Optical module

Abstract

The present disclosure provides an optical module, comprising: an upper housing comprising an upper cover plate; the chip generates heat, and the heat is transmitted to the upper cover plate; the heat dissipation part is arranged on the upper shell, is in contact connection with the upper cover plate and is used for diffusing heat on the upper shell; wherein the heat dissipation component comprises heat dissipation fins; a plurality of windward side surfaces are arranged on the heat dissipation fins, the windward side surfaces are used for making forward contact with air flows from multiple directions, and the size of the windward side surfaces is smaller than that of the leeward side surfaces of the heat dissipation fins; or, the heat dissipation fins are provided with arc-shaped windward side faces, and the arc-shaped windward side faces are used for making forward contact with air flow from multiple directions. According to the optical module provided by the invention, the heat generated by the chip in the optical module is quickly transmitted out through the heat dissipation component arranged on the upper shell, so that the optical module is ensured to have good heat dissipation efficiency.

Description

[0001] This application claims the priority of the Chinese patent application filed with the China Patent Office on August 31, 2023, with application number 202322360963.X and invention name “A Kind of Optical Module”, the entire contents of which are incorporated by reference in this application. Technical Field

[0002] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0003] Optical communication technology is used in new services and application modes such as cloud computing, mobile Internet, and video. In optical communication technology, optical modules are devices that realize photoelectric signal conversion and are one of the key components in optical communication equipment.

[0004] At present, as the transmission rate of optical modules continues to increase, the integration of optical modules is getting higher and higher, the power density of optical modules is also increasing, generating more heat. If the heat generated by the optical module cannot be dissipated in time, it is easy to cause local high temperature of the optical module, affecting the optoelectronic performance of the optical module. Summary of the invention

[0005] The present disclosure provides an optical module, which is convenient for ensuring the heat dissipation efficiency of the optical module.

[0006] In a first aspect, the present disclosure provides an optical module, comprising:

[0007] An upper shell, including an upper cover plate;

[0008] The chip generates heat, and the heat is transmitted to the upper cover plate;

[0009] A heat dissipation component, disposed on the upper housing, in contact with and connected to the upper cover plate, and used for dissipating heat on the upper housing;

[0010] Wherein, the heat dissipation component includes a heat dissipation fin; the heat dissipation fin is provided with a plurality of windward side surfaces, the windward side surfaces are used to positively contact air flows from multiple directions, and the size of the windward side surfaces is smaller than the size of the leeward side surfaces of the heat dissipation fins;

[0011] Alternatively, the heat dissipation fin is provided with an arc-shaped windward side surface, and the arc-shaped windward side surface is used for positively contacting air flows from multiple directions.

[0012] In a second aspect, the optical module provided by the present disclosure includes: an upper housing including an upper cover plate;

[0013] The chip generates heat, and the heat is transmitted to the upper cover plate;

[0014] A heat dissipation component is arranged at the left end of the upper housing close to the optical module, is in contact with and connected to the upper cover plate, and is used to dissipate the heat on the upper housing;

[0015] Wherein, the heat dissipation component comprises:

[0016] A fourth heat dissipation fin, the bottom of which contacts and is connected to the top surface of the upper cover plate; the side surface of the fourth heat dissipation fin includes an arc-shaped windward side surface, the arc-shaped windward side surface faces the left end direction of the optical module, and the arc-shaped windward side surface is used to positively contact air flows from multiple directions;

[0017] A fourth heat dissipation cover plate is formed on the fourth heat dissipation fins, and the fourth heat dissipation cover plate and the upper cover plate form a heat dissipation channel with openings at both ends.

[0018] In the optical module provided by the present disclosure, a heat dissipation component is arranged on the top of the upper cover plate of the upper shell, and the heat dissipation component includes a heat dissipation fin, and a plurality of windward side surfaces are arranged on the heat dissipation fin or a circular arc-shaped windward side surface is arranged on the heat dissipation fin. The heat dissipation fin of such a shape is convenient for reducing the flow resistance to the air flow, improving the comprehensive performance of the heat transfer enhancement of the heat dissipation fin, ensuring the heat dissipation efficiency of the heat dissipation fin, so that the heat generated by the chip in the optical module is quickly transferred out through the heat dissipation component arranged on the upper shell, and ensuring that the optical module has good heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0020] Figure 1 A partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0021] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0022] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0023] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0024] Figure 5A schematic diagram of the structure of a first upper housing is provided according to some embodiments of the present disclosure;

[0025] Figure 6 A schematic diagram of the structure of a second upper housing provided according to some embodiments of the present disclosure;

[0026] Figure 7 It is a schematic structural diagram of a third upper housing provided according to some embodiments of the present disclosure;

[0027] Figure 8 It is an exploded schematic diagram of a third upper housing provided according to some embodiments of the present disclosure;

[0028] Fig. 9 It is a schematic structural diagram of a fourth upper housing provided according to some embodiments of the present disclosure;

[0029] Fig.10 A partially exploded schematic diagram of a fourth upper housing provided according to some embodiments of the present disclosure;

[0030] Fig.11 It is a structural schematic diagram of another first heat dissipation cover plate provided according to some embodiments of the present disclosure;

[0031] Fig.12 is an exploded schematic diagram of a fifth upper housing provided according to some embodiments of the present disclosure;

[0032] Fig.13 It is a structural schematic diagram of a fifth upper housing provided according to some embodiments of the present disclosure;

[0033] Fig.14 A schematic diagram of a heat dissipation component according to some embodiments of the present disclosure Figure 1 ;

[0034] Fig.15 A schematic diagram of a heat dissipation component according to some embodiments of the present disclosure Figure 2 ;

[0035] Fig.16 It is a structural schematic diagram of a sixth upper housing provided according to some embodiments of the present disclosure;

[0036] Fig.17 A sixth exploded schematic diagram of an upper housing is provided according to some embodiments of the present disclosure;

[0037] Fig.18 A schematic diagram of the structure of a heat dissipation component provided according to some embodiments of the present disclosure;

[0038] Fig.19 is a schematic diagram of a cross-sectional structure of a third heat sink fin provided according to some embodiments of the present disclosure;

[0039] Fig. 20 It is a schematic diagram of the structure of another heat dissipation component provided according to some embodiments of the present disclosure;

[0040] Fig.21 A schematic diagram of a cross-sectional structure of another third heat sink fin provided according to some embodiments of the present disclosure;

[0041] Fig. 22 is an exploded schematic diagram of a seventh upper housing provided according to some embodiments of the present disclosure;

[0042] Fig.23 A schematic diagram of a partial structure of a seventh upper shell provided according to some embodiments of the present disclosure Figure 1 ;

[0043] Fig.24 A schematic diagram of a partial structure of a seventh upper shell provided according to some embodiments of the present disclosure Figure 2 ;

[0044] Fig.25 A schematic diagram of a partial structure of a seventh upper shell provided according to some embodiments of the present disclosure Figure 3 ;

[0045] Fig.26 A schematic diagram of a partial structure of a seventh upper shell provided according to some embodiments of the present disclosure Figure 4 . DETAILED DESCRIPTION

[0046] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0047] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0048] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0049] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0050] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0051] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0052] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0053] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0054] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0055] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0056] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0057] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0058] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component.

[0059] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0060] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with respect to the bottom plate 2021; the upper shell 201 includes an upper cover plate 2011, and the upper cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0061] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes an upper cover plate 2011 and two upper side plates located on both sides of the upper cover plate 2011 and vertically arranged with the upper cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0062] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component in the optical module 200.

[0063] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the light emitting component 400, the light receiving component, etc. into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above-mentioned components. In addition, when assembling the circuit board 300, the light emitting component 400, the light receiving component, etc., the above-mentioned upper shell 201 and the lower shell 202 are combined to facilitate the deployment of the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0064] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0065] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer 100, or to release the fixed connection between the optical module 200 and the host computer 100.

[0066] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0067] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting Amplifier, LIA), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, and digital signal processing (Digital Signal Processing, DSP) chips.

[0068] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0069] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0070] At least one of the light emitting component 400 or the light receiving component is located on a side of the circuit board 300 away from the gold finger 301 .

[0071] In some embodiments, the light emitting component 400 and the light receiving component are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0072] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0073] During the operation of the optical module, the DSP chip and other chips on the circuit board 300 are the main heat-generating components inside the optical module. The heat generated by the DSP chip and other chips is transmitted to the housing of the optical module, and the heat on the housing is dissipated by the heat dissipation system of the host computer. In order to facilitate efficient heat dissipation through the housing, a heat dissipation component is arranged on the housing, and the heat dissipation component includes heat dissipation fins; such as heat dissipation fins are arranged on the upper housing 201. The heat generated by the DSP chip and other chips in the housing is transmitted to the upper housing 201, and the heat is transmitted to the heat dissipation fins on the upper housing 201. The heat dissipation system of the host computer performs heat exchange with the heat dissipation fins to take away the heat. Of course, in the embodiment of the present disclosure, it is not limited to setting a heat dissipation component on the upper housing 201, and a heat dissipation component can also be set on the lower housing 202.

[0074] In some embodiments, the heat dissipation fins include long ribbed fins, non-long ribbed fins, etc.; the long ribbed fins are straight fins; the interfaces of the non-long ribbed fins include square, cross, cross, round, oval, teardrop, etc. The heat dissipation fins can be integrally formed with the upper housing 201, or they can be non-integrally formed with the upper housing 201. The heat dissipation fins are used to increase the heat dissipation area of ​​the upper housing 201 to ensure the heat dissipation efficiency of the optical module; or, by coordinating the shape and arrangement of the heat dissipation fins, the comprehensive heat transfer performance of the heat dissipation fins is improved to achieve the purpose of ensuring the heat dissipation efficiency of the optical module.

[0075] Figure 5 The first upper housing structure diagram is provided according to some embodiments of the present disclosure. Figure 5As shown, a heat dissipation component 500 is disposed on the top of the upper housing 201. The heat dissipation component 500 includes a first heat dissipation fin 510. The first heat dissipation fin 510 is disposed on the top of the upper housing 201. The first heat dissipation fin 510 is a long, ridge-shaped protrusion formed on the outer side wall of the top of the upper cover plate 2011. The first heat dissipation fin 510 is formed integrally with the upper housing 201. The first heat dissipation fin 510 is a fin formed by the protrusion of the top surface of the upper housing 201. The first heat dissipation fin 510 is a straight fin. The first heat dissipation fin 510 extends from one end of the upper housing 201 to the other end of the upper housing 201. The length of the first heat dissipation fin 510 is greater than half of the total length of the upper housing 201. Of course, in some embodiments, the first heat dissipation fin 510 can be disposed only at a position of the upper housing 201 close to the optical port. The length of the first heat dissipation fin 510 is less than half of the total length of the upper housing 201. A first heat dissipation fin 510 is disposed on the top of the upper housing 201 , which increases the heat dissipation area on the top of the upper housing 201 , improves the heat dissipation efficiency of the optical module, and effectively reduces local heat concentration of the optical module.

[0076] In some embodiments, the extension direction of the first heat dissipation fins 510 is parallel or approximately parallel to the length direction of the upper housing 201. Exemplarily, the heat dissipation component 500 includes a plurality of first heat dissipation fins 510, and the plurality of first heat dissipation fins 510 extend from one end of the upper housing 201 to the other end of the upper housing 201. The thickness of the first heat dissipation fins 510 is about 1 mm, and there is a gap between any two adjacent first heat dissipation fins 510, and the gap width is greater than or equal to 2 mm, such as the gap width is 2-3 mm; Exemplarily, the gap width is 2.9 mm, etc.

[0077] In some embodiments, the end of the first heat dissipation fin 510 close to the light port is tilted, so that the end of the first heat dissipation fin 510 has a drainage function, which facilitates the air flow to flow into the gap between the first heat dissipation fins 510. Exemplarily, both ends of the first heat dissipation fin 510 are tilted, which is convenient for air flow drainage and for processing and setting the first heat dissipation fin 510 on the upper housing 201.

[0078] Figure 6 FIG. 1 is a schematic diagram of the structure of a second upper housing provided according to some embodiments of the present disclosure. Figure 6 As shown, the first heat dissipation fin 510 includes a first heat dissipation fin body 511 and a bend 512 disposed on the first heat dissipation fin body 511, the bend 512 protrudes toward one side of the upper housing 201, and the bend 512 increases the total length of the first heat dissipation fin 510, thereby increasing the heat dissipation area of ​​the first heat dissipation fin 510 through the bend 512, so as to increase the heat dissipation efficiency of the heat dissipation component 500. In some embodiments, the bend 512 is formed by a heat dissipation groove disposed on the first heat dissipation fin body 511.

[0079] In some embodiments, the first heat sink fin body 511 extends from one end of the upper housing 201 to the other end of the upper housing 201, with a plurality of interruptions in the middle, and a bend 512 is provided at the interruption, and the length of the bend 512 is greater than the length of the corresponding interruption; a gap is formed between adjacent first heat sink fin bodies 511, and the bend 512 is located in the gap. Exemplarily, each first heat sink fin 510 at the top of the upper housing 201 includes a plurality of bends 512. Of course, in some embodiments, a portion of the first heat sink fins 510 may be provided with bends 512, and the bends 512 on the first heat sink fins 510 are not limited to a plurality.

[0080] In some embodiments, a groove is provided on the first heat dissipation fin 510 to form a bend 512. Exemplarily, the bend 512 is a flat-bottom bend, the bend 512 is located on one side of the first heat dissipation fin body 511 and in the interruption on the first heat dissipation fin body 511, and both ends of the bend 512 are connected to the first heat dissipation fin body 511. In the embodiments of the present disclosure, the bend 512 is not limited to a flat-bottom bend, and can also be an arc-shaped bend, etc.

[0081] In some embodiments, the vertical distance between the top of the bend 512 and the first heat sink fin body 511 is less than the width of the interval between two adjacent first heat sink fins 510. Exemplarily, the vertical distance between the top of the bend 512 and the first heat sink fin body 511 is greater than or equal to one-third of the width of the interval between two adjacent first heat sink fins 510 and less than or equal to two-thirds of the width of the interval between two adjacent first heat sink fins 510. Exemplarily, the vertical distance between the top of the bend 512 and the first heat sink fin body 511 is equal to one-half of the width of the interval between two adjacent first heat sink fins 510, which can effectively increase the heat dissipation area of ​​the first heat sink fins 510, and can also facilitate the circulation speed of the air flow driven by the upper computer heat dissipation system, so that the air flow can smoothly take away the heat from the first heat sink fins 510.

[0082] Figure 7 is a schematic structural diagram of a third upper housing provided according to some embodiments of the present disclosure, Figure 8 FIG. 1 is a schematic diagram of an exploded view of a third upper housing provided according to some embodiments of the present disclosure. Figure 7 and Figure 8As shown, the heat dissipation component 500 also includes a first heat dissipation cover plate 520, which is located on the top of the first heat dissipation fins 510, and the bottom surface of the first heat dissipation cover plate 520 covers and connects to the top of the first heat dissipation fins 510, so that the intervals between the first heat dissipation fins 510 and the upper shell 201 and the first heat dissipation cover plate 520 form a heat dissipation channel, and the openings at both ends of the heat dissipation channel are used for air inlet and outlet, so that the air flow driven by the upper computer heat dissipation system can flow along the heat dissipation channel; and the first heat dissipation cover plate 520 can further increase the heat dissipation area on the top of the upper shell 201, thereby improving the heat dissipation efficiency of the upper shell 201. A heat dissipation channel is formed by the first heat dissipation fins 510, the upper shell 201 and the first heat dissipation cover plate 520, which is used to limit the air flow driven by the upper computer heat dissipation system, reduce the air flow from diffusing outward from the first heat dissipation fins 510 when passing through the first heat dissipation fins 510, and make the air flow flow in the extension direction of the heat dissipation channel, so that the air flow can fully take away the heat on the heat dissipation surface of the first heat dissipation fins 510, ensure the heat exchange efficiency between the air flow and the first heat dissipation fins 510, and further ensure the heat dissipation efficiency of the first heat dissipation fins 510, that is, ensure the heat dissipation efficiency of the optical module.

[0083] In some embodiments, the first heat dissipation cover plate 520 is a sheet metal plate, but is not limited to a sheet metal plate, and may also be a die-cast plate; the first heat dissipation cover plate 520 is welded and connected to the first heat dissipation fins 510. In some embodiments of the present disclosure, the first heat dissipation fins 510 may also be provided with bends.

[0084] Fig. 9 is a schematic structural diagram of a fourth upper housing provided according to some embodiments of the present disclosure, Fig.10 is a partial exploded schematic diagram of a fourth upper housing provided according to some embodiments of the present disclosure, Fig.11 This is a schematic diagram of the structure of another first heat dissipation cover plate provided according to some embodiments of the present disclosure. A first heat dissipation fin 510 is provided at the upper portion of the upper housing 201 near the optical port end, and the length of the first heat dissipation fin 510 is less than one third of the total length of the upper housing 201; the first heat dissipation fin 510 is a ridge-shaped protrusion formed on the outer wall of the top of the upper housing 201 near the optical port end, and the first heat dissipation fin 510 is integrally formed with the upper housing 201.

[0085] In the embodiment of the present disclosure, the first heat dissipation cover plate 520 includes a heat dissipation cover plate body 521, a first connection portion 522 and a second connection portion 523. The first connection portion 522 is located on one side of the length direction of the heat dissipation cover plate body 521, and the second connection portion 523 is located on the other side of the length direction of the heat dissipation cover plate body 521; the heat dissipation cover plate body 521, the first connection portion 522 and the second connection portion 523 form a receiving cavity with two ends open. The first heat dissipation cover plate 520 covers the first heat dissipation fin 510, and the first connection portion 522 and the second connection portion 523 are respectively connected to the first heat dissipation fin 510, so that the top of the first heat dissipation fin 510 is located in the receiving cavity. In some embodiments, the first connection portion 522 and the second connection portion 523 are respectively welded to the side of the first heat dissipation fin 510.

[0086] In some embodiments, a plurality of first heat dissipation fins 510 are disposed on the top of the upper housing 201, and fixing protrusions 513 are disposed on the outer sides of the first heat dissipation fins 510 located at the top of the side of the upper housing 201, and fixing grooves 524 are disposed on the first connecting portion 522 and the second connecting portion 523. The fixing protrusions 513 and the fixing grooves 524 are assembled and connected to realize the clamping connection between the first heat dissipation fins 510 and the first heat dissipation cover plate 520, so as to facilitate the assembly and connection of the first heat dissipation cover plate 520. Of course, in some embodiments, fixing grooves are disposed on the outer sides of the first heat dissipation fins 510 located at the top of the side of the upper housing 201, and fixing protrusions or buckles protruding toward the inner side of the accommodating cavity are disposed on the first connecting portion 522 and the second connecting portion 523.

[0087] Exemplarily, first fixing protrusions 5131 and second fixing protrusions 5132 are respectively arranged on the outer sides of the first heat dissipation fins 510 located at the top edges of both sides of the upper shell 201, and first fixing grooves 5241 and second fixing grooves 5242 are respectively arranged on the first connecting portion 522 and the second connecting portion 523; the first connecting portion 522 is assembled and connected to the first fixing protrusions 5131 and second fixing protrusions 5132 on the first heat dissipation fins 510 located at the top edge of one side of the upper shell 201 through the first fixing grooves 5241 and second fixing grooves 5242 arranged thereon; the second connecting portion 523 is assembled and connected to the first fixing protrusions 5131 and second fixing protrusions 5132 on the first heat dissipation fins 510 located at the top edge of the other side of the upper shell 201 through the first fixing grooves 5241 and second fixing grooves 5242 arranged thereon.

[0088] In some embodiments, the edges of the first fixing protrusion 5131 and the second fixing protrusion 5132 are provided with a fitting groove, and the first fixing protrusion 5131 and the second fixing protrusion 5132 are located in the fitting groove, which is a depression formed on the side of the first heat sink fin 510. The fitting groove is used to fit and connect the first connecting portion 522 and the second connecting portion 523, and the bottom surface of the fitting groove cooperates with the inner side surface of the first connecting portion 522 and the second connecting portion 523 to make the outer side surface of the first connecting portion 522 and the second connecting portion 523 flush with the outer wall of the lower housing 202.

[0089] Fig.12 FIG. 1 is a schematic diagram of an exploded view of a fifth upper housing provided according to some embodiments of the present disclosure. Fig.12 As shown, the heat dissipation component 500 includes a second heat dissipation fin 530 and a second heat dissipation cover plate 540. The second heat dissipation fin 530 is arranged on the second heat dissipation cover plate 540, and the bottom of the second heat dissipation fin 530 is welded and connected to the top of the upper shell 201. The second heat dissipation fin 530 is a long strip, ridge-shaped protrusion formed on the bottom surface of the second heat dissipation cover plate 540. The second heat dissipation fin 530 and the second heat dissipation cover plate 540 are integrally formed, and the second heat dissipation fin 530 and the upper shell 201 are not integrally formed, so that the heat dissipation component 500 has a good effect of improving the heat dissipation effect of the upper shell 201, and can also facilitate the production of the heat dissipation component 500 and ensure that the top of the optical module is flat. The bottom of the second heat dissipation fin 530 is connected to the top of the upper shell 201, and the second heat dissipation cover plate 540 is arranged on the top of the second heat dissipation fin 530, so that the top of the upper shell 201 is provided with a heat dissipation fin, which can not only increase the heat dissipation area of ​​the top of the upper shell 201, but also form a heat dissipation channel with the function of limiting the flow direction of the air flow, so that the upper shell 201 has a higher heat dissipation efficiency.

[0090] In some embodiments, the second heat dissipation fins 530 are straight fins, and the second heat dissipation fins 530 extend from one end of the second heat dissipation cover plate 540 to the other end of the second heat dissipation cover plate 540. Exemplarily, the length of the second heat dissipation cover plate 540 is greater than half of the total length of the upper housing 201. Of course, in some embodiments of the present disclosure, the length of the second heat dissipation cover plate 540 is less than or equal to half of the total length of the upper housing 201.

[0091] In some embodiments, a first heat dissipation fin 510a and a first heat dissipation fin 510b are disposed on the top of the upper housing 201, the first heat dissipation fin 510a is located at the edge of one side of the top of the upper housing 201, the first heat dissipation fin 510b is located at the edge of the other side of the top of the upper housing 201, an assembly cavity 2012 is formed between the first heat dissipation fin 510a and the first heat dissipation fin 510b, and the heat dissipation component 500 is assembled and connected to the assembly cavity 2012. Exemplarily, the second heat dissipation fin 530 and the second heat dissipation cover plate 540 are located in the assembly cavity 2012, and the bottom of the second heat dissipation fin 530 contacts and connects the top surface of the upper cover plate 2011 in the assembly cavity 2012.

[0092] Fig.13 is a schematic structural diagram of a fifth upper housing provided according to some embodiments of the present disclosure, Fig.14 A schematic diagram of a heat dissipation component according to some embodiments of the present disclosure Figure 1 , Fig.15 A schematic diagram of a heat dissipation component according to some embodiments of the present disclosure Figure 2 .like Figure 13-Figure 15 As shown, a solder groove 2013 is provided on the top surface of the upper cover plate 2011, and the solder groove 2013 is used to weld and connect the bottom of the second heat sink fin 530. Exemplarily, the solder groove 2013 carries solder paste, so that the bottom of the second heat sink fin 530 and the solder groove 2013 are welded and connected by the solder paste, so that the bottom of the heat sink component 500 is welded and connected to the upper cover plate 2011 of the upper housing 201.

[0093] A plurality of second heat dissipation fins 530 are disposed on the second heat dissipation cover plate 540, and the extension direction of the second heat dissipation fins 530 is parallel or approximately parallel to the length direction of the second heat dissipation cover plate 540, and there is a gap between any two adjacent second heat dissipation fins 530. For example, the thickness of the second heat dissipation fins 530 is about 1 mm, and the gap between any two adjacent second heat dissipation fins 530 is greater than or equal to 2 mm, such as the width of the gap is 2-3 mm; for example, the width of the gap is 2.9 mm, etc.

[0094] In some embodiments, a first support platform 541 and a second support platform 542 are provided on the second heat dissipation cover plate 540. The first support platform 541 is provided at the edge of the bottom surface of one side of the second heat dissipation cover plate 540, and the second support platform 542 is provided at the edge of the bottom surface of the other side of the second heat dissipation cover plate 540. The first heat dissipation fin 510a is supported and connected to the first support platform 541, and the first heat dissipation fin 510b is supported and connected to the second support platform 542, so that the second heat dissipation cover plate 540 is connected to the upper housing 201 through the first support platform 541 and the second support platform 542. In some embodiments, the top surface of the second heat dissipation cover plate 540 is flush with the top surface of the first heat dissipation fin 510a and the top surface of the first heat dissipation fin 510b.

[0095] In some embodiments, a first support step surface 511a is provided on the side of the first heat dissipation fin 510a facing the first heat dissipation fin 510b, and a second support step surface 511b is provided on the side of the first heat dissipation fin 510b facing the first heat dissipation fin 510a; a first assembly surface 543 is provided on the first support platform 541, and a second assembly surface 544 is provided on the second support platform 542. The first assembly surface 543 is assembled and connected to the first support step surface 511a, and the second assembly surface 544 is assembled and connected to the second support step surface 511b, so as to facilitate the assembly and fixation of the second heat dissipation cover plate 540 with the first heat dissipation fin 510a and the first heat dissipation fin 510b.

[0096] In some embodiments, a first assembly groove 512a is provided on the first support step surface 511a, and a second assembly groove 512b is provided on the second support step surface 511b; a first assembly protrusion 545 is provided on the first support platform 541, and a second assembly protrusion 546 is provided on the second support platform 542. Exemplarily, a first assembly protrusion 545 is provided on the first assembly surface 543, and a second assembly protrusion 546 is provided on the second assembly surface 544. The first assembly groove 512a is assembled and connected with the first assembly protrusion 545, and the second assembly groove 512b is assembled and connected with the second assembly protrusion 546 to facilitate the assembly and positioning of the second heat dissipation cover plate 540 with the first heat dissipation fins 510a and the first heat dissipation fins 510b. Exemplarily, the first assembly groove 512a and the second assembly groove 512b are symmetrically arranged, but of course, the embodiments of the present disclosure are not limited thereto. In some embodiments, it is not limited to setting the assembly groove on the support step surface. Assembly protrusions can also be set on the first support step surface 511a and the second support step surface 511b, and assembly grooves can be set on the first assembly surface 543 and the second assembly surface 544.

[0097] In some embodiments, the bottom of one end of the second heat dissipation fin 530 exceeds the top of one end of the second heat dissipation fin 530, so that the end of the second heat dissipation fin 530 close to the optical port of the optical module is tilted, and then the end formed by the second heat dissipation fin 530, the second heat dissipation cover plate 540 and the upper shell 201 has an inclined heat dissipation channel. In some embodiments, the air flow driven by the upper computer heat dissipation system flows from the optical port end of the optical module to the electrical port end of the optical module, so the second heat dissipation fin 530 is tilted at one end, which can divert and guide the air flow into each heat dissipation channel, so as to fully ensure the heat dissipation efficiency of the second heat dissipation fin 530.

[0098] In some embodiments, the second heat dissipation fin 530 is also provided with a bend, and the bend on the second heat dissipation fin 530 can refer to the bend 512 provided on the first heat dissipation fin 510 in the above embodiment.

[0099] Fig.16 is a schematic structural diagram of a sixth upper housing provided according to some embodiments of the present disclosure, Fig.17A sixth exploded schematic diagram of an upper housing is provided according to some embodiments of the present disclosure. Fig.16 and 17 As shown, a heat dissipation component 500 is disposed on the top of the upper shell 201, and the heat dissipation component 500 includes a third heat dissipation cover plate 550, and a third heat dissipation fin 560 is disposed on the third heat dissipation cover plate 550, and the third heat dissipation fin 560 is a non-strip-shaped protrusion formed on the top surface of the third heat dissipation cover plate 550. Exemplarily, the cross section of the third heat dissipation fin 560 is a cross shape, which can be a centrally symmetrical cross shape or a non-centrally symmetrical cross shape. The bottom surface of the third heat dissipation cover plate 550 is connected to the top surface of the upper cover plate 2011; for example, the bottom surface of the third heat dissipation cover plate 550 is welded and connected to the top surface of the upper cover plate 2011. The third heat dissipation fins 560 are arranged in rows, and each row of third heat dissipation fins 560 includes a plurality of third heat dissipation fins 560, and there is a gap between adjacent third heat dissipation fins 560.

[0100] In some embodiments, a first heat dissipation fin 510c and a first heat dissipation fin 510d are disposed on the top of the upper housing 201, the first heat dissipation fin 510c is located at the edge of one side of the top of the upper housing 201, the first heat dissipation fin 510b is located at the edge of the other side of the top of the upper housing 201, an assembly cavity 2014 is formed between the first heat dissipation fin 510c and the first heat dissipation fin 510d, and the heat dissipation component 500 is assembled and connected to the assembly cavity 2014. Exemplarily, the first heat dissipation fin 510c and the first heat dissipation fin 510d are limitedly connected to the third heat dissipation cover plate 550, and the third heat dissipation cover plate 550 is welded and connected to the top surface of the upper cover plate 2011.

[0101] In some embodiments, a heat dissipation cover plate is further disposed on the top of the third heat dissipation fin 560 , and the heat dissipation cover plate and the third heat dissipation cover plate 550 form a heat dissipation channel that has the function of limiting the flow direction of the air flow, so that the upper housing 201 has a higher heat dissipation efficiency.

[0102] In some embodiments, the top of the third heat dissipation fin 560 is connected to the top surface of the upper cover plate 2011; for example, the top of the third heat dissipation fin 560 is welded to the top surface of the upper cover plate 2011. In this way, the third heat dissipation cover plate 550 is located above the top surface of the upper cover plate 2011, and the third heat dissipation cover plate 550 and the upper cover plate 2011 form a heat dissipation channel that has the function of limiting the flow direction of the air flow, so that the upper housing 201 has a higher heat dissipation efficiency. In some embodiments, the third heat dissipation fin 560 can be directly integrally formed on the top of the upper housing 201, and the third heat dissipation cover plate 550 is projected on the third heat dissipation fin 560.

[0103] In the disclosed embodiment, the third heat sink fin 560 includes a plurality of windward side surfaces, which can positively contact air flows from a plurality of directions, so that the third heat sink fin 560 can be fully in contact with the air flow, thereby facilitating the air flow to efficiently carry away the heat conducted on the third heat sink fin 560, thereby ensuring the heat dissipation efficiency of the optical module. Exemplarily, the third heat sink fin 560 includes 2, 3, etc. windward side surfaces.

[0104] In some embodiments, the heat dissipation component 500 includes a plurality of rows of third heat dissipation fins 560 . The plurality of rows of third heat dissipation fins 560 may be arranged opposite to each other in rows, or may be arranged in adjacent rows in a staggered manner. Fig.18 FIG. 1 is a schematic diagram of a heat dissipation component provided according to some embodiments of the present disclosure. Fig.18 As shown, the heat dissipation component 500 includes 4 rows of third heat dissipation fins 560, each row of third heat dissipation fins 560 includes multiple third heat dissipation fins 560, and there are gaps between adjacent third heat dissipation fins 560 in each row; the third heat dissipation fins 560 in adjacent rows are staggered; for example, the third heat dissipation fins 560 in a row of third heat dissipation fins 560 are directly opposite to the gaps between the third heat dissipation fins 560 in an adjacent row.

[0105] In some embodiments, the third heat sink fin 560 includes four windward sides, which can be in direct contact with air flows from four directions, so that the third heat sink fin 560 can be fully in contact with the air flow, so that the air flow can efficiently take away the heat conducted on the third heat sink fin 560, thereby ensuring the heat dissipation efficiency of the optical module. In some embodiments, the third heat sink fin 560 also includes a leeward side, the windward side of the third heat sink fin 560 is a narrow side, and the leeward side of the third heat sink fin 560 is a wide side, so that the shape of the third heat sink fin 560 tends to be streamlined, which is convenient for reducing pressure difference resistance and reducing flow resistance, thereby increasing the flow speed of the air flow and improving the heat dissipation efficiency of the optical module. Among them, the windward side is the side of the third heat sink fin 560 that faces the wind first, and the leeward side is the side of the third heat sink fin 560 that is sheltered from the wind.

[0106] In some embodiments, a connecting surface is provided between adjacent windward side surfaces to increase the heat dissipation area of ​​the third heat dissipation fin 560 through the connecting surface. Exemplarily, there are two connecting surfaces between adjacent windward side surfaces on the third heat dissipation fin 560, and the two connecting surfaces are connected and the angle between the two connecting surfaces is a right angle or an acute angle, so as to further increase the heat dissipation area of ​​the third heat dissipation fin 560 through the two connecting surfaces.

[0107] Fig.19 FIG. 1 is a schematic diagram of a cross-sectional structure of a third heat sink fin provided according to some embodiments of the present disclosure. Fig.19As shown, the a surface, b surface, c surface and d surface of the third heat dissipation fin 560 can all be used as the windward side surface, and the connection area between the a surface and the b surface includes the connection surface a1 and the connection surface a2, and the connection surface a1 and the connection surface a2 are perpendicular to each other. The windward side surface of the third heat dissipation fin 560 is the a surface, and b1, b2, c, c1 and c2 constitute the leeward side surface arranged corresponding to the windward side surface a surface.

[0108] Fig. 20 FIG. 1 is a schematic diagram of the structure of another heat dissipation component provided according to some embodiments of the present disclosure. Fig. 20 As shown, the third heat sink fin 560 is a cubic structure with a square cross section. Fig.19 Compared with the third heat sink fin 560 of the structural shape shown in FIG. 1 , when both have the same heat dissipation area, Fig.19 The third heat dissipation fin 560 of the structural shape shown in the figure can positively contact the air flow from four directions, and the contact with the air flow is more sufficient. The heat on the third heat dissipation fin 560 is more easily taken away by the air flow, and the heat dissipation efficiency is higher. Fig.19 The third heat dissipation fin 560 of the structural shape shown in the figure has a narrow windward side and a wide leeward side, which is convenient for reducing the flow resistance to the air flow. The air flow has a relatively large flow rate, which makes the heat dissipation efficiency higher.

[0109] Fig.21 FIG. 1 is a schematic diagram of a cross-sectional structure of another third heat sink fin provided according to some embodiments of the present disclosure. Fig.21 As shown, the third heat dissipation fin 560 is in a cross-shaped shape, and the a surface, b surface, c surface, d surface, e surface, f surface, g surface and h surface of the third heat dissipation fin 560 can all be used as the windward side surface. Fig. 20 Compared with the third heat sink fin 560 of the structure shape shown in FIG. Fig.21 Compared with the third heat sink fin 560 of the shape shown in FIG. , when the length, width and height of the two are the same, Fig.21 The third heat sink fin 560 of the structure shown in FIG. has a larger heat dissipation area and can also positively contact air flows from more directions, so that the contact with the air flow is more sufficient and the heat dissipation efficiency is higher. Fig.21 The third heat dissipation fin 560 of the structural shape shown is more streamlined, which further reduces the flow resistance to the air, and the air flow has a relatively large flow rate, so that the heat dissipation efficiency is higher.

[0110] Fig. 22 FIG. 1 is a schematic diagram of an exploded view of a seventh upper housing provided according to some embodiments of the present disclosure. Fig. 22As shown, the heat dissipation component 500 includes a fourth heat dissipation fin 570, which is disposed on the upper housing 201. The side surface of the fourth heat dissipation fin 570 includes an arc surface, which is used as the windward side surface of the fourth heat dissipation fin 570, that is, the fourth heat dissipation fin 570 is provided with an arc-shaped windward side surface. The fourth heat dissipation fin 570 has an arc-shaped windward side surface, which reduces the flow resistance of the fourth heat dissipation fin 570 to the air flow, and increases the area of ​​the fourth heat dissipation fin 570 that is in positive contact with the air flow, so that the fourth heat dissipation fin 570 has a good comprehensive performance of enhanced heat transfer, thereby improving the heat dissipation efficiency of the optical module.

[0111] In some embodiments, a small area on the top of the upper housing 201 is provided with a fourth heat dissipation fin 570. Exemplarily, the fourth heat dissipation fin 570 is provided at one end of the top of the upper housing 201 close to the light port, and the fourth heat dissipation fin 570 is integrally formed with the upper housing 201. Of course, the embodiments of the present disclosure are not limited to providing the fourth heat dissipation fin 570 at a small area on the top of the upper housing 201, and the fourth heat dissipation fin 570 may also be provided at most areas on the top of the upper housing 201, such as the distribution area of ​​the fourth heat dissipation fin 570 extends from one end of the top of the upper housing 201 to the other end of the top of the upper housing 201.

[0112] In some embodiments, a first heat dissipation fin 510e and a first heat dissipation fin 510f are also provided on the top of the upper shell 201, the first heat dissipation fin 510e is located at the edge of one side of the top of the upper shell 201, the first heat dissipation fin 510f is located at the edge of the other side of the top of the upper shell 201, and the fourth heat dissipation fin 570 is located between the first heat dissipation fin 510e and the first heat dissipation fin 510f.

[0113] In some embodiments, the heat dissipation component 500 further includes a fourth heat dissipation cover plate 580, which covers the top of the fourth heat dissipation fin 570. The fourth heat dissipation cover plate 580, the upper housing 201 and the fourth heat dissipation fin 570 form a heat dissipation channel with openings at both ends. The heat dissipation channel is used to limit the air flow, so that the air flow flows along the heat dissipation channel, and the air flow is reduced from diffusing outward from the fourth heat dissipation fin 570 during the circulation process, so that the air flow fully contacts the heat dissipation surface of the fourth heat dissipation fin 570, so as to fully take away the heat on the heat dissipation surface of the fourth heat dissipation fin 570, ensure the heat exchange efficiency between the air flow and the fourth heat dissipation fin 570, and further ensure the heat dissipation efficiency of the optical module.

[0114] In some embodiments, the fourth heat dissipation cover plate 580 includes a cover plate body and connection parts located on both sides of the cover plate body; the cover plate body is located on the top of the fourth heat dissipation fin 570; the connection part is connected to the side of the upper shell 201, or the connection part is connected to the first heat dissipation fin 510e and the first heat dissipation fin 510f. The specific structure and implementation method of the fourth heat dissipation cover plate 580 connected to the upper shell through the connection part can refer to the structure and fixing implementation method of the first heat dissipation cover plate 520 in the above embodiment.

[0115] Fig.23 A schematic diagram of a partial structure of a seventh upper shell provided according to some embodiments of the present disclosure Figure 1 , Fig.24 A schematic diagram of a partial structure of a seventh upper shell provided according to some embodiments of the present disclosure Figure 2 , Fig.25 A schematic diagram of a partial structure of a seventh upper shell provided according to some embodiments of the present disclosure Figure 3 . Fig.23 A fourth heat sink fin 570 having a circular cross section is shown. Fig.24 A fourth heat sink fin 570 having an elliptical cross section is shown. Fig.25 A fourth heat dissipation fin 570 with a teardrop-shaped cross section is exhibited, wherein the arrow in the figure indicates the main transmission direction of the air flow. Figure 23-Figure 25 The fourth heat sink fin 570 with the structural shape shown in the figure reduces the flow resistance to the air flow and ensures that the fourth heat sink fin 570 is fully in contact with the air flow, so that the air flow and the fourth heat sink fin 570 can perform sufficient heat exchange to take away the heat on the fourth heat sink fin 570, so that the fourth heat sink fin 570 has good comprehensive performance of enhanced heat transfer, thereby improving the heat dissipation efficiency of the optical module.

[0116] In some embodiments, Figure 23-Figure 25 As shown, the fourth heat dissipation fins 570 are arranged in rows, each row of the fourth heat dissipation fins 570 includes a plurality of fourth heat dissipation fins 570, and there is a gap between adjacent fourth heat dissipation fins 570; the fourth heat dissipation fins 570 in adjacent rows are symmetrically arranged along the length direction of the upper housing 201. Of course, in the embodiment of the present disclosure, the fourth heat dissipation fins 570 in adjacent rows may not be symmetrically arranged along the length direction of the upper housing 201, such as the fourth heat dissipation fins 570 in adjacent rows are staggered.

[0117] Fig.26 A schematic diagram of a partial structure of a seventh upper shell provided according to some embodiments of the present disclosure Figure 4 , which shows a staggered arrangement of adjacent rows of fourth heat dissipation fins 570. Of course, the arrangement of the fourth heat dissipation fins 570 in the embodiment of the present disclosure is not limited to this.

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: An upper shell, including an upper cover plate; The chip generates heat, and the heat is transmitted to the upper cover plate; A heat dissipation component, disposed on the upper housing, in contact with and connected to the upper cover plate, and used for dissipating heat on the upper housing; Wherein, the heat dissipation component includes a heat dissipation fin; the heat dissipation fin is provided with a plurality of windward side surfaces, the windward side surfaces are used to positively contact air flows from multiple directions, and the size of the windward side surfaces is smaller than the size of the leeward side surfaces of the heat dissipation fins; Alternatively, the heat dissipation fin is provided with an arc-shaped windward side surface, and the arc-shaped windward side surface is used for positively contacting air flows from multiple directions.

2. The optical module according to claim 1, characterized in that: The cross section of the heat dissipation fins provided with the arc-shaped windward side is circular, cylindrical or teardrop-shaped; the heat dissipation fins are arranged in rows on the upper cover plate, each row of heat dissipation fins includes a plurality of heat dissipation fins, and there is a gap between adjacent heat dissipation fins; The heat dissipation component further comprises a heat dissipation cover plate, which is covered above the upper cover plate, and the bottom surface of the upper cover plate is in contact with and connected to the top of the heat dissipation fins.

3. The optical module according to claim 2, characterized in that: The heat dissipation fins further include first heat dissipation fins, one of the first heat dissipation fins is arranged on an edge of one side of the top of the upper shell, and one of the first heat dissipation fins is arranged on an edge of the other side of the top of the upper shell; The heat dissipation cover plate comprises a cover plate body, a first connection portion and a second connection portion, wherein the first connection portion is located at one side of the heat dissipation cover plate body in the length direction, and the second connection portion is arranged at the other side of the heat dissipation cover plate body in the length direction; The first connection portion and the second connection portion are respectively connected to two of the first heat dissipation fins.

4. The optical module according to claim 3, characterized in that: A first fixing protrusion and a second fixing protrusion are arranged on the outer side of the first heat dissipation fin; a first fixing groove and a second fixing groove are arranged on the first connecting portion; the first fixing protrusion is assembled and connected to the first fixing groove, and the second fixing protrusion is assembled and connected to the second fixing groove; The edges of the first fixing groove and the second fixing groove are provided with assembly grooves, and the first fixing groove and the second fixing groove are located in the assembly grooves; the bottom surface of the assembly groove is assembled and connected to the inner side surfaces of the first connecting part and the second connecting part.

5. The optical module according to claim 1, characterized in that: The heat dissipation fins having a plurality of windward side surfaces are provided with a plurality of connection surfaces between adjacent windward side surfaces, and the plurality of connection surfaces increase the heat dissipation area of ​​the heat dissipation fins.

6. The optical module according to claim 5, characterized in that: The heat dissipation component further includes a third heat dissipation cover plate, the bottom of the heat dissipation fins is connected to the third heat dissipation cover plate; the bottom surface of the third heat dissipation cover plate is in contact with and connected to the top surface of the upper cover plate.

7. The optical module according to claim 6, characterized in that: The heat dissipation fins also include first heat dissipation fins, one of the first heat dissipation fins is arranged on the edge of one side of the top of the upper shell, and one of the first heat dissipation fins is arranged on the edge of the other side of the top of the upper shell, and an assembly cavity is formed between the two first heat dissipation fins; the third heat dissipation cover plate is assembled into the assembly cavity.

8. The optical module according to claim 5, characterized in that: The heat dissipation fins further include first heat dissipation fins, one of the first heat dissipation fins is arranged on an edge of one side of the top of the upper shell, and one of the first heat dissipation fins is arranged on an edge of the other side of the top of the upper shell; A heat dissipation cover plate is arranged on the top of the heat dissipation fins, and the heat dissipation cover plate is supported and connected to the upper cover plate and the two first heat dissipation fins.

9. An optical module, characterized in that: include: An upper shell, including an upper cover plate; The chip generates heat, and the heat is transmitted to the upper cover plate; A heat dissipation component is arranged at the left end of the upper housing close to the optical module, is in contact with and connected to the upper cover plate, and is used to dissipate the heat on the upper housing; Wherein, the heat dissipation component comprises: A fourth heat dissipation fin, the bottom of which contacts and is connected to the top surface of the upper cover plate; the side surface of the fourth heat dissipation fin includes an arc-shaped windward side surface, the arc-shaped windward side surface faces the left end direction of the optical module, and the arc-shaped windward side surface is used to positively contact air flows from multiple directions; A fourth heat dissipation cover plate is formed on the fourth heat dissipation fins, and the fourth heat dissipation cover plate and the upper cover plate form a heat dissipation channel with openings at both ends.

10. The optical module according to claim 9, characterized in that: The heat dissipation component further includes first heat dissipation fins, one of the first heat dissipation fins is arranged on an edge of one side of the top of the upper shell, and one of the first heat dissipation fins is arranged on an edge of the other side of the top of the upper shell; The fourth heat dissipation fins are arranged in rows, each row of the fourth heat dissipation fins includes a plurality of fourth heat dissipation fins, and there are intervals between adjacent fourth heat dissipation fins; The fourth heat dissipation cover plate includes a cover plate body and connection parts arranged on both sides of the cover plate body, the cover plate body is located on the top of the fourth heat dissipation fins, and the connection parts are connected to the first heat dissipation fins.

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