Card holder processing method, card holder and electronic equipment

Abstract

The invention provides a card tray processing method, a card tray and electronic equipment, and belongs to the technical field of electronic equipment. The method comprises the following steps: punching a plate so as to form a pull rod hole and a first group of positioning holes in the plate; the plate obtained after punching is conducted is ground; cNC machining is conducted on the front face of the ground plate so that a second set of positioning holes can be formed in the plate; cNC machining is conducted on the back face of the plate subjected to front face machining, so that a card support cap blank is formed; performing surface treatment on the card support cap blank to obtain a card support cap to be stamped; stamping and blanking the card support cap to be stamped to obtain the card support cap; and obtaining a middle plate, and carrying out injection molding processing on the middle plate and the card support cap to form the card support. The technical effects that the machining precision can be improved, and the production efficiency can be improved are achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic equipment, and in particular relates to a card tray processing method, a card tray and an electronic equipment. Background Art

[0002] As a key component for loading SIM cards, the manufacturing accuracy and quality of the card tray are crucial to ensure the stability of mobile phone signal reception and the user experience. As smartphones develop towards lighter, thinner and more high-performance, the processing requirements for mobile phone card trays are getting higher and higher. At present, in electronic equipment technology, most card tray processing processes use a relatively single processing method, such as simple stamping or injection molding. Although it can meet basic manufacturing needs, it is difficult to avoid the accumulation of processing errors during the card tray processing process. There are certain limitations in processing accuracy, production efficiency and material utilization, which is not conducive to reducing manufacturing costs.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0004] The technical problems to be solved by the present invention are poor machining accuracy and low production efficiency.

[0005] In order to solve the above technical problems, the present invention provides a Cato processing method, which includes punching a plate to form a pull rod hole and a first group of positioning holes on the plate; grinding the plate after punching; CNC processing the front side of the plate after grinding to form a second group of positioning holes on the plate; CNC processing the back side of the plate after front processing to form a Cato cap blank; surface treatment of the Cato cap blank to obtain a Cato cap to be punched; stamping and blanking the Cato cap to be punched to obtain a Cato cap; obtaining a middle plate, and injection molding the middle plate and the Cato cap to form a Cato.

[0006] Optionally, the CNC processing of the front side of the plate after grinding includes: using the first group of positioning holes as the positioning reference in the XY direction and the back side of the plate as the positioning reference in the Z direction, and CNC processing the front side of the plate after grinding.

[0007] Optionally, the CNC processing of the back side of the plate after the front side processing includes: using the second group of positioning holes as the positioning reference in the XY direction, the front side of the plate as the positioning reference in the Z direction, and CNC processing the back side of the plate after the front side processing.

[0008] Optionally, the surface treatment of the cador cap blank includes sandblasting, and the sandblasting includes: using zirconium sand as a sandblasting material to sandblast the cador cap blank.

[0009] Optionally, the surface treatment of the CAT cap blank includes anodizing, and the anodizing includes: anodizing the CAT cap blank according to a preset thickness value to form an anodized film on the CAT cap blank, wherein the thickness value ranges from 5 μm to 10 μm.

[0010] Optionally, the injection molding of the middle plate and the card tray cap to form the card tray includes: placing the card tray cap and the middle plate into a mold for primary injection molding to form the card tray; and performing secondary injection molding on the card tray to add a waterproof silicone ring on the card tray.

[0011] Optionally, placing the card holder cap and the middle plate into a mold for one-time injection molding comprises: using a composite material of polycarbonate added with 20% glass fiber to perform one-time injection molding on the card holder cap and the middle plate in a mold.

[0012] Optionally, punching the plate includes: punching the plate according to a preset flatness, wherein the flatness is no greater than 0.10 mm.

[0013] According to another aspect of the present invention, the present invention further provides a card tray, wherein the card tray cap is manufactured by the card tray processing method.

[0014] According to another aspect of the present invention, the present invention further provides an electronic device, comprising a shell, the shell being provided with a card holder hole, and the card holder being detachably received in the card holder hole and connected to the shell.

[0015] Beneficial effects:

[0016] The present invention provides a method for processing a caddy, wherein a plate is punched to form a tie rod hole and a first group of positioning holes on the plate. The punched plate is ground, and the front of the ground plate is CNC-processed to form a second group of positioning holes on the plate. The back of the plate after the front processing is CNC-processed to form a caddy cap blank. The caddy cap blank is surface-treated to obtain a caddy cap to be punched. The caddy cap to be punched is punched and blanked to obtain the caddy cap. A middle plate is obtained, and the middle plate and the caddy cap are injection-molded to form a caddy. In this way, a tie rod hole, a first group of positioning holes and a second group of positioning holes are formed on the plate by punching, grinding and CNC processing, which provides a positioning basis for the subsequent processing of the caddy cap, and at the same time forms a caddy cap blank to ensure the initial shape, size and position of the caddy. The surface quality, surface finish and corrosion resistance of the caddy cap are improved by surface-treating the caddy cap blank. The card holder cap and the middle plate after stamping are processed by injection molding to complete the overall processing of the card holder, ensuring the high precision and high quality of the card holder. This achieves the technical effect of improving processing accuracy and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A flowchart of a tray processing method provided in an embodiment of the present invention.

[0019] Figure 2 A schematic diagram of the structure of a plate in a tray processing method provided in an embodiment of the present invention.

[0020] Figure 3 A schematic structural diagram of a first group of positioning holes in a tray processing method provided in an embodiment of the present invention.

[0021] Figure 4 A schematic structural diagram of a second group of positioning holes in a tray processing method provided in an embodiment of the present invention.

[0022] Figure 5 A schematic structural diagram of a tray cap blank in a tray processing method provided in an embodiment of the present invention.

[0023] Figure 6 A schematic structural diagram of a tray cap in a tray processing method provided in an embodiment of the present invention.

[0024] Figure 7A schematic structural diagram of a card tray provided in an embodiment of the present invention.

[0025] Figure 8 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention.

[0026] The meanings of the numbers in the accompanying drawings are: 1—plate material, 11—pull rod hole, 12—first group of positioning holes, 13—second group of positioning holes, 14—front side, 15—back side; 2—card holder cap blank, 21—card holder cap; 3—middle plate; 4—card holder; 5—composite material, 51—waterproof silicone ring; 6—electronic device, 61—housing, 62—card holder hole. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limitations on the present application. In order to enable those skilled in the art to better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0028] It should be noted that, in the embodiments of the present application, at least one refers to one or more; multiple refers to two or more. The terms "first", "second", "third", or "first", "then", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, and it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances, and it is not intended to limit the present invention.

[0029] References to "one embodiment" or "some embodiments" etc. described in this specification mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, in this specification, the terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. It should be noted that in the embodiments of the present application, "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone.

[0030] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. It should be understood that the various steps recorded in the method embodiments disclosed in the present invention may be performed in different orders and / or performed in parallel. In addition, the method embodiments may include other steps and / or omit certain steps.

[0031] See also Figures 1 to 6 , Figure 1 It is a flow chart of a method for processing a tray 4 provided in an embodiment of the present invention. Figure 2 It is a structural schematic diagram of a plate 3 material 1 in a method for processing a tray 4 provided in an embodiment of the present invention. Figure 3 It is a structural schematic diagram of a first group of positioning holes 12 in a method for processing a tray 4 provided in an embodiment of the present invention. Figure 4 It is a structural schematic diagram of a second group of positioning holes 13 in a method for processing a tray 4 provided in an embodiment of the present invention. Figure 5 It is a structural schematic diagram of a tray cap blank 2 in a tray 4 processing method provided in an embodiment of the present invention. Figure 6 1 is a schematic diagram of the structure of a tray cap 21 in a tray processing method provided by an embodiment of the present invention. A tray processing method 4 provided by an embodiment of the present invention comprises the following steps:

[0032] Step S100, punching the plate 1 to form a pull rod hole 11 and a first group of positioning holes 12 on the plate 1; wherein punching the plate 1 includes: punching the plate 1 according to a preset flatness, wherein the flatness is not greater than 0.10 mm.

[0033] Specifically, the sheet 1 can be cut according to the design size of the mobile phone card tray 4 to ensure that the dimensional accuracy is controlled within ±0.02mm. Then, a punching device is used to perform punching processing to form a pull rod hole 11 and a first group of positioning holes 12 on the sheet 1. The first group of positioning holes 12 includes a plurality of spaced positioning holes. At the same time, before punching, the sheet 1 is pretreated to ensure that the flatness of the sheet 1 is controlled within 0.1mm to ensure the accuracy of subsequent processing and reduce the accumulation of errors in subsequent processing. According to the material and thickness of the sheet 1, a suitable punching speed and pressure can be set. After punching, quality inspection can be carried out, including checking the flatness, grain size and performance test report to ensure that the quality of the sheet 1 meets the processing requirements.

[0034] Step S200, grinding the punched plate 1;

[0035] Specifically, after forming the pull rod hole 11 and the first group of positioning holes 12 on the plate 1 through the above step S100, the punched plate 1 is ground to remove burrs and unevenness that may be generated during the punching process, which is beneficial to improving the surface quality of the plate 1. According to the material and thickness of the plate 1, a suitable grinding speed and pressure can be set. During the grinding process, a cooling system can also be used to prevent the plate 1 from overheating and deformation to ensure the grinding quality. And through the punching and grinding operations of the above steps S100 and S200, an accurate reference can be provided for the subsequent CNC processing of steps S300 and S400 to ensure the position accuracy and shape accuracy of the card holder cap blank 2.

[0036] Step S300, CNC processing is performed on the front side 14 of the plate 1 after grinding to form a second group of positioning holes 13 on the plate 1; wherein the CNC processing of the front side 14 of the plate 1 after grinding includes: using the first group of positioning holes 12 as the positioning reference in the XY direction, and the back side 15 of the plate 1 as the positioning reference in the Z direction, and CNC processing is performed on the front side 14 of the plate 1 after grinding.

[0037] Specifically, after the plate 1 is ground in step S200, the front side 14 of the ground plate 1 can be processed by CNC processing technology, and a four-axis CNC machine tool can be used for processing to form a second group of positioning holes 13 on the plate 1. During the processing, the first group of positioning holes 12 is used as the positioning reference in the XY direction, and the back side 15 of the plate 1 is used as the positioning reference in the Z direction to ensure the accuracy and precision of the CNC processing.

[0038] Step S400, CNC processing is performed on the back side 15 of the plate 1 after the front side 14 is processed to form a card holder cap blank 2; wherein, the CNC processing of the back side 15 of the plate 1 after the front side 14 is processed includes: using the second group of positioning holes 13 as the positioning reference in the XY direction, and the front side 14 of the plate 1 as the positioning reference in the Z direction, and CNC processing is performed on the back side 15 of the plate 1 after the front side 14 is processed.

[0039] Specifically, with the second group of positioning holes 13 as the positioning reference in the XY direction and the front side 14 of the plate 1 as the positioning reference in the Z direction, the back side 15 of the plate 1 is CNC machined to form a bracket cap blank 2. The appropriate cutting speed and feed rate can be set according to the material and thickness of the plate 1. Before CNC machining, the plate 1 can also be pretreated, such as removing surface impurities, to improve the quality and efficiency of machining. After CNC machining, precise positioning can be achieved and the preliminary shape of the bracket cap 21 can be machined.

[0040] Step S500, performing surface treatment on the cador cap blank 2 to obtain the cador cap 21 to be punched, wherein the surface treatment includes grinding, sandblasting and anodizing, and the sandblasting of the cador cap blank 2 includes: using zircon sand as a sandblasting material to sandblast the cador cap blank 2. The anodizing of the cador cap blank 2 includes: performing anodizing on the cador cap blank 2 according to a preset thickness value to form an anodized film on the cador cap blank 2, wherein the thickness value ranges from 5 μm to 10 μm.

[0041] Specifically, after the Cato cap blank 2 is formed through the above steps S100 to S400, the Cato cap blank 2 can be polished, sandblasted and anodized in sequence. The polishing process can remove the processing marks and improve the surface finish. The sandblasting process uses zirconium sand as the sandblasting material to enhance the surface roughness and adhesion. In addition, deburring and a comprehensive inspection can be performed between the above steps S400 and S500. A comprehensive inspection is performed after polishing, sandblasting, and anodizing. An anodizing treatment is performed and based on a preset thickness value, such as a thickness value between 5μm and 10μm, to form a corrosion-resistant anodized film. Through polishing, sandblasting and anodizing, the surface finish and corrosion resistance of the Cato cap 21 can be significantly improved, providing a good foundation for the subsequent injection molding process of step S700.

[0042] Step S600, punching and blanking the card holder cap 21 to be punched to obtain the card holder cap 21;

[0043] Specifically, after obtaining the to-be-punched tray cap 21 through the above steps S100 to S500, the tray cap 21 to be punched can be punched and blanked, that is, a stamping device is used to apply pressure to the tray cap 21 to be punched, so that the tray cap 21 is separated along a predetermined contour line. For example, a multi-stage stamping process can be used to gradually approach the final shape, ensure the yield, and form a finished tray cap 21 that meets the design specifications.

[0044] Step S700, obtaining the middle plate 3, and performing injection molding of the middle plate 3 and the card holder cap 21 to form the card holder 4. The injection molding of the middle plate 3 and the card holder cap 21 to form the card holder 4 includes: placing the card holder cap 21 and the middle plate 3 in a mold for a first injection molding to form the card holder 4; performing a second injection molding on the card holder 4 to add a waterproof silicone ring 5 on the card holder 4. The placing of the card holder cap 21 and the middle plate 3 in a mold for a first injection molding includes: using a composite material 5 of polycarbonate added with 20% glass fiber to perform a first injection molding on the card holder cap 21 and the middle plate 3 in a mold.

[0045] Specifically, after obtaining the Cato cap 21 through the above steps S100 to S600, the middle plate 3 and the Cato cap 21 are injection molded to form the Cato 4. In addition, a comprehensive inspection can be performed between the above steps S600 and S700. After completing step S700, a comprehensive inspection can also be performed and the Cato 4 can be packaged and shipped. It should be noted that during the injection molding process, the Cato cap 21 and the middle plate 3 are first placed inside the mold, and a polycarbonate composite material 5 with 20% glass fiber is used for one injection molding to improve the mechanical strength of the Cato 4 and to form an injection molding structure at a preset position. The polycarbonate composite material 5 with 20% glass fiber means that the mass proportion of glass fiber in the composite material 5 is 20%. Subsequently, the Cato 4 is subjected to secondary injection molding, and a waterproof silicone ring 5 is added to enhance the waterproof performance of the Cato 4. After the middle plate 3 and the Cato cap 21 are injection molded, the overall manufacturing of the Cato 4 is completed, realizing the complete transformation process from raw materials to finished products.

[0046] The present invention provides a method for processing a Cato 4, wherein a plate 1 is punched to form a pull rod hole 11 and a first group of positioning holes 12 on the plate 1. The plate 1 after punching is ground, and the front side 14 of the ground plate 1 is CNC-processed to form a second group of positioning holes 13 on the plate 1. The back side 15 of the plate 1 after the front side 14 is processed is CNC-processed to form a Cato cap blank 2. The Cato cap blank 2 is sequentially polished, sandblasted, and anodized to obtain a Cato cap 21 to be punched. The Cato cap 21 to be punched is punched and blanked to obtain the Cato cap 21. A middle plate 3 is obtained, and the middle plate 3 and the Cato cap 21 are injection molded to form a Cato 4. In this way, the pull rod hole 11, the first group of positioning holes 12 and the second group of positioning holes 13 are formed on the plate 1 by punching, grinding and CNC processing, providing a positioning basis for the subsequent processing of the Cato cap 21, and at the same time forming the Cato cap blank 2 to ensure the initial shape, size and position of the Cato 4. The surface quality, surface finish and corrosion resistance of the Cato cap 21 are improved by grinding, sandblasting and anodizing the Cato cap blank 2. The Cato cap 21 and the middle plate 3 after stamping and blanking are injection molded to complete the overall processing of the Cato 4, ensuring the high precision and high quality of the Cato 4. Thereby achieving the technical effect of improving processing accuracy and improving production efficiency.

[0047] In order to explain in detail a card tray 4 provided by the present invention, the above-mentioned embodiment 1 explains in detail a card tray 4 processing method. Based on the same inventive concept, the present application also provides a card tray 4, see embodiment 2 for details.

[0048] See also Figure 7 , Figure 7 1 is a schematic diagram of the structure of a card tray 4 provided in an embodiment of the present invention. Embodiment 2 of the present invention provides a card tray 4, wherein the card tray cap 21 is manufactured by the card tray 4 processing method.

[0049] The present invention provides a tray 4, which is formed by punching a plate 1 to form a pull rod hole 11 and a first group of positioning holes 12 on the plate 1. The plate 1 after punching is ground, and the front side 14 of the ground plate 1 is CNC-processed to form a second group of positioning holes 13 on the plate 1. The back side 15 of the plate 1 after the front side 14 is processed is CNC-processed to form a tray cap blank 2. The tray cap blank 2 is sequentially ground, sandblasted and anodized to obtain a tray cap 21 to be punched. The tray cap 21 to be punched is punched and blanked to obtain the tray cap 21. The middle plate 3 is obtained, and the middle plate 3 and the tray cap 21 are injection molded to form the tray 4. In this way, the pull rod hole 11, the first group of positioning holes 12 and the second group of positioning holes 13 are formed on the plate 1 by punching, grinding and CNC processing, providing a positioning basis for the subsequent processing of the Cato cap 21, and at the same time forming the Cato cap blank 2 to ensure the initial shape, size and position of the Cato 4. The surface quality, surface finish and corrosion resistance of the Cato cap 21 are improved by grinding, sandblasting and anodizing the Cato cap blank 2. The Cato cap 21 after stamping and blanking is injection molded with the middle plate 3 to complete the overall processing of the Cato 4, ensuring the high precision and high quality of the Cato 4. Thereby achieving the technical effect of improving processing accuracy and improving production efficiency.

[0050] In order to explain in detail an electronic device 6 provided by the present invention, the above-mentioned embodiment one explains in detail a method for processing a tray 4. Based on the same inventive concept, the present application also provides an electronic device 6, see embodiment three for details.

[0051] See also Figure 8 , Figure 8 Schematic diagram of the structure of an electronic device 6 provided in an embodiment of the present invention. Embodiment 3 of the present invention provides an electronic device 6, the electronic device 6 comprises a housing 61, the housing 61 is provided with a card holder hole 62, and the card holder 4, the card holder 4 is detachably received in the card holder hole 62, and is connected to the housing 61.

[0052] The present invention provides an electronic device 6, which forms a pull rod hole 11 and a first group of positioning holes 12 on the plate 1 by punching a plate 1. The plate 1 after punching is ground, and the front side 14 of the ground plate 1 is CNC-processed to form a second group of positioning holes 13 on the plate 1. The back side 15 of the plate 1 after the front side 14 is processed is CNC-processed to form a card holder cap blank 2. The card holder cap blank 2 is sequentially ground, sandblasted and anodized to obtain a card holder cap 21 to be punched. The card holder cap 21 to be punched is punched and blanked to obtain the card holder cap 21. The middle plate 3 is obtained, and the middle plate 3 and the card holder cap 21 are injection molded to form a card holder 4. The card holder 4 is then detachably accommodated inside the card holder hole 62 located in the shell 61. In this way, the pull rod hole 11, the first group of positioning holes 12 and the second group of positioning holes 13 are formed on the plate 1 by punching, grinding and CNC processing, providing a positioning basis for the subsequent processing of the Cato cap 21, and at the same time forming the Cato cap blank 2 to ensure the initial shape, size and position of the Cato 4. The surface quality, surface finish and corrosion resistance of the Cato cap 21 are improved by grinding, sandblasting and anodizing the Cato cap blank 2. The Cato cap 21 after stamping and blanking is injection molded with the middle plate 3 to complete the overall processing of the Cato 4, ensuring the high precision and high quality of the Cato 4. Thereby achieving the technical effect of improving processing accuracy and improving production efficiency.

[0053] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A tray processing method, characterized in that: The tray processing method comprises: Punching the plate to form a tie rod hole and a first group of positioning holes on the plate; Grinding the punched plate; Performing CNC machining on the front side of the plate after grinding to form a second set of positioning holes on the plate; Performing CNC processing on the back side of the plate after the front side processing to form a blank of a card holder cap; Performing surface treatment on the blank of the cartridge cap to obtain the cartridge cap to be punched; Punching and blanking the cador cap to be punched to obtain the cador cap; A middle plate is obtained, and the middle plate and the card holder cap are injection molded to form a card holder.

2. The tray processing method according to claim 1, characterized in that: The CNC processing of the front side of the plate after grinding includes: using the first group of positioning holes as the positioning reference in the XY direction, the back side of the plate as the positioning reference in the Z direction, and CNC processing the front side of the plate after grinding.

3. The tray processing method according to claim 1, characterized in that: The CNC processing of the back side of the plate after the front side processing includes: using the second group of positioning holes as the positioning reference in the XY direction, the front side of the plate as the positioning reference in the Z direction, and CNC processing the back side of the plate after the front side processing.

4. The tray processing method according to claim 1, characterized in that: The surface treatment of the cador cap blank includes sandblasting, and the sandblasting includes: using zirconium sand as a sandblasting material to sandblast the cador cap blank.

5. The tray processing method according to claim 1, characterized in that: The surface treatment of the cador cap blank includes anodizing treatment, and the anodizing treatment includes: anodizing the cador cap blank according to a preset thickness value to form an anodized film on the cador cap blank, wherein the thickness value ranges from 5μm to 10μm.

6. The tray processing method according to claim 1, characterized in that: The injection molding of the middle plate and the card tray cap to form the card tray includes: placing the card tray cap and the middle plate into a mold for primary injection molding to form the card tray; and performing secondary injection molding on the card tray to add a waterproof silicone ring on the card tray.

7. The tray processing method according to claim 6, characterized in that: The placing of the card holder cap and the middle plate in a mold for one-time injection molding comprises: using a composite material of polycarbonate added with 20% glass fiber to perform one-time injection molding on the card holder cap and the middle plate in a mold.

8. The tray processing method according to claim 1, characterized in that: Punching the plate includes: punching the plate according to a preset flatness, wherein the flatness is no greater than 0.10 mm.

9. A card tray, characterized in that: The card holder cap is made by the card holder processing method described in any one of claims 1 to 8.

10. An electronic device, characterized in that: The electronic device comprises: a shell, the shell is provided with a card holder hole, and the card holder according to claim 9, the card holder is detachably accommodated in the card holder hole and connected to the shell.

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