Design of thin-film micro-power integrated transformer

Abstract

The invention provides a design of a thin-film micro-power integrated transformer, and relates to the technical field of thin-film transformers. According to the design of the thin-film micro-power integrated transformer, a planar spiral winding structure, an annular magnetic core structure, a self-repairing insulating layer, a flexible substrate, a packaging structure and a magnetostrictive material are included; the manufacturing method of the thin-film micro-power integrated transformer comprises the following detailed steps of S1, a design stage, S2, substrate preparation, S3, winding manufacturing, S4, magnetic core manufacturing, S5, insulating layer manufacturing, S6, packaging, S7, testing and verification and S8, optimization and adjustment. By monitoring the state of the insulating layer in real time, potential faults can be predicted and maintained in time, sudden faults can be avoided, unnecessary maintenance of undamaged parts can be avoided, the maintenance cost and workload are reduced, a more reasonable maintenance plan can be made based on analysis of performance data, and by collecting and analyzing the performance data for a long time, the maintenance efficiency is improved. The performance degradation trend of the insulating layer can be predicted, and a basis is provided for future design and material selection.

Description

Technical Field

[0001] The invention relates to the technical field of thin film transformers, and in particular to the design of a thin film micro-power integrated transformer. Background Art

[0002] A transformer is an electrical device used to transfer electrical energy between two or more circuits through the principle of electromagnetic induction, usually changing the voltage and current. Transformers play a vital role in power systems and are used in power transmission, distribution, and various electronic devices. Thin-film micro-power integrated transformers are miniature transformers manufactured using thin-film technology. They are mainly used in the fields of microelectronics and power electronics. They are designed to achieve the goals of miniaturization, high efficiency, and easy integration.

[0003] There are still some problems in the use of existing thin-film micro-power integrated transformers. In order to solve the problem that traditional transformers need manual maintenance and repair after being damaged, which increases costs and downtime, self-healing insulation layers are used to reduce maintenance time. However, the limits and efficiency of self-repair cannot be monitored in real time. Therefore, technical personnel in this field provide a design of a thin-film micro-power integrated transformer to solve the problems raised in the above background technology. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the present invention provides a design of a thin-film micro-power integrated transformer, which solves the problem that traditional transformers require manual maintenance and repair after being damaged, which increases costs and downtime. A self-healing insulation layer is used to reduce maintenance time, but the limit and efficiency of self-repair cannot be monitored in real time.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a design of a thin film micro-power integrated transformer, including: a planar spiral winding structure, a toroidal magnetic core structure, a self-healing insulating layer, a flexible substrate, a packaging structure and a magnetostrictive material. The detailed steps of making a thin film micro-power integrated transformer are as follows:

[0008] S1. Design stage: Determine the specifications. Determine the electrical specifications of the transformer according to the application requirements. Design the structure of the transformer based on the operating voltage, current, frequency and power, including the planar spiral winding structure, toroidal core structure, insulation layer, flexible substrate and packaging structure. Select appropriate materials, such as copper or aluminum as winding material, ferrite or nanocrystalline alloy as core material, polyimide or silicon oxide as insulation material, and suitable packaging material;

[0009] S2. preparing a substrate, cleaning the substrate, cleaning the substrate material to remove contaminants, and depositing a layer of insulating material on the substrate using a deposition technique, such as chemical vapor deposition or physical vapor deposition;

[0010] S3. Making a winding, depositing a conductive film, depositing a copper conductive film material on an insulating layer, defining a winding pattern using a photolithography technique, and then removing excess conductive material by wet or dry etching to form a planar spiral winding structure;

[0011] S3.2. Thermal path design. Design an effective thermal path to ensure that heat can be quickly transferred from the hotspot winding to the heat dissipation area. Use thermal isolation materials to protect sensitive components from overheating.

[0012] S3.1. Depositing magnetostrictive film: depositing a magnetostrictive material film on the winding, using photolithography and etching techniques to define the shape and size of the magnetostrictive material;

[0013] S4. Make a magnetic core, deposit a magnetic film, deposit a magnetic film material on or between windings, and also use photolithography and etching techniques to define the shape and size of the magnetic core;

[0014] S4.1. Deposit magnetostrictive film: deposit magnetostrictive material film on the magnetic core, use photolithography and etching technology to define the shape and size of the magnetostrictive material, and deposit magnetostrictive film on the winding and the magnetic core. The magnetostrictive material will deform under the action of the magnetic field. This deformation can change the physical size of the winding or the geometric shape of the magnetic circuit, thereby achieving precise control of the inductance of the transformer. The deformation of the magnetostrictive material can optimize the magnetic circuit, reduce leakage magnetic and hysteresis losses, and improve the overall efficiency of the transformer. By precisely controlling the inductance, the energy conversion process can be optimized and unnecessary energy loss can be reduced;

[0015] S4.2. Thermal path design. Design an effective thermal path to ensure that heat can be quickly transferred from the hot spot core to the heat dissipation area. Use thermal isolation materials to protect sensitive components from overheating. Effective thermal path design ensures that heat can be quickly transferred from the hot spot winding and core to the heat dissipation area, preventing component damage caused by local overheating, reducing the impact of thermal stress on components, and extending the overall service life of the transformer.

[0016] S5. Making an insulating layer, depositing an additional insulating layer, and depositing an additional insulating layer on the winding and the magnetic core to provide the necessary electrical isolation;

[0017] S5.1. Repair monitoring, multiple sets of electrode pairs and electrodes are deposited on both sides of the insulating layer, and the electrode pairs form a capacitor structure. The distance and area between the electrode pairs determine the capacitance value, and the electrodes form a resistance measurement path. The electrodes can be designed into strips, meshes or other shapes, depending on the application and the required measurement accuracy;

[0018] S5.2. Use photolithography and etching techniques to define the patterns of insulating layers, electrodes, and electrode pairs;

[0019] S5.3. The self-healing insulating layer is a self-healing insulating layer with built-in capsules. When the microcapsules are broken and the repair agent is released, the resistance of the material will change. After the repair agent fills the cracks, the resistance will usually decrease. The detailed steps of the electrode through resistance monitoring are as follows:

[0020] A1. Baseline measurement, first measure the resistance of the undamaged material as the baseline;

[0021] A2. Real-time monitoring, continuous monitoring of material resistance changes;

[0022] A3. Change detection, detects changes by comparing the current resistance value with the baseline value;

[0023] Algorithm or formula:

[0024] Resistance change rate, calculate the rate of change of resistance (ΔR / R0), where ΔR is the resistance change and R0 is the baseline resistance;

[0025] Threshold setting: set a resistance change rate threshold. When the change rate exceeds this threshold, it is considered that damage has occurred.

[0026] Repair confirmation: When the resistance value returns to close to the baseline value, the repair process is considered complete;

[0027] The electrode pair can also be used to monitor the change of electrical properties of the material through the change of capacitance. The detailed steps are as follows:

[0028] B1. Baseline measurement, first measure the capacitance of the undamaged material as the baseline;

[0029] B2. Real-time monitoring, continuous monitoring of the capacitance changes of materials;

[0030] B3. Change detection, detecting changes by comparing the current capacitance value with the baseline value;

[0031] Algorithm or formula:

[0032] Capacitance change rate, calculate the rate of change of capacitance (ΔC / C0), where ΔC is the capacitance change and C0 is the baseline capacitance;

[0033] Threshold setting: set a threshold value for the capacitance change rate. When the change rate exceeds this threshold, it is considered that damage has occurred.

[0034] Repair confirmation: When the capacitance value returns to a value close to the baseline value, the repair process is considered to be completed. By real-time monitoring of the state of the insulation layer, potential faults can be predicted and maintenance can be performed in time to avoid sudden failures. Accurate performance monitoring can avoid unnecessary maintenance of undamaged parts, reducing maintenance costs and workload. Based on the analysis of performance data, a more reasonable maintenance plan can be formulated to improve maintenance efficiency. By collecting and analyzing performance data over a long period of time, the performance degradation trend of the insulation layer can be predicted, providing a basis for future design and material selection.

[0035] S6. Packaging, prepare packaging material ceramic, encapsulate the transformer in the selected packaging material, and ensure that all connection points are properly connected;

[0036] S7. Testing and verification, conduct electrical tests to verify the performance of the transformer, including inductance, Q value, insulation resistance and withstand voltage tests, and then conduct reliability tests such as thermal cycle tests and mechanical stress tests;

[0037] S8. Optimization and adjustment: Evaluate the performance of the transformer based on the test results, and then adjust and optimize the design based on the evaluation results.

[0038] Preferably, the magnetostrictive film is Terfenol ID, which is alloyed with rare earth elements terbium and dysprosium and iron, and its chemical formula is usually expressed as Tb0.3Dy0.7Fe2, which means that it contains about 30% terbium and 70% dysprosium, and twice the total amount of iron as rare earth elements.

[0039] Preferably, the resistance change rate is calculated as:

[0040]

[0041] Among them, R current is the currently measured resistance value, R baseline is the initial resistance value;

[0042] The capacitance change rate is calculated as:

[0043]

[0044] Among them, C current is the current measured resistance value, C baseline is the initial resistance value;

[0045] Set thresholds. According to the material and characteristics, set the thresholds for resistance and capacitance changes to determine whether damage has occurred.

[0046] Repair confirmation: when the electrical performance parameters are restored to close to the initial value, the repair process is considered to be completed, and the repair efficiency is calculated as follows:

[0047]

[0048] Among them, R recovered is the repaired resistance value, R after damage is the resistance value after damage.

[0049] Preferably, long-term data collection, continuously collecting electrical performance data to evaluate the long-term repair ability and performance degradation of the material;

[0050] Trend analysis uses the moving average method in statistics to analyze data trends and predict the repair limit. The formula is as follows:

[0051]

[0052] Among them, MA t is the moving average at time t, y t-i is the observation value at time ti, and n is the window size of the moving average.

[0053] (III) Beneficial effects

[0054] The present invention provides a design of a thin-film micro-power integrated transformer. It has the following beneficial effects:

[0055] 1. In the present invention, by real-time monitoring of the state of the insulation layer, potential faults can be predicted and maintenance can be performed in time to avoid sudden faults. By accurate performance monitoring, unnecessary maintenance of undamaged parts can be avoided, reducing maintenance costs and workload. Based on the analysis of performance data, a more reasonable maintenance plan can be formulated to improve maintenance efficiency. Moreover, by long-term collection and analysis of performance data, the performance degradation trend of the insulation layer can be predicted, providing a basis for future design and material selection.

[0056] 2. In the present invention, the effective thermal path design ensures that heat can be quickly transferred from the hot spot winding and the magnetic core to the heat dissipation area, thereby preventing component damage caused by local overheating, reducing the impact of thermal stress on components, and extending the overall service life of the transformer.

[0057] 3. In the present invention, by depositing a magnetostrictive film on the winding and the magnetic core, the magnetostrictive material will deform under the action of the magnetic field. This deformation can change the physical size of the winding or the geometric shape of the magnetic circuit, thereby achieving precise control of the inductance of the transformer. The deformation of the magnetostrictive material can optimize the magnetic circuit, reduce leakage flux and hysteresis loss, and improve the overall efficiency of the transformer. By precisely controlling the inductance, the energy conversion process can be optimized and unnecessary energy loss can be reduced.

[0058] 4. In the present invention, the space occupied by the deposited highly integrated transformer is much smaller than that of the traditional transformer, making the device design more compact. The saved space can be used to increase other functions or battery capacity, thereby improving the overall function and endurance of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 Schematic diagram of the process of the present invention. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0061] Embodiment 1:

[0062] like Figure 1 As shown, the embodiment of the present invention provides a design of a thin film micro-power integrated transformer, including: a planar spiral winding structure, a toroidal magnetic core structure, a self-healing insulating layer, a flexible substrate, a packaging structure and a magnetostrictive material. The detailed steps of making a thin film micro-power integrated transformer are as follows:

[0063] S1. Design stage: Determine the specifications. Determine the electrical specifications of the transformer according to the application requirements. Design the structure of the transformer based on the operating voltage, current, frequency and power, including the planar spiral winding structure, toroidal core structure, insulation layer, flexible substrate and packaging structure. Select appropriate materials, such as copper or aluminum as winding material, ferrite or nanocrystalline alloy as core material, polyimide or silicon oxide as insulation material, and suitable packaging material;

[0064] S2. preparing a substrate, cleaning the substrate, cleaning the substrate material to remove contaminants, and depositing a layer of insulating material on the substrate using a deposition technique, such as chemical vapor deposition or physical vapor deposition;

[0065] S3. Making a winding, depositing a conductive film, depositing a copper conductive film material on an insulating layer, defining a winding pattern using a photolithography technique, and then removing excess conductive material by wet or dry etching to form a planar spiral winding structure;

[0066] S3.2. Thermal path design. Design an effective thermal path to ensure that heat can be quickly transferred from the hotspot winding to the heat dissipation area. Use thermal isolation materials to protect sensitive components from overheating.

[0067] S3.1. Depositing magnetostrictive film: depositing a magnetostrictive material film on the winding, using photolithography and etching techniques to define the shape and size of the magnetostrictive material;

[0068] S4. Make a magnetic core, deposit a magnetic film, deposit a magnetic film material on or between windings, and also use photolithography and etching techniques to define the shape and size of the magnetic core;

[0069] S4.1. Deposit magnetostrictive film: deposit magnetostrictive material film on the magnetic core, use photolithography and etching technology to define the shape and size of the magnetostrictive material, and deposit magnetostrictive film on the winding and the magnetic core. The magnetostrictive material will deform under the action of the magnetic field. This deformation can change the physical size of the winding or the geometric shape of the magnetic circuit, thereby achieving precise control of the inductance of the transformer. The deformation of the magnetostrictive material can optimize the magnetic circuit, reduce leakage magnetic and hysteresis losses, and improve the overall efficiency of the transformer. By precisely controlling the inductance, the energy conversion process can be optimized and unnecessary energy loss can be reduced;

[0070] S4.2. Thermal path design. Design an effective thermal path to ensure that heat can be quickly transferred from the hot spot core to the heat dissipation area. Use thermal isolation materials to protect sensitive components from overheating. Effective thermal path design ensures that heat can be quickly transferred from the hot spot winding and core to the heat dissipation area, preventing component damage caused by local overheating, reducing the impact of thermal stress on components, and extending the overall service life of the transformer.

[0071] S5. Making an insulating layer, depositing an additional insulating layer, and depositing an additional insulating layer on the winding and the magnetic core to provide the necessary electrical isolation;

[0072] S5.1. Repair monitoring, multiple sets of electrode pairs and electrodes are deposited on both sides of the insulating layer, and the electrode pairs form a capacitor structure. The distance and area between the electrode pairs determine the capacitance value, and the electrodes form a resistance measurement path. The electrodes can be designed into strips, meshes or other shapes, depending on the application and the required measurement accuracy;

[0073] S5.2. Use photolithography and etching techniques to define the patterns of insulating layers, electrodes, and electrode pairs;

[0074] S5.3. The self-healing insulating layer is a self-healing insulating layer with built-in capsules. When the microcapsules are broken and the repair agent is released, the resistance of the material will change. After the repair agent fills the cracks, the resistance will usually decrease. The detailed steps of the electrode through resistance monitoring are as follows:

[0075] A1. Baseline measurement, first measure the resistance of the undamaged material as the baseline;

[0076] A2. Real-time monitoring, continuous monitoring of material resistance changes;

[0077] A3. Change detection, detects changes by comparing the current resistance value with the baseline value;

[0078] Algorithm or formula:

[0079] Resistance change rate, calculate the rate of change of resistance (ΔR / R0), where ΔR is the resistance change and R0 is the baseline resistance;

[0080] Threshold setting: set a resistance change rate threshold. When the change rate exceeds this threshold, it is considered that damage has occurred.

[0081] Repair confirmation: When the resistance value returns to close to the baseline value, the repair process is considered complete;

[0082] The electrode pair can also be used to monitor the change of electrical properties of the material through the change of capacitance. The detailed steps are as follows:

[0083] B1. Baseline measurement, first measure the capacitance of the undamaged material as the baseline;

[0084] B2. Real-time monitoring, continuous monitoring of the capacitance changes of materials;

[0085] B3. Change detection, detecting changes by comparing the current capacitance value with the baseline value;

[0086] Algorithm or formula:

[0087] Capacitance change rate, calculate the rate of change of capacitance (ΔC / C0), where ΔC is the capacitance change and C0 is the baseline capacitance;

[0088] Threshold setting: set a threshold value for the capacitance change rate. When the change rate exceeds this threshold, it is considered that damage has occurred.

[0089] Repair confirmation: When the capacitance value returns to a value close to the baseline value, the repair process is considered to be completed. By real-time monitoring of the state of the insulation layer, potential faults can be predicted and maintenance can be performed in time to avoid sudden failures. Accurate performance monitoring can avoid unnecessary maintenance of undamaged parts, reducing maintenance costs and workload. Based on the analysis of performance data, a more reasonable maintenance plan can be formulated to improve maintenance efficiency. By collecting and analyzing performance data over a long period of time, the performance degradation trend of the insulation layer can be predicted, providing a basis for future design and material selection.

[0090] S6. Packaging, prepare packaging material ceramic, encapsulate the transformer in the selected packaging material, and ensure that all connection points are properly connected;

[0091] S7. Testing and verification, conduct electrical tests to verify the performance of the transformer, including inductance, Q value, insulation resistance and withstand voltage tests, and then conduct reliability tests such as thermal cycle tests and mechanical stress tests;

[0092] S8. Optimization and adjustment: Evaluate the performance of the transformer based on the test results, and then adjust and optimize the design based on the evaluation results.

[0093] The magnetostrictive film is Terfeno ID, which is alloyed with rare earth elements terbium and dysprosium and iron. Its chemical formula is usually expressed as Tb0.3Dy0.7Fe2, which means that it contains about 30% terbium and 70% dysprosium, and twice the total amount of iron as rare earth elements. Using Terfeno ID as a magnetostrictive film material can significantly improve the performance of thin-film micro-power integrated transformers. Its high magnetostrictive performance, fast response and high energy density make Terfeno ID an ideal choice for achieving efficient, reliable and compact design.

[0094] The resistance change rate is calculated as:

[0095]

[0096] Among them, R current is the currently measured resistance value, R baseline is the initial resistance value;

[0097] The capacitance change rate is calculated as:

[0098]

[0099] Among them, C current is the current measured resistance value, C baseline is the initial resistance value;

[0100] Set thresholds. According to the material and characteristics, set the thresholds for resistance and capacitance changes to determine whether damage has occurred.

[0101] Repair confirmation: when the electrical performance parameters are restored to close to the initial value, the repair process is considered to be completed, and the repair efficiency is calculated as follows:

[0102]

[0103] Among them, R recovered is the repaired resistance value, R after damage is the resistance value after damage.

[0104] Long-term data collection: continuously collect electrical performance data to evaluate the long-term repair ability and performance degradation of materials;

[0105] Trend analysis uses the moving average method in statistics to analyze data trends and predict the repair limit. The formula is as follows:

[0106]

[0107] Among them, MA t is the moving average at time t, y t-i is the observation value at time ti, and n is the window size of the moving average.

[0108] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A design of a thin film micro-power integrated transformer, characterized in that: include: The detailed steps of making a thin-film micro-power integrated transformer with a planar spiral winding structure, a toroidal core structure, a self-healing insulating layer, a flexible substrate, a packaging structure and a magnetostrictive material are as follows: S1. Design stage: Determine the specifications. Determine the electrical specifications of the transformer according to the application requirements. Design the structure of the transformer based on the operating voltage, current, frequency and power, including the planar spiral winding structure, toroidal core structure, insulation layer, flexible substrate and packaging structure. Select appropriate materials, such as copper or aluminum as winding material, ferrite or nanocrystalline alloy as core material, polyimide or silicon oxide as insulation material, and suitable packaging material; S2. preparing a substrate, cleaning the substrate, cleaning the substrate material to remove contaminants, and depositing a layer of insulating material on the substrate using a deposition technique, such as chemical vapor deposition or physical vapor deposition; S3. Making a winding, depositing a conductive film, depositing a copper conductive film material on an insulating layer, defining a winding pattern using a photolithography technique, and then removing excess conductive material by wet or dry etching to form a planar spiral winding structure; S3.

1. Thermal path design. Design an effective thermal path to ensure that heat can be quickly transferred from the hotspot winding to the heat dissipation area. Use thermal isolation materials to protect sensitive components from overheating. S3.

2. Depositing magnetostrictive film: depositing a magnetostrictive material film on the winding, using photolithography and etching techniques to define the shape and size of the magnetostrictive material; S4. Make a magnetic core, deposit a magnetic film, deposit a magnetic film material on or between windings, and also use photolithography and etching techniques to define the shape and size of the magnetic core; S4.

1. Depositing magnetostrictive film: depositing a magnetostrictive material film on the magnetic core, using photolithography and etching techniques to define the shape and size of the magnetostrictive material; S4.

2. Thermal path design. Design an effective thermal path to ensure that heat can be quickly transferred from the hot spot core to the heat dissipation area. Use thermal isolation materials to protect sensitive components from overheating. S5. Making an insulating layer, depositing an additional insulating layer, and depositing an additional insulating layer on the winding and the magnetic core to provide the necessary electrical isolation; S5.

1. Repair monitoring, multiple sets of electrode pairs and electrodes are deposited on both sides of the insulating layer, and the electrode pairs form a capacitor structure. The distance and area between the electrode pairs determine the capacitance value, and the electrodes form a resistance measurement path. The electrodes can be designed into strips, meshes or other shapes, depending on the application and the required measurement accuracy; S5.

2. Use photolithography and etching techniques to define the patterns of insulating layers, electrodes, and electrode pairs; S5.

3. The self-healing insulating layer is a self-healing insulating layer with built-in capsules. When the microcapsules are broken and the repair agent is released, the resistance of the material will change. After the repair agent fills the cracks, the resistance will usually decrease. The detailed steps of the electrode through resistance monitoring are as follows: A1. Baseline measurement, first measure the resistance of the undamaged material as the baseline; A2. Real-time monitoring, continuous monitoring of material resistance changes; A3. Change detection, detects changes by comparing the current resistance value with the baseline value; Algorithm or formula: Resistance change rate, calculate the rate of change of resistance (ΔR / R0), where ΔR is the resistance change and R0 is the baseline resistance; Threshold setting: set a resistance change rate threshold. When the change rate exceeds this threshold, it is considered that damage has occurred. Repair confirmation: When the resistance value returns to close to the baseline value, the repair process is considered complete; The electrode pair can also be used to monitor the change of electrical properties of the material through the change of capacitance. The detailed steps are as follows: B1. Baseline measurement, first measure the capacitance of the undamaged material as the baseline; B2. Real-time monitoring, continuous monitoring of the capacitance changes of materials; B3. Change detection, detecting changes by comparing the current capacitance value with the baseline value; Algorithm or formula: Capacitance change rate, calculate the rate of change of capacitance (ΔC / C0), where ΔC is the capacitance change and C0 is the baseline capacitance; Threshold setting: set a threshold value for the capacitance change rate. When the change rate exceeds this threshold, it is considered that damage has occurred. Repair confirmation: When the capacitance value returns to close to the baseline value, the repair process is considered complete; S6. Packaging, prepare packaging material ceramic, encapsulate the transformer in the selected packaging material, and ensure that all connection points are properly connected; S7. Testing and verification, conduct electrical tests to verify the performance of the transformer, including inductance, Q value, insulation resistance and withstand voltage tests, and then conduct reliability tests such as thermal cycle tests and mechanical stress tests; S8. Optimization and adjustment: Evaluate the performance of the transformer based on the test results, and then adjust and optimize the design based on the evaluation results.

2. The design of a thin-film micro-power integrated transformer according to claim 1 is characterized in that: The magnetostrictive film is Terfenol-D, which is alloyed with rare earth elements terbium and dysprosium and iron. Its chemical formula is usually expressed as Tb0.3Dy0.7Fe2, which means that it contains about 30% terbium and 70% dysprosium, and twice the total amount of iron as the rare earth elements.

3. The design of a thin-film micro-power integrated transformer according to claim 1 is characterized in that: The resistance change rate is calculated as: Among them, R current is the currently measured resistance value, R baseline is the initial resistance value; The capacitance change rate is calculated as: Among them, C current is the current measured resistance value, C baseline is the initial resistance value; Set thresholds. According to the material and characteristics, set the thresholds for resistance and capacitance changes to determine whether damage has occurred. Repair confirmation: when the electrical performance parameters are restored to close to the initial value, the repair process is considered to be completed, and the repair efficiency is calculated as follows: Among them, R recovered is the repaired resistance value, R afterdamage is the resistance value after damage.

4. The design of a thin-film micro-power integrated transformer according to claim 3 is characterized in that: Long-term data collection: continuously collect electrical performance data to evaluate the long-term repair ability and performance degradation of materials; Trend analysis uses the moving average method in statistics to analyze data trends and predict the repair limit. The formula is as follows: Among them, MA t is the moving average at time t, y t-i is the observation value at time ti, and n is the window size of the moving average.

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