High-precision Hall sensor
By designing the mounting mechanism and chute sliding frame structure in the Hall sensor, it is easy to disassemble and replace the sealed cover and silicone drying board, and enhance moisture-proof performance; at the same time, the heat dissipation mechanism of the heat dissipation coil and the micro semiconductor refrigerator are used to improve the heat dissipation ability of the sensor, solving the problems of inconvenient disassembly, poor moisture-proof effect and insufficient heat dissipation ability during use, and achieving higher service life and measurement accuracy.
Patent Information
- Application Number
- CN202411826025.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-02-28
AI Technical Summary
During the use of existing Hall sensors, the internal sensor is not convenient for quick disassembly and installation and maintenance, and the drying plate cannot be replaced, resulting in the failure of moisture-proof effect. The cladding and sealing design leads to the inability to dissipate heat, which easily leads to temperature accumulation and affects the use of the sensor.
A high-precision Hall sensor is designed, adopting a mounting mechanism and a sliding frame structure to facilitate the disassembly and assembly and replacement of the sealed cover and silicone drying board, enhancing moisture-proof performance; at the same time, a heat dissipation mechanism of a heat dissipation coil and a micro semiconductor refrigerator are used to improve the heat dissipation ability of the sensor through the cooling liquid circulation and the cooling effect of the refrigerator.
It realizes convenient disassembly and assembly and replacement of Hall sensors, improves moisture resistance and heat dissipation capabilities, extends service life, and enhances measurement accuracy and reliability.
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Figure CN119534964A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of Hall sensors, in particular to a high-precision Hall sensor. Background Art
[0002] The Hall sensor is an important sensor based on the Hall effect. The Hall effect refers to the deflection of carriers when current passes through a semiconductor perpendicular to an external magnetic field, thereby generating an additional electric field perpendicular to the current and magnetic field, resulting in a potential difference between the two ends of the semiconductor. The Hall sensor has the characteristics of high precision, strong reliability, and rapid response. It is a non-contact measurement that will not cause wear or interference to the object being measured. It is small in size, light in weight, and low in power consumption. It works stably and is not easily affected by environmental factors. It can accurately measure changes in the magnetic field and respond quickly. In the automotive field, it can be used to measure vehicle speed, engine speed, and wheel speed. For example, in an electronic ignition system, it can accurately detect engine speed and phase to control the ignition timing; in industrial automation, it can perform motor speed measurement and position detection, etc. It is widely used in many fields and provides reliable solutions for various measurement and control tasks; the publication number is "CN The Chinese patent No. 212780963U discloses a moisture-proof Hall sensor, which includes a mounting plate, a protective shell is fixedly provided on the top of the mounting plate, a Hall sensor body is provided in the inner cavity of the protective shell, a pin is provided on the right side of the Hall sensor body, a sealing plate is provided on the right side of the inner cavity of the protective shell, a fixing plate is provided at the right end of the protective shell, a first through hole is provided on the sealing plate, and a second through hole is provided on each of the fixing plates, a sealing cover is provided on the left side of the protective shell, a clamping plate is connected to the right side of the sealing cover through an extrusion spring, the clamping plate is located at the left end of the protective shell, guide bars are symmetrically provided on the inner wall of the protective shell, guide grooves are provided on both sides of the Hall sensor body, and the guide grooves are slidably connected to the guide bars, which is convenient for the installation of the Hall sensor, so that the sealing cover connection is sealed at the pin threading position to prevent water vapor from entering the protective shell through the pin, thereby improving the moisture-proof ability of the Hall sensor body;
[0003] Although the above-mentioned device has a certain sealing performance during use, in its specific application process, the internal sensor is not convenient to be quickly disassembled and repaired, and the internal drying plate cannot be replaced. When the drying plate is saturated, it obviously cannot achieve the drying effect. In addition, its encapsulated sealed design obviously cannot dissipate the heat generated inside the sensor during operation. The temperature accumulation during use can easily cause the sensor temperature to be in a high state, which can easily affect the overall use of the sensor. It can be seen that the existing technical means have certain defects and shortcomings, and need to be improved. Summary of the invention
[0004] The object of the present invention is to provide a high-precision Hall sensor to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the present invention provides a high-precision Hall sensor, including a base, a protection box is fixedly installed in the middle of the top of the base, a moisture-proof mechanism is movably installed in the middle of the upper end of the protection box, a sealing cover is fixedly installed at the front end of the moisture-proof mechanism, a clamping mechanism is fixedly installed at the upper end of the front side of the sealing cover, the sealing cover is connected to the protection box through the clamping mechanism, a heat dissipation mechanism is fixedly installed on the top of the protection box, through holes are provided in the middle of the rear side of the protection box and in the middle of the sealing cover, a Hall sensor body is slidably connected to the inside of the protection box, a pin is fixedly installed at the rear end of the Hall sensor body through the through hole, a detection probe at the front end of the Hall sensor body passes through the through hole located in the middle of the sealing cover, the heat dissipation end of the heat dissipation mechanism is covered on the outer surface of the Hall sensor body, and sealing gaskets are provided at both ends of the Hall sensor body, and the outer side of the sealing gasket is fit-connected to the inner wall of the through hole.
[0006] Furthermore, the moisture-proof mechanism includes a slide groove, which is opened in the middle of the top of the protective box. The interior of the slide groove is slidably connected to a slide frame. The front end of the slide frame is fixedly connected to the upper end of the back side of the sealing cover. The interior of the slide frame is slidably connected to a silica gel drying plate.
[0007] Furthermore, mounting holes are provided at the four corners of the base, and the mounting holes are configured as countersunk holes.
[0008] Furthermore, the clamping mechanism includes a limiting hole and a front rail, the front rail is fixedly installed on the upper front end of the sealing cover, limiting components are fixedly installed at both ends of the front rail, the upper front end of the front rail is fixedly connected with a linkage component, the limiting holes are opened at the front ends of both sides of the protection box, and the outer end of the limiting component is inserted into the inner side of the clamping slot.
[0009] Furthermore, the limit assembly includes a limit spring, which is fixedly connected to the two ends of the front rail at equal intervals, the outer end of the limit spring is fixedly connected to the limit frame, the outer end of the limit frame is fixedly installed with a limit block, and the outer end of the limit block is inserted into the inner side of the limit hole.
[0010] Furthermore, the linkage assembly includes a top rail and a linkage plate, the top rail is fixedly installed in the middle of the top of the front rail, the linkage plate is fixedly installed at the inner end of the front face of the limit frame, the inner side of the top rail is slidably connected with a movable block, the side of the movable block away from the top rail is fixedly connected with a fixed plate, both ends of the fixed plate are rotatably connected with linkage rods, and the lower end of the linkage rod is hinged to the inner end of the linkage plate.
[0011] Furthermore, a driving shaft is fixedly installed on the top of the movable block, and a pressing plate is fixedly installed on the top of the driving shaft passing through the top rail.
[0012] Furthermore, the heat dissipation mechanism includes a heat dissipation coil and a cooling box, the interior of the cooling box is filled with coolant, the heat dissipation coil is fixedly installed on the inner wall of the protection box, the inner side of the heat dissipation coil and the outer surface of the Hall sensor body are fitted and connected, a micro pump is fixedly installed on one side of the cooling box, the input end of the micro pump is connected to the cooling box, the output end of the micro pump is connected to the heat dissipation coil, and the output end of the heat dissipation coil is connected to the cooling box.
[0013] Furthermore, a micro semiconductor refrigerator is fixedly installed on the top of the cooling box, and the cooling end of the micro semiconductor refrigerator is arranged on the inner side of the cooling box. The micro semiconductor refrigerator is specifically a micro semiconductor refrigerator of model TES1-068020.
[0014] Compared with the prior art, the present invention has the following beneficial effects:
[0015] First, in the present invention, the Hall sensor body is inserted into the protection box, the sealing cover is installed at the front end of the protection box through a clamping mechanism, both ends of the Hall sensor pass through through holes, the sealing gaskets in the through holes enhance the seal, the sliding frame in the slide groove is connected to the silica gel drying plate to absorb moisture and ensure moisture-proof sealing. When disassembling, the clamping mechanism is adjusted, the sliding frame and the silica gel drying plate are pulled out and replaced, thereby improving the convenience of use.
[0016] Secondly, in the present invention, through the clamping mechanism, the pressing plate is pressed to move the driving shaft downward, driving the movable block to slide, and the linkage rod and the linkage plate are rotated and linked to push the limit frame to move outward, so that the limit block is disengaged from the limit hole, and the sealing cover and the protection box are released from the limit, which is convenient for disassembly and maintenance of the sealing cover. During installation, a new silica gel drying plate is inserted into the sliding frame, the sliding frame is inserted into the sliding groove, and the limit spring causes the limit block to be inserted into the limit hole for limit, thereby improving ease of use.
[0017] Third, in the present invention, when the Hall sensor body is used, the micro pump and the micro semiconductor refrigerator are started, the micro pump pumps the coolant to circulate in the heat dissipation coil, the Hall sensor body is installed and fits with the heat dissipation coil, the heat is sent to the cooling box through the coolant, the micro semiconductor refrigerator cools the cooling box and dissipates heat, so that the inside of the protective box has good sealing and cooling performance, thereby improving the heat dissipation capacity and service life. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0019] Figure 2 It is a schematic diagram of the rear view structure of the present invention;
[0020] Figure 3 It is a schematic diagram of the top view structure of the present invention;
[0021] Figure 4This is a schematic diagram of the top view of the Hall sensor body in the disassembled state in the present invention;
[0022] Figure 5 This is a schematic diagram of the structure of the Hall sensor body in the disassembled state viewed from above in the present invention;
[0023] Figure 6 It is a front structural schematic diagram of the disassembled state of the clamping mechanism in the present invention;
[0024] Figure 7 It is a schematic diagram of the rear view structure of the clamping mechanism in the present invention in the disassembled state;
[0025] Figure 8 It is a schematic diagram of the structure of the protection box and the heat dissipation mechanism in the present invention.
[0026] In the figure: 1. base; 2. protection box; 3. moisture-proof mechanism; 31. slide groove; 32. slide frame; 33. silica gel drying plate; 4. sealing cover; 5. through hole; 6. heat dissipation mechanism; 61. heat dissipation coil; 62. cooling box; 63. micro semiconductor refrigerator; 64. micro pump; 7. clamping mechanism; 71. limit hole; 72. front rail; 73. limit assembly; 731. limit spring; 732. limit frame; 733. limit block; 74. linkage assembly; 741. top rail; 742. linkage plate; 743. movable block; 744. fixed plate; 745. linkage rod; 746. driving shaft; 747. pressing plate; 8. Hall sensor body; 9. pin; 10. sealing gasket; 11. mounting hole. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0028] See also Figure 1-Figure 7In an embodiment of the present invention, a high-precision Hall sensor includes a base 1, a protective box 2 is fixedly installed in the middle of the top of the base 1, a moisture-proof mechanism 3 is movably installed in the middle of the upper end of the protective box 2, a sealing cover 4 is fixedly installed at the front end of the moisture-proof mechanism 3, a clamping mechanism 7 is fixedly installed at the upper end of the front of the sealing cover 4, the sealing cover 4 is connected to the protective box 2 through the clamping mechanism 7, a heat dissipation mechanism 6 is fixedly installed on the top of the protective box 2, through holes 5 are provided in the middle of the rear side of the protective box 2 and in the middle of the sealing cover 4, a Hall sensor body 8 is slidably connected inside the protective box 2, a pin 9 is fixedly installed at the rear end of the Hall sensor body 8 through the through hole 5, a detection probe at the front end of the Hall sensor body 8 passes through the through hole 5 located in the middle of the sealing cover 4, a heat dissipation end of the heat dissipation mechanism 6 is covered on the outer surface of the Hall sensor body 8, sealing gaskets 10 are sleeved at both ends of the Hall sensor body 8, the outer side of the sealing gasket 10 is fitted and connected to the inner wall of the through hole 5, and the protective box 2 at the top of the base 1 provides a stable installation environment for the Hall sensor body 8. The internal moisture-proof mechanism 3 is conveniently connected through the sealing cover 4 and the clamping mechanism 7, and the sealing gasket 10 ensures good sealing at the through hole 5, thereby enhancing the overall moisture-proof performance. The heat dissipation end of the heat dissipation mechanism 6 covers the outer surface of the Hall sensor body 8, effectively improving the heat dissipation capacity and ensuring the long-term stable operation of the sensor. This design allows the Hall sensor body 8 to avoid external interference in the protective box 2 while maintaining a good working state, extending the service life, improving the measurement accuracy and reliability, and adapting to various complex working environments.
[0029] See also Figure 4-Figure 7 The moisture-proof mechanism 3 includes a slide groove 31, which is opened in the middle of the top of the protection box 2. A slide frame 32 is slidably connected inside the slide groove 31. The front end of the slide frame 32 is fixedly connected to the upper back end of the sealing cover 4. A silica gel drying plate 33 is slidably connected inside the slide frame 32. The slide groove 31 is slidably connected to the slide frame 32. The front end of the slide frame 32 is fixedly connected to the upper back end of the sealing cover 4. The slide frame 32 is also slidably connected to the slide frame 32. This design allows the silica gel drying plate 33 to be flexibly installed and replaced. By sliding the slide frame 32 in the slide groove 31, it is easy to operate the silica gel drying plate 33, thereby effectively absorbing the moisture inside the protection box 2 and enhancing the overall moisture-proof effect.
[0030] See also Figure 1-Figure 3 The four corners of the base 1 are provided with mounting holes 11, and the mounting holes 11 are set as countersunk holes. The design of the countersunk holes can make the heads of the mounting screws sink into the holes, making the surface after installation smoother and more beautiful, and can also reduce the interference and collision of the screw heads to the outside to a certain extent. This design facilitates the installation of the base 1 and helps to firmly fix the entire device at the desired position.
[0031] See also Figure 4-Figure 7 The clamping mechanism 7 includes a limiting hole 71 and a front rail 72. The front rail 72 is fixedly installed on the upper front end of the sealing cover 4. The limiting components 73 are fixedly installed at both ends of the front rail 72. The upper front end of the front rail 72 is fixedly connected with a linkage component 74. The limiting holes 71 are opened at the front ends of both sides of the protection box 2. The outer end of the limiting component 73 is inserted into the inner side of the card slot. The limiting component 73 includes a limiting spring 731. The limiting spring 731 is fixedly connected to the two ends of the front rail 72 at equal intervals. The outer end of the limiting spring 731 is fixedly connected to the limiting frame 732. The outer end of the limiting frame 732 is fixedly installed with a limiting block 733. The outer end of the limiting block 733 is inserted into On the inner side of the limiting hole 71, the front rail 72 is fixed to the upper end of the front face of the sealing cover 4, and the limiting components 73 at the inner two ends are connected to the limiting frame 732 through limiting springs 731 with equal spacing, and the limiting blocks 733 at the outer ends of the limiting frame 732 can be inserted into the limiting holes 71 at the front ends of both sides of the protection box 2. This design makes the connection between the sealing cover 4 and the protection box 2 stable and reliable, and the limiting spring 731 provides a certain elastic buffer, which enhances the adaptability and stability of the connection. At the same time, through the plug-in cooperation between the limiting block 733 and the limiting hole 71, the disassembly and assembly operation is simple, and the sealing cover 4 can be quickly installed and disassembled, which is convenient for maintenance and repair of internal components.
[0032] See also Figure 4-Figure 7 The linkage assembly 74 includes a top rail 741 and a linkage plate 742. The top rail 741 is fixedly installed in the middle of the top of the front rail 72. The linkage plate 742 is fixedly installed on the inner end of the front side of the limiting frame 732. A movable block 743 is slidably connected to the inner side of the top rail 741. A fixed plate 744 is fixedly connected to the side of the movable block 743 away from the top rail 741. Both ends of the fixed plate 744 are rotatably connected to a linkage rod 745. The lower end of the linkage rod 745 is hinged to the inner end of the linkage plate 742. A push shaft 746 is fixedly installed on the top of the movable block 743. The top of the push shaft 746 passes through the top rail 741 and is fixedly installed with a pressing plate 747. The top rail 741 is fixed in the middle of the top of the front rail 72 and is fixed on its inner side through the movable block 743. When the pressing plate 747 on the pushing shaft 746 which passes through the top rail 741 is pressed, the movable block 743 drives the linkage rod 745 to move, thereby pushing the linkage plate 742 to realize the control of the limit frame 732. This design has a compact structure and is simple and direct to operate. It can accurately and quickly realize the control of the limit frame 732, thereby efficiently completing the disassembly and assembly operation of the sealing cover 4, greatly improving the work efficiency, and also enhancing the stability and reliability of the entire clamping mechanism 7.
[0033] See also Figure 7The heat dissipation mechanism 6 includes a heat dissipation coil 61 and a cooling box 62. The interior of the cooling box 62 is filled with coolant. The heat dissipation coil 61 is fixedly installed on the inner wall of the protection box 2. The inner side of the heat dissipation coil 61 is fitted and connected to the outer surface of the Hall sensor body 8. A micro pump 64 is fixedly installed on one side of the cooling box 62. The input end of the micro pump 64 is connected to the cooling box 62. The output end of the micro pump 64 is connected to the heat dissipation coil 61. The output end of the heat dissipation coil 61 is connected to the cooling box 62. A micro semiconductor refrigerator 63 is fixedly installed on the top of the cooling box 62. The cooling end of the refrigerator 63 is arranged on the inner side of the cooling box 62. The micro semiconductor refrigerator 63 is specifically a micro semiconductor refrigerator 63 of model TES1-068020. The cooling box 62 is filled with coolant. The heat dissipation coil 61 is fixed on the inner wall of the protection box 2 and is in contact with the outer surface of the Hall sensor body 8. The micro pump 64 circulates the coolant between the cooling box 62 and the heat dissipation coil 61. The cooling end of the micro semiconductor refrigerator 63 is located in the cooling box 62 to cool the coolant. This heat dissipation design can effectively take away the heat generated by the Hall sensor and ensure its stable operation.
[0034] The working principle of the present invention is as follows: during use, the Hall sensor body 8 is inserted into the interior of the protection box 2, and the sealing cover 4 is installed on the front end of the protection box 2 with the assistance of the clamping mechanism 7. At this time, both ends of the Hall sensor pass through the through hole 5, and since a sealing gasket 10 is provided inside the through hole 5, the sealing gasket 10 is attached to the inner wall of the through hole 5, which can assist in sealing the through hole 5 of the protection box 2, so that the Hall sensor body 8 has a strong sealing performance as a whole after installation. During use, the sliding groove 31 is internally slidably connected to the sliding frame 32 The sliding frame 32 is internally movably connected to the silica gel drying plate 33. At this time, the silica gel drying plate 33 can assist in absorbing the moisture inside the protection box 2, so that the sensor as a whole can have a strong sealing and moisture-proof performance. If disassembly is required, it is only necessary to adjust the clamping mechanism 7 to remove the sealing cover 4 of the protection box 2. At this time, the sliding frame 32 can be pulled out from the inside of the slide groove 31, and then the silica gel drying plate 33 can be pulled out from the inside of the sliding frame 32 for replacement, so that the device as a whole can be quickly disassembled, assembled and replaced, which can improve the overall convenience of use of the device.
[0035] By setting the card installation mechanism 7, during the use of the device, if it is necessary to disassemble and repair the Hall sensor or disassemble and assemble the silica gel drying plate 33, the pressing plate 747 can be pressed to resist the push shaft 746 to move downward, and the push shaft 746 can be pushed downward to resist and drive the movable block 743 to slide on the inner side of the top rail 741, and the movable block 743 drives the linkage rod 745 and the linkage plate 742 to cooperate with the rotation linkage, which can assist in pushing the two limit frames 732 to move outward, and the outward movement of the limit frame 732 can cause the limit block 733 at the outer end of the limit frame 732 to disengage from the limit hole 71, and the limit hole 71 and the limit block 733 are separated from each other, at this time, the sealing cover 4 and the protective box 2 lose the gap. The limit makes it easy to quickly disassemble and assemble the sealing cover 4 of the sensor as a whole, and makes it easy to quickly inspect and maintain the sensor. In the process of use, if installation is required, it is only necessary to insert a new silica gel drying plate 33 into the sliding frame 32, and then insert the sliding frame 32 into the inner side of the sliding groove 31. When the limit block 733 contacts the limit hole 71, the limit spring 731 is reset to drive the limit block 733 to be inserted into the inner side of the limit hole 71. The limit block 733 and the limit hole 71 are mutually limited and clamped, which can promote the sealing cover 4 to be stably installed on the front end of the protective box 2, so that the device as a whole can quickly disassemble and inspect the Hall sensor body 8, which can improve the convenience of the overall use of the device.
[0036] During the use of the Hall sensor body 8, the micro pump 64 and the micro semiconductor refrigerator 63 can be started to operate. The micro pump 64 can be started to pump the coolant inside the cooling box 62 to circulate inside the heat dissipation coil 61. After the Hall sensor body 8 is installed inside the protection box 2, the heat dissipation coil 61 is attached to the outer surface of the Hall sensor body 8. The Hall sensor body 8 and the inner side of the heat dissipation coil 61 are attached. At this time, the heat dissipation coil 61 can assist in heat conduction and heat dissipation, and the heat of the Hall sensor body 8 can be sent to the interior of the cooling box 62 through the coolant in the heat dissipation coil 61. At this time, the interior of the cooling box 62 can be cooled and dissipated by running the micro semiconductor refrigerator 63, so that the interior of the sensor protection box 2 can have better sealing and cooling performance, which can improve the overall heat dissipation capacity of the Hall sensor and its overall service life.
Claims
1. A high-precision Hall sensor, characterized in that: The utility model comprises a base, wherein a protection box is fixedly installed in the middle of the top of the base, a moisture-proof mechanism is movably installed in the middle of the upper end of the protection box, a sealing cover is fixedly installed at the front end of the moisture-proof mechanism, a clamping mechanism is fixedly installed at the upper end of the front side of the sealing cover, the sealing cover is connected to the protection box through the clamping mechanism, a heat dissipation mechanism is fixedly installed on the top of the protection box, through holes are provided in the middle of the rear side of the protection box and in the middle of the sealing cover, a Hall sensor body is slidably connected inside the protection box, a pin is fixedly installed at the rear end of the Hall sensor body passing through the through hole, a detection probe at the front end of the Hall sensor body passes through the through hole located in the middle of the sealing cover, the heat dissipation end of the heat dissipation mechanism is covered on the outer surface of the Hall sensor body, and sealing gaskets are provided at both ends of the Hall sensor body, and the outer side of the sealing gasket is fitted and connected with the inner wall of the through hole.
2. A high-precision Hall sensor according to claim 1, characterized in that: The moisture-proof mechanism includes a slide groove, which is opened in the middle of the top of the protection box. A slide frame is slidably connected inside the slide groove. The front end of the slide frame is fixedly connected to the upper end of the back of the sealing cover. A silica gel drying plate is slidably connected inside the slide frame.
3. A high-precision Hall sensor according to claim 1, characterized in that: The four corners of the base are all provided with mounting holes, and the mounting holes are configured as countersunk holes.
4. A high-precision Hall sensor according to claim 1, characterized in that: The clamping mechanism includes a limiting hole and a front rail, the front rail is fixedly installed on the upper front end of the sealing cover, both ends of the front rail are fixedly installed with limiting components, the upper front end of the front rail is fixedly connected with a linkage component, the limiting holes are opened at the front ends of both sides of the protection box, and the outer ends of the limiting components are inserted into the inner side of the clamping slot.
5. A high-precision Hall sensor according to claim 4, characterized in that: The limit assembly includes a limit spring, which is fixedly connected to the two ends of the front rail at equal intervals, the outer end of the limit spring is fixedly connected to the limit frame, the outer end of the limit frame is fixedly installed with a limit block, and the outer end of the limit block is inserted into the inner side of the limit hole.
6. A high-precision Hall sensor according to claim 5, characterized in that: The linkage assembly includes a top rail and a linkage plate, the top rail is fixedly installed in the middle of the top of the front rail, the linkage plate is fixedly installed at the front inner end of the limiting frame, the inner side of the top rail is slidably connected with a movable block, the side of the movable block away from the top rail is fixedly connected with a fixed plate, both ends of the fixed plate are rotatably connected with linkage rods, and the lower end of the linkage rod is hinged to the inner end of the linkage plate.
7. A high-precision Hall sensor according to claim 6, characterized in that: A driving shaft is fixedly installed on the top of the movable block, and a pressing plate is fixedly installed on the top of the driving shaft passing through the top rail.
8. A high-precision Hall sensor according to claim 1, characterized in that: The heat dissipation mechanism includes a heat dissipation coil and a cooling box, the interior of the cooling box is filled with coolant, the heat dissipation coil is fixedly installed on the inner wall of the protection box, the inner side of the heat dissipation coil and the outer surface of the Hall sensor body are fitted and connected, a micro pump is fixedly installed on one side of the cooling box, the input end of the micro pump is connected to the cooling box, the output end of the micro pump is connected to the heat dissipation coil, and the output end of the heat dissipation coil is connected to the cooling box.
9. A high-precision Hall sensor according to claim 8, characterized in that: A micro semiconductor refrigerator is fixedly installed on the top of the cooling box, and a cooling end of the micro semiconductor refrigerator is arranged on the inner side of the cooling box.
Citation Information
Patent Citations
Moisture-proof Hall sensor
CN212780963U