Insulation of elements on printed circuit board

Abstract

The invention relates to a device for insulating electronic components, comprising: a printed circuit board; an electronic component disposed on a surface of the printed circuit board; a printed circuit board includes an electronic component, a stiffener configured and arranged to at least partially surround the electronic component, where the stiffener is arranged on a surface of the printed circuit board, and where the stiffener is configured and arranged to insulate the electronic component with respect to the surroundings.

Description

Technical Field

[0001] The invention relates to a device for insulating electronic components on a printed circuit board. The invention also relates to a method for insulating electronic components on a printed circuit board and the use of the device in an electric vehicle. Background Art

[0002] In order to ensure that the components mounted (for example, soldered) on the circuit board can achieve specific functions, these components need to be electrically isolated from the surrounding environment by insulating materials. The insulating material can be a solidified material here. However, when applying such insulating materials, it may flow uncontrollably, thereby crosslinking and curing in unexpected areas and isolating them. Due to this unexpected flow, process uncertainties may occur, for example, components must be arranged on the circuit board with a large spacing tolerance. In other words, the maximum flow distance that the insulating material can reach from the component to be isolated must be taken into account. In addition, the layer thickness of the insulating material on the component and the circuit board may be different from each other, which will result in lower insulation strength. In addition, when using high-viscosity insulating materials, the insulating material itself is prone to form bubbles. These bubbles may cause partial discharges, which may lead to the failure of the insulating material during the service life of the component. Due to the corresponding application of insulating materials, some electronic components cannot be directly pressed, but this is necessary for ideal heat conduction between the component and the circuit board.

[0003] There are various possible approaches to this problem, such as creating barriers for insulating materials or using printed components, embedding sensors in circuit boards or using prefabricated insulating plates or films. Most of these different possible approaches require additional processes and additional materials, which significantly increase the workload and working time. In addition, there is the problem that these possible approaches usually result in reduced measurement accuracy of electronic components and greater errors in component positioning. For this reason, additional complex manufacturing and / or process steps usually have to be provided in the prior art and / or lower measurement accuracy must be accepted.

[0004] There is therefore a need for an improved apparatus for insulating one or more components on a circuit board that can provide more accurate positioning of the components on the printed circuit board and better insulation performance. Summary of the invention

[0005] The object of the present invention is therefore to provide better insulation of electronic components on a printed circuit board using structurally as simple as possible means, thereby at least partially solving the above-mentioned problems.

[0006] This object is achieved by the subject matter of the independent claim. Advantageous developments of the invention are indicated in the dependent claims, the description and the drawings.

[0007] The embodiments are also applicable to a method for insulating an electronic component on a printed circuit board (or circuit board), and a device for insulating an electronic component on a circuit board and uses of the device. Although not described in detail, various combinations of the embodiments may produce synergistic effects.

[0008] According to one aspect of the present invention, a device for insulating electronic components is provided, which has a printed circuit board, electronic components arranged on a surface of the printed circuit board, and a reinforcement member configured and arranged to at least partially surround the electronic components, wherein the reinforcement member is arranged on the surface of the printed circuit board, and wherein the reinforcement member is configured and arranged to insulate the electronic components relative to the surrounding environment.

[0009] In other words, the device comprises a circuit board, electronic components arranged on the circuit board, and a reinforcement member partially surrounding the electronic components, wherein the reinforcement member serves as an insulator / insulation and partially insulates the electronic components. Here, the electronic components and the reinforcement member are arranged on a surface of the printed circuit board, wherein the two components are arranged on the same surface of the printed circuit board, that is, on the same face of the printed circuit board. The reinforcement member at least partially surrounds the electronic components, wherein at least one or more sides can be surrounded by the electronic components. For example, the lowest surface of the electronic component is exposed toward the circuit board so that contact with the circuit board can be established. In addition, the reinforcement member can be exposed toward one or more sides around the electronic components, so that these sides are freely accessible. However, it is not excluded that the electronic components are completely surrounded. Other possible implementations will be explained in the following embodiments.

[0010] "Insulating the electronic component from its surroundings" may in particular mean that the electronic component is isolated from other electronic components arranged on or near the printed circuit board or located there. It may also mean that the electronic component is isolated from other potentials generated by other electronic components (such as the wiring harness in an electric vehicle). The surroundings of the electronic component are in particular the surrounding area of ​​the printed circuit board, which is subject to electronic or magnetic interference from other components and thus affects the electronic component. The electronic component should be protected from said interference by the insulation according to the invention, and its influence on the electronic component should be reduced, so that, for example, a higher measurement accuracy of the electronic component can be provided.

[0011] By means of the device of the present invention, the insulation of electronic components can be provided by simple structural means. It is therefore easier to comply with component boundary tolerances, so that better tolerance ranges, i.e., for example, smaller tolerance ranges, can be selected and implemented for the design and installation of electronic components. For example, the insulated components can be placed closer to the edge of the flexible printed circuit board. At the same time, the height of the reinforcement can more easily ensure the overlapping height above the electronic components. Advantageously, the material selection range of the insulating material can be expanded by the selected reinforcement, i.e., it is no longer limited to viscous insulating materials, and even ambient air can be used as an insulating material, for example. Another advantage of the device of the present invention is that the reinforcement can be used as a mechanical fastener for a circuit board (such as a flexible circuit board, so-called FPC) at the same time. This also allows the circuit board, in particular the flexible circuit board, to be directly pressed by means of a soft component above the cast and insulated electronic component. This will be explained in more detail in one of the following embodiments.

[0012] The reinforcement element at least partially surrounds the electronic component in such a way that the electronic component can still be connected to the circuit board despite being (partially) insulated by means of the reinforcement element. The reinforcement element surrounds the electronic component in particular on the sides thereof, i.e. the top side and / or the bottom side opposite thereto are not surrounded by the electronic component, i.e. there is no reinforcement element. The reinforcement element is arranged at a certain distance from the electronic component, wherein the size of the reinforcement element is adapted to the electronic component and the place of use, i.e. the required insulation properties. This ensures that the electronic component can be easily arranged during the manufacture of the device.

[0013] In one embodiment of the invention, the reinforcement may have a recess in which the electronic component may be arranged. The recess may in particular surround the electronic component at least on one or more sides. The recess may allow access to the electronic component from above, so that the electronic component can be easily added during the device manufacturing process. The recess may be adapted to the shape of the electronic component, i.e. the recess may be designed to be rectangular, square, oval or circular, wherein it is not necessary to be restricted to a specific shape.

[0014] In one embodiment of the present invention, the recess may extend from a first side of the reinforcement to a second side of the reinforcement opposite to the first side. In other words, the recess may penetrate the reinforcement, wherein the recess at least partially surrounds the electronic component. The recess may, for example, be a hole that passes through the reinforcement, the hole extending vertically and / or at a specified angle relative to the surface of the printed circuit board on which the electronic components are arranged. For example, when the recess is made with a conical milling cutter, an inclined side surface may also be formed. In other words, the reinforcement may extend outwardly from the surface of the printed circuit board on which the components are arranged in the vertical direction. Extension in the vertical direction is not limited to a strictly vertical extension, i.e., an extension at a right angle, and therefore the reinforcement may also extend outwardly from the printed circuit board obliquely, i.e., at an oblique angle, in the vertical direction.

[0015] In one embodiment of the present invention, the reinforcement can surround the electronic component at least on one or more sides of the electronic component, and the side extends in a vertical direction or at a specified angle relative to the surface of the electronic component placed on the printed circuit board. This ensures that these components can be contacted by the insulating material from above, and the reinforcement can be used as an insulating material barrier on the side of the electronic component. If the recess is designed as a hole, the recess and the reinforcement thus completely surround the side of the electronic component. On the other hand, the recess can also be provided as a side recess on the reinforcement, so that the recess is open to the circuit board environment on at least one side, for example, a U-shaped recess. The shape of the recess and the side of the electronic component surrounded by the recess are not limited to the above-mentioned specific embodiments. Depending on the application, the recess and its structural shape can be selected accordingly.

[0016] In one embodiment of the present invention, the printed circuit board may be a multilayer printed circuit board. The multilayer printed circuit board may, for example, consist of at least a bottom layer, a top layer and one or more conductive layers, wherein the one or more conductive layers are arranged between the bottom layer and the top layer. Here, the layers of the printed circuit board are not limited to the above arrangement. Depending on the requirements for the printed circuit board and the electronic components to be positioned thereon, more or fewer layers may be provided.

[0017] In one embodiment of the present invention, the conductive layer may be, for example, a copper layer, wherein the conductive layer is not limited to this specific material. This means that other corresponding conductive materials may also be used for the conductive layer.

[0018] In one embodiment of the invention, the element can be arranged on the top layer and in particular the element can be connected to the conductive layer via the top layer. On the other hand, the element can be arranged on the bottom layer and can be connected to the conductive layer via the bottom layer. In the device of the invention, the conductive layer is, for example, provided for contacting with electronic components. The top layer can therefore be correspondingly absent, that is, it can be correspondingly left empty in the circuit board manufacturing method, so that the conductive layer is exposed in the area where the electronic components are provided and is available and designated for fixing the electronic components, for example by means of soldering. On the other hand, other contact connections such as metal wires, pins, etc. can also extend from the conductive layer through the bottom / top layer to connect the conductive layer to the electronic components.

[0019] In one embodiment of the invention, the electronic component can be a sensor, which can in particular be a temperature sensor for detecting heat sources in the vicinity of the device. With the aid of the device construction according to the invention, a sensor arranged very close to the edge of a circuit board (such as a flexible circuit board) can be electrically insulated very accurately with the aid of an insulating material such as a Glop Top. Uncontrolled flows of insulating material are prevented with the aid of recesses and uncertain layer thicknesses above the sensor can be avoided. For example, as an electronic component in the device according to the invention, a temperature sensor can ensure a very high dynamic response to the measurable temperature of the outer surface. Here, the surface to be measured can have a high voltage potential, which is electrically insulated from the sensor by the circuit board, in particular the flexible circuit board and the reinforcement and / or the insulating material, so that its measurement is hardly affected.

[0020] In one embodiment of the present invention, the printed circuit board is a flexible printed circuit board. In particular, the printed circuit board is a so-called FPC. In the case of a thick printed circuit board, the heat conduction path from the bottom of the printed circuit board to the electronic components such as the temperature sensor is longer. That is, when the temperature changes rapidly, this is difficult to detect. Therefore, the dynamic response characteristics of the temperature sensor are limited by the thickness of the printed circuit board. That is, a short conduction path is required to track the dynamic changes of temperature fluctuations. This can be solved by using a flexible printed circuit board because its layered structure is thinner.

[0021] In one embodiment of the present invention, the device may also have a force-applying member, which is arranged on the reinforcement member and configured to apply force to the reinforcement member so that the device can be pressed against the element to be measured. With the help of the force-applying member, mechanical force can be applied without affecting the electronic components (such as sensors) or the insulating materials very close to the sensors. The application of mechanical force can be achieved by means of a reinforcement member directly next to the sensor or directly above the sensor. During this period, the sensor will not be subjected to any mechanical force because the force is directly applied to the reinforcement member. Mechanically pressing the sensor to a specified surface in a stress-free manner while achieving electrical insulation with the help of insulating materials is a specific state, which allows better sensor insulation and at the same time allows higher measurement accuracy and better sensor positioning possibilities. Through the force-applying member, the device of the present invention can be pressed against the element to be measured, such as a surface or another external element. The force-applying member can be installed (i.e. fixed) on the reinforcement member in a force-transmitting fit, a shape fit or a material joint.

[0022] For example, a mechanical force can be introduced into the reinforcement by means of a force-fit connection so that the device is moved toward the element to be measured. Thus, for example, a zero gap can be formed with a heat source to be measured as the element to be measured, which improves the measurement accuracy when a temperature sensor is used as an electronic component.

[0023] As the force-applying member, for example, one or more screws, one or more rivets, one or more mechanical springs, or one or more bending clips can be provided. The elements mentioned here are merely exemplary and need not be limited thereto. Any element capable of applying force can be used in the device of the present invention. For example, the bolt connection of the member to be reinforced at the surface to be tested or other surrounding positions can be used as a force-transmitting member. In addition, the elastic member can be supported on a housing in which the device is built or on another component near the device and thus transmit force to the reinforcement member. In addition, as the force-applying member, heat riveting similar to riveting the reinforcement member on the surface to be tested and / or connecting with a hook or a similar device for mechanical form matching can also be used.

[0024] In one embodiment of the present invention, the force can be applied by the force applying member perpendicular to the member to be strengthened. In other words, the force to be applied can always have at least a vertical component oriented toward the member to be strengthened. This ensures the precise position of the electronic component relative to the member to be measured.

[0025] In one embodiment of the invention, the electronic components can be arranged at a close distance from the edge of the printed circuit board, wherein the distance is in particular in the range of 0.5 mm to 30 mm, more particularly in the range of 0.5 mm to 10 mm. By means of the device according to the invention and the arrangement of the printed circuit board, the reinforcement and the electronic components relative to each other, the electronic components can thus be arranged closer to the edge of the printed circuit board. This results, for example, in better accessibility of the electronic components and in material savings due to the miniaturization of the printed circuit board. The distance of the electronic components from the edge of the printed circuit board depends, for example, on the way in which the insulation and / or reinforcement of the electronic components are manufactured.

[0026] In one embodiment of the present invention, the reinforcement member may also have an insulating material, which is configured and arranged to insulate the electronic components from the surrounding environment. Such additional insulating material may further improve the insulation performance of the device of the present invention.

[0027] In one embodiment of the invention, the insulating material can at least partially surround the electronic component. The electronic component is thereby correspondingly insulated from the external environment. In particular, the insulating material surrounds the electronic component from the side and from above. That is, the electronic component remains free of insulating material at least on its side in contact with the printed circuit board or on its side arranged on the surface of the circuit board.

[0028] In one embodiment of the present invention, the insulating material may be arranged in the recess and may at least partially fill the recess. In other words, the recess may be completely or only partially filled with the insulating material. That is, the electronic component may be partially or completely surrounded by the insulating material and thus covered by it.

[0029] In one embodiment of the present invention, the insulating material may be a liquid insulating material and / or a viscous insulating material and / or a solidified insulating material. Advantageously, by using a reinforcement that can act as a barrier to the insulating material, there is no restriction to a specific insulating material. By means of the reinforcement, the material options for the insulating material can be increased, and insulating materials with other fluid properties can also be used. In addition, when using liquid materials, uncontrolled flow can be prevented by the reinforcement. Furthermore, compared to viscous insulating materials, when using liquid insulating materials, bubbles may be less likely to form in the insulating material, which in turn reduces local discharges within the bubbles and improves the insulating capacity over the entire life span. With the present device, it is now also possible to use a thin liquid insulating material, thereby significantly improving the insulating properties. Therefore, the insulating properties of the device of the present invention are improved overall.

[0030] At the same time, the height of the reinforcement can be used in cooperation with the recess to more easily ensure the insulation material overlap height above the electronic components. By better applying and positioning the insulation material above the electronic components, it can be ensured that the insulation material height above the electronic components is constant and uncontrolled flows and the resulting different insulation material layer thicknesses are reduced. This also improves the insulation performance of the device of the invention in terms of high voltages on the circuit board and the risk of flashover.

[0031] In one embodiment of the invention, the recess of the reinforcement can be completely filled with insulating material and / or the element can be completely surrounded by insulating material on the sides and above the electronic component. For example, the insulating material surrounds the top side of the electronic component, and in the case of a rectangular electronic component, all four sides of the electronic component, so that only the bottom side of the electronic component remains exposed and the electronic component can be in contact with the circuit board, in particular the conductive layer, on the bottom side. For example, the insulating material can also be a so-called Glop Top package.

[0032] According to one aspect of the present invention, the device for insulating electronic components according to one of the embodiments can be used in a charging path of an electric vehicle. In particular, the device can be used in a charging socket, wherein the charging socket can be an interface between the electric vehicle and, for example, an external charging pile or socket. In particular, the device can be used in a charging path from a charging infrastructure to a battery in an electric vehicle.

[0033] According to one aspect of the invention, the device of the invention can be arranged, for example, in a charging socket. According to this exemplary use, the temperature sensor on the flexible printed circuit board is pressed down onto the pin piece of the charging socket pin by means of a reinforcement. This ensures a heat conduction path from the pin piece to the temperature sensor. The high voltage potential of the charging pin is effectively isolated from the temperature sensor by the flexible printed circuit board and the insulating material. Since the surface of the reinforcement is designed to be large enough, mechanical adjustment can be carried out very easily. In this example, the mechanical pressing can be achieved by a threaded connection to a section of the housing of the charging socket internally.

[0034] According to another aspect of the present invention, a method for insulating electronic components on a printed circuit board is provided, wherein the method comprises the following steps: providing a printed circuit board; placing a reinforcement member on a surface of the printed circuit board, the reinforcement member at least partially surrounding the electronic components; arranging the electronic components on the surface of the printed circuit board, wherein the reinforcement member insulates the electronic components from the surrounding environment.

[0035] Other possible method steps that the method may be supplemented with are, for example, adding or generating a recess in the reinforcement, providing a force-applying member arranged on the reinforcement, providing an electrically conductive contact connection between the printed circuit board and the electronic component. It should be noted that the method may be supplemented with corresponding method steps similar to the above-mentioned embodiments related to the device.

[0036] It should also be noted that all method-related embodiments of the present invention can be performed in the order of steps described. However, this is not necessarily the only possible necessary order of the method steps. Unless otherwise explicitly stated below, the methods described herein can perform the disclosed steps in other orders without violating the corresponding embodiments of the method.

[0037] The printed circuit board used in the device according to the invention and the method according to the invention can be a prefabricated printed circuit board, in particular a flexible printed circuit board. The method can also have upstream steps, which include the assembly of the flexible printed circuit board, until the desired flexible printed circuit board is manufactured. The above method steps can then be performed.

[0038] In this context, an electronic component is understood to be any component that can be mounted on a circuit board. This refers in particular to electronic components that can measure properties of the surroundings and / or of the circuit board and / or of the component itself or of other components. Non-exhaustive examples include in particular temperature sensors, strain gauges, piezoelectric elements and heating surfaces.

[0039] It should be noted that more than one electronic component can also be used in the device of the present invention. Therefore, the shape and design of the reinforcement are adjusted so that, for example, a corresponding number of recesses and insulating material are provided in the reinforcement depending on the number of components, wherein the number of components and the number of recesses depend on the selected embodiment.

[0040] Further features, advantages and possible uses of the invention emerge from the following description of advantageous embodiments and from the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Advantageous embodiments of the invention will be explained below with reference to the accompanying drawings, in which:

[0042] Figure 1 A schematic diagram showing an apparatus according to one embodiment of the present invention,

[0043] Figure 2 A schematic cross-sectional view showing an exemplary device according to one embodiment of the present invention,

[0044] Figure 3 Show Figure 2 An enlarged cross-sectional schematic diagram of an exemplary device.

[0045] These figures are only schematic and serve only to explain the invention. Identical or identically acting components are always provided with the same reference numerals. DETAILED DESCRIPTION

[0046] Figure 1 A schematic cross-sectional view of an exemplary device 100 according to one embodiment of the present invention is shown. The device 100 for insulating an electronic component 102 comprises: a printed circuit board 101; an electronic component 102 arranged on a surface of the printed circuit board 101; and a member 104 to be reinforced which is configured and arranged to at least partially surround the electronic component 102, wherein the reinforcement member 104 is arranged on the surface of the printed circuit board 101. In addition, the device 100 comprises an insulating material 103 which is configured and arranged to insulate the electronic component 102 relative to the surroundings. The insulating material 103 may also be omitted, so that only the reinforcement member 104 is used to insulate the electronic component 102 as its insulation. As shown in FIG. Figure 1As can be seen in the figure, the electronic component 102 is arranged in a recess 110 and is surrounded by the part 104 to be reinforced at least on the side, which extends perpendicularly to the surface of the electronic component 102 arranged on the printed circuit board 101. That is, the electronic component 102 can be approached from above. In particular, the electronic component 102 can be applied with insulating material 103 from above, so that the insulating material 103 is also located in the recess 110 of the part 104 to be reinforced. The electronic component contacts the conductive layer 105. According to this embodiment, two conductive layers 105 are arranged side by side in parallel in one plane in order to form corresponding conductor tracks to the electronic component 102. The electronic component 102 is, for example, a rectangular temperature sensor, wherein the shape of the recess 110 is matched to the temperature sensor 102. The recess 110 is almost completely filled with the insulating material 103, in particular in such a way that the surface of the insulating material 103, which is opposite to the surface of the printed circuit board 101, is located in the same plane as the surface of the reinforcement 104. In the exemplary embodiment shown here, the recess 110 and the reinforcing member 104 surround the electronic component 102 from four sides. That is, the top side and the bottom side of the electronic component 102 are left open and are not surrounded by the recess 110 and the reinforcing member 104.

[0047] Figure 2 1 shows a schematic cross-sectional view of an exemplary device according to one embodiment of the present invention. In the figure, it can be seen that the insulating material 103 is not completely filled to the upper edge of the reinforcement 104, that is, it only partially fills the recess 110. However, the insulating material 103 covers the electronic component 102 from the top side and the side perpendicular to the top side of the printed circuit board 101. Figure 2 The force to be applied is shown by dashed lines in FIG. 1 , which can be generated by means of the above-mentioned embodiments involving the force-applying member. For example, a screw can be screwed into the reinforcement member 104 , wherein the screw can be located near the recess 110 .

[0048] Figure 3 Show Figure 2 An enlarged cross-sectional schematic diagram of an exemplary device. Figure 3 In particular, the enlargement is such that the individual layers of the printed circuit board 101 can be seen. In this embodiment, it is therefore a multilayer printed circuit board 101, which consists of at least three layers. These three layers are a bottom layer 307, a top layer 306 and a conductive layer 305 located between these two layers. Depending on the selected embodiment, the printed circuit board 101 can also include more than three layers and the arrangement of the conductive layer 305 can differ from the arrangement shown.

[0049] Although the present invention has been shown and described in detail in the figures and the above description, these figures and descriptions should be understood as exemplary or exemplary and should not be considered as limiting. The present invention is not limited to the disclosed embodiments. Other changes to the disclosed embodiments can be understood and implemented by those skilled in the art who implement the claimed invention in conjunction with the figures, the disclosure and the dependent claims.

[0050] It should be added that "comprising" does not exclude other elements or steps, and "one" or "an" does not exclude a plurality. It should also be noted that the features or steps described with reference to the above embodiments may also be used in combination with other features or steps of other above-mentioned embodiments. The reference signs in the claims should not be regarded as limiting conditions.

[0051] Reference numerals list

[0052] 100 Installations

[0053] 101 Printed Circuit Board

[0054] 102 Electronic components

[0055] 103 Insulation Materials

[0056] 104 reinforcement

[0057] 105 Conductive layer

[0058] 110 recess

[0059] 306 Top Floor

[0060] 307 Bottom Floor

[0061] 308 Top surface

Claims

1. A device for insulating an electronic component, comprising: Printed Circuit Boards, electronic components arranged on a surface of the printed circuit board, a reinforcement member configured and arranged to at least partially surround the electronic component, wherein The reinforcing member is arranged on the surface of the printed circuit board, Wherein, the reinforcement is configured and arranged to insulate the electronic component relative to the surroundings.

2. The device according to claim 1, wherein: The reinforcement element has a recess in which the electronic component is accommodated, wherein the recess extends from a first side of the reinforcement element to a second side of the reinforcement element that is opposite the first side.

3. The device according to claim 1 or 2, wherein: The reinforcing member surrounds the electronic component at least at one or more side surfaces of the electronic component, the side surfaces extending in a vertical direction or at a prescribed angle relative to a surface on which the electronic component is placed on the printed circuit board.

4. The device according to claim 1, wherein: The printed circuit board is a multi-layer printed circuit board, which consists of at least one bottom layer, one top layer and one or more conductive layers, wherein the one or more conductive layers are arranged between the bottom layer and the top layer.

5. The device according to claim 4, wherein: The element is arranged on the top layer, and wherein the element is connected to the conductive layer through the top layer; or wherein the element is arranged on the bottom layer, and wherein the element is connected to the conductive layer through the bottom layer.

6. The device according to one of the preceding claims, wherein The electronic component is a sensor, in particular a temperature sensor, and / or wherein the printed circuit board is a flexible printed circuit board.

7. The device according to one of the preceding claims, further comprising a force applying member which is arranged on the reinforcement member and is configured to apply a force to the reinforcement member so that the device can be pressed against the component to be measured.

8. The device according to one of the preceding claims, wherein The electronic component is arranged at a close distance from the edge of the printed circuit board, wherein the distance is in particular in the range of 0.5 mm to 30 mm, more in particular in the range of 0.5 mm to 10 mm.

9. The device according to one of the preceding claims, wherein The reinforcement element further comprises an insulating material which is configured and arranged to insulate the electronic component from the surroundings, wherein the insulating material surrounds the electronic component in particular laterally and from above.

10. The device according to one of claims 2 to 9, wherein: The insulating material is disposed in the recess of the reinforcement member and at least partially fills the recess.

11. Use of the device for insulating electronic components according to one of claims 1 to 10 in a charging path of an electric vehicle.

12. A method for insulating electronic components on a printed circuit board, wherein: The method comprises the following steps: Provide printed circuit boards; placing a reinforcement member on a surface of the printed circuit board, at least partially surrounding the electronic component; placing electronic components on the surface of the printed circuit board; The reinforcing member isolates the electronic component from the surroundings.

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