Array substrate, display panel and display device

Abstract

The invention provides an array substrate, a display panel and a display device. The array substrate comprises a substrate, a common electrode wire and a functional unit. The functional unit is located in the frame area. The functional unit comprises a thermode and a heating wire. The heating wires half surround the display area and are located on the sides, close to the substrate, of the common electrode wires. The heating wire comprises a first part and a second part which are connected. And the joint of the first part and the second part is electrically connected with one end of the thermode. And the thermode and the first part form a thermocouple, and / or the thermode and the second part form a thermocouple. Wherein the functional unit has heating and temperature sensing functions, and each function is subjected to time division multiplexing. According to the array substrate, the functional unit located in the frame area is arranged in the array substrate, temperature detection of the display panel can be achieved, liquid crystal can be heated in a low-temperature environment, the display speed and the display quality of the display panel are improved, and the stability and the reliability of the display panel are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate, a display panel and a display device. Background Art

[0002] Most liquid crystal displays (LCDs) are backlight type LCDs, which include a housing, a liquid crystal display panel disposed in the housing, and a backlight module in the housing. The LCD requires a light source provided by the backlight module to display light normally.

[0003] Usually, a liquid crystal display panel is made of two glass substrates (array glass and color filter glass) bonded together, with liquid crystal poured between the two glass substrates. Pixel electrodes and common electrodes are set on the opposite inner sides of the two glass substrates, and the voltage field strength is used to control the rotation direction of the liquid crystal molecules to refract the light from the backlight module to produce a picture.

[0004] LCD has a greater adhesion due to the characteristics of the liquid crystal molecules themselves; due to its poor response speed, especially at low temperatures, its ghosting is more obvious, seriously affecting the display quality. Summary of the invention

[0005] The main technical problem solved by the present application is to provide an array substrate, a display panel and a display device to solve the problem of poor liquid crystal response speed in the prior art.

[0006] In order to solve the above technical problems, the first technical solution provided by the present application is: to provide an array substrate having a display area and a frame area; including:

[0007] substrate;

[0008] The common electrode wiring is located on one side of the substrate and in the border area;

[0009] The array substrate further includes a functional unit located in the border area; the functional unit includes:

[0010] Thermopiles;

[0011] The heating line is arranged to semi-surround the display area and is located on a side of the common electrode line close to the substrate; the heating line comprises a first part and a second part connected; the connection between the first part and the second part is electrically connected to one end of the thermoelectrode; the thermoelectrode and the first part form a thermocouple, and / or the thermoelectrode and the second part form a thermocouple;

[0012] Among them, the functional unit has heating and temperature sensing functions, and each function is time-sharing and multiplexed.

[0013] in,

[0014] There is one hot electrode;

[0015] or,

[0016] There are two thermocouples, the heating line includes a second part and two first parts, the second part is connected between the two first parts, the thermocouples are arranged in one-to-one correspondence with the first parts, and form thermocouples with the corresponding first parts.

[0017] The line length of the second part is greater than that of the first part; the thermocouple is formed by the thermoelectrode and the first part, the second part is an arcuate line, and the first part is a straight line.

[0018] The thermode is located on the side of the heating line away from the substrate; the thermode and the common electrode line are patterned using the same metal layer; the thermode is located at the end of the common electrode line and is insulated from the common electrode line.

[0019] Wherein, the projection of the common electrode wiring on the substrate covers a part of the orthographic projection of the heating wiring on the substrate;

[0020] The width of the common electrode wiring is 150 microns to 1500 microns.

[0021] in,

[0022] The array substrate further includes a virtual pixel electrode, which is located in the frame area and arranged around the display area; the virtual pixel electrode is located on a side of the common electrode wiring close to the display area and is electrically connected to the common electrode wiring;

[0023] The heating wiring is located on a side of the virtual pixel electrode close to the substrate, and the orthographic projection of the virtual pixel electrode on the substrate covers a portion of the orthographic projection of the heating wiring on the substrate.

[0024] The array substrate further includes a gate insulating layer and a thin film transistor located in the display area, and the gate insulating layer is located between the source and drain electrode layers of the thin film transistor and the gate layer of the thin film transistor;

[0025] The thin film transistor is a top gate structure, the array substrate further comprises a light shielding layer and a buffer layer stacked in sequence, the buffer layer is located between the light shielding layer and the thin film transistor; the light shielding layer and the heating wiring are patterned on the same metal layer; the thermoelectrode is sequentially passed through the gate insulating layer and the buffer layer and is electrically connected to the heating wiring, or the thermoelectrode is passed through the buffer layer and is electrically connected to the heating wiring;

[0026] or,

[0027] The thin film transistor is a bottom gate structure, the heating line is located on the side of the gate insulating layer close to the substrate, and the thermode passes through the gate insulating layer and is electrically connected to the heating line.

[0028] in,

[0029] The array substrate includes a heating stage and a temperature sensing stage;

[0030] In the temperature sensing stage, the other end of the thermode and the heating trace are connected to a high-level signal and a low-level signal respectively, and the thermocouple senses the temperature;

[0031] During the heating stage, one end of the heating trace is connected to a high-level signal and the other end is connected to a low-level signal, and the heating trace is heated.

[0032] In order to solve the above technical problem, the second technical solution provided by the present application is: to provide a display panel, which includes:

[0033] An array substrate, such as the above-mentioned array substrate;

[0034] A color filter substrate is arranged opposite to the array substrate;

[0035] The liquid crystal is located between the array substrate and the color filter substrate.

[0036] In order to solve the above technical problems, the third technical solution provided by the present application is: providing a display device, which includes a driving chip and the above display panel;

[0037] The driving chip is electrically connected to the common electrode wiring, the hot electrode and the heating wiring respectively.

[0038] Beneficial effects of the present application: Different from the prior art, the present application provides an array substrate, a display panel and a display device, wherein the array substrate has a display area and a frame area. The array substrate includes a substrate, a common electrode wiring and a functional unit. The functional unit is located in the frame area. The functional unit includes a thermode and a heating wiring. The heating wiring is arranged to semi-surround the display area and is located on the side of the common electrode wiring close to the substrate. The heating wiring includes a first part and a second part that are connected. The connection between the first part and the second part is electrically connected to one end of the thermoelectrode. The thermoelectrode forms a thermocouple with the first part, and / or the thermoelectrode forms a thermocouple with the second part. Among them, the functional unit has heating and temperature sensing functions, and each function is time-division multiplexed. The embodiment of the present application can realize temperature detection of the display panel by setting a functional unit located in the frame area in the array substrate, and can also heat the liquid crystal in a low temperature environment, improve the display speed and display quality of the display panel, and increase the stability and reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technical workers in this field, other drawings can be obtained based on these drawings without any creative work.

[0040] Figure 1 is a schematic diagram of a top view of the structure of a first embodiment of an array substrate provided in an embodiment of the present application;

[0041] Figure 2 is a schematic diagram of a top view of the structure of a second embodiment of an array substrate provided in an embodiment of the present application;

[0042] Figure 3 is a schematic diagram of the longitudinal cross-sectional structure of an embodiment of an array substrate provided in an embodiment of the present application;

[0043] Figure 4 is a schematic diagram of a top view of the structure of a third embodiment of an array substrate provided in an embodiment of the present application;

[0044] Figure 5 is a schematic diagram of the longitudinal cross-sectional structure of another embodiment of the array substrate provided in an embodiment of the present application;

[0045] Figure 6 is a schematic diagram of a longitudinal cross-sectional structure of another embodiment of an array substrate provided in an embodiment of the present application;

[0046] Figure 7 is a schematic structural diagram of an embodiment of a display panel provided in an embodiment of the present application;

[0047] Figure 8 is a structural schematic diagram of an embodiment of a display device provided in an embodiment of the present application;

[0048] Fig. 9 It is a structural schematic diagram of another embodiment of the display device provided in the embodiment of the present application.

[0049] Description of Figure Numbers:

[0050] 100, array substrate; 101, display area; 1011, first side; 1012, second side; 102, frame area; 1021, fan-out area; 10, substrate; 20, common electrode routing; 30, functional unit; 31, hot electrode; 311, lead part; 312, block part; 32, heating routing; 321, first part; 322, second part; 323, thermocouple node; 40, virtual pixel electrode; 50, gate insulation layer; 60, thin film transistor; 61, source and drain layer; 62, gate layer; 63, active layer; 70, buffer layer; 80, interlayer dielectric layer; 90, shading layer; 200, color film substrate; 300, liquid crystal; 400, display panel; 500, driver chip; 600, flexible printed circuit board; 700, flexible substrate; 800, display device. DETAILED DESCRIPTION

[0051] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0052] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0053] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technical workers in the field without making creative work are within the scope of protection of this application.

[0054] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0055] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0056] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a top view of the structure of a first embodiment of an array substrate provided in an embodiment of the present application, Figure 2 It is a schematic diagram of the top view structure of the second embodiment of the array substrate provided in the embodiment of the present application.

[0057] The embodiment of the present application provides an array substrate 100, which has a display area 101 and a frame area 102. The array substrate 100 includes a substrate 10, a common electrode wiring 20 and a functional unit 30. The functional unit 30 is located in the frame area 102. The functional unit 30 includes a thermoelectrode 31 and a heating wiring 32. The heating wiring 32 is arranged to semi-surround the display area 101 and is located on the side of the common electrode wiring 20 close to the substrate 10. The heating wiring 32 includes a first part 321 and a second part 322 connected. The connection between the first part 321 and the second part 322 is electrically connected to one end of the thermoelectrode 31. The thermoelectrode 31 and the first part 321 form a thermocouple, and / or the thermoelectrode 31 and the second part 322 form a thermocouple. Among them, the functional unit 30 has heating and temperature sensing functions, and each function is time-division multiplexed.

[0058] The embodiment of the present application can realize the display panel 400 (see Figure 7 ) temperature detection, and can also heat the liquid crystal 300 in a low temperature environment (see Figure 7 ), improve the display speed and display quality of the display panel 400, and increase the stability and reliability of the display panel 400.

[0059] The substrate 10 may be a hard substrate, such as glass, quartz, sapphire, etc.; the substrate 10 may also be a flexible substrate 600, such as polyimide (PI), polyethylene terephthalate (PET), etc. The material of the substrate 10 is not limited here and is selected according to actual needs. The substrate 10 is a transparent substrate.

[0060] The array substrate 100 further includes an in-plane common electrode layer (not shown), which is located in the display area 101. The in-plane common electrode layer is used to form an electric field, control the arrangement of the liquid crystal 300, improve display quality, reduce cross interference, increase response speed, and reduce power consumption.

[0061] There is no restriction on the shape and wiring method of the common electrode layer in the plane, and they can be selected according to actual needs.

[0062] The common electrode wiring 20 is located in the border area 102 and is used to connect the external control circuit (for example, the driver chip 400 (see Figure 8 )) is electrically connected to the in-plane common electrode layer.

[0063] The material of the common electrode trace 20 may be the same as or different from the material of the in-plane common electrode layer. There are no excessive restrictions here and the material is selected according to actual needs.

[0064] In some embodiments, the material of the common electrode wiring 20 is different from the material of the in-plane common electrode layer. The in-plane common electrode layer includes at least one of indium tin oxide (ITO), zinc oxide (ZnO), and gallium-doped zinc oxide (GZO). The common electrode wiring 20 is arranged to semi-surround the display area 101. The common electrode wiring 20 includes a metal material such as copper or molybdenum.

[0065] In other embodiments, the in-plane common electrode layer may be made of other materials. The common electrode trace 20 may also be made of other non-metallic conductive materials, such as graphene.

[0066] In some embodiments, the display area 101 is rectangular. The frame area 102 is arranged around the display area 101. The display area 101 is used to set structures such as pixels (not shown), data signal lines (not shown), and scan signal lines (not shown). The frame area 102 is used to set structures such as scan circuits (not shown) and test circuits (not shown).

[0067] In other embodiments, the display area 101 may be in a circular shape or other shapes, which is not limited here and is selected according to actual needs.

[0068] The frame area 102 includes a fan-out area 1021, and the fan-out area 1021 is located on one side of the display area 101. The fan-out area 1021 and the common electrode trace 20 are located on different sides of the display area 101. The fan-out area 1021 refers to an area for signal transmission and connection, which can improve the integration and reliability of the display panel 400 and reduce the frame width.

[0069] Exemplarily, the common electrode wiring 20 is located on the other three sides of the display area 101 except the side where the fan-out area 1021 is located.

[0070] The array substrate 100 includes a heating phase and a temperature sensing phase. The working phase of the array substrate 100 matches the function of the functional unit 30 .

[0071] The functional unit 30 has a heating function and a temperature sensing function, and the heating function and the temperature sensing function are not performed at the same time.

[0072] In the temperature sensing stage, the functional unit 30 has a temperature sensing function, and the thermoelectrode 31 forms a thermocouple with the first part 321, and / or the thermoelectrode 31 forms a thermocouple with the second part 322. The other end of the thermoelectrode 31 and the heating wiring 32 are respectively connected to a high-level signal and a low-level signal, and the thermocouple senses the temperature. The connection between the first part 321 and the second part 322 forms a thermocouple node 323 at the place where one end of the thermoelectrode 31 contacts, which serves as the measuring end of the thermocouple. The thermocouple is used to detect the ambient temperature of the liquid crystal 300 in the display panel 400 to improve the low-temperature driving and high-temperature polarization problems of the liquid crystal 300.

[0073] Exemplarily, in the temperature sensing stage, the other end of the thermode 31 is connected to a high-level signal, and the heating trace 32 is connected to a low-level signal, the thermode 31 and part of the heating trace 32 form a closed loop, and the connection between the thermode 31 and the heating trace 32 forms a thermocouple node 323.

[0074] In the heating stage, one end of the heating line 32 is connected to a high level signal, and the other end is connected to a low level signal, and the heating line 32 is heated.

[0075] Exemplarily, the heating wiring 32 forms a closed loop with the external control circuit, and the current circulates in the heating wiring 32 to generate continuous heat to heat the liquid crystal 300 in a low temperature environment, thereby improving the response speed of the liquid crystal 300, thereby improving the display speed and display quality of the display panel 400, and increasing the stability and reliability of the display panel 400.

[0076] The hot electrode 31 includes a lead portion 311 and a block portion 312. The lead portion 311 is used to electrically connect an external control circuit to the block portion 312. The connection between the first portion 321 and the second portion 322 in the heating lead is electrically connected to the block portion 312.

[0077] Exemplarily, the side where the fan-out area 1021 is located is defined as the first side 1011 of the display area 101. The block portion 312 is located at the second side 1012 of the display area 101 adjacent to the first side 1011 of the display area 101, and is arranged close to the first side 1011. Alternatively, the block portion 312 is located at the overlap of the first side 1011 and the second side 1012 of the display area 101, that is, the block portion 312 is located at the corner of the frame area 102, and is arranged close to the fan-out area 1021. The projection of the measuring end on the block portion 312 is located within the block portion 312.

[0078] Designing a portion of the thermoelectrode 31 to be block-shaped, namely the block portion 312 , is beneficial for electrically connecting the thermoelectrode 31 to the connection between the first portion 321 and the second portion 322 in the heating trace 32 , thereby facilitating improving the detection accuracy of the thermocouple.

[0079] In some embodiments, Figure 1 As shown, there are two thermoelectrodes 31 , and the heating wiring 32 includes a second part 322 and two first parts 321 . The second part 322 is connected between the two first parts 321 . The thermoelectrodes 31 are arranged one-to-one with the first parts 321 , and form thermocouples with the corresponding first parts 321 .

[0080] Exemplarily, the two thermoelectrodes 31 are respectively located on opposite sides of the display area 101, and are both located on the second side 1012 of the display area 101. The heating trace 32 is located on the other three sides of the display area 101 except the side where the fan-out area 1021 is located. The two thermoelectrodes 31 and the heating trace 32 respectively form two thermocouples, and the temperature at the location is fed back by the measuring end, so that the ambient temperature of the liquid crystal 300 in the display panel 400 can be better monitored, thereby improving the low-temperature driving and high-temperature polarization problems of the liquid crystal 300.

[0081] In other embodiments, Figure 2 As shown, there is one thermoelectrode 31 , that is, one measuring end. The thermoelectrode 31 and the first part 321 form a thermocouple, and / or the thermoelectrode 31 and the second part 322 form a thermocouple.

[0082] When the thermoelectrode 31 and the first portion 321 form a thermocouple, and the thermoelectrode 31 and the second portion 322 form another thermocouple, the two thermocouples share the same measuring end.

[0083] In some embodiments, the line length of the second part 322 is greater than the line length of the first part 321. The thermocouple is formed by the hot electrode 31 and the first part 321, the second part 322 is an arcuate line, and the first part 321 is a straight line. The second part 322 is designed to be an arch, and the line length is increased to increase the heating impedance of the second part 322 without occupying the extra space of the frame area 102, which is conducive to improving the heating effect and narrow frame design. The first part 321 is designed to be straight and shorter than the line length of the second part 322, which reduces the length of the heat conduction path, reduces the influence of heat conduction between the measuring end and the non-measuring end in the thermocouple, and improves the measurement accuracy.

[0084] Exemplarily, the second portion 322 is disposed around three sides of the display area 101 .

[0085] In other embodiments, the second portion 322 may be a non-arcuate routing, which is not limited here and is selected according to actual needs.

[0086] In some embodiments, Figure 4 As shown, the hot electrode 31 is located on the side of the heating line 32 away from the substrate 10. The hot electrode 31 and the common electrode line 20 are patterned using the same metal layer to simplify the manufacturing process. The hot electrode 31 is located at the end of the common electrode line 20 and is insulated from the common electrode line 20, which is conducive to the narrow frame design.

[0087] In other embodiments, the hot electrode 31 and the common electrode trace 20 can be made of different materials, which is not limited here and can be selected according to actual needs. The hot electrode 31 can also be located at other positions.

[0088] See also Figures 1 to 3 , Figure 3 is a schematic diagram of the longitudinal cross-sectional structure of an embodiment of an array substrate provided in an embodiment of the present application,

[0089] In some embodiments, the projection of the common electrode trace 20 on the substrate 10 covers a portion of the orthographic projection of the heating trace 32 on the substrate 10. The width of the common electrode trace 20 is 150 micrometers to 1500 micrometers.

[0090] Exemplarily, the width of the common electrode wiring 20 is greater than the width of the heating wiring 32. The orthographic projection of the common electrode wiring 20 on the substrate 10 covers the orthographic projection of the second portion 322 of the heating wiring 32 on the substrate 10, which can shield the interference of the heating signal of the heating wiring 32 on other signals of the display panel 400, so that the picture display and heating of the display panel 400 can be performed simultaneously.

[0091] See also Figures 1 to 4 , Figure 4It is a schematic diagram of the top view of the structure of the third embodiment of the array substrate provided in the embodiments of the present application.

[0092] In other embodiments, the array substrate 100 further includes a virtual pixel electrode 40, which is located in the border area 102 and is arranged around the display area 101. The virtual pixel electrode 40 is located on a side of the common electrode wiring 20 close to the display area 101 and is electrically connected to the common electrode wiring 20. The heating wiring 32 is located on a side of the virtual pixel electrode 40 close to the substrate 10, and the orthographic projection of the virtual pixel electrode 40 on the substrate 10 covers a portion of the orthographic projection of the heating wiring 32 on the substrate 10.

[0093] Exemplarily, the virtual pixel electrode 40 is a ring-shaped structure. The orthographic projection of the virtual pixel electrode 40 on the substrate 10 covers the orthographic projection of the second portion 322 of the heating trace 32 on the substrate 10, which can shield the heating signal of the heating trace 32 from interfering with other signals of the display panel 400, so that the picture display and heating of the display panel 400 can be performed simultaneously.

[0094] Exemplarily, the setting of the virtual pixel electrode 40 can compensate for the uneven display of the edge area of ​​the display area 101 and other functions, with reference to the relevant technology, which will not be described in detail here. The virtual pixel electrode 40 can be a transparent electrode. Specifically, the virtual pixel electrode 40 can be indium tin oxide (Indium Tin Oxide, ITO), zinc oxide (Zinc Oxide, ZnO), gallium-doped zinc oxide (Gallium-doped Zinc Oxide, GZO), etc.

[0095] See also Figures 1 to 6 , Figure 5 is a schematic diagram of a longitudinal cross-sectional structure of another embodiment of an array substrate provided in an embodiment of the present application, Figure 6 It is a schematic diagram of the longitudinal cross-sectional structure of another embodiment of the array substrate provided in the embodiment of the present application.

[0096] In some embodiments, the array substrate 100 further includes a gate insulating layer 50 and a thin film transistor 60 located in the display area 101, and the gate insulating layer 50 is located between the source and drain electrode layer 61 of the thin film transistor 60 and the gate layer 62 of the thin film transistor 60. The thin film transistor 60 is a top gate structure, and the gate layer 62 of the thin film transistor 60 is located on the side of the source and drain electrode layer 61 of the thin film transistor 60 away from the substrate 10. The array substrate 100 further includes a light shielding layer 90 and a buffer layer 70 stacked in sequence, and the buffer layer 70 is located between the light shielding layer 90 and the thin film transistor 60. The light shielding layer 90 blocks the light directed to the active layer 63 of the thin film transistor 60 to improve the light leakage current. The light shielding layer 90 and the heating wiring 32 are formed by patterning the same metal layer, which can simplify the preparation process. The hot electrode 31 is sequentially penetrated through the gate insulating layer 50 and the buffer layer 70 to be electrically connected to the heating wiring 32, or the hot electrode 31 is penetrated through the buffer layer 70 to be electrically connected to the heating wiring 32.

[0097] For example, Figure 5 As shown, the thermode 31 is located on the side of the gate insulating layer 50 away from the substrate 10 , the heating trace 32 is located between the substrate 10 and the buffer layer 70 , and the thermode 31 passes through the gate insulating layer 50 and the buffer layer 70 in sequence and is electrically connected to the heating trace 32 .

[0098] For example, Figure 6 As shown, the thermode 31 is located between the gate insulating layer 50 and the buffer layer 70 , the heating trace 32 is located between the substrate 10 and the buffer layer 70 , and the thermode 31 passes through the buffer layer 70 and is electrically connected to the heating trace 32 .

[0099] Exemplarily, the hot electrode 31 and the heating trace 32 are made of different materials. The hot electrode 31 includes copper, and the heating trace 32 includes constantan.

[0100] In other embodiments, the thermode 31 and the heating trace 32 may be made of other materials, as long as they can form a thermocouple.

[0101] In other embodiments, the array substrate 100 further includes a gate insulating layer 50 and a thin film transistor 60 located in the display area 101, and the gate insulating layer 50 is located between the source and drain electrode layer 61 of the thin film transistor 60 and the gate layer 62 of the thin film transistor 60. The thin film transistor 60 is a bottom gate structure, and the gate layer 62 of the thin film transistor 60 is located on the side of the source and drain electrode layer 61 of the thin film transistor 60 close to the substrate 10. The heating trace 32 is located on the side of the gate insulating layer 50 close to the substrate 10, and the hot electrode 31 passes through the gate insulating layer 50 and is electrically connected to the heating trace 32 (see Figure 3 ).

[0102] The array substrate 100 further includes an interlayer dielectric layer 80, which is located on a side of the common electrode wiring 20 away from the substrate 10. The material and thickness of the interlayer dielectric layer 80 are not limited here and can be selected according to actual needs.

[0103] See also Figures 1 to 7 , Figure 7 It is a schematic structural diagram of an embodiment of a display panel provided in an embodiment of the present application.

[0104] The embodiment of the present application provides a display panel 400. The display panel 400 includes an array substrate 100, a color filter substrate 200 and a liquid crystal 300.

[0105] The array substrate 100 is the above-mentioned array substrate 100 . The color filter substrate 200 is disposed opposite to the array substrate 100 . The liquid crystal 300 is located between the array substrate 100 and the color filter substrate 200 .

[0106] In some embodiments, the deflection of the liquid crystal 300 is controlled by the electric field formed between the array substrate 100 and the color filter substrate 200, or the deflection of the liquid crystal 300 is controlled by the electric field formed on the array substrate 100 to realize the display of the display panel 400. The color filter substrate 200 is used to realize the color display of the display panel 400.

[0107] The common electrode trace 20 is located on a side of the substrate 10 close to the color filter substrate 200 .

[0108] In some embodiments, the functional unit 30 has a temperature sensing function and a heating function. The functional unit 30 can detect the ambient temperature of the liquid crystal 300 in the display panel 400, and further improve the low-temperature driving and high-temperature polarization problems of the liquid crystal 300. In addition, the functional unit 30 can also heat the liquid crystal 300 in a low-temperature environment, improve the display speed and display quality of the display panel 400, and increase the stability and reliability of the display panel 400.

[0109] See also Figures 1 to 9 , Figure 8 is a schematic structural diagram of an embodiment of a display device provided in an embodiment of the present application, Fig. 9 It is a structural schematic diagram of another embodiment of the display device provided in the embodiment of the present application.

[0110] The embodiment of the present application provides a display device 800. The display device 800 includes a driving chip 500 and the display panel 400 described above.

[0111] The driving chip 500 is electrically connected to the common electrode wiring 20 , the hot electrode 31 and the heating wiring 32 , respectively.

[0112] In some embodiments, Figure 8As shown, the display device 800 further includes a flexible printed circuit board 600, which is electrically connected to the display panel 400 and is used to transmit image data, control signals and power signals to the display panel 400. The driving chip 500 may be disposed on the flexible printed circuit board 600.

[0113] In some other embodiments, the chip on glass (COG) technology is used to directly package the driver chip 500 on the glass substrate of the display panel 400. Specifically, the driver chip 500 is directly packaged on the substrate 10 of the array substrate 100.

[0114] In yet another embodiment, Fig. 9 As shown, the display device 800 further includes a flexible substrate 700, which is electrically connected to the display panel 400. The driving chip 500 is disposed on the flexible substrate 700 using a chip-on-film (COF) technology. The flexible substrate 700 is used to carry the driving chip 500 and provide functions such as electrical connection and signal transmission.

[0115] The display device 800 may also include one or more of the following components (not shown): memory, power supply component, processing component, multimedia component, audio component, input / output (I / O) interface, sensor component, and communication component. The specific structure and function of these components are the same or similar to the related art. For details, please refer to the related art and will not be repeated here. The display device 800 can be a computer, a digital broadcast terminal, a message transceiver, a game console, a medical device, a fitness device, a personal digital assistant, etc. This application does not limit this and is selected according to actual needs.

[0116] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0117] The above are only implementation methods of the present application, and are not intended to limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An array substrate having a display area and a frame area; comprising: substrate; A common electrode wiring is located on one side of the substrate and in the frame area; It is characterized in that the array substrate further comprises a functional unit located in the border area; the functional unit comprises: Thermopiles; A heating line is arranged to semi-surround the display area and is located on a side of the common electrode line close to the substrate; the heating line includes a first part and a second part that are connected; a connection between the first part and the second part is electrically connected to one end of the thermoelectrode; the thermoelectrode and the first part form a thermocouple, and / or the thermoelectrode and the second part form a thermocouple; Among them, the functional unit has heating and temperature sensing functions, and each function is time-division multiplexed.

2. The array substrate according to claim 1, characterized in that: There is one hot electrode; or, There are two thermocouples, the heating line includes one second part and two first parts, the second part is connected between the two first parts, the thermocouples are arranged in one-to-one correspondence with the first parts, and form thermocouples with the corresponding first parts.

3. The array substrate according to claim 2, characterized in that: The line length of the second part is greater than that of the first part; the thermoelectrode and the first part form a thermocouple, the second part is an arcuate line, and the first part is a straight line.

4. The array substrate according to claim 1, characterized in that: The thermoelectrode is located at a side of the heating line away from the substrate; the thermoelectrode and the common electrode line are patterned by the same metal layer; the thermoelectrode is located at an end of the common electrode line and is insulated from the common electrode line.

5. The array substrate according to claim 1, characterized in that: The projection of the common electrode wiring on the substrate covers part of the orthographic projection of the heating wiring on the substrate; The width of the common electrode wiring is 150 micrometers to 1500 micrometers.

6. The array substrate according to claim 1, characterized in that: The array substrate further includes a virtual pixel electrode, which is located in the frame area and is arranged around the display area; the virtual pixel electrode is located on a side of the common electrode wiring close to the display area and is electrically connected to the common electrode wiring; The heating trace is located on a side of the virtual pixel electrode close to the substrate, and the orthographic projection of the virtual pixel electrode on the substrate covers a portion of the orthographic projection of the heating trace on the substrate.

7. The array substrate according to claim 1 or 4, characterized in that: The array substrate further comprises a gate insulating layer and a thin film transistor located in the display area, wherein the gate insulating layer is located between a source and drain electrode layer of the thin film transistor and a gate layer of the thin film transistor; Wherein, the thin film transistor is a top gate structure, the array substrate further comprises a light shielding layer and a buffer layer which are stacked in sequence, the buffer layer is located between the light shielding layer and the thin film transistor; the light shielding layer and the heating trace are patterned and formed by the same metal layer; the thermoelectrode is sequentially passed through the gate insulating layer and the buffer layer to be electrically connected to the heating trace, or the thermoelectrode is passed through the buffer layer to be electrically connected to the heating trace; or, The thin film transistor is a bottom gate structure, the heating line is located on a side of the gate insulating layer close to the substrate, and the thermoelectrode passes through the gate insulating layer and is electrically connected to the heating line.

8. The array substrate according to claim 1, characterized in that: The array substrate includes a heating stage and a temperature sensing stage; In the temperature sensing stage, the other end of the thermoelectrode and the heating wiring are respectively connected to a high level signal and a low level signal, and the thermocouple senses the temperature; In the heating stage, one end of the heating line is connected to a high level signal, and the other end is connected to a low level signal, and the heating line is heated.

9. A display panel, characterized in that: include: An array substrate, as claimed in any one of claims 1 to 8; A color filter substrate, arranged opposite to the array substrate; The liquid crystal is located between the array substrate and the color film substrate.

10. A display device, characterized in that: comprising a driving chip and the display panel according to claim 9; The driving chip is electrically connected to the common electrode wiring, the hot electrode and the heating wiring respectively.

Images