Heat dissipation device

Abstract

The invention belongs to the technical field of electronic equipment, and particularly relates to a heat dissipation device, the heat dissipation device is used for heat dissipation of an electronic device, and the heat dissipation device comprises a heat dissipation part used for placing the electronic device; the refrigeration element is arranged in the heat dissipation piece and attached to the side, facing the heat dissipation piece, of the electronic device, and the refrigeration element is used for transmitting heat of the electronic device to the heat dissipation piece in a one-way mode; and the heat insulation assembly and the heat dissipation piece jointly define a closed space for containing the electronic device and the refrigeration element, and the heat insulation assembly is used for preventing external heat from entering the closed space. By adopting the heat dissipation device, not only can the heat of the electronic device be quickly transmitted to the heat dissipation piece, but also the external heat can be prevented from entering the closed space, so that the electronic device can continuously and normally work in a high-temperature environment.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic equipment, and in particular relates to a heat dissipation device. Background Art

[0002] With the continuous development and progress of electronic information technology, its application areas are constantly expanding. Electronic devices (such as electronic chips, circuit boards, etc.) will inevitably face extreme temperature environments, such as industrial scenarios, the oil field, and military and aerospace. Studies have shown that the main reason for the failure of electronic devices is due to temperature runaway, so thermal management is crucial for electronic devices. However, electronic devices that work continuously underground often have to withstand high temperature erosion of hundreds of degrees Celsius. The continuous increase in the working environment temperature has put higher requirements on the thermal management of electronic devices.

[0003] In the prior art, the solution to the above situation is to keep electronic devices away from high-temperature environments, and to customize electronic devices that must work in high-temperature environments to improve their temperature resistance. However, the research and development of high-temperature electronic devices faces high costs and long design and testing cycles. Therefore, the current more economical and efficient method is to use thermal management technology to control the temperature of electronic devices so that they can work stably within the rated temperature range. In the prior art, there are heat dissipation structures such as refrigeration elements and heat dissipation fans to maintain the normal operation of circuit modules in high-temperature environments, but high-temperature environments will transfer heat to electronic devices for a long time, resulting in the heat dissipation structure integrated in a small space unable to meet the heat dissipation requirements. Summary of the invention

[0004] The object of the present invention is to provide a heat dissipation device for an electronic device to improve the heat dissipation efficiency of the electronic device.

[0005] In order to achieve the above object, the present invention provides a heat dissipation device on one hand, which is used to dissipate heat from electronic devices, and the heat dissipation device includes:

[0006] Heat sink, used to place electronic devices;

[0007] A cooling element is arranged in the heat sink and attached to a side of the electronic device facing the heat sink, and is used to transfer heat from the electronic device to the heat sink in a unidirectional manner;

[0008] The thermal insulation component and the heat sink together form a closed space for accommodating electronic devices and refrigeration elements. The thermal insulation component is used to isolate external heat from entering the closed space.

[0009] In some embodiments, the heat sink is a cylindrical seat structure and is open. A first receiving groove is provided in the heat sink, and a second receiving groove is provided on the bottom wall of the first receiving groove. The size of the second receiving groove is adapted to the size of the electronic device, and the refrigeration element and the electronic device are arranged in the second receiving groove.

[0010] In some embodiments, the thermal insulation assembly includes: a thermal insulation member, which is filled in the first receiving groove and covers the second receiving groove, and the side of the thermal insulation member facing the second receiving groove is in contact with the electronic device and is used to isolate external heat from entering the second receiving groove; a sealing cover plate, which is arranged at the open part of the heat sink and seals the gap formed between the thermal insulation member and the inner wall of the first receiving groove.

[0011] In some embodiments, an annular groove is further provided on the inner circumferential wall of the heat dissipation element, the bottom wall of the annular groove is connected to the first accommodating groove, an annular groove is circumferentially provided on the top end of the first accommodating groove, and the sealing cover plate includes a sealing portion and a cover plate portion, the outer periphery of the sealing portion is sealed with the inner circumferential wall of the annular groove, the cover plate portion is located on the side of the sealing portion away from the thermal insulation element, and covers the outer circumferential edge of the top end of the annular groove.

[0012] In some embodiments, a third receiving groove is opened on the side of the sealing portion facing away from the cover portion, one end surface of the thermal insulation component is received in the third receiving groove, and the other end surface extends from the third receiving groove and is received in the first receiving groove.

[0013] In some embodiments, a fourth receiving groove adapted to the size of the electronic device is opened on the side of the thermal insulation member facing the electronic device, the fourth receiving groove and the second receiving groove have the same shape and are correspondingly arranged, and the inner circumferential wall of the fourth receiving groove and the inner circumferential wall of the second receiving groove together enclose a closed space.

[0014] In some embodiments, the thermal insulation is made of aluminum silicate fiber, asbestos, or aerogel.

[0015] In some embodiments, the heat sink is further provided with a through hole for passing the electronic circuit.

[0016] In some embodiments, the cooling element is a semiconductor cooling sheet, the heat absorbing end of the semiconductor cooling sheet faces the electronic device, and the heat releasing end of the semiconductor cooling sheet faces the heat sink.

[0017] In some embodiments, a thermal interface material is attached to both the heat absorbing end and the heat releasing end of the semiconductor cooling chip.

[0018] In the above technical solution, the heat dissipation device is used to dissipate heat for electronic devices. The heat dissipation device includes a heat sink, a refrigeration element and a heat insulation component. The heat sink is used to place the electronic device. The refrigeration element is arranged in the heat sink and attached to the side of the electronic device facing the heat sink. The refrigeration element can transfer the heat of the electronic device to the heat sink in one direction to dissipate heat for the electronic device. The heat insulation component and the heat sink together enclose a closed space for accommodating the electronic device and the refrigeration element. The heat insulation component is used to isolate external heat from entering the closed space. The above heat dissipation device can not only fully dissipate heat for the electronic device, but also isolate external heat from entering the closed space, thereby improving the heat dissipation efficiency and enabling the electronic device to continue to work in a higher temperature environment.

[0019] Other features and advantages of the embodiments of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the embodiments of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the embodiments of the present invention, but do not constitute a limitation on the embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative work. In the accompanying drawings:

[0021] Figure 1 A schematic diagram of the structure of a heat dissipation device provided according to an embodiment of the present invention;

[0022] Figure 2 It is an exploded schematic diagram of a heat dissipation device provided by an embodiment of the present invention at a first viewing angle;

[0023] Figure 3 It is an exploded schematic diagram of a heat dissipation device provided by an embodiment of the present invention at a second viewing angle;

[0024] Figure 4 A schematic diagram of the structure of a heat sink provided according to an embodiment of the present invention;

[0025] Figure 5 A temperature simulation diagram of a heat dissipation device provided according to an embodiment of the present invention in a high temperature environment from a third viewing angle;

[0026] Figure 6 It is a temperature simulation diagram of the heat dissipation device provided according to an embodiment of the present invention at a fourth viewing angle in a high temperature environment.

[0027] Description of Reference Numerals

[0028] 10 Heat sink

[0029] 11. First storage tank

[0030] 12 Second storage tank

[0031] 13 Annular groove

[0032] 14 Through Holes

[0033] 20 Refrigeration elements

[0034] 30 Insulation

[0035] 31 Fourth storage tank

[0036] 40 Sealing cover

[0037] 41 Sealing part

[0038] 42 Cover plate

[0039] 43 Third storage tank

[0040] 50 Thermal Interface Materials

[0041] 60 Electronic Circuits

[0042] 70 Electronic devices DETAILED DESCRIPTION

[0043] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0044] The heat dissipation device according to the present invention is described below with reference to the accompanying drawings. Figure 1 As shown, it is a schematic diagram of the structure of the heat dissipation device provided according to an embodiment of the present invention; Figure 2 As shown, it is a schematic diagram of an exploded view of a heat dissipation device provided by an embodiment of the present invention at a first viewing angle; Figure 3 As shown, it is a schematic diagram of an exploded view of a heat dissipation device provided by an embodiment of the present invention at a second viewing angle; Figure 4 , which is a schematic structural diagram of a heat sink 10 provided according to an embodiment of the present invention.

[0045] The heat dissipation device provided in the embodiment of the present invention is used to dissipate heat for the electronic device 70, and the heat dissipation device includes a heat sink 10, a cooling element 20 and a heat insulation component. Among them, the heat sink 10 is used to place the electronic device 70, and the heat generated by the electronic device 70 can be transmitted to the heat sink 10. The heat sink 10 has a large surface area and can dissipate heat efficiently. The cooling element 20 is arranged in the heat sink 10 and attached to the side of the electronic device 70 facing the heat sink 10. The cooling element 20 is used to transfer the heat of the electronic device 70 to the heat sink 10 in a unidirectional manner, so as to speed up the heat transfer rate and improve the heat dissipation performance. The heat insulation component and the heat sink 10 are enclosed together to form a closed space for accommodating the electronic device 70 and the cooling element 20, and the heat insulation component is used to isolate the external heat from entering the closed space.

[0046] The heat dissipation device for the electronic device 70 includes a heat sink 10, a cooling element 20 and a heat insulation component. The cooling element 20 can transfer the heat of the electronic device 70 to the heat sink 10 in one direction. The heat sink 10 usually has a large surface area and can dissipate heat efficiently. In addition, the embodiment of the present invention also includes a heat insulation component, which can isolate the heat from the outside from entering the closed space enclosed by the heat sink 10 and the heat insulation component, so as to prevent the heat from the outside from being transferred to the closed space, resulting in slow heat dissipation of the electronic device 70, and then causing overheating damage.

[0047] In one embodiment, Figure 2 and Figure 4 As shown, the heat sink 10 is a cylindrical seat structure and is openly arranged. A first receiving groove 11 is provided in the heat sink 10. A second receiving groove 12 is provided on the bottom wall of the first receiving groove 11. The size of the second receiving groove 12 is adapted to the size of the electronic device 70. The cooling element 20 and the electronic device 70 are arranged in the second receiving groove 12. The first receiving groove 11 can be used to install the heat insulation component, and the second receiving groove 12 can be used to install the cooling element 20 and the electronic device 70. The electronic device 70 and the cooling element 20 can be stably installed in the second receiving groove 12, and the structure is tightly connected to prevent damage to the electronic device 70 during transportation and disassembly of the heat dissipation mechanism.

[0048] In one embodiment, Figure 3As shown, the heat insulation assembly includes a heat insulation member 30 and a sealing cover plate 40. The heat insulation member 30 is filled in the first receiving groove 11 and covers the second receiving groove 12. The side of the heat insulation member 30 facing the second receiving groove 12 is in contact with the electronic device 70 and is used to isolate the external heat from entering the second receiving groove 12. The heat insulation member 30 is in contact with the electronic device 70 to prevent the electronic device 70 from shaking in the closed space. The heat insulation member 30 has poor thermal conductivity, and the external heat cannot be transmitted to the electronic device 70 through the heat insulation member 30. The sealing cover plate 40 is provided at the open portion of the heat sink 10 and seals the gap formed between the heat insulation member 30 and the first receiving groove 11. The heat insulating member 30 is filled in the first receiving groove 11, and there is a gap between the heat insulating member 30 and the inner wall of the first receiving groove 11, so that the external heat can easily be transmitted to the electronic device 70 through the gap, and the sealing cover plate 40 can be covered at the open part of the heat dissipating member 10, and seal the gap formed between the inner wall of the first receiving groove 11 and the heat insulating member 30. With the above structure, the external heat can be fully isolated from entering the closed space, which is beneficial to the heat dissipation of the electronic device 70 and prolongs the service life of the electronic device 70.

[0049] In one embodiment, Figure 4 As shown, the inner peripheral wall of the heat sink 10 is also provided with an annular groove 13, the bottom wall of the annular groove 13 is connected with the first receiving groove 11, the top of the first receiving groove 11 is provided with an annular groove 13 along the circumferential direction, and the sealing cover plate 40 includes a sealing portion 41 and a cover plate portion 42, the outer periphery of the sealing portion 41 is sealed with the inner peripheral wall of the annular groove 13, the cover plate portion 42 is located on the side of the sealing portion 41 away from the thermal insulation 30, and covers the outer peripheral edge of the top of the annular groove 13. The heat sink 10 is provided with an annular groove 13, the inner wall of the annular groove 13 can be used to seal with the sealing portion 41 of the sealing cover plate 40, so as to seal the gap formed between the thermal insulation 30 and the first receiving groove 11. The cover plate portion 42 is covered on the outer peripheral edge of the annular groove 13, which can make the sealing cover plate 40 and the thermal insulation 30 fit more closely, thereby making the structure more compact and convenient for transportation and disassembly.

[0050] In one embodiment, Figure 3 As shown, a third receiving groove 43 is provided on the side of the sealing portion 41 away from the cover portion 42, one end face of the heat insulating member 30 is received in the third receiving groove 43, and the other end face extends from the third receiving groove 43 and is received in the first receiving groove 11. The third receiving groove 43 can be used to receive a part of the heat insulating member 30, and the inner wall of the third receiving groove 43 and the inner wall of the first receiving groove 11 together enclose a receiving space for receiving the heat insulating member 30, so that the heat insulating member 30 can be tightly filled in the receiving space, thereby isolating the external heat from entering the second receiving groove 12. The above-mentioned heat dissipation device has a compact structure, high installation stability, small space occupation, and is easy to install and maintain.

[0051] In one embodiment, Figure 2As shown, the side of the heat insulating member 30 facing the electronic device 70 is provided with a fourth receiving groove 31 adapted to the size of the electronic device 70, the fourth receiving groove 31 and the second receiving groove 12 have the same shape and are arranged correspondingly, and the inner peripheral wall of the fourth receiving groove 31 and the inner peripheral wall of the second receiving groove 12 are enclosed together to form a closed space. The fourth receiving groove 31 and the second receiving groove 12 have the same shape and are arranged correspondingly, and the electronic device 70 and the refrigeration element 20 can be installed in the closed space formed by the fourth receiving groove 31 and the second receiving groove 12. The above-mentioned installation structure can ensure that the electronic device 70 and the refrigeration element 20 are stably installed, and the structure is compact, the space occupied is small, and it is easy to install and disassemble.

[0052] In one embodiment, the heat insulating member 30 is made of aluminum silicate fiber, asbestos or aerogel. Aluminum silicate fiber, asbestos and aerogel all have good heat insulation performance, good resistance to mechanical vibration and small thermal expansion. As the heat insulating member 30, filling the second receiving groove 12 and the third receiving groove 43 can isolate the external heat on the one hand, and can play a role in the stable installation of the electronic device 70 and the refrigeration element 20 on the other hand.

[0053] In one embodiment, Figure 4 As shown, the heat sink 10 is also provided with a through hole 14 for passing the electronic circuit 60. The electronic device 70 needs to transmit signals with the outside world during use. If the signal is transmitted wirelessly, it may be affected by the environment and the signal transmission may not be timely. In the embodiment of the present invention, a through hole 14 is provided on the heat sink 10, and the electronic circuit 60 can pass through the through hole 14 to transmit signals with the electronic device 70 and power the electronic device 70. The electronic circuit 60 can also be electrically connected to the cooling element 20 and used to power the cooling element 20. The use of the above-mentioned heat dissipation device can make the transmission of signals between the electronic device 70 and the outside more stable.

[0054] In one embodiment, the cooling element 20 is a semiconductor cooling sheet, the heat absorbing end of the semiconductor cooling sheet faces the electronic device 70, and the heat releasing end of the semiconductor cooling sheet faces the heat sink 10. The semiconductor cooling sheet is divided into a heat absorbing end and a heat releasing end, and can transfer heat in one direction. The heat absorbing end of the semiconductor cooling sheet faces the electronic device 70, and the heat releasing end faces the heat sink 10, and can transfer the heat of the electronic device 70 to the heat sink 10 to accelerate the heat dissipation efficiency.

[0055] In a specific embodiment, the area of ​​the heat absorption end of the semiconductor refrigeration plate is greater than or equal to the contact area between the semiconductor refrigeration plate and the electronic device 70. The above structure can fully transfer the heat of the electronic device 70 to the semiconductor refrigeration plate. In addition, the above structure can make the heat dissipation of the electronic device 70 more uniform, preventing local overheating from causing damage to the electronic device 70.

[0056] In one embodiment, the heat absorbing end and the heat releasing end of the semiconductor cooling sheet are both affixed with thermal interface materials 50. Thermal interface materials 50 such as silicone, silicone grease, thermal conductive adhesive, etc. can be applied between the heat dissipation device and the heat generation device to reduce the contact thermal resistance between them and accelerate the heat transfer rate. In the embodiment of the present invention, thermal interface materials 50 are affixed to both the heat absorbing end and the heat releasing end of the semiconductor cooling sheet, which can accelerate the heat transfer rate of the electronic device 70 and prevent the damage of the components caused by excessive heat.

[0057] In a specific embodiment, the electronic device 70 and the semiconductor refrigeration sheet are both planar rectangular sheet elements, and the second accommodating groove 12 and the fourth accommodating groove 31 are square grooves adapted to the electronic device 70 , and the bottom area of ​​the square groove is slightly larger than the area of ​​the electronic device 70 so that the electronic device 70 can be installed in the second accommodating groove 12 .

[0058] In a specific embodiment, during the operation of the electronic device 70, the semiconductor cooling sheet is powered on, and the heat generated by the electronic device 70 is transferred from the heat absorbing end of the semiconductor cooling sheet to the heat releasing end through the Peltier effect, and then the semiconductor cooling sheet transfers the heat to the heat sink 10. The heat sink 10 is made of an aluminum alloy with a large surface area. The aluminum alloy has excellent thermal conductivity and can quickly dissipate heat into the air. At the same time, the heat insulation 30 and the sealing cover 40 isolate the heat from the external high temperature environment, so as to maintain a low temperature in the closed space, and ensure that the electronic device 70 can work normally for a long time in a high temperature environment.

[0059] In one embodiment, Figure 5 As shown, it is a temperature simulation diagram of the heat dissipation device provided by an embodiment of the present invention in a high temperature environment from a third viewing angle; Figure 6 , which is a temperature simulation diagram of the heat dissipation device provided by an embodiment of the present invention in a high temperature environment from a fourth viewing angle. Figure 5 and Figure 6 It can be seen that the temperature near the electronic device 70 is always maintained at a low level. Under the action of the heat dissipation device, the electronic device 70 can continue to work normally in a high-temperature environment.

[0060] The heat dissipation device has a compact structure, occupies a small space, has a fast heat dissipation rate and can isolate external heat from entering the closed space accommodating the electronic device 70, further enhancing the heat dissipation effect for the electronic device 70, so that the electronic device 70 can be used in a high temperature environment.

[0061] In one embodiment, a method for installing a heat dissipation device is provided, the method comprising the following steps:

[0062] S101, attaching a thermal interface material 50 to the cooling element 20;

[0063] S102, installing the cooling element 20 and the electronic device 70 in the second receiving groove 12 of the heat sink 10 in sequence;

[0064] S103, installing the heat insulating element 30 in the first receiving groove 11 of the heat dissipating element 10;

[0065] S104, passing the electronic circuit 60 through the through hole 14 of the heat sink 10 to supply power to the cooling element 20 and the electronic device 70, thereby achieving electrical connection between the electronic device 70 and external components;

[0066] S105 , cover the sealing cover plate 40 on the thermal insulation component 30 .

[0067] By adopting the above-mentioned installation method, the electronic device 70 can achieve stable heat dissipation, and the external heat can be isolated from entering the first receiving groove 11 and the second receiving groove 12. The structure is compact, the space occupied is small, and the layout is convenient.

[0068] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0069] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0071] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device is used to dissipate heat from the electronic device (70), and the heat dissipation device comprises: A heat sink (10) for accommodating the electronic device (70); A cooling element (20) is disposed in the heat sink (10) and attached to a side of the electronic device (70) facing the heat sink (10), the cooling element (20) being used to transfer heat from the electronic device (70) to the heat sink (10) in a unidirectional manner; A heat insulation component, wherein the heat insulation component and the heat sink (10) together enclose a closed space for accommodating the electronic device (70) and the refrigeration element (20), and the heat insulation component is used to isolate external heat from entering the closed space.

2. The heat dissipation device according to claim 1, characterized in that: The heat sink (10) is a cylindrical seat structure and is openly arranged. A first receiving groove (11) is provided in the heat sink (10). A second receiving groove (12) is provided on the bottom wall of the first receiving groove (11). The size of the second receiving groove (12) is adapted to the size of the electronic device (70). The refrigeration element (20) and the electronic device (70) are arranged in the second receiving groove (12).

3. The heat dissipation device according to claim 2, characterized in that: The thermal insulation assembly comprises: a heat insulating member (30), the heat insulating member (30) being filled in the first containing groove (11) and covering the second containing groove (12), the heat insulating member (30) being in contact with the electronic device (70) on a side facing the second containing groove (12) and being used to isolate external heat from entering the second containing groove (12); A sealing cover plate (40) is arranged at the open portion of the heat dissipation element (10) and seals the gap formed between the heat insulation element (30) and the inner side wall of the first containing groove (11).

4. The heat dissipation device according to claim 3, characterized in that: The inner circumferential wall of the heat dissipation element (10) is also provided with an annular groove (13), the bottom wall of the annular groove (13) is connected to the first accommodating groove (11), and the top end of the first accommodating groove (11) is provided with an annular groove (13) along the circumferential direction. The sealing cover plate (40) includes a sealing portion (41) and a cover plate portion (42), the outer periphery of the sealing portion (41) is sealed with the inner circumferential wall of the annular groove (13), and the cover plate portion (42) is located on the side of the sealing portion (41) away from the thermal insulation element (30), and covers the outer circumferential edge of the top end of the annular groove (13).

5. The heat dissipation device according to claim 4, characterized in that: A third receiving groove (43) is provided on the side of the sealing portion (41) facing away from the cover plate portion (42); one end surface of the heat insulating member (30) is received in the third receiving groove (43), and the other end surface extends out from the third receiving groove (43) and is received in the first receiving groove (11).

6. The heat dissipation device according to claim 3, characterized in that: A fourth receiving groove (31) adapted to the size of the electronic device (70) is provided on a side of the heat insulating member (30) facing the electronic device (70); the fourth receiving groove (31) and the second receiving groove (12) have the same shape and are arranged correspondingly; the inner peripheral wall of the fourth receiving groove (31) and the inner peripheral wall of the second receiving groove (12) are jointly enclosed to form the closed space.

7. The heat dissipation device according to claim 3, characterized in that: The heat insulating member (30) is made of aluminum silicate fiber, asbestos or aerogel.

8. The heat dissipation device according to claim 1, characterized in that: The heat sink (10) is also provided with a through hole (14) for passing the electronic circuit (60).

9. The heat dissipation device according to any one of claims 1 to 8, characterized in that: The cooling element (20) is a semiconductor cooling sheet, the heat absorbing end of the semiconductor cooling sheet faces the electronic device (70), and the heat releasing end of the semiconductor cooling sheet faces the heat sink (10).

10. The heat dissipation device according to claim 9, characterized in that: The heat absorbing end of the semiconductor refrigeration sheet and the heat releasing end of the semiconductor refrigeration sheet are both provided with thermal interface materials (50).

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