Air-liquid mixed heat dissipation device of high-performance computer inserted and pasted mixed layout mainboard

Abstract

The invention discloses an air-liquid mixed heat dissipation device of a high-performance computer inserted and pasted mixed layout mainboard, which comprises a support structure for fixing the mainboard and a heat dissipation suite, and the heat dissipation suite comprises a liquid cooling circulation pipeline with a liquid inlet and a liquid outlet. An upstream pipeline and a downstream pipeline of the liquid cooling circulation pipeline are provided with a plurality of branch pipelines which are connected in parallel, liquid cooling plates used for dissipating heat of chips on the mainboard are arranged on the branch pipelines in series, and cold conduction strips used for dissipating heat of components on the mainboard are further installed on the branch pipelines. The two sides of the supporting structure are provided with air channels used for air cooling and heat dissipation of the memory bank, the liquid cooling plate is installed on the main board in an inserted mode and located on the upper side of the chip, and the cold conduction strip is attached to the upper side of a component of the main board. The invention aims to realize the air-liquid mixed heat dissipation structure of the high-performance computer inserted and pasted mixed layout mainboard, and solves the heat dissipation problem and the maintenance problem under the condition of high-density assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of high performance computer (HPC) heat dissipation, and in particular to an air-liquid hybrid heat dissipation device for a high performance computer plug-in hybrid layout motherboard. Background Art

[0002] In order to meet the requirements of the continuous improvement of the computing power of high-performance computers, under the existing space and cabinet structure conditions, improving the system installation density is the only way to achieve the improvement of computing power. However, with the increase in system assembly density, on the one hand, the increase in power density makes heat dissipation face more severe challenges, and on the other hand, the increase in assembly density will also make motherboard maintenance more difficult. Conventional high-performance computer or server computing plug-ins adopt a single-sided assembly mode. Since the plug-in memory stick occupies the space in the height direction of the motherboard, the plug-in assembly density is low, and the motherboard of the computing plug-in is simply buckled on the motherboard with the tray. When the bottom motherboard fails, the upper motherboard needs to be disassembled, which increases the maintenance time. Summary of the invention

[0003] Technical problem to be solved by the present invention: In view of the above-mentioned problems of the prior art, an air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard is provided. The present invention aims to realize an air-liquid hybrid heat dissipation structure for a high-performance computer plug-in hybrid layout motherboard, and solve the heat dissipation and maintenance problems faced under high-density assembly conditions.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: A wind-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard, comprising a supporting structure for fixing the motherboard and a heat dissipation kit, the heat dissipation kit comprising a liquid cooling circulation pipeline with a liquid inlet and a liquid outlet, a plurality of parallel branch pipelines are arranged on the upstream and downstream pipelines of the liquid cooling circulation pipeline, liquid cooling plates for dissipating heat for chips on the motherboard are arranged in series on the branch pipelines, cooling strips for dissipating heat for components on the motherboard are also installed on the branch pipelines, and air ducts for air cooling and heat dissipation of memory modules are arranged on both sides of the supporting structure, the liquid cooling plate is plug-in mounted on the motherboard and located on the upper side of the chip, and the cooling strips are mounted on the upper side of the components of the motherboard.

[0005] Optionally, the length direction of the air duct is perpendicular to the length direction of the memory stick on the motherboard, and one or more air duct holes are provided on the air duct. The air duct holes are located at one end of the length direction of the memory stick on the motherboard to achieve air cooling for multiple memory sticks at the same time.

[0006] Optionally, the liquid cooling circulation pipeline is in an annular structure and is fixed on a supporting structure.

[0007] Optionally, a cooling strip or a heat conducting block for dissipating heat for the mainboard is also installed on the liquid cooling circulation pipeline.

[0008] Optionally, the portion of the liquid cooling circulation pipeline where the cooling strip or the heat conducting block is installed includes a plurality of parallel pipeline passages to increase the contact area with the cooling strip.

[0009] Optionally, the liquid cooling plate is connected and fixed to the mainboard via a connecting piece, and a plurality of limit columns are provided around the liquid cooling plate to prevent overpressure during installation of the mainboard.

[0010] Optionally, the motherboard of the high-performance computer is installed on both sides of the supporting structure in a positive-negative-positive manner.

[0011] Optionally, the air ducts on both sides of the support structure are grooves of the guide rail, the outer end face of the support structure is provided with a panel, and the support structure, a fixed motherboard and a heat dissipation kit fixed on the support structure form a computing blade and are arranged in a frame of a high-performance computer through insertion of the guide rail.

[0012] Optionally, the liquid cooling plate is a microchannel liquid cooling plate, which has two liquid cooling chambers connected to the liquid inlet and the liquid outlet respectively, and a plurality of microchannels arranged in parallel are provided between the two liquid cooling chambers, and a nozzle is provided in each microchannel for connecting the two liquid cooling chambers.

[0013] A high-performance computer comprises a power supply and a mainboard, on which the mainboard is provided with an air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout mainboard.

[0014] Compared with the prior art, the present invention mainly has the following advantages: the present invention includes a supporting structure for fixing a mainboard and a heat dissipation kit, the heat dissipation kit includes a liquid cooling circulation pipeline with a liquid inlet and a liquid outlet, a plurality of parallel branch pipelines are arranged on the upstream and downstream pipelines of the liquid cooling circulation pipeline, liquid cooling plates for dissipating heat for chips on the mainboard are arranged in series on the branch pipelines, cooling strips for dissipating heat for components on the mainboard are also installed on the branch pipelines, and air ducts for air-cooling the memory modules are provided on both sides of the supporting structure, the liquid cooling plate is plug-in installed on the mainboard and located on the upper side of the chip, and the cooling strips are mounted on the upper side of the components of the mainboard, which can realize the air-liquid hybrid heat dissipation structure of the plug-in hybrid layout mainboard of a high-performance computer, and solve the heat dissipation and maintenance problems faced under high-density assembly conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional exploded structure of the air-liquid hybrid heat dissipation device in an embodiment of the present invention.

[0016] Figure 2Schematic diagram of the pipeline structure of the liquid cooling plate and its branch pipelines for heat dissipation in an embodiment of the present invention.

[0017] Figure 3 Schematic diagram of the structure of the heat dissipation kit in an embodiment of the present invention.

[0018] Figure 4 Schematic diagram of the support structure in an embodiment of the present invention.

[0019] Legend: 1. Mainboard; 2. Support structure; 21. Air duct; 22. Air duct hole; 3. Heat dissipation kit; 31. Liquid cooling circulation pipeline; 32. Liquid cooling plate; 33. Cooling strip; 34. Limiting column. DETAILED DESCRIPTION

[0020] The air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout motherboard of the present invention is intended to achieve efficient heat dissipation and convenient maintenance of high-power chips of the high-performance computer plug-in hybrid layout motherboard under high-density buckle assembly conditions. In order to achieve efficient heat dissipation and convenient maintenance of high-power chips of the high-performance computer plug-in hybrid layout motherboard under high-density buckle assembly conditions, this specification implements an air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout motherboard, and the present invention will be further described below in conjunction with the accompanying drawings.

[0021] Embodiment 1: like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout motherboard in this embodiment includes a support structure 2 for fixing the motherboard 1 and the heat dissipation kit 3, the heat dissipation kit 3 includes a liquid cooling circulation pipeline 31 with a liquid inlet and a liquid outlet, and a plurality of parallel branch pipelines are arranged on the upstream and downstream pipelines of the liquid cooling circulation pipeline 31, and liquid cooling plates 32 for dissipating heat for the chip on the motherboard 1 are arranged in series on the branch pipelines, and cooling strips 33 for dissipating heat for the components on the motherboard 1 are also installed on the branch pipelines, and air ducts 21 for air-cooling the memory modules are provided on both sides of the support structure 2, the liquid cooling plate 32 is plug-in installed on the motherboard 1 and is located on the upper side of the chip, and the cooling strip 33 is mounted on the upper side of the components of the motherboard 1. The heat dissipation device includes a heat dissipation kit 3 and a support structure 2 for fixing various motherboards 1 and the heat dissipation kit 3. Multiple motherboards 1 are respectively mounted from the upper and lower surfaces of the heat dissipation device, so that the heat dissipation chips with higher heat generation on the motherboard 1 correspond to the core cooling position of the heat dissipation kit 3 one by one, and the heat dissipation of the surface-mounted components with lower heat generation is conducted out through the heat dissipation kit 3. Side air duct holes 21 are designed on both sides of the support structure 2, and the high-efficiency air cooling of plug-in memory, capacitors and inductors is completed through the system inter-row air conditioner. Each motherboard 1 is fixedly installed on the heat dissipation kit 3 through bolts and positioning mounting holes. Through the front and back double-sided installation, the installation and removal of each motherboard 1 are independent of each other and do not affect each other. The area corresponding to the support structure 2 and the low-power surface-mounted device has a cooling strip 33, which can be formed by mechanical processing or screw connection, and is made of copper or aluminum alloy, and is used for cooling components with lower heat generation.

[0022] In this embodiment, the support structure 2 is made of aluminum, high-strength engineering materials and other materials with low density and high strength to ensure the overall strength while reducing the weight of the structure.

[0023] like Figure 1 and Figure 4 As shown, the length direction of the air duct 21 in this embodiment is perpendicular to the length direction of the memory stick on the motherboard 1, and one or more air duct holes 22 are provided on the air duct 21. The air duct hole 22 is located at one end of the length direction of the memory stick on the motherboard 1 to achieve air cooling for multiple memory sticks at the same time.

[0024] Different sizes and shapes of heat dissipation channels, such as microchannels, jet channels, spray channels, etc., are designed inside the heat dissipation kit 3 according to the heat dissipation requirements. At the same time, the liquid cooling circulation pipeline 31 adopts a solution of series connection, parallel connection, or series-parallel connection of the channels, so that each motherboard 1 thereon can obtain a suitable coolant flow rate. Thermal pads are mounted at the positions where the heat dissipation kit 3 contacts the chip (such as the liquid cooling plate 32, the cooling strip 33), which not only achieves a tight fit at the interface, but also facilitates the disassembly of the motherboard 1. The heat dissipation kit 3 is mainly made of highly thermally conductive and corrosion-resistant materials such as copper and aluminum to ensure the heat dissipation effect and safety and reliability. The liquid cooling circulation pipeline of the heat dissipation kit 3 adopts a solution of series connection, parallel connection, or series-parallel connection to ensure the uniformity of the coolant distribution in each flow branch. Figure 2 and Figure 3 As shown, the liquid cooling circulation pipeline 31 in this embodiment is annular and fixed on the support structure 2. The support structure 2 achieves efficient cooling between the support structure 2 and the heat dissipation kit 3 while ensuring structural strength through technical means such as extension and avoidance, and at the same time, the plug-in memory module area is cut to ensure smooth air duct.

[0025] like Figure 2 and Figure 3 As shown, the liquid cooling circulation pipeline 31 in this embodiment is also equipped with a cooling strip 33 or a heat conducting block for dissipating heat for the mainboard 1. Figure 2 As shown, the portion of the liquid cooling circulation pipeline 31 in this embodiment where the cooling strip 33 or the heat conduction block is installed includes a plurality of parallel pipeline passages to increase the contact area with the cooling strip 33 .

[0026] like Figure 3 As shown, the liquid cooling plate 32 in this embodiment is connected and fixed to the mainboard 1 through a connecting piece, and a plurality of limiting columns 34 are arranged around the liquid cooling plate 32 to prevent the mainboard 1 from being over-pressurized during installation.

[0027] like Figure 1 As shown, the motherboard 1 of the high-performance computer in this embodiment is installed on both sides of the support structure 2 in a positive and negative buckling manner. Multiple motherboards 1 are buckled and installed from the upper and lower sides of the heat dissipation device, respectively, so that the heat dissipation chips with larger heat generation on the motherboard 1 correspond to the core cooling positions of the heat dissipation kit 3 one by one, and the heat of the components with smaller heat generation is conducted out through the cooling strip structure, and the air cooling of the side air duct holes is used to achieve efficient heat dissipation. Multiple motherboards 1 are fixedly installed on the heat dissipation kit 3 through bolts and positioning mounting holes, and can be installed and disassembled separately.

[0028] like Figure 1 and Figure 4As shown, the air ducts 21 on both sides of the support structure 2 in this embodiment are grooves of the guide rails, and a panel is provided on the outer end surface of the support structure 2. The support structure 2, the fixed motherboard 1 fixed on the support structure 2, and the heat dissipation kit 3 form a computing blade and are inserted and arranged in the frame of the high-performance computer through the guide rails. An indicator light, a reset button, etc. can be installed on the panel provided on the front of the support structure 2 as needed.

[0029] As an optional embodiment, the liquid cooling plate 32 in this embodiment is a microchannel liquid cooling plate, which has two liquid cooling chambers connected to the liquid inlet and the liquid outlet respectively, and a plurality of microchannels arranged in parallel are provided between the two liquid cooling chambers, and a nozzle is provided in each microchannel for connecting the two liquid cooling chambers.

[0030] The working principle of the air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout motherboard of this embodiment is as follows: with the air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout motherboard 1 as the core, various types of motherboards 1 are mounted from both sides of the heat dissipation device, and the motherboard 1 is locked on the heat dissipation device with screws. Various high-power chips correspond to the core heat dissipation area of ​​the cold plate one by one, and the heat dissipation gap between the two is filled by a thermal pad to eliminate the installation tolerance between different chips. At the same time, limit columns are installed around the chip to prevent the motherboard 1 from being over-pressurized during the installation process. Heat dissipation liquid, such as water, ethylene glycol solution, etc., flows into the inlet of the heat dissipation device and flows to the heat dissipation cold plate corresponding to each chip in a series-parallel manner, thereby achieving targeted heat dissipation of high-power chips. At the same time, air ducts are designed on both sides of the support structure 2, and air is blown to the plug-in memory stick on the motherboard 1 through the side outlet of the system inter-row air conditioner to complete the air cooling of the memory stick. This embodiment includes a heat dissipation kit 3 and a support structure 2 for fixing the heat dissipation kit 3. Multiple motherboards 1 are respectively mounted from the upper and lower surfaces of the integrated structure device, so that the heat dissipation chips with higher heat generation on the motherboard 1 correspond to the core cooling position of the heat dissipation kit 3 one by one. The heat of the components with lower heat generation is conducted out through the cooling strip 33, and the air cooling of the side air duct holes 222 is coordinated to achieve efficient heat dissipation. Multiple motherboards 1 are fixedly mounted on the heat dissipation kit 3 through bolts and positioning mounting holes, and can be installed and disassembled separately. This embodiment can achieve efficient heat dissipation and convenient maintenance of high-power chips of high-performance computer plug-in hybrid layout motherboards 1 under high-density buckle assembly conditions.

[0031] In summary, the air-liquid hybrid heat dissipation device of the plug-in hybrid layout motherboard of the high-performance computer in this embodiment includes a heat dissipation kit 3 and a support structure 2 for fixing the motherboard 1 and the heat dissipation kit 3. Multiple motherboards 1 are respectively mounted from the upper and lower surfaces of the integrated structure device, so that the heat dissipation chip on the motherboard 1 corresponds to the core cooling position of the heat dissipation kit 3 one by one. Multiple motherboards 1 are fixed and installed by bolts and positioning installation holes to achieve efficient liquid cooling of high-power devices. At the same time, air ducts 21 for heat dissipation are added on both sides of the structure, and air cooling of plug-in memory sticks and devices such as capacitors and inductors is completed through inter-row air conditioning. At the same time, the motherboard 1 is distributed on both sides of the heat dissipation kit 3, which can achieve fast and convenient disassembly and maintenance. The air-liquid hybrid heat dissipation device of the plug-in hybrid layout motherboard of the high-performance computer in this embodiment can achieve efficient heat dissipation of the plug-in hybrid layout motherboard of the high-performance computer and its various chips and convenient maintenance of the motherboard itself under high-density buckle assembly conditions. The air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout motherboard of this embodiment includes a heat dissipation kit 3 and a support structure 2 for fixing the heat dissipation kit 3. In terms of heat dissipation, the heat load of the heat dissipation kit 3 is improved by double-sided mounting, and at the same time, the overall heat dissipation efficiency of the plug-in hybrid layout computing plug-in is effectively improved by combining liquid cooling, conduction cooling and air cooling. In terms of structural assembly, while adopting a snap-on installation, the support structure 2 and the heat dissipation device are integrated and placed in the middle of the two mainboards 1, which shortens the maintenance and disassembly time of the bottom mainboard of the snap-on assembly, and greatly improves the maintainability of the plug-in. The air-liquid hybrid heat dissipation device proposed in the present invention can achieve efficient heat dissipation and convenient maintenance of high-power chips of high-performance computer plug-in hybrid layout motherboards.

[0032] In addition, this embodiment also provides a high-performance computer, including a power supply and a mainboard, on which the air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout mainboard is provided.

[0033] Embodiment 2: This embodiment is similar to Embodiment 1 in overall structural design, but there are certain differences in the design of the heat dissipation kit 3. In Embodiment 1, two liquid cooling plates 32 are connected in series and then connected in parallel to the circulation pipeline, while in this embodiment, four liquid cooling plates 32 are connected in parallel and then connected to the liquid cooling circulation pipeline 31. The limiting columns 34 of Embodiment 1 are all fixed on the heat dissipation kit 3 to fix each mainboard 1, while the limiting columns 34 in this embodiment are fixed on the support structure 2; the cooling strip 33 in Embodiment 1 is fixed to the heat dissipation kit 3, while the cooling strip 33 in this embodiment is fixed to the support structure 2. Although the specific schemes of the two embodiments are slightly different, the overall technical effects are similar, and both belong to the protection scope of the technical scheme of the present invention.

[0034] In addition, this embodiment also provides a high-performance computer, including a power supply and a mainboard, on which the air-liquid hybrid heat dissipation device of the high-performance computer plug-in hybrid layout mainboard is provided.

[0035] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A wind-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard, characterized in that: The invention comprises a support structure (2) for fixing a mainboard (1) and a heat dissipation kit (3), wherein the heat dissipation kit (3) comprises a liquid cooling circulation pipeline (31) with a liquid inlet and a liquid outlet, wherein the upstream and downstream pipelines of the liquid cooling circulation pipeline (31) are provided with a plurality of parallel branch pipelines, wherein the branch pipelines are provided with liquid cooling plates (32) for dissipating heat for a chip on the mainboard (1) arranged in series, wherein the branch pipelines are provided with cooling strips (33) for dissipating heat for components on the mainboard (1), and air ducts (21) for air cooling heat for memory modules are provided on both sides of the support structure (2), wherein the liquid cooling plates (32) are inserted and installed on the mainboard (1) and are located on the upper side of the chip, and wherein the cooling strips (33) are mounted on the upper side of the components on the mainboard (1).

2. The air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard according to claim 1, characterized in that: The length direction of the air duct (21) is perpendicular to the length direction of the memory stick on the mainboard (1), and one or more air duct holes (22) are provided on the air duct (21). The air duct hole (22) is located at one end of the length direction of the memory stick on the mainboard (1) to achieve air cooling and heat dissipation for multiple memory sticks at the same time.

3. The air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard according to claim 1, characterized in that: The liquid cooling circulation pipeline (31) is in an annular structure and is fixed on the supporting structure (2).

4. The air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard according to claim 1, characterized in that: The liquid cooling circulation pipeline (31) is also provided with a cooling strip (33) or a heat conducting block for dissipating heat from the mainboard (1).

5. The air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard according to claim 4, characterized in that: The portion of the liquid cooling circulation pipeline (31) on which the cooling strip (33) or the heat conducting block is installed comprises a plurality of parallel pipeline passages to increase the contact area with the cooling strip (33).

6. The air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard according to claim 1, characterized in that: The liquid cooling plate (32) is connected and fixed to the main board (1) via a connecting piece, and a plurality of limit columns (34) are provided around the liquid cooling plate (32) to prevent the main board (1) from being over-pressurized during installation.

7. The air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard according to claim 1, characterized in that: The mainboard (1) of the high-performance computer is installed on both sides of the support structure (2) in a positive-negative-negative manner.

8. The air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard according to claim 1, characterized in that: The air ducts (21) on both sides of the support structure (2) are grooves of the guide rails, and the outer end surface of the support structure (2) is provided with a panel. The support structure (2) and the fixed mainboard (1) and the heat dissipation kit (3) fixed on the support structure (2) form a computing blade and are inserted into the frame of a high-performance computer through the guide rails.

9. The air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout motherboard according to claim 1, characterized in that: The liquid cooling plate (32) is a microchannel liquid cooling plate, and has two liquid cooling cavities connected to a liquid inlet and a liquid outlet respectively inside the microchannel liquid cooling plate, and a plurality of microchannels arranged in parallel are provided between the two liquid cooling cavities, and a nozzle is provided in each microchannel for connecting the two liquid cooling cavities.

10. A high performance computer, comprising a power supply and a motherboard, characterized in that: The mainboard is provided with an air-liquid hybrid heat dissipation device for a high-performance computer plug-in hybrid layout mainboard as claimed in any one of claims 1 to 9.

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