. The non-cellular RF front end 124 can amplify the weak RF signal received by the GPS antenna and minimize the introduction of noise, which can improve the receiving sensitivity of the RF transceiver. It is understandable that Figure 6Only one non-cellular RF front end 124 is shown, which is just an example and does not limit the actual number of non-cellular RF front ends 124. One or more non-cellular RF front ends 124 may be provided as required, and one non-cellular RF front end 124 is connected to one GPS antenna module.

[0075] The non-cellular antenna module 121 is used to transmit and receive non-cellular electromagnetic wave signals, which include but are not limited to Wi-Fi signals, Bluetooth signals, GNSS signals (such as GPS signals, Beidou navigation signals, etc.), NFC signals, FM signals, infrared signals, etc. The non-cellular antenna module 121 is used to connect the non-cellular RF front end 124 and the non-cellular antenna (described below), and is used to transmit RF signals between the non-cellular RF front end 124 and the non-cellular antenna, and may also have filtering and modulation functions. Schematically, the non-cellular antenna module 121 may include a transmission cable, a ground feed, a matching circuit, a matching device, etc.

[0076] Understandably, Figure 6 Only the Wi-Fi antenna module 121a and the GPS antenna module 121b are shown, which is only an example and does not limit the type and number of the non-cellular antenna module 121. Schematically, the Wi-Fi antenna module 121a may include a Wi-Fi 2.4GHz antenna module, a Wi-Fi 5GHz antenna module, a Wi-Fi 2.4GHz+5GHz antenna module (the same Wi-Fi antenna can work in the 2.4GHz and 5GHz frequency bands respectively), etc. Schematically, the GPS antenna module 121b may include a GPS L1 antenna module and a GPS L5 antenna module.

[0077] The electronic device 1 also includes a non-cellular antenna, which is used to transmit and receive non-cellular radio frequency signals. This embodiment does not limit the structural form of the non-cellular antenna. For example, the non-cellular antenna can be a slot antenna, a middle frame radiator, an LDS antenna, a PCB antenna, a ceramic antenna, a patch antenna arranged on a circuit board, etc. The position of the non-cellular antenna can be set as needed. For example, the non-cellular antenna can be close to the non-cellular radio frequency front end 124. The non-cellular antenna may include all non-cellular antennas in the electronic device 1; or, the non-cellular antenna may include only a part of the non-cellular antennas in the electronic device 1, such as a Wi-Fi antenna and a GPS antenna.

[0078] like Figure 6As shown, a non-cellular RF chip 152 and a non-cellular RF front end 151 may be arranged on the second circuit board 15, and the non-cellular RF chip 152 is electrically connected to the non-cellular RF front end 151. Corresponding to the cellular RF module, the non-cellular RF chip 152, the non-cellular RF front end 151 and the non-cellular antenna module 121 may be collectively referred to as a non-cellular RF module.

[0079] Corresponding to the first cellular RF chip 123a, the non-cellular RF chip 152 is also a RF transceiver, and the non-cellular RF chip 152 can be called an NC chip. The non-cellular RF chip 152 can control the non-cellular RF front end 151 to work.

[0080] The non-cellular RF front end 151 is connected between the non-cellular RF chip 152 and the Wi-Fi antenna module 121a. Schematically, the electrical connection between the non-cellular RF front end 151 and the Wi-Fi antenna module 121a can be achieved through a transmission line (such as a coaxial line, a soft and hard board, etc.). The non-cellular RF front end 151 is used to filter and amplify the Wi-Fi signal. The non-cellular RF front end 151 may include a transmitting end and a receiving end. The transmitting end may include components such as a power amplifier (PA), a duplexer or a multiplexer. The transmitting end may amplify and filter the weaker non-cellular RF signal generated by the non-cellular RF chip 152 during the signal transmission process. The receiving end may include devices such as a filter, an LNA, and an RF switch. The receiving end may amplify and filter the received non-cellular RF signal to a range suitable for the operation of the non-cellular RF chip 152 during the signal reception process.

[0081] Understandably, Figure 6 Only one non-cellular RF front end 151 is shown, which is only an example and does not limit the actual number of non-cellular RF front ends 151. One or more non-cellular RF front ends 151 can be provided as needed, and one non-cellular RF front end 151 is connected to one Wi-Fi antenna module. Multiple non-cellular RF front ends 151 can also form an n*n array (for example, a 2*2 array). Figure 6 As shown, the system-level chip 125 can be electrically connected to the first cellular RF chip 123a, and the first cellular RF front end 123b is electrically connected to the first cellular RF chip 123a and the first cellular antenna module 123c, thereby enabling the transmission and reception of cellular RF signals. The system-level chip 125 is also electrically connected to the non-cellular RF chip 152, and the non-cellular RF front end 151 is electrically connected to the non-cellular RF chip 152 and the Wi-Fi antenna module 121a, thereby enabling the transmission and reception of Wi-Fi signals. The non-cellular RF front end 124 is electrically connected to the non-cellular RF chip 152 and the GPS antenna module 121b, thereby enabling the transmission and reception of GPS signals.

[0082] The system-level chip 125 is one of the main heat sources in the electronic device 1. The first cellular RF chip 123a and the first cellular RF front end 123b, the non-cellular RF chip 152 and the non-cellular RF front end 151 in the cellular RF module 123 are also prone to generate heat. Figure 6 As shown, by making the system-level chip 125, the cellular RF module 123, the non-cellular antenna module 121 and the non-cellular RF front end 124 on the first circuit board 12, and making the non-cellular RF front end 151 and the non-cellular RF chip 152 on the second circuit board 15, the heat source can be dispersed and arranged on both sides of the electronic device 1 to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, there is no need to set a thermal conductive material between the main and auxiliary frames, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitor capacity. In particular, when the electronic device 1 is a small folding mobile phone with a small size and a relatively compact device layout, the heat source dispersion layout design of this embodiment can greatly improve the heat dissipation performance and heat distribution performance of the small folding mobile phone.

[0083] As described above, the solution of this embodiment can disperse the RF modules (including cellular RF modules and non-cellular RF modules) so that part of the RF modules are on one side of the first circuit board 12 and the other part of the RF modules are on the side of the second circuit board 15. Compared with the traditional centralized layout solution, the solution of this embodiment expands the available area of ​​the antenna, which is conducive to reducing antenna combining and combining devices (such as switches, matching modules, etc.), thereby reducing combining losses and improving conduction. Since the available area of ​​the antenna is expanded, it is also convenient to design n*n (for example, 8*8, 4*4, etc.) Wi-Fi solutions.

[0084] Figure 7 It is a schematic plan view of the arrangement of components on the first circuit board 22 and the second circuit board 25 in the electronic device 2 of the second embodiment.

[0085] like Figure 7 As shown, the first circuit board 22 may be provided with a system-level chip 222, a first cellular antenna module 221, a non-cellular radio frequency chip 223a, a non-cellular radio frequency front end 223b and a non-cellular antenna module 223c.

[0086] The first cellular antenna module 221 may include all cellular antenna modules in the electronic device 2, that is, all cellular antenna modules are arranged on the side where the first circuit board 22 is located. Alternatively, the first cellular antenna module 221 may include only a part of the cellular antenna modules in the electronic device 2. Schematically, the first cellular antenna module 221 may include an N77 module, an N79 module, and a mid / high band (MHB) module. The N77 module and the N79 module are both antenna modules for the 5G frequency band, and the MHB module may be an antenna module for the 2G frequency band, the 3G frequency band, and the 4G frequency band. The N77 module, the N79 module, and the MHB module may all be one module or include multiple modules. For example, the N77 module may include an N77-1 module, an N77-2 module, an N77-3 module, an N77-4 module, etc., the N79 module may include an N79-1 module, an N79-2 module, an N79-3 module, an N79-4 module, etc., and the MHB module may include an MHB-1 module, an MHB-2 module, an MHB-3 module, an MHB-4 module, etc.

[0087] Illustratively, the electronic device 2 may also include an LB DIV antenna module and an LB MIMO antenna module 2 located on one side of the first circuit board 22, and an LB MIMO antenna module 1, an MHB1 antenna module, and an LB Main antenna module located on one side of the second circuit board 25. For these cellular antenna modules, a cellular RF front end matching them may be arranged nearby.

[0088] The non-cellular RF chip 223a is electrically connected to the system-level chip 222, and the non-cellular RF front end 223b is electrically connected to the non-cellular RF chip 223a and the non-cellular antenna module 223c. The non-cellular RF chip 223a can be the same as or similar to the non-cellular RF chip 152 in the first embodiment, the non-cellular RF front end 223b can be the same as or similar to the non-cellular RF front end 151 in the first embodiment, and the non-cellular antenna module 223c can be the same as or similar to the non-cellular antenna module 121 in the first embodiment.

[0089] like Figure 7As shown, a power amplifier 251, a first cellular RF front end 252 and a first cellular RF chip 253 can be arranged on the second circuit board 25. The first cellular RF front end 252 is electrically connected to the first cellular antenna module 221 and the first cellular RF chip 253. High-speed signals can be transmitted between the first cellular RF front end 252 and the first cellular antenna module 221, and each first cellular antenna module and the first cellular RF front end 252 can be connected through a low-loss transmission line, including but not limited to a coaxial line. The first cellular RF front end 252 can be one or more. When there are multiple, one first cellular RF front end 252 is connected to one first cellular antenna module 221. The power amplifier (transiver) 251 can electrically connect the system-level chip 222 and the first cellular RF chip 253. The power amplifier 251 has a power amplification function, which can improve the problem of large signal loss across the axis. The power amplifier 251 may not be provided as needed.

[0090] like Figure 7 As shown, the system-level chip 222 is electrically connected to the first cellular RF chip 253, and the first cellular RF front end 252 is electrically connected to the first cellular RF chip 253 and the first cellular antenna module 221, thereby enabling the transmission and reception of cellular RF signals. The system-level chip 222 is also electrically connected to the non-cellular RF chip 223a, and the non-cellular RF front end 223b is electrically connected to the non-cellular RF chip 223a and the non-cellular antenna module 223c, thereby enabling the transmission and reception of non-cellular RF signals.

[0091] like Figure 7 As shown, the solution of the second embodiment is to make the system-level chip 222, the first cellular antenna module 221, the non-cellular radio frequency chip 223a, the non-cellular radio frequency front end 223b and the non-cellular antenna module 223c on the first circuit board 22, and the first cellular radio frequency front end 252 and the first cellular radio frequency chip 253 on the second circuit board 25, so that the heat source can be dispersed and arranged on both sides of the electronic device 2 to avoid heat concentration, which is beneficial to improve the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, there is no need to set a thermal conductive material between the main and auxiliary frames, thereby reducing costs, and it can save space, which is beneficial to increase the battery volume and improve the design value of the capacitance. In particular, when the electronic device 2 is a small folding mobile phone with a small size and a relatively compact device layout, the heat source dispersion layout design of this embodiment can greatly improve the heat dissipation performance and heat distribution performance of the small folding mobile phone.

[0092] As described above, the solution of this embodiment can disperse the RF modules (including cellular RF modules and non-cellular RF modules) so that part of the RF modules are on one side of the first circuit board 22 and the other part of the RF modules are on the side of the second circuit board 25. Compared with the traditional centralized layout solution, the solution of this embodiment expands the available area of ​​the antenna, which is conducive to reducing antenna combining and combining devices (such as switches, matching modules, etc.), thereby reducing combining losses and improving conduction. Since the available area of ​​the antenna is expanded, it is also convenient to design an n*n Wi-Fi solution.

[0093] Figure 8 It is a schematic plan view of the arrangement of components on the first circuit board 32 and the second circuit board 35 in the electronic device 3 of the third embodiment.

[0094] like Figure 8 As shown, the first circuit board 32 may be provided with a system-level chip 323, a power amplifier 322, a first cellular radio frequency module 321, a non-cellular radio frequency chip 324a, a non-cellular radio frequency front end 324b and a non-cellular antenna module 324c.

[0095] The first cellular RF module 321 can, for example, operate in the MHB frequency band. The first cellular RF module 321 can include a first cellular RF chip 321a, a first cellular RF front end 321b and a first cellular antenna module 321c. The power amplifier 322 electrically connects the system-level chip 323 and the first cellular RF chip 321a. The first cellular RF chip 321a electrically connects the power amplifier 322 and the first cellular RF front end 321b. The first cellular RF front end 321b electrically connects the first cellular RF chip 321a and the first cellular antenna module 321c. The first cellular antenna module 321c connects the first cellular RF front end 321b and the first cellular antenna. The power amplifier 322 has a power amplification function, which can improve the problem of large signal loss across the axis. The power amplifier 322 may not be provided as needed.

[0096] The non-cellular RF chip 324a is electrically connected to the system-level chip 323, and the non-cellular RF front end 324b is electrically connected to the non-cellular RF chip 324a and the non-cellular antenna module 324c. Figure 8As shown, a power amplifier 351 and a second cellular RF module 352 can be arranged on the second circuit board 35. The power amplifier 351 has a power amplification function, which can improve the problem of large signal loss across the axis. As needed, the power amplifier 351 may not be set. Schematically, the second cellular RF module 352 can operate in a low frequency (Low Band, LB) band. The second cellular RF module 352 may include a second cellular RF chip 352a, a second cellular RF front end 352b and a second cellular antenna module 352c, the power amplifier 351 is electrically connected to the system-level chip 323 and the second cellular RF chip 352a, the second cellular RF chip 352a is electrically connected to the power amplifier 322 and the second cellular RF front end 352b, and the second cellular RF front end 352b is electrically connected to the second cellular RF chip 352a and the second cellular antenna module 352c.

[0097] The electronic device 3 may also include a second cellular antenna, and the operating frequency band of the second cellular antenna may be different from that of the first cellular antenna. This embodiment does not limit the structural form of the second cellular antenna. For example, the second cellular antenna may be a slot antenna, a middle frame radiator, an LDS antenna, a PCB antenna, a ceramic antenna, a patch antenna arranged on a circuit board, etc. The position of the second cellular antenna can be set as needed. For example, the second cellular antenna can be close to the second cellular RF front end 352b. The second cellular antenna module 352c connects the second cellular RF front end 352b and the second cellular antenna.

[0098] In this embodiment, the first circuit board 32 and the second circuit board 35 can be connected by a flexible printed circuit (FPC), and the FPC can span the hinge 13. In order to reduce the trans-axis loss, an FPC with lower trans-axis loss can be customized. The trans-axis loss of the FPC can be, for example, between 1dB / 100mm and 2dB / 100mm, such as 1dB / 100mm, 1.5dB / 100mm or 2dB / 100mm, etc.; the length of the trans-axis FPC can also be reduced (for example, reducing it to less than 30mm). Alternatively, the SoC can be customized to increase the link differential mode insertion loss borne by the SoC to greater than or equal to 7dB (for example, 12dB). Alternatively, the first circuit board 32 and the second circuit board 35 can also communicate in the form of millimeter waves.

[0099] like Figure 8 As shown, on one side of the first circuit board 32, the first cellular RF module 321 can realize the transmission and reception of cellular RF signals in the MHB frequency band, and the non-cellular RF module can realize the transmission and reception of non-cellular RF signals. On one side of the second circuit board 35, the second cellular RF module 352 can realize the transmission and reception of cellular RF signals in the LB frequency band.

[0100] like Figure 8As shown, the scheme of embodiment three is to make the system-level chip 323, the first cellular radio frequency module 321, the non-cellular radio frequency chip 324a, the non-cellular radio frequency front end 324b and the non-cellular antenna module 324c on the first circuit board 22, and the second cellular radio frequency module 352 on the second circuit board 25, so that the heat source can be dispersed and arranged on both sides of the electronic device 3 to avoid heat concentration, which is beneficial to improve the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, there is no need to set a thermal conductive material between the main and auxiliary frames, thereby reducing costs, and it can save space, which is beneficial to increase the battery volume and improve the design value of the capacitance. In particular, when the electronic device 3 is a small folding mobile phone with a small size and a relatively compact device layout, the heat source dispersion layout design of this embodiment can greatly improve the heat dissipation performance and heat distribution performance of the small folding mobile phone.

[0101] In addition, since the space on one side of the first circuit board 32 is relatively ample, the available area of ​​the antenna is expanded, which is conducive to reducing antenna combining and combining devices (such as switches, matching modules, etc.), thereby reducing combining losses and improving conduction. Multiple Wi-Fi antenna solutions can be implemented, such as 4*4, 8*8 and other multi-Wi-Fi solutions, without the need for shared Wi-Fi.

[0102] Fig. 9 It is a schematic plan view of the arrangement of components on the second circuit board 42 and the first circuit board 45 in the electronic device 4 of the fourth embodiment.

[0103] like Fig. 9 As shown, a system-level chip 451 may be arranged on the first circuit board 45 .

[0104] like Fig. 9 As shown, a power amplifier 422, a first cellular RF module 421, a non-cellular RF chip 423a, a non-cellular RF front end 423b, a non-cellular antenna module 423c and a camera module 424 may be arranged on the second circuit board 42. Among them:

[0105] The power amplifier 422 is electrically connected to the system-level chip 451. The power amplifier 422 has a power amplification function, which can improve the problem of large signal loss across the axis. The power amplifier 422 may not be provided as required.

[0106] The first cellular RF module 421 may include a first cellular RF chip 421a, a first cellular RF front end 421b and a first cellular antenna module 421c. The first cellular RF chip 421a is electrically connected to the power amplifier 422 and the first cellular RF front end 421b. The first cellular RF front end 421b is electrically connected to the first cellular RF chip 421a and the first cellular antenna module 421c.

[0107] The first cellular RF front end 421b may include all cellular RF front ends in the electronic device 4, that is, all cellular RF front ends in the electronic device 4 may be arranged on the second circuit board 42. Alternatively, the first cellular RF front end 421b may include only a portion of the cellular RF front ends in the electronic device 4, and the other portion of the cellular RF front ends may be arranged on the first circuit board 45.

[0108] The first cellular antenna module 421c may include all cellular antenna modules in the electronic device 4, that is, all cellular antenna modules are arranged on the side where the second circuit board 42 is located. Alternatively, the first cellular antenna module 421c may include only a portion of the cellular antenna modules in the electronic device 4, for example, including the LB DIV antenna module, the LB MIMO antenna module 2, etc. Another portion of the cellular antenna modules in the electronic device 4, such as the LB MIMO antenna module 1, the LB Main antenna module, etc., may be arranged on the side where the first circuit board 45 is located. For these cellular antenna modules arranged on one side of the first circuit board 45, a cellular RF front end matching therewith may be arranged on the side of the first circuit board 45.

[0109] The non-cellular RF chip 423a is electrically connected to the system-level chip 451 and the non-cellular RF front end 423b, and the non-cellular RF front end 423b is electrically connected to the non-cellular RF chip 423a and the non-cellular antenna module 423c.

[0110] The camera module 424 is electrically connected to the system-level chip 451. Schematically, the camera module 424 can be electrically connected to the system-level chip 451 through an FPC with low transaxial loss, and high-speed signals are transmitted between the camera module 424 and the system-level chip 451. The transaxial loss of the FPC can be, for example, between 1dB / 100mm and 2dB / 100mm, such as 1dB / 100mm, 1.5dB / 100mm or 2dB / 100mm.

[0111] In this embodiment, the first circuit board 45 and the second circuit board 42 can be connected by an FPC, and the FPC can span the hinge 13. In order to reduce the trans-axis loss, an FPC with lower trans-axis loss can be customized. The trans-axis loss of the FPC can be, for example, between 1dB / 100mm and 2dB / 100mm, such as 1dB / 100mm, 1.5dB / 100mm or 2dB / 100mm; the length of the trans-axis FPC can also be reduced (for example, reducing it to less than 30mm). Alternatively, the SoC can be customized to increase the link differential mode insertion loss borne by the SoC to greater than or equal to 7dB (for example, 12dB). Alternatively, the first circuit board 45 and the second circuit board 42 can also communicate in the form of millimeter waves.

[0112] like Fig. 9As shown, the scheme of embodiment 4 is to place the system-level chip 451 on the first circuit board 45, and arrange the first cellular radio frequency module 421 and the non-cellular radio frequency module on the second circuit board 42, so that other heat sources can be isolated from the system-level chip 451 as the main heat source, avoiding heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, there is no need to set a thermal conductive material between the main and auxiliary frames, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitor capacity. In particular, when the electronic device 4 is a small folding mobile phone with a small size and a relatively compact device layout, the heat source dispersion layout design of this embodiment can greatly improve the heat dissipation performance and heat distribution performance of the small folding mobile phone.

[0113] As described above, the solution of this embodiment makes the available area on one side of the first circuit board 45 larger, and the space on one side of the first circuit board 45 can be fully utilized to arrange the antenna, which is conducive to reducing antenna combining and combining devices (such as switches, matching modules, etc.), thereby reducing combining losses and improving conduction. Since the available area of ​​the antenna is expanded, it is also convenient to design an n*nWi-Fi solution.

[0114] Fig.10a This is a schematic plan view of the arrangement of components on the first circuit board 53 and the second circuit board 51 in the electronic device 5 in an implementation manner of the fifth embodiment. Schematically, the electronic device 5 may be a large foldable mobile phone.

[0115] like Fig.10a As shown, a transverse center line L1 and a longitudinal center line L2 may be defined in the electronic device 5. The longitudinal center line L2 may be parallel to the hinge 13, and the electronic device 5 may be symmetrical about the longitudinal center line L2. The transverse center line L1 may be perpendicular to the longitudinal center line L2, and the electronic device 5 may be symmetrical about the transverse center line L1. The transverse center line L1 and the longitudinal center line L2 intersect vertically and horizontally, dividing the electronic device 5 into four areas.

[0116] like Fig.10a As shown, a system-level chip 532, a non-cellular antenna module 531, a non-cellular RF front end 533, and a non-cellular RF chip 534 can be arranged on the first circuit board 53. Among them, the system-level chip 532 and the non-cellular antenna module 531 can be arranged in the area of ​​the upper right corner, and the non-cellular RF front end 533 and the non-cellular RF chip 534 can be arranged in the area of ​​the lower right corner. The system-level chip 532 is electrically connected to the non-cellular RF chip 534, and the non-cellular RF front end 533 is electrically connected to the non-cellular RF chip 534 and the non-cellular antenna module 531. The non-cellular RF module located on one side of the first circuit board 53 can realize the transmission and reception of non-cellular RF signals.

[0117] like Fig.10aAs shown, the first cellular antenna module 511, the first cellular RF front end 512 and the first cellular RF chip 513 may be arranged on the second circuit board 51. The first cellular antenna module 511, the first cellular RF front end 512 and the first cellular RF chip 513 may be located in the upper left corner.

[0118] like Fig.10a As shown, the scheme of embodiment 5 arranges the system-level chip 532, the non-cellular antenna module 531, the non-cellular RF front end 533 and the non-cellular RF chip 534 on one side of the first circuit board 53, and arranges the first cellular antenna module 511, the first cellular RF front end 512 and the first cellular RF chip 513 on one side of the second circuit board 51, so that the heat source can be dispersed on both sides of the electronic device 5 to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole machine. As an example, the system-level chip 532 and the non-cellular antenna module 531 are distributed on one side of the first circuit board 53, and the non-cellular RF front end 533 and the non-cellular RF chip 534 are distributed on the other side of the first circuit board 53, which can further disperse the heat source and enhance the heat dissipation performance and heat distribution performance of the whole machine. Furthermore, it is not necessary to set a thermal conductive material between the main and sub-frames, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance.

[0119] based on Fig.10a As shown, in Fig.10b In the illustrated embodiment, the electronic device 5 may further include a first power management chip 535 and a second power management chip 514. The first power management chip 535 may be arranged at the lower right corner of the first circuit board 53, the first power management chip 535 is electrically connected to the system-level chip 532, and the first power management chip 535 is used to manage the battery on one side of the first circuit board 53. The second power management chip 514 may be arranged at the lower left corner of the second circuit board 51, the second power management chip 514 is electrically connected to the system-level chip 532, and the second power management chip 514 is used to manage the battery on one side of the second circuit board 51.

[0120] Fig.10b In the embodiment shown, by dispersing the first power management chip 535 and the second power management chip 514 and distributing the first power management chip 535 and the system-level chip 532 on both sides of the first circuit board 53, respectively, the heat source can be dispersed to optimize the heat dissipation and heat distribution performance of the whole machine.

[0121] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: It includes a first circuit board, a second circuit board, a first cellular radio frequency front end, a non-cellular radio frequency front end and a system-level chip; The first circuit board and the second circuit board are arranged at an interval, and the first circuit board and the second circuit board are connected in circuit; One of the first cellular RF front end and the non-cellular RF front end is arranged on the first circuit board, and the other is arranged on the second circuit board, or both the first cellular RF front end and the non-cellular RF front end are arranged on the second circuit board; The system-level chip is arranged on the first circuit board and is electrically connected to both the first cellular radio frequency front end and the non-cellular radio frequency front end.

2. The electronic device according to claim 1, characterized in that: The electronic device further includes a non-cellular antenna module, which is arranged on the first circuit board or the second circuit board, and is electrically connected to the non-cellular radio frequency front end.

3. The electronic device according to claim 2, characterized in that: The electronic device also includes a non-cellular radio frequency chip, which is arranged on the first circuit board or the second circuit board, and is electrically connected to the non-cellular antenna module; the system-level chip is electrically connected to the non-cellular radio frequency chip.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device further includes a first cellular antenna module, which is arranged on the first circuit board or the second circuit board, and is electrically connected to the first cellular radio frequency front end.

5. The electronic device according to claim 4, characterized in that: The electronic device further includes a first cellular radio frequency chip, which is arranged on the first circuit board or the second circuit board, and is electrically connected to the first cellular antenna module; The system-level chip is electrically connected to the first cellular radio frequency chip.

6. The electronic device according to claim 3, characterized in that: The electronic device also includes a first cellular radio frequency chip and a first cellular antenna module, the first cellular radio frequency chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular radio frequency front end, the first cellular radio frequency chip, the first cellular antenna module, the first cellular radio frequency front end and the non-cellular antenna module are all arranged on the first circuit board, the non-cellular radio frequency chip and the non-cellular radio frequency front end are both arranged on the second circuit board; the system-level chip is electrically connected to the first cellular radio frequency chip.

7. The electronic device according to claim 3, characterized in that: The electronic device also includes a first cellular radio frequency chip and a first cellular antenna module, the first cellular radio frequency chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular radio frequency front end, the first cellular antenna module, the non-cellular radio frequency chip, the non-cellular antenna module and the non-cellular radio frequency front end are all arranged on the first circuit board, the first cellular radio frequency chip and the first cellular radio frequency front end are both arranged on the second circuit board; the system-level chip is electrically connected to the first cellular radio frequency chip.

8. The electronic device according to claim 7, characterized in that: The first cellular antenna module includes an N77 module, an N79 module and a medium-high frequency MHB module; The electronic device further includes a power amplifier, and the system-level chip is electrically connected to the first cellular radio frequency chip via the power amplifier.

9. The electronic device according to claim 3, characterized in that: The electronic device also includes a first cellular RF chip, a first cellular antenna module, a second cellular RF chip, a second cellular RF front end, and a second cellular antenna module. The first cellular RF chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular RF front end, the second cellular RF chip is electrically connected to the second cellular antenna module, and the second cellular antenna module is electrically connected to the second cellular RF front end. The first cellular RF chip, the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, and the non-cellular RF front end are all arranged on the first circuit board, and the second cellular RF chip, the second cellular RF front end, and the second cellular antenna module are all arranged on the second circuit board; the system-level chip is electrically connected to the first cellular RF chip and the second cellular RF chip.

10. The electronic device according to claim 9, characterized in that: The electronic device further comprises a first power amplifier disposed on the first circuit board, and the system-level chip is electrically connected to the first cellular radio frequency chip via the first power amplifier; And / or, the electronic device further includes a second power amplifier disposed on the second circuit board, and the system-level chip is electrically connected to the second cellular radio frequency chip via the second power amplifier.

11. The electronic device according to claim 3, characterized in that: The electronic device also includes a first cellular RF chip and a first cellular antenna module, the first cellular RF chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular RF front end, and the first cellular RF chip, the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular RF front end and the non-cellular antenna module are all arranged on the second circuit board.

12. The electronic device according to claim 11, characterized in that: The electronic device further includes a third power amplifier disposed on the second circuit board, and the system-level chip is electrically connected to the first cellular radio frequency chip via the third power amplifier.

13. The electronic device according to claim 11 or 12, characterized in that: The electronic device further includes a camera module, which is arranged on the second circuit board. The camera module is electrically connected to the system-level chip via a flexible circuit board, and the trans-axis loss of the flexible circuit board is 1 dB / 100 mm to 2 dB / 100 mm.

14. The electronic device according to claim 3, characterized in that: The non-cellular radio frequency chip, the non-cellular radio frequency front end, the non-cellular antenna module and the system-level chip are all arranged on the first circuit board; The electronic device further includes a first cellular radio frequency chip and a first cellular antenna module, wherein the first cellular radio frequency chip and the first cellular antenna module are both arranged on the second circuit board, and the first cellular radio frequency chip is electrically connected to the first cellular antenna module; The system-level chip is electrically connected to the first cellular radio frequency chip.

15. The electronic device according to claim 14, characterized in that: The electronic device also includes a first power management chip and a second power management chip. The first power management chip is arranged on the first circuit board and electrically connected to the system-level chip. The second power management chip is arranged on the second circuit board and electrically connected to the system-level chip.

16. An electronic device, characterized in that: It comprises a housing and the electronic device according to any one of claims 1 to 15, wherein the electronic device is installed in the housing.

17. The electronic device according to claim 16, characterized in that: The housing includes a first housing and a second housing, and the electronic device further includes a hinge, the hinge connecting the first housing and the second housing, the hinge being used to generate a mechanical movement to make the first housing and the second housing rotate relative to each other, so that the electronic device can be folded or unfolded; The first circuit board is installed in the first shell, and the second circuit board is installed in the second shell.

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