Method and device for adjusting holding current, storage medium and program product

Abstract

The embodiment of the invention discloses a holding current adjusting method and device, a storage medium and a program product. The method for adjusting the holding current comprises the following steps of: adjusting an irradiation machine according to irradiation power, irradiation time and transmission speed so as to control the irradiation dose of the semiconductor discharge tube; irradiating the semiconductor discharge tube placed on the conveying device through an irradiation machine; the service life of minority carriers in the semiconductor discharge tube is controlled by adjusting the irradiation dose, so that the holding current of the semiconductor discharge tube is adjusted. According to the technical scheme and the method for setting and adjusting the holding current, the service life of the minority carriers in the semiconductor discharge tube is reduced through external factors, the irradiation technology is applied, the irradiation dose of the semiconductor discharge tube is controlled, the service life of the minority carriers in the semiconductor discharge tube is further controlled, and the purpose of effectively controlling the holding current is achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a method, device, storage medium and program product for adjusting a holding current. Background Art

[0002] As a high-voltage, high-speed, low-current overvoltage protection device based on the thyristor principle, the semiconductor discharge tube (Transient Solid State Switch, TSS) plays a key role in the modern electronic field. TSS is a semiconductor device that uses two structures of PNP transistor and NPN transistor to achieve mutual feedback. When sufficient voltage is applied to the control electrode, the electric field of PNP and NPN will be strengthened, resulting in the diffusion and impact ionization of carriers in the junction, and then forming a rapid current burst, raising the voltage to the maximum value that TSS can withstand. When the control voltage is reduced, the electric field returns to normal, the current stops and returns to the initial state. The holding current is a key parameter in TSS, so how to adjust the holding current of TSS has become a research focus.

[0003] In the prior art, the maintenance current of TSS is regulated by adjusting the concentration of carriers in TSS to regulate the maintenance current. However, the method used in the prior art cannot accurately control the maintenance current of TSS, and the control accuracy is low. Summary of the invention

[0004] The present invention provides a method, device, storage medium and program product for adjusting a holding current, so as to achieve accurate control of the holding current of a semiconductor discharge tube and improve the control accuracy of the holding current of the semiconductor discharge tube.

[0005] According to one aspect of the present invention, a method for adjusting a holding current is provided for a semiconductor discharge tube. The method for adjusting the holding current comprises:

[0006] The irradiation machine is adjusted according to the irradiation power, irradiation time and conveying speed to control the irradiation dose to the semiconductor discharge tube;

[0007] irradiating the semiconductor discharge tube placed on the conveyor by means of an irradiation machine;

[0008] By adjusting the irradiation dose, the lifetime of minority carriers in the semiconductor discharge tube is controlled to adjust the holding current of the semiconductor discharge tube.

[0009] Optionally, after the semiconductor discharge tube placed on the conveyor is irradiated by the irradiation machine, the method further includes:

[0010] Turn over the semiconductor discharge tube;

[0011] The semiconductor discharge tube which has been turned over continues to be irradiated.

[0012] Optionally, before adjusting the irradiation machine according to the irradiation power, irradiation time and conveying speed to control the irradiation dose to the semiconductor discharge tube, the method includes:

[0013] placing a first preset number of semiconductor discharge tubes into a wafer box;

[0014] placing a second predetermined number of wafer cassettes into the irradiation tray;

[0015] Place the irradiation tray on the conveyor.

[0016] Optionally, the irradiation machine is adjusted according to the irradiation power, irradiation time and conveying speed to control the irradiation dose to the semiconductor discharge tube, including:

[0017] The irradiation dose to the semiconductor discharge tube is increased by increasing the irradiation power and / or increasing the irradiation time and / or reducing the conveying speed.

[0018] Optionally, the irradiation machine is adjusted according to the irradiation power, irradiation time and conveying speed to control the irradiation dose to the semiconductor discharge tube, and further includes:

[0019] The irradiation dose to the semiconductor discharge tube can be reduced by reducing the irradiation power and / or reducing the irradiation time and / or increasing the conveying speed.

[0020] Optionally, the irradiation dose is adjusted to thereby control the lifetime of minority carriers in the semiconductor discharge tube so as to adjust the holding current of the semiconductor discharge tube, including:

[0021] Increasing the irradiation dose reduces the lifetime of minority carriers in the semiconductor discharge tube, thereby increasing the holding current of the semiconductor discharge tube.

[0022] Optionally, the semiconductor discharge tube placed on the conveyor is irradiated by an irradiation machine, including:

[0023] The semiconductor discharge tube placed on the laser conveyor belt is irradiated by the irradiation machine.

[0024] According to another aspect of the present invention, there is provided a device for adjusting a holding current, the device for adjusting a holding current comprising:

[0025] An irradiation dose control module, used to adjust the irradiation machine according to the irradiation power, irradiation time and transmission speed, so as to control the irradiation dose to the semiconductor discharge tube;

[0026] An irradiation module, used for irradiating the semiconductor discharge tube placed on the conveyor through an irradiation machine;

[0027] The holding current regulating module is used to adjust the irradiation dose and thus control the life of minority carriers in the semiconductor discharge tube to complete the regulation of the holding current of the semiconductor discharge tube.

[0028] According to another aspect of the present invention, a computer-readable storage medium is provided. The computer-readable storage medium stores computer instructions. The computer instructions are used to enable a processor to implement the method for adjusting the holding current according to any embodiment of the present invention when executed.

[0029] According to another aspect of the present invention, a computer program product is provided. The computer program product includes a computer program. When the computer program is executed by a processor, the method for adjusting the holding current according to any embodiment of the present invention is implemented.

[0030] The technical solution of the embodiment of the present invention can control the irradiation dose of the semiconductor discharge tube by adjusting the parameters of the irradiation machine. After determining the irradiation dose, the irradiated semiconductor discharge tube is placed on a conveying device, and the semiconductor discharge tube is conveyed to the irradiation area of ​​the irradiation machine with the set parameters by the conveying device to irradiate the semiconductor discharge tube. By adjusting the irradiation dose, the life of the minority carriers in the semiconductor discharge tube is controlled to adjust the holding current of the semiconductor discharge tube. The life of the minority carriers in the semiconductor discharge tube is reduced by external factors to achieve the purpose of accurately controlling the holding current, thereby improving the control accuracy of the holding current of the semiconductor discharge tube.

[0031] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 is a flow chart of a method for adjusting a holding current provided according to an embodiment of the present invention;

[0034] Figure 2 is a schematic diagram of the relationship between the irradiation dose and the maintenance current increment provided according to an embodiment of the present invention;

[0035] Figure 3 is a flow chart of another method for adjusting the holding current provided in an embodiment of the present invention;

[0036] Figure 4-Figure 11 It is a cross-sectional view corresponding to each step of a method for preparing a semiconductor discharge tube provided in an embodiment of the present invention;

[0037] Fig.12 is a schematic structural diagram of a device for adjusting a holding current provided according to an embodiment of the present invention;

[0038] Fig.13 1 is a schematic diagram of the structure of an electronic device for implementing the method for adjusting the holding current according to an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0040] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0041] Figure 1 1 is a flow chart of a method for adjusting a holding current according to an embodiment of the present invention. This embodiment is applicable to adjusting the holding current of a semiconductor discharge tube. The method for adjusting the holding current can be performed by a device for adjusting the holding current. The device for adjusting the holding current can be implemented in the form of hardware and / or software. Figure 1 As shown, the method for adjusting the maintaining current includes:

[0042] S110, adjusting the irradiation machine according to the irradiation power, irradiation time and transmission speed to control the irradiation dose to the semiconductor discharge tube.

[0043] Specifically, the holding current is the minimum current required to maintain the on state after the semiconductor discharge tube is triggered to conduct at room temperature when the control electrode is open. If the current in the loop where the semiconductor discharge tube is located is less than the holding current, the semiconductor discharge tube will be turned off and no longer conduct. The holding current is a key parameter of the semiconductor discharge tube.

[0044] By reducing the life of minority carriers in semiconductor discharge tubes through external factors, the holding current of semiconductor discharge tubes can be effectively controlled. The life of minority carriers in semiconductor discharge tubes is negatively correlated with the holding current, that is, if the life of minority carriers in semiconductor discharge tubes decreases, the holding current of semiconductor discharge tubes will increase significantly. The life of minority carriers in semiconductor discharge tubes represents the time from the generation to the recombination of electrons or holes. Exemplarily, in an embodiment of the present invention, the external factor is irradiating the semiconductor discharge tube, so that the life of minority carriers in the semiconductor discharge tube is reduced, and the holding current of the semiconductor discharge tube can be controlled. Irradiation is the transfer of energy from electron beams generated by electron accelerators or rays generated by radioactive isotopes to irradiated substances. Ionizing radiation acts on irradiated substances, produces ionization and excitation, releases orbital electrons, and forms free radicals. By controlling the irradiation conditions, the organism can be irreversibly damaged.

[0045] The life of minority carriers in the semiconductor discharge tube after irradiation mainly depends on the irradiation dose when the semiconductor discharge tube is irradiated, and has nothing to do with the life of minority carriers in the semiconductor discharge tube before irradiation. Therefore, by accurately controlling the irradiation dose of the semiconductor discharge tube, the life of minority carriers in the semiconductor discharge tube can be accurately controlled, thereby accurately controlling the holding current of the semiconductor discharge tube.

[0046] In an embodiment of the present invention, the irradiation dose of the semiconductor discharge tube can be controlled by setting the parameters of the irradiation machine. Exemplarily, the parameters of the irradiation machine include irradiation voltage, irradiation current, irradiation time, and the time the semiconductor discharge tube is placed in the irradiation area of ​​the irradiation machine. The embodiment of the present invention adjusts the irradiation machine according to the irradiation power, irradiation time, and transmission speed. Exemplarily, the irradiation voltage or irradiation current of the irradiation machine is increased, thereby increasing the irradiation power of the irradiation machine. Similarly, the irradiation power of the irradiation machine can be reduced by reducing the irradiation voltage or irradiation current of the irradiation machine. In an optional embodiment of the present invention, buttons of different powers on the irradiation machine can be selected as needed to achieve control of the irradiation dose of the semiconductor discharge tube.

[0047] In an optional embodiment of the present invention, the irradiation dose to the semiconductor discharge tube may be controlled by extending or shortening the irradiation time and adjusting the time for the semiconductor discharge tube to pass through the irradiation area of ​​the irradiation machine.

[0048] S120, irradiating the semiconductor discharge tube placed on the conveying device by using an irradiation machine.

[0049] Specifically, after setting the relevant parameters of the irradiation machine, the semiconductor discharge tube is placed on the conveying device. When the maintaining current of the semiconductor discharge tube needs to be adjusted, the irradiation machine is turned on, and the semiconductor discharge tube is conveyed to the position where the irradiation machine emits radiation through the conveying device. The semiconductor discharge tube on the conveying device is irradiated to reduce the lifetime of minority carriers in the semiconductor discharge tube.

[0050] S130, by adjusting the irradiation dose, the lifetime of minority carriers in the semiconductor discharge tube is controlled to adjust the holding current of the semiconductor discharge tube.

[0051] Specifically, Figure 2 FIG. 1 is a schematic diagram showing the relationship between the irradiation dose and the maintenance current increment according to an embodiment of the present invention. Figure 2 As shown, the maintenance current increment is positively correlated with the irradiation dose. The greater the irradiation dose, the greater the maintenance current increment. In the embodiment of the present invention, if it is necessary to adjust the maintenance current of the semiconductor discharge tube to increase the maintenance current of the semiconductor discharge tube, it can be achieved by increasing the irradiation dose. By increasing the irradiation dose, the lifetime of minority carriers in the semiconductor discharge tube can be reduced, thereby increasing the maintenance current of the semiconductor discharge tube.

[0052] The technical solution of the embodiment of the present invention can control the irradiation dose of the semiconductor discharge tube by adjusting the parameters of the irradiation machine. After determining the irradiation dose, the irradiated semiconductor discharge tube is placed on a conveying device, and the semiconductor discharge tube is conveyed to the irradiation area of ​​the irradiation machine with the set parameters by the conveying device to irradiate the semiconductor discharge tube. By adjusting the irradiation dose, the life of the minority carriers in the semiconductor discharge tube is controlled to adjust the holding current of the semiconductor discharge tube. The life of the minority carriers in the semiconductor discharge tube is reduced by external factors to achieve the purpose of accurately controlling the holding current, thereby improving the control accuracy of the holding current of the semiconductor discharge tube.

[0053] Figure 3 FIG. 1 is a flow chart of another method for adjusting the holding current provided according to an embodiment of the present invention. This embodiment is a detailed description of the technical features of the above embodiment. Figure 3 As shown, the method for adjusting the maintaining current includes:

[0054] S210, adjusting the irradiation machine according to the irradiation power, irradiation time and transmission speed to control the irradiation dose to the semiconductor discharge tube.

[0055] In an optional embodiment of the present invention, before adjusting the irradiation machine according to the irradiation power, irradiation time and conveying speed to control the irradiation dose of the semiconductor discharge tube, it includes: placing a first preset number of semiconductor discharge tubes into a wafer box; placing a second preset number of wafer boxes into an irradiation tray; and placing the irradiation tray on a conveying device.

[0056] Specifically, the first preset number is the number of semiconductor discharge tubes placed in a wafer box. Exemplarily, the first preset number is 25, that is, 25 semiconductor discharge tubes are placed in a wafer box.

[0057] The second preset number is the preset number of wafer boxes placed in the irradiation tray. Exemplarily, the second preset number is 8, that is, 8 wafer boxes are placed in the irradiation tray.

[0058] In an embodiment of the present invention, metallized silicon wafers are packaged and placed in wafer boxes; 25 silicon wafers are placed in each wafer box; the wafer boxes containing silicon wafers are placed in irradiation trays, and 8 wafer boxes are placed in each irradiation tray; the irradiation tray filled with wafer boxes is placed on a conveyor belt, and the conveyor belt is controlled at a preset speed to send the irradiation tray to the position where the irradiation machine emits radiation, and is moved out of the irradiation area after a period of time, thereby completing the irradiation of the semiconductor discharge tube.

[0059] In an optional embodiment of the present invention, the irradiation dose to the semiconductor discharge tube is increased by increasing the irradiation power and / or increasing the irradiation time and / or reducing the conveying speed.

[0060] Specifically, if it is necessary to increase the irradiation dose to the semiconductor discharge tube, the irradiation power may be increased, the irradiation time may be increased, or the transmission speed of the transmission device may be reduced.

[0061] If a larger irradiation dose is required, the irradiation power and irradiation time can be increased and the conveying speed of the conveyor can be reduced at the same time to increase the irradiation dose of the semiconductor discharge tube. By adjusting multiple parameters of the irradiation machine, the irradiation dose of the semiconductor discharge tube can be adjusted to achieve the purpose of accurately controlling the irradiation dose.

[0062] Optionally, the irradiation dose to the semiconductor discharge tube can be reduced by reducing the irradiation power and / or reducing the irradiation time and / or increasing the conveying speed.

[0063] Specifically, if it is necessary to reduce the irradiation dose to the semiconductor discharge tube, the irradiation power may be reduced, the irradiation time may be reduced, or the transmission speed of the transmission device may be increased.

[0064] If a smaller irradiation dose is required, the irradiation power, irradiation time and the conveying speed of the conveyor can be reduced at the same time to reduce the irradiation dose of the semiconductor discharge tube. By adjusting multiple parameters of the irradiation machine, the irradiation dose of the semiconductor discharge tube can be adjusted to achieve the purpose of accurately controlling the irradiation dose.

[0065] S220, irradiating the semiconductor discharge tube placed on the conveying device through an irradiation machine.

[0066] In an optional embodiment of the present invention, the conveying device may include a laser conveyor belt. The semiconductor discharge tube placed on the laser conveyor belt is irradiated by an irradiation machine to achieve more accurate control of the conveying speed and improve the accuracy of adjusting the maintenance current of the semiconductor discharge tube.

[0067] S230, turning over the semiconductor discharge tube.

[0068] Specifically, after irradiating the front side of the semiconductor discharge tube in the irradiation tray, the semiconductor discharge tube is turned over to make the irradiation more uniform and improve the accuracy of the irradiation.

[0069] S240, continue to irradiate the turned-over semiconductor discharge tube.

[0070] Specifically, after the semiconductor discharge tube is turned over, an irradiation machine with the same settings as that for irradiating the front side of the semiconductor discharge tube is used to continue irradiating the turned over semiconductor discharge tube, so that each area of ​​the semiconductor discharge tube receives the same irradiation dose.

[0071] S250, by adjusting the irradiation dose, the lifetime of minority carriers in the semiconductor discharge tube is controlled to adjust the maintenance current of the semiconductor discharge tube.

[0072] In an optional embodiment of the present invention, the irradiation dose is increased so that the lifetime of minority carriers in the semiconductor discharge tube is reduced, thereby increasing the holding current of the semiconductor discharge tube.

[0073] Optionally, an embodiment of the present invention further provides a method for preparing a semiconductor discharge tube. Figure 4 First, a substrate 10 is provided. The substrate 10 can be an N-type substrate silicon wafer or a P-type substrate silicon wafer. In the embodiment of the present invention, an N-type substrate silicon wafer is used as an example for description. The N-type substrate silicon wafer is subjected to chemical polishing and thinning treatment, and the surface of the N-type substrate silicon wafer is corroded to form a unit cell.

[0074] refer to Figure 5 , the N-type substrate silicon wafer is subjected to hydrogen-oxygen synthesis high-temperature oxidation, and a silicon dioxide layer 20 of a preset thickness is grown on both sides of the N-type substrate silicon wafer.

[0075] refer to Figure 6 , a first groove 201 is etched in the silicon dioxide layer 20 on both sides of the N-type substrate silicon wafer by using a photolithography process. A high concentration of boron (B) ions are diffused in the first groove 201 to form a deep P region 30 on both sides of the N-type substrate silicon wafer.

[0076] refer to Figure 7 , the silicon dioxide layer 20 is removed by a wet etching process.

[0077] refer to Figure 8 , a low concentration of boron ions are diffused to form a light P region 40. A silicon dioxide layer 20 with a preset thickness is grown on one side of the light P region 40.

[0078] refer to Fig. 9 The silicon dioxide layer 20 is etched by photolithography to form two second grooves 202 in each silicon dioxide layer 20. Phosphorus (P) ions are diffused in the second grooves 202 to form an emitter region 50, and an electron injection emitter junction is formed in the N-type substrate silicon wafer.

[0079] refer to Fig.10 , using a photolithography process, the shape of the groove is obtained by coating photoresist, exposing and developing, and the groove is formed by wet etching.

[0080] refer to Fig.11 The exposed grooves are filled with glass to form an insulating layer 60. The silicon dioxide layer 20 is etched with lead holes through a photolithography process, and metals such as aluminum or silver are electroded at the lead holes to form double-sided metal electrodes 70.

[0081] The adjustment of the holding current in the embodiment of the present invention can be applied to the semiconductor discharge tube prepared by the above method.

[0082] Fig.12 FIG. 1 is a schematic diagram of a structure of a device for adjusting a holding current according to an embodiment of the present invention. Fig.12 As shown, the device for adjusting the maintaining current includes:

[0083] The irradiation dose control module 100 is used to adjust the irradiation machine according to the irradiation power, irradiation time and transmission speed to control the irradiation dose of the semiconductor discharge tube;

[0084] An irradiation module 200 is used to irradiate the semiconductor discharge tube placed on the conveying device through an irradiation machine;

[0085] The holding current regulating module 300 is used to adjust the irradiation dose and thereby control the life of minority carriers in the semiconductor discharge tube, so as to complete the regulation of the holding current of the semiconductor discharge tube.

[0086] The technical solution of the embodiment of the present invention is to set a device for adjusting the holding current. By adjusting the parameters of the irradiation machine, the irradiation dose of the semiconductor discharge tube can be controlled. After the irradiation dose is determined, the semiconductor discharge tube to be irradiated is placed on a conveying device, and the semiconductor discharge tube is conveyed to the irradiation area of ​​the irradiation machine with the set parameters by the conveying device to irradiate the semiconductor discharge tube. By adjusting the irradiation dose, the life of the minority carriers in the semiconductor discharge tube is controlled to adjust the holding current of the semiconductor discharge tube. The life of the minority carriers in the semiconductor discharge tube is reduced by external factors to achieve the purpose of accurately controlling the holding current, thereby improving the control accuracy of the holding current of the semiconductor discharge tube.

[0087] The device for adjusting the holding current provided in the embodiment of the present invention can execute the method for adjusting the holding current provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0088] Fig.13 It is a structural schematic diagram of an electronic device for implementing a method for adjusting a holding current according to an embodiment of the present invention. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0089] like Fig.13 As shown, the electronic device 400 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 400 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0090] A number of components in the electronic device 400 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 400 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0091] The processor 11 may be a variety of general and / or dedicated processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 performs the various methods and processes described above, such as a method for adjusting the holding current.

[0092] In some embodiments, the method for adjusting the holding current may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 400 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the method for adjusting the holding current described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to perform the method for adjusting the holding current in any other appropriate manner (e.g., by means of firmware).

[0093] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0094] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0095] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0096] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0097] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0098] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0099] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0100] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for adjusting a holding current, characterized in that: For a semiconductor discharge tube, the method for adjusting the maintaining current comprises: adjusting the irradiation machine according to the irradiation power, irradiation time and conveying speed to control the irradiation dose to the semiconductor discharge tube; irradiating the semiconductor discharge tube placed on the conveyor by an irradiation machine; By adjusting the irradiation dose, the lifetime of minority carriers in the semiconductor discharge tube is controlled to adjust the maintenance current of the semiconductor discharge tube.

2. The method for adjusting the holding current according to claim 1, characterized in that: After the semiconductor discharge tube placed on the conveying device is irradiated by the irradiation machine, the method further includes: Turning over the semiconductor discharge tube; The semiconductor discharge tube is continuously irradiated after being turned over.

3. The method for adjusting the holding current according to claim 1, characterized in that: Before adjusting the irradiation machine according to the irradiation power, irradiation time and conveying speed to control the irradiation dose of the semiconductor discharge tube, the method includes: placing a first preset number of semiconductor discharge tubes into a wafer box; placing a second preset number of the wafer boxes into the irradiation tray; The irradiation tray is placed on the conveyor.

4. The method for adjusting the holding current according to claim 1, characterized in that: The step of adjusting the irradiation machine according to the irradiation power, irradiation time and transmission speed to control the irradiation dose of the semiconductor discharge tube comprises: The irradiation dose to the semiconductor discharge tube is increased by increasing the irradiation power and / or increasing the irradiation time and / or reducing the conveying speed.

5. The method for adjusting the holding current according to claim 4, characterized in that: The step of adjusting the irradiation machine according to the irradiation power, irradiation time and transmission speed to control the irradiation dose of the semiconductor discharge tube further includes: The irradiation dose to the semiconductor discharge tube is reduced by reducing the irradiation power and / or reducing the irradiation time and / or increasing the conveying speed.

6. The method for adjusting the holding current according to claim 1, characterized in that: The method of adjusting the irradiation dose to control the lifetime of minority carriers in the semiconductor discharge tube to adjust the holding current of the semiconductor discharge tube comprises: Increasing the irradiation dose reduces the life of minority carriers in the semiconductor discharge tube, thereby increasing the holding current of the semiconductor discharge tube.

7. The method for adjusting the holding current according to claim 1, characterized in that: The irradiating the semiconductor discharge tube placed on the conveying device by using an irradiation machine comprises: The semiconductor discharge tube placed on the laser conveyor belt is irradiated by an irradiation machine.

8. A device for adjusting a holding current, characterized in that: include: An irradiation dose control module, used to adjust the irradiation machine according to the irradiation power, irradiation time and transmission speed, so as to control the irradiation dose to the semiconductor discharge tube; An irradiation module, used for irradiating the semiconductor discharge tube placed on the conveyor through an irradiation machine; The holding current regulating module is used to adjust the irradiation dose and thereby control the life of minority carriers in the semiconductor discharge tube, so as to complete the regulation of the holding current of the semiconductor discharge tube.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for adjusting the holding current according to any one of claims 1 to 7 when the processor executes the computer instructions.

10. A computer program product, characterized in that The computer program product comprises a computer program, which, when executed by a processor, implements the method for adjusting a holding current according to any one of claims 1 to 7.

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