Packaging processing technology

Abstract

The invention provides a packaging processing technology. The packaging processing technology is used for packaging a lamp panel structure. The packaging processing technology comprises the following steps: obtaining specification information of the lamp panel structure; according to the specification information, an annular enclosure structure is machined on a substrate of the lamp panel structure, and the annular enclosure structure is arranged around an LED chip of the lamp panel structure; mixed colloid is injected into the annular fence structure; performing centrifugal treatment on the lamp panel structure injected with the mixed colloid until the colored medium in the mixed colloid settles to be layered with the transparent colloid in the mixed colloid; wherein the height of the colored dielectric layer is lower than that of the LED chip; and the lamp panel structure subjected to centrifugal treatment is subjected to baking treatment. The problem that in the prior art, a packaging processing technology capable of improving the display contrast of a display screen cannot package a lamp panel structure of LED chips with small intervals and small sizes is effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of display screen processing, and in particular to a packaging processing technology. Background Art

[0002] At present, the light board structure, as the core component in the assembly process of the display screen, is composed of a substrate and an LED chip arranged on the substrate. The light board structure needs to be packaged with packaging glue during the processing to extend the service life of the light board structure and improve the display effect of the display screen.

[0003] In the prior art, a black agent is usually packaged simultaneously during the packaging of the light panel structure to improve the contrast display effect of the display screen. There are three common packaging processing techniques:

[0004] Process 1: Directly encapsulate with encapsulation glue containing black agent;

[0005] Process 2: When processing the substrate, the top surface is coated with black ink, and only the area where the LED chip needs to be mounted is developed;

[0006] Process three: Use a high-precision glue dispenser to dispense black glue on the substrate after the LED chips are mounted to fill the gaps between the LED chips.

[0007] However, as the size and gap (pixel pitch) of LED chips become smaller and smaller, the above processes have certain disadvantages. For example, the original contrast enhancement effect of process one is very limited and cannot meet the growing demand, and the thickness of its encapsulation glue needs to be greater than 200μm, which cannot encapsulate tiny LED chips (that is, the height of the LED chip is less than 200μm); for example, the fixing effect of the black ink after coating in process two is very dependent on the contact area between it and the substrate, and the reduction in the pixel pitch size directly causes the black ink to fall off easily (especially for products with specifications below P0.6), and it cannot be applied to lamp board structures with tiny pixel pitches; for example, the high-precision dispensing machine used in process three is actually mainly suitable for products with specifications above P0.9, because as the pixel pitch continues to decrease, the process requirements of the equipment will continue to increase, the efficiency will continue to decrease, the cost will continue to increase, and the dispensing process will become more and more error-prone, and it cannot be applied to lamp board structures with tiny pixel pitches. Summary of the invention

[0008] The main purpose of the present invention is to provide a packaging process to solve the problem that the packaging process in the prior art that can improve the display contrast of the display screen cannot package the lamp board structure with LED chips with small spacing and small size.

[0009] In order to achieve the above-mentioned purpose, the present invention provides a packaging processing technology for packaging a lamp board structure, and the packaging processing technology includes: obtaining specification information of the lamp board structure; processing an annular enclosure structure on a substrate of the lamp board structure according to the specification information, and the annular enclosure structure is arranged around an LED chip of the lamp board structure; injecting a mixed colloid into the annular enclosure structure; centrifuging the lamp board structure after the mixed colloid is injected until the colored medium in the mixed colloid settles to form a layer between the colored medium and the transparent colloid in the mixed colloid; wherein the height of the colored medium layer is lower than the height of the LED chip; and baking the lamp board structure after the centrifugal treatment.

[0010] Furthermore, according to the specification information, the method for processing the annular enclosure structure on the substrate includes: obtaining a processing trajectory and a height H1 of the annular enclosure structure according to the specification information; and processing the annular enclosure structure with a height H1 along the processing trajectory.

[0011] Furthermore, the specification information includes the position of the functional area of ​​the light board structure, and the method for obtaining the processing trajectory of the annular enclosure structure includes: defining a pre-filled area on the substrate, the pre-filled area covering the functional area; wherein the contour line of the pre-filled area is the processing trajectory.

[0012] Furthermore, the specification information also includes a height H2 of the LED chip, and a method for obtaining the height H1 of the annular enclosure structure includes: setting the height H1, and the height H1 and the height H2 satisfy: H1>H2.

[0013] Furthermore, the method for processing the annular enclosure structure with a height H1 along the processing track includes: using a glue dispenser to dispense glue on the substrate along the processing track to process the annular enclosure structure with a height H1.

[0014] Furthermore, in the process of using the glue dispensing machine to glue along the processing track to form an annular enclosure structure with a height H1 on the substrate, the glue dispensing machine uses molding glue for glue dispensing processing.

[0015] Further, the specification information includes a height H2 of the LED chip, the mixed colloid has an injection volume value V, and a method for obtaining the injection volume value V includes: obtaining an area S1 of the pre-filled area and a total area S2 of the LED chip; setting a preset height H3 of the mixed colloid filled in the pre-filled area, and the preset height H3 satisfies: H3<H2; wherein the formula for calculating the injection volume value V is:

[0016] V1 = (S1 - S2) H3.

[0017] Furthermore, the method of centrifugally treating the lamp panel structure after the mixed colloid is injected includes: using an LED centrifugal sedimentation machine to centrifugally treat the lamp panel structure after the mixed colloid is injected.

[0018] Furthermore, after baking the centrifugally treated lamp board structure, the packaging process further includes: cutting the baked lamp board structure to cut the annular enclosure structure from the lamp board structure.

[0019] Furthermore, there is a preset distance between the contour line of the pre-filled area and the contour line of the functional area. The method for cutting the lamp board structure after baking includes: using a cutting device to cut the light board structure, and the cutting line of the cutting device is located between the contour line of the pre-filled area and the contour line of the functional area.

[0020] The technical solution of the present invention is applied, and the packaging process is used to package the light board structure and includes: obtaining the specification information of the light board structure; processing the annular enclosure structure on the substrate of the light board structure according to the specification information, and the annular enclosure structure is arranged around the LED chip of the light board structure; injecting the mixed colloid into the annular enclosure structure; centrifuging the light board structure after the mixed colloid is injected until the colored medium in the mixed colloid settles to form a layer between the colored medium layer and the transparent colloid in the mixed colloid. The height of the colored medium layer is less than the height of the LED chip; and baking the light board structure after the centrifugation. In this way, a receiving recess is actually formed between the annular enclosure structure and the substrate, so that the mixed colloid located in the receiving recess is blocked by the annular enclosure structure during the centrifugal treatment process, ensuring that the mixed colloid has a good centrifugal effect. During the centrifugal process, even if the size of the LED chip is small and the spacing between the LED chips is small, the mixed colloid will gradually flow into the gap between two adjacent LED chips and produce a stratification effect, that is, the colored medium will be well spread on the substrate and cannot flow to the light-emitting surface of the LED chip (the height of the colored medium layer is less than the height of the LED chip), thereby effectively improving the display contrast effect of subsequent products. It can be seen that the packaging process in the present application actually relies on the spontaneous flow and spontaneous stratification of the mixed colloid during the centrifugal process, and is no longer limited by size factors, thereby solving the problem that the packaging process that can improve the display contrast of the display screen in the prior art cannot package the light board structure with LED chips with small spacing and small size. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 A schematic diagram showing a process flow of an embodiment of a packaging process according to the present invention is shown;

[0023] Figure 2The overall structural schematic diagram of the lamp panel structure encapsulated by the encapsulation process of the invention is shown, after the pre-filling area is demarcated;

[0024] Figure 3 The overall structure schematic diagram of the lamp panel structure encapsulated by the encapsulation process of the invention after being filled with mixed colloid is shown;

[0025] Figure 4 Shows Figure 3 A is an enlarged schematic diagram;

[0026] Figure 5 Shows Figure 4 Cross-sectional view in

[0027] Figure 6 The cross-sectional view at point A of the lamp panel structure packaged by the packaging process of the invention after centrifugal treatment is shown.

[0028] The above drawings include the following reference numerals:

[0029] 10. Light board structure; 11. Substrate; 111. Pre-filled area; 112. Functional area; 12. LED chip; 20. Mixed colloid; 21. Colored medium; 22. Transparent colloid; 30. Annular enclosure structure. DETAILED DESCRIPTION

[0030] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0031] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0032] In the present invention, unless otherwise specified, the directional words used, such as "up" and "down", usually refer to the directions shown in the drawings, or to the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above directional words are not used to limit the present invention.

[0033] In order to solve the problem that the packaging process in the prior art that can improve the display contrast of the display screen cannot package the lamp board structure with LED chips with small pitch and small size, the present application provides a packaging process.

[0034] like Figures 1 to 6 As shown, the packaging process is used to package the light panel structure 10, and the packaging process includes:

[0035] Obtaining specification information of the light board structure 10;

[0036] According to the specification information, an annular enclosure structure 30 is processed on the substrate 11 of the lamp board structure 10, and the annular enclosure structure 30 is arranged around the LED chip 12 of the lamp board structure 10;

[0037] Injecting the mixed colloid 20 into the annular enclosure structure 30;

[0038] The lamp panel structure 10 after the mixed colloid 20 is injected is centrifuged until the colored medium 21 in the mixed colloid 20 settles to form a layer between the colored medium layer and the transparent colloid 22 in the mixed colloid 20; wherein the height of the colored medium layer is lower than the height of the LED chip 12;

[0039] The lamp panel structure 10 after the centrifugal treatment is baked.

[0040] The technical solution of this embodiment is applied, and the packaging process is used to package the light board structure 10 and includes: obtaining the specification information of the light board structure 10; processing the annular enclosure structure 30 on the substrate 11 of the light board structure 10 according to the specification information, and the annular enclosure structure 30 is arranged around the LED chip 12 of the light board structure 10; injecting the mixed colloid 20 into the annular enclosure structure 30; centrifuging the light board structure 10 after the mixed colloid 20 is injected, until the colored medium 21 in the mixed colloid 20 settles to form a layer between the colored medium layer and the transparent colloid 22 in the mixed colloid 20. The height of the colored medium layer is less than the height of the LED chip 12; and baking the light board structure 10 after the centrifugation. In this way, a receiving recess is actually formed between the annular enclosure structure 30 and the substrate 11, so that the mixed colloid 20 located in the receiving recess is blocked by the annular enclosure structure 30 during the centrifugal treatment process, ensuring that the mixed colloid 20 has a good centrifugal effect. During the centrifugal process, even if the size of the LED chip 12 is small and the spacing between the LED chips is small, the mixed colloid 20 will gradually flow into the gap between two adjacent LED chips 12 and produce a stratification effect, that is, the colored medium 21 will be well spread on the substrate 11 and cannot flow to the light-emitting surface of the LED chip 12 (the height of the colored medium layer is less than the height of the LED chip), thereby effectively improving the display contrast effect of subsequent products. It can be seen that the packaging process in this embodiment actually relies on the spontaneous flow and spontaneous stratification generated by the mixed colloid 20 during the centrifugal process, and is no longer limited by the size factor, thereby solving the problem that the packaging process that can improve the display contrast of the display screen in the prior art cannot package the light board structure with LED chips with small spacing and small size.

[0041] Specifically, since the packaging process in this embodiment actually relies on the spontaneous flow and spontaneous stratification generated by the mixed colloid 20 during the centrifugation process, the injection position is no longer restricted, that is, it is only necessary to ensure that it is injected into the annular enclosure structure 30. Therefore, the packaging equipment that uses the packaging process in this embodiment for packaging processing does not need to use a high-precision dispensing machine, which greatly reduces the processing cost of the packaging equipment.

[0042] Specifically, in the lamp board structure 10 packaged using the packaging processing technology in this embodiment, the colored medium 21 exists only in the gap between two adjacent LED chips 12, that is, there is no colored medium 21 on the light-emitting surface (upper surface) of the LED chip 12, so as to ensure high light-emitting consistency between each LED chip 12.

[0043] In this embodiment, the mixed colloid 20 is formed by mixing a colored medium 21 and a transparent colloid 22 .

[0044] Optionally, the colored medium 21 is toner.

[0045] Optionally, the transparent colloid 22 is epoxy resin or silicone.

[0046] Optionally, the height of the colored medium layer is optimally about 20 μm, so as to further improve the contrast display effect of a display screen formed by subsequent processing.

[0047] Specifically, due to the difference in physical characteristics such as density between the colored medium 21 and the transparent colloid 22 , the heavier colored medium 21 will spontaneously settle during the centrifugation of the mixed colloid 20 .

[0048] Specifically, baking the centrifugally processed lamp panel structure 10 can solidify the transparent colloid 22 , thereby ensuring that the colored medium 21 and the transparent colloid 22 can be firmly fixed on the lamp panel structure 10 .

[0049] In this embodiment, according to the specification information, the method for processing the annular enclosure structure 30 on the substrate 11 includes:

[0050] According to the specification information, the processing trajectory and height H1 of the annular enclosure structure 30 are obtained;

[0051] Along the machining track, an annular enclosure structure 30 with a machining height H1 is machined.

[0052] Specifically, the specification information includes the position of the functional area 112 of the light board structure 10, and the method for obtaining the processing trajectory of the annular enclosure structure 30 includes:

[0053] A pre-filled area 111 is defined on the substrate 11, and the pre-filled area 111 covers the functional area 112. The contour line of the pre-filled area 111 is a processing track.

[0054] In this way, the above-mentioned setting ensures that the mixed colloid 20 after centrifugal treatment can be spread and cover the functional area 112 of the lamp board structure 10, so as to ensure that the lamp board structure 10 has a high packaging effect while making sure that there is a colored medium layer in the gaps between all LED chips 12, further improving the display contrast effect of subsequent products.

[0055] In this embodiment, the annular enclosure structure 30 is rectangular.

[0056] It should be noted that the specific structure of the annular enclosure structure 30 is not limited thereto, and can be adjusted accordingly according to working conditions and usage requirements (mainly the shape of the functional area 112).

[0057] In this embodiment, the LED chip 12 is located in the functional area 112 of the light board structure 10 .

[0058] In this embodiment, the specification information also includes the height H2 of the LED chip 12. The method for obtaining the height H1 of the annular enclosure structure 30 includes:

[0059] A height H1 is set, and the height H1 and the height H2 satisfy: H1>H2.

[0060] In this way, the above setting ensures that the height H1 of the annular enclosure structure 30 is higher than the height H2 of the LED chip 12, so as to ensure that the annular enclosure structure 30 has a higher enclosure reliability, so as to avoid the mixed colloid 20 located in the annular enclosure structure 30 from splashing outside the annular enclosure structure 30 during the centrifugation process, thereby ensuring that the amount of the mixed colloid 20 in the annular enclosure structure 30 will not change, so as to improve the packaging effect of the lamp panel structure 10, and make the working environment cleaner and tidier.

[0061] In this embodiment, the method for processing the annular enclosure structure 30 with a height H1 along the processing trajectory includes:

[0062] The dispensing machine is used to dispense glue on the substrate 11 along the processing track to form an annular enclosure structure 30 with a height H1.

[0063] In this way, the above arrangement makes the processing method of the annular enclosure structure 30 simpler and easier to implement, thereby reducing the processing cost of the annular enclosure structure 30 and the processing difficulty of the staff.

[0064] In this embodiment, in the process of using the glue dispenser to glue the substrate 11 along the processing track to form the annular enclosure structure 30 with a height H1, the glue dispenser uses molding glue for glue dispensing. In this way, the molding glue has a high molding speed during the glue dispensing process of the glue dispenser, so as to avoid the overflow of the glue and affect the packaging quality of the light board structure 10 and the processing quality of the annular enclosure structure 30.

[0065] In this embodiment, the specification information includes the height H2 of the LED chip 12, and the mixed colloid 20 has an injection volume value V. The method for obtaining the injection volume value V includes:

[0066] Obtaining the area S1 of the pre-filled region 111 and the total area S2 of the LED chips 12;

[0067] A preset height H3 of the mixed colloid 20 filled in the pre-filling area 111 is set, and the preset height H3 satisfies: H3<H2;

[0068] The formula for calculating the injection volume value V is:

[0069] V1 = (S1 - S2) H3.

[0070] In this way, the setting of the preset injection volume value V actually enables the mixed colloid 20 to flow completely into the gap between two adjacent LED chips 12, that is, after the centrifugal treatment contact, there is basically no colloid left on the light-emitting surface (upper surface) of the LED chip 12, thereby preventing the colored medium 21 from following the excess colloid to settle on the light-emitting surface of the LED chip and affecting the display contrast effect of subsequent products. At the same time, the above setting also provides the staff with a calculation method for the injection volume value V, so that the staff can quickly calculate the injection volume value V required for the light board structure 10 of different specifications and sizes.

[0071] Specifically, even if the mixed colloid 20 is not injected into the gap between two adjacent LED chips 12, the mixed colloid 20 can gradually flow into the gap between two adjacent LED chips 12 under the action of centrifugal force. At the same time, the setting of the preset injection volume value V can ensure that the mixed colloid 20 will not remain on the upper surface of the LED chip 12, so the mixed colloid 20 in this embodiment only needs to be injected into any position in the annular enclosure structure 30.

[0072] In this embodiment, the method of centrifuging the light panel structure 10 after the mixed colloid 20 is injected includes:

[0073] The LED centrifugal sedimentation machine is used to centrifuge the lamp panel structure 10 after the mixed colloid 20 is injected.

[0074] In this embodiment, after the centrifugation-treated lamp panel structure 10 is baked, the packaging process further includes:

[0075] The lamp panel structure 10 after the baking process is cut to cut the annular enclosure structure 30 from the lamp panel structure 10 .

[0076] In this way, the above arrangement can cut and remove the redundant annular enclosure structure 30 after the lamp board structure 10 is completed, so as to avoid the annular enclosure structure 30 affecting the subsequent processing flow of the lamp board structure 10 .

[0077] In this embodiment, there is a preset distance between the contour line of the pre-filled area 111 and the contour line of the functional area 112, and the method for cutting the light panel structure 10 after baking includes:

[0078] The light panel structure 10 is cut by a cutting device, and the cutting line of the cutting device is located between the outline of the pre-filled area 111 and the outline of the functional area 112 .

[0079] In this way, the above setting reserves cutting space for the cutting device to ensure that the cutting device will not damage the functional area 112 of the light board structure 10 during the process of cutting and removing the annular enclosure structure 30, further improving the packaging quality of the light board structure 10.

[0080] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0081] The packaging process is used to package the light board structure and includes: obtaining specification information of the light board structure; processing an annular enclosure structure on the substrate of the light board structure according to the specification information, the annular enclosure structure is arranged around the LED chip of the light board structure; injecting a mixed colloid into the annular enclosure structure; centrifuging the light board structure after the mixed colloid is injected until the colored medium in the mixed colloid settles to be layered between the transparent colloid in the mixed colloid. Wherein, the height of the colored medium layer is less than the height of the LED chip; baking the light board structure after the centrifugation. In this way, a receiving recess is actually formed between the annular enclosure structure and the substrate, so that the mixed colloid located in the receiving recess is blocked by the annular enclosure structure during the centrifugation process, ensuring that the mixed colloid has a good centrifugal effect, and during the centrifugation process, even if the size of the LED chip is small and the spacing between the LED chips is small, the mixed colloid will gradually flow into the gap between two adjacent LED chips and produce a layered effect, that is, the colored medium will be well spread on the substrate and cannot flow to the light-emitting surface of the LED chip (the height of the colored medium layer is less than the height of the LED chip), thereby effectively improving the display contrast effect of subsequent products. It can be seen that the packaging process in the present application actually relies on the spontaneous flow and spontaneous stratification generated by the mixed colloid during the centrifugation process, and is no longer limited by size factors, thereby solving the problem that the packaging process in the prior art that can improve the display contrast of the display screen cannot package the lamp board structure with LED chips with small spacing and small size.

[0082] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0083] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0084] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging process for packaging a light panel structure (10), characterized in that: The packaging process includes: Obtaining specification information of the light panel structure (10); According to the specification information, an annular enclosure structure (30) is processed on the substrate (11) of the light board structure (10), wherein the annular enclosure structure (30) is arranged around the LED chip (12) of the light board structure (10); Injecting a mixed colloid (20) into the annular enclosure structure (30); The lamp panel structure (10) after the mixed colloid (20) is injected is centrifuged until the colored medium (21) in the mixed colloid (20) settles to form a layer between the colored medium layer and the transparent colloid (22) in the mixed colloid (20); wherein the height of the colored medium layer is lower than the height of the LED chip (12); The lamp panel structure (10) after the centrifugal treatment is subjected to a baking treatment.

2. The packaging process according to claim 1, characterized in that: According to the specification information, a method for machining an annular enclosure structure (30) on the substrate (11) comprises: According to the specification information, obtaining a processing track and a height H1 of the annular enclosure structure (30); An annular enclosure structure (30) with a processing height H1 is processed along the processing track.

3. The packaging process according to claim 2, characterized in that: The specification information includes the position of the functional area (112) of the light panel structure (10), and the method for obtaining the processing trajectory of the annular enclosure structure (30) includes: A pre-filled area (111) is defined on the substrate (11), wherein the pre-filled area (111) covers the functional area (112); wherein the contour line of the pre-filled area (111) is the processing track.

4. The packaging process according to claim 2, characterized in that: The specification information also includes a height H2 of the LED chip (12), and a method for obtaining the height H1 of the annular enclosure structure (30) includes: The height H1 is set, and the height H1 and the height H2 satisfy: H1>H2.

5. The packaging process according to claim 2, characterized in that: A method for machining an annular enclosure structure (30) with a height H1 along the machining trajectory comprises: A dispensing machine is used to dispense glue on the substrate (11) along the processing track to form an annular enclosure structure (30) with a height H1.

6. The packaging process according to claim 5, characterized in that: In the process of using a glue dispensing machine to glue-dispense a ring-shaped enclosure structure (30) with a height H1 on the substrate (11) along the processing track, the glue dispensing machine uses molding glue to perform glue dispensing processing.

7. The packaging process according to claim 3, characterized in that: The specification information includes a height H2 of the LED chip (12), the mixed colloid (20) has an injection volume value V, and a method for obtaining the injection volume value V includes: Obtaining the area S1 of the pre-filled region (111) and the total area S2 of the LED chips (12); A preset height H3 of the mixed colloid (20) filled in the pre-filled area (111) is set, and the preset height H3 satisfies: H3<H2; Wherein, the formula for calculating the injection volume value V is: V1 = (S1 - S2) H3.

8. The packaging process according to claim 1, characterized in that: The method of centrifuging the lamp panel structure (10) after the mixed colloid (20) is injected comprises: The LED centrifugal sedimentation machine is used to centrifuge the lamp panel structure (10) after the mixed colloid (20) is injected.

9. The packaging process according to claim 3, characterized in that: After the centrifugally processed lamp panel structure (10) is baked, the packaging process further comprises: The lamp panel structure (10) after the baking process is cut to cut the annular enclosure structure (30) from the lamp panel structure (10).

10. The packaging process according to claim 9, characterized in that: There is a preset distance between the contour line of the pre-filled area (111) and the contour line of the functional area (112), and the method for cutting the light panel structure (10) after baking comprises: The lamp panel structure (10) is cut using a cutting device, wherein a cutting line of the cutting device is located between the contour line of the pre-filled area (111) and the contour line of the functional area (112).

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