Epoxy resin composition for semiconductor sealing and sealing method

Abstract

The invention discloses an epoxy resin composition for semiconductor sealing and a sealing method, and relates to the technical field of semiconductor sealing, the composition comprises the following components: 50-80 parts of epoxy resin, 10-30 parts of a hyaluronic acid derivative, 10-20 parts of a curing agent, 2-5 parts of a flame retardant, 1-3 parts of a coupling agent, and 0.5-2 parts of an antioxidant. By adding the special hyaluronic acid derivative, the compatibility with human tissues is remarkably improved, the hyaluronic acid derivative not only retains the good biocompatibility of hyaluronic acid, but also enhances the dispersity and functionality of the hyaluronic acid derivative in the epoxy resin through chemical modification, so that when the packaging material is in contact with the human tissues, the packaging material has the good biocompatibility, and the packaging effect is greatly improved. The adverse effects such as immune response can be reduced, and the long-term stability and safety of biomedical semiconductor devices such as implantable medical chips and the like in a human body can be ensured.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor sealing, in particular to an epoxy resin composition for semiconductor sealing and a sealing method. Background Art

[0002] Semiconductor packaging technology is an important part of the modern electronics industry, especially in the biomedical field, such as implantable medical chips, which have particularly stringent requirements for semiconductor packaging. Semiconductor packaging not only requires physical protection and electrical connections, but also good biocompatibility to ensure safety and reliability during long-term work inside the human body. Epoxy resin, as a commonly used packaging material, has been widely used in the field of semiconductor packaging due to its good mechanical properties, chemical stability and cost-effectiveness.

[0003] Traditional epoxy resin compositions and sealing methods have many shortcomings in biomedical-related semiconductor packaging. On the one hand, traditional epoxy resin compositions often have poor wettability and flexibility, making it difficult to form good contact with human tissues and easily inducing adverse consequences such as immune responses. On the other hand, for semiconductor chips with complex structures, such as implantable medical chips, traditional sealing methods are difficult to ensure the integrity and reliability of the seal. In terms of material usage, traditional methods are often not accurate enough, prone to waste, and difficult to achieve personalized sealing of chips of different structures and sizes. In addition, traditional technologies lack the ability to simultaneously embed functional micro-nano components during the sealing process, limiting the functional diversity of semiconductor devices in biomedical applications.

[0004] In view of the above problems, it is necessary to optimize the existing epoxy resin composition and sealing method for semiconductor sealing. By adding specially prepared hyaluronic acid derivatives, not only the good biocompatibility of hyaluronic acid is retained, but also the epoxy resin composition is given excellent wettability and flexibility. At the same time, innovative sealing technology is used to achieve personalized sealing of complex chips. Therefore, it is of great significance to develop an epoxy resin composition and sealing method for semiconductor sealing that can comprehensively realize the above characteristics. Summary of the invention

[0005] The purpose of the present invention is to make up for the shortcomings of the prior art and provide an epoxy resin composition and a sealing method for semiconductor sealing. It can not only retain the good biocompatibility of hyaluronic acid, but also give the epoxy resin composition excellent wettability and flexibility by adding a specifically prepared hyaluronic acid derivative. At the same time, it adopts innovative sealing technology to organically combine the steps of chip preparation, vacuum pretreatment, epoxy resin composition droplet preparation, droplet injection sealing, component embedding, and curing molding, thereby realizing personalized sealing of complex chips, reducing material waste, and ensuring the integrity and reliability of the seal. In addition, the method can also simultaneously embed functional micro-nano components such as microsensors during the sealing process, providing a more efficient, reliable and functional solution for semiconductor sealing.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: on the one hand, an epoxy resin composition for semiconductor sealing, the composition comprising the following components: epoxy resin: 50-80 parts, hyaluronic acid derivative: 10-30 parts, curing agent: 10-20 parts, flame retardant: 2-5 parts, coupling agent: 1-3 parts, antioxidant: 0.5-2 parts.

[0007] Furthermore, the epoxy resin is bisphenol A epoxy resin.

[0008] Furthermore, the hyaluronic acid derivative is obtained by chemically modifying natural hyaluronic acid. Specifically, hyaluronic acid extracted from cockscomb is selected as the starting material, and the molecular weight is between 1 million and 2 million Daltons. The hyaluronic acid is dissolved in a phosphate buffer solution with a pH value of 7.0-7.5 to form a hyaluronic acid solution with a concentration of 5%-10% w / v. Hydroxyethyl acrylate is added to the hyaluronic acid solution in an amount of 10%-30% of the mass of the hyaluronic acid. The hyaluronic acid solution is heated to 30°C and heated to 40°C. , react for 3-5 hours at a stirring speed of 200-300 rpm. After the reaction is completed, filter out unreacted reagents and impurities, and use the pore size difference of the filter medium to retain larger particles of unreacted substances and impurities to obtain a preliminary purified filtrate. Then, use a dialysis bag with a molecular weight cutoff of 8000-10000 Daltons to dialyze the filtrate for 24-48 hours to remove small molecule impurities, and obtain a hyaluronic acid derivative by cooling and drying at -50°C for 8-12 hours.

[0009] Furthermore, the curing agent is m-phenylenediamine, the flame retardant is aluminum hydroxide, the coupling agent is γ-aminopropyltriethoxysilane, and the antioxidant is antioxidant 1010.

[0010] Furthermore, the preparation method of the epoxy resin composition is: according to claims 1-4, weigh the epoxy resin, hyaluronic acid derivative, curing agent and other additives, add the weighed epoxy resin and hyaluronic acid derivative into a mixing container, and pre-mix them at a temperature of 40-50°C and a stirring speed of 300-400 rpm for 20-30 minutes to uniformly disperse the hyaluronic acid derivative in the epoxy resin, add the curing agent and other additives to the pre-mixed system in turn, continue to stir and mix uniformly at a temperature of 50-60°C and a stirring speed of 400-500 rpm for 30-40 minutes to obtain an epoxy resin composition for semiconductor sealing.

[0011] A method for sealing an epoxy resin composition for semiconductor sealing, the specific steps of the method are:

[0012] Chip preparation: Select the semiconductor chips to be packaged and perform appearance inspection on the chips to ensure that there are no obvious scratches or damage defects on the chip surface;

[0013] Vacuum pretreatment: Place the prepared semiconductor chip in a vacuum chamber, set the vacuum degree and duration, and remove air and impurities on the chip surface and in the gaps by vacuuming;

[0014] Preparation of epoxy resin composition droplets: using a droplet jetting device to process the prepared epoxy resin composition to form tiny droplets. During the droplet preparation process, the droplet volume is set according to the specific needs and sealing requirements of the chip;

[0015] Micro-droplet jetting sealing and component embedding: The prepared epoxy resin composition micro-droplets are sprayed one by one onto the surface and gaps of the vacuum pre-treated chip through a micro-droplet jetting device. During the spraying process, various parameters of the droplets, including the droplet volume, jetting speed and jetting interval, are controlled to achieve personalized sealing of chips of different structures and sizes. At the same time, in the process of spraying the epoxy resin composition droplets, functional micro-nano components including micro-sensors are synchronously embedded to achieve the integration of sealing and monitoring functions;

[0016] Curing molding: The semiconductor chip with epoxy resin composition droplets and embedded micro-sensors and other components is placed in a constant temperature curing box for curing. During the curing process, the epoxy resin composition and the curing agent react chemically to form a strong sealing structure, completing the sealing of the semiconductor chip.

[0017] Furthermore, in the vacuum pretreatment step, the vacuum degree is set between 10-1000 Pascals, and the vacuum state is maintained for a duration between 5-30 minutes.

[0018] Furthermore, in the droplet jetting sealing and component embedding steps, the droplet volume is between 0.1-10 μl, the jetting speed is between 1-100 mm / s, and the jetting interval is between 0.1-5 seconds.

[0019] Furthermore, in the curing step, the semiconductor chip with the epoxy resin composition droplets and embedded microsensors and other components is placed in a constant temperature curing box and cured at a curing temperature of 80-100° C. and a curing time of 1.5-3 hours.

[0020] Compared with the prior art, the epoxy resin composition and sealing method for semiconductor sealing have the following beneficial effects:

[0021] 1. The present invention significantly improves the compatibility with human tissue by adding specially prepared hyaluronic acid derivatives. The hyaluronic acid derivatives not only retain the good biocompatibility of hyaluronic acid itself, but also enhance its dispersibility and functionality in epoxy resin through chemical modification, so that when the packaging material comes into contact with human tissue, it can reduce adverse effects such as immune response, thereby ensuring the long-term stability and safety of biomedical semiconductor devices such as implantable medical chips in the human body.

[0022] 2. The present invention adopts droplet injection technology to accurately control the injection parameters of epoxy resin composition droplets, such as droplet volume, injection speed and injection interval, according to the specific structure and needs of semiconductor chips, which not only ensures the sealing integrity and reliability of complex chips, but also greatly reduces material waste. In addition, this method can also simultaneously embed functional micro-nano elements such as micro sensors during the sealing process, realizing the integration of sealing and monitoring functions, and providing a more efficient and functional solution for semiconductor packaging.

[0023] Other advantages, objectives and features of the present invention will be set forth in part in the following description and, in part, will be apparent to those skilled in the art based on an examination of the following or may be taught from the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A flow chart of a sealing method of an epoxy resin composition for semiconductor sealing;

[0026] Figure 2 The present invention is a flow chart of an epoxy resin composition for semiconductor sealing and a sealing method for preparing a hyaluronic acid derivative. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Comparative Example

[0029] For the preparation of hyaluronic acid derivatives, natural hyaluronic acid extracted from cockscombs was selected, and its molecular weight was about 1.5 million Daltons. After weighing 10g of the natural hyaluronic acid, it was dissolved in 100ml of phosphate buffer solution (pH value was 7.2), and it was evenly mixed by stirring at room temperature to form a hyaluronic acid solution with a concentration of 8% (w / v). Then, 2g of hydroxyethyl acrylate was added to the solution as a chemical modification reagent, and the reagent had carboxyl and hydroxyl functional groups. The added amount was about 20% of the mass of the hyaluronic acid. The solution was then placed in a constant temperature reaction container with a stirring function, the reaction temperature was set to 35°C, the stirring speed was set to 250 rpm, and it was allowed to react under this condition for 4 hours. After the reaction is completed, filter paper is used for filtration to remove unreacted reagents and larger particles of impurities, thereby obtaining a preliminarily purified filtrate. The filtrate is then transferred to a dialysis bag with a molecular weight cutoff of 9000 Daltons and placed in a dialysis buffer (a phosphate buffer solution similar to that used to dissolve hyaluronic acid) for dialysis. The dialysis process is continued at room temperature for 36 hours to remove small molecule impurities. Finally, the dialyzed hyaluronic acid derivative solution is placed in a freeze dryer for freeze drying. The shelf temperature of the freeze dryer is set to -50°C. The entire freeze drying process lasts for 12 hours. Water is removed by low-temperature sublimation to obtain a dry powdered hyaluronic acid derivative.

[0030] For the preparation of the epoxy resin composition, the following components were accurately weighed in parts by weight: 60 parts of E-51 bisphenol A epoxy resin, 20 parts of hyaluronic acid derivatives, 15 parts of m-phenylenediamine as a curing agent, 3 parts of aluminum hydroxide as a flame retardant, 2 parts of γ-aminopropyltriethoxysilane as a coupling agent, and 1 part of antioxidant 1010 (pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate). After weighing, the epoxy resin and the hyaluronic acid derivative were added together into a stainless steel reactor with heating and stirring functions. The heating system was first turned on to increase the temperature to 45°C. At the same time, the stirring system was started and the stirring speed was set to 350 rpm. Under this condition, the premixing operation was carried out. During the premixing process, the mixing state of the materials was observed through the observation window on the reactor on the one hand, and the viscosity change of the materials was monitored online using a viscosity monitor on the other hand. The premixing duration was set to 25 minutes. When the viscosity of the material is observed to be stable and no longer changes significantly, it means that the premixing is basically completed. Subsequently, the curing agent and other additives are added to the premixed system in the order of curing agent first and other additives later. When adding the curing agent, add it slowly and stir continuously at the same time. This is to prevent the local curing reaction from being too fast and causing uneven materials. When adding other additives, they also need to be added slowly and stirred thoroughly. After adding the curing agent and other additives, the temperature of the reactor is increased to 55°C, and the stirring can be adjusted to 450 rpm, and the stirring and mixing operation is continued. During this process, the viscosity, color and other changes of the material are monitored to determine whether the mixing is uniform. When the viscosity of the material reaches a relatively stable value and the color is uniform, it can be considered that the stirring and mixing is uniform. The stirring and mixing time is 35 minutes, and the epoxy resin composition for semiconductor sealing is obtained.

[0031] For the sealing of semiconductor chips, before the sealing operation is performed on the semiconductor chips, the chip preparation work must be done first, and an implantable medical chip is selected as the semiconductor chip to be packaged, and then the chip surface is inspected using a high-power microscope with a magnification of 200 times. During the inspection, the chip surface must be carefully observed under different angles and lighting conditions to ensure that there are no obvious scratches, breakages and other defects on the chip surface. Only in this way can a good basic condition be provided for the subsequent sealing operation. After completing the chip preparation, the vacuum pretreatment step is then performed to place the prepared implantable medical chip in a professional vacuum chamber, which has a high The vacuum control accuracy can reach within ±1 Pascal. According to the characteristics and sealing requirements of this implantable medical chip, the vacuum degree is set to 50 Pascal and maintained for 15 minutes. By vacuuming, the air and impurities on the chip surface and in the gaps can be effectively removed, thereby creating extremely favorable conditions for the subsequent penetration and sealing of the epoxy resin composition. After that, the epoxy resin composition droplet preparation work is carried out using a high-precision droplet injection device. This device can achieve a droplet volume control accuracy of within ±0.01 microliters, a spray speed control accuracy of within ±1 mm / s, and a spray interval control accuracy of ±0.Within 01 seconds, the previously prepared epoxy resin composition is processed by the equipment to form tiny droplets. In combination with the specific needs and sealing requirements of this implantable medical chip, the droplet volume is initially set to 1 microliter, so that the subsequent injection sealing operation can be better carried out. The prepared epoxy resin composition tiny droplets are sprayed one by one through the droplet injection equipment onto the chip surface and gaps that have been vacuum pretreated. During the injection process, it is necessary to accurately control various parameters of the droplets: the droplet volume is set to 1 microliter, which is consistent with the initial setting during droplet preparation and can well meet the sealing requirements of the chip. The injection speed is controlled to 20 mm / s, which can ensure that the droplets are evenly and accurately sprayed onto the chip surface and gaps. The injection interval is set to 1 second, which can not only ensure that the droplets have enough time to adhere to the chip surface and gaps, but also effectively improve the injection efficiency. At the same time, when spraying the epoxy resin composition droplets During the process, a micro temperature sensor is also embedded as a functional micro-nano element. Through a specially designed injection device with a micro-manipulator arm, the micro temperature sensor is accurately placed at a pre-set position on the chip surface by using the precise movement and positioning function of the micro-manipulator arm, thereby realizing the integration of sealing and monitoring functions, and giving more functional characteristics to semiconductor sealing. Finally, the semiconductor chip with epoxy resin composition droplets and embedded micro temperature sensor is placed in a constant temperature curing box. The temperature error of the constant temperature curing box is controlled within ±1°C. According to the characteristics of the chip and the sealing requirements, the curing temperature is set to 90°C and the curing time is 2 hours. During the curing process, the epoxy resin composition and the curing agent will react chemically to form a solid sealing structure, completing the sealing operation of the semiconductor chip. At the same time, it can also ensure that the micro temperature sensor can work normally in the sealing structure, thereby meeting the various requirements of biomedical related semiconductor packaging. .

[0032] After the semiconductor chip sealed with epoxy resin prepared by the present invention was in contact with human tissue for 100 hours, the concentration of interleukin-6 was detected within ±0.5pg / mL, the concentration of C-reactive protein was within ±0.1mg / L, and no obvious immune response was found. The packaged chip was placed in a test device simulating the internal stress environment of the human body and tested for 50 hours. The maximum strain on the chip surface was less than 0.05%, and the chip did not show any damage such as cracking.

[0033] Embodiment 1

[0034] For the preparation of hyaluronic acid derivatives, 15 g of natural hyaluronic acid (molecular weight of about 1.5 million Daltons) extracted from cockscombs was weighed, and a hyaluronic acid solution was prepared in the same way. Then, 3 g of hydroxyethyl acrylate (about 20% of the mass of hyaluronic acid) was added for chemical modification reaction. Other reaction conditions remained unchanged, and subsequent post-treatment steps such as filtration, dialysis, and freeze-drying were also the same as those in the comparative example. Finally, a hyaluronic acid derivative was obtained, and the weight portion of the hyaluronic acid derivative in the epoxy resin composition was 30 parts.

[0035] For the preparation of the epoxy resin composition, 60 parts of E-51 bisphenol A epoxy resin, 20 parts of hyaluronic acid derivatives, 15 parts of m-phenylenediamine as a curing agent, 3 parts of aluminum hydroxide as a flame retardant, 2 parts of γ-aminopropyltriethoxysilane as a coupling agent, and 1 part of antioxidant 1010 (pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate) are accurately weighed by weight, and the epoxy resin and the hyaluronic acid derivative are added to a stainless steel reactor with heating and stirring functions, the temperature is raised to 45° C., the stirring speed is 350 rpm, and the premixing is performed for 25 minutes. Then, the curing agent and other additives are added in the order of curing agent first and then other additives. When adding the curing agent, the curing agent is stirred slowly to prevent local curing from being too fast. When adding other additives, the curing agent is also stirred slowly and evenly. Then, the temperature is raised to 55° C., the stirring speed is 450 rpm, and the stirring is performed for 35 minutes until the viscosity of the material is stable and the color is uniform, thereby obtaining an epoxy resin composition for semiconductor sealing.

[0036] The sealing of the semiconductor chip is the same as that of the comparative example.

[0037] By using the epoxy resin-sealed semiconductor chip prepared by the present invention, after contacting with human tissue for 100 hours, the human immune system related indicators were detected, and it was found that the concentration of interleukin-6 changed within ±0.3pg / mL, the concentration of C-reactive protein changed within ±0.08mg / L, and the immune response was further reduced, indicating that increasing the proportion of hyaluronic acid derivatives helps to better maintain compatibility with human tissue. The packaged chip was placed in a test device that simulates the internal stress environment of the human body and tested for 50 hours. The maximum strain on the chip surface was less than 0.04%. Compared with the control example, the deformation of the chip under stress environment was smaller, indicating that increasing the proportion of hyaluronic acid derivatives can improve the stability of the chip under stress environment.

[0038] Embodiment 2

[0039] For the preparation of hyaluronic acid derivatives, 5 g of natural hyaluronic acid (molecular weight of about 1.5 million Daltons) extracted from chicken combs was weighed to make a hyaluronic acid solution, and 1 g of hydroxyethyl acrylate (about 20% of the mass of hyaluronic acid) was added for chemical modification reaction. The other reaction conditions remained unchanged. After the same post-treatment steps such as filtration, dialysis, freeze-drying, etc., a hyaluronic acid derivative was obtained, and its weight portion in the epoxy resin composition was 10 parts.

[0040] For the preparation of the epoxy resin composition, 60 parts of E-51 bisphenol A epoxy resin, 10 parts of hyaluronic acid derivatives, 15 parts of m-phenylenediamine as a curing agent, 3 parts of aluminum hydroxide as a flame retardant, 2 parts of γ-aminopropyltriethoxysilane as a coupling agent, and 1 part of antioxidant 1010 (pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate) were accurately weighed by weight, and the steps of premixing, adding curing agent and other additives, and continuing stirring and mixing were performed according to the same preparation method as in Example 1 to obtain an epoxy resin composition for semiconductor sealing.

[0041] The sealing of the semiconductor chip is the same as that in the first embodiment.

[0042] By using the epoxy resin-sealed semiconductor chip prepared by the present invention, after contacting with human tissue for 100 hours, the human immune system related indicators were detected, and the concentration of interleukin-6 changed within ±0.7pg / mL, the concentration of C-reactive protein changed within ±0.12mg / L, and the degree of immune response increased compared with the control group, but was still within an acceptable range, indicating that reducing the proportion of hyaluronic acid derivatives may have a certain effect on the compatibility with human tissue. The packaged chip was placed in a test device simulating the internal stress environment of the human body and tested for 50 hours. The maximum strain on the chip surface was less than 0.06%. Compared with the control group, the deformation of the chip under the stress environment was slightly larger, indicating that reducing the proportion of hyaluronic acid derivatives may reduce the stability of the chip under the stress environment.

[0043] Embodiment 3

[0044] For the preparation of hyaluronic acid derivatives, 8 g of natural hyaluronic acid (molecular weight of about 1.5 million Daltons) extracted from cockscombs was weighed to prepare a hyaluronic acid solution, and 1.6 g of hydroxyethyl acrylate (about 20% of the mass of hyaluronic acid) was added for chemical modification reaction. Other reaction conditions remained unchanged, and the same post-treatment steps such as filtration, dialysis, and freeze-drying were performed to obtain a hyaluronic acid derivative, which had a weight portion of 15 parts in the epoxy resin composition.

[0045] For the preparation of the epoxy resin composition, 60 parts of E-51 bisphenol A epoxy resin, 15 parts of hyaluronic acid derivatives, 15 parts of m-phenylenediamine as a curing agent, 3 parts of aluminum hydroxide as a flame retardant, 2 parts of γ-aminopropyltriethoxysilane as a coupling agent, and 1 part of antioxidant 1010 (pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate) were accurately weighed by weight, and the same preparation process as in Example 1 was adopted, including premixing, adding a curing agent and other additives, and continuing stirring and mixing, to obtain an epoxy resin composition for semiconductor sealing.

[0046] The sealing of the semiconductor chip is the same as that in the first embodiment.

[0047] After the semiconductor chip sealed with epoxy resin prepared by the present invention was in contact with human tissue for 100 hours, the human immune system related indicators were detected, and the concentration of interleukin-6 changed within ±0.6pg / mL, and the concentration of C-reactive protein changed within ±0.11mg / L, indicating that the change in the proportion of hyaluronic acid derivatives has a certain influence on the compatibility with human tissue and presents a corresponding change trend. The packaged chip was placed in a test device simulating the internal stress environment of the human body and tested for 50 hours. The maximum strain on the chip surface was less than 0.055%. Compared with the control example, the deformation of the chip under the stress environment increased slightly, further confirming that the change in the proportion of hyaluronic acid derivatives will affect the stability of the chip under the stress environment.

[0048]

[0049]

[0050] As shown in the table above, through detailed comparison and analysis of the above embodiments and comparative examples, it is concluded that the weight ratio of the hyaluronic acid derivative in the epoxy resin composition has a significant effect on the sealing of the semiconductor chip. When the ratio changes, it will have different degrees of impact on the performance of the chip after packaging in multiple key aspects, among which the immune response of the chip and the performance under stress environment are particularly prominent. For the immune response, after the contact with human tissue reaches a certain length of time, it is found through the detection of relevant indicators of the human immune system that with the change of the weight ratio of the hyaluronic acid derivative, the fluctuation of these indicators shows obvious differences. In terms of the performance of the chip under stress environment, the packaged chip is placed in a professional testing equipment that simulates the internal stress environment of the human body for continuous testing. By monitoring the strain on the chip surface, it is found that the change in the weight ratio of the hyaluronic acid derivative causes the maximum strain of the chip to also change.

[0051] In summary, in actual semiconductor packaging application scenarios, especially for those with high requirements for biocompatibility and chip stability in complex environments, such as implantable medical chips, the weight ratio of hyaluronic acid derivatives in the epoxy resin composition can be adjusted according to specific application requirements and the emphasis on chip performance, so as to achieve the best packaging effect, ensure that the packaged chip can maintain good interaction with human tissues, and can operate stably and reliably under various stress environments, thereby meeting different usage requirements and application scenarios.

[0052] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An epoxy resin composition for semiconductor sealing, characterized in that: The composition comprises the following components: 50-80 parts of epoxy resin, 10-30 parts of hyaluronic acid derivative, 10-20 parts of curing agent, 2-5 parts of flame retardant, 1-3 parts of coupling agent and 0.5-2 parts of antioxidant.

2. The epoxy resin composition for semiconductor sealing according to claim 1, characterized in that: The epoxy resin is bisphenol A type epoxy resin.

3. The epoxy resin composition for semiconductor sealing according to claim 1, characterized in that: The hyaluronic acid derivative is obtained by chemically modifying natural hyaluronic acid. Specifically, hyaluronic acid extracted from cockscombs is selected as a starting material with a molecular weight between 1 million and 2 million Daltons. It is dissolved in a phosphate buffer solution with a pH value of 7.0-7.5 to form a hyaluronic acid solution with a concentration of 5%-10% w / v. Hydroxyethyl acrylate is added to the hyaluronic acid solution in an amount of 10%-30% of the mass of the hyaluronic acid. The reaction is carried out for 3-5 hours at a temperature of 30-40° C. and a stirring speed of 200-300 rpm. After the reaction is completed, unreacted reagents and impurities are filtered out, and larger particles of unreacted substances and impurities are retained by utilizing the pore size difference of the filter medium to obtain a preliminarily purified filtrate. The filtrate is then dialyzed for 24-48 hours using a dialysis bag with a molecular weight cutoff of 8000-10000 Daltons to remove small molecular impurities. The hyaluronic acid derivative is obtained by cooling and drying at -50° C. for 8-12 hours.

4. The epoxy resin composition for semiconductor sealing according to claim 1, characterized in that: The curing agent is m-phenylenediamine, the flame retardant is aluminum hydroxide, the coupling agent is γ-aminopropyltriethoxysilane, and the antioxidant is antioxidant 1010.

5. The epoxy resin composition for semiconductor sealing according to claim 1, characterized in that: The preparation method of the epoxy resin composition is as follows: according to claims 1-4, epoxy resin, hyaluronic acid derivative, curing agent and other additives are weighed, the weighed epoxy resin and hyaluronic acid derivative are added into a mixing container, and pre-mixed at a temperature of 40-50° C. and a stirring speed of 300-400 rpm for 20-30 minutes to uniformly disperse the hyaluronic acid derivative in the epoxy resin, the curing agent and other additives are sequentially added into the pre-mixed system, and the mixture is continuously stirred and mixed uniformly at a temperature of 50-60° C. and a stirring speed of 400-500 rpm for 30-40 minutes to obtain an epoxy resin composition for semiconductor sealing.

6. The method for sealing a semiconductor using an epoxy resin composition according to claim 1, wherein: The specific steps of the method are: Chip preparation: Select the semiconductor chips to be packaged and perform appearance inspection on the chips to ensure that there are no obvious scratches or damage defects on the chip surface; Vacuum pretreatment: Place the prepared semiconductor chip in a vacuum chamber, set the vacuum degree and duration, and remove air and impurities on the chip surface and in the gaps by vacuuming; Preparation of epoxy resin composition droplets: using a droplet jetting device to process the prepared epoxy resin composition to form tiny droplets. During the droplet preparation process, the droplet volume is set according to the specific needs and sealing requirements of the chip; Micro-droplet jetting sealing and component embedding: The prepared epoxy resin composition micro-droplets are sprayed one by one onto the surface and gaps of the vacuum pre-treated chip through a micro-droplet jetting device. During the spraying process, various parameters of the droplets, including the droplet volume, jetting speed and jetting interval, are controlled to achieve personalized sealing of chips of different structures and sizes. At the same time, in the process of spraying the epoxy resin composition droplets, functional micro-nano components including micro-sensors are synchronously embedded to achieve the integration of sealing and monitoring functions; Curing molding: The semiconductor chip with epoxy resin composition droplets and embedded micro-sensors and other components is placed in a constant temperature curing box for curing. During the curing process, the epoxy resin composition and the curing agent react chemically to form a strong sealing structure, completing the sealing of the semiconductor chip.

7. The method for sealing a semiconductor using an epoxy resin composition according to claim 6, wherein: In the vacuum pretreatment step, the vacuum degree is set between 10 and 1000 Pascals, and the vacuum state is maintained for a duration of 5 to 30 minutes.

8. The method for sealing a semiconductor using an epoxy resin composition according to claim 6, wherein: In the step of micro-droplet jetting sealing and component embedding, the droplet volume is between 0.1-10 microliters, the jetting speed is between 1-100 mm / s, and the jetting interval is between 0.1-5 seconds.

9. The method for sealing a semiconductor using an epoxy resin composition according to claim 6, wherein: In the curing step, the semiconductor chip with the epoxy resin composition droplets and embedded micro-sensors and other components is placed in a constant temperature curing box and cured at a curing temperature of 80-100° C. and a curing time of 1.5-3 hours.

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