Semiconductor process equipment layout structure

Abstract

A semiconductor process equipment layout structure comprises: a plurality of main tracks parallel to a first direction; the annular branch rails are located between the adjacent main rails, and each main rail is connected with at least one annular branch rail; the first equipment areas and the second equipment areas are located between the adjacent main rails, the annular branch rails are located between the adjacent first equipment areas, the second equipment areas are adjacent to the main rails, the second equipment areas are adjacent to at least part of the first equipment areas, the second equipment areas comprise a plurality of measuring devices, and the measuring devices are arranged in the first direction; the annular transportation rail is located in the second equipment area, each measuring device is connected with the edge of one side of the annular transportation rail through a first connection port, and the annular transportation rail is connected with the annular branch rails on the two sides of the second equipment area; therefore, the reasonability of the wafer preparation workshop on the layout structure of the processing equipment, the measuring equipment and the wafer storage equipment is improved, and the carrying efficiency of the material carrying system is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a semiconductor process equipment layout structure. Background Art

[0002] With the continuous development of semiconductor technology, the process flow required for advanced semiconductor manufacturing is becoming more and more complex, and the demand for equipment and personnel is gradually increasing. At present, wafer manufacturers widely use the automated material handling system AMHS (Automated Material Handling System) to assist in material handling in semiconductor manufacturing.

[0003] In the semiconductor manufacturing process of a wafer fab, the equipment commonly used includes process equipment, measurement equipment, and wafer storage equipment. Among them, the process equipment is responsible for the production and processing of wafers, the measurement equipment corrects the parameters of the process equipment by testing the wafers processed by the process equipment to ensure that the processed wafers meet the design goals, and the wafer storage equipment is used to store wafers that need to be temporarily stored during the material handling process. The automated material handling system enables materials such as wafers to flow smoothly between various equipment, thereby completing the various processes required for the semiconductor process.

[0004] However, in the prior art, the rationality of the layout structure of process equipment, measurement equipment and wafer storage equipment in the wafer preparation workshop needs to be improved, and the handling efficiency of the material handling system also needs to be improved. Summary of the invention

[0005] The technical problem solved by the present invention is to provide a semiconductor process equipment layout structure, which increases the rationality of the layout structure of the process equipment, measurement equipment and wafer storage equipment in the wafer preparation workshop, and increases the handling efficiency of the material handling system.

[0006] In order to solve the above technical problems, the technical solution of the present invention provides a semiconductor process equipment layout structure, including: a number of main rails parallel to a first direction; a number of circular branch rails located between adjacent main rails, and each main rail is connected to at least one circular branch rail; a number of first equipment areas and a number of second equipment areas located between adjacent main rails, each circular branch rail is located between adjacent first equipment areas, the second equipment area is adjacent to the main rail, and the second equipment area is adjacent to at least part of the first equipment area, the second equipment area includes a number of measuring equipment, and each of the measuring equipment is arranged along the first direction; a circular transport rail located in the second equipment area, each of the measuring equipment is connected to one side edge of the circular transport rail through a first docking port, and the circular transport rail is respectively connected to the circular branch rails on both sides of the second equipment area.

[0007] Optionally, the first equipment area includes a plurality of process equipment, each process equipment is arranged along a second direction, the second direction is perpendicular to the first direction, and each process equipment is connected to a side edge of the annular branch track through a second connection port.

[0008] Optionally, the second equipment area further includes storage devices, which are arranged along the first direction, and each of the storage devices is interconnected with a side edge of the circular transport rail via a third docking port.

[0009] Optionally, the storage device and each measuring device are respectively located on both sides of the circular transport track.

[0010] Optionally, the storage device is located between the circular transport track and the main track, and the storage device is placed adjacent to the main track.

[0011] Optionally, the third docking port is arranged along a side of the storage device facing away from the main track.

[0012] Optionally, the first equipment area has two opposite sides, and the two sides are respectively adjacent to two annular branch tracks.

[0013] Optionally, each process equipment in the first equipment area is arranged along the edge of the two annular branch tracks close to one side of the first equipment area.

[0014] Optionally, the running direction of the circular transport rail is the same as the running direction of the circular branch rail.

[0015] Optionally, each main track is a circular track.

[0016] Optionally, the shape of the annular transport track includes a rectangular ring, an elliptical ring or other ring shapes.

[0017] Optionally, the annular transport track includes a first track and a second track which are parallel to each other, and two ends of the first track and the second track are connected respectively by a third track and a fourth track, and the third track and the fourth track are arc-shaped.

[0018] Optionally, the distance between the center of the first track and the center of the second track is greater than or equal to the minimum required distance L1.

[0019] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0020] In the semiconductor process equipment layout structure provided by the technical solution of the present invention, the second equipment area includes a plurality of measuring devices, each of which is arranged along the first direction, and each of which is connected to a side edge of the circular transport track through a first docking port. The arrangement of the measuring devices improves the space utilization of the second equipment area, thereby more reasonably arranging the overall equipment in the first equipment area and the second equipment area, and increasing the rationality of the layout structure of the wafer preparation workshop for different equipment.

[0021] Furthermore, since the process equipment in the first equipment area is arranged along the second direction and the measuring equipment is arranged along the first direction, the first direction is perpendicular to the second direction, and the measuring equipment is connected to one side edge of the circular transport rail via a first connection port, and the process equipment is connected to one side edge of the circular branch rail via a second connection port, thereby, the circular branch rail can be connected to the circular transport rail with a different arrangement position and direction, and a transportation shortcut is created through the circular transport rail. After the process equipment in the first equipment area completes material preparation, the material is transported via the circular branch rail, and the material enters the circular transport rail, and with the help of the circular transport rail, the measuring equipment near the circular transport rail is contacted via a shorter path, thereby improving the material handling efficiency.

[0022] Furthermore, the second equipment area also includes storage devices, which are arranged along a first direction, and each of the storage devices is connected to one side edge of the circular transport rail through a third docking port, and the fourth docking port is arranged along the side of the storage device facing away from the main rail. Thus, the third docking port is avoided from directly facing the main rail, which avoids congestion of the main rail due to material exchange between the main rail and the storage devices, thereby improving the operation efficiency of the main rail. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figures 1 to 5 It is a schematic diagram of the layout structure of semiconductor process equipment according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] As described in the background technology, in the semiconductor process of the wafer factory, the equipment commonly used includes process equipment, measurement equipment and wafer storage equipment. Among them, the process equipment is responsible for the production and processing of wafers, the measurement equipment corrects the parameters of the process equipment by detecting the wafers processed by the process equipment to ensure that the processed wafers meet the design goals, and the wafer storage equipment is used to store wafers that need to be temporarily stored during the material handling process. The automated material handling system enables materials such as wafers to flow smoothly between various equipment, thereby completing the various processes required for the semiconductor process.

[0025] However, in the prior art, a lot of space is wasted in the layout structure of process equipment, measurement equipment and wafer storage equipment in the wafer preparation workshop; in addition, the transportation path between the wafer processing equipment and the measurement equipment is too long, resulting in the need to improve the transportation efficiency of the material handling system.

[0026] In order to solve the above technical problems, the technical solution of the present invention provides a semiconductor process equipment layout structure, including: a plurality of first equipment areas and a plurality of second equipment areas located between adjacent main tracks, the second equipment area including a plurality of measuring devices, each of the measuring devices arranged along a first direction, and each of the measuring devices and a side edge of the circular transport track are connected to each other through a first docking port. The arrangement of the measuring devices improves the space utilization of the second equipment area, thereby more reasonably arranging the overall equipment in the first equipment area and the second equipment area, and increasing the rationality of the layout structure of the wafer preparation workshop for different equipment.

[0027] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] Figures 1 to 5 It is a schematic diagram of the layout structure of semiconductor process equipment according to an embodiment of the present invention.

[0029] Please refer to Figure 1 and Figure 2 The semiconductor process equipment layout structure includes: a plurality of main rails 110 parallel to the first direction X; a plurality of circular branch rails 101 located between adjacent main rails 110, and each main rail 110 is connected to at least one circular branch rail 101; a plurality of first equipment areas 100 and a plurality of second equipment areas 120 located between adjacent main rails 110, each circular branch rail 101 is located between adjacent first equipment areas 100, the second equipment area 120 is adjacent to the main rail 110, and the second equipment area 120 is adjacent to at least part of the first equipment area 100, the second equipment area 120 includes a plurality of measuring equipment 131, and each of the measuring equipment 131 is arranged along the first direction X; a circular transport rail 130 located in the second equipment area 120, each of the measuring equipment 131 is connected to one side edge of the circular transport rail 130 through a first docking port 134, and the circular transport rail 130 is respectively connected to the circular branch rails 101 on both sides of the second equipment area 120.

[0030] In this embodiment, the first equipment area 100 includes a plurality of process equipment (not shown), each process equipment is arranged along a second direction Y, the second direction Y is perpendicular to the first direction X, and each process equipment is connected to a side edge of the annular branch track 101 through a second docking port 111. Each process equipment in the first equipment area 100 is arranged along the edge of the two annular branch tracks 101 close to one side of the first equipment area 100.

[0031] The process equipment can be arranged along any one side of the two sides of the annular branch track 101 in the second direction Y, or along the two side tracks of the annular branch track 101 in the second direction Y. In this embodiment, the first equipment area 100 has two opposite sides, and the two sides are respectively adjacent to two annular branch tracks 101.

[0032] In this embodiment, the second equipment area 120 further includes storage devices 132 , which are arranged along the first direction X, and each of the storage devices 132 is connected to a side edge of the circular transport rail 130 via a third docking port 133 .

[0033] Please continue to refer to Figure 2 Specifically, the second equipment area 120 has a plurality of measuring devices 131, a circular transport track 130 and a storage device 132. The storage device 132 and each measuring device 131 are respectively located on both sides of the circular transport track 130. The storage device 132 is located between the circular transport track 130 and the main track 110, and the storage device 132 is placed adjacent to the main track 110.

[0034] In this embodiment, since each of the measuring devices 131 is arranged along the first direction X, and each of the measuring devices 131 is connected to one side edge of the circular transport rail 130 through the first docking port 134, and each of the process equipment is arranged along the second direction Y, and the second direction Y is perpendicular to the first direction X, the arrangement of the measuring devices 131 improves the space utilization of the second equipment area 120, and also provides more buffer space between the measuring devices 131 and the storage devices 132, thereby more reasonably arranging the overall equipment in the first equipment area 100 and the second equipment area 120, increasing the rationality of the layout structure of the wafer preparation workshop for different equipment and increasing the convenience of equipment maintenance.

[0035] During the semiconductor process, after the process equipment completes the preparation process, the wafer and other materials are transported via the circular branch track 101. After the materials are measured by various measuring devices 131, they enter the process equipment for the next process, or enter the main track 110 through the circular transport track 130, and then enter other equipment areas. In addition, the storage device 132 is used to temporarily store the materials transported from the main track 110.

[0036] Since the process equipment in the first equipment area 100 is arranged along the second direction Y, and each measuring equipment 131 is arranged along the first direction X, and the first direction X is perpendicular to the second direction Y, each measuring equipment 131 is connected to one side edge of the circular transport rail 130 through the first docking port 134, and each process equipment is connected to one side edge of the circular branch track 101 through the second docking port 111. Therefore, the circular branch track 101 can be connected to the circular transport rail 130 with a different arrangement position and direction, and a transportation shortcut is created through the circular transport rail 130. After the process equipment in the first equipment area 100 completes material preparation, the material is transported via the circular branch track 101, so that the material enters the circular transport rail 130, and contacts the measuring equipment 131 near the circular transport rail 130 with a shorter path with the help of the circular transport rail 130, thereby improving the material handling efficiency.

[0037] Please refer to Figure 3 , Figure 3 The semiconductor process equipment layout structure in this embodiment is a path for transporting materials during the process.

[0038] In this embodiment, the running direction of the circular transport rail 130 is the same as the running direction of the circular branch rail 101. Specifically, the running directions are both clockwise.

[0039] Among them, for the process equipment (process equipment 1-process equipment 8) in the first equipment area 100 above the second equipment area 120, the materials produced after their preparation can reach the measuring equipment 131 in the second equipment area 120 through the following path: after the process equipment completes the preparation process, the wafers and other materials begin to be transported via the circular branch track 101 (as shown in direction A); then, the materials pass through the circular branch track 101 and enter the circular transport track 130 (as shown in direction B); then, the materials enter the side of the circular transport track 130 close to the storage device 132 (as shown in direction C); finally, the materials enter the other side of the circular transport track 130 along the bypass direction of the circular transport track 130, pass through various measuring equipment 131 in turn, and complete the measurement of the materials (as shown in direction D).

[0040] After that, the material can enter the circular branch track 101 to the left again and enter the process equipment for the next process, or enter the side track of the circular transport track 130 close to the storage device 132 to the right again, until it bypasses the circular branch track 101 at the bottom of the storage device 132 and enters the main track 110 adjacent to the second equipment area 120, thereby entering other equipment areas.

[0041] Therefore, through the layout of the circular transport rail 130 and its running direction, a shortcut for transporting materials between different equipment areas is created. With the help of the circular transport rail 130, the material can be transported from the process equipment in the first equipment area 100 to the measuring equipment 131 near the circular transport rail 130 via a shorter path, thereby improving the transportation efficiency of the materials.

[0042] In other embodiments, the running direction of the circular transport rail is the same as the running direction of the circular branch rail, and both may be counterclockwise.

[0043] In other embodiments, the running direction of the circular transport rail and the running direction of the circular branch rail may be the same, so that an operating mode that is more convenient for transportation can be designed according to demand, thereby increasing flexibility.

[0044] In this embodiment, the third docking port 133 is arranged along the side of the storage device 132 facing away from the main track 110, thereby avoiding the third docking port 133 directly facing the main track 110, avoiding congestion of the main track 110 due to material exchange between the main track 110 and the storage device 132, and improving the operating efficiency of the main track 110.

[0045] Please refer to Figure 4 and Figure 5 ,in, Figure 4 is an enlarged view of the circular transport track 130, Figure 5 It is an enlarged view of a portion of the circular transport track 130 and the storage device 132.

[0046] In this embodiment, the circular transport track 130 includes a first track and a second track parallel to each other, and the two ends of the first track and the second track are connected by a third track and a fourth track respectively, and the third track and the fourth track are arc-shaped. The distance between the center of the first track and the center of the second track is greater than or equal to the minimum required distance L1. The minimum required distance L1 is the minimum distance required to ensure the normal operation of the circular transport track 130.

[0047] In this embodiment, the side track of the circular transport rail 130 close to the storage device 132 is the first track, and the shortest distance from the center of the first track to the storage device 132 is greater than or equal to the minimum interaction distance L2, thereby ensuring the feasibility of material interaction between the storage device 132 and the first track.

[0048] In other embodiments, the shape of the circular transport track includes a rectangular ring, an elliptical ring or other ring shapes.

[0049] In this embodiment, each main track 110 is a circular track, and its running direction is the same as the running direction of the circular transport track 130 and the circular branch track 101.

[0050] It should be noted that the structures and operation modes of the first connection port 134 , the second connection port 111 , and the third connection port 133 may be the same or different.

[0051] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A semiconductor process equipment layout structure, characterized in that: include: A plurality of main tracks parallel to the first direction; A plurality of annular branch tracks are located between adjacent main tracks, and each main track is connected to at least one annular branch track; A plurality of first equipment areas and a plurality of second equipment areas are located between adjacent main tracks, each of the annular branch tracks is located between adjacent first equipment areas, the second equipment area is adjacent to the main track, and the second equipment area is adjacent to at least part of the first equipment area, the second equipment area includes a plurality of measuring equipment, and each of the measuring equipment is arranged along a first direction; The circular transport track is located in the second equipment area, each of the measuring equipment is connected to one side edge of the circular transport track through a first docking port, and the circular transport track is respectively connected to the circular branch tracks on both sides of the second equipment area.

2. The semiconductor process equipment layout structure according to claim 1, characterized in that: The first equipment area includes a plurality of process equipments, each of which is arranged along a second direction, the second direction is perpendicular to the first direction, and each of the process equipments is connected to a side edge of the annular branch track via a second connection port.

3. The semiconductor process equipment layout structure according to claim 1, characterized in that: The second equipment area also includes storage devices, which are arranged along the first direction, and each of the storage devices is connected to a side edge of the circular transport rail via a third docking port.

4. The semiconductor process equipment layout structure according to claim 3, characterized in that: The storage device and each measuring device are respectively located on two sides of the circular transport track.

5. The semiconductor process equipment layout structure according to claim 3, characterized in that: The storage device is located between the circular transport rail and the main track, and the storage device is placed adjacent to the main track.

6. The semiconductor process equipment layout structure according to claim 3, characterized in that: The third docking port is arranged along a side of the storage device facing away from the main track.

7. The semiconductor process equipment layout structure according to claim 1, characterized in that: The first equipment area has two opposite sides, and the two sides are respectively adjacent to two annular branch tracks.

8. The semiconductor process equipment layout structure according to claim 7, characterized in that: The process equipment in the first equipment area is arranged along the edge of the two annular branch tracks close to one side of the first equipment area.

9. The semiconductor process equipment layout structure according to claim 1, characterized in that: The running direction of the circular transport rail is the same as the running direction of the circular branch rail.

10. The semiconductor process equipment layout structure according to claim 1, wherein: Each main track is a circular track.

11. The semiconductor process equipment layout structure according to claim 1, characterized in that: The shape of the circular transport track includes a rectangular ring, an elliptical ring or other rings.

12. The semiconductor process equipment layout structure according to claim 1, wherein: The circular transport track includes a first track and a second track which are parallel to each other. Both ends of the first track and the second track are connected by a third track and a fourth track respectively. The third track and the fourth track are in arc shape.

13. The semiconductor process equipment layout structure according to claim 12, characterized in that: The distance between the center of the first track and the center of the second track is greater than or equal to the minimum required distance L1.

Images