Heat conduction structure and photoelectric conversion module

Abstract

The invention provides a heat conduction structure which comprises a heat absorption wall, a heat conduction wall and two side walls, the heat absorption wall, the heat conduction wall and the two side walls form a containing space in a surrounding mode, the heat absorption wall, the heat conduction wall and the two side walls are formed by bending a single-piece material, the heat absorption walls are formed at the two ends of the single-piece material, and the heat conduction wall is formed at the two ends of the single-piece material. And a gap exists between two ends of the single-sheet material on the plane where the heat absorption wall is located. The invention further provides a photoelectric conversion module which comprises a photoelectric conversion circuit board and the heat conduction structure, the photoelectric conversion circuit board is arranged in the containing space, and at least two heating elements in the multiple heating elements of the photoelectric conversion circuit board are located on the two sides of the gap respectively. The heat conduction structure and the photoelectric conversion module solve the problem that an existing electronic element is poor in heat conduction efficiency, and the heat interference effect of a plurality of heat sources can be reduced to the maximum extent.

Description

Technical Field

[0001] The invention relates to a heat-conducting structure and a photoelectric conversion module, and in particular to a heat-conducting structure and a photoelectric conversion module with high-efficiency heat dissipation. Background Art

[0002] Optical transmission components such as optical fibers or planar optical waveguides have a lower energy loss rate than transmitting electrical signals through cables. Therefore, when transmitting signals, a laser emitting component is usually used to convert electrical signals into optical signals, and the optical signals are sent toward the transmitting end of the optical transmission component; the optical signals are transmitted to the output end via the optical transmission component, and the optical signals are emitted from the optical transmission component toward the optical signal receiving component, and the optical signal receiving component converts the optical signals into electrical signals. The module that provides mutual conversion between optical signals and electrical signals is called a photoelectric conversion module. The photoelectric conversion module usually includes electronic components such as circuit boards, photodiodes, and lasers.

[0003] During the conversion process, the operating temperature of heating elements such as photodiodes and lasers is quite high, and the heat energy must be removed quickly in order to perform work stably. The common practice is to add thermal bumps, thermal conductive plates and other components layer by layer on the heating elements, and fill the gaps with thermal conductive glue to conduct the heat energy of the heating elements on the circuit board to the fins on the surface of the photoelectric conversion module. In other words, the conduction path of heat energy must first pass through multiple different thermal conductive elements, so the thermal conductivity is not good; the thermal conductivity of thermal conductive glue is even lower than that of ordinary metals. When multiple heating elements heat up at the same time in a similar area, the traditional heat dissipation structure has no way to quickly and effectively remove the heat energy, causing the heat energy to accumulate in the module. Summary of the invention

[0004] The purpose of the present invention is to solve various problems of existing heat-conducting structures and photoelectric conversion modules, and to provide a heat-conducting structure and photoelectric conversion module with high heat dissipation efficiency.

[0005] To achieve the above-mentioned and other purposes, the present invention provides a heat-conducting structure, which includes: a heat-absorbing wall; a heat-conducting wall; and two side walls, wherein the two side walls connect the heat-absorbing wall and the heat-conducting wall, and the heat-absorbing wall, the heat-conducting wall and the two side walls surround to form an accommodating space, wherein the heat-absorbing wall, the heat-conducting wall and the two side walls are formed by bending a single sheet of material, and the two ends of the single sheet of material form the heat-absorbing wall, and there is a gap between the two ends of the single sheet of material on the plane where the heat-absorbing wall is located.

[0006] Optionally, the heat absorbing wall has a contact protrusion facing the accommodating space, and the contact protrusion is formed by stamping the single sheet of material.

[0007] Optionally, it further includes an extension portion parallel to the heat-conducting wall, and the extension portion is formed by bending the single sheet of material.

[0008] The present invention further proposes a photoelectric conversion module, which includes: a heat-conducting structure, having a heat-absorbing wall, a heat-conducting wall and two side walls, the two side walls connecting the heat-absorbing wall and the heat-conducting wall, the heat-absorbing wall, the heat-conducting wall and the two side walls surrounding to form an accommodating space; and a photoelectric conversion circuit board, arranged in the accommodating space, the photoelectric conversion circuit board is provided with a plurality of heating elements, wherein the heat-absorbing wall, the heat-conducting wall and the two side walls are formed by bending a single sheet of material, the two ends of the single sheet of material form the heat-absorbing wall, and there is a gap between the two ends of the single sheet of material on the plane where the heat-absorbing wall is located, and at least two of the plurality of heating elements are respectively located on both sides of the gap.

[0009] Optionally, a first limiting feature is provided at a first end of the heat-conducting structure along the assembly direction, and the first limiting feature is a groove parallel to the assembly direction.

[0010] Optionally, the heat conductive structure is provided with a second limiting feature at the second end along the assembly direction, the second limiting feature protrudes from the side wall toward the accommodating space, the second limiting feature has a snap-fitting recessed hole, and the photoelectric conversion circuit board has a snap-fitting protrusion at a position corresponding to the snap-fitting recessed hole.

[0011] Optionally, the second limiting feature has a guiding slope in the assembly direction, and the guiding slope is inclined relative to the assembly direction.

[0012] Optionally, a shell is further included, and the heat-conducting structure is arranged in the shell along the assembly direction.

[0013] Optionally, the shell has a third limiting feature, which protrudes toward the heat-conducting structure in two directions perpendicular to the assembly direction to limit the movement of the heat-conducting structure outside the assembly direction.

[0014] Optionally, the heat-conducting structure further comprises at least one spring sheet disposed on the heat-absorbing wall, the spring sheet being provided with a positioning protrusion facing the shell, the bottom surface of the shell having at least one positioning recess, the position of the positioning recess corresponding to the positioning protrusion.

[0015] Thus, the photoelectric conversion module of the present invention utilizes the heat-conducting structure formed by the monolithic material to directly conduct heat energy from the bottom and the side to the top of the photoelectric conversion circuit board with a single structure that is not connected to other heterogeneous materials, without the need to conduct heat through a number of stacked and complicated different heat-conducting elements. In addition, when multiple heating elements generate heat simultaneously in a nearby area, the heat-conducting structure of the present invention uses the two ends of the monolithic material that are far apart to thermally contact the heating elements respectively, so that the heat source will not accumulate in a specific area of ​​the monolithic material, but can be quickly conducted out on both sides, thereby avoiding overheating of the photoelectric conversion circuit board and maintaining good operation.

[0016] In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the invention. However, this description and drawings are only used to illustrate the present invention and do not limit the scope of rights of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A is a three-dimensional schematic diagram of a heat-conducting structure according to an embodiment of the present invention;

[0018] Figure 1B It is a front view of the heat conducting structure of an embodiment of the present invention;

[0019] Figure 2A is a three-dimensional cross-sectional schematic diagram of a photoelectric conversion module according to an embodiment of the present invention;

[0020] Figure 2B A cross-sectional front view of a photoelectric conversion module according to an embodiment of the present invention;

[0021] Figure 3A A bottom view of a heat-conducting structure according to an embodiment of the present invention;

[0022] Figure 3B A bottom view of another type of heat-conducting structure according to an embodiment of the present invention;

[0023] Figure 4A Schematic diagram 1 of the assembly of the photoelectric conversion module according to an embodiment of the present invention;

[0024] Figure 4B is a schematic diagram of assembling a second limiting feature according to an embodiment of the present invention;

[0025] Figure 5A FIG2 is a second assembly diagram of a photoelectric conversion module according to an embodiment of the present invention;

[0026] Figure 5B It is a stereoscopic diagram from another perspective of the photoelectric conversion module according to an embodiment of the present invention.

[0027] Reference numerals

[0028] 100 Photoelectric conversion module

[0029] 1 Housing

[0030] 11 Bottom

[0031] 12 Positioning recess

[0032] 13 The third limiting feature

[0033] 2 Thermal Conductive Structure

[0034] 21 Heat absorbing wall

[0035] 211 Both ends of a single piece of material

[0036] 211a Contact convex part

[0037] 212 Both ends of a single piece of material

[0038] 212a Contact convex part

[0039] 22 Heat conduction wall

[0040] 23 Sidewall

[0041] 24 Extension

[0042] 25 First limit feature

[0043] 26 Second limit feature

[0044] 261 snap-fitting recess

[0045] 262 Guide slope

[0046] 27 Slide rail

[0047] 28 Shrapnel

[0048] 281 Positioning convex part

[0049] 3 Photoelectric conversion circuit board

[0050] 31 Heating element

[0051] 32 Flange

[0052] 33 snap-fit ​​tab

[0053] d Assembly direction

[0054] g Clearance

[0055] S Accommodation Space DETAILED DESCRIPTION

[0056] In order to fully understand the present invention, the present invention is described in detail through the following specific embodiments and in conjunction with the accompanying drawings. Those skilled in the art can understand the purpose, characteristics and effects of the present invention from the contents disclosed in this specification. It should be noted that the present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the inventive point of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the claims of the present invention. The description is as follows:

[0057] like Figure 2A , Figure 2B and Figure 5AAs shown, the photoelectric conversion module 100 according to the embodiment of the present invention at least comprises: a heat conducting structure 2 and a photoelectric conversion circuit board 3 .

[0058] like Figure 1A and Figure 1B As shown, the heat conducting structure 2 comprises: a heat absorbing wall 21, a heat conducting wall 22 and two side walls 23. The two side walls 23 connect the heat absorbing wall 21 and the heat conducting wall 22, and the heat absorbing wall 21, the heat conducting wall 22 and the two side walls 23 surround to form an accommodation space S, and the accommodation space S is used to accommodate the photoelectric conversion circuit board 3.

[0059] The heat absorbing wall 21 , the heat conducting wall 22 and the two side walls 23 are formed by bending a single sheet of material. The two ends 211 , 212 of the single sheet of material form the heat absorbing wall 21 , and there is a gap g between the two ends 211 , 212 of the single sheet of material on the plane where the heat absorbing wall 21 is located.

[0060] like Figure 2B As shown, the heat-conducting structure 2 formed by a single piece of material (including a heat-absorbing wall 21, a heat-conducting wall 22 and two side walls 23) can directly contact the bottom of the photoelectric conversion circuit board 3, and the heat energy generated by the photoelectric conversion circuit board 3 is transferred to the lower surface of the board body through the upper surface of the board body and the conductive holes of the board body (not shown), and then transferred to the heat-conducting wall 22 above the photoelectric conversion circuit board 3 through the heat-absorbing wall 21 and the side walls 23 on both sides, and finally the heat energy is dissipated by the heat-conducting wall 22. Figure 2B In the heat conduction path, since the heat absorbing wall 21, the heat conducting wall 22 and the two side walls 23 are a whole piece of structure, there is no need to pass through multiple heat conducting elements (the connection between multiple heat conducting elements will reduce the heat conduction rate), nor is there a need to fill the gaps with heat conducting glue, so the heat conduction rate is excellent, and the assembly efficiency and cost considerations are also better than the previous technology. In the present invention, a single piece of material refers to a piece of the same material (preferably a metal material with high thermal conductivity), which does not need to be spliced, adhered, locked, etc., and can be formed into a complete whole, and the required structure can be formed by stamping, cutting, bending, etc.

[0061] In this embodiment, the heat conducting wall 22 can be connected to a heat dissipation fin or other type of cooling device to accelerate the heat dissipation. The aforementioned single piece of material is preferably mainly smooth sheet metal, so that the heat conducting wall 22 has a flat and smooth surface suitable for connecting to heat dissipation fins or other types of cooling devices.

[0062] like Figure 2A and Figure 2BAs shown, the photoelectric conversion circuit board 3 is disposed in the accommodating space S, and the photoelectric conversion circuit board 3 is provided with a plurality of heating elements 31. The heating element 31 may include an element dedicated to photoelectric conversion (such as a vertical cavity surface emitting laser or a photodiode), or may include other electronic elements, such as a capacitor or a resistor. The present invention does not limit the type of the heating element 31, and any element that may generate heat energy due to operation, whether an active element or a passive element, may be the heating element 31 of the present invention. Figure 2B and Figure 3A As shown, at least two of the multiple heating elements 31 are respectively located on both sides of the gap g. That is to say, the two ends 211, 212 of the single-piece material are not directly connected and touch each other to form the gap g, and at least two heating elements 31 correspond to the two ends 211, 212 of the single-piece material and conduct heat through the two ends 211, 212 of the single-piece material. In this way, even if a plurality of heating elements 31 (a plurality of heat sources) are densely arranged on the optoelectronic conversion circuit board 3, the heat-conducting structure 2 thermally contacts the heating elements 31 with its two ends 211, 212 of the single-piece material that are farther apart, so that the heat source will not accumulate in a specific area of ​​the single-piece material, but can be quickly conducted out on both sides, thereby avoiding overheating of the optoelectronic conversion circuit board 3 and maintaining good operation. The heat-absorbing wall 21 formed at the two ends 211, 212 of the single-piece material may further have contact protrusions 211a, 212a facing the accommodating space S (refer to Figure 1B ), the contact protrusions 211a, 212a are formed by stamping the single piece of material and are matched with the position of the heating element 31 to further fit the heating element 31 and enhance the thermal conductivity.

[0063] Figure 3B Another type of heat-conducting structure 2 is shown. When the heating elements 31 are not arranged horizontally (X axis in the figure), two heating elements 31 arranged linearly (Y axis in the figure) can be located on both sides of the gap g through a non-linear gap g, so that the two ends 211 and 212 of the single-piece material are respectively in thermal contact with the two heating elements 31. The gap g of the heat-conducting structure 2 of the present invention is not limited to this.

[0064] In summary, the photoelectric conversion module 100 of the present invention utilizes the heat-conducting structure 2 formed by a single piece of material to directly conduct heat energy from the bottom and side of the photoelectric conversion circuit board 3 to the top with a single structure that is not connected to other heterogeneous materials, without the need to conduct heat through a number of stacked and complicated different heat-conducting elements. In addition, when multiple heating elements generate heat simultaneously in a nearby area, the heat-conducting structure 2 of the present invention uses the two ends 211 and 212 of the single piece of material that are far apart to thermally contact the heating element 31 respectively, so that the heat source will not accumulate in a specific area of ​​the single piece of material, but can be quickly conducted out on both sides, thereby preventing the photoelectric conversion circuit board 3 from overheating and maintaining good operation.

[0065] Furthermore, if Figure 1B As shown, the heat-conducting structure 2 also includes an extension portion 24 parallel to the heat-conducting wall 22, and the extension portion 24 is formed by bending the aforementioned single-piece material. The extension portion 24 can be used to thermally contact the upper surface of the heating element 31 of the photoelectric conversion circuit board 3 (relative to the lower surface of the heat-absorbing wall 21 thermally contacting the photoelectric conversion circuit board 3) to increase the heat conduction path and accelerate the heat conduction speed. In addition, the extension portion 24 is a sheet material that is the same as the heat-conducting wall 22, and the heat conduction efficiency is better. Among the heating elements 31, due to their different structures and heights, some heating elements 31 can be connected to the extension portion 24 at the top and conduct heat from the heat-absorbing wall 21 at the bottom, and conduct heat from the upper and lower ends respectively to speed up the speed; some heating elements 31 cannot directly contact the extension portion 24, but can still take the path below, that is, conduct heat from the heat-absorbing wall 21.

[0066] Furthermore, if Figure 4A As shown, the first end of the heat-conducting structure 2 along the assembly direction d (parallel to the Y axis in the figure) is provided with a first limiting feature 25 to limit excessive movement of the photoelectric conversion circuit board 3 during assembly. In this embodiment, the first limiting feature 25 is a groove parallel to the assembly direction d, and the end of the photoelectric conversion circuit board 3 has a corresponding flange 32 to be limited by the first limiting feature 25. However, the present invention is not limited thereto, and in other embodiments, the first limiting feature 25 may also be in other forms.

[0067] Furthermore, a second limiting feature 26 is provided at the second end of the heat conducting structure 2 along the assembly direction d. Figure 4B , the second limiting feature 26 protrudes from the side wall 23 toward the accommodating space S. The second limiting feature 26 has a snap-fitting recessed hole 261, and the photoelectric conversion circuit board 3 has a snap-fitting protrusion 33 at a position corresponding to the snap-fitting recessed hole 261. The snap-fitting protrusion 33 is preferably a relatively protruding area formed by cutting off part of the edge of the photoelectric conversion circuit board 3. Since the second limiting feature 26 protrudes toward the accommodating space S, when the photoelectric conversion circuit board 3 moves along the assembly direction and passes through the second limiting feature 26, the snap-fitting protrusion 33 is squeezed and slightly elastically deformed, and then releases the elastic potential energy and snaps into the snap-fitting recessed hole 261, so that the photoelectric conversion circuit board 3 is positioned in the heat-conducting structure 2.

[0068] Preferably, the second limiting feature 26 has a guiding inclined surface 262 in the assembly direction d, and the guiding inclined surface 262 is inclined relative to the assembly direction d. The guiding inclined surface 262 can guide the engaging protrusion 33 to gradually elastically deform through the inclined surface.

[0069] Furthermore, if Figure 2A , Figure 2B and Figure 5AAs shown, the photoelectric conversion module 100 further includes a housing 1, and the heat-conducting structure 2 is slidably disposed in the housing 1. The housing 1 can be used to assemble and accommodate other components to form an integrated other device, and can also be used to protect the airtightness of the photoelectric conversion module 100. The housing 1 can completely cover the heat-absorbing wall 21, the heat-conducting wall 22 and the two side walls 23 of the heat-conducting structure 2 and only leave connection ports at both ends, or it can be as shown in FIG. Figure 2A and Figure 5A As shown, the heat-conducting wall 22 is exposed to allow the heat-conducting wall 22 to dissipate heat or be connected to various heat-dissipating devices.

[0070] Further, the housing 1 has a third limiting feature 13, which protrudes toward the heat conducting structure 2 in two directions perpendicular to the assembly direction d (such as the Y axis and the Z axis in the figure) to limit the movement of the heat conducting structure 2 outside the assembly direction d. Accordingly, a slide rail 27 is formed at a position adjacent to the third limiting feature 13 of the heat conducting structure 2, and the shape of the slide rail 27 matches the third limiting feature 13. The heat conducting structure 2 is assembled by relative movement with the housing 1 using the slide rail 27.

[0071] Furthermore, if Figure 5A and Figure 5B As shown, the heat-conducting structure 2 also includes at least one spring piece 28, which is arranged on the heat-absorbing wall 21, and the spring piece 28 is provided with a positioning protrusion 281 facing the shell 1. The bottom surface 11 of the shell 1 has at least one positioning recess 12, and the position of the positioning recess 12 corresponds to the positioning protrusion 281. The spring piece 28 is preferably formed by cutting the aforementioned single piece of material, but the present invention is not limited to this. When the heat-conducting structure 2 moves relatively in the assembly direction d, the spring piece 28 can be compressed due to its elasticity and does not affect the movement of the heat-conducting structure 2. When the heat-conducting structure 2 is assembled to the position, the positioning protrusion 281 is inserted into the positioning concave portion 12 of the bottom surface 11 of the shell 1 to fix the heat-conducting structure 2. The specific shape and number of the positioning protrusion 281 can be changed as needed, and it is preferably avoided to contact the position formed by the protrusions 211a and 212a. In other embodiments, the spring piece 28 can also be changed to the two side walls 23, and the present invention is not limited to this.

[0072] The present invention has been disclosed in the above with preferred embodiments, but it should be understood by those skilled in the art that the embodiments are only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to the embodiments should be set as being within the scope of the present invention. Therefore, the protection scope of the present invention shall be based on the scope of the content defined in the claims.

Claims

1. A heat-conducting structure, characterized in that: The heat conducting structure comprises: Heat absorbing wall; thermally conductive walls; and two side walls, the two side walls are connected to the heat absorbing wall and the heat conducting wall, the heat absorbing wall, the heat conducting wall and the two side walls surround to form an accommodating space, The heat absorbing wall, the heat conducting wall and the two side walls are formed by bending a single sheet of material, two ends of the single sheet of material form the heat absorbing wall, and there is a gap between the two ends of the single sheet of material on the plane where the heat absorbing wall is located.

2. The heat conducting structure according to claim 1, characterized in that: The heat absorbing wall has a contact convex portion facing the accommodating space, and the contact convex portion is formed by punching the single sheet material.

3. The heat conducting structure according to claim 1, characterized in that: It also includes an extension portion parallel to the heat-conducting wall, and the extension portion is formed by bending the single sheet of material.

4. A photoelectric conversion module, characterized in that: The photoelectric conversion module comprises: A heat-conducting structure, comprising a heat-absorbing wall, a heat-conducting wall and two side walls, wherein the two side walls are connected to the heat-absorbing wall and the heat-conducting wall, and the heat-absorbing wall, the heat-conducting wall and the two side walls surround and form an accommodating space; and A photoelectric conversion circuit board is arranged in the accommodating space, and the photoelectric conversion circuit board is provided with a plurality of heating elements. The heat absorbing wall, the heat conducting wall and the two side walls are formed by bending a single sheet of material, the two ends of the single sheet of material form the heat absorbing wall, and there is a gap between the two ends of the single sheet of material on the plane where the heat absorbing wall is located, and at least two of the multiple heating elements are respectively located on both sides of the gap.

5. The photoelectric conversion module according to claim 4, characterized in that: A first limiting feature is provided at a first end of the heat-conducting structure along the assembly direction, and the first limiting feature is a groove parallel to the assembly direction.

6. The photoelectric conversion module according to claim 4, characterized in that: The heat-conducting structure is provided with a second limiting feature at the second end along the assembly direction. The second limiting feature protrudes from the side wall toward the accommodating space. The second limiting feature has a snap-fitting recessed hole. The photoelectric conversion circuit board has a snap-fitting protrusion at a position corresponding to the snap-fitting recessed hole.

7. The photoelectric conversion module according to claim 6, characterized in that: The second limiting feature has a guiding slope in the assembly direction, and the guiding slope is inclined relative to the assembly direction.

8. The photoelectric conversion module according to claim 4, characterized in that: A shell is also included, and the heat-conducting structure is slidably disposed in the shell.

9. The photoelectric conversion module according to claim 8, characterized in that: The shell has a third limiting feature, and the third limiting feature protrudes toward the heat-conducting structure in two directions perpendicular to the assembly direction to limit the movement of the heat-conducting structure outside the assembly direction.

10. The photoelectric conversion module according to claim 8, characterized in that: The heat-conducting structure further comprises at least one spring sheet disposed on the heat-absorbing wall, wherein the spring sheet is provided with a positioning protrusion facing the shell, and the bottom surface of the shell has at least one positioning concave portion, and the position of the positioning concave portion corresponds to the positioning protrusion.

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