Device, equipment and method for automatically loading samples to manufacture metallographic samples for detection

Abstract

The invention belongs to the technical field of metallographic detection equipment, solves the problem of low metallographic sample preparation efficiency in the prior art, and provides a device, method and equipment for automatically loading and manufacturing a metallographic sample for detection, the device comprises a sample injection assembly (5) and an embedding assembly (4), the sample injection assembly (5) comprises a transmission assembly and a sample bin assembly (502), the embedding assembly (4) comprises a light-curing lamp assembly (408), a light-curing resin conveying assembly (409) and a switching assembly, automatic switching between a light-curing resin adding procedure and a light-curing lamp assembly curing procedure is achieved through cooperation of the conveying assembly and the switching assembly, meanwhile, a sample bin (5025) with the adjustable inner cavity depth is arranged, man-made interference in the process from metallographic sample preparation to embedding is reduced, and the accuracy of metallographic sample embedding is improved. According to the metallographic sample manufacturing device, the automation level of metallographic sample manufacturing is improved, and the metallographic sample manufacturing efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of metallographic detection equipment, and in particular to a device, equipment and method for automatically loading and preparing metallographic samples for detection. Background Art

[0002] Metallographic testing is a type of physical and chemical testing, which is mainly used to evaluate the quality and performance of materials by observing and analyzing the microstructure of metal materials. The metallographic samples used for testing are usually small, which makes it inconvenient to grind and polish the surface to be tested. In order to achieve the technical effect of observing the metallographic structure, the sample usually needs to be embedded in a resin with a diameter of Φ30mm and a height of about 30mm for embedding, grinding, and polishing.

[0003] In the prior art, the epoxy resin embedding process of metallographic samples includes hot embedding and cold embedding. When hot embedding with epoxy resin is used, a certain temperature and pressure need to be applied, and the embedding time is usually 5 minutes per sample, which takes a long time and has low efficiency. When cold embedding with photocurable resin is used, such as the cold embedding method described in the patents CN114989365B "A UV-LED fast-curing metallographic cold embedding material and preparation method" and CN109387423B "A metallographic cold embedding device and method using photosensitive resin", the metallographic sample after embedding is relatively high, so further curing is required. Only after that can the requirements be met, and the overall efficiency improvement is limited; at the same time, during the grinding and polishing steps in the production process of metallographic samples, the grinding and polishing of metallographic samples requires sandpaper of different precisions to complete the grinding and polishing steps. However, the current grinding and polishing equipment for metallographic samples takes a long time in the grinding and polishing process, resulting in low grinding and polishing efficiency, such as the metallographic sample grinding and polishing equipment recorded in the public patents CN104044059B "Intelligent automatic metallographic grinding and polishing machine" and CN111069995B "A metallographic grinding and polishing machine"; it can be seen that how to improve the production efficiency of metallographic samples is an urgent problem to be solved in metallographic testing. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a device, equipment and method for automatically loading and preparing metallographic samples for detection, so as to solve the problem of low efficiency in metallographic sample preparation in the prior art.

[0005] The technical solution adopted by the present invention is:

[0006] On the one hand, the present invention provides a device for automatically loading and preparing metallographic samples for detection, comprising a sample injection component (5) and a mounting component (4), wherein the sample injection component (5) comprises a transmission component and a sample chamber component (502), and the mounting component (4) comprises a light-curing lamp component (408), a light-curing resin conveying component (409), and a switching component, wherein the conveying component and the switching component cooperate to adjust the relative position of the sample chamber component (502), the light-curing lamp component (408), and the light-curing resin conveying component (409);

[0007] The sample chamber assembly (502) includes a sample chamber body and a plurality of first mounting holes arranged in the sample chamber body, and a plurality of sample chambers (5025) with adjustable inner cavities are formed in each of the first mounting holes by arranging a lifting mechanism, the light curing lamp (4081) of the light curing lamp assembly (408) is adapted to the sample chamber (5025), and the delivery tube (4091) of the light curing resin delivery assembly (409) is adapted to the sample chamber (5025).

[0008] Preferably, the inner wall of the sample chamber (5025) is provided with a reflective coating.

[0009] Preferably, the transmission component includes a seventh slide linear guide (501) and a seventh slide (5021), the seventh slide (5021) is slidably connected to the seventh slide linear guide (501), the sample chamber component (502) is connected to the seventh slide (5021), and the sample chamber component (502) follows the seventh slide (5021) and moves along the length direction of the seventh slide linear guide (501).

[0010] Preferably, the sample chamber body comprises a lower base (5022), an upper base (5024), a lifting rod (5026) and a sixth cylinder (5027), and the first mounting hole passes through the upper base (5024) and extends into the lower base (5022);

[0011] One end of the lower base (5022) away from the upper base (5024) is installed on the seventh slide (5021), and the upper base (5024) is installed on the end of the lower base (5022) away from the seventh slide (5021). The sixth cylinder (5027) and the lifting rod (5026) are installed in the first mounting hole. The lifting rod (5026) moves along the axial direction of the first mounting hole under the action of the sixth cylinder (5027), and forms the sample chamber (5025) at the end of the first mounting hole located on the upper base (5024) away from the lower base (5022).

[0012] Preferably, the switching mechanism includes a fifth slide linear guide (404) and a fifth slide (405), the fifth slide (405) is slidably connected to the fifth slide linear guide (404), the light curing lamp assembly (408) and the light curing resin conveying assembly (409) are connected to the fifth slide (405), and the light curing lamp assembly (408) and the light curing resin conveying assembly (409) follow the fifth slide (405) and move along the length direction of the fifth slide linear guide (404).

[0013] Preferably, the switching mechanism also includes a sixth slide linear guide rail (4073) and a sixth slide (4075), the photocuring lamp assembly (408) and the photocuring resin delivery assembly (409) are connected to the sixth slide (4075), and the photocuring lamp assembly (408) and the photocuring resin delivery assembly (409) follow the sixth slide (4075) and move along the length direction of the sixth slide linear guide rail (4073).

[0014] On the other hand, the present invention also provides a device for automatically loading and preparing metallographic samples for detection, comprising a device body (1), a sandpaper assembly (2), a transfer assembly (3), a grinding and polishing assembly (8), and any one of the above-mentioned devices for automatically loading and preparing metallographic samples for detection, wherein the sandpaper assembly (2), the transfer assembly (3), the grinding and polishing assembly (8), the sample introduction assembly (5), and the mounting assembly (4) are all mounted on the device body (1);

[0015] The transport component (3) comprises a sandpaper clamping component (309) and a sample clamping component (311), wherein the sandpaper clamping component (309) is used to transport the sandpaper (204) or the first sandpaper (8041), and the sample clamping component (311) is used to transport the metallographic sample to be polished.

[0016] Preferably, the transfer assembly also includes a transfer platform, the sandpaper clamping assembly (309) is fixed to a first mounting member of the transfer platform, and the sample clamping assembly (311) is fixed to a second mounting member of the transfer platform, wherein the first mounting member and the second mounting member are different surfaces of a first adapter plate 3101 of the transfer platform.

[0017] Preferably, the grinding and polishing assembly (8) comprises a lower grinding head assembly, an upper grinding head assembly and a rotating assembly, wherein the rotating assembly is mounted on the device body (1), the upper grinding head assembly is connected to the rotating assembly, the lower grinding head assembly is mounted on the device body (1), the lower grinding head assembly comprises a first type of lower grinding head assembly and at least one second type of lower grinding head assembly, and the rotating assembly is used to switch the upper grinding head assembly to a different second type of lower grinding head assembly for matching.

[0018] Preferably, the rotating assembly includes a ninth motor (807), a first rotating rod (808) and an upper grinding head support rod (809); the upper grinding head assembly is mounted on one end of the first rotating rod (808); the other end of the first rotating rod (808) is mounted on the device body (1); the upper grinding head assembly cooperates with each of the second-type lower grinding heads under the drive of the first rotating rod (808).

[0019] Preferably, the upper grinding head assembly includes an upper grinding head body and an infusion assembly (810), and the infusion assembly (810) includes a first drip hole and a second drip hole, the first drip hole is used to drip coolant, and the second drip hole is used to drip abrasive paste.

[0020] The present invention also provides a method for automatically loading and preparing metallographic samples for detection, the method comprising:

[0021] In response to an inlay instruction for inlaying a metallographic sample, loading the metallographic sample to a first target position of a sample bin in a first state, and outputting an inlay execution instruction;

[0022] According to the inlay execution instruction, controlling the inlay component to cold-mount the metallographic sample in the sample bin in the second state to obtain a first process sample;

[0023] The first process sample is transferred to a second target location, and the polishing assembly is controlled to polish the first process sample to obtain a target sample;

[0024] The first state is a state in which the depth of the sample chamber cavity meets the requirements for loading and unloading metallographic samples, and the second state is a state in which the depth of the sample chamber cavity meets the requirements for cold mounting of metallographic samples.

[0025] Preferably, the metallographic sample loading comprises:

[0026] In response to the inlay instruction, a preset metallographic sample loading scheme and a loading starting position are obtained;

[0027] Starting to load samples from the loading starting position according to the loading scheme, and outputting a sample position correction instruction after the loading is completed;

[0028] In response to the sample position correction instruction, the metallographic sample is adjusted to the first target position, and the inlay execution instruction is output.

[0029] Preferably, cold mounting of metallographic samples comprises:

[0030] In response to the inlay execution instruction, obtaining second depth information of the inner cavity depth of the sample chamber corresponding to the second state;

[0031] adjusting the sample chamber to a second state according to the second depth information, and outputting a mosaic target instruction;

[0032] The embedding component is controlled according to the embedding target instruction to perform cold embedding on the metallographic sample to obtain the first process sample.

[0033] Preferably, the target mounting instruction includes a first execution instruction and a second execution instruction, and the metallographic sample cold mounting includes:

[0034] According to the first execution instruction, using the photocurable resin delivery component at the second coordinate position, injecting photocurable resin into the sample chamber at the first coordinate position to obtain a sample to be cured;

[0035] According to the second execution instruction, using the light curing lamp in the light curing lamp assembly at the second coordinate position to penetrate into each of the sample bins at the first coordinate position to perform light curing on the sample to be cured, so as to obtain the first process sample;

[0036] The transmission component of the injection component moves the sample chamber to the first coordinate position, and the switching component of the inlay component moves the photocurable resin delivery component and the photocurable resin delivery component to the second coordinate position matching the first coordinate position.

[0037] Preferably, polishing the first process sample comprises:

[0038] In response to the polishing instruction of the first process sample, obtaining first depth information of the inner cavity depth of the sample chamber corresponding to the first state;

[0039] Adjust the sample chamber to a first state according to the first depth information, and output a marking instruction;

[0040] According to the marking instruction, adding marking information to each of the first process samples at the second target position to obtain each of the second process samples;

[0041] The grinding and polishing assembly is controlled to grind and polish the second process sample to obtain a target sample.

[0042] Preferably, polishing the first process sample comprises:

[0043] Controlling the upper grinding head assembly of the grinding and polishing assembly to obtain each of the first process samples and output a grinding and polishing instruction;

[0044] According to the polishing instruction, the upper grinding head assembly is controlled to move in a first rotation direction and the lower grinding head assembly of the inlay assembly is controlled to move in a second rotation direction to obtain the target sample;

[0045] Wherein, the first rotation direction is opposite to the second rotation direction.

[0046] In summary, the beneficial effects of the present invention are as follows:

[0047] The device, equipment and method for automatically loading and preparing metallographic samples for detection provided by the present invention include a sample injection component 5 and a mounting component 4, the sample injection component 5 includes a transmission component and a sample chamber component 502, the mounting component 4 includes a light-curing lamp component 408, a light-curing resin conveying component 409 and a switching component, the conveying component and the switching component cooperate to adjust the relative position of the sample chamber component 502, the light-curing lamp component 408 and the light-curing resin conveying component 409, and the transmission component and the switching component cooperate to realize the automatic switching of the light-curing resin adding process and the light-curing lamp component curing process, and at the same time, a sample chamber 5025 with an adjustable inner cavity depth is provided to reduce human interference in the process from metallographic sample preparation to mounting, improve the circulation efficiency and the disassembly and assembly efficiency of the metallographic sample, and the present invention improves the automation level of metallographic sample production and improves the efficiency of metallographic sample production. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0049] Figure 1 A top view of the main structure of the device for automatically loading and preparing metallographic samples for detection in Example 1 of the present invention;

[0050] Figure 2 This is a front view of the main structure in Example 1 of the present invention;

[0051] Figure 3 This is a schematic diagram of the installation of the sandpaper assembly in Example 1 of the present invention;

[0052] Figure 4 is a side view of the sandpaper assembly in Example 1 of the present invention;

[0053] Figure 5 A top view of the transfer assembly in Example 1 of the present invention;

[0054] Figure 6 It is a side view of the driven part of the transfer assembly in Example 1 of the present invention;

[0055] Figure 7 A top view of the driven part of the transfer assembly in Example 1 of the present invention;

[0056] Figure 8 It is a front view of the transfer component in Example 1 of the present invention;

[0057] Fig. 9 This is a rear view of the transfer component in Example 1 of the present invention;

[0058] Fig.10 A top view of the inlay component in Example 1 of the present invention;

[0059] Fig.11 It is a front view of the inlay component in Example 1 of the present invention;

[0060] Fig.12 A side view of the inlaid component in Example 1 of the present invention Figure 1 ;

[0061] Fig.13 A side view of the inlaid component in Example 1 of the present invention Figure 2 ;

[0062] Fig.14 A top view of the injection assembly in Example 1 of the present invention Figure 1 ;

[0063] Fig.15 A top view of the injection assembly in Example 1 of the present invention Figure 2 ;

[0064] Fig.16 It is a side view of the injection assembly in Example 1 of the present invention;

[0065] Fig.17 A top view of a drying component in Example 1 of the present invention;

[0066] Fig.18 A top view of the output assembly in Embodiment 1 of the present invention;

[0067] Fig.19 It is a side view of the lower part of the grinding and polishing assembly in Example 1 of the present invention;

[0068] Fig. 20 Schematic diagram of sandpaper replacement in Example 1 of the present invention Figure 1 ;

[0069] Fig.21 Schematic diagram of sandpaper replacement in Example 1 of the present invention Figure 2 ;

[0070] Fig. 22 This is a schematic diagram of the structure of the combined sandpaper in Example 1 of the present invention;

[0071] Fig.23 It is a side view of the upper part of the grinding and polishing assembly in Example 1 of the present invention;

[0072] Fig.24 A top view of the sample chassis in Example 1 of the present invention;

[0073] Fig.25The side view (left) and top view (right) of the metallographic sample after mounting in Example 1 of the present invention.

[0074] Reference numerals:

[0075] 1-device body, 101-main body upper frame, 102-interactive screen, 103-first information entry unit, 104-power switch, 105-emergency switch, 106-main body lower frame, 107-leveling support block, 108-first roller, 109-working indicator light, 110-sandpaper assembly locking switch, 111-first cylinder, 112-sandpaper assembly release switch, 113-second cylinder, 114-installation platform;

[0076] 2-sandpaper assembly, 201-assembly handle, 202-sandpaper assembly body, 203-sandpaper lever, 204-sandpaper, 205-locking groove, 206-second roller;

[0077] 3-transfer assembly, 301-driven rail support column, 302-driven rail support platform, 303-driven rail slide, 304-driven rail slide, 305-first motor, 306-first coupling, 307-first slide support platform, 308-first slide linear guide, 309-sandpaper clamping assembly, 3091-second slide linear guide, 3092-second slide, 3093-second motor, 3094-first clamping body, 3095-suction cup, 3096-clamping auxiliary part, 310-first slide assembly, 3101-second An adapter plate, 3102-a first slide, 311-a sample clamping assembly, 3111-a third motor, 3112-a third coupling, 3113-a third slide linear guide, 3114-a first guide rail slide, 3115-a third slide, 3116-a second clamping body, 3117-a fourth cylinder, 3118-a fifth cylinder, 312-an active rail support column, 313-an active rail support platform, 314-an active rail guide, 315-an active rail slide, 316-a fourth coupling, 317-a fourth motor, 318-a first guide rail;

[0078] 4-inlay assembly, 401-fifth motor, 402-fifth coupling, 403-fifth slide support assembly, 4031-slide support column, 4032-fifth slide support platform, 4033-second guide rail, 404-fifth slide linear guide, 405-fifth slide, 406-second adapter plate, 407-second slide assembly, 4071-sixth motor, 4072-sixth coupling, 4073-sixth slide linear guide, 4074-third adapter plate, 4075-sixth slide, 4076-seventh adapter plate, 4077-eighth adapter plate, 408-light curing lamp assembly, 4081-light curing lamp, 4082-ninth adapter plate, 409-light curing resin delivery assembly, 4091-delivery pipe, 4092-tenth adapter plate;

[0079] 5-injection assembly, 501-seventh slide linear guide, 502-lifting assembly, 5021-seventh slide, 5022-lower base, 5023-connecting rod, 5024-upper base, 5025-sample compartment, 5026-lifting rod, 5027-sixth cylinder, 503-third housing, 504-inlaid switch, 505-seventh coupling, 506-seventh motor;

[0080] 6-drying component, 601-drying component body, 602-compressed air nozzle, 603-first water outlet;

[0081] 7-output assembly, 701-eighth motor, 702-rotating belt, 703-belt driven pulley;

[0082] 8-grinding and polishing assembly, 801-grinding and polishing assembly upper frame, 802-second water outlet, 803-grinding and polishing assembly lower frame, 804-combined sandpaper, 8041-first sandpaper, 8042-sandpaper chassis, 8043-magnetic disk, 805-base, 806-eighth motor, 807-ninth motor, 808-first rotating rod, 809-upper grinding head support rod, 810-infusion assembly, 811-upper grinding head outer frame, 812-force sensor, 813-tenth motor, 814-upper grinding head lifting rod, 815-eleventh motor, 816-second rotating rod, 817-pre-tightening cylinder cavity, 818-pre-tightening cylinder, 819-pre-tightening cylinder rod, 820-pre-tightening head, 821-style cavity, 822-style chassis;

[0083] 9-Marker. DETAILED DESCRIPTION

[0084] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such a process, method, article or device. In the absence of further restrictions, the elements defined by the phrase "comprising..." do not exclude the existence of other identical elements in the process, method, article or device comprising the elements. If there is no conflict, the various features of the present invention and the embodiments can be combined with each other, all within the protection scope of the present invention.

[0085] Example 1

[0086] See also Figure 1 , Figure 1 The main structure diagram of the equipment for automatically loading and preparing metallographic samples for detection includes a device body 1, a sandpaper component 2, a transfer component 3, a mounting component 4, a sample introduction component 5 and a grinding and polishing component 8. Each component is respectively installed on the installation platform 114 of the device body 1. The installation platform 114 is divided into a first installation area corresponding to the sandpaper component 2, a second installation area corresponding to the mounting component 4, a third installation area corresponding to the grinding and polishing component 8, a fourth installation area corresponding to the mounting component 4, a fifth installation area corresponding to the sample introduction component 5 and a sixth installation area corresponding to the transfer component 3 according to function; in addition, a marker 8, a drying component 6 and an output component 7 are also installed on the installation platform 114. The present invention can realize the automation of the entire process of metallographic sample loading, mounting, marking, grinding and polishing, drying and finished product output. At the same time, it can also automatically install unused sandpaper 204 and replace the first sandpaper 8041 after use, reduce manual processes, increase the savings in circulation time of each link, and improve production efficiency.

[0087] The transfer component 3 is provided with a sandpaper clamping component 309 and a sample clamping component 311. The sandpaper clamping component 309 can be used to transfer the sandpaper 204 of corresponding specifications stored in the sandpaper component 2 to the grinding and polishing component 8 according to the grinding accuracy requirements of the metallographic sample. At the same time, the failed first sandpaper 8041 on the grinding and polishing component 8 is removed and transferred to the designated storage area in the sandpaper component 2; the sample clamping component 311 is used to transfer the metallographic sample on the injection component 4 to the grinding and polishing component 8 for grinding and polishing. A rotating cylinder 3118 corresponding to the rotating mechanism is arranged on the sample clamping component 311. With the cooperation of the rotating cylinder 3118, the marking device 9 adds marking information to each metallographic sample. The marking information is obtained by inputting through an interactive interface, scanning with an optical lens, or obtaining from a third party (copying from a mobile storage medium, downloading from the Internet), etc. The installation position of the marking device 9 is adapted to the mobile coverage range of the sample clamping component 311.

[0088] In a specific embodiment, if Figure 2 As shown, the device body 1 includes an upper outer frame 101 and a lower outer frame 106. The upper outer frame 101 of the device body is provided with an interactive screen 102 for human-computer interaction, a first information entry unit 103, a second information entry unit, a power switch 104, an emergency switch 105 and a working indicator light 109. The working indicator light 109 includes a light for displaying multiple working states such as standby, stop, operation, and maintenance. The working indicator light 109 includes different color modes of the same light source or multiple light sources corresponding to each working state.

[0089] In one embodiment, the first information entry unit 103 is an optical scanning head for entering an identification code, and the second information entry unit is an information input interface provided by the interactive screen 102. The sample information of the metallographic sample to be processed is entered through the first information entry unit 103 and the second information entry unit, and the marker 9 adds marking information to each first process sample according to the sample information. The first process sample is a metallographic sample that has completed the inlay.

[0090] In one embodiment, a leveling support block 107 and a first roller 108 for equipment transportation are provided at the bottom of the device body 1. The first rollers 108 are composed of four pieces with the same structure and are respectively arranged at four bottom corners. The leveling nut on the leveling support block 107 is used to adjust the height of the leveling support block 107, thereby reducing the flatness requirement of the equipment installation environment.

[0091] In one embodiment, if Figure 3 and Figure 4As shown, the sandpaper assembly 2 is used to store unused sandpaper 204 and used first sandpaper 8041. The sandpaper assembly 2 includes a first sandpaper storage area and a second sandpaper storage area. The first sandpaper storage area is used to store unused sandpaper 204, and the second sandpaper storage area is used to store the used first sandpaper 8041. The first sandpaper storage area and the second sandpaper storage area both include multiple storage positions. Preferably, three storage positions are respectively provided in the first sandpaper storage area and the second sandpaper storage area, which are used to store sandpaper of three specifications of 120 mesh, 600 mesh and 1000 mesh respectively; the sandpaper assembly 2 also includes a sandpaper assembly body 202, and a The component handle 201, sandpaper lever 203, locking groove 205 and second roller 206 on 202, the locking groove 206 is used in conjunction with the first cylinder 111 and the second cylinder 113, and the sandpaper component locking switch 110 and the sandpaper component releasing switch 112 are used to complete the rapid installation and disassembly of the sandpaper component 2, and at the same time, the accuracy of the sandpaper 204 clamped by the transfer component 3 can also be improved; it should be noted that any device body 1 is equipped with at least one set of sandpaper component 2. When the sandpaper on the sandpaper component 2 assembled on the device body 1 is used up, it can be directly and quickly replaced with a spare sandpaper component 2, thereby improving the replacement efficiency of the sandpaper 204.

[0092] It should be noted that: the length direction of the driven rail slide 304 and the active rail guide 314 is set as the first direction, recorded as the X-axis direction in the coordinate system, the length direction of the first conductor rail 318 is set as the second direction, recorded as the Y-axis direction in the coordinate system, and the direction perpendicular to both the first direction and the second direction is recorded as the third direction, recorded as the Z-axis direction in the coordinate system.

[0093] In one embodiment, the transfer component 3 includes a transfer platform, a sandpaper clamping component 309 and a sample clamping component 311. The sandpaper clamping component 309 is used for the transfer of sandpaper 204 and the first sandpaper 8041. The sample clamping component 311 is used to transfer the metallographic sample to be polished from the sampling component 3 to the polishing component 8. The transfer platform includes a guide rail component, a driven rail component and an active rail component adapted to the driven rail component. The guide rail component is slidably connected to the driven rail component and the guide rail component. The sandpaper clamping component 309 and the sample clamping component 311 are installed on the guide rail component. The sandpaper clamping component 309 and the sample clamping component 311 can move along the track direction of the first guide rail 318 of the guide rail component driven by the sliding mechanism of the guide rail component.

[0094] In one embodiment, if Figure 5 , Figure 6 and Figure 7As shown, the active rail assembly includes an active rail support column 312, an active rail support platform 313, an active rail guide 314, an active rail slide 315, a fourth coupling 316, a fourth motor 317 and a first guide rail 318, the lower surface of the active rail support platform 313 is fixed on the active rail support column 312, the active rail guide 314 is installed on the upper surface of the active rail support platform 313, and the active rail slide 315 is slidably connected to the active rail guide 314; the driven rail assembly includes a driven rail support column 301, a driven rail support platform 302, a driven rail slide 303 and a driven rail slide 304, the lower surface of the driven rail support platform 302 is fixed on the driven rail support column 302, the driven rail slide 304 is installed on the upper surface of the driven rail support platform 302, and the driven rail slide 303 is slidably connected with the driven rail slide 304, and the driven rail assembly and the active rail assembly are used in combination; the guide rail assembly includes a first motor 305, a first coupling 306, a first slide support platform 307, a first slide linear guide 308 and a first slide 3102, the first slide 3102 is slidably connected with the first slide linear guide 308, and the first slide linear guide 308 is installed on the first slide support platform 307; one end of the first slide support platform 307 is installed on the driven rail slide 303, and the other end is installed on the active rail slide 315 of the active rail. Driven by the first slide support platform 307, the guide rail assembly follows the active rail slide 315 and the driven rail slide 303 to move along the length direction of the driven rail guide 304 and the active rail guide 314.

[0095] In one embodiment, if Fig. 9 As shown, the sandpaper clamping assembly 309 includes a second slide linear guide 3091, a second slide 3092, a second motor 3093, a first clamping body 3094, a suction cup 3095, a third gas 3096 and a first mounting member. The second slide 3092 is mounted on the first mounting member, the first mounting member is mounted on the first slide 3102, the first mounting member moves along the second direction following the first slide 3102, the second slide 3092 is slidably connected to the second slide linear guide 3091, and the second slide linear guide 3091 moves along the third direction driven by the second motor 3093 One side of the first clamping body 3094 is installed at the end of the second slide linear guide 3091, and the sandpaper clamping body 3094 is provided with a suction cup 3095 on the side away from the second slide linear guide 3091. The suction cup 3095 is used to absorb the unused sandpaper 204 and transport it to the grinding and polishing component 4 under the drive of the transfer component 3. The first clamping body 3094 is provided with at least one clamping auxiliary part 3096 for clamping the used sandpaper 204 and transporting it from the grinding and polishing component 8 to the sandpaper component 2. Preferably, 2N clamping auxiliary parts 3096 are symmetrically arranged, and N is a positive integer greater than or equal to 1.

[0096] In one embodiment, if Figure 8As shown, the sample clamping assembly 311 includes a third motor 3111, a third coupling 3112, a third slide linear guide 3113, a first guide rail slide 3114, a second mounting member, a third slide 3115, a second clamping body 3116, a fourth cylinder 3117 and a fifth cylinder 3118, the first guide rail slide 3114 is slidably connected to the first guide rail 318, the second mounting member is fixed on the first guide rail slide 3114, the third slide linear guide 3113 is mounted on the first mounting member, the third slide 3115 is slidably connected to the third slide linear guide 3113, and the second clamping body 3116 is slidably connected to the first guide rail slide 3114, and the second mounting member is fixed on the first guide rail slide 3114. The upper end of the holding body 3116 is connected to the third slide 3115, and the second clamping body 3116 follows the third slide 3115 to move along the third direction on the third slide guide rail 3113. The lower end of the second clamping body 3116 is provided with a fifth cylinder 3118, and the end of the fifth cylinder 3118 away from the second clamping body 3116 is installed with a fourth cylinder 3117. The fourth cylinder 3117 is used to clamp the metallographic sample, and the fifth cylinder 3118 is used to drive the fourth cylinder 3117 that clamps the first process sample to rotate, thereby causing the first process sample to rotate so that the marker 9 can add marking information to the first process sample.

[0097] In one embodiment, if Figure 8 and Fig. 9 As shown, the transfer assembly also includes a first slide assembly 310, the first slide assembly 310 includes a first adapter plate 3101 and a first slide 3102, the first adapter plate 3101 includes but is not limited to an L-shaped, U-shaped and T-shaped structure, the first mounting member is the first mounting portion of the first adapter plate 3101, the second mounting member is the second mounting portion of the first adapter plate 3101, and the first mounting member and the second mounting member are located on different surfaces of the first adapter plate 3101, such as: if the first adapter plate 3101 is an L-shaped / T-shaped structure, the first mounting member is the first adapter plate 31 01 side, the second mounting piece is the back area of ​​the side of the first adapter plate 3101, and the top of the first adapter plate 3101 is connected to the first slide 3102; if the first adapter plate 3101 is a U-shaped structure, the first mounting piece is the first side of the first adapter plate 3101, the second mounting piece is the second side of the first adapter plate 3101, and the top of the first adapter plate 3101 is connected to the first slide 3102; preferably, the first adapter plate 3101 is an L-shaped structure, which can save the installation space of the sandpaper clamping assembly 309 and the sample clamping assembly 310.

[0098] In one embodiment, the inlay assembly 4 includes a light curing lamp assembly 408, a light curing resin delivery assembly 409 and a switching assembly, and the switching assembly is used to adjust the position of the light curing lamp assembly 408 and the light curing resin delivery assembly 409 relative to the injection assembly 5, including a first adjustment structure for horizontal position adjustment and / or a second adjustment structure for vertical position adjustment; Fig.10As shown, the switching component includes a fifth motor 401, a fifth coupling 402, a fifth slide support assembly 403, a fifth slide linear guide 404, a fifth slide 405 and a second adapter plate 406. The second adapter plate 406 is used to install a photocuring lamp assembly 408 and a photocuring resin delivery assembly 409. The fifth slide 405 moves along the length direction of the fifth slide linear guide 404 under the action of the fifth motor 401 and the fifth coupling 402. The fifth slide support assembly 403 includes a slide support column 4031, a fifth slide support platform 4032 and a second guide rail 4033. The second guide rail 4033 is installed on the fifth slide support platform 4032. The fifth slide support assembly 403 is fixed to the mounting platform 114 through the slide support column 4031. The switching component can also be a robotic arm. The implementation scheme of the switching component is not specifically limited here.

[0099] In one embodiment, if Fig.11 As shown, the switching assembly also includes a second slide assembly 407, the second slide assembly 407 includes a sixth motor 4071, a sixth coupling 4072, a sixth slide linear guide 4073, a third adapter plate 4074 and a sixth slide 4075, the sixth slide 4075 moves along a third direction on the sixth slide linear guide 4073 under the action of the sixth motor 4071 and the sixth coupling 4072, the third adapter plate 4074 includes a fourth fixing portion, a seventh adapter plate 4076 and an eighth adapter plate 4077, the fourth fixing portion of the third adapter plate 4074 is connected to the sixth slide 4075, the seventh adapter plate 4076 is used to install the light fixing lamp assembly 408, and the eighth adapter plate 4077 is used to install the light fixing lamp conveying assembly 409.

[0100] In one embodiment, if Fig.12 As shown, the light-curing lamp assembly 408 includes multiple light-curing lamps 4081 and a ninth adapter plate 4082. The ninth adapter plate 4082 includes a first installation area and a fifth fixing portion. The light-curing lamp 4081 is installed in the first installation area of ​​the ninth adapter plate 4082. The model of the light-curing lamp 4081 is preferably a 405nm ultraviolet light source. It should be noted that the model of the light-curing lamp 4081 is not limited to the above-mentioned 405nm ultraviolet light source, but can also be other light sources that meet the light-curing requirements. The model of the light-curing lamp 4081 is not specifically limited here. The fifth fixing portion of the ninth adapter plate 4082 is connected to the seventh adapter plate 4076. The installation method of the light-curing lamp 4081 is no longer described here.

[0101] In one embodiment, if Fig.13As shown, the photocurable resin delivery assembly 409 includes a delivery tube 4091 and a tenth adapter plate 4092. The tenth adapter plate 4092 includes a second installation area and a sixth fixing portion. The delivery tube 4091 is installed in the second installation area. The sixth fixing portion of the tenth adapter plate is connected to the eighth adapter plate 4077. The installation method of the delivery tube 4091 is not repeated here.

[0102] In one embodiment, if Fig.14 , Fig.15 and Fig.16 As shown, the sample injection component 5 includes a transmission component and a sample chamber component 502. The sample chamber component 502 includes a sample chamber main body and a plurality of first mounting holes arranged in the sample chamber main body. A plurality of sample chambers 5025 with adjustable inner cavity depth are formed in each first mounting hole by arranging a lifting mechanism. The transmission component is used to transmit the sample chamber 5025 to the subsequent inlay, marking, grinding and polishing process area. The transmission component includes a seventh slide linear guide 501, a seventh slide 5021, a third shell 503, an inlay switch 504, a seventh coupling 505 and a seventh motor 506. The seventh slide linear guide 501 is fixed on the mounting platform 114. The seventh slide 5021 is slidably connected to the seventh slide linear guide 501. The seventh slide 5021 moves along the length direction of the seventh slide linear guide 501 under the action of the seventh coupling 505 and the seventh motor 506. The seventh coupling 505 and the seventh motor 506 are provided with a third shell 503. Other motors are also provided with protective shells, which will not be repeated here.

[0103] In one embodiment, if Fig.16 As shown, the sample bin body includes: a lower base 5022, an upper base 5024, a lifting rod 5026 and a sixth cylinder 5027, the first mounting hole passes through the upper base 5024 and extends into the lower base 5022; the bottom of the lower base 5022 is mounted on the seventh slide 5021, and the entire sample bin body moves along the length direction of the seventh slide linear guide 501 following the seventh slide 5021, the lower bottom surface of the upper base 5024 is mounted on the top of the lower base 5022, the sixth cylinder 5027 and the lifting rod 5026 are arranged in the first mounting hole, the lifting rod 5026 moves along the axis direction of the first mounting hole under the action of the sixth cylinder 5027, and forms a sample bin (5025) in the top area of ​​the upper base (5024) where the first mounting hole is located, and by controlling the depth position of the lifting rod 5026 in the first mounting hole, sample bins 5025 of different depths can be obtained.

[0104] In a specific embodiment, the sample bin 5025 includes a first state and a second state. The first state is a state in which the depth of the sample bin cavity 5025 meets the requirements for loading and unloading metallographic samples, and the second state is a state in which the depth of the sample bin cavity 5025 meets the requirements for cold mounting of metallographic samples. For example, when a metallographic sample needs to be loaded, the lifting rod 5026 is evenly adjusted to a corresponding height. At this time, the height difference between the top of the lifting rod 5026 and the upper surface of the upper base 5024 is a first height difference. The sample bin 5025 in this state is recorded as the first state. After the metallographic sample is loaded, the metallographic sample is sent to the mounting assembly 4 for mounting. At this time, the lifting rod 5026 is adjusted to a corresponding height. The height difference between the top and the upper surface of the upper base 5024 is the second height difference, and the first height difference is smaller than the second height difference. The sample chamber 5025 can be adjusted from the first state to the second state at the position of the inlay component 4, or the sample chamber 5025 can be adjusted from the first state to the second state at the initial position of the metallographic sample loading, or it can be adjusted during the transmission process, and no specific restrictions are made here; similarly, when the first process sample is transferred to the sample clamping component 311, it needs to be executed when the sample chamber 5025 is in the first state, and there is no restriction on the adjustment timing of adjusting the state of the sample chamber 5025 from the second state to the first state.

[0105] The inner wall of the sample chamber 5025 is provided with a reflective coating, and the light curing lamp 4081 penetrates into the sample chamber 5025 to cure the metallographic sample. There are problems such as low efficiency of direct light irradiation and long light curing time. By providing a reflective coating, the curing efficiency of the light curing resin can be improved and the time required for light curing can be saved.

[0106] In one embodiment, if Fig.17 As shown, the drying component 6 is used to dry the metallographic sample after grinding and polishing. The drying component 6 includes a drying component body 601, at least one compressed air nozzle 602 and a first water outlet 603. The drying component body 601 is fixed on the mounting platform 114, and the compressed air nozzle 602 is arranged in the drying component body 601. All compressed air nozzles 602 are evenly distributed in the drying component body 601. Preferably, 4 compressed air nozzles 602 are arranged, respectively, on the four sides of the drying component body 601. Preferably, the compressed air nozzle 602 sprays heated air at 40°C, and a first water outlet 603 is provided at the lower part of the drying component body 601.

[0107] In one embodiment, if Fig.18 As shown, the output component 7 includes an eighth motor 701, a rotating belt 702 and a belt driven pulley 703. The output component 7 is used to output the prepared metallographic sample. The prepared metallographic sample is placed on the moving belt 702. The moving belt 702 moves under the action of the belt driven pulley 703 and the eighth motor 701, and the prepared metallographic sample is output following the rotating belt 701.

[0108] In one embodiment, if Fig.19 As shown, the grinding and polishing assembly 8 includes an upper grinding head assembly, a lower grinding head assembly and a rotating assembly, the lower grinding head assembly includes an upper frame 801 of the grinding and polishing assembly, a second water outlet 802, a lower frame 803 of the grinding and polishing assembly, a combination of sandpaper 804, a base 805 and an eighth motor 806; the lower frame 803 of the grinding and polishing assembly is installed on the installation platform 114, the upper frame 801 of the grinding and polishing assembly is installed on the lower frame 803 of the grinding and polishing assembly, the upper surface of the grinding and polishing assembly 801 and the lower frame 803 of the grinding and polishing assembly form a mounting groove, the base 805 is installed in the mounting groove, the combination of sandpaper 804 is installed on the base 805, the eighth motor 806 is installed in the lower frame 803 of the grinding and polishing assembly, the eighth motor 806 drives the combination of sandpaper 804 to rotate through the base 805, and the upper surface of the lower frame 803 of the grinding and polishing assembly is provided with a second water outlet 802, that is, the bottom of the mounting groove is provided with a second water outlet 802.

[0109] In one embodiment, a first type of lower grinding head assembly and a second type of lower grinding head assembly are included. The first type of lower grinding head assembly is used for polishing metallographic samples, and the second type of lower grinding head assembly is used for polishing metallographic samples. Preferably, at least one second type of lower grinding head assembly is provided. If a plurality of second type of lower grinding head assemblies are included, then according to the polishing requirements of the metallographic samples, each second type of lower grinding head assembly is equipped with sandpaper 204 of different specifications, such as 120 mesh, 600 mesh and 1000 mesh. The specifications of the sandpaper 204 are not limited to the above three types, and can also be other specifications, such as 180 mesh, etc.

[0110] In one embodiment, Fig. 20 , Fig.21 and Fig. 22 As shown, the combined sandpaper 804 includes a first sandpaper 8041, a sandpaper base 8042 and a magnetic disk 8043. The first sandpaper 8041 is a sandpaper 204 with adhesive backing. The first sandpaper 8041 is adhered to the sandpaper base 8042. The sandpaper base 8042 is magnetically fixed to the magnetic disk 8043. The edge size of the sandpaper base 8042 is larger than the edge size of the first sandpaper 8041 and the magnetic suction disk 8042, which is convenient for clamping the auxiliary part 3. 096 clamps the sandpaper chassis 8042 for transportation; it should be noted that: when the sandpaper chassis 8042, the magnetic suction cup 8043 and the first sandpaper 8041 are circular, the diameter of the sandpaper chassis 8042 is the largest, and when the sandpaper chassis 8042, the magnetic suction cup 8043 and the first sandpaper 8041 are square, the side of the sandpaper chassis 8042 is the longest. The shapes of the sandpaper chassis 8042, the magnetic suction cup 8043 and the first sandpaper 8041 are not limited here.

[0111] In one embodiment, if Fig.23As shown, the upper grinding head assembly includes an upper grinding head body and an infusion assembly 810. The rotating assembly includes a ninth motor 807, a first rotating rod 808 and an upper grinding head support rod 809. The ninth motor 807 is installed on the mounting platform 114. One end of the first rotating rod 808 is connected to the ninth motor 807, and the other end of the first rotating rod 808 is connected to one end of the upper grinding head support rod 809. The upper grinding head body is connected to the other end of the upper grinding head support rod 809. The infusion assembly 810 is installed on the upper grinding head support rod 809, and the infusion assembly 809 is adapted to the upper grinding head body. Under the action of the first rotating rod 808 and the ninth motor 807, the upper grinding head body switches between the lower grinding head assemblies.

[0112] In one embodiment, the upper grinding head body includes an upper grinding head outer frame 811, a force sensor 812, a tenth motor 813, an upper grinding head lifting rod 814, an eleventh motor 815, a second rotating rod 816, a pre-tightening cylinder cavity 817, a pre-tightening cylinder 818, a pre-tightening cylinder rod 819, a pre-tightening head 820, a pattern cavity 821 and a pattern chassis 822. The upper grinding head outer frame 811 is installed on the upper grinding head support rod 809, and the force sensor 812 is installed on the top of the upper grinding head outer frame 811 to detect the force value during the grinding and polishing of the metallographic sample. The tenth motor 813 is arranged at the lower part of the sensor 812, the lower part of the tenth motor 813 is connected to the upper grinding head lifting rod 814, the lower end of the upper grinding head lifting rod 814 is connected to the eleventh motor 815, the eleventh motor 816 is connected to the sample chassis 822 through the second rotating rod 816 to drive the sample chassis 822 to rotate, the pre-tightening cylinder cavity 817 is arranged in the upper grinding head outer frame 811, the pre-tightening cylinder cavity 817 is connected to the pre-tightening cylinder 818, and the pre-tightening cylinder rod 819 drives the pre-tightening head 820 to move along the third direction under the action of the pre-tightening cylinder 818. The pre-tightening head 820 provides a pre-tightening force for the metallographic sample in the sample cavity 821.

[0113] In one embodiment, if Fig.24 and Fig.25 As shown, a plurality of sample cavities 821 are arranged on the sample chassis 822 , and the distribution of the sample cavities 821 on the sample chassis 821 is adapted to the distribution of the fourth cylinders 3117 corresponding to the clamping mechanisms for transferring metallographic samples in the sample clamping assembly 311 , so that the metallographic samples transferred from the sample chamber 5025 by the fourth cylinder 3117 can correspond to the embedded sample cavities 821 .

[0114] In a specific embodiment, a technician enters the sample information of the metallographic samples to be processed into the system through the second information entry unit embedded in the interactive screen 102, the first information entry unit 103 or other forms (such as copying to a mobile storage medium, downloading from the Internet), and the sample information is used to generate marking information that is subsequently added to each metallographic sample by the marker 9; when the information entry of each metallographic sample is completed, the sixth cylinder 5027 of the lifting mechanism is controlled to drive the lifting rod 5026 to move, so that the sample bin 5025 is in the first state, and then each metallographic sample is placed in the corresponding sample bin 5025 in the order in which the sample information is entered. Specifically, each metallographic sample is placed in the sample bin 5025 with the corresponding number according to the metallographic sample loading rules.

[0115] After all metallographic samples are loaded, the inlay switch 504 is operated to start inlaying. At this time, the sixth cylinder 5027 of the lifting mechanism drives the lifting rod 5026 to move, so that the sample bin 5025 is in the second state. Preferably, the inner cavity depth of the sample bin 5025 in the second state is 50 mm (the depth can be adaptively adjusted based on the thickness of the metallographic samples). The first motor 506 and the seventh coupling 505 of the transmission component work, and the sample bin 5025 on the seventh slide 502 is driven to move upward through the seventh slide linear guide 501. After the inlay assembly 4 moves to the preset position, the light-curing resin delivery assembly 409 moves left and right along the length direction of the fifth slide linear guide rail 404 driven by the fifth slide 405, and moves up and down along the length direction of the sixth slide linear guide rail 4073 under the action of the sixth slide 4075, until the end of the delivery tube 4091 extends into the sample chamber 5025, and injects light-curing resin into the sample chamber 5025. The amount of light-curing resin injected is to wrap the metallographic sample, and the height of the light-curing resin is preferably 5mm higher than the upper surface of the metallographic sample. Repeat the above actions, remove the delivery tube 4091 from the sample chamber 5025, and at the same time, the light source part of the light-curing lamp 4081 of the light-curing lamp assembly 408 penetrates into the sample chamber 5025 for light curing, so as to obtain the first process sample. The curing time is preferably 10s each time, and it is repeated multiple times until the metallographic sample is completely cured; then repeat the above actions, and remove the light-curing lamp assembly 408 from the sample chamber 5025.

[0116] When the metallographic sample is inlaid to obtain the first process sample, the sixth cylinder 5027 of the lifting mechanism drives the lifting rod 5026 to move, so that the sample bin 5025 is in the first state, and the first motor 506 and the seventh coupling 505 of the transmission component work, and the sample bin 5025 on the seventh slide 502 is driven to move toward the polishing component 8 through the seventh slide linear guide 501. The sample clamping component 3117 moves left and right along the length direction of the first slide linear guide 308 under the drive of the first slide 3102, and at the same time moves up and down along the length direction of the third slide linear guide 3113 under the action of the third slide 3115, until it is convenient for the sample clamping component 3117 to clamp the first process sample in the sample bin 5025; the first process sample on the sample clamping component 3117 rotates under the drive of the fifth cylinder 3118, and cooperates with the marking device 9 to complete the addition of marking information, and the marking information is preferably added to the photocuring resin on the outer side of the metallographic sample.

[0117] After the first process sample is completed with the addition of the marking information, the sample clamping assembly 311 moves left and right along the length direction of the first slide linear guide 308 under the action of the first slide 3102, and moves up and down along the length direction of the third slide linear guide 3113 under the action of the third slide 3115, and places the clamped metallographic sample on the first sandpaper 8041 of the polishing assembly 8, and then removes the sample clamping assembly 311 from the polishing assembly 8 area; wherein, the installation of the first sandpaper 8041 includes: the sandpaper clamping assembly 309 moves left and right along the length direction of the first slide linear guide 308 under the action of the first slide 3102, and moves up and down along the length direction of the third slide linear guide 3113 under the action of the third slide 3115, and the sandpaper 204 with the largest roughness on the sandpaper assembly 2 is adsorbed and transported to the magnetic disk 8043 of the polishing assembly 8, thereby being fixed on the bottom of the sandpaper A first sandpaper 8041 is formed on the disk 8042, and the first sandpaper 8041 is a disposable consumable; the ninth motor 807 drives the sample clamping assembly 311 to rotate until the position of the sample cavity 821 corresponds to the metallographic sample on the first sandpaper 8041, and then the tenth motor 813 drives the sample cavity 821 to move toward the metallographic sample, and with the cooperation of the pre-tightening cylinder 818 and the pre-tightening head 821, the metallographic sample is installed in the sample cavity 821, and then the eleventh motor 815 drives the metallographic sample to rotate in the first rotation direction, and the base 805 drives the first sandpaper 8041 to move in the second rotation direction, and the metallographic sample grinding begins; when the first stage of grinding is completed, the eleventh motor 815 stops working, the eighth motor 806 stops working, the infusion assembly 810 stops working, the pre-tightening cylinder 818 stops working, and the pre-tightening head 820 rises to the target position, preferably the highest position. The sample cavity 821, under the action of the tenth motor 813, drives the metallographic sample to separate from the first sandpaper 8041, and at the same time, the ninth motor 807 drives the upper grinding head assembly to move to a position that does not interfere with the transfer assembly 3. The fourth cylinder 3117 of the sample clamping assembly 311 clamps the metallographic sample, the clamping auxiliary member 3096 of the sample clamping assembly 311 clamps the sandpaper chassis 8042, and the suction cup 3095 of the sample clamping assembly 311 absorbs the first sandpaper 8041, thereby transferring the first sandpaper 8041 to the second sandpaper storage area of ​​the sandpaper assembly 2, and then transferring the new sandpaper 204 to the sandpaper chassis 842, and repeating the above operation to achieve the grinding of the metallographic sample with sandpaper 204 of different roughness.

[0118] When the metallographic sample is finished with roughness sandpaper polishing, the eleventh motor 815 stops working, the eighth motor 806 stops working, and the infusion assembly 810 stops working. The preload cylinder 818 stops working, and the preload head 820 rises to the upper target position, preferably the highest position. The sample cavity 821 is driven by the tenth motor 813 to separate the metallographic sample from the first sandpaper 8041. The upper grinding head assembly is driven by the ninth motor 809 to move to a position that does not interfere with the transport assembly 3. The metallographic sample is transferred to the lower grinding head polishing disk by the sample clamping assembly 311 again. The position of the sample cavity 821 is adjusted to align with the metallographic sample. The tenth motor 813 drives the sample cavity 821 to separate from the first sandpaper 8041. The cavity 821 moves toward the metallographic sample, and with the cooperation of the pre-tightening cylinder 818 and the pre-tightening head 821, the metallographic sample is installed in the sample cavity 821, and then the eleventh motor 815 drives the metallographic sample to rotate in the first rotation direction, and the base 805 drives the polishing disc to move in the second rotation direction. The infusion component 810 adds polishing auxiliary liquid to the polishing disc at a drop rate of 0.5 seconds / drop to 3 seconds / drop, and the polishing time is 30 seconds to 180 seconds, and then the metallographic sample is separated from the sample cavity 821.

[0119] After the metallographic sample is polished, the sample clamping component 311 transfers the metallographic sample on the polishing disc to the drying component 6, which removes water stains on the surface of the metallographic sample to obtain the final metallographic sample, which is recorded as the target sample and output by the output component 8.

[0120] The device for automatically loading and preparing metallographic samples for detection provided by the present invention comprises a sampling component 5 and a mounting component 4, wherein the sampling component 5 comprises a transmission component and a sample chamber component 502, and the mounting component 4 comprises a light-curing lamp component 408, a light-curing resin conveying component 409 and a switching component, wherein the conveying component and the switching component cooperate to adjust the relative positions of the sample chamber component 502, the light-curing lamp component 408 and the light-curing resin conveying component 409, and the transmission component and the switching component cooperate to realize automatic switching between the light-curing resin adding process and the light-curing lamp component curing process, and at the same time, a sample chamber 5025 with an adjustable inner cavity depth is provided to reduce human interference in the process from metallographic sample preparation to mounting, and improve the circulation efficiency and the disassembly and assembly efficiency of the metallographic sample. The present invention improves the automation level of metallographic sample production and improves the efficiency of metallographic sample production.

[0121] Example 2

[0122] The present invention further provides a method for automatically loading and preparing metallographic samples for detection based on the device for automatically loading and preparing metallographic samples for detection in Example 1, the method comprising:

[0123] S1: In response to a metallographic sample mounting instruction, the metallographic sample is loaded to a first target position of a sample bin in a first state, and a mounting execution instruction is output;

[0124] Specifically, a lifting mechanism is provided in the sample bin 5025, and the lifting mechanism is used to adjust the inner cavity depth of the sample bin 5025, so that the sample bin 5025 is in different states, so that the sample bin 5025 can meet the needs of different links. The first state is to facilitate the placement of metallographic samples in the sample bin 5025 or the removal of metallographic samples from the sample bin 5025, and the first target position is the position of the sample bin 5025 for placing metallographic samples.

[0125] S2: According to the inlay execution instruction, controlling the inlay component to cold-mount the metallographic sample in the sample chamber in the second state to obtain a first process sample;

[0126] Specifically, when the metallographic sample needs to be inlaid, the lifting mechanism is controlled to adjust the sample bin 5025 to the second state, and the second state satisfies that the depth of the sample bin 5025 meets the irradiation requirements of the photocuring lamp 4081 and the filling requirements of the photocuring resin; after the inlay component 4 uses the photocuring resin delivery component 409 to inject the photocuring resin into the sample bin 5025, the light curing lamp 4081 of the light curing lamp component 408 irradiates the sample bin 5025 filled with the photocuring resin to obtain a first process sample.

[0127] S3: transporting the first process sample to a second target location, and controlling the polishing assembly (8) to polish the first process sample to obtain a target sample;

[0128] The first state is a state in which the depth of the sample chamber (5025) is in compliance with the requirements for loading and unloading metallographic samples, and the volume of the inner cavity meets the requirements for embedding; the second state is a state in which the depth of the sample chamber (5025) is in compliance with the requirements for cold embedding metallographic samples.

[0129] In one embodiment, the S1 includes:

[0130] S11: in response to the inlay instruction, obtaining a preset metallographic sample loading scheme and a loading starting position;

[0131] S12: starting to load samples from the loading starting position according to the loading scheme, and outputting a sample position correction instruction after the loading is completed;

[0132] S13: In response to the sample position correction instruction, the metallographic sample is adjusted to the first target position, and the inlay execution instruction is output.

[0133] Specifically, the loading scheme includes a test scheme and a batch production scheme. Each sample bin 5025 is numbered, and metallographic samples are added to the sample bin 5025 according to the starting position specified in the loading scheme. For example, if there are 10 sample bins 5025, they are numbered from NO.1 to NO.10 in a clockwise direction. After the metallographic samples are placed in each sample bin 5025, it is detected whether the placement position of each metallographic sample meets the requirements, such as whether there is any contact between the metallographic sample and the inner wall of the sample bin 5025. If so, the metallographic sample position is calibrated until all metallographic samples are placed at the first target position and then inlaying begins.

[0134] In one embodiment, the S2 includes:

[0135] S21: in response to the inlay execution instruction, obtaining second depth information of the inner cavity depth of the sample chamber corresponding to the second state;

[0136] S22: adjusting the sample chamber to a second state according to the second depth information, and outputting a mosaic target instruction;

[0137] S23: Controlling the mounting assembly to cold mount the metallographic sample according to the mounting target instruction to obtain the first process sample.

[0138] Specifically, when all metallographic samples are placed correctly, the lifting mechanism is controlled to adjust the state of the sample bin to the second state according to the second depth information corresponding to the second state of the sample bin 5025, and then the inlay assembly 4 is used for inlaying to obtain the first process sample.

[0139] In one embodiment, the inlay target instruction includes a first execution instruction and a second execution instruction, and S23 includes:

[0140] S231: according to the first execution instruction, using the photocurable resin delivery component (409) at the second coordinate position, injecting photocurable resin into the sample chamber at the first coordinate position to obtain a sample to be cured;

[0141] S232: according to the second execution instruction, using the light curing lamp in the light curing lamp assembly (408) at the second coordinate position to penetrate into each of the sample chambers at the first coordinate position to perform light curing on the sample to be cured, so as to obtain the first process sample;

[0142] The transmission component of the injection component moves the sample chamber to the first coordinate position, and the switching component of the inlay component moves the photocurable resin delivery component and the photocurable resin delivery component to the second coordinate position matching the first coordinate position.

[0143] Specifically, after the debugging of the photocurable resin delivery component 409 and the sample chamber 5025 located at the first coordinate position is completed, the delivery tube 4091 of the photocurable resin delivery component 409 is inserted into the sample chamber 5025, and a preset amount of photocurable resin is injected. The metallographic sample at this time is recorded as a sample to be cured. Then, the switching mechanism of the inlay component 4 is used to adjust the photocuring component 408 to the second coordinate position, and the photocuring lamp 4081 is inserted into the sample chamber 5025 to irradiate and cure the sample to be cured, thereby obtaining a first process sample in the sample chamber 5025.

[0144] In one embodiment, the S3 includes:

[0145] S31: in response to the polishing instruction of the first process sample, obtaining first depth information of the inner cavity depth of the sample chamber (5025) corresponding to the first state;

[0146] S32: adjusting the sample chamber (5025) to a first state according to the first depth information, and outputting a marking instruction;

[0147] S33: adding marking information to each of the first process samples at the second target position according to the marking instruction to obtain each of the second process samples;

[0148] S34: Control the grinding and polishing component (8) to grind and polish the second process sample to obtain a target sample.

[0149] Specifically, when the metallographic sample is completed inlay, the first depth information of the inner cavity depth of the sample bin 5025 in the first state is obtained, and then the lifting mechanism is controlled to adjust the sample bin 5025 from the second state to the first state. In the first state, the sample clamping assembly 311 is controlled to clamp the first process sample in the sample bin 5025, and cooperate with the marking device 9 to add marking information to each first process sample, and the metallographic sample with the marking information is recorded as the second process sample, and then the sample clamping assembly 311 transfers the second process sample to the grinding and polishing assembly for grinding and polishing.

[0150] In one embodiment, the S33 includes:

[0151] S331: transferring each of the first process samples at the second target position to the sample clamping component, and outputting a marking execution instruction;

[0152] S332: In response to the marking execution instruction, control the sample clamping assembly to rotate to cooperate with the marking device to add the marking information to each of the first process samples.

[0153] Specifically, a rotating mechanism is provided on the sample clamping assembly 311. After the marking device 9 adds the marking information of a first process sample, the sample clamping assembly 311 uses the rotating mechanism to rotate the next first process sample to be marked to the marking position, and the marking device 9 continues to add marking information to the new first process sample. The above actions are repeated until all the first process samples have completed the addition of marking information, and the sample clamping assembly 311 directly transfers each second process sample to the polishing assembly 4.

[0154] In one embodiment, the S3 includes:

[0155] S35: controlling the upper grinding head assembly of the grinding and polishing assembly (8) to obtain each of the first process samples and output a grinding and polishing instruction;

[0156] S36: According to the polishing instruction, the upper grinding head assembly is controlled to move in a first rotation direction and the lower grinding head assembly of the inlay assembly (8) is controlled to move in a second rotation direction to obtain the target sample;

[0157] Wherein, the first rotation direction is opposite to the second rotation direction.

[0158] In one embodiment, the upper grinding head assembly moves in the first rotation direction as a rotating mechanism driving the first metallographic sample to move, and the lower grinding head assembly moves in the second rotation direction as a rotating mechanism driving the sandpaper assembly to move.

[0159] Specifically, the upper grinding head assembly of the grinding and polishing assembly 8 transfers the first process sample or the second process sample on the sample clamping assembly 311 to the sample cavity 821 and locks it, and then adjusts the relative position of the upper grinding head assembly and the lower grinding head assembly, and then controls the upper grinding head assembly to move in the first rotation direction and the lower grinding head assembly to move in the second rotation direction to complete the grinding and polishing of the metallographic sample. In a preferred embodiment, the rotation speed of the first sandpaper 8041 located in the lower grinding head assembly is 100 rpm to 1200 rpm, and the rotation speed of the first process sample or the second process sample in the upper grinding head sample cavity 821 is 50 rpm to 400 rpm; further, the grinding The polishing component 4 is divided into multiple polishing procedures according to the polishing requirements of the metallographic sample. After the first stage of polishing is completed, the upper grinding head component and the lower grinding head component are separated, and the sandpaper clamping component 309 of the transfer component 3 clamps the first sandpaper 8041 to remove it from the lower grinding head, and transfers it to the second sandpaper storage area of ​​the sandpaper component for placing the first sandpaper 8041. At the same time, sandpaper 204 that meets the polishing requirements is selected from the first sandpaper storage area and installed on the lower grinding head to perform the second stage of polishing on the metallographic sample. The above process is repeated to achieve polishing of the metallographic sample with sandpaper 204 of different roughness, which can reduce the number of lower grinding heads and save equipment space and cost. Optionally, multiple lower grinding heads can be set up, and sandpaper 204 with different roughness can be installed on each lower grinding head according to the grinding requirements. After completing grinding with sandpaper 204 of one specification, the switching mechanism automatically switches the upper grinding head to the next lower grinding head position for the next stage of grinding, thereby realizing the grinding of metallographic samples with sandpaper 204 with different roughness. When all grinding procedures are completed, the first sandpaper 8041 on each lower grinding head is transferred to the second sandpaper storage area, thereby saving grinding time and improving grinding efficiency.

[0160] The method for automatically loading and preparing metallographic samples for detection provided by the present invention comprises a sampling component 5 and a mounting component 4, wherein the sampling component 5 comprises a transmission component and a sample chamber component 502, and the mounting component 4 comprises a light-curing lamp component 408, a light-curing resin conveying component 409 and a switching component, wherein the conveying component and the switching component cooperate to adjust the relative positions of the sample chamber component 502, the light-curing lamp component 408 and the light-curing resin conveying component 409, and the transmission component and the switching component cooperate to realize automatic switching between the light-curing resin adding process and the light-curing lamp component curing process, and at the same time, a sample chamber 5025 with an adjustable inner cavity depth is provided to reduce human interference in the process from metallographic sample preparation to mounting, and improve the circulation efficiency and the disassembly and assembly efficiency of the metallographic samples. The present invention improves the automation level of metallographic sample production and improves the efficiency of metallographic sample production.

[0161] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for automatically loading and preparing metallographic samples for detection, comprising a sample feeding component (5) and a mounting component (4), characterized in that: The sample injection assembly (5) comprises a transmission assembly and a sample chamber assembly (502), and the inlay assembly (4) comprises a light curing lamp assembly (408), a light curing resin delivery assembly (409) and a switching assembly, wherein the delivery assembly and the switching assembly cooperate to adjust the relative position of the sample chamber assembly (502), the light curing lamp assembly (408) and the light curing resin delivery assembly (409); The sample chamber assembly (502) includes a sample chamber body and a plurality of first mounting holes arranged in the sample chamber body, and a plurality of sample chambers (5025) with adjustable inner cavities are formed in each of the first mounting holes by arranging a lifting mechanism, the light curing lamp (4081) of the light curing lamp assembly (408) is adapted to the sample chamber (5025), and the delivery tube (4091) of the light curing resin delivery assembly (409) is adapted to the sample chamber (5025).

2. The device for automatically loading and preparing metallographic samples for detection according to claim 1, characterized in that: The inner wall of the sample chamber (5025) is provided with a reflective coating.

3. The device for automatically loading and preparing metallographic samples for detection according to claim 1, characterized in that: The transmission component comprises a seventh slide linear guide rail (501) and a seventh slide (5021), wherein the seventh slide (5021) is slidably connected to the seventh slide linear guide rail (501), and the sample chamber component (502) is connected to the seventh slide (5021), and the sample chamber component (502) moves along the length direction of the seventh slide linear guide rail (501) following the seventh slide (5021).

4. The device for automatically loading and preparing metallographic samples for detection according to claim 3, characterized in that: The sample chamber body comprises a lower base (5022), an upper base (5024), a lifting rod (5026) and a sixth cylinder (5027), and the first mounting hole passes through the upper base (5024) and extends into the lower base (5022); One end of the lower base (5022) away from the upper base (5024) is installed on the seventh slide (5021), and the upper base (5024) is installed on the end of the lower base (5022) away from the seventh slide (5021). The sixth cylinder (5027) and the lifting rod (5026) are installed in the first mounting hole. The lifting rod (5026) moves along the axial direction of the first mounting hole under the action of the sixth cylinder (5027), and forms the sample chamber (5025) at the end of the first mounting hole located on the upper base (5024) away from the lower base (5022).

5. The device for automatically loading and preparing metallographic samples for detection according to claim 1, characterized in that: The switching mechanism comprises a fifth slide linear guide (404) and a fifth slide (405), wherein the fifth slide (405) is slidably connected to the fifth slide linear guide (404), the light curing lamp assembly (408) and the light curing resin conveying assembly (409) are connected to the fifth slide (405), and the light curing lamp assembly (408) and the light curing resin conveying assembly (409) follow the fifth slide (405) and move along the length direction of the fifth slide linear guide (404).

6. The device for automatically loading and preparing metallographic samples for detection according to any one of claims 1 to 5, characterized in that: The switching mechanism also includes a sixth slide linear guide rail (4073) and a sixth slide (4075), the light curing lamp assembly (408) and the light curing resin conveying assembly (409) are connected to the sixth slide (4075), and the light curing lamp assembly (408) and the light curing resin conveying assembly (409) follow the sixth slide (4075) and move along the length direction of the sixth slide linear guide rail (4073).

7. A device for automatically loading and preparing metallographic samples for detection, comprising a device body (1), a sandpaper component (2), a transfer component (3), a grinding and polishing component (8), and the device for automatically loading and preparing metallographic samples for detection according to any one of claims 1 to 6, characterized in that: The sandpaper assembly (2), the transport assembly (3), the polishing assembly (8), the sample introduction assembly (5) and the inlay assembly (4) are all installed on the device body (1); The transport component (3) comprises a sandpaper clamping component (309) and a sample clamping component (311), wherein the sandpaper clamping component (309) is used to transport the sandpaper (204) or the first sandpaper (8041), and the sample clamping component (311) is used to transport the metallographic sample to be polished.

8. The device for automatically loading and preparing metallographic samples for detection according to claim 7, characterized in that: The transfer assembly also includes a transfer platform, the sandpaper clamping assembly (309) is fixed on a first mounting member of the transfer platform, and the sample clamping assembly (311) is fixed on a second mounting member of the transfer platform, wherein the first mounting member and the second mounting member are different surfaces of a first adapter plate 3101 of the transfer platform.

9. The device for automatically loading and preparing metallographic samples for detection according to claim 7, characterized in that: The grinding and polishing assembly (8) comprises a lower grinding head assembly, an upper grinding head assembly and a rotating assembly, wherein the rotating assembly is mounted on the device body (1), the upper grinding head assembly is connected to the rotating assembly, the lower grinding head assembly is mounted on the device body (1), the lower grinding head assembly comprises a first type of lower grinding head assembly and at least one second type of lower grinding head assembly, and the rotating assembly is used to switch the upper grinding head assembly to a different second type of lower grinding head assembly for matching.

10. The device for automatically loading and preparing metallographic samples for detection according to claim 9, characterized in that: The rotating assembly includes a ninth motor (807), a first rotating rod (808) and an upper grinding head support rod (809); the upper grinding head assembly is mounted on one end of the first rotating rod (808); the other end of the first rotating rod (808) is mounted on the device body (1); the upper grinding head assembly cooperates with each of the second-type lower grinding heads under the drive of the first rotating rod (808).

11. The device for automatically loading and preparing metallographic samples for detection according to claim 10, characterized in that: The upper grinding head assembly comprises an upper grinding head body and an infusion assembly (810), wherein the infusion assembly (810) comprises a first drip hole and a second drip hole, wherein the first drip hole is used for dripping cooling liquid, and the second drip hole is used for dripping grinding paste.

12. A method for automatically loading and preparing metallographic samples for detection, characterized in that: The method comprises: In response to an inlay instruction for inlaying a metallographic sample, loading the metallographic sample to a first target position of a sample bin in a first state, and outputting an inlay execution instruction; According to the inlay execution instruction, controlling the inlay component to cold-mount the metallographic sample in the sample bin in the second state to obtain a first process sample; The first process sample is transferred to a second target location, and the polishing assembly is controlled to polish the first process sample to obtain a target sample; The first state is a state in which the depth of the sample chamber cavity meets the requirements for loading and unloading metallographic samples, and the second state is a state in which the depth of the sample chamber cavity meets the requirements for cold mounting of metallographic samples.

13. The method for automatically loading and preparing metallographic samples for detection according to claim 12, characterized in that: Metallographic sample loading includes: In response to the inlay instruction, a preset metallographic sample loading scheme and a loading starting position are obtained; Starting to load samples from the loading starting position according to the loading scheme, and outputting a sample position correction instruction after the loading is completed; In response to the sample position correction instruction, the metallographic sample is adjusted to the first target position, and the inlay execution instruction is output.

14. The method for automatically loading and preparing metallographic samples for detection according to claim 12, characterized in that: Metallographic sample cold mounting includes: In response to the inlay execution instruction, obtaining second depth information of the inner cavity depth of the sample chamber corresponding to the second state; adjusting the sample chamber to a second state according to the second depth information, and outputting a mosaic target instruction; The embedding component is controlled according to the embedding target instruction to perform cold embedding on the metallographic sample to obtain the first process sample.

15. The method for automatically loading and preparing metallographic samples for detection according to claim 14, characterized in that: The target embedding instruction includes a first execution instruction and a second execution instruction, and the metallographic sample cold embedding includes: According to the first execution instruction, using the photocurable resin delivery component at the second coordinate position, injecting photocurable resin into the sample chamber at the first coordinate position to obtain a sample to be cured; According to the second execution instruction, using the light curing lamp in the light curing lamp assembly at the second coordinate position to penetrate into each of the sample chambers at the first coordinate position to perform light curing on the sample to be cured, so as to obtain the first process sample; The transmission component of the injection component moves the sample chamber to the first coordinate position, and the switching component of the inlay component moves the photocurable resin delivery component and the photocurable resin delivery component to the second coordinate position matching the first coordinate position.

16. The method for automatically loading and preparing metallographic samples for detection according to claim 12, characterized in that: The first process of polishing the sample includes: In response to the polishing instruction of the first process sample, obtaining first depth information of the inner cavity depth of the sample chamber corresponding to the first state; Adjust the sample chamber to a first state according to the first depth information, and output a marking instruction; According to the marking instruction, adding marking information to each of the first process samples at the second target position to obtain each of the second process samples; The grinding and polishing assembly is controlled to grind and polish the second process sample to obtain a target sample.

17. The method for automatically loading and preparing metallographic samples for detection according to claim 12, characterized in that: The first process of polishing the sample includes: Controlling the upper grinding head assembly of the grinding and polishing assembly to obtain each of the first process samples and output a grinding and polishing instruction; According to the polishing instruction, the upper grinding head assembly is controlled to move in a first rotation direction and the lower grinding head assembly of the inlay assembly is controlled to move in a second rotation direction to obtain the target sample; Wherein, the first rotation direction is opposite to the second rotation direction.

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