Computer heat dissipation performance testing device and method
By designing temperature control, dustproof and dust removal mechanisms for computer thermal performance testing, the problems of inaccurate temperature adjustment and dust entry in traditional testing methods are solved, and the effects of high-precision testing and equipment cleaning are achieved.
Patent Information
- Application Number
- CN202411572817.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2025-02-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Traditional computer thermal performance testing methods are difficult to quickly adjust the temperature, resulting in inaccurate test results, and dust entering the computer affects brand image and customer satisfaction.
A computer thermal performance testing device is designed, including a temperature control mechanism, a dustproof mechanism and a dust removal mechanism. The temperature control mechanism uses semiconductor refrigeration sheets to achieve rapid and accurate temperature adjustment; the dustproof mechanism filters dust through belt dustproof curtains; the dust removal mechanism removes dust accumulation on the dustproof curtains through a combination of brush rollers and adhesive rollers.
It realizes high-precision temperature control, effectively prevents dust from entering the computer, improves the accuracy of test results and the service life of the equipment, and reduces maintenance costs.
Smart Images

Figure CN119533893A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of notebook testing equipment, in particular to a computer heat dissipation performance testing device and method. Background Art
[0002] Computers generate a lot of heat during operation, especially in high-load application scenarios such as high-performance computing and gaming. The quality of heat dissipation directly affects the stability and service life of the computer. With the development of technology, the integration of computers is getting higher and higher, and the heat generation is also increasing. Therefore, the requirements for computer cooling systems are also getting higher and higher. In order to ensure that the computer can work normally under various environmental conditions, its heat dissipation performance must be strictly tested.
[0003] Traditional testing methods usually find it difficult to quickly change the temperature of the test environment in a short period of time, and it is difficult to maintain long-term temperature stability, which leads to inaccurate test results. In addition, since computers need to be tested at different temperatures for a long time, when the filter of the test equipment accumulates too much dust, on the one hand, the dust may pass through the filter into the notebook, causing customers to mistakenly believe that it is a second-hand product after purchase, affecting the brand image and reducing customer satisfaction. On the other hand, it increases the air intake resistance of the test equipment and affects the temperature control accuracy. Therefore, a computer heat dissipation performance testing device and method are needed to solve the above problems. Summary of the invention
[0004] The purpose of the present invention is to provide a computer heat dissipation performance testing device and method and a method of using the same, which have the advantages of high temperature control accuracy and good dustproof performance, and solve the problems in the prior art that the test environment temperature is slow to control and the adjustment accuracy is poor during the computer heat dissipation performance testing process, and dust may enter the computer during the computer testing process and affect the brand image.
[0005] To achieve the above object, the present invention provides the following technical solutions: A computer heat dissipation performance testing device, comprising a test box, wherein a temperature control mechanism, a dust prevention mechanism and a dust removal mechanism are arranged in the test box; A test chamber is provided in the test box, a first air inlet and a first air outlet are provided on the left and right sides of the test box respectively, a first fan is provided in the first air outlet, a sealing cover is provided at the upper end of the test chamber, a support seat is provided at the upper end surface of the bottom of the test chamber, and a controller is provided at the upper end of the test chamber; The temperature control mechanism comprises a semiconductor refrigeration sheet, a first temperature sensor and a second temperature sensor, and the temperature control mechanism is electrically connected to the controller; The dust-proof mechanism comprises a belt-type dust-proof curtain, a driving roller, a driven roller and a first motor, and the dust-proof mechanism is installed in the first air inlet; The dust removal mechanism comprises a brush roller, a sticky roller and a dust collecting box, and the dust removal mechanism is installed on the upper end of the dust prevention mechanism.
[0006] As a preferred embodiment of the present invention, a heat exchange chamber is provided at the upper end of the first air inlet, a partition is provided between the heat exchange chamber and the first air inlet, a mounting groove is provided on the partition, the semiconductor refrigeration plate is installed in the mounting groove, the thickness of the partition is equal to the thickness of the semiconductor refrigeration plate, the upper end surface and the lower end surface of the semiconductor refrigeration plate are provided with a heat exchanger, a second motor is provided in the test box, a rotating shaft cooperating with the second motor is provided on the side of the heat exchanger, the first temperature sensor is installed on the upper end surface of the test box, and the second temperature sensor is installed on the bottom upper end surface of the test chamber.
[0007] As a preferred embodiment of the present invention, a second air inlet is provided on the top of the heat exchange chamber, a second air outlet is provided on the side of the heat exchange chamber, a second fan is provided in the heat exchange chamber, the heat exchanger is a semi-cylindrical structure, and heat exchange fins are provided on the surface of the heat exchanger.
[0008] As a preferred embodiment of the present invention, the belt-type dust curtain is an annular nylon net, the driving roller is located at the upper end of the partition, the driven roller is located at the bottom of the first air inlet, the belt-type dust curtain is sleeved on the driving roller and the driven roller and is transmitted by friction, the output shaft of the first motor is keyed to the driving roller, and rubber strips are provided on the edges of the driving roller, the driven roller and the belt-type dust curtain.
[0009] As a preferred embodiment of the present invention, the brush roller is provided with a first synchronous wheel, the drive roller is provided with a second synchronous wheel, the first synchronous wheel and the second synchronous wheel are provided with a synchronous belt for transmission, the drive roller is provided with a first gear, the sticking roller is provided with a second gear, and the drive roller and the sticking roller are driven by meshing the first gear and the second gear.
[0010] As a preferred embodiment of the present invention, the surface of the brush roller is provided with nylon bristles, the sticky roller includes a key shaft and a sleeve, the sleeve is sleeved on the key shaft and slidably connected thereto, the surface of the sleeve is provided with a sticky silicone layer, and the front end face of the test box is provided with an inspection port corresponding to the sticky roller.
[0011] As a preferred embodiment of the present invention, a dustproof net is arranged in the second air inlet, the dust collecting box is interference-mounted at the second air outlet, and a dust removal cloth is arranged on the side of the dust collecting box.
[0012] As a preferred embodiment of the present invention, a sliding block is provided at the bottom of the support seat, a sliding rail cooperating with the sliding block is provided in the test chamber, and a magnet sheet is provided on the upper end surface of the support seat.
[0013] As a preferred embodiment of the present invention, the sealing cover is made of a transparent PC material, and a thermal imager is provided on the inner end surface of the sealing cover.
[0014] A method for using a computer heat dissipation performance testing device and method, comprising the following steps: Step 1. Open the notebook and run the temperature measurement software installed in the notebook. Then, place the notebook on the support and close the sealing cover. Step 2: Adjust the temperature in the test chamber by a temperature control mechanism; Step 3: During the test, the dust-proof mechanism filters the air entering the test room to prevent dust; Step 4: The dust removal mechanism cleans the dust on the dust prevention mechanism in real time; Step 5. Observe the temperature through the sealing cover.
[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The temperature control mechanism of the present invention utilizes the thermoelectric effect to achieve efficient and rapid temperature changes, and can reach the required test temperature in a short time. It is automatically adjusted by the controller to adjust the working state of the semiconductor refrigeration plate according to the difference between the preset temperature and the actual temperature, thereby ensuring the stability of the test environment temperature. It can simulate different temperature conditions, not only limited to normal temperature environments, but also high or low temperature environments, and is suitable for a variety of test needs.
[0016] 2. The present invention cooperates with the dust-proof mechanism and the dust-removing mechanism. The belt-type dust-proof curtain can effectively block external dust from entering the interior of the test box, reducing the influence of dust on the test results. The dust accumulated on the dust-proof curtain can be automatically removed through the combination of the brush roller and the sticky roller, thereby keeping the test environment clean and extending the service life of the equipment. It can also prevent dust from entering the interior of the notebook, causing a small amount of dust accumulation inside the notebook and affecting the sales of the notebook.
[0017] 3 The present invention cooperates with the temperature control mechanism and the dust removal mechanism through the second fan. The second fan blows air to the upper end surface of the semiconductor refrigerator in the heat exchange chamber to accelerate the air flow on its surface and improve the heating and cooling efficiency of the semiconductor refrigeration plate. The airflow can remove the dust swept by the dust removal mechanism, and the dust collecting box collects the dust at the back, thereby improving the cleanliness of the environment. The interference-mounted dust collecting box and the inspection port design of the sticky roller make replacement and cleaning simple and quick, reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 An exploded view of the present invention; Figure 2 It is a schematic diagram of the overall structure of the present invention from a first viewing angle; Figure 3 It is a schematic diagram of the overall structure of the second viewing angle of the present invention; Figure 4 A top view of the present invention; Figure 5 For the present invention Figure 4 Middle AA section; Figure 6 For the present invention Figure 5 Enlarged view of point B in the middle; Figure 7 It is a schematic diagram of the coordination state of the dust prevention mechanism and the dust removal mechanism of the present invention; Figure 8 It is an exploded view of the semiconductor refrigeration plate, the second motor and the heat exchanger of the present invention; Fig. 9 It is a schematic diagram of the cooperation state between the test box and the support seat of the present invention.
[0019] In the figure: 1. test box; 101. sealing cover; 102. thermal imager; 103. controller; 104. inspection port; 106. test chamber; 1061. first air inlet; 1062. first air outlet; 1063. slide rail; 107. heat exchange chamber; 1071. second air inlet; 1072. second air outlet; 1073. partition; 1074. mounting groove; 108. support seat; 1081. slider; 1082. magnet sheet; 2. temperature control mechanism; 201. semiconductor cooling sheet; 202. first temperature sensor; 203. second temperature sensor; 2 04, motor; 205, heat exchanger; 2051, heat exchange wing; 2052, rotating shaft; 206, first fan; 3, dust prevention mechanism; 301, driving roller; 3011, second synchronous wheel; 3012, first gear; 302, driven roller; 303, belt-type dust curtain; 304, rubber strip; 4, dust removal mechanism; 401, brush roller; 4011, first synchronous wheel; 4012, synchronous belt; 402, sticky roller; 4021, second gear; 4022, key shaft; 4023, bushing; 403, dust collection box; 4031, dust removal cloth; 404, second fan. DETAILED DESCRIPTION
[0020] See also Figure 1-Figure 9 , a computer heat dissipation performance testing device, comprising a test box 1, wherein the test box 1 is provided with a temperature control mechanism 2, a dust prevention mechanism 3 and a dust removal mechanism 4; A test chamber 106 is provided in the test box 1, a first air inlet 1061 and a first air outlet 1062 are provided on the left and right sides of the test box 1 respectively, a first fan 206 is provided in the first air outlet 1062, a sealing cover 101 is provided at the upper end of the test chamber 106, a support seat 108 is provided at the upper end surface of the bottom of the test chamber 106, and a controller 103 is provided at the upper end of the test chamber 106; The temperature control mechanism 2 includes a semiconductor refrigeration sheet 201, a first temperature sensor 202 and a second temperature sensor 203, and the temperature control mechanism 2 is electrically connected to the controller 103; The dust-proof mechanism 3 includes a belt-type dust-proof curtain 303, a driving roller 301, a driven roller 302 and a first motor 204, and the dust-proof mechanism 3 is installed in the first air inlet 1061; The dust removal mechanism 4 includes a brush roller 401 , a sticky roller 402 and a dust collecting box 403 , and the dust removal mechanism 4 is installed at the upper end of the dust prevention mechanism 3 .
[0021] Furthermore, a heat exchange chamber 107 is provided at the upper end of the first air inlet 1061, a partition 1073 is provided between the heat exchange chamber 107 and the first air inlet 1061, a mounting groove 1074 is provided on the partition 1073, the semiconductor refrigeration plate 201 is installed in the mounting groove 1074, the thickness of the partition 1073 is equal to the thickness of the semiconductor refrigeration plate 201, a heat exchanger 205 is provided on the upper end surface and the lower end surface of the semiconductor refrigeration plate 201, a second motor 204 is provided in the test box 1, a rotating shaft 2052 cooperating with the second motor 204 is provided on the side of the heat exchanger 205, the first temperature sensor 202 is installed on the upper end surface of the test box 1, and the second temperature sensor 203 is installed on the bottom upper end surface of the test chamber 106.
[0022] The semiconductor cooling chip 201, also called a thermoelectric cooling chip, is a heat pump. When direct current passes through a thermocouple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively. On one side of the cooling chip, the current makes the contact area cold; and on the other side, the contact area becomes hot. Therefore, one side becomes the cold end and the other side becomes the hot end. The current room temperature is detected by the first temperature sensor 202, and the real-time temperature in the test chamber 106 is detected by the second temperature sensor 203. When the controller 103 inputs the experimental temperature, the controller 103 compares the input temperature with the temperature of the first temperature sensor 202. If it is higher than the room temperature, the second motor 204 drives the semiconductor cooling chip 201 to rotate to the hot end facing downward. If it is lower than the room temperature, the cooling chip is driven to rotate to the cold end facing downward. The first fan 206 draws air to evenly draw the hot air flow or cold air flow into the test chamber 106, so that the computer can be tested in a relatively stable temperature environment.
[0023] Furthermore, a second air inlet 1071 is provided on the top of the heat exchange chamber 107, a second air outlet 1072 is provided on the side of the heat exchange chamber 107, a second fan 404 is provided in the heat exchange chamber 107, the heat exchanger 205 is a semi-cylindrical structure, and heat exchange wings 2051 are provided on the surface of the heat exchanger 205.
[0024] Air is blown by the second fan 404 to dissipate heat for the semiconductor refrigeration plate 201. If the hot end temperature is lowered by active heat dissipation, the cold end temperature will also drop accordingly, thereby reaching a lower temperature. Similarly, if the air flow rate on the cold end surface is accelerated to increase the cold end temperature, the hot end temperature will rise, thereby making the hot end reach a higher temperature. By increasing the heat dissipation or heat absorption rate of the upper end surface of the semiconductor refrigeration plate 201, the cooling or heating efficiency of the lower end surface of the semiconductor refrigeration plate 201 is improved. By increasing the heat dissipation area of the heat exchanger 205 through the heat exchange fins 2051, the cooling or heating efficiency is further improved.
[0025] Furthermore, the belt-type dust curtain 303 is an annular nylon net, the driving roller 301 is located at the upper end of the partition 1073, the driven roller 302 is located at the bottom of the first air inlet 1061, the belt-type dust curtain 303 is sleeved on the driving roller 301 and the driven roller 302 and is transmitted by friction, the output shaft of the first motor 204 is keyed to the driving roller 301, and rubber strips 304 are provided on the edges of the driving roller 301, the driven roller 302 and the belt-type dust curtain 303.
[0026] The driven roller 302 is driven to rotate by the first motor 204, thereby driving the belt dust curtain 303 to rotate, so that the dust removal mechanism 4 removes dust from various positions of the belt dust curtain 303. The rubber strip 304 is arranged on the belt dust curtain 303 and the driving roller 301 and the driven roller 302, which can effectively enhance the structural strength of the edge of the belt dust curtain 303, and enhance the friction between the belt dust curtain 303 and the driving roller 301, thereby enhancing the transmission effect.
[0027] Furthermore, a first synchronous wheel 4011 is provided on the brush roller 401, a second synchronous wheel 3011 is provided on the driving roller 301, a synchronous belt 4012 for transmission is provided on the first synchronous wheel and the second synchronous wheel 3011, a first gear 3012 is provided on the driving roller 301, and a second gear 4021 is provided on the sticking roller 402. The driving roller 301 and the sticking roller 402 are driven by meshing of the first gear 3012 and the second gear 4021.
[0028] When the first motor 204 drives the driving roller 301 to rotate, the brush roller 401 is driven to rotate in the same direction through the synchronous belt 4012 and the first synchronous wheel 4011 and the second synchronous wheel 3011. At the same time, the sticky roller 402 is driven to rotate in the opposite direction through the first gear 3012 and the second gear 4021, so that the brush roller 401 brushes the dust on the surface of the belt-type dust curtain 303 outwards, and the swept dust is blown to the second air outlet 1072 by the second fan 404, and the small amount of dust remaining on the surface of the belt-type dust curtain 303 is removed by the sticky roller 402.
[0029] Furthermore, the surface of the brush roller 401 is provided with nylon bristles, the sticky roller 402 includes a key shaft 4022 and a sleeve 4023, the sleeve 4023 is sleeved on the key shaft 4022 and slidably connected thereto, the surface of the sleeve 4023 is provided with a sticky silicone layer, and the front end face of the test box 1 is provided with an inspection port 104 corresponding to the sticky roller 402.
[0030] The surface of the belt-type dust curtain 303 is swept by a nylon brush, and the sticky silicone layer on the surface of the sticky roller 402 removes the remaining small amount of dust. By providing an inspection port 104 on the front end face of the test box 1, the key shaft 4022 and the sleeve 4023 structure that are slidably connected facilitate the replacement of a new sleeve 4023 or the cleaning and repair of an old sleeve 4023, thereby maintaining its stickiness.
[0031] Furthermore, a dustproof net is provided in the second air inlet 1071 , the dust collecting box 403 is interference installed at the second air outlet 1072 , and a dust removing cloth 4031 is provided on the side of the dust collecting box 403 .
[0032] The dust blown away by the second fan 404 enters the dust box 403 and is trapped by the dust removal cloth 4031 at the bottom of the dust box 403. The interference-connected dust box 403 is easy to disassemble and clean.
[0033] Furthermore, a slider 1081 is disposed at the bottom of the support seat 108 , a slide rail 1063 cooperating with the slider 1081 is disposed in the test chamber 106 , and a magnet sheet 1082 is disposed on the upper end surface of the support seat 108 .
[0034] The notebook is supported by the support base 108 so that the bottom of the notebook is suspended in the air. The slidingly connected support base 108 is convenient for adjusting the spacing to accommodate notebooks of different sizes. The magnet sheet 1082 can be adsorbed on the bottom of the notebook to fix it and prevent it from moving and shaking.
[0035] Furthermore, the sealing cover 101 is made of transparent PC material, and a thermal imager 102 is disposed on the inner end surface of the sealing cover 101 .
[0036] The sealing cover 101 made of transparent material is convenient for viewing the real-time temperature displayed by the monitoring software on the notebook display screen, and the heat distribution of the body is convenient for observing through the thermal imager 102, which is convenient for later optimization and improvement.
[0037] See also Figure 1-Figure 9 , a computer heat dissipation performance testing method, comprising the following steps: Step 1, open the notebook, run the baking machine temperature measurement software installed in the notebook, then place the notebook on the support base 108, and ensure that its bottom is suspended to facilitate air circulation, close the sealing cover 101, and start the preparation work before the test; Step 2: Set the temperature required for the test through the controller 103. The controller 103 automatically adjusts the working state of the semiconductor refrigeration sheet 201 to achieve the set temperature condition. The first temperature sensor 202 detects the external ambient temperature, and the second temperature sensor 203 detects the temperature inside the test chamber 106. The controller 103 adjusts the working state of the semiconductor refrigeration sheet 201 based on the target temperature set by the user to maintain a constant temperature in the test chamber 106. If the target temperature is higher than the ambient temperature, the controller 103 will use the second motor 204 to turn the hot end of the refrigeration sheet downward, otherwise, the cold end will be turned downward; Step 3: Air enters through the first air inlet 1061 and is filtered by the belt-type dust curtain 303 to reduce dust from entering the test chamber 106. The belt-type dust curtain 303 is driven by the first motor 204 and moves through the friction between the driving roller 301 and the driven roller 302 to filter the air entering the test chamber 106. Step 4, except that during the test, the dust removal mechanism 4 continues to work, and the dust curtain is kept clean by using the brush roller 401 and the sticky roller 402 in combination. The brush roller 401 and the sticky roller 402 are used in combination. The former removes dust on the dust curtain through nylon bristles, and the latter further cleans through the sticky silicone layer. The first motor 204 drives the rotation of the brush roller 401 and the sticky roller 402 at the same time to achieve an efficient dust removal process; Step 5: Observe the real-time temperature of each hardware in the baking software through the sealing cover 101 , and check the temperature distribution of each position of the laptop computer through the thermal imager 102 .
[0038] During step 2 and step 3, in order to improve the efficiency of the refrigeration plate, the heat exchange chamber 107 is provided with a second fan 404 and a heat exchanger 205, which helps the hot end to dissipate heat or the cold end to absorb heat by increasing the air circulation speed, thereby affecting the temperature change at the other end. At the same time, the second fan 404 uses suction to absorb the dust brushed by the brush roller 401, and filters it through the dust removal cloth 4031, and the dust is trapped in the dust collecting box 403, thereby greatly reducing the replacement frequency of the sticky roller 402.
[0039] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A computer heat dissipation performance testing device, comprising a test box (1), characterized in that: The test box (1) is provided with a temperature control mechanism (2), a dust prevention mechanism (3) and a dust removal mechanism (4); A test chamber (106) is provided in the test box (1); a first air inlet (1061) and a first air outlet (1062) are provided on the left and right sides of the test box (1), a first fan (206) is provided in the first air outlet (1062); a sealing cover (101) is provided at the upper end of the test chamber (106); a support seat (108) is provided on the upper end surface of the bottom of the test chamber (106); and a controller (103) is provided at the upper end of the test chamber (106); The temperature control mechanism (2) comprises a semiconductor refrigeration sheet (201), a first temperature sensor (202) and a second temperature sensor (203); the temperature control mechanism (2) is electrically connected to the controller (103); The dust-proof mechanism (3) comprises a belt-type dust-proof curtain (303), a driving roller (301), a driven roller (302) and a first motor (204); the dust-proof mechanism (3) is installed in the first air inlet (1061); The dust removal mechanism (4) comprises a brush roller (401), a sticky roller (402) and a dust collection box (403); the dust removal mechanism (4) is mounted on the upper end of the dust prevention mechanism (3).
2. A computer heat dissipation performance testing device as claimed in claim 1, characterized in that: A heat exchange chamber (107) is arranged at the upper end of the first air inlet (1061); a partition (1073) is arranged between the heat exchange chamber (107) and the first air inlet (1061); a mounting groove (1074) is arranged on the partition (1073); the semiconductor refrigeration plate (201) is installed in the mounting groove (1074); the thickness of the partition (1073) is equal to the thickness of the semiconductor refrigeration plate (201); a heat exchanger (205) is arranged on the upper end surface and the lower end surface of the semiconductor refrigeration plate (201); a second motor (204) is arranged in the test box (1); a rotating shaft (2052) cooperating with the second motor (204) is arranged on the side of the heat exchanger (205); the first temperature sensor (202) is installed on the upper end surface of the test box (1); and the second temperature sensor (203) is installed on the upper end surface of the bottom of the test chamber (106).
3. A computer heat dissipation performance testing device as claimed in claim 2, characterized in that: A second air inlet (1071) is arranged on the top of the heat exchange chamber (107), a second air outlet (1072) is arranged on the side of the heat exchange chamber (107), a second fan (404) is arranged in the heat exchange chamber (107), the heat exchanger (205) is a semi-cylindrical structure, and a heat exchange wing (2051) is arranged on the surface of the heat exchanger (205).
4. A computer heat dissipation performance testing device as claimed in claim 3, characterized in that: The belt-type dust-proof curtain (303) is an annular nylon net, the driving roller (301) is located at the upper end of the partition (1073), the driven roller (302) is located at the bottom of the first air inlet (1061), the belt-type dust-proof curtain (303) is sleeved on the driving roller (301) and the driven roller (302), the output shaft of the first motor (204) is keyed to the driving roller (301), and rubber strips (304) are provided at the edges of the driving roller (301), the driven roller (302) and the belt-type dust-proof curtain (303).
5. A computer heat dissipation performance testing device as claimed in claim 4, characterized in that: The brush roller (401) is provided with a first synchronous wheel (4011), the driving roller (301) is provided with a second synchronous wheel (3011), the first synchronous wheel and the second synchronous wheel (3011) are provided with a synchronous belt (4012) for transmission, the driving roller (301) is provided with a first gear (3012), the sticking roller (402) is provided with a second gear (4021), and the driving roller (301) and the sticking roller (402) are meshed and driven by the first gear (3012) and the second gear (4021).
6. A computer heat dissipation performance testing device as claimed in claim 3, characterized in that: A dustproof net is arranged inside the second air inlet (1071), the dust collecting box (403) is interference-mounted at the second air outlet (1072), and a dust removal cloth (4031) is arranged on the side of the dust collecting box (403).
7. A computer heat dissipation performance testing device as claimed in claim 1, characterized in that: A sliding block (1081) is provided at the bottom of the support seat (108), a sliding rail (1063) cooperating with the sliding block (1081) is provided in the test chamber (106), and a magnet sheet (1082) is provided on the upper end surface of the support seat (108).
8. A computer heat dissipation performance testing device as claimed in claim 1, characterized in that: The sealing cover (101) is made of a transparent PC material, and a thermal imager (102) is provided on the inner end surface of the sealing cover (101).
9. A method for using a computer heat dissipation performance test device, applicable to a computer heat dissipation performance test device as claimed in any one of claims 1 to 8, characterized in that: The following steps are involved: Step 1, open the notebook, run the baking machine temperature measurement software installed in the notebook, then place the notebook on the support base (108), and close the sealing cover (101); Step 2: adjusting the temperature in the test chamber (106) by means of the temperature control mechanism (2); Step 3: During the testing process, the dust prevention mechanism (3) filters the air entering the test chamber (106) to prevent dust; Step 4: The dust removal mechanism (4) cleans the dust on the dust prevention mechanism (3) in real time; Step 5: Observe the temperature through the sealing cover (101).